JP2010034429A5 - - Google Patents
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- Publication number
- JP2010034429A5 JP2010034429A5 JP2008197159A JP2008197159A JP2010034429A5 JP 2010034429 A5 JP2010034429 A5 JP 2010034429A5 JP 2008197159 A JP2008197159 A JP 2008197159A JP 2008197159 A JP2008197159 A JP 2008197159A JP 2010034429 A5 JP2010034429 A5 JP 2010034429A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- roller
- wafer
- peripheral portion
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008197159A JP5386874B2 (ja) | 2008-07-31 | 2008-07-31 | 半導体ウェーハ周辺部の研磨装置及びその方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008197159A JP5386874B2 (ja) | 2008-07-31 | 2008-07-31 | 半導体ウェーハ周辺部の研磨装置及びその方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010034429A JP2010034429A (ja) | 2010-02-12 |
| JP2010034429A5 true JP2010034429A5 (zh) | 2011-09-15 |
| JP5386874B2 JP5386874B2 (ja) | 2014-01-15 |
Family
ID=41738534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008197159A Active JP5386874B2 (ja) | 2008-07-31 | 2008-07-31 | 半導体ウェーハ周辺部の研磨装置及びその方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5386874B2 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2359390A1 (en) * | 2008-11-19 | 2011-08-24 | MEMC Electronic Materials, Inc. | Method and system for stripping the edge of a semiconductor wafer |
| KR101089480B1 (ko) * | 2010-06-01 | 2011-12-07 | 주식회사 엘지실트론 | 웨이퍼 연마장치 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04129656A (ja) * | 1990-09-19 | 1992-04-30 | Kawasaki Steel Corp | 半導体ウエハの面取加工装置 |
| JP3256808B2 (ja) * | 1991-04-30 | 2002-02-18 | 東芝セラミックス株式会社 | 半導体ウエーハの周縁ポリシング装置 |
| JP2542445Y2 (ja) * | 1992-07-14 | 1997-07-30 | 信越半導体株式会社 | バフ溝加工装置 |
| JPH11297665A (ja) * | 1998-04-06 | 1999-10-29 | Takahiro Oishi | ウエハ端面処理装置 |
| JPH11300587A (ja) * | 1998-04-15 | 1999-11-02 | Mitsubishi Materials Corp | 半導体ウエハー研磨装置 |
| JP4743951B2 (ja) * | 2000-11-13 | 2011-08-10 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | 半導体ウエハのノッチ部分の研磨装置及び研磨加工方法 |
| JP2007248812A (ja) * | 2006-03-16 | 2007-09-27 | Bridgestone Corp | 導電性ローラ |
| JP2008023603A (ja) * | 2006-07-18 | 2008-02-07 | Nippon Seimitsu Denshi Co Ltd | ２層構造のリテーナリング |
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2008
- 2008-07-31 JP JP2008197159A patent/JP5386874B2/ja active Active
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