JP2010018668A - エポキシ樹脂組成物及びこれを用いた電子部品装置 - Google Patents
エポキシ樹脂組成物及びこれを用いた電子部品装置 Download PDFInfo
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- JP2010018668A JP2010018668A JP2008178981A JP2008178981A JP2010018668A JP 2010018668 A JP2010018668 A JP 2010018668A JP 2008178981 A JP2008178981 A JP 2008178981A JP 2008178981 A JP2008178981 A JP 2008178981A JP 2010018668 A JP2010018668 A JP 2010018668A
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- Prior art keywords
- epoxy resin
- resin composition
- phenol
- resins
- preferable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 150
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 146
- 239000000203 mixture Substances 0.000 title claims abstract description 51
- 150000001875 compounds Chemical class 0.000 claims abstract description 35
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 34
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- 239000004711 α-olefin Substances 0.000 claims abstract description 21
- 229920001577 copolymer Polymers 0.000 claims abstract description 20
- 239000011256 inorganic filler Substances 0.000 claims abstract description 19
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 19
- 229920000098 polyolefin Polymers 0.000 claims abstract description 12
- 239000006082 mold release agent Substances 0.000 claims description 5
- 239000012968 metallocene catalyst Substances 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 abstract description 6
- 239000005011 phenolic resin Substances 0.000 description 61
- -1 Glycidyl ester Chemical class 0.000 description 30
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 27
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 23
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 23
- 125000004432 carbon atom Chemical group C* 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 229920003986 novolac Polymers 0.000 description 16
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 14
- 150000002989 phenols Chemical class 0.000 description 14
- 239000000047 product Substances 0.000 description 14
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 13
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 12
- 238000002156 mixing Methods 0.000 description 12
- 125000000962 organic group Chemical group 0.000 description 12
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 11
- 150000004780 naphthols Chemical class 0.000 description 11
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 10
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 10
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 10
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 125000003710 aryl alkyl group Chemical group 0.000 description 8
- 239000013065 commercial product Substances 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- XYFCBTPGUUZFHI-UHFFFAOYSA-N phosphine group Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 8
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 8
- 239000001993 wax Substances 0.000 description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
- 239000004305 biphenyl Substances 0.000 description 7
- 235000010290 biphenyl Nutrition 0.000 description 7
- 238000011109 contamination Methods 0.000 description 7
- 239000007822 coupling agent Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000003063 flame retardant Substances 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 229920001568 phenolic resin Polymers 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 150000001450 anions Chemical class 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 125000004434 sulfur atom Chemical group 0.000 description 5
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 4
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 4
- SPURMHFLEKVAAS-UHFFFAOYSA-N 1-docosene Chemical compound CCCCCCCCCCCCCCCCCCCCC=C SPURMHFLEKVAAS-UHFFFAOYSA-N 0.000 description 4
- BLBVJHVRECUXKP-UHFFFAOYSA-N 2,3-dimethoxy-1,4-dimethylbenzene Chemical group COC1=C(C)C=CC(C)=C1OC BLBVJHVRECUXKP-UHFFFAOYSA-N 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 4
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 229930003836 cresol Natural products 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 4
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 238000006266 etherification reaction Methods 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
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- 239000003960 organic solvent Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 3
- 229940005561 1,4-benzoquinone Drugs 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- VQOXUMQBYILCKR-UHFFFAOYSA-N 1-Tridecene Chemical compound CCCCCCCCCCCC=C VQOXUMQBYILCKR-UHFFFAOYSA-N 0.000 description 2
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- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- 229940106006 1-eicosene Drugs 0.000 description 2
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 2
- ADOBXTDBFNCOBN-UHFFFAOYSA-N 1-heptadecene Chemical compound CCCCCCCCCCCCCCCC=C ADOBXTDBFNCOBN-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- PJLHTVIBELQURV-UHFFFAOYSA-N 1-pentadecene Chemical compound CCCCCCCCCCCCCC=C PJLHTVIBELQURV-UHFFFAOYSA-N 0.000 description 2
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- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 2
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- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 2
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- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 2
- UIXPTCZPFCVOQF-UHFFFAOYSA-N ubiquinone-0 Chemical compound COC1=C(OC)C(=O)C(C)=CC1=O UIXPTCZPFCVOQF-UHFFFAOYSA-N 0.000 description 2
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- 150000003739 xylenols Chemical class 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- WOAHJDHKFWSLKE-UHFFFAOYSA-N 1,2-benzoquinone Chemical compound O=C1C=CC=CC1=O WOAHJDHKFWSLKE-UHFFFAOYSA-N 0.000 description 1
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Abstract
【解決手段】 (A)エポキシ樹脂、(B)硬化剤、(C)硬化促進剤、(D)無機充填材及び(E)メタロセン系触媒を用いて製造された、酸化ポリオレフィン系ワックス化合物である離型剤と、(F)α−オレフィン、無水マレイン酸及び無水マレイン酸誘導体の少なくとも一方との共重合物を1種又は2種以上含む化合物を必須成分としてなるエポキシ樹脂組成物及び上記のエポキシ樹脂組成物を用いて封止した素子を備えた電子部品装置。
【選択図】 なし
Description
また、本発明は、上記のエポキシ樹脂組成物を用いて封止した素子を備えた電子部品装置に関する。
(A)エポキシ樹脂
本発明において、(A)エポキシ樹脂として、1分子中に2個以上のエポキシ基を有するエポキシ樹脂を用いることができる。そのようなエポキシ樹脂としては、特に制限はないが、例えば、フェノールノボラック型エポキシ樹脂、オルソクレゾールノボラック型エポキシ樹脂をはじめとするフェノール、クレゾール、キシレノール、レゾルシノール、カテコール、ビスフェノールA、ビスフェノールF等のフェノール類及び/又はα−ナフトール、β−ナフトール、ジヒドロキシナフタレン等のナフトール類とホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド、ベンズアルデヒド、サリチルアルデヒド等のアルデヒド基を有する化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック樹脂をエポキシ化したノボラック型エポキシ樹脂;
ビスフェノールA、ビスフェノールF、ビスフェノールS、アルキル置換又は非置換のビフェノール、スチルベン系フェノール類等のジグリシジルエーテル(ビスフェノール型エポキシ樹脂、ビフェニル型エポキシ樹脂、スチルベン型エポキシ樹脂)、
ブタンジオール、ポリエチレングリコール、ポリプロピレングリコール等のアルコール類のグリシジルエーテル;
フタル酸、イソフタル酸、テトラヒドロフタル酸等のカルボン酸類のグリシジルエステル型エポキシ樹脂;
アニリン、イソシアヌル酸等の窒素原子に結合した活性水素をグリシジル基で置換したもの等のグリシジル型またはメチルグリシジル型のエポキシ樹脂;
分子内のオレフィン結合をエポキシ化して得られるビニルシクロヘキセンジエポキシド、3,4−エポキシシクロヘキシルメチル−3,4−エポキシシクロヘキサンカルボキシレート、2−(3,4−エポキシ)シクロヘキシル−5,5−スピロ(3,4−エポキシ)シクロヘキサン−m−ジオキサン等の脂環型エポキシ樹脂;
パラキシリレン及び/又はメタキシリレン変性フェノール樹脂のグリシジルエーテル;
テルペン変性フェノール樹脂のグリシジルエーテル;
ジシクロペンタジエン変性フェノール樹脂のグリシジルエーテル;
シクロペンタジエン変性フェノール樹脂のグリシジルエーテル;
多環芳香環変性フェノール樹脂のグリシジルエーテル;
ナフタレン環含有フェノール樹脂のグリシジルエーテル;
ハロゲン化フェノールノボラック型エポキシ樹脂;
ハイドロキノン型エポキシ樹脂;
トリメチロールプロパン型エポキシ樹脂;
オレフィン結合を過酢酸等の過酸で酸化して得られる線状脂肪族エポキシ樹脂;
フェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂のエポキシ化物;
ビスフェノールSを除く硫黄原子含有型エポキシ樹脂
等が挙げられ、これらを単独で用いても2種以上を組み合わせて用いてもよい。
(式(VII)中、R10〜R12は水素原子又は炭素数1〜18の1価の有機基を示し、それぞれ全てが同一でも異なっていてもよく、iは0〜3の整数、jは0〜2の整数、kは0〜4の整数を示し、pは平均値で0〜1の整数を示し、l、mはそれぞれ平均値で0〜11の整数であり(l+m)は1〜11の整数を示す。)
(式(VIII)及び(IX)において、R13〜R17は水素原子又は炭素数1〜18の1価の有機基を示し、それぞれ全てが同一でも異なっていてもよく、iは0〜3の整数、jは0〜2の整数、kは0〜4の整数を示す。)
本発明のエポキシ樹脂組成物には、(B)硬化剤を用いることを必須とする。使用可能な硬化剤としては、(A)エポキシ樹脂を硬化させることができる化合物であれば、特に制限はない。例えば、フェノール樹脂などのフェノール化合物、ジアミン、ポリアミン等のアミン化合物、無水フタル酸、無水トリメリット酸、無水ピロメリット酸等の無水有機酸、ジカルボン酸、ポリカルボン酸等のカルボン酸化合物等が挙げられ、これら化合物の1種を単独で用いても、2種以上を組み合わせて用いても差し支えない。中でも、本発明の効果が十分に発揮されるという観点からは、フェノール化合物が好ましい。
フェノール、クレゾール、キシレノール、レゾルシノール、カテコール、ビスフェノールA、ビスフェノールF、フェニルフェノール、アミノフェノール等のフェノール類及び/又はα−ナフトール、β−ナフトール、ジヒドロキシナフタレン等のナフトール類とホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド、ベンズアルデヒド、サリチルアルデヒド等のアルデヒド類とを酸性触媒下で縮合又は共縮合させて得られるノボラック型フェノール樹脂;
フェノール類及び/又はナフトール類とジメトキシパラキシレンやビス(メトキシメチル)ビフェニルから合成されるフェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂;
パラキシリレン及び/又はメタキシリレン変性フェノール樹脂;
メラミン変性フェノール樹脂;
テルペン変性フェノール樹脂;
フェノール類及び/又はナフトール類とジシクロペンタジエンから共重合により合成される、ジシクロペンタジエン型フェノール樹脂、ジシクロペンタジエン型ナフトール樹脂;
シクロペンタジエン変性フェノール樹脂;
多環芳香環変性フェノール樹脂;
ビフェニル型フェノール樹脂;
トリフェニルメタン型フェノール樹脂;
これら2種以上を共重合して得たフェノール樹脂
等が挙げられ、これらを単独で用いても2種以上を組み合わせて用いてもよい。
(式(XIV)中、R26及びR27は水素原子又は炭素数1〜18の1価の有機基を示し、それぞれ全てが同一でも異なっていてもよく、iは0〜3の整数、kは0〜4の整数、nは平均値であり、0〜10の整数を示す。)
(式(XV)中、R28〜R30は水素原子又は炭素数1〜18の1価の有機基を示し、それぞれ全てが同一でも異なっていてもよく、iは0〜3の整数、kは0〜4の整数、qは0〜5の整数、l、mはそれぞれ平均値で0〜11の整数であり(l+m)は1〜11の正数を示す。)
また、第三ホスフィンとキノン化合物との付加物に用いられるキノン化合物としては特に制限はないが、例えば、o−ベンゾキノン、p−ベンゾキノン、ジフェノキノン、1,4−ナフトキノン、アントラキノン等が挙げられ、耐湿性又は保存安定性の観点からはp−ベンゾキノンが好ましい
本発明で用いられる(E)成分は、未変性のポリオレフィンワックスが酸化変性または酸グラフト変性された変性ポリオレフィンワックスが好ましい。
変性ポリオレフィンワックスとしては、熱硬化性樹脂に対する相溶性の点で酸グラフト変性されたポリオレフィンが好ましい。
また(E)成分の溶融粘度は通常100〜1,000mPa・s、好ましくは200〜800mPa・sである。(E)成分の軟化点は通常80〜120℃、好ましくは90〜110℃である。(E)成分の針入度は通常0.1〜10、好ましくは0.5〜5である。
(式(XVIII)及び(XIX)中のRは、一価の脂肪族炭化水素基を示し、nは1以上の整数である。mは、α−オレフィンと無水マレイン酸との共重合比を示し、特に制限はないが、α−オレフィンをXモル、無水マレイン酸をYモルとした場合、X/Y、すなわち、mは1/5以上〜5/1以下が好ましい。)
また、反応には、必要に応じてアミン系触媒、酸触媒等の反応触媒を加えてもよい。反応系のpHは、1〜10程度とするのが好ましい。
電子部品装置としては、例えば、リードフレーム、配線済みのテープキャリア、配線板、ガラス、シリコンウエハ等の支持部材に、半導体チップ、トランジスタ、ダイオード、サイリスタ等の能動素子、コンデンサ、抵抗体、コイル等の受動素子等の素子を搭載したものが挙げられ、それら素子部を本発明のエポキシ樹脂組成物で封止したものが挙げられる。
また、プリント回路板にも本発明のエポキシ樹脂組成物は有効に使用できる。
〔エポキシ樹脂組成物の調製及びその特性評価〕
(A)エポキシ樹脂として、エポキシ当量196、融点106℃のビフェニル型エポキシ樹脂(エポキシ樹脂1:ジャパンエポキシレジン株式会社製、商品名YX−4000H)、エポキシ当量200、軟化点65℃のオルソクレゾールノボラック型エポキシ樹脂(エポキシ樹脂2:住友化学株式会社製、商品名ESCN−190)、エポキシ当量240、軟化点90℃のビフェニル・アラルキル型エポキシ樹脂/ビフェノールのグリシジルエーテル化物混合物(エポキシ樹脂3:日本化薬株式会社製、商品名CER−3000)、臭素化エポキシ樹脂として、エポキシ当量393、軟化点80℃、臭素含有量48重量%の臭素化ビスフェノールA型エポキシ樹脂を用意した。
(C)硬化促進剤として、トリフェニルホスフィンと1,4−ベンゾキノンとの付加反応物を用意した。
(D)無機充填材として、平均粒径17.5μm、比表面積3.8m2/gの球状溶融シリカを用意した。
表面に硬質クロムメッキが施されたフェロ板(35mm×50mm×0.5mmt)上に、上記条件にてエポキシ樹脂組成物を円板上に成形(円板面積3.14cm2)、成形直後の剪断離型力(剪断離型強度)をプッシュプルゲージ(株式会社イマダ製、最大目盛500(N))で読み取る作業を10回繰り返し、10回後(10ショット後)の剪断離型力を測定した。10回後(10ショット後)の剪断離型力が30N未満のものを離型性が良好とした。
エポキシ樹脂組成物をTOWAプレス(藤和精機株式会社製、TPS−60H、TSOP28p用)を用いて、180℃、6.9MPa、90秒の条件で500ショットの連続成形を行い、金型へのはりつき、ゲート残りの有無等により連続成形性を確認し、50ショット毎にサンプリングした成形品を目視により観察することで、パッケージ汚れの有無を確認した。
◎:汚れなし
○:汚れの広がりがパッケージ表面の10面積%以下
△:汚れの広がりがパッケージ表面の10面積%超〜20面積%以下
×:汚れの広がりがパッケージ表面の20面積%超〜50面積%以下
××:汚れの広がりがパッケージ表面の50面積%超
これにより、本発明のエポキシ樹脂組成物は、離型性、連続成形性及びパッケージ汚れに優れており、このエポキシ樹脂組成物を用いてIC、LSI等を封止すれば優れた電子部品装置を得ることができる。
Claims (2)
- (A)エポキシ樹脂、(B)硬化剤、(C)硬化促進剤、(D)無機充填材及び(E)メタロセン系触媒を用いて製造された、酸化ポリオレフィン系ワックス化合物である離型剤と、(F)α−オレフィン、無水マレイン酸及び無水マレイン酸誘導体の少なくとも一方との共重合物を1種又は2種以上含む化合物を必須成分としてなるエポキシ樹脂組成物。
- 請求項1記載のエポキシ樹脂組成物を用いて封止した素子を備えた電子部品装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008178981A JP2010018668A (ja) | 2008-07-09 | 2008-07-09 | エポキシ樹脂組成物及びこれを用いた電子部品装置 |
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Cited By (2)
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KR101805991B1 (ko) * | 2015-12-15 | 2017-12-07 | 주식회사 케이씨씨 | 반도체 봉지용 에폭시 수지 조성물 |
WO2024111574A1 (ja) * | 2022-11-22 | 2024-05-30 | 株式会社レゾナック | 成形用樹脂組成物及び電子部品装置 |
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JP2001247748A (ja) * | 1999-12-28 | 2001-09-11 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2004224849A (ja) * | 2003-01-21 | 2004-08-12 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
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JP2001247748A (ja) * | 1999-12-28 | 2001-09-11 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2004224849A (ja) * | 2003-01-21 | 2004-08-12 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
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Cited By (2)
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KR101805991B1 (ko) * | 2015-12-15 | 2017-12-07 | 주식회사 케이씨씨 | 반도체 봉지용 에폭시 수지 조성물 |
WO2024111574A1 (ja) * | 2022-11-22 | 2024-05-30 | 株式会社レゾナック | 成形用樹脂組成物及び電子部品装置 |
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