JP2010034429A5 - - Google Patents
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- JP2010034429A5 JP2010034429A5 JP2008197159A JP2008197159A JP2010034429A5 JP 2010034429 A5 JP2010034429 A5 JP 2010034429A5 JP 2008197159 A JP2008197159 A JP 2008197159A JP 2008197159 A JP2008197159 A JP 2008197159A JP 2010034429 A5 JP2010034429 A5 JP 2010034429A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- roller
- wafer
- peripheral portion
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (10)
ローラの一部が前記スラリーの液面より上部に存在して、かつ水平に前記タンクに設けられた研磨ローラと、 A part of the roller exists above the liquid level of the slurry, and a polishing roller provided horizontally in the tank;
前記研磨ローラと平行に設けられウェーハ周辺部形状に相応した形状の複数の周溝が所定の間隔をあけて形成され前記周溝にウェーハ周辺部を収容することにより前記研磨ローラとともに複数の半導体ウェーハを鉛直状態に保持する複数の回転ローラと、 A plurality of circumferential grooves provided in parallel with the polishing roller and having a shape corresponding to the shape of the peripheral portion of the wafer are formed at predetermined intervals, and a plurality of semiconductor wafers are formed together with the polishing roller by accommodating the peripheral portion of the wafer in the circumferential groove. A plurality of rotating rollers that hold the device in a vertical state;
前記研磨ローラを回転駆動する第1ローラ回転手段と、 First roller rotating means for rotating the polishing roller;
前記複数の回転ローラを回転駆動する第2ローラ回転手段と Second roller rotating means for rotating the plurality of rotating rollers;
を備え、 With
前記第1及び第2ローラ回転手段により前記研磨ローラ及び前記複数の回転ローラを回転駆動して前記ウェーハを円周方向に回転させることにより前記研磨ローラに保持された研磨スラリーで前記ウェーハの周辺部を研磨する The polishing roller and the plurality of rotating rollers are rotationally driven by the first and second roller rotating means to rotate the wafer in the circumferential direction, thereby polishing the peripheral portion of the wafer with the polishing slurry held on the polishing roller. To polish
ことを特徴とする半導体ウェーハ周辺部の研磨装置。 An apparatus for polishing a peripheral portion of a semiconductor wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008197159A JP5386874B2 (en) | 2008-07-31 | 2008-07-31 | Semiconductor wafer peripheral polishing apparatus and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008197159A JP5386874B2 (en) | 2008-07-31 | 2008-07-31 | Semiconductor wafer peripheral polishing apparatus and method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010034429A JP2010034429A (en) | 2010-02-12 |
JP2010034429A5 true JP2010034429A5 (en) | 2011-09-15 |
JP5386874B2 JP5386874B2 (en) | 2014-01-15 |
Family
ID=41738534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008197159A Active JP5386874B2 (en) | 2008-07-31 | 2008-07-31 | Semiconductor wafer peripheral polishing apparatus and method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5386874B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010059556A1 (en) * | 2008-11-19 | 2010-05-27 | Memc Electronic Materials, Inc. | Method and system for stripping the edge of a semiconductor wafer |
KR101089480B1 (en) * | 2010-06-01 | 2011-12-07 | 주식회사 엘지실트론 | Wafer polishing apparatus |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04129656A (en) * | 1990-09-19 | 1992-04-30 | Kawasaki Steel Corp | Beveling device for semiconductor wafer |
JP3256808B2 (en) * | 1991-04-30 | 2002-02-18 | 東芝セラミックス株式会社 | Peripheral polishing equipment for semiconductor wafers |
JP2542445Y2 (en) * | 1992-07-14 | 1997-07-30 | 信越半導体株式会社 | Buff groove processing equipment |
JPH11297665A (en) * | 1998-04-06 | 1999-10-29 | Takahiro Oishi | Wafer end face processing apparatus |
JPH11300587A (en) * | 1998-04-15 | 1999-11-02 | Mitsubishi Materials Corp | Semi-conductor wafer grinding device |
JP4743951B2 (en) * | 2000-11-13 | 2011-08-10 | Sumco Techxiv株式会社 | Polishing apparatus and polishing method for notch portion of semiconductor wafer |
JP2007248812A (en) * | 2006-03-16 | 2007-09-27 | Bridgestone Corp | Conductive roller |
JP2008023603A (en) * | 2006-07-18 | 2008-02-07 | Nippon Seimitsu Denshi Co Ltd | Retainer ring of two-layer structure |
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2008
- 2008-07-31 JP JP2008197159A patent/JP5386874B2/en active Active
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