JP2009295877A - Resistor - Google Patents

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JP2009295877A
JP2009295877A JP2008149646A JP2008149646A JP2009295877A JP 2009295877 A JP2009295877 A JP 2009295877A JP 2008149646 A JP2008149646 A JP 2008149646A JP 2008149646 A JP2008149646 A JP 2008149646A JP 2009295877 A JP2009295877 A JP 2009295877A
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resistor
metal plate
protective film
plate material
hole
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JP5263734B2 (en
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Yasuyuki Kifune
泰幸 木舩
Shintaro Tabata
進太郎 田畑
Takayuki Yamabe
孝之 山辺
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Koa Corp
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Koa Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a resistor having the structure, in which a metal plate material is sealed with a protecting film for cooling purpose, and the metal plate material can be readily inspected visual as to whether it is exposed from a protective film. <P>SOLUTION: The resistor is provided with a resistance material 11, a couple of electrodes 12, 13 connected to the resistance material, a metal plate material 16 bonded to the resistance material via an insulating layer 15, and a protecting film 18 covering the metal plate material. This resistor is also provided, at the protecting film thereof, with a hole 19 or a groove 21, to a degree of not causing dummy holes for contact the metal plate material on the occasion of the plating process, in which a part of the metal plate material is exposed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、抵抗器に係り、特に抵抗体の発熱を抑えるための金属板材を備えた、電流測定用に回路に挿入して用いる電流検出用等の抵抗器に関する。   The present invention relates to a resistor, and more particularly, to a resistor for current detection and the like, which is inserted into a circuit for current measurement and includes a metal plate material for suppressing heat generation of a resistor.

従来から、回路に流れる電流値を検出するための電流検出用抵抗器として、低い抵抗値を有する金属板抵抗器が用いられている。係る金属板抵抗器は、一例として、ＣｕＮｉ系合金等の抵抗合金よりなる平板状の抵抗体の一面の両端部に、Ｃｕ等の高導電率金属よりなる平板状の電極をクラッディング（圧延および熱処理による圧接）等により接合したものが知られている（特許文献１）。   Conventionally, a metal plate resistor having a low resistance value has been used as a current detection resistor for detecting a current value flowing in a circuit. For example, such a metal plate resistor is formed by cladding (rolling and rolling) flat electrodes made of a highly conductive metal such as Cu on both ends of one surface of a flat resistor made of a resistance alloy such as a CuNi-based alloy. A material joined by, for example, pressure welding by heat treatment) is known (Patent Document 1).

また、アルミナ等の絶縁性基板上にＮｉＣｒ系合金等の抵抗合金箔（金属箔）を接着し、抵抗体として用いた金属箔抵抗器が古くから知られている（特許文献２）。
特開２００２−５７００９号公報 特開２００２−１５１３０４号公報 Further, a metal foil resistor used as a resistor by bonding a resistance alloy foil (metal foil) such as a NiCr alloy on an insulating substrate such as alumina has been known for a long time (Patent Document 2).
JP 2002-57009 A JP 2002-151304 A

これらの抵抗器では、被検出電流が大きくなると、発熱が抵抗体の中央部に集中して発生し、抵抗値の変動など特性の変化をもたらし、定格電流の制限ともなっている。このため、小型・コンパクト化したサイズで電流容量を大きくするため、冷却用に金属板材を抵抗体に沿って配置し、絶縁を図るため金属板材を絶縁樹脂（保護膜）で封止する構成が考えられる。しかしながら、何らかの原因で金属板材が保護膜から露出し、金属板材の絶縁が不十分になると、例えば、抵抗器を実装基板にハンダ接合によって装着する時に、ハンダが金属板材に付着することによって抵抗値が変化する等の不良が生じる可能性がある。このため、金属板材の絶縁が不十分な製品は不良品として選別する必要がある。   In these resistors, when the current to be detected becomes large, heat generation is concentrated in the central portion of the resistor, causing a change in characteristics such as a change in resistance value, and limiting the rated current. For this reason, in order to increase the current capacity in a compact and compact size, the metal plate material is disposed along the resistor for cooling, and the metal plate material is sealed with an insulating resin (protective film) for insulation. Conceivable. However, if the metal plate material is exposed from the protective film for some reason, and the insulation of the metal plate material becomes insufficient, for example, when the resistor is attached to the mounting board by solder bonding, the resistance value is due to the solder attaching to the metal plate material. Defects such as change may occur. For this reason, products with insufficient insulation of the metal plate material must be selected as defective products.

本発明は、上述の事情に基づいてなされたもので、放熱用の金属板材を備えた抵抗器において、金属板材が絶縁されているか否かの検査に好適な抵抗器およびその製造方法を提供することを目的とする。   The present invention has been made based on the above circumstances, and provides a resistor suitable for testing whether or not a metal plate material is insulated in a resistor including a metal plate material for heat dissipation, and a method for manufacturing the same. For the purpose.

本発明の抵抗器は、抵抗体と、該抵抗体と接続した一対の電極と、前記抵抗体に絶縁層を介して接着した金属板材と、前記金属板材を被覆する保護膜と、を備え、該保護膜に金属板材の一部を露出する孔または溝を備えたことを特徴とするものである。   The resistor of the present invention comprises a resistor, a pair of electrodes connected to the resistor, a metal plate material bonded to the resistor via an insulating layer, and a protective film covering the metal plate material, The protective film is provided with a hole or groove exposing a part of the metal plate.

本発明の抵抗器の製造方法は、抵抗体と、一対の電極と、前記抵抗体に絶縁層を介して接着された金属板材と、前記電極間における前記抵抗体を被覆する第１の保護膜と、前記金属板材を被覆する第２の保護膜と、を備えた抵抗器の製造方法であって、前記第２の保護膜に前記金属板材の一部を露出する孔または溝を形成し、前記孔または溝から露出した前記金属板材に接触しない程度の径としたダミーボールと、抵抗器と、を混合して電解メッキすることを特徴とするものである。   The method for manufacturing a resistor according to the present invention includes a resistor, a pair of electrodes, a metal plate bonded to the resistor via an insulating layer, and a first protective film that covers the resistor between the electrodes. And a second protective film that covers the metal plate material, wherein a hole or a groove exposing a part of the metal plate material is formed in the second protective film, A dummy ball having a diameter that does not contact the metal plate material exposed from the hole or groove and a resistor are mixed and electroplated.

本発明の抵抗器によれば、電極に電解メッキによりメッキ層を形成すると、金属板材が保護膜から露出していた場合、その露出部分にダミーボールが接触しメッキ電流が流れるため、金属板材の露出部分にメッキ層が形成されると同時に、孔または溝内の金属板材の露出部分にもメッキ層が形成される。しかしながら、金属板材が保護膜から露出していない場合は、ダミーボールは孔または溝内の金属板材に接触しないので、メッキ電流が流れず、メッキ層は形成されない。従って、孔または溝内にメッキされたか否かを判別することで、金属板材が保護膜から露出しているか否か、即ち金属板材の絶縁不良を検知することができる。従来は、かかる確認をするため、少なくとも製品の両側面、両端面、上面を検査する必要があったが、本発明により、孔または溝内のメッキ層の有無のみを判別すればよく、煩わしい作業工程を大幅に簡素化することができる。   According to the resistor of the present invention, when the plating layer is formed on the electrode by electrolytic plating, when the metal plate material is exposed from the protective film, the dummy ball contacts the exposed portion and the plating current flows. At the same time as the plating layer is formed on the exposed portion, the plating layer is also formed on the exposed portion of the metal plate material in the hole or groove. However, when the metal plate material is not exposed from the protective film, the dummy balls do not contact the metal plate material in the hole or groove, so that no plating current flows and no plating layer is formed. Therefore, it is possible to detect whether or not the metal plate material is exposed from the protective film, that is, the insulation failure of the metal plate material, by determining whether or not the hole or groove is plated. Conventionally, in order to make such confirmation, it was necessary to inspect at least both side surfaces, both end surfaces, and the upper surface of the product. The process can be greatly simplified.

また、本発明の抵抗器の製造方法によれば、金属板材が保護膜から露出しているか否かの検査を簡単且つ確実に行うことができる。   In addition, according to the method for manufacturing a resistor of the present invention, it is possible to easily and reliably inspect whether or not the metal plate material is exposed from the protective film.

以下、本発明の抵抗器およびその製造方法の実施形態について、添付図面を参照して説明する。なお、各図中、同一または相当する部材または要素には、同一の符号を付して説明する。   Embodiments of a resistor and a method for manufacturing the same according to the present invention will be described below with reference to the accompanying drawings. In addition, in each figure, the same code | symbol is attached | subjected and demonstrated to the same or equivalent member or element.

図１は、本発明の一実施形態の抵抗器を示す。この抵抗器は、金属箔からなる抵抗体１１と、抵抗体１１の下面両端部に接合した金属箔からなる一対の電極１２，１３を備える。抵抗体１１は、厚さが０．１ｍｍ程度以下の極めて薄いＮｉＣｒ系合金の箔である。一対の電極１２，１３は、厚さが０．１ｍｍ程度以下の極めて薄いＣｕの箔であり、表面には下地にＮｉメッキ層、上地にハンダまたはＳｎメッキ層が設けられ、電極１２，１３の下面が実装基板にハンダ接合により固定される。   FIG. 1 shows a resistor according to an embodiment of the present invention. This resistor includes a resistor 11 made of metal foil and a pair of electrodes 12 and 13 made of metal foil joined to both ends of the lower surface of the resistor 11. The resistor 11 is a very thin NiCr alloy foil having a thickness of about 0.1 mm or less. The pair of electrodes 12 and 13 is a very thin Cu foil having a thickness of about 0.1 mm or less. The surface is provided with a Ni plating layer on the base and a solder or Sn plating layer on the top. Is fixed to the mounting substrate by solder bonding.

抵抗体１１の上面には、絶縁層１５を介して金属板材１６が接着により固定されている。絶縁層１５は、厚さ８０μｍ程度の高熱伝導性と高絶縁耐圧性を有するエポキシ系接着剤が硬化して形成された層であり、厚さ０．２ｍｍ程度の比較的厚いＣｕの板からなる金属板材１６を抵抗体１１の上面に接着固定している。抵抗体１１の一対の電極１２，１３間部分（抵抗体の露出面）は、絶縁樹脂材からなる第１の保護膜１７により被覆されており、金属板材１６は、絶縁樹脂材からなる第２の保護膜１８により被覆されている。   A metal plate 16 is fixed to the upper surface of the resistor 11 by an adhesive via an insulating layer 15. The insulating layer 15 is a layer formed by curing an epoxy adhesive having a high thermal conductivity of about 80 μm and a high withstand voltage, and is made of a relatively thick Cu plate having a thickness of about 0.2 mm. A metal plate 16 is bonded and fixed to the upper surface of the resistor 11. A portion between the pair of electrodes 12 and 13 of the resistor 11 (exposed surface of the resistor) is covered with a first protective film 17 made of an insulating resin material, and the metal plate material 16 is a second made of an insulating resin material. The protective film 18 is covered.

従って、抵抗器の上面は第２の保護膜１８により被覆され、金属板材１６が完全に封止されているので、実装時にハンダ材が抵抗器の側面或いは上面に及んでも金属板材１６による電極端子間のショート或いは絶縁不良を防止できる。また、抵抗器の底面側は、絶縁樹脂材による保護膜１７により被覆され、一対の電極１２，１３間が封止されているので、実装時にハンダ材が抵抗体１１に接触することを防止できる。   Therefore, since the upper surface of the resistor is covered with the second protective film 18 and the metal plate material 16 is completely sealed, even if the solder material reaches the side surface or the upper surface of the resistor during mounting, the electrode by the metal plate material 16 is used. Short circuit between terminals or insulation failure can be prevented. Further, since the bottom surface side of the resistor is covered with a protective film 17 made of an insulating resin material and the pair of electrodes 12 and 13 are sealed, it is possible to prevent the solder material from contacting the resistor 11 during mounting. .

ここで、金属箔からなる抵抗体１１が極めて薄く、それ自体では形状を保持できないので、ある程度の厚さ、すなわち、剛性を有する金属板材１６が抵抗体１１の形状を保持する支持基体としての役割を果たしている。また、金属板材１６は、放熱体（ヒートシンク）としての役割を果たし、抵抗体１１で発生する熱を吸収し、金属板材１６の内部に拡散し、大気側および実装基板側に放熱し、抵抗体１１の温度上昇を低減し、且つ、抵抗体１１表面における温度集中の偏りを均一化する役割を果たしている。Ｃｕは、熱膨張係数が抵抗体のＮｉＣｒ等の抵抗合金材料に近く、且つ熱伝導性も良好で保護膜内に装着した冷却体として用いるのに好適であるが、Ａｌ等の金属板材を用いるようにしてもよい。   Here, since the resistor 11 made of a metal foil is extremely thin and cannot hold the shape itself, the metal plate 16 having a certain thickness, that is, a rigidity, serves as a support base for holding the shape of the resistor 11. Plays. The metal plate 16 serves as a heat radiator (heat sink), absorbs heat generated in the resistor 11, diffuses into the metal plate 16, and dissipates heat to the atmosphere side and the mounting substrate side. The temperature rise of 11 is reduced, and the role of temperature concentration on the surface of the resistor 11 is made uniform. Cu has a thermal expansion coefficient close to that of a resistance alloy material such as NiCr as a resistor and has good thermal conductivity and is suitable for use as a cooling body mounted in a protective film, but a metal plate material such as Al is used. You may do it.

金属板材１６を被覆する保護膜１８には、金属板材１６の一部が露出する貫通孔１９を備える。この孔１９は、電極のメッキに際して使用されるダミーボール（金属球）が金属板材の露出面に接触しない程度の直径（幅）および深さを有する。   The protective film 18 covering the metal plate 16 is provided with a through hole 19 through which a part of the metal plate 16 is exposed. The hole 19 has a diameter (width) and depth such that a dummy ball (metal sphere) used for electrode plating does not come into contact with the exposed surface of the metal plate material.

電極１２，１３の表面には、メッキ層が形成される。この際、電解メッキ槽におけるバレル内で抵抗器とダミーボールが混合され、電極１２，１３の表面にダミーボールが接触して電流が流れることで、メッキ層が形成される。一方、金属板材１６は保護膜１８で被覆されているが、貫通孔１９が存在しており、メッキ液は孔１９から金属板材１６の露出部分に接触している。しかし前述のごとく、孔１９の直径（若しくは幅）及び深さは、ダミーボールが金属板材１６の露出面に接触しない程度としているため（換言すれば、使用するダミーボールの径を、孔１９内に侵入せず、孔１９内に露出した金属板材１９に接触できない程度のものとすることで）、金属板材１６には電流が流れず、従って、孔１９内に金属板材１６が露出していても、孔１９を除く全てが保護膜１８で覆われている限り、金属板材１６にはメッキ層は形成されない。   A plating layer is formed on the surfaces of the electrodes 12 and 13. At this time, the resistor and the dummy ball are mixed in the barrel in the electrolytic plating tank, and the dummy ball comes into contact with the surfaces of the electrodes 12 and 13 so that a current flows, thereby forming a plating layer. On the other hand, the metal plate 16 is covered with the protective film 18, but there are through holes 19, and the plating solution is in contact with the exposed portions of the metal plate 16 through the holes 19. However, as described above, the diameter (or width) and depth of the hole 19 are set so that the dummy ball does not come into contact with the exposed surface of the metal plate 16 (in other words, the diameter of the dummy ball to be used is set in the hole 19). The metal plate 16 is not in contact with the metal plate 19 exposed in the hole 19), and no current flows through the metal plate 16. Therefore, the metal plate 16 is exposed in the hole 19. However, as long as all except for the holes 19 are covered with the protective film 18, no plating layer is formed on the metal plate 16.

図２（ａ）（ｂ）（ｃ）は金属板材１６が保護膜１８により、孔１９以外は完全に被覆された状態を示す。この状態では、（ａ）に示す抵抗器にメッキ処理を行っても、（ｂ）に示すように電極１２，１３にメッキ層が形成されるが、（ｃ）に示すように孔１９内にメッキ層は形成されない。一方、図２（ｄ）に示すように、金属板材１６が保護膜１８の側面等から露出してしまう場合が、保護膜のコーティング不良や、大判の基板から個片のチップ抵抗器に分割するためのダイシング時の位置ズレ等により起こり得る。この場合、メッキ処理を施すと、（ｅ）に示すように、金属板材１６の露出面１６ａにもダミーボールが接触するので、電流が流れ、露出面１６ａにメッキ層が形成されると同時に、（ｆ）に示すようにメッキ液に曝された孔１９内にもメッキ層が形成される。   2A, 2B, and 2C show a state in which the metal plate 16 is completely covered with the protective film 18 except for the holes 19. FIG. In this state, even if the resistor shown in (a) is plated, a plating layer is formed on the electrodes 12 and 13 as shown in (b), but in the hole 19 as shown in (c). A plating layer is not formed. On the other hand, as shown in FIG. 2D, when the metal plate 16 is exposed from the side surface of the protective film 18 or the like, the protective film is poorly coated or the large-sized substrate is divided into individual chip resistors. This may occur due to misalignment during dicing. In this case, when the plating process is performed, as shown in (e), the dummy ball comes into contact with the exposed surface 16a of the metal plate member 16, so that a current flows and a plated layer is formed on the exposed surface 16a. As shown in (f), a plating layer is also formed in the hole 19 exposed to the plating solution.

次に、孔１９の意義について説明する。上述したように、金属板材１６が保護膜１８から露出した状態で出荷されてしまうと、実装基板への装着時に電極端子間のショート或いは絶縁不良が生じる可能性があるので、製造工程の段階で選別工程を設け、金属板材１６が保護膜１８から露出した製品を排除する必要がある。   Next, the significance of the hole 19 will be described. As described above, if the metal plate 16 is shipped in a state where it is exposed from the protective film 18, there is a possibility that a short circuit between the electrode terminals or an insulation failure may occur at the time of mounting on the mounting substrate. It is necessary to provide a sorting step and exclude products in which the metal plate 16 is exposed from the protective film 18.

本発明では、かかる選別工程において、孔１９内の金属板材面にメッキ層が形成されたか否かを判別することで、金属板材１６の保護膜１８から露出した部分の有無を検知することができるようにしたものである。孔１９内におけるメッキ層の有無の判別は、目視による検査で行ってもよいが、ＣＣＤカメラ等での画像を用いた色識別装置等で行うこともできる。   In the present invention, it is possible to detect the presence or absence of a portion exposed from the protective film 18 of the metal plate 16 by determining whether or not a plating layer is formed on the surface of the metal plate in the hole 19 in the sorting step. It is what I did. The presence / absence of the plated layer in the hole 19 may be determined by visual inspection, or may be determined by a color identification device using an image from a CCD camera or the like.

なお、抵抗体１１が保護膜１７から露出することも同じ理由により考えられる。抵抗体１１は金属板材１６とは絶縁されているので、孔１９内のメッキ有無で抵抗体１１の露出の有無を判定することはできない。しかしながら、金属板材１６が、抵抗体１１の幅と等しいか、抵抗体１１の幅よりも大きく、金属板材１６が抵抗体１１の電極間部分（抵抗路部分）を完全に覆っていれば、抵抗体１１が保護膜１７から露出する場合は、金属板材１６も保護膜１８から露出していると考えられる。かかる構成とすれば、孔１９内のメッキの有無を判別することで、抵抗体１１が保護膜１７から露出する不良品の流出をも防止することができる。   Note that the resistor 11 is exposed from the protective film 17 for the same reason. Since the resistor 11 is insulated from the metal plate 16, it cannot be determined whether the resistor 11 is exposed based on the presence or absence of plating in the hole 19. However, if the metal plate 16 is equal to or larger than the width of the resistor 11, and the metal plate 16 completely covers the interelectrode portion (resistance path portion) of the resistor 11, the resistance When the body 11 is exposed from the protective film 17, it is considered that the metal plate 16 is also exposed from the protective film 18. With such a configuration, the presence or absence of plating in the hole 19 can be discriminated, so that the outflow of defective products in which the resistor 11 is exposed from the protective film 17 can be prevented.

次に、孔１９の好ましいサイズについて、図３を参照して検討する。ダミーボール２０の半径をｒとし、孔１９の直径を２Ｃ（半径をＣ）とし、孔１９の深さ（保護膜の厚さ）をＢとすると、ｒ＜Ｃであると、ダミーボール２０は金属板材１６に接触する。従って、ｒ＞Ｃであることが必要である。また、ｒ＞Ｃであっても、Ｂ＜ｂである場合には、図示するようにダミーボール２０は金属板材１６に接触する。従って、ダミーボール２０が金属板材１６に接触しない条件としては、
ｒ＞Ｃ、且つ、Ｂ＞ｂ
である。 Next, the preferred size of the holes 19 will be discussed with reference to FIG. When the radius of the dummy ball 20 is r, the diameter of the hole 19 is 2C (radius is C), and the depth of the hole 19 (thickness of the protective film) is B, the dummy ball 20 has r <C. Contact the metal plate 16. Therefore, it is necessary that r> C. Further, even if r> C, if B <b, the dummy ball 20 comes into contact with the metal plate 16 as illustrated. Therefore, as a condition that the dummy ball 20 does not contact the metal plate 16,
r> C and B> b
It is.

ここで、
ａ＝（ｒ２−Ｃ２）１／２、であり、
ｂ＝ｒ−ａ、であるので、
Ｂ＞ｒ−（ｒ２−Ｃ２）１／２、となる。
通常、ダミーボール２０は直径が１００μｍ程度あり、孔１９の直径（２Ｃ）を２０μｍ程度に設定することで、ｒ＞＞Ｃであり、ｂが略ゼロとなり、保護膜１８の膜厚を５０μｍ程度に設定することで、メッキに際してダミーボール２０が金属板材１６に接触しない十分なサイズの孔とすることができる。 here,
a = (r 2 −C 2 ) 1/2 ,
Since b = r−a,
B> r- (r 2 -C 2 ) 1/2 .
Usually, the dummy ball 20 has a diameter of about 100 μm, and by setting the diameter (2C) of the hole 19 to about 20 μm, r >> C, b becomes substantially zero, and the thickness of the protective film 18 is about 50 μm. By setting to, a sufficiently sized hole can be formed so that the dummy ball 20 does not contact the metal plate material 16 during plating.

上記実施形態では、第２の保護膜１８に金属板材１６の一部を露出する、メッキに際してダミーボールが金属板材１６に接触しない程度の孔１９を設ける例について説明したが、図４（ａ）に示すように、孔１９に代えて溝２１を形成するようにしてもよい。レーザビーム照射によるマーキング装置で、幅２０μｍ程度の金属板材１６の一部を露出する溝を形成でき、メーカー、製品の型式、抵抗値等の特性、その他必要な識別をするための文字、図形からなる表示と兼ねたものとすることができる。この溝２１の幅および深さを、前述同様、ダミーボールが金属板材１６の露出面に接触しない程度にしておけば、金属板材１６が保護膜から露出していない場合には、溝内の金属板材面にメッキ層が形成されず（図４（ｂ）参照）、金属板材が保護膜から露出している場合には、溝内の金属板材面にメッキ層が形成され（図４（ｃ）参照）、不良品を選別できる。   In the above-described embodiment, an example in which a hole 19 that exposes a part of the metal plate material 16 to the second protective film 18 and that does not allow the dummy balls to contact the metal plate material 16 during plating has been described. As shown in FIG. 7, a groove 21 may be formed instead of the hole 19. With a marking device using laser beam irradiation, a groove that exposes a part of the metal plate 16 with a width of about 20 μm can be formed. From the manufacturer, product model, characteristics such as resistance value, and other characters and figures for necessary identification It can also serve as a display. If the width and depth of the groove 21 are set so that the dummy balls do not come into contact with the exposed surface of the metal plate 16 as described above, the metal in the groove can be obtained when the metal plate 16 is not exposed from the protective film. When the plated layer is not formed on the plate surface (see FIG. 4B) and the metal plate is exposed from the protective film, the plated layer is formed on the metal plate surface in the groove (FIG. 4C). See), and can select defective products.

次に、上記抵抗器の製造方法の一例について、図５を参照して説明する。まず、図５（ａ）に示すように、金属箔からなる電極材料１２ｍと、抵抗体材料１１ｍとをクラッディング接合した接合材のシート１４を準備する。ここで、電極材料は、厚さが０．１ｍｍ程度以下の極めて薄いＣｕの箔であり、抵抗体材料は、厚さが０．１ｍｍ程度以下の極めて薄いＮｉＣｒ系合金の箔であり、シートの寸法は例えば５００ｍｍ×２００ｍｍ程度のものを用いる。なお、接合材は、電極材料および抵抗体材料ともに、厚さが数十μｍから数百μｍの範囲で任意に調整が可能である。そして、接合材のシート１４を、エッチング加工、プレス加工、または放電加工により、所定の形状にパターニングする。   Next, an example of a method for manufacturing the resistor will be described with reference to FIG. First, as shown in FIG. 5A, a bonding material sheet 14 is prepared by cladding an electrode material 12m made of metal foil and a resistor material 11m. Here, the electrode material is a very thin Cu foil having a thickness of about 0.1 mm or less, and the resistor material is a very thin NiCr alloy foil having a thickness of about 0.1 mm or less. For example, dimensions of about 500 mm × 200 mm are used. In addition, both the electrode material and the resistor material can be arbitrarily adjusted in the thickness range of several tens μm to several hundreds μm for the bonding material. Then, the bonding material sheet 14 is patterned into a predetermined shape by etching, pressing, or electrical discharge.

次に、図５（ｂ）に示すように、金属箔よりも厚い板材である金属板材料１６ｍに、絶縁性接着材を塗布し、パターニングした接合材１４の抵抗体材料側の面を固定し、真空熱プレス法等により加温硬化することで、接合材１４と金属板材料１６ｍを接合した絶縁層１５を形成する。 Next, as shown in FIG. 5B, an insulating adhesive is applied to the metal plate material 16m, which is a plate material thicker than the metal foil, and the resistor material side surface of the patterned bonding material 14 is fixed. to form a vacuum heat by heating cured by pressing or the like, the bonding material 14 and the metal plate material insulating layer 15 formed by joining 16m.

次に、図５（ｃ）に示すように、金属板材料１６ｍをフォトリソグラフィによりパターニングして、エッチングすることで所定の形状の金属板材１６を形成する。そして、電極材料１１をフォトリソグラフィによりパターニングして、エッチングすることで、所定の形状の一対の電極１２，１３を形成すると共に、一対の電極１２，１３間で抵抗体材料１１ｍの面を露出させ、抵抗体（抵抗路）１１を形成する。   Next, as shown in FIG. 5C, the metal plate material 16m is patterned by photolithography and etched to form the metal plate material 16 having a predetermined shape. Then, the electrode material 11 is patterned by photolithography and etched to form a pair of electrodes 12 and 13 having a predetermined shape, and the surface of the resistor material 11m is exposed between the pair of electrodes 12 and 13. The resistor (resistive path) 11 is formed.

次に、図５（ｄ）に示すように、一対の電極１２，１３間の抵抗体１１を被覆するエポキシ樹脂等からなる第１の保護膜１７をスクリーン印刷等により形成する。さらに、抵抗器上面側において、金属板材１６を被覆するエポキシ樹脂等からなる第２の保護膜１８をスクリーン印刷等により全面に形成する。そして、レーザビーム照射等で、保護膜１８に金属板材１６の一部を露出する、メッキに際してダミーボールが金属板材に接触しない程度の、孔１９または溝２１を形成する。   Next, as shown in FIG. 5D, a first protective film 17 made of an epoxy resin or the like that covers the resistor 11 between the pair of electrodes 12 and 13 is formed by screen printing or the like. Further, a second protective film 18 made of an epoxy resin or the like covering the metal plate material 16 is formed on the entire surface of the resistor by screen printing or the like. A hole 19 or a groove 21 is formed by laser beam irradiation or the like so that a part of the metal plate 16 is exposed on the protective film 18 and the dummy balls do not contact the metal plate during plating.

次に、マーキング切断線に沿ってダイシングすることで、個々の抵抗器が得られる。そして、図５（ｆ）に示すように、電極１２，１３にＮｉメッキとＳｎメッキの表面処理を行う。そして、最終検査を経て、製品が完成する。最終検査では、孔１９または溝２１にメッキが形成されているか否かの検査を行い、金属板材１６が保護膜１８から露出している不良品を排除する選別工程を実施する。   The individual resistors are then obtained by dicing along the marking cut line. Then, as shown in FIG. 5F, the electrodes 12 and 13 are subjected to Ni plating and Sn plating surface treatment. Then, after the final inspection, the product is completed. In the final inspection, it is inspected whether or not the plating is formed in the hole 19 or the groove 21, and a selection process for removing defective products in which the metal plate material 16 is exposed from the protective film 18 is performed.

上記製造工程によれば、金属板材１６が保護膜１８から露出している不良品を排除する選別工程が簡単になり、上記不良品の流出を防止できる。   According to the manufacturing process described above, the sorting process for removing the defective product in which the metal plate 16 is exposed from the protective film 18 is simplified, and the outflow of the defective product can be prevented.

なお、上記実施形態の説明では、金属箔抵抗器の例について説明したが、抵抗体の冷却用に金属板材を保護膜で封止した構成を備えた各種の抵抗器について、本発明の趣旨を適用することができる。また、抵抗器に限らず、発熱する要素があり、該要素を絶縁層を介して被覆する冷却用の金属板材を配置し、該金属板材を保護膜により封止し、電極端子にメッキ層を備える各種の電子部品についても、本発明の趣旨を同様に適用することができる。   In the description of the above embodiment, the example of the metal foil resistor has been described. However, the gist of the present invention is described with respect to various resistors having a configuration in which a metal plate material is sealed with a protective film for cooling the resistor. Can be applied. Moreover, there is an element that generates heat, not limited to a resistor, a metal sheet for cooling that covers the element via an insulating layer is disposed, the metal sheet is sealed with a protective film, and a plating layer is provided on the electrode terminal. The gist of the present invention can be similarly applied to various electronic components provided.

これまで本発明の一実施形態について説明したが、本発明は上述の実施形態に限定されず、その技術的思想の範囲内において種々異なる形態にて実施されてよいことは言うまでもない。   Although one embodiment of the present invention has been described so far, it is needless to say that the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea.

本発明の一実施形態の抵抗器を示す、（ａ）は内部を破線で示す上面図であり、（ｂ）は（ａ）のＢＢ線に沿った断面図である。The resistor of one Embodiment of this invention is shown, (a) is a top view which shows an inside with a broken line, (b) is sectional drawing along the BB line of (a). （ａ）（ｂ）は金属板材が保護膜から露出していない状態の上記抵抗器の斜視図であり、（ｃ）は孔内部にメッキ層が存在しないことを示す図であり、（ｄ）（ｅ）は金属板材が保護膜から露出した状態の上記抵抗器の斜視図であり、（ｆ）は孔内部にメッキ層が形成されたことを示す図である。(A) (b) is a perspective view of the resistor in a state where the metal plate material is not exposed from the protective film, (c) is a diagram showing that there is no plating layer inside the hole, (d) (E) is a perspective view of the resistor in a state where the metal plate material is exposed from the protective film, and (f) is a diagram showing that a plating layer is formed inside the hole. 保護膜に金属板材の一部を露出するメッキに際して、ダミーボールが金属板材に接触しない程度の孔のサイズ検討のための図である。It is a figure for examination of the hole size to the extent that the dummy ball does not come into contact with the metal plate material during plating that exposes a part of the metal plate material on the protective film. （ａ）は保護膜に設けた金属板材の一部を露出する溝の例を示す図であり、（ｂ）（ｃ）はその拡大図である。(A) is a figure which shows the example of the groove | channel which exposes a part of metal plate material provided in the protective film, (b) (c) is the enlarged view. 本発明の抵抗器の製造工程を示す図である。It is a figure which shows the manufacturing process of the resistor of this invention.

符号の説明Explanation of symbols

１１ 抵抗体
１１ｍ 抵抗体材料
１２，１３ 電極
１２ｍ 電極材料
１４ 接合材シート
１５ 絶縁層
１６ 金属板材
１６ｍ 金属板材料
１７ 第１の保護膜
１８ 第２の保護膜
１９ 貫通孔
２０ ダミーボール
２１ 貫通溝 DESCRIPTION OF SYMBOLS 11 Resistor 11m Resistor material 12, 13 Electrode 12m Electrode material 14 Bonding material sheet 15 Insulating layer 16 Metal plate material 16m Metal plate material 17 First protective film 18 Second protective film 19 Through-hole 20 Dummy ball 21 Through-groove

Claims (7)

抵抗体と、
該抵抗体と接続した一対の電極と、
前記抵抗体に絶縁層を介して接着した金属板材と、
前記金属板材を被覆する保護膜と、を備え、
該保護膜に金属板材の一部を露出する孔または溝を備えたことを特徴とする抵抗器。 A resistor,
A pair of electrodes connected to the resistor;
A metal plate adhered to the resistor via an insulating layer;
A protective film covering the metal plate material,
A resistor comprising a hole or a groove exposing a part of the metal plate material in the protective film. 前記電極の表面はメッキで覆われており、
前記孔または溝より前記金属板材が露出した部分はメッキが覆っていないことを特徴とする請求項１記載の抵抗器。 The surface of the electrode is covered with plating,
The resistor according to claim 1, wherein a portion where the metal plate material is exposed from the hole or groove is not covered with plating. 前記溝が、文字又は図形を構成していることを特徴とする請求項１記載の抵抗器。   The resistor according to claim 1, wherein the groove forms a character or a figure. 前記金属板材の幅は、前記抵抗体の幅と同一又は前記抵抗体の幅よりも広いことを特徴とする請求項１記載の抵抗器。   The resistor according to claim 1, wherein the width of the metal plate is equal to or wider than the width of the resistor. 抵抗体と、一対の電極と、前記抵抗体に絶縁層を介して接着された金属板材と、前記電極間における前記抵抗体を被覆する第１の保護膜と、前記金属板材を被覆する第２の保護膜と、を備えた抵抗器の製造方法であって、
前記第２の保護膜に前記金属板材の一部を露出する孔または溝を形成し、
前記孔または溝から露出した前記金属板材に接触しない程度の径としたダミーボールと、抵抗器と、を混合して電解メッキすることを特徴とする抵抗器の製造方法。 A resistor, a pair of electrodes, a metal plate bonded to the resistor via an insulating layer, a first protective film covering the resistor between the electrodes, and a second covering the metal plate A method of manufacturing a resistor comprising:
Forming a hole or groove exposing a part of the metal plate in the second protective film;
A method of manufacturing a resistor, comprising mixing a dummy ball having a diameter that does not contact the metal plate exposed from the hole or groove and a resistor, and performing electrolytic plating. さらに、前記孔または溝の前記金属板材が露出した面にメッキ層が形成されているか否かによって抵抗器を選別することを特徴とする請求項５記載の抵抗器の製造方法。   6. The method of manufacturing a resistor according to claim 5, further comprising selecting a resistor depending on whether a plated layer is formed on a surface of the hole or groove where the metal plate is exposed. 保護膜内に冷却用の金属板材を封止した電子部品であって、
前記保護膜に前記金属板材を露出する孔または溝を備えたことを特徴とする電子部品。 An electronic component in which a metal sheet for cooling is sealed in a protective film,
An electronic component comprising a hole or a groove exposing the metal plate material in the protective film.
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Publication number Priority date Publication date Assignee Title
KR101075664B1 (en) * 2009-12-24 2011-10-21 삼성전기주식회사 Chip resister and method of manufacturing the same
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JP2016503237A (en) * 2012-12-21 2016-02-01 ヴィシェイ デイル エレクトロニクス, インコーポレイテッドVishay Dale Electronics, Inc. Power resistor with integrated heat spreader
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US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
KR20190127013A (en) * 2018-05-03 2019-11-13 이재훈 A current detection resistor and the manufacturing method
KR102071137B1 (en) * 2018-05-03 2020-03-02 이재훈 A current detection resistor and the manufacturing method

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