JP2009260114A - Substrate bonding device - Google Patents

Substrate bonding device Download PDF

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JP2009260114A
JP2009260114A JP2008108759A JP2008108759A JP2009260114A JP 2009260114 A JP2009260114 A JP 2009260114A JP 2008108759 A JP2008108759 A JP 2008108759A JP 2008108759 A JP2008108759 A JP 2008108759A JP 2009260114 A JP2009260114 A JP 2009260114A
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Prior art keywords
substrate
bonding
elastic sheet
jig
wafer
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JP2008108759A
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JP4812131B2 (en
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Yuka Hoshiya
有香 星谷
Eiichiro Aoki
栄一郎 青木
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NEC Engineering Ltd
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NEC Engineering Ltd
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Priority to JP2008108759A priority Critical patent/JP4812131B2/en
Priority to PCT/JP2009/057200 priority patent/WO2009128376A1/en
Priority to KR1020107022935A priority patent/KR101260117B1/en
Priority to CN2009801131619A priority patent/CN102007587B/en
Priority to TW098112223A priority patent/TWI466224B/en
Publication of JP2009260114A publication Critical patent/JP2009260114A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate bonding device which keeps the bonding position of a wafer with a substrate, etc. constant, prevents the substrate from being damaged, and is satisfactory in work efficiency. <P>SOLUTION: The substrate bonding device includes: a base 2; an upper cover 3; an elastic sheet 5 which divides an air-tight space into a first air-tight void 9 at the base side and a second air-tight void 10 of the upper cover side; a first bonding jig 12 which is mounted on the elastic sheet, separates from the elastic sheet, a first substrate having an adhesive double coated tape bonded to the upper surface, and supports the first substrate while positioning the first substrate at a predetermined position of the elastic sheet; a second bonding jig 13 which is arranged above the first substrate, supports a second substrate at a position opposing to the first substrate so as to be apart from the first substrate, and positions the second substrate at a predetermined position; and an air pressure adjustment means which adjusts the inner air pressure of both air-tight voids, sets the atmospheric pressure in the first air-tight void while making the second air-tight void vacuum, thereby elastically deforming the elastic sheet upward to bond both substrates via the adhesive double coated tape. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、基板貼り合わせ装置に関し、特に、真空を利用して、ウエハと基板の貼り合わせなどを行う基板貼り合わせ装置に関する。   The present invention relates to a substrate bonding apparatus, and more particularly to a substrate bonding apparatus that performs bonding of a wafer and a substrate using a vacuum.

近年、パソコン等の電子機器の薄型化及び小型化に伴って半導体ウエハ（以下、適宜「ウエハ」と略称する）の薄型化及び小型化が進んでいる。しかし、薄型化及び小型化された半導体ウエハは、強度が不十分であるため、ウエハの製造工程において、ガラス板等の基板をウエハに貼り合わせたり、２枚の基板をウエハの両面に各々貼り合わせることにより補強を行う必要があった。   2. Description of the Related Art In recent years, with the reduction in thickness and size of electronic devices such as personal computers, semiconductor wafers (hereinafter referred to as “wafers” as appropriate) have been made thinner and smaller. However, thinned and miniaturized semiconductor wafers have insufficient strength, so that in the wafer manufacturing process, substrates such as glass plates are bonded to the wafer, or two substrates are bonded to both sides of the wafer. It was necessary to reinforce by combining them.

このような補強を行う前工程として、例えば、特許文献１には、ウエハの表面にダイシングテープ（両面粘着テープ）を貼り付けるウエハ用真空テープ貼付装置が提案されている。このウエハ用真空テープ貼付装置は、基台と、基台の上方に被せられて基台との間に気密空間を形成する上蓋と、気密空間を基台側の第１の気密空間と上蓋側の第２の気密空間とに仕切り、第２の気密空間側にテープを貼り付ける部品を載置する弾性体の弾性シートと、弾性シートに載置され、ウエハを弾性シートから離して支持する貼付用冶具と、第１及び第２の気密空間の内気圧を各々調整する第１及び第２の真空ポンプとで構成される。   As a pre-process for performing such reinforcement, for example, Patent Document 1 proposes a wafer vacuum tape attaching device for attaching a dicing tape (double-sided adhesive tape) to the surface of a wafer. The wafer vacuum tape applicator includes a base, an upper lid that is placed over the base and forms an airtight space between the base, a first airtight space on the base side, and an upper lid side. An elastic sheet of an elastic body that divides into the second airtight space and places a part to which the tape is attached on the second airtight space side, and an adhesive that is placed on the elastic sheet and supports the wafer apart from the elastic sheet And a first vacuum pump and a second vacuum pump for adjusting the internal pressure of the first and second hermetic spaces, respectively.

また、特許文献２には、ウエハに基板を貼り合わせて補強する基板貼り合わせ方法が提案されている。この基板貼り合わせ方法は、上記特許文献１に記載の貼付装置等を用いてウエハの上面に両面粘着テープを貼り付ける過程と、この両面粘着テープよりも粘着力の弱い支持シートの粘着面に基板を貼り付け、この基板をウエハと間隙をもって相対向する位置に配置する過程と、減圧状態のもとで支持シートの被粘着面に貼り付け手段を押圧しながら、基板をウエハに貼り付けた両面粘着テープに貼り付ける過程とを備える。   Patent Document 2 proposes a substrate bonding method in which a substrate is bonded to a wafer for reinforcement. This substrate laminating method includes a process of affixing a double-sided adhesive tape to the upper surface of a wafer using the affixing device described in Patent Document 1, and a substrate on an adhesive surface of a support sheet having a lower adhesive strength than the double-sided adhesive tape. The process of disposing the substrate at a position facing the wafer with a gap, and both surfaces of the substrate adhered to the wafer while pressing the adhering means against the adherend surface of the support sheet under reduced pressure. And a process of attaching to an adhesive tape.

特開２００６−３１０３３８号公報JP 2006-310338 A 特開２００６−２２２２６７号公報JP 2006-222267 A

しかし、上記特許文献２に記載の基板貼合せ方法においては、基板をウエハと間隙をもって相対向する位置に配置する過程において、作業者が基板を支持シートの定位置に貼り付けるのは極めて困難であり、ウエハと基板の貼り合わせ位置を一定に保つことができなかった。   However, in the substrate bonding method described in Patent Document 2, it is extremely difficult for an operator to bond the substrate to a fixed position of the support sheet in the process of arranging the substrate at a position facing the wafer with a gap. In other words, the bonding position of the wafer and the substrate could not be kept constant.

また、支持シートの張力、基板とウエハとの間隙及び支持シートの粘着面の粘着力により、基板とウエハの貼り合わせ位置が変化する虞があった。さらに、粘着面に基板を貼り付けた支持シートの上からローラによって押圧することにより、基板とウエハの貼り合わせを行うため、基板へ応力が加わって基板が破損する虞があった。   Further, the bonding position of the substrate and the wafer may change due to the tension of the support sheet, the gap between the substrate and the wafer, and the adhesive force of the adhesive surface of the support sheet. Furthermore, since the substrate and the wafer are bonded together by pressing with a roller from the support sheet having the substrate bonded to the adhesive surface, there is a possibility that the substrate is damaged due to stress applied to the substrate.

さらに、支持テープの高さが予め設定されているため、貼り合わせるウエハ及び基板の枚数が制限されるという問題があり、改善の余地があった。さらに、ウエハとウエハより小径の基板を貼り合わせた場合、ウエハに基板と貼り合わせられない両面粘着テープが残ってしまうため、製品の品質が悪化するという問題もあった。   Furthermore, since the height of the support tape is preset, there is a problem that the number of wafers and substrates to be bonded is limited, and there is room for improvement. In addition, when a wafer and a substrate having a smaller diameter than the wafer are bonded together, a double-sided adhesive tape that cannot be bonded to the substrate remains on the wafer, resulting in a problem that the quality of the product deteriorates.

そこで、本発明は、上記従来の技術における問題点に鑑みてなされたものであって、ウエハと基板等の貼り合わせ位置を一定に保つことができるとともに、基板を破損する虞がなく、作業効率のよい基板貼り合わせ装置を提供することを目的とする。   Therefore, the present invention has been made in view of the above-described problems in the prior art, and can keep the bonding position of the wafer and the substrate constant, and there is no possibility of damaging the substrate. An object of the present invention is to provide an excellent substrate bonding apparatus.

上記目的を達成するため、本発明は基板貼り合わせ装置であって、基台と、該基台の上面側に設けられ、該基台との間に気密空間を形成する上蓋と、該気密空間を前記基台側の第１の気密空間と、上蓋側の第２の気密空間とに仕切る弾性シートと、該弾性シートに載置され、上面に両面粘着テープが貼り付けられた第１の基板を前記弾性シートから離間させるとともに、該第１の基板を前記弾性シートの所定の位置に位置決めしながら支持する第１の貼り合わせ用治具と、前記第１の基板の上方に設けられ、第２の基板を前記第１の基板と相対向する位置に該第１の基板から離間させて支持するとともに、前記第２の基板を所定の位置に位置決めする第２の貼り合わせ用治具と、前記第１及び第２の気密空間の各々の内気圧を調整する気圧調整手段とを備え、該気圧調整手段によって、前記第１の気密空間を大気圧とするとともに、前記第２の気密空間を真空圧とすることにより、前記弾性シートを上方に弾性変形させ、前記第１の基板と前記第２の基板とを前記両面粘着テープを介して貼り合わせることを特徴とする。   In order to achieve the above object, the present invention is a substrate bonding apparatus, comprising a base, an upper lid provided on the upper surface side of the base, and forming an airtight space with the base, and the airtight space A first sheet having a double-sided adhesive tape affixed to the upper surface thereof, and an elastic sheet that divides the base into a first airtight space on the base side and a second airtight space on the upper lid side And a first bonding jig for supporting the first substrate while positioning the first substrate at a predetermined position of the elastic sheet, and a first bonding jig provided above the first substrate, A second bonding jig for positioning the second substrate at a predetermined position while supporting the second substrate at a position opposite to the first substrate and separating from the first substrate; Pressure control for adjusting the internal pressure of each of the first and second airtight spaces Means for adjusting the first airtight space to atmospheric pressure and the second airtight space to vacuum pressure by the air pressure adjusting means to elastically deform the elastic sheet upward, and 1 board | substrate and said 2nd board | substrate are bonded together through the said double-sided adhesive tape.

そして、本発明によれば、第１の貼り合わせ用治具によって第１の基板を所定の位置に位置決めし、第２の貼り合わせ用治具によって第２の基板を所定の位置に位置決めしながら第１の基板と第２の基板を貼り合わせることができるため、第１の基板と第２の基板の貼り合わせ位置を一定に保つことができる。また、ローラによって押圧することなく基板を貼り合わせることができるため、応力により基板が破損する虞もない。   According to the present invention, the first substrate is positioned at a predetermined position by the first bonding jig, and the second substrate is positioned at the predetermined position by the second bonding jig. Since the first substrate and the second substrate can be bonded together, the bonding position of the first substrate and the second substrate can be kept constant. Further, since the substrates can be bonded together without being pressed by a roller, there is no possibility that the substrate is damaged by stress.

前記基板貼り合わせ装置において、前記第１の貼り合わせ用治具を、前記弾性シートに載置されるプレートと、該プレート上に配置され、前記第１の基板を前記プレートの所定の位置に位置決めする位置決めピンとを有するように構成することができる。これにより、第１の基板を弾性シートの所定の位置に容易に位置決めすることができる。   In the substrate bonding apparatus, the first bonding jig is disposed on a plate placed on the elastic sheet, and the first substrate is positioned at a predetermined position of the plate. And a positioning pin to be configured. Thereby, the first substrate can be easily positioned at a predetermined position of the elastic sheet.

前記基板貼り合わせ装置において、前記第２の貼り合わせ用治具を、前記第２の基板と同形状に穿設されて該第２の基板を所定の位置に位置決めする貫通孔と、該第２の貼り合わせ用治具の下面に固定され、前記貫通孔に挿入された第２の基板を支持するための支持部材とを有するように構成し、前記第１の貼り合わせ用治具を、前記支持部材と同形状に穿設された孔を有するように構成し、さらに、前記弾性シートに載置され、前記第１の貼り合わせ用治具と同形状に穿設されて該第１の貼り合わせ用治具を前記弾性シートの所定の位置に位置決めする貫通孔と、前記第２の基板を前記第１の基板に対して所定の位置関係となるように前記第２の貼り合わせ用治具を位置決めする位置決め手段とを有するプレート台を設けることができる。これにより、第２の基板を従来のような支持シートにより支持することなく、第１の基板と相対向する位置に第１の基板から離間させるとともに、第２の基板を所定の位置に位置決めしながら支持することができるため、基板の貼り合わせ位置が変化する虞がない。また、第２の基板が第１の基板に対して所定の位置関係となるように位置決めしながら第２の貼り合わせ用治具を支持することができるため、基板の貼り合わせ位置をより確実に一定に保つことができる。さらに、第１の貼り合わせ用治具と、第２の貼り合わせ用治具との間隔を調整することにより、所望の枚数の基板を貼り合わせることができる。   In the substrate bonding apparatus, the second bonding jig is drilled in the same shape as the second substrate, and the second substrate is positioned at a predetermined position. And a support member for supporting the second substrate inserted into the through hole, and the first bonding jig is A hole is formed in the same shape as the support member, and is further mounted on the elastic sheet and is drilled in the same shape as the first bonding jig. A through hole for positioning the alignment jig at a predetermined position of the elastic sheet, and the second bonding jig so that the second substrate is in a predetermined positional relationship with respect to the first substrate. A plate base having positioning means for positioning the plate can be provided. As a result, the second substrate is separated from the first substrate at a position opposite to the first substrate without being supported by a conventional support sheet, and the second substrate is positioned at a predetermined position. Therefore, there is no possibility that the bonding position of the substrates changes. In addition, since the second bonding jig can be supported while positioning the second substrate so as to have a predetermined positional relationship with respect to the first substrate, the bonding position of the substrates can be more reliably determined. Can be kept constant. Furthermore, a desired number of substrates can be bonded together by adjusting the distance between the first bonding jig and the second bonding jig.

前記基板貼り合わせ装置において、前記第１の基板の上面の面積を、前記第２の基板の下面より小さくすることができる。これにより、第１の基板と第２の基板の貼り合わせ後、両面粘着テープを第１の基板の上面に沿って切り取ることにより、第１の基板と第２の基板の貼り合わせ面にのみ両面粘着テープを介在させることができ、製品の品質を悪化させることがない。   In the substrate bonding apparatus, the area of the upper surface of the first substrate can be made smaller than the lower surface of the second substrate. Thus, after the first substrate and the second substrate are bonded together, the double-sided adhesive tape is cut off along the upper surface of the first substrate, so that only the bonding surface of the first substrate and the second substrate is double-sided. Adhesive tape can be interposed, and product quality is not deteriorated.

前記基板貼り合わせ装置において、前記第１の貼り合わせ用治具に代えて、基板を前記弾性シートから離間させて支持するとともに、該基板を前記弾性シートの所定の位置に位置決めしながら支持する貼付用治具を、前記第２の貼り合わせ用治具に代えて、両面粘着テープを前記基板と相対向する位置に該基板から離間させて支持する支持部材を装着可能であり、該貼付用治具及び支持部材を装着した状態で、前記気圧調整手段によって、前記第１の気密空間を大気圧とするとともに、前記第２の気密空間を真空圧とすることにより、前記弾性シートを上方に弾性変形させて前記基板に前記両面粘着テープを貼り付けることができる。これによって、この基板貼り合わせ装置１台で、従来のテープ貼付装置の機能も発揮することができ、別途テープ貼り合わせ装置を設ける必要がないため、設備コストの低減に繋がる。   In the substrate bonding apparatus, instead of the first bonding jig, the substrate is supported while being separated from the elastic sheet, and the substrate is supported while being positioned at a predetermined position of the elastic sheet. In place of the second bonding jig, a supporting member for supporting the double-sided pressure-sensitive adhesive tape at a position opposite to the substrate can be attached, and the jig for bonding can be attached. With the tool and the support member mounted, the elastic sheet is elastically moved upward by setting the first airtight space to atmospheric pressure and the second airtight space to vacuum pressure by the atmospheric pressure adjusting means. The double-sided pressure-sensitive adhesive tape can be attached to the substrate by being deformed. Thereby, the function of the conventional tape bonding apparatus can be exhibited with one substrate bonding apparatus, and it is not necessary to provide a separate tape bonding apparatus, leading to a reduction in equipment cost.

以上のように、本発明によれば、ウエハと基板等の貼り合わせ位置を一定に保つことができるとともに、基板を破損する虞がなく、作業効率のよい基板貼り合わせ装置を提供することができる。   As described above, according to the present invention, the bonding position of the wafer and the substrate can be kept constant, and there is no possibility of damaging the substrate, and a substrate bonding apparatus with high work efficiency can be provided. .

次に、本発明の実施の形態について、図面を参照しながら説明する。尚、本発明にかかる基板貼り合わせ装置は、テープ貼付装置の機能も発揮することができるものであり、以下、第１の実施の形態としてウエハに両面粘着テープ（以下、「テープ」という）を貼り付ける工程、第２の実施の形態としてウエハと基板とを貼り合わせる工程、及び第３の実施の形態として第２の実施の形態で基板が貼り合わせられたウエハに、さらに１枚の基板を貼り合わせて製品を製造する工程に使用される装置について、各々説明する。   Next, embodiments of the present invention will be described with reference to the drawings. The substrate laminating apparatus according to the present invention can also exhibit the function of a tape affixing apparatus. Hereinafter, as a first embodiment, a double-sided adhesive tape (hereinafter referred to as “tape”) is applied to a wafer. A step of bonding, a step of bonding the wafer and the substrate as the second embodiment, and a wafer bonded with the substrate according to the second embodiment as the third embodiment are combined with one more substrate. Each of the devices used in the process of manufacturing the product by bonding will be described.

図１は、本発明にかかる基板貼り合わせ装置の第１の実施の形態として、ウエハＷにテープＴを貼り付ける工程に用いる装置を示す。この基板貼り合わせ装置１は、大別して、基台２と、基台２との間に気密空間を形成する上蓋３と、この気密空間を基台２側の第１の気密空間９と、上蓋側の第２の気密空間１０とに仕切るゴムシート（弾性シート）５と、ゴムシート５を基台２の中央部に固定するプレート台６と、プレート台６によってゴムシート５の中央に位置決めされ、ウエハＷを載置するウエハ用治具７と、ウエハＷと相対向する位置に、ウエハＷから離間させてテープＴを支持するテープ支持部材８とで構成される。   FIG. 1 shows an apparatus used in a process of attaching a tape T to a wafer W as a first embodiment of a substrate bonding apparatus according to the present invention. The substrate bonding apparatus 1 is roughly divided into a base 2, an upper lid 3 that forms an airtight space between the base 2, a first airtight space 9 on the base 2 side, and an upper lid. A rubber sheet (elastic sheet) 5 that partitions the second airtight space 10 on the side, a plate base 6 that fixes the rubber sheet 5 to the center of the base 2, and the center of the rubber sheet 5 are positioned by the plate base 6. , A wafer jig 7 for placing the wafer W, and a tape support member 8 that supports the tape T at a position facing the wafer W and spaced from the wafer W.

基台２と上蓋３は、Ｏリング４を介して気密的に固定され、基台２には、図示しない真空ポンプ及び真空弁を介して、第１の気密空間９及び第２の気密空間１０を大気圧又は真空圧に切り替えるための配管開口２ａ、２ｂを備える。   The base 2 and the upper lid 3 are hermetically fixed via an O-ring 4. The base 2 is connected to a first airtight space 9 and a second airtight space 10 via a vacuum pump and a vacuum valve (not shown). Are provided with pipe openings 2a and 2b for switching the pressure to atmospheric pressure or vacuum pressure.

図１及び図２に示すように、ゴムシート５は、プレート台６の下面に固定され、プレート台６は、開口部６ａと、テープ支持部材８を支持するための複数の支持ピン６ｂと、テープ支持部材８を中央に位置決めするための位置決めブロック６ｃが設けられる、尚、図１には示さないが、ゴムシート５を挟持した状態で、基台２にプレート台６をねじ止めし、ゴムシート５及びプレート台６を基台２の中央部に固定する。   As shown in FIGS. 1 and 2, the rubber sheet 5 is fixed to the lower surface of the plate base 6, and the plate base 6 includes an opening 6 a and a plurality of support pins 6 b for supporting the tape support member 8. A positioning block 6c for positioning the tape support member 8 in the center is provided. Although not shown in FIG. 1, the plate base 6 is screwed to the base 2 with the rubber sheet 5 sandwiched between the rubber and the rubber. The sheet 5 and the plate base 6 are fixed to the central portion of the base 2.

図１及び図３に示すように、ウエハ用治具７は、プレート台６の開口部６ａと同形状に形成されるプレート７ａと、上面に非粘着処理であるトシカル処理が施され、ウエハＷをプレート７ａの中央部に位置決めする弾性体からなる位置決めピン７ｂとを備える。そして、図４に示すように、プレート台６によってプレート７ａがゴムシート５の中央部に位置決めされ、ウエハＷ、プレート７ａ及びゴムシート５の中心が一致するように位置決めされる。   As shown in FIGS. 1 and 3, the wafer jig 7 has a plate 7a formed in the same shape as the opening 6a of the plate base 6, and a topical process that is a non-adhesive process on the upper surface. And a positioning pin 7b made of an elastic body for positioning at the center of the plate 7a. Then, as shown in FIG. 4, the plate 7 a positions the plate 7 a at the center of the rubber sheet 5, and positions the wafer W, the plate 7 a and the rubber sheet 5 so that the centers coincide.

図１及び図５に示すように、テープ支持部材８は、ウエハＷの上面より大きい面を有する開口部８ａを備える。そして、このテープ支持部材８は、図１、図２及び図４に示すプレート台６の位置決めブロック６ｂに係合させられながら、支持ピン６ｃに載置される。   As shown in FIGS. 1 and 5, the tape support member 8 includes an opening 8 a having a surface larger than the upper surface of the wafer W. And this tape support member 8 is mounted in the support pin 6c, being engaged with the positioning block 6b of the plate stand 6 shown in FIG.1, FIG2 and FIG.4.

次に、上記構成を有する基板貼り合わせ装置１の動作について、図面を参照しながら説明する。   Next, operation | movement of the board | substrate bonding apparatus 1 which has the said structure is demonstrated, referring drawings.

図６に示すように、図示しない真空ポンプ及び真空弁を介して、配管開口２ａ、２ｂから大気を真空ポンプ側に吸引することにより、第１の気密空間９及び第２の気密空間１０を大気圧から真空圧へと各々切り替える。   As shown in FIG. 6, the first airtight space 9 and the second airtight space 10 are made large by sucking the air from the pipe openings 2 a and 2 b to the vacuum pump side via a vacuum pump and a vacuum valve (not shown). Switch from atmospheric pressure to vacuum pressure.

その後、図７に示すように、真空ポンプ等を介して、配管開口２ａから大気を供給して第１の気密空間９を真空圧から大気圧へと切り替えることにより、ゴムシート５を上方へ膨らませてウエハ用治具７を上方へ移動させ、位置決めピン７ｂをテープＴに当接させ、位置決めピン７ｂを弾性変形させることにより、ウエハＷにテープＴを均一に貼り付ける。ここで、第２の気密空間１０が真空圧であるため、ウエハＷとテープＴの間に空気を残留させることなく貼り付けることが可能である。   Thereafter, as shown in FIG. 7, the rubber sheet 5 is expanded upward by supplying the atmosphere from the pipe opening 2a via a vacuum pump or the like and switching the first hermetic space 9 from the vacuum pressure to the atmospheric pressure. Then, the wafer jig 7 is moved upward, the positioning pins 7b are brought into contact with the tape T, and the positioning pins 7b are elastically deformed, so that the tape T is uniformly attached to the wafer W. Here, since the second hermetic space 10 is at a vacuum pressure, the air can be stuck between the wafer W and the tape T without leaving any air.

テープＴの貼付が完了すると、図８に示すように、真空ポンプ等を介して、配管開口２ａから大気を吸引して第１の気密空間９を大気圧から真空圧へと切り替えるとともに、配管開口２ｂから大気を供給して第２の気密空間１０を真空圧から大気圧へと切り替えることにより、ゴムシート５の膨張を抑制してテープ支持部材８及びウエハ用治具７を元の位置に戻す。そして、上蓋３を取り外してテープＴに貼り付いたウエハＷをテープ支持部材８とともに装置１外へ取り出し、ウエハＷの上面以外に貼り付いている余分なテープＴを切り取り、テープＴの貼付工程が完了する。   When the application of the tape T is completed, the first airtight space 9 is switched from the atmospheric pressure to the vacuum pressure by sucking the air from the pipe opening 2a via a vacuum pump or the like as shown in FIG. By supplying air from 2b and switching the second hermetic space 10 from vacuum pressure to atmospheric pressure, the expansion of the rubber sheet 5 is suppressed and the tape support member 8 and the wafer jig 7 are returned to their original positions. . Then, the wafer W attached to the tape T with the upper lid 3 removed is taken out of the apparatus 1 together with the tape support member 8, and the excess tape T attached to the surface other than the upper surface of the wafer W is cut off. Complete.

図９は、本発明にかかる基板貼り合わせ装置の第２の実施の形態として、上面にテープＴが貼着されたウエハＷと、基板Ｓとを貼り合わせる工程に用いる装置を示す。この基板貼り合わせ装置１１は、上記第１の実施の形態における基板貼り合わせ装置１のウエハ用治具７に代えて、ウエハ用治具１２を有するとともに、テープ支持部材８に代えて、基板用治具１３を有する。尚、基板貼り合わせ装置１と同一の構成要素については、同一の符号を付し、詳細な説明を省略する。   FIG. 9 shows an apparatus used in the step of bonding the wafer W and the substrate S having the tape T bonded to the upper surface, as a second embodiment of the substrate bonding apparatus according to the present invention. The substrate bonding apparatus 11 includes a wafer jig 12 instead of the wafer jig 7 of the substrate bonding apparatus 1 in the first embodiment, and replaces the tape support member 8 with a substrate bonding board. A jig 13 is provided. In addition, about the component same as the board | substrate bonding apparatus 1, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

ウエハ用治具１２は、図１０に示すように、図２に示したプレート台６の開口部６ａと同形状に形成されるプレート１２ａと、このプレート１２ａの上面にテープＴが貼着されたウエハＷをプレート１２ａの中央部に位置決めするための位置決めピン１２ｂと、後述の基板用治具１３の支持部材１３ｃ（図１２参照）と同形状に形成された凹部１２ｃとを有する。そして、図１１に示すように、プレート台６によってプレート１２ａがゴムシート５（図９参照）の中央部に位置決めされ、テープＴが貼着されたウエハＷ、プレート１２ａ及びゴムシート５の中心が一致するように位置決めされる。   As shown in FIG. 10, the wafer jig 12 has a plate 12a formed in the same shape as the opening 6a of the plate base 6 shown in FIG. 2, and a tape T attached to the upper surface of the plate 12a. It has positioning pins 12b for positioning the wafer W at the center of the plate 12a, and a recess 12c formed in the same shape as a support member 13c (see FIG. 12) of a substrate jig 13 described later. Then, as shown in FIG. 11, the plate 12 is positioned at the center of the rubber sheet 5 (see FIG. 9) by the plate base 6, and the centers of the wafer W, the plate 12 a and the rubber sheet 5 to which the tape T is adhered Positioned to match.

基板用治具１３は、図１２に示すように、基板Ｓ（図９参照）と略々同形状に形成される開口部１３ａと、基板Ｓを開口部１３ａに挿入し易くするための取付用凹部１３ｂと、下面に固定され開口部１３ａに挿入した基板Ｓを支持する支持部材１３ｃとを有する。そして、この基板用治具１３を、図１３に示すように、図１１に示すウエハ用治具１２が載置されたプレート台６の支持ピン６ｂに、位置決めブロック６ｃによって位置決めしながら載置することにより、図９に示すウエハＷの中心と基板Ｓの中心とを一致させることができるように構成される。   As shown in FIG. 12, the substrate jig 13 is provided with an opening 13a formed in substantially the same shape as the substrate S (see FIG. 9) and an attachment for facilitating insertion of the substrate S into the opening 13a. It has a recess 13b and a support member 13c that supports the substrate S that is fixed to the lower surface and inserted into the opening 13a. Then, as shown in FIG. 13, the substrate jig 13 is placed on the support pins 6b of the plate base 6 on which the wafer jig 12 shown in FIG. 11 is placed while being positioned by the positioning block 6c. As a result, the center of the wafer W and the center of the substrate S shown in FIG.

次に、上記構成を有する基板貼り合わせ装置１１の動作について、図面を参照しながら説明する。   Next, operation | movement of the board | substrate bonding apparatus 11 which has the said structure is demonstrated, referring drawings.

図９に示すように、各部材を位置決めした状態で、上記第１の実施の形態のように、図示しない真空ポンプ及び真空弁を介して第１の気密空間９及び第２の気密空間１０の内気圧を変化させることにより、ゴムシート５を上方に膨らませてウエハ用治具１２を上方へ移動させ、ウエハ用治具１２に載置されるウエハＷと基板用治具１３に支持される基板Ｓとを貼り合わせる。これにより、上述のように位置決めされたウエハＷと基板Ｓの貼り合わせ位置が変化することなく両部材を貼り合わせることができる。また、従来のようなローラによって押圧することなく、ウエハＷと基板Ｓを貼り合わせることができるため、応力による基板Ｓの破損を考慮する必要がない。   As shown in FIG. 9, with each member positioned, the first hermetic space 9 and the second hermetic space 10 are connected via a vacuum pump and a vacuum valve (not shown) as in the first embodiment. By changing the internal pressure, the rubber sheet 5 is expanded upward and the wafer jig 12 is moved upward, and the wafer W placed on the wafer jig 12 and the substrate supported by the substrate jig 13 are supported. Paste S. Thereby, both members can be bonded together without changing the bonding position of the wafer W and the substrate S positioned as described above. Further, since the wafer W and the substrate S can be bonded together without being pressed by a conventional roller, it is not necessary to consider the damage to the substrate S due to stress.

ここで、基板用治具１３の支持部材１３ｃ（図１２参照）とウエハ用治具１２とが互いに係合可能に形成されているため、ウエハＷと基板Ｓとの貼り合わせを阻害することがなく、ウエハＷと基板Ｓの貼り合わせ位置が変化する虞もない。また、ウエハＷの上面は、基板Ｓの下面より面積が小さいため、基板Ｓの下面に余分なテープが貼り付くことがなく、製品の品質を悪化させることがない。   Here, since the support member 13c (see FIG. 12) of the substrate jig 13 and the wafer jig 12 are formed to be able to engage with each other, the bonding between the wafer W and the substrate S may be hindered. In addition, there is no possibility that the bonding position of the wafer W and the substrate S changes. Further, since the upper surface of the wafer W is smaller in area than the lower surface of the substrate S, no extra tape is attached to the lower surface of the substrate S, and the quality of the product is not deteriorated.

図１４は、本発明にかかる基板貼り合わせ装置の第３の実施の形態として、第２の実施の形態で基板Ｓが貼り合わせられたウエハＷに、さらに１枚の基板Ｓを貼り合わせて製品を製造する工程に用いる装置を示す。この基板貼り合わせ装置２１は、上記第１の実施の形態における基板貼り合わせ装置１のウエハ用治具７（図１、図３参照）に代えて基板用治具２２を有する。その他の上記基板貼り合わせ装置１と同一の構成要素については、同一の符号を付し、詳細な説明を省略する。   FIG. 14 shows, as a third embodiment of the substrate bonding apparatus according to the present invention, a product obtained by further bonding one substrate S to the wafer W on which the substrate S is bonded in the second embodiment. The apparatus used for the process of manufacturing is shown. The substrate bonding apparatus 21 includes a substrate jig 22 in place of the wafer jig 7 (see FIGS. 1 and 3) of the substrate bonding apparatus 1 in the first embodiment. The same components as those of the above-described substrate bonding apparatus 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

図１５に示すように、基板用治具２２は、上記ウエハ用治具７と同一の機能を有し、図２に示したプレート台６の開口部６ａと同形状に形成されるプレート２２ａと、上面側にテープＴを介してウエハＷが貼着された基板Ｓを位置決めするための位置決めピン２２ｂを備える。そして、上記図４及び図１１と同様に、プレート台６によってプレート２２ａがゴムシート５の中央部に位置決めされ、基板Ｓ、プレート２２ａ及びゴムシート５の中心が一致するように位置決めされる。   As shown in FIG. 15, the substrate jig 22 has the same function as that of the wafer jig 7, and a plate 22a formed in the same shape as the opening 6a of the plate base 6 shown in FIG. , Positioning pins 22b for positioning the substrate S on which the wafer W is attached via the tape T are provided on the upper surface side. 4 and 11, the plate base 6 positions the plate 22a at the center of the rubber sheet 5, and positions the substrate S, the plate 22a, and the rubber sheet 5 so that the centers thereof coincide with each other.

次に、上記構成を有する基板貼り合わせ装置２１の動作について、図面を参照しながら説明する。   Next, operation | movement of the board | substrate bonding apparatus 21 which has the said structure is demonstrated, referring drawings.

図１４に示すように、各部材を位置決めした状態で、上記第１及び第２の実施の形態のように、図示しない真空ポンプ及び真空弁を介して第１の気密空間９及び第２の気密空間１０の内気圧を調整することにより、ゴムシート５を上方に膨らませて基板用治具２２を上方へ移動させ、基板Ｓに貼り合わせられたウエハＷの上面にテープＴを貼り付ける。   As shown in FIG. 14, with each member positioned, the first hermetic space 9 and the second hermetic seal are provided via a vacuum pump and a vacuum valve (not shown) as in the first and second embodiments. By adjusting the internal pressure of the space 10, the rubber sheet 5 is expanded upward, the substrate jig 22 is moved upward, and the tape T is attached to the upper surface of the wafer W bonded to the substrate S.

テープＴの貼付が完了すると、上蓋３を開放してテープＴ、テープ支持部材８並びにテープＴに貼着されたウエハＷ及び基板Ｓを取り出し、図１６に示すように上下反転させて再度プレート台６の支持ピン６ｂ上に載置する。また、基板用治具２２には新たな基板Ｓを載置する。そして、上述のように、ゴムシート５を上方に膨らませて基板用治具２２を上方へ移動させ、基板ＳをテープＴに貼り付けた後、基板ＳとウエハＷの貼り合わせ面以外の余分なテープＴを除去して図１７に示す製品３０を製造する。   When the application of the tape T is completed, the upper lid 3 is opened, and the tape T, the tape support member 8, and the wafer W and the substrate S attached to the tape T are taken out. 6 on the support pins 6b. Further, a new substrate S is placed on the substrate jig 22. Then, as described above, the rubber sheet 5 is inflated upward, the substrate jig 22 is moved upward, the substrate S is attached to the tape T, and then an extra portion other than the bonding surface of the substrate S and the wafer W is added. The tape T is removed to produce the product 30 shown in FIG.

尚、本実施の形態においては、上面視円形のウエハＷ及び基板Ｓの貼り合わせについて説明したが、本発明は、これに限定されることなく、図１８に示すように、上記ウエハ用治具７（図１、図３参照）等に代えて、上面視面取り正方形に形成し、上面視面取り正方形型に形成され、上面にテープＴが貼着されたウエハＷを中央に位置決めするための位置決めピン４１ａを有するウエハ用治具４１と、上記プレート台６（図１、図２参照）に代えて、このウエハ用治具４１と同形状に形成された開口部４２ａを有するプレート台４２を設け、さらに、上記基板用治具１３（図９、図１２参照）に代えて、このプレート４２の位置決めブロック４２ｃによって位置決めされながら支持ピン４２ｂによって支持されるとともに、中央に基板を位置決め可能な基板用治具（不図示）を設けることにより、上面視面取り正方形型のウエハＷ及び基板についても同様に貼り合わせることが可能である。   In the present embodiment, the bonding of the wafer W and the substrate S that are circular when viewed from above has been described. However, the present invention is not limited to this, and as shown in FIG. 7 (refer to FIG. 1 and FIG. 3), etc., positioning for positioning the wafer W, which is formed in a square shape with a chamfered top surface, formed into a square shape with a chamfered top surface, and having a tape T attached to the top surface in the center. Instead of the wafer jig 41 having the pins 41a and the plate base 6 (see FIGS. 1 and 2), a plate base 42 having an opening 42a formed in the same shape as the wafer jig 41 is provided. Further, instead of the substrate jig 13 (see FIGS. 9 and 12), the substrate 42 is supported by the support pins 42b while being positioned by the positioning block 42c of the plate 42, and the substrate is positioned at the center. By providing fit possible substrate jig (not shown), it can be laminated to the same for the wafer W and the substrate viewed from the chamfered square end.

また、図１６に示す基板貼り合わせ装置２１において、基板用治具２２と位置決めブロック６ｃの頂部との間隔を大きくすることにより、ウエハＷに２枚目のテープＴを貼着した後、ウエハＷの外形に沿ってテープＴを切断し、その後、２枚目の基板Ｓを貼着することにより、図１７に示す製品３０を製造することもできる。   In addition, in the substrate bonding apparatus 21 shown in FIG. 16, after the second tape T is bonded to the wafer W by increasing the distance between the substrate jig 22 and the top of the positioning block 6c, the wafer W The product 30 shown in FIG. 17 can also be manufactured by cutting the tape T along the outer shape of FIG.

本発明にかかるテープ貼り合わせ装置の第１の実施形態を示す断面図である。It is sectional drawing which shows 1st Embodiment of the tape bonding apparatus concerning this invention. 図１に示すテープ貼り合わせ装置のプレート台を示す上面図である。It is a top view which shows the plate stand of the tape bonding apparatus shown in FIG. 図１に示すテープ貼り合わせ装置のウエハ用治具を示す図であって、（ａ）は上面図、（ｂ）は（ａ）のＡ−Ａ線断面図である。It is a figure which shows the jig | tool for wafers of the tape bonding apparatus shown in FIG. 1, Comprising: (a) is a top view, (b) is the sectional view on the AA line of (a). 図２及び図３に示すプレート台とウエハ用治具とを組み付けた状態を示す上面図である。It is a top view which shows the state which assembled | attached the plate stand shown in FIG.2 and FIG.3, and the jig | tool for wafers. 図１に示すテープ貼り合わせ装置のテープ及びテープ用治具を示す下面図である。It is a bottom view which shows the tape and tape jig | tool of the tape bonding apparatus shown in FIG. 図１に示すテープ貼り合わせ装置の動作を示す断面図である。It is sectional drawing which shows operation | movement of the tape bonding apparatus shown in FIG. 図１に示すテープ貼り合わせ装置の動作を示す断面図である。It is sectional drawing which shows operation | movement of the tape bonding apparatus shown in FIG. 図１に示すテープ貼り合わせ装置の動作を示す断面図である。It is sectional drawing which shows operation | movement of the tape bonding apparatus shown in FIG. 本発明にかかるテープ貼り合わせ装置の第２の実施形態を示す断面図である。It is sectional drawing which shows 2nd Embodiment of the tape bonding apparatus concerning this invention. 図９に示すテープ貼り合わせ装置のウエハ用治具を示す上面図である。It is a top view which shows the jig | tool for wafers of the tape bonding apparatus shown in FIG. 図２及び図１０に示すプレート台とウエハ用治具とを組み付けた状態を示す上面図である。It is a top view which shows the state which assembled | attached the plate stand shown in FIG.2 and FIG.10, and the jig | tool for wafers. 図９に示すテープ貼り合わせ装置の基板用治具を示す図であって、（ａ）は上面図、（ｂ）は（ａ）のＢ−Ｂ線断面図である。It is a figure which shows the jig | tool for board | substrates of the tape bonding apparatus shown in FIG. 9, Comprising: (a) is a top view, (b) is the BB sectional drawing of (a). 図２、図１０及び図１２に示すプレート台と、ウエハ用治具と、基板用治具とを組み付けた状態を示す上面図である。It is a top view which shows the state which assembled | attached the plate stand shown in FIG.2, FIG.10 and FIG.12, the jig | tool for wafers, and the jig | tool for board | substrates. 本発明にかかるテープ貼り合わせ装置の第３の実施形態を示す断面図である。It is sectional drawing which shows 3rd Embodiment of the tape bonding apparatus concerning this invention. 図１４に示すテープ貼り合わせ装置の基板用治具を示す上面図である。It is a top view which shows the jig | tool for a board | substrate of the tape bonding apparatus shown in FIG. 図１４に示すテープ貼り合わせ装置の動作を示す断面図である。It is sectional drawing which shows operation | movement of the tape bonding apparatus shown in FIG. 図１４に示すテープ貼り合わせ装置によって製造された製品を示す断面図である。It is sectional drawing which shows the product manufactured by the tape bonding apparatus shown in FIG. 他の形状のウエハを貼り合わせる場合に使用するウエハ用治具を示す上面図である。It is a top view which shows the jig | tool for wafers used when bonding the wafer of another shape.

符号の説明Explanation of symbols

１ 基板貼り合わせ装置
２ 基台
２ａ、２ｂ 配管開口
３ 上蓋
４ Ｏリング
５ ゴムシート
６ プレート台
６ａ 開口部
６ｂ 支持ピン
６ｃ 位置決めブロック
７ ウエハ用治具
７ａ プレート
７ｂ 位置決めピン
８ テープ支持部材
８ａ 開口部
９ 第１の気密空間
１０ 第２の気密空間
１１ 基板貼り合わせ装置
１２ ウエハ用治具
１２ａ プレート
１２ｂ 位置決めピン
１２ｃ 凹部
１３ 基板用治具
１３ａ 開口部
１３ｂ 取付用凹部
１３ｃ 支持部材
２１ 基板貼り合わせ装置
２２ 基板用治具
２２ａ プレート
２２ｂ 位置決めピン
３０ 製品
４１ ウエハ用治具
４１ａ 位置決めピン
４２ プレート台
４２ａ 開口部
４２ｂ 支持ピン
４２ｃ 位置決めブロック DESCRIPTION OF SYMBOLS 1 Board | substrate bonding apparatus 2 Base 2a, 2b Pipe opening 3 Upper cover 4 O-ring 5 Rubber sheet 6 Plate base 6a Opening part 6b Support pin 6c Positioning block 7 Wafer jig 7a Plate 7b Positioning pin 8 Tape support member 8a Opening part 9 First hermetic space 10 Second hermetic space 11 Substrate bonding apparatus 12 Wafer jig 12a Plate 12b Positioning pin 12c Recess 13 Substrate jig 13a Opening 13b Mounting recess 13c Support member 21 Substrate bonding apparatus 22 Substrate jig 22a Plate 22b Positioning pin 30 Product 41 Wafer jig 41a Positioning pin 42 Plate base 42a Opening 42b Support pin 42c Positioning block

Claims (5)

基台と、
該基台の上面側に設けられ、該基台との間に気密空間を形成する上蓋と、
該気密空間を前記基台側の第１の気密空間と、上蓋側の第２の気密空間とに仕切る弾性シートと、
該弾性シートに載置され、上面に両面粘着テープが貼り付けられた第１の基板を前記弾性シートから離間させるとともに、該第１の基板を前記弾性シートの所定の位置に位置決めしながら支持する第１の貼り合わせ用治具と、
前記第１の基板の上方に設けられ、第２の基板を前記第１の基板と相対向する位置に該第１の基板から離間させて支持するとともに、前記第２の基板を所定の位置に位置決めする第２の貼り合わせ用治具と、
前記第１及び第２の気密空間の各々の内気圧を調整する気圧調整手段とを備え、
該気圧調整手段によって、前記第１の気密空間を大気圧とするとともに、前記第２の気密空間を真空圧とすることにより、前記弾性シートを上方に弾性変形させ、前記第１の基板と前記第２の基板とを前記両面粘着テープを介して貼り合わせることを特徴とする基板貼り合わせ装置。 The base,
An upper lid which is provided on the upper surface side of the base and forms an airtight space with the base;
An elastic sheet that partitions the airtight space into a first airtight space on the base side and a second airtight space on the upper lid side;
A first substrate mounted on the elastic sheet and having a double-sided adhesive tape attached to the upper surface is separated from the elastic sheet, and the first substrate is supported while being positioned at a predetermined position of the elastic sheet. A first bonding jig;
Provided above the first substrate and supporting the second substrate at a position facing the first substrate, spaced apart from the first substrate, and placing the second substrate at a predetermined position A second bonding jig for positioning;
Pressure adjusting means for adjusting the internal pressure of each of the first and second airtight spaces,
By the atmospheric pressure adjusting means, the first airtight space is set to atmospheric pressure, and the second airtight space is set to a vacuum pressure, whereby the elastic sheet is elastically deformed upward, and the first substrate and the A substrate bonding apparatus, wherein a second substrate is bonded to the double-sided adhesive tape. 前記第１の貼り合わせ用治具は、前記弾性シートに載置されるプレートと、該プレート上に配置され、前記第１の基板を前記プレートの所定の位置に位置決めする位置決めピンとを有することを特徴とする請求項１に記載の基板貼り合わせ装置。   The first bonding jig includes a plate placed on the elastic sheet, and a positioning pin that is disposed on the plate and positions the first substrate at a predetermined position of the plate. The board | substrate bonding apparatus of Claim 1 characterized by the above-mentioned. 前記第２の貼り合わせ用治具は、前記第２の基板と同形状に穿設されて該第２の基板を所定の位置に位置決めする貫通孔と、該第２の貼り合わせ用治具の下面に固定され、前記貫通孔に挿入された第２の基板を支持するための支持部材とを有し、
前記第１の貼り合わせ用治具は、前記支持部材と同形状に穿設された孔を有し、
前記弾性シートに載置され、前記第１の貼り合わせ用治具と同形状に穿設されて該第１の貼り合わせ用治具を前記弾性シートの所定の位置に位置決めする貫通孔と、前記第２の基板を前記第１の基板に対して所定の位置関係となるように前記第２の貼り合わせ用治具を位置決めする位置決め手段とを有するプレート台を備えることを特徴とする請求項１又は２に記載の基板貼り合わせ装置。 The second bonding jig includes a through hole that is formed in the same shape as the second substrate to position the second substrate at a predetermined position, and the second bonding jig includes: A support member for supporting the second substrate fixed to the lower surface and inserted into the through-hole,
The first bonding jig has a hole drilled in the same shape as the support member,
A through-hole placed on the elastic sheet, formed in the same shape as the first bonding jig, and positioning the first bonding jig at a predetermined position of the elastic sheet; 2. A plate stand having positioning means for positioning the second bonding jig so that the second substrate is in a predetermined positional relationship with the first substrate. Or the board | substrate bonding apparatus of 2. 前記第１の基板の上面は、前記第２の基板の下面より面積が小さいことを特徴とする請求項１、２又は３に記載の基板貼り合わせ装置。   4. The substrate bonding apparatus according to claim 1, wherein the upper surface of the first substrate has a smaller area than the lower surface of the second substrate. 前記第１の貼り合わせ用治具に代えて、基板を前記弾性シートから離間させて支持するとともに、該基板を前記弾性シートの所定の位置に位置決めしながら支持する貼付用治具を、
前記第２の貼り合わせ用治具に代えて、両面粘着テープを前記基板と相対向する位置に該基板から離間させて支持する支持部材を装着可能であり、
該貼付用治具及び該支持部材を装着した状態で、前記気圧調整手段によって、前記第１の気密空間を大気圧とするとともに、前記第２の気密空間を真空圧とすることにより、前記弾性シートを上方に弾性変形させて前記基板に前記両面粘着テープを貼り付けることを特徴とする請求項１に記載の基板貼り合わせ装置。 Instead of the first bonding jig, a bonding jig for supporting the substrate while being spaced apart from the elastic sheet and supporting the substrate at a predetermined position of the elastic sheet,
Instead of the second bonding jig, it is possible to attach a support member that supports the double-sided pressure-sensitive adhesive tape spaced from the substrate at a position facing the substrate,
With the sticking jig and the support member attached, the elastic pressure is adjusted by setting the first airtight space to atmospheric pressure and the second airtight space to vacuum pressure. The substrate bonding apparatus according to claim 1, wherein the double-sided pressure-sensitive adhesive tape is attached to the substrate by elastically deforming the sheet upward.
JP2008108759A 2008-04-18 2008-04-18 Substrate bonding equipment Active JP4812131B2 (en)

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