JP2010026457A - 薄膜半導体基板およびその製造装置 - Google Patents
薄膜半導体基板およびその製造装置 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 147
- 239000004065 semiconductor Substances 0.000 title claims abstract description 110
- 239000010409 thin film Substances 0.000 title claims abstract description 107
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 41
- 239000002985 plastic film Substances 0.000 claims abstract description 53
- 229920006255 plastic film Polymers 0.000 claims abstract description 53
- 239000010408 film Substances 0.000 claims abstract description 42
- 239000004033 plastic Substances 0.000 claims abstract description 26
- 229920003023 plastic Polymers 0.000 claims abstract description 26
- 238000010030 laminating Methods 0.000 claims abstract description 19
- 238000004804 winding Methods 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 230000001681 protective effect Effects 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 9
- 238000009413 insulation Methods 0.000 abstract 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 abstract 1
- 238000003860 storage Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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Abstract
【解決手段】プラスチック基板と対向して組み合わせてフラットパネルディスプレイとするための薄膜半導体アレイ3を有する単板状の絶縁基板4が長尺状のプラスチックフィルム2上に連続して貼合されてなる。また、フラットパネルディスプレイとする薄膜半導体基板を製造する装置であって、薄膜半導体アレイ3を保護するための保護フィルムが貼合された単板状の絶縁基板4を長尺状のプラスチックフィルム2上に連続して貼合する貼合部と、保護フィルムを加熱または紫外線照射により剥がす剥離部と、長尺状の保護フィルム6を長尺状のプラスチックフィルム2にラミネートして薄膜半導体アレイ3を保護するラミネート部と、長尺状の保護フィルム6をラミネートした長尺状のプラスチックフィルム2をロール状に巻き取る巻取り部とを有する。
【選択図】図1
Description
このフラットパネルディスプレイには液晶ディスプレイパネルだけでなく、TFTを画素スイッチング素子として用いたELディスプレイパネルなどがある。このようなフラットパネルディスプレイとして、プラスチック基板と対向して薄膜半導体基板を組み合わせたものがある。薄膜半導体基板としては、薄膜半導体技術を用い、TFT素子(TFT:
Thin Film Transistor)、密着センサ、光電変換素子等の薄膜半導体アレイを絶縁基板上に形成するものがある(特許文献2)。
薄膜半導体アレイを有する単板状の絶縁基板が長尺状のプラスチックフィルム上に連続して貼合されてなることを特徴とする薄膜半導体基板である。
薄膜半導体アレイを保護するための保護フィルムが貼合された単板状の絶縁基板を長尺状のプラスチックフィルム上に連続して貼合する貼合部と、
前記保護フィルムを加熱または紫外線照射により剥がす剥離部と、
長尺状の保護フィルムを前記長尺状のプラスチックフィルムにラミネートして前記薄膜半導体アレイを保護するラミネート部と、
前記長尺状の保護フィルムをラミネートした前記長尺状のプラスチックフィルムをロール状に巻き取る巻取り部と、
を有することを特徴とする薄膜半導体基板の製造装置である。
図1は薄膜半導体基板の概略構成図である。この実施の形態の薄膜半導体基板は、プラスチック基板と対向して組み合わせてフラットパネルディスプレイとするためのものであり、薄膜半導体アレイ3を有する単板状の絶縁基板4が長尺状のプラスチックフィルム2上に連続して貼合されてなる。この絶縁基板4は、長尺状の保護フィルム6を長尺状のプラスチックフィルム2で保護するようにラミネートして構成される。
単板状の絶縁基板4が長尺状のプラスチックフィルム2上に連続して貼合されており、薄膜半導体アレイ3を有するロール状の薄膜半導体基板を安価に製造できる。
図4は薄膜半導体基板の製造装置の概略構成図である。この実施の形態の薄膜半導体基板の製造装置1は、プラスチック基板と対向して組み合わせてフラットパネルディスプレイとするための薄膜半導体基板を製造する装置である。この薄膜半導体基板の製造装置1は、巻出し部10と、貼合部20と、剥離部30と、ラミネート部40と、巻取り部50とを備えている。
2 長尺状のプラスチックフィルム
3 薄膜半導体アレイ
4 単板状の絶縁基板
5 保護フィルム
6 長尺状の保護フィルム
7 フラットパネルディスプレイのプラスチック基板
10 巻出し部
20 貼合部
30 剥離部
40 ラミネート部
50 巻取り部
Claims (8)
- プラスチック基板と対向して組み合わせてフラットパネルディスプレイとするための薄膜半導体基板であって、
薄膜半導体アレイを有する単板状の絶縁基板が長尺状のプラスチックフィルム上に連続して貼合されてなることを特徴とする薄膜半導体基板。 - 前記絶縁基板が、長尺状の保護フィルムを前記長尺状のプラスチックフィルムで保護するようにラミネートして構成されることを特徴とする請求項1に記載の薄膜半導体基板。
- 前記長尺状のプラスチックフィルムは、前記プラスチック基板と同じ素材のプラスチックフィルムであることを特徴とする請求項1または請求項2に記載の薄膜半導体基板。
- 前記薄膜半導体アレイの厚さが、0.1mm以下であることを特徴とする請求項1乃至請求項3のいずれか1項に記載の薄膜半導体基板。
- 前記プラスチック基板が、カラーフィルタであることを特徴とする請求項1乃至請求項4のいずれか1項に記載の薄膜半導体基板。
- プラスチック基板と対向して組み合わせてフラットパネルディスプレイとするための薄膜半導体基板を製造する装置であって、
薄膜半導体アレイを保護するための保護フィルムが貼合された単板状の絶縁基板を長尺状のプラスチックフィルム上に連続して貼合する貼合部と、
前記保護フィルムを加熱または紫外線照射により剥がす剥離部と、
長尺状の保護フィルムを前記長尺状のプラスチックフィルムにラミネートして前記薄膜半導体アレイを保護するラミネート部と、
前記長尺状の保護フィルムをラミネートした前記長尺状のプラスチックフィルムをロール状に巻き取る巻取り部と、
を有することを特徴とする薄膜半導体基板の製造装置。 - 前記長尺状のプラスチックフィルムは、前記プラスチック基板と同じ素材のプラスチックフィルムであることを特徴とする請求項6に記載の薄膜半導体基板の製造装置。
- 前記薄膜半導体アレイの厚さが、0.1mm以下であることを特徴とする請求項6または請求項7に記載の薄膜半導体基板の製造装置。
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JP2008191137A JP2010026457A (ja) | 2008-07-24 | 2008-07-24 | 薄膜半導体基板およびその製造装置 |
PCT/JP2009/056283 WO2010010739A1 (ja) | 2008-07-24 | 2009-03-27 | 薄膜半導体基板およびその製造装置 |
KR1020117001523A KR101301405B1 (ko) | 2008-07-24 | 2009-03-27 | 박막 반도체 기판 및 그 제조 장치 |
CN2009801288403A CN102224535A (zh) | 2008-07-24 | 2009-03-27 | 薄膜半导体基板及其制造装置 |
US12/737,543 US20120025213A1 (en) | 2008-07-24 | 2009-03-27 | Thin film semiconductor substrate and apparatus for manufacturing the same |
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KR100527088B1 (ko) * | 2001-12-31 | 2005-11-09 | 비오이 하이디스 테크놀로지 주식회사 | 플라스틱 기판을 이용한 액정표시장치 |
JP4526771B2 (ja) * | 2003-03-14 | 2010-08-18 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR101002936B1 (ko) * | 2003-12-17 | 2010-12-21 | 삼성전자주식회사 | 캐리어 기판, 이를 이용한 플라스틱 기판의 적층 방법 및유연한 디스플레이 장치의 제조 방법 |
KR20070041197A (ko) * | 2005-10-14 | 2007-04-18 | 엘지전자 주식회사 | Eva 진공증착법을 이용한 전자종이 표시소자의 제조방법및 eva 접착제를 포함하는 전자종이 표시소자 |
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2008
- 2008-07-24 JP JP2008191137A patent/JP2010026457A/ja active Pending
-
2009
- 2009-03-27 KR KR1020117001523A patent/KR101301405B1/ko not_active IP Right Cessation
- 2009-03-27 WO PCT/JP2009/056283 patent/WO2010010739A1/ja active Application Filing
- 2009-03-27 US US12/737,543 patent/US20120025213A1/en not_active Abandoned
- 2009-03-27 CN CN2009801288403A patent/CN102224535A/zh active Pending
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JPH05313151A (ja) * | 1992-05-08 | 1993-11-26 | Idemitsu Kosan Co Ltd | 液晶素子の製造方法 |
JPH1154877A (ja) * | 1997-08-01 | 1999-02-26 | Seiko Epson Corp | 基板接続構造、液晶表示装置及び電子機器 |
JPH11167091A (ja) * | 1997-12-03 | 1999-06-22 | Seiko Epson Corp | 液晶表示装置の製造方法 |
JPH11343149A (ja) * | 1998-06-01 | 1999-12-14 | Matsushita Electric Ind Co Ltd | 基板の貼り合わせ装置の付加装置 |
JP2001215891A (ja) * | 2000-02-01 | 2001-08-10 | Nec Corp | フラットディスプレイパネルの製造方法 |
JP2002277847A (ja) * | 2001-03-19 | 2002-09-25 | Casio Comput Co Ltd | 液晶素子の製造方法 |
JP2006049859A (ja) * | 2004-06-29 | 2006-02-16 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2007011025A (ja) * | 2005-06-30 | 2007-01-18 | Sharp Corp | 液晶表示素子の製造方法および製造装置 |
JP2007033537A (ja) * | 2005-07-22 | 2007-02-08 | Sharp Corp | 可撓性表示素子の製造装置およびその素子の製造方法 |
Also Published As
Publication number | Publication date |
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KR101301405B1 (ko) | 2013-08-28 |
KR20110047186A (ko) | 2011-05-06 |
CN102224535A (zh) | 2011-10-19 |
WO2010010739A1 (ja) | 2010-01-28 |
US20120025213A1 (en) | 2012-02-02 |
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