JP2009290218A - 熱管理装置及び熱管理装置の製造方法 - Google Patents
熱管理装置及び熱管理装置の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 claims abstract description 31
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- 239000004020 conductor Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 239000011888 foil Substances 0.000 claims description 28
- 239000000654 additive Substances 0.000 abstract description 4
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- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
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- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
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- 238000010586 diagram Methods 0.000 description 2
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002470 thermal conductor Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
- F28F7/02—Blocks traversed by passages for heat-exchange media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/028—Treatment by energy or chemical effects using vibration, e.g. sonic or ultrasonic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Aviation & Aerospace Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】電子部品等の熱源から熱エネルギーを除去する一体的に形成されたチャネルを有するモノリシック構造のモノコック構造体を含む、電子シャーシとして使用するのに適した熱管理装置である。この装置は、超音波結合等の加法/減法製造プロセスを使用して製造可能である。
【選択図】図1
Description
電子アセンブリが取り付けられ、電子アセンブリから熱を除去するために一体的に形成された一以上のチャネルを有するモノコック構造体を備えている。
モノコック構造体が端部を含み、
チャネルが電子アセンブリからモノコック構造体の端部まで熱を伝送するためにモノコック構造体の端部に沿って延びる部分を含んでいる。
銅、
マンガン、
ニッケル、
金、
銀、及び
チタン
の一以上の結合層を含んでいる。
実装容器をさらに備え、
モノコック構造体が、電子アセンブリが取り付けられた面と、この面に対してほぼ横方向に延びており、実装容器内に挿入される端部を含んでいる。
モノリシック構造のシャーシと、
シャーシに取り付けられ、発熱する一以上の回路基板
を備え、
モノリシック構造のシャーシが回路基板から熱を除去する一体的に形成されたチャネルを含む。
複数の物質層を結合させることによって内部に伝熱チャネルを有するモノリシック構造の熱伝導体を形成するステップと、
発熱電子回路を熱伝導体に取り付けるステップ
を含む。
基板上に連続する熱伝導シート材料の層を配置するステップと、
超音波変換器を各層と接触させるステップと、
変換器を層の上で移動させるステップと、
変換器が層の上で移動する時に、超音波変換器を使用して層に超音波エネルギーを加えることにより複数の層を互いに冶金的に結合させてモノリシック構造体を形成するステップと、
複数の層が互いに結合する時に、層の複数の部位を選択的にトリミングすることで、モノリシック構造体の流体チャネルを形成するステップ
を含む。
冶金的に結合した金属箔の層とそれぞれ熱源と接触する一対の面を含むほぼ平坦なモノリシック構造体と、
構造体からチャネルへの熱の転送を促進するために、チャネルの伝熱フィンを含む構造体に一体的に形成され、構造体から熱を抽出できる熱抽出区域を画定する平坦なモノリシック構造体の端部に沿って延びる配列した延長部を含む流体チャネルと、
チャネルを熱交換流体源に連結させる構造体の流入口及び流出口
を備えている。
32 構造体
33 壁
34 内蔵チャネル
35 第1層
36 流入口
37 外層
38 流出口
39 弓形区域
40 延長部
41 開口部
42 線形領域
43 周辺部
44 線形領域
46 伝熱フィン
48 伝熱フィン
50 電子ユニット
52 サブアセンブリ
54 電子機器又はダイ
56 接続プラグ
58 容器
60 容器
61 チャネル
62 ソケット
63 ウェッジロック
68 プリント基板(PWB)
70 熱伝導層
72 点線
74 点線
86 超音波結合機構
88 蒸着モジュール
89 先端部
90 基板
92 基部
94 金属箔層
96 供給ロール
98 超音波先端部
100 金属箔層
104 下部基板
106 ピゾ装置
108 ブースター
110 ソノトロード
112 矢印
114 頂点部
116 矢印
120 変形域
128 熱管理装置
130 金属箔層
131 金属箔層
132 金属箔層
133 金属箔層
134 金属箔層
136 周辺部
138 溶接箇所
144 ウィック領域
145 流体
146 蒸気チューブ
147 表面張力
148 隙間
149 表面
150 航空機製造及び保守方法
152 航空機
154 規格及び設計
156 材料の入手
158 部品及びサブアセンブリの製造
160 システムの一体化
162 認証及び納入
164 稼働
166 保守サービス
168 機体
170 複数のシステム
172 機体内部
174 推進システム
176 電子システム
178 油圧システム
180 環境システム
Claims (11)
- 熱源から熱を除去する熱管理装置であって、
熱源に接して配置され且つ熱源から熱を伝送する一以上の内蔵チャネルを有するモノリシック構造体を備える、熱管理装置。 - 本体が第1及び第2対向端部を含み、チャネルが、熱を本体から第1及び第2端部に伝送するための第1及び第2端部に沿ってそれぞれ延びている第1及び第2部分を含んでいる、請求項1に記載の装置。
- チャネルが内壁と、本体からチャネルへ熱を転送しやすくする壁と一体化した伝熱フィンを含む、請求項1に記載の装置。
- 本体が、熱源を取り付け可能な対向面を有するプレートである、請求項1に記載の装置。
- モノリシック構造体が、熱源から熱を伝送する第2内蔵チャネルを含み、第1及び第2チャネルがジグザグパターンを形成し概して互いに同延である、請求項1に記載の装置。
- 複数の熱伝導物質層を結合して、熱エネルギーの流れを伝送する内蔵チャネルを有するモノリシック構造体を形成するステップを含む、熱管理装置の製造方法。
- 複数の層を結合するステップが、連続する金属箔層を互いに冶金的に結合させることを含む、請求項6に記載の方法。
- 冶金的結合が、金属箔層に超音波エネルギーを加えることによって行われる、請求項7に記載の方法。
- 金属箔層に超音波エネルギーを印加するステップが、
金属箔層を超音波変換器の先端部に接触させ、
金属箔層全域にわたって先端部を移動させる
ことによって行われる、請求項8に記載の方法。 - 複数の層を結合するステップが、伝熱フィンを内蔵チャネル内部に、本体と一体的に形成することを含む、請求項6に記載の方法。
- 請求項6に記載の方法によって製造される熱管理装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/131,081 | 2008-05-31 | ||
US12/131,081 US9500416B2 (en) | 2008-05-31 | 2008-05-31 | Thermal management device and method for making the same |
Publications (2)
Publication Number | Publication Date |
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JP2009290218A true JP2009290218A (ja) | 2009-12-10 |
JP5858594B2 JP5858594B2 (ja) | 2016-02-10 |
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Country Status (5)
Country | Link |
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US (1) | US9500416B2 (ja) |
EP (1) | EP2131640B1 (ja) |
JP (1) | JP5858594B2 (ja) |
KR (1) | KR101652515B1 (ja) |
CN (1) | CN101594768B (ja) |
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US10928139B1 (en) | 2013-08-16 | 2021-02-23 | Advanced Cooling Technologies, Inc. | Assembly and process for heat transfer with three surfaces |
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US20180184550A1 (en) | 2016-12-28 | 2018-06-28 | Microsoft Technology Licensing, Llc | Metal additive structures on printed circuit boards |
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CN101594768B (zh) | 2014-11-05 |
EP2131640A1 (en) | 2009-12-09 |
EP2131640B1 (en) | 2019-11-06 |
KR20090124939A (ko) | 2009-12-03 |
CN101594768A (zh) | 2009-12-02 |
US20090296345A1 (en) | 2009-12-03 |
US9500416B2 (en) | 2016-11-22 |
JP5858594B2 (ja) | 2016-02-10 |
KR101652515B1 (ko) | 2016-08-30 |
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