JP2009535598A - カーボンナノチューブウィック構造の方法、装置、およびシステム - Google Patents
カーボンナノチューブウィック構造の方法、装置、およびシステム Download PDFInfo
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- JP2009535598A JP2009535598A JP2009508015A JP2009508015A JP2009535598A JP 2009535598 A JP2009535598 A JP 2009535598A JP 2009508015 A JP2009508015 A JP 2009508015A JP 2009508015 A JP2009508015 A JP 2009508015A JP 2009535598 A JP2009535598 A JP 2009535598A
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- Prior art keywords
- heat pipe
- catalyst layer
- wall material
- carbon nanotubes
- cold plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【選択図】 図1
Description
幾らかの実施形態において温度範囲は、熱CVDについては約摂氏500〜1000度でありってよく、プラズマCVDについては約摂氏2500〜4000度であってよい。そしてプロセスは706へ進み、一以上のキャリアガスに触媒層上を通過させ得、一以上のキャリアガスが触媒層上を通過した結果、カーボンナノチューブが成長しうる。
Claims (20)
- カーボンナノチューブウィック構造を有するヒートパイプであって、
前記ヒートパイプの内のりを形成する熱伝導性壁材と、
前記壁材上に堆積される触媒層と、
前記触媒層上に形成されるカーボンナノチューブのウィックと、
作業流体と、を含むヒートパイプ。 - 前記壁材は銅あるいはシリコンを含む、請求項1に記載のヒートパイプ。
- 前記触媒層は金属を含む、請求項1に記載のヒートパイプ。
- 前記カーボンナノチューブはパターニング技術あるいは蒸着技術を利用して形成される、請求項1に記載のヒートパイプ。
- 前記作業流体は水あるいはエタノールである、請求項1に記載のヒートパイプ。
- 前記カーボンナノチューブの形成を支援するのに一以上のキャリアガスが利用された、請求項1に記載のヒートパイプ。
- 前記一以上のキャリアガスはメタンあるいはエチレンである、請求項6に記載のヒートパイプ。
- カーボンナノチューブウィック構造を有する装置であって、
熱交換器と、
冷却板内部容量を有する冷却板と、
前記冷却板内部容量内にヒートパイプと、を含み、
前記ヒートパイプは、前記ヒートパイプの内のりを形成する熱伝導性壁材と、前記壁材上に堆積される触媒層と、前記触媒層上に形成されるカーボンナノチューブのウィックと、作業流体とを含む、装置。 - 前記冷却板と前記熱交換器とに連結される導管(conduit of tubing)と、
前記導管に連結され、前記冷却板と前記熱交換器との間の前記管内で冷却流体を循環させるポンプと、をさらに含む、請求項8に記載の装置。 - 前記カーボンナノチューブはパターニング技術あるいは蒸着技術を利用して形成される、請求項8に記載の装置。
- 一以上のキャリアガスを利用して前記カーボンナノチューブの形成を支援する、請求項8に記載の装置。
- 前記冷却板は、前記ヒートパイプを含むマニフォールドプレートを含む、請求項8に記載の装置。
- カーボンナノチューブウィック構造を有するシステムであって、
電子部材を含むフレームと、
熱交換器と、
冷却板内部容量を有する冷却板と、
前記冷却板内部容量内にヒートパイプと、を含み、
前記ヒートパイプは、前記ヒートパイプの内のりを形成する熱伝導性壁材と、前記壁材上に堆積される触媒層と、前記触媒層上に形成されるカーボンナノチューブのウィックと、作業流体とを含む、システム。 - 前記冷却板と前記熱交換器とに連結される導管と、
前記導管に連結され、前記冷却板と前記熱交換器との間の前記管内で冷却流体を循環させるポンプと、をさらに含む、請求項13に記載のシステム。 - 前記カーボンナノチューブはパターニング技術あるいは蒸着技術を利用して形成される、請求項13に記載のシステム。
- 一以上のキャリアガスを利用して前記カーボンナノチューブの形成を支援する、請求項13に記載のシステム。
- 前記冷却板は、前記ヒートパイプを含むマニフォールドプレートを含む、請求項13に記載のシステム。
- 壁材に触媒層を堆積させることと、
前記壁材および前記触媒層を、ある温度範囲に加熱することと、
一以上のキャリアガスに前記触媒層上を通過させることでカーボンナノチューブを成長させることと、を含む方法。 - 前記壁材と、触媒層と、カーボンナノチューブとをヒートパイプに封止することと、
前記ヒートパイプを作業流体で充たすことと、をさらに含む、請求項18に記載の方法。 - 前記堆積はパターニング技術あるいは蒸着技術を利用して行われる、請求項18に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/444,739 | 2006-05-31 | ||
US11/444,739 US20070284089A1 (en) | 2006-05-31 | 2006-05-31 | Method, apparatus and system for carbon nanotube wick structures |
PCT/US2007/069863 WO2008079430A2 (en) | 2006-05-31 | 2007-05-29 | Method, apparatus and system for carbon nanotube wick structures |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009535598A true JP2009535598A (ja) | 2009-10-01 |
JP4780507B2 JP4780507B2 (ja) | 2011-09-28 |
Family
ID=38820705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009508015A Expired - Fee Related JP4780507B2 (ja) | 2006-05-31 | 2007-05-29 | ヒートパイプ、装置、およびシステム |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070284089A1 (ja) |
JP (1) | JP4780507B2 (ja) |
KR (1) | KR101024757B1 (ja) |
CN (1) | CN101438402B (ja) |
DE (1) | DE112007001304T5 (ja) |
TW (1) | TWI372138B (ja) |
WO (1) | WO2008079430A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101218670B1 (ko) * | 2010-12-13 | 2013-01-10 | 정춘식 | 탄소나노튜브가 코팅된 윅을 이용한 히트파이프 |
JP2015169411A (ja) * | 2014-03-10 | 2015-09-28 | 富士通株式会社 | 熱輸送デバイスとその製造方法、及び電子機器 |
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KR20060083430A (ko) * | 2003-10-30 | 2006-07-20 | 후지쯔 가부시끼가이샤 | 냉각 장치 및 전자 장치 |
US8846143B2 (en) * | 2006-07-10 | 2014-09-30 | California Institute Of Technology | Method for selectively anchoring and exposing large numbers of nanoscale structures |
CN101232794B (zh) * | 2007-01-24 | 2011-11-30 | 富准精密工业(深圳)有限公司 | 均热板及散热装置 |
US7911052B2 (en) * | 2007-09-30 | 2011-03-22 | Intel Corporation | Nanotube based vapor chamber for die level cooling |
US7843693B2 (en) * | 2007-11-02 | 2010-11-30 | The Boeing Company | Method and system for removing heat |
US20100032141A1 (en) * | 2008-08-08 | 2010-02-11 | Sun Microsystems, Inc. | cooling system utilizing carbon nanotubes for cooling of electrical systems |
JP4881352B2 (ja) * | 2008-08-11 | 2012-02-22 | ソニー株式会社 | ヒートスプレッダ、電子機器及びヒートスプレッダの製造方法 |
JP2010062234A (ja) * | 2008-09-02 | 2010-03-18 | Sony Corp | ヒートスプレッダ、電子機器及びヒートスプレッダの製造方法 |
JP2010243036A (ja) * | 2009-04-03 | 2010-10-28 | Sony Corp | 熱輸送装置、電子機器及び熱輸送装置の製造方法 |
US20110214841A1 (en) * | 2010-03-04 | 2011-09-08 | Kunshan Jue-Chung Electronics Co. | Flat heat pipe structure |
TWI477729B (zh) * | 2011-12-30 | 2015-03-21 | Asia Vital Components Co Ltd | 散熱單元之散熱結構 |
TWI593930B (zh) * | 2011-12-30 | 2017-08-01 | 奇鋐科技股份有限公司 | 散熱單元之散熱結構 |
US9064667B2 (en) | 2012-11-15 | 2015-06-23 | California Institute Of Technology | Systems and methods for implementing robust carbon nanotube-based field emitters |
EP2923372A4 (en) | 2012-11-21 | 2016-07-20 | California Inst Of Techn | SYSTEMS AND METHOD FOR PRODUCING ELECTRONIC VACUUM DEVICES ON CARBON NANOTUBE BASE |
FR3018631B1 (fr) * | 2014-03-11 | 2016-04-29 | St Microelectronics Sa | Caloduc et son procede de fabrication |
CN103940269B (zh) * | 2014-04-25 | 2017-04-26 | 上海交通大学 | 基于碳纳米管吸液芯的热管及其制备方法 |
US10345874B1 (en) | 2016-05-02 | 2019-07-09 | Juniper Networks, Inc | Apparatus, system, and method for decreasing heat migration in ganged heatsinks |
CN109715854A (zh) | 2016-10-07 | 2019-05-03 | 惠普发展公司,有限责任合伙企业 | 均热板的涂布 |
US10591964B1 (en) * | 2017-02-14 | 2020-03-17 | Juniper Networks, Inc | Apparatus, system, and method for improved heat spreading in heatsinks |
TWI731578B (zh) * | 2020-02-10 | 2021-06-21 | 優材科技有限公司 | 熱傳導裝置與電子裝置 |
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JP2004087841A (ja) * | 2002-08-27 | 2004-03-18 | Toshiba Corp | 電子機器および冷却装置 |
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2006
- 2006-05-31 US US11/444,739 patent/US20070284089A1/en not_active Abandoned
-
2007
- 2007-05-29 DE DE112007001304T patent/DE112007001304T5/de not_active Ceased
- 2007-05-29 CN CN2007800156234A patent/CN101438402B/zh not_active Expired - Fee Related
- 2007-05-29 WO PCT/US2007/069863 patent/WO2008079430A2/en active Application Filing
- 2007-05-29 JP JP2009508015A patent/JP4780507B2/ja not_active Expired - Fee Related
- 2007-05-29 KR KR1020087029136A patent/KR101024757B1/ko not_active IP Right Cessation
- 2007-05-30 TW TW096119364A patent/TWI372138B/zh active
Patent Citations (3)
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JP2004087841A (ja) * | 2002-08-27 | 2004-03-18 | Toshiba Corp | 電子機器および冷却装置 |
US20050092467A1 (en) * | 2003-10-31 | 2005-05-05 | Hon Hai Precision Industry Co., Ltd. | Heat pipe operating fluid, heat pipe, and method for manufacturing the heat pipe |
JP2005285821A (ja) * | 2004-03-26 | 2005-10-13 | Fujitsu Ltd | 半導体装置およびその製造方法 |
Cited By (2)
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KR101218670B1 (ko) * | 2010-12-13 | 2013-01-10 | 정춘식 | 탄소나노튜브가 코팅된 윅을 이용한 히트파이프 |
JP2015169411A (ja) * | 2014-03-10 | 2015-09-28 | 富士通株式会社 | 熱輸送デバイスとその製造方法、及び電子機器 |
Also Published As
Publication number | Publication date |
---|---|
WO2008079430A9 (en) | 2008-08-14 |
DE112007001304T5 (de) | 2009-04-23 |
TWI372138B (en) | 2012-09-11 |
TW200806576A (en) | 2008-02-01 |
KR20090009927A (ko) | 2009-01-23 |
CN101438402A (zh) | 2009-05-20 |
KR101024757B1 (ko) | 2011-03-24 |
WO2008079430A2 (en) | 2008-07-03 |
US20070284089A1 (en) | 2007-12-13 |
CN101438402B (zh) | 2013-09-11 |
JP4780507B2 (ja) | 2011-09-28 |
WO2008079430A3 (en) | 2008-10-02 |
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