JP2010056141A5 - - Google Patents
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- JP2010056141A5 JP2010056141A5 JP2008216829A JP2008216829A JP2010056141A5 JP 2010056141 A5 JP2010056141 A5 JP 2010056141A5 JP 2008216829 A JP2008216829 A JP 2008216829A JP 2008216829 A JP2008216829 A JP 2008216829A JP 2010056141 A5 JP2010056141 A5 JP 2010056141A5
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- JP
- Japan
- Prior art keywords
- printing
- jig
- condition data
- substrates
- respect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims 32
- 229910000679 solder Inorganic materials 0.000 claims 9
- 238000001514 detection method Methods 0.000 claims 6
- 238000003384 imaging method Methods 0.000 claims 4
Claims (11)
前記治具に対する前記複数の基板のそれぞれの相対的な貼付位置を含む貼付状態を検出する貼付状態検出部と、
前記治具に対する前記複数の基板のそれぞれの相対的な貼付位置を含む貼付状態に基づいて、印刷条件データを作成する印刷条件データ作成部と、
前記印刷条件データに基づいて、前記基板上にマスクを介して半田を印刷する印刷部と、
半田が印刷された前記基板に前記部品を搭載する部品搭載装置とを備え、
前記印刷部は、前記印刷条件データ作成部により作成された印刷条件データに基づいて、印刷を行う際の前記マスクに対する前記治具の位置を補正するように構成されている、部品実装システム。 A substrate pasting part for pasting a plurality of substrates to the jig;
An application state detection unit for detecting an application state including a relative application position of each of the plurality of substrates with respect to the jig;
A printing condition data creating unit that creates printing condition data based on a pasting state including a relative pasting position of each of the plurality of substrates with respect to the jig;
Based on the printing condition data, a printing unit that prints solder on the substrate through a mask;
A component mounting device for mounting the component on the substrate on which the solder is printed;
The component mounting system, wherein the printing unit is configured to correct the position of the jig with respect to the mask when performing printing based on the printing condition data created by the printing condition data creating unit.
前記印刷部は、前記印刷条件データ作成部により作成された前記複数の基板の平均の位置ずれ情報を含む印刷条件データに基づいて、印刷を行う際の前記マスクに対する前記治具の位置を補正するように構成されている、請求項1に記載の部品実装システム。The printing unit corrects the position of the jig with respect to the mask during printing based on printing condition data including average positional deviation information of the plurality of substrates created by the printing condition data creation unit. The component mounting system according to claim 1, configured as described above.
前記印刷条件データ作成部は、前記貼付位置のみならず、前記反り状態にも基づいて印刷条件データを作成するように構成されている、請求項1〜4のいずれか1項に記載の部品実装システム。 The sticking state detection unit includes a warp detection unit that detects a warp state of the substrate before printing with respect to the jig,
The component mounting according to any one of claims 1 to 4 , wherein the printing condition data creation unit is configured to create printing condition data based on not only the pasting position but also the warpage state. system.
前記治具は、複数の第1位置基準マークを有しており、
前記複数の基板のそれぞれは、前記基板上の電極パターンにおける部分パターンおよび前記電極パターンとは独立のマークの内少なくともいずれかからなる複数の第2位置基準マークを有しており、
前記貼付状態検出部は、前記撮像部により撮像された前記第1位置基準マークおよび前記第2位置基準マークの位置に基づいて、前記複数の基板のそれぞれの前記治具に対する貼付位置を検出するように構成されている、請求項1〜6のいずれか1項に記載の部品実装システム。 The sticking state detection unit includes an imaging unit that images the jig and the substrate before printing,
The jig has a plurality of first position reference marks,
Each of the plurality of substrates has a plurality of second position reference marks including at least one of a partial pattern in the electrode pattern on the substrate and a mark independent of the electrode pattern;
The affixing state detection unit detects an affixing position of each of the plurality of substrates with respect to the jig based on the positions of the first position reference mark and the second position reference mark captured by the imaging unit. The component mounting system of any one of Claims 1-6 comprised by these.
前記治具に対する前記複数の基板のそれぞれの相対的な貼付位置を含む貼付状態を検出する工程と、
前記治具に対する前記複数の基板のそれぞれの相対的な貼付位置を含む貼付状態に基づいて印刷条件データを作成する工程と、
前記印刷条件データに基づいて、前記基板上に半田を印刷する工程と、
半田が印刷された後の前記基板に部品を搭載する工程とを備え、
前記半田を印刷する工程は、前記印刷条件データ作成部により作成された印刷条件データに基づいて、印刷を行う際の前記マスクに対する前記治具の位置を補正する工程を含む、部品実装方法。 Attaching a plurality of substrates to a jig;
Detecting a pasting state including a relative pasting position of each of the plurality of substrates with respect to the jig;
Creating printing condition data based on a pasting state including a relative pasting position of each of the plurality of substrates with respect to the jig;
Printing solder on the substrate based on the printing condition data;
And mounting the component on the board after the solder is printed,
The component printing method, wherein the step of printing the solder includes a step of correcting the position of the jig with respect to the mask when performing printing based on the printing condition data created by the printing condition data creating unit.
制御部とを備え、
前記制御部は、前記撮像部により撮像された前記治具および前記基板の撮像画像に基づいて、前記治具に対する前記複数の基板のそれぞれの相対的な貼付位置を含む貼付状態を検出することにより、前記基板上にマスクを介して半田を印刷する際の印刷条件データを作成するための貼付状態データを取得するように構成されている、基板貼付状態検出装置。 An imaging unit that images each of a jig and a plurality of substrates attached to the jig;
A control unit,
The control unit detects a pasting state including a relative pasting position of each of the plurality of substrates with respect to the jig based on the jig and the substrate image captured by the imaging unit. A substrate sticking state detection device configured to acquire sticking state data for creating printing condition data when printing solder on the substrate via a mask.
制御部とを備え、
前記制御部は、治具に対する複数の基板のそれぞれの相対的な貼付位置を含む貼付状態に基づいて作成された印刷条件データに基づいて、前記治具に貼付された前記基板上にマスクを介して半田を印刷する際の前記マスクに対する前記治具の位置を補正するように前記印刷機構部を制御するように構成されている、印刷機。 A printing mechanism,
A control unit,
The control unit is configured to place a mask on the substrate affixed to the jig based on printing condition data created based on the affixing state including the relative affixing positions of the plurality of substrates with respect to the jig. A printing machine configured to control the printing mechanism so as to correct the position of the jig with respect to the mask when printing solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008216829A JP4995788B2 (en) | 2008-08-26 | 2008-08-26 | Component mounting system, component mounting method, printing condition data creation device and printing machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008216829A JP4995788B2 (en) | 2008-08-26 | 2008-08-26 | Component mounting system, component mounting method, printing condition data creation device and printing machine |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010056141A JP2010056141A (en) | 2010-03-11 |
JP2010056141A5 true JP2010056141A5 (en) | 2011-06-16 |
JP4995788B2 JP4995788B2 (en) | 2012-08-08 |
Family
ID=42071773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008216829A Active JP4995788B2 (en) | 2008-08-26 | 2008-08-26 | Component mounting system, component mounting method, printing condition data creation device and printing machine |
Country Status (1)
Country | Link |
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JP (1) | JP4995788B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102140645B1 (en) | 2013-04-22 | 2020-08-04 | 삼성디스플레이 주식회사 | Apparatus for manufacturing panel display |
CN106304658B (en) * | 2016-11-11 | 2018-09-14 | 伟时电子股份有限公司 | FPC attaches mechanism |
CN113747668B (en) * | 2021-09-01 | 2023-01-24 | 西玛特易联(苏州)科技有限公司 | PCB board aligning device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000021541A (en) * | 1998-07-03 | 2000-01-21 | Nippon Avionics Co Ltd | Solder bump forming device and its method |
JP4597435B2 (en) * | 2000-08-29 | 2010-12-15 | パナソニック株式会社 | Component mounting method and component mounting apparatus |
JP4798888B2 (en) * | 2001-08-06 | 2011-10-19 | パナソニック株式会社 | Offset measurement method |
JP4363093B2 (en) * | 2003-06-25 | 2009-11-11 | 株式会社日立プラントテクノロジー | Screen printing machine |
JP4619896B2 (en) * | 2004-08-20 | 2011-01-26 | パナソニック株式会社 | Reference position determining method, reference position determining apparatus, bonding material printing method and printing apparatus |
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2008
- 2008-08-26 JP JP2008216829A patent/JP4995788B2/en active Active
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