JP2009252767A - Light-emitting device - Google Patents

Light-emitting device Download PDF

Info

Publication number
JP2009252767A
JP2009252767A JP2008094815A JP2008094815A JP2009252767A JP 2009252767 A JP2009252767 A JP 2009252767A JP 2008094815 A JP2008094815 A JP 2008094815A JP 2008094815 A JP2008094815 A JP 2008094815A JP 2009252767 A JP2009252767 A JP 2009252767A
Authority
JP
Japan
Prior art keywords
electrode
element mounting
mounting substrate
light emitting
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008094815A
Other languages
Japanese (ja)
Inventor
Hiroyuki Tajima
博幸 田嶌
Shota Shimonishi
正太 下西
Toshimasa Hayashi
稔真 林
Hideki Kokubu
英樹 國分
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2008094815A priority Critical patent/JP2009252767A/en
Publication of JP2009252767A publication Critical patent/JP2009252767A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device capable of unfailingly protecting an electrode pattern of a light-emitting package and reducing the load to be applied to the electrodes of a wiring board. <P>SOLUTION: The light-emitting device is provided with: a light-emitting package 10 in which a center side of a lower surface of an element mounting substrate 13 forms a heat-radiating region, at least one part of the outer edge side of the lower surface forms an electrode forming region formed to be lower than the heat radiating region and an electrode pattern is formed on the electrode forming region; a heat radiating member 30 abutting on the heat radiating region of the lower surface of the element mounting substrate 13; a holding member 20, abutting against the upper surface of the element mounting region 13; a wiring board 50 having a substrate body 51, sandwiched by the heat radiating member 30 and the holding member 20, and a protruding electrode 52, having a base end connected to the substrate body 51 and an distal end slidably contacting the electrode forming region of the element mounting substrate 13; and fixing portions 40 for fixing the heat radiating member 30 and the holding member 20 with the element mounting substrate 13 and the wiring board 50 sandwiched so that the distal end of the protruding electrode 52 can be forced toward the electrode pattern. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、半田を用いずに発光パッケージと配線基板とを電気的に接続した発光装置に関する。   The present invention relates to a light emitting device in which a light emitting package and a wiring board are electrically connected without using solder.

従来、ＬＥＤ（Light Emitting Diode）素子等の発光素子を有する発光パッケージと、この発光パッケージと電気的に接続される配線基板と、を備えた発光装置が知られている（例えば、特許文献１参照）。特許文献１に記載の発光装置では、発光パッケージの導線が、配線基板に半田付けによって取り付けられている。しかしながら、半田付けを利用して発光パッケージと配線基板とを電気的に接続すると、熱サイクルにより半田に膨張・収縮応力が加わり、装置に不具合が生じるおそれがある。   2. Description of the Related Art Conventionally, a light emitting device including a light emitting package having a light emitting element such as an LED (Light Emitting Diode) element and a wiring board electrically connected to the light emitting package is known (see, for example, Patent Document 1). ). In the light emitting device described in Patent Document 1, the lead wire of the light emitting package is attached to the wiring board by soldering. However, if the light emitting package and the wiring board are electrically connected by using soldering, the thermal cycle may apply expansion / contraction stress to the solder, which may cause a problem in the apparatus.

また、半田を用いない発光装置として、特許文献２に記載の発光装置が知られている。この発光装置の発光パッケージは、ＬＥＤ素子が実装された矩形状の基板と、この基板上でＬＥＤ素子を被覆する透光性部材とを備え、基板下面の両側縁には、下方に突出する一対の電極パターンが形成されている。この発光装置の配線基板には、配線基板の前面から背面に亘って切り欠いて形成された凹部と、その両側壁の上端に形成された突出部とが備えられ、発光パッケージの基板の端部が凹部の底面と突出部とで形成されたレール状の部位に係合するようになっている。また、凹部の底面において突出部と対向する部分には、発光パッケージの電極パターンと接続される電極が設けられている。この電極は、細板状に形成され、上方に湾曲された状態でその両端部が固定されている。これにより、電極は、板バネとして作用し、発光パッケージの基板両側部を上方へ押圧するようになっている。
特表２００７−５００４４８号公報 特開２００４−２６６１６８号公報 Moreover, the light-emitting device described in Patent Document 2 is known as a light-emitting device that does not use solder. The light emitting package of the light emitting device includes a rectangular substrate on which the LED elements are mounted and a translucent member that covers the LED elements on the substrate, and a pair protruding downward on both side edges of the lower surface of the substrate. The electrode pattern is formed. The wiring board of the light emitting device includes a recess formed by cutting out from the front surface to the back surface of the wiring board and protrusions formed at the upper ends of both side walls of the wiring board. Is engaged with a rail-shaped portion formed by the bottom surface of the recess and the protrusion. In addition, an electrode connected to the electrode pattern of the light emitting package is provided on a portion of the bottom surface of the recess facing the protruding portion. This electrode is formed in a thin plate shape, and both ends thereof are fixed while being curved upward. Thereby, the electrode acts as a leaf spring and presses both side portions of the substrate of the light emitting package upward.
Special Table 2007-500448 JP 2004-266168 A

しかしながら、特許文献２に記載の発光装置では、発光パッケージの電極パターンを平坦な基板下面に突出して形成しているため電極パターンを損壊しやすい。また、配線基板の電極が両端支持のため、発光パッケージを配線基板に組み付けたり、使用時に発光パッケージにて発熱した際に、電極が配線基板に拘束されて配線基板の電極及びその取り付け部に過大な負荷が加わり、配線基板の電極が外れるおそれがある。   However, in the light-emitting device described in Patent Document 2, the electrode pattern of the light-emitting package is formed so as to protrude on the flat bottom surface of the substrate, so that the electrode pattern is easily damaged. In addition, since the electrode of the wiring board is supported at both ends, when the light emitting package is assembled to the wiring board or when the light emitting package generates heat during use, the electrode is constrained by the wiring board and the electrode of the wiring board and its mounting portion are excessive. Load may be applied and the electrodes of the wiring board may come off.

本発明は、前記事情に鑑みてなされたものであり、その目的とするところは、発光パッケージの電極パターンを的確に保護することができ、配線基板の電極に加わる負荷を低減することのできる発光装置を提供することである。   The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a light emitting device that can accurately protect the electrode pattern of the light emitting package and can reduce the load applied to the electrodes of the wiring board. Is to provide a device.

前記目的を達成するため、本発明では、発光素子及び前記発光素子が上面に搭載される素子搭載基板を含み、前記素子搭載基板の下面の中央側が放熱領域をなし、該下面の外縁側の少なくとも一部が放熱領域よりも薄く段差を有するよう形成された電極形成領域をなし、前記電極形成領域に電極パターンが形成される発光パッケージと、前記素子搭載基板の前記下面の前記放熱領域と当接する放熱部材と、前記素子搭載基板の前記上面と当接する保持部材と、前記放熱部材と前記保持部材により挟まれる基板本体と、前記基板本体に基端が接続され先端が前記素子搭載基板の前記下面の前記電極形成領域と摺動可能に接触する突出電極と、を有する配線基板と、前記放熱部材と前記保持部材を、前記突出電極の前記先端が前記電極パターンへ付勢されるよう前記素子搭載基板及び前記配線基板を挟んで固定する固定部と、を備えた発光装置が提供される。   In order to achieve the above object, the present invention includes a light emitting element and an element mounting substrate on which the light emitting element is mounted on an upper surface, wherein the center side of the lower surface of the element mounting substrate forms a heat dissipation region, and at least the outer edge side of the lower surface. A part of the electrode forming region is formed so as to be thinner and stepped than the heat radiating region, and the light emitting package in which an electrode pattern is formed in the electrode forming region and the heat radiating region on the lower surface of the element mounting substrate A heat dissipating member, a holding member in contact with the upper surface of the element mounting substrate, a substrate main body sandwiched between the heat dissipating member and the holding member, a base end connected to the substrate main body, and a distal end of the lower surface of the element mounting substrate A wiring board having a projecting electrode that is slidably in contact with the electrode forming region, the heat dissipation member, and the holding member, and the tip of the projecting electrode to the electrode pattern A fixing portion that fixes across the element mounting substrate and the wiring board to be energized, a light-emitting device in which a is provided.

上記発光装置において、前記素子搭載基板は、平面視にて四角形状を呈し、前記電極形成領域が前記下面の四隅に形成され、４つの前記突出電極が互いに独立して前記電極形成領域と接触することが好ましい。   In the light emitting device, the element mounting substrate has a quadrangular shape in a plan view, the electrode forming regions are formed at the four corners of the lower surface, and the four protruding electrodes are in contact with the electrode forming region independently of each other. It is preferable.

上記発光装置において、前記各突出電極は、平面視にて直線状に形成され、前記放熱領域は、平面視にて、前記各突出電極の延長線によって囲まれた領域に当該延長線上を避けて形成されていることが好ましい。   In the light-emitting device, each protruding electrode is formed in a straight line when seen in a plan view, and the heat dissipation area is avoided in a region surrounded by the extension line of each protruding electrode when seen in a plan view. Preferably it is formed.

上記発光装置において、前記発光パッケージは、前記素子搭載基板上にて前記発光素子を封止するとともに前記素子搭載基板の前記上面を全面的に覆う封止樹脂を有し、前記保持部材は、前記封止樹脂を介して前記素子搭載基板の前記上面と当接することが好ましい。   In the light-emitting device, the light-emitting package includes a sealing resin that seals the light-emitting element on the element mounting substrate and covers the entire upper surface of the element mounting substrate. It is preferable to contact the upper surface of the element mounting substrate through a sealing resin.

上記発光装置において、前記固定部は、前記放熱部材と前記保持部材の少なくとも一方と螺合するねじを有することが好ましい。   In the above light emitting device, it is preferable that the fixing portion has a screw that is screwed into at least one of the heat radiating member and the holding member.

本発明によれば、発光パッケージの電極パターンを的確に保護することができ、配線基板の電極に加わる負荷を低減することができる。   ADVANTAGE OF THE INVENTION According to this invention, the electrode pattern of a light emitting package can be protected exactly, and the load added to the electrode of a wiring board can be reduced.

図１から図７は本発明の一実施形態を示すもので、図１は斜め上方から見た発光装置の外観斜視図である。
図１に示すように、この発光装置１は、発光素子としてのＬＥＤ素子１４（図１中不図示）を有する発光パッケージとしてのＬＥＤパッケージ１０と、ＬＥＤパッケージ１０の上側に配置されるカバー２０と、ＬＥＤパッケージ１０の下側に配置されるヒートシンク３０と、を備えている。保持部材としてのカバー２０は、アルミニウムからなり、円板状に形成にされＬＥＤパッケージ１０を上側から押圧する円板部２１を有し、円板部２１の中央にＬＥＤパッケージ１０の発光部分を露出させる露出孔２２が形成される。また、カバー２０は、外縁から下方へ延びるフランジ２３を有している。尚、カバー２０は、アルミニウム以外の金属により形成してもよいし、表面に白色レジストを有する高反射性の樹脂や、透明樹脂により形成してもよい。 1 to 7 show an embodiment of the present invention, and FIG. 1 is an external perspective view of a light-emitting device as viewed obliquely from above.
As shown in FIG. 1, the light emitting device 1 includes an LED package 10 as a light emitting package having an LED element 14 (not shown in FIG. 1) as a light emitting element, and a cover 20 disposed above the LED package 10. And a heat sink 30 disposed below the LED package 10. The cover 20 as a holding member is made of aluminum, has a disc portion 21 that is formed in a disc shape and presses the LED package 10 from above, and the light emitting portion of the LED package 10 is exposed at the center of the disc portion 21. An exposure hole 22 is formed. The cover 20 has a flange 23 that extends downward from the outer edge. The cover 20 may be formed of a metal other than aluminum, or may be formed of a highly reflective resin having a white resist on the surface or a transparent resin.

図２は斜め下方から見た発光装置の外観斜視図である。
図２に示すように、放熱部材としてのヒートシンク３０は、アルミニウム、銅等の金属からなり、カバー２０のフランジ２３の内側に配置される円板部３１と、円板部３１から下方へ延びる複数のフィン３２を有する。カバー２０とヒートシンク３０は、上下に延びるねじ４０に締結され、後述する配線基板５０を上下から挟んでいる。 FIG. 2 is an external perspective view of the light emitting device as viewed obliquely from below.
As shown in FIG. 2, the heat sink 30 serving as a heat radiating member is made of a metal such as aluminum or copper, and includes a disc portion 31 disposed inside the flange 23 of the cover 20 and a plurality extending downward from the disc portion 31. The fin 32 is provided. The cover 20 and the heat sink 30 are fastened to screws 40 extending vertically, and sandwich a wiring board 50 described later from above and below.

図３は斜め下方から見た発光装置の分解斜視図である。
図３に示すように、２つのねじ４０がカバー２０とヒートシンク３０の各円板部２１，３１の中心について対称に配置されている。各ねじ４０は、ヒートシンク３０の円板部３１に形成された孔３３を挿通し、カバー２０の下面に突出形成されたボス２４のねじ孔２５と螺合する。尚、ねじ４０は、カバー２０に加えてヒートシンク３０とも螺合してもよいし、ヒートシンク３０とのみ螺合してもよい。 FIG. 3 is an exploded perspective view of the light emitting device as viewed obliquely from below.
As shown in FIG. 3, the two screws 40 are arranged symmetrically with respect to the centers of the disc portions 21 and 31 of the cover 20 and the heat sink 30. Each screw 40 is inserted into a hole 33 formed in the disk portion 31 of the heat sink 30 and screwed into a screw hole 25 of the boss 24 formed to protrude from the lower surface of the cover 20. The screw 40 may be screwed with the heat sink 30 in addition to the cover 20 or may be screwed only with the heat sink 30.

配線基板５０は、円板状の基板本体５１と、基板本体５１の中央に形成され基板本体５１から突出する突出電極５２が配置される孔５３と、基板本体５１に形成されカバー２０のボス２４を受容する受容部５４と、基板本体５１の外縁に形成され基板本体５１から突出する外部接続端子５５が配置される切欠５６と、を有している。配線基板５０は、表層が例えばポリブチレンテレフタレート、ナイロン、ポリアミド等の樹脂からなり、一端が突出電極５２であり他端が外部接続端子５５となる導電体として例えば銅等の金属層５７が設けられている。   The wiring substrate 50 includes a disc-shaped substrate body 51, a hole 53 formed in the center of the substrate body 51 and provided with a protruding electrode 52 protruding from the substrate body 51, and a boss 24 of the cover 20 formed in the substrate body 51. And a notch 56 in which an external connection terminal 55 that is formed at the outer edge of the substrate body 51 and protrudes from the substrate body 51 is disposed. The wiring board 50 has a surface layer made of resin such as polybutylene terephthalate, nylon, polyamide, etc., and a metal layer 57 such as copper is provided as a conductor whose one end is a protruding electrode 52 and the other end is an external connection terminal 55. ing.

ＬＥＤ接続用の孔５３は、平面視にて四角形状に形成され、ＬＥＤパッケージ１０を受容する。突出電極５２は、基端から先端へ向かって上方に傾斜した板状に形成され、ＬＥＤパッケージ１０が孔５３に受容されると、後述するアノード電極パターン１１及びカソード電極パターン１２と接触しつつ弾性変形をする。   The LED connection hole 53 is formed in a square shape in plan view and receives the LED package 10. The protruding electrode 52 is formed in a plate shape inclined upward from the proximal end to the distal end. When the LED package 10 is received in the hole 53, the protruding electrode 52 is elastic while being in contact with an anode electrode pattern 11 and a cathode electrode pattern 12 described later. Deform.

受容部５４は、基板本体５０の外縁を切り欠いて形成される。尚、受容部５４の形状は任意であり、孔状に形成されたものであってもよい。
外部接続端子５５は、アノード用とカソード用とで一対設けられ、切欠５６によりカバー２０とヒートシンク３０との間に形成された空間に配置されている。この空間は、カバー２０のフランジ２３に形成された切欠２６により、装置外部と連通している。 The receiving portion 54 is formed by cutting out the outer edge of the substrate body 50. In addition, the shape of the receiving part 54 is arbitrary, and may be formed in a hole shape.
A pair of external connection terminals 55 are provided for the anode and the cathode, and are arranged in a space formed between the cover 20 and the heat sink 30 by the notch 56. This space communicates with the outside of the apparatus by a notch 26 formed in the flange 23 of the cover 20.

カバー２０の下面には、ＬＥＤパッケージ１０の素子搭載基板１３の上面と当接する所定深さの受容穴２７が形成される。受容穴２７は、平面視にて、四角形状を呈し、配線基板５０の孔５３と重なるよう形成される。受容穴２７の中央に前述の露出孔２２が形成されている。   A receiving hole 27 having a predetermined depth is formed on the lower surface of the cover 20 so as to contact the upper surface of the element mounting substrate 13 of the LED package 10. The receiving hole 27 has a quadrangular shape in plan view and is formed so as to overlap the hole 53 of the wiring board 50. The aforementioned exposure hole 22 is formed in the center of the receiving hole 27.

図４はヒートシンクを取り外した状態の発光装置の底面図である。
図４に示すように、カバー２０は、受容穴２７内に突出しＬＥＤパッケージ１０を左右方向へ位置決めする突出部２８を有する。本実施形態においては、ＬＥＤパッケージ１０の素子搭載基板１３は四角形状であり、左右方向へ延びる突出部２８の先端が素子搭載基板１３の左右の辺部と当接する。突出部２８の先端には上方へ向かって受容穴２７の内側へ傾斜する傾斜面２８ａが形成される。また、受容穴２７の前面及び後面は、上方へ向かって受容穴２７の内側へ傾斜する傾斜面２７ａをなしている。 FIG. 4 is a bottom view of the light emitting device with the heat sink removed.
As shown in FIG. 4, the cover 20 has a protrusion 28 that protrudes into the receiving hole 27 and positions the LED package 10 in the left-right direction. In the present embodiment, the element mounting substrate 13 of the LED package 10 has a quadrangular shape, and the tips of the protruding portions 28 extending in the left-right direction are in contact with the left and right sides of the element mounting substrate 13. An inclined surface 28 a is formed at the tip of the projecting portion 28 so as to incline upward into the receiving hole 27. Further, the front surface and the rear surface of the receiving hole 27 form an inclined surface 27 a that is inclined inwardly toward the inside of the receiving hole 27.

図５はＬＥＤパッケージの底面図である。
図５に示すように、素子搭載基板１３の下面の四隅は、電極形成領域１３ａをなしている。素子搭載基板１３は、アルミナ等のセラミックの多層体からなり、中央側には当該セラミックよりも熱伝導率の高い銅等の金属１３ｂが埋設されて放熱領域１３ｃをなしている。本実施形態においては、電極形成領域１３ａを除いて素子搭載基板１３の下面が平坦であり、下面の中央側に加えて四隅を除いた外縁側も放熱領域１３ｃとなっている。各電極形成領域１３ａは、放熱領域１３ｂよりも薄く形成され、下面の四隅にて平面視三角形状を呈している。本実施形態においては、電極形成領域１３ａのセラミック層の積層数を放熱領域１３ｃよりも少なくすることにより、電極形成領域１３ａが放熱領域１３ｃに対して段差を有するよう薄く形成されている。このＬＥＤパッケージ１０は、製造時にダイシングを使用して隣接するパッケージと分離されるため、各電極パターン１１，１２の短絡を防止すべく、各電極形成領域１３ａの各電極パターン１１，１２が素子搭載基板１３の外縁と所定の間隔をおいて形成されている。 FIG. 5 is a bottom view of the LED package.
As shown in FIG. 5, the four corners of the lower surface of the element mounting substrate 13 form electrode forming regions 13a. The element mounting substrate 13 is made of a multilayer body of ceramics such as alumina, and a metal 13b such as copper having a higher thermal conductivity than that of the ceramic is embedded in the center side to form a heat radiation region 13c. In the present embodiment, the lower surface of the element mounting substrate 13 is flat except for the electrode formation region 13a, and the outer edge side excluding the four corners is also a heat radiation region 13c in addition to the center side of the lower surface. Each electrode formation region 13a is formed thinner than the heat dissipation region 13b and has a triangular shape in plan view at the four corners of the lower surface. In the present embodiment, the number of ceramic layers stacked in the electrode formation region 13a is smaller than that of the heat dissipation region 13c, so that the electrode formation region 13a is formed to have a step with respect to the heat dissipation region 13c. Since this LED package 10 is separated from adjacent packages by using dicing at the time of manufacture, each electrode pattern 11, 12 in each electrode formation region 13 a is mounted on the element in order to prevent short-circuiting of each electrode pattern 11, 12. It is formed at a predetermined interval from the outer edge of the substrate 13.

本実施形態においては、突出電極５２は、アノード電極パターン１１用で互いに平行な平面視直線状の２つのアノード電極５２ａと、カソード電極パターン１２用で互いに平行な直線状の２つのカソード電極５２ｂとからなる。各アノード電極５２ａ及び各カソード電極５２ｂは、延在方向について先端を対向して配置されている。そして、４つの突出電極５２が互いに独立して電極形成領域１３ａと接触している。   In the present embodiment, the protruding electrode 52 includes two anode electrodes 52a that are linear in plan view parallel to each other for the anode electrode pattern 11, and two cathode electrodes 52b that are linear in parallel to each other for the cathode electrode pattern 12. Consists of. Each anode electrode 52a and each cathode electrode 52b are arranged with their tips opposed in the extending direction. The four protruding electrodes 52 are in contact with the electrode forming region 13a independently of each other.

図６は図４のＡ−Ａ断面図である。
図６に示すように、配線基板５０の基板本体５１は、カバー２０とヒートシンク３０とにより挟まれている。この状態で、突出電極５２は弾性変形しており、電極形成領域１３ａへ付勢されて各電極パターン１１，１２と接触している。突出電極５２は、配線基板５０から水平に突出する基端部５２ｃと、基端部５２ｃから斜め上方へ延びる傾斜部５２ｄと、傾斜部５２ｄから斜め下方へ延びる折り返し部５２ｅと、を有し、傾斜部５２ｄと折り返し部５２ｅの間で各電極パターン１１，１２と摺動可能に接触している。すなわち、突出電極５２は、基板本体５１に基端が接続され先端が電極形成領域１３ａと摺動可能に接触している。 6 is a cross-sectional view taken along line AA of FIG.
As shown in FIG. 6, the substrate body 51 of the wiring substrate 50 is sandwiched between the cover 20 and the heat sink 30. In this state, the protruding electrode 52 is elastically deformed and is urged toward the electrode forming region 13a to be in contact with the electrode patterns 11 and 12. The protruding electrode 52 includes a base end portion 52c that protrudes horizontally from the wiring substrate 50, an inclined portion 52d that extends obliquely upward from the base end portion 52c, and a folded portion 52e that extends obliquely downward from the inclined portion 52d. The electrode patterns 11 and 12 are slidably contacted between the inclined portion 52d and the folded portion 52e. That is, the protruding electrode 52 has a proximal end connected to the substrate body 51 and a distal end that is slidably in contact with the electrode forming region 13a.

図７は図４のＢ−Ｂ断面図である。
図７に示すように、ＬＥＤパッケージ１０の素子搭載基板１３は、カバー２０とヒートシンク３０とにより挟まれている。具体的には、素子搭載基板１３は、カバー２０と上面外縁側で接触し、ヒートシンク３０と下面中央側で接触している。ＬＥＤパッケージ１０は、素子搭載基板１３の上面に搭載されたＬＥＤ素子１４と、素子搭載基板１３上にてＬＥＤ素子１４を封止する封止樹脂１５と、を有している。本実施形態においては、ＬＥＤ素子１４はＧａＮ系の材料からなる発光層を有し、封止樹脂１５はＬＥＤ素子１４の光により励起される蛍光体を含有するシリコーンからなる。封止樹脂１５は、ＬＥＤ素子１４を中心とした半球状の封止部１５ａと、この封止部１５ａと連続的に形成され素子搭載基板１３の上面を全面的に被覆する被覆部１５ｂと、を有している。封止樹脂１５は、ダイシングにより複数のＬＥＤパッケージ１０を分離する前に、金型を用いて各ＬＥＤパッケージ１０の素子搭載基板１３上に一括して形成される。 7 is a cross-sectional view taken along the line BB in FIG.
As shown in FIG. 7, the element mounting substrate 13 of the LED package 10 is sandwiched between the cover 20 and the heat sink 30. Specifically, the element mounting substrate 13 is in contact with the cover 20 on the outer edge side of the upper surface, and is in contact with the heat sink 30 on the lower surface center side. The LED package 10 includes an LED element 14 mounted on the upper surface of the element mounting substrate 13 and a sealing resin 15 that seals the LED element 14 on the element mounting substrate 13. In the present embodiment, the LED element 14 has a light emitting layer made of a GaN-based material, and the sealing resin 15 is made of silicone containing a phosphor excited by the light of the LED element 14. The sealing resin 15 includes a hemispherical sealing portion 15a centering on the LED element 14, and a covering portion 15b formed continuously with the sealing portion 15a and covering the entire top surface of the element mounting substrate 13, have. The sealing resin 15 is collectively formed on the element mounting substrate 13 of each LED package 10 using a mold before separating the plurality of LED packages 10 by dicing.

以上のように構成された発光装置１は、ＬＥＤパッケージ１０をカバー２０の受容穴２７に載置し、カバー２０に配線基板５０及びヒートシンク３０を重ね合わせて、ねじ４０をカバー２０と螺合させることにより組み立てられる。このとき、ＬＥＤパッケージ１０は、受容穴２７の傾斜面２７ａ及び突出部２８の傾斜面２８ａにより、カバー２０に対して前後方向及び左右方向について自動的に位置決めされる。また、配線基板５０は、カバー２０に対してボス２４とフランジ２３により前後方向及び左右方向について自動的に位置決めされ、ヒートシンク３０とともに上方へ移動させられる。   In the light emitting device 1 configured as described above, the LED package 10 is placed in the receiving hole 27 of the cover 20, the wiring substrate 50 and the heat sink 30 are overlapped on the cover 20, and the screw 40 is screwed to the cover 20. Can be assembled. At this time, the LED package 10 is automatically positioned in the front-rear direction and the left-right direction with respect to the cover 20 by the inclined surface 27 a of the receiving hole 27 and the inclined surface 28 a of the protruding portion 28. The wiring board 50 is automatically positioned with respect to the cover 20 in the front-rear direction and the left-right direction by the boss 24 and the flange 23, and is moved upward together with the heat sink 30.

このように、ＬＥＤパッケージ１０をカバー２０に対して位置決めするとともに、配線基板５０を前後及び左右に位置決めして上方へ移動させることにより、組み付け時における突出電極５２と各電極パターン１１，１２の摺動を最小限とすることができる。従って、各電極パターン１１，１２の摺動による損耗を低減し、信頼性を向上させることができる。また、電極形成領域１３ａを放熱領域１３ｃよりも低く形成したので、各電極パターン１１，１２が素子搭載基板１０の下面から突出することはなく、各電極パターン１１，１２を的確に保護することができる。   In this way, the LED package 10 is positioned with respect to the cover 20, and the wiring board 50 is positioned front and rear and left and right and moved upward, thereby sliding the protruding electrode 52 and the electrode patterns 11 and 12 during assembly. Movement can be minimized. Therefore, wear due to sliding of the electrode patterns 11 and 12 can be reduced, and reliability can be improved. In addition, since the electrode formation region 13a is formed lower than the heat dissipation region 13c, the electrode patterns 11 and 12 do not protrude from the lower surface of the element mounting substrate 10, and the electrode patterns 11 and 12 can be accurately protected. it can.

この発光装置１は、外部接続端子５５を通じてＬＥＤパッケージ１０へ通電すると、ＬＥＤ素子１４から青色光が発せられ、青色光の一部が蛍光体により波長変換されて黄色光となる。そして、青色光と黄色光との混色により白色光がＬＥＤパッケージ１０から発せられる。ＬＥＤパッケージ１０から発せられた光のうち、カバー２０へ入射するものについては、カバー２０の表面にて反射する。本実施形態においては、カバー２０として反射率が比較的高いアルミニウムを用いているので、光取り出し効率が良好である。   In the light emitting device 1, when the LED package 10 is energized through the external connection terminal 55, blue light is emitted from the LED element 14, and part of the blue light is wavelength-converted by the phosphor to become yellow light. Then, white light is emitted from the LED package 10 by the mixed color of blue light and yellow light. Of the light emitted from the LED package 10, the light incident on the cover 20 is reflected on the surface of the cover 20. In the present embodiment, since aluminum having a relatively high reflectance is used as the cover 20, the light extraction efficiency is good.

ＬＥＤ素子１４にて生じた熱は、素子搭載基板１３の放熱領域を介して、ヒートシンク３０の円板部３１へ伝達される。ここで、素子搭載基板１３とヒートシンク３０とは直接接触していることから、ヒートシンク３０側へスムースに熱を伝達することができる。本実施形態においては、素子搭載基板１３の下面を四隅の電極形成領域１３ａを除いて平坦な放熱領域１３ｃとしたので、下面に電極パターン１１１２が形成されているにも関わらず、ヒートシンク１３との接触面積を大きくすることができ、高い放熱性能を得ることができる。   The heat generated in the LED element 14 is transmitted to the disk portion 31 of the heat sink 30 through the heat dissipation area of the element mounting substrate 13. Here, since the element mounting board 13 and the heat sink 30 are in direct contact with each other, heat can be smoothly transferred to the heat sink 30 side. In the present embodiment, since the lower surface of the element mounting substrate 13 is a flat heat dissipation region 13c except for the electrode forming regions 13a at the four corners, the electrode mounting substrate 13 is connected to the heat sink 13 even though the electrode pattern 1112 is formed on the lower surface. The contact area can be increased and high heat dissipation performance can be obtained.

また、ＬＥＤ素子１４にて生じた熱により、発光装置１を構成する各部品が膨張する。ここで、突出電極５２が電極形成領域１３ａへ付勢されていることから、熱膨張率の差により各部品の相対位置が変化したとしても、突出電極５２は電極形成領域１３ａから離隔することなく電極形成領域１３ａ上を摺動する。これにより、発熱時における電気的接続を的確に確保することができる。   In addition, each component constituting the light emitting device 1 expands due to heat generated in the LED element 14. Here, since the protruding electrode 52 is urged toward the electrode forming region 13a, the protruding electrode 52 is not separated from the electrode forming region 13a even if the relative position of each component changes due to the difference in coefficient of thermal expansion. It slides on the electrode forming region 13a. Thereby, the electrical connection at the time of heat_generation | fever can be ensured correctly.

また、突出電極５２を配線基板５０に一端で支持されるようにしたので、ＬＥＤパッケージ１０を配線基板５０に組み付けたり、ＬＥＤパッケージ１０にて発熱した際に、両端支持されたもののように突出電極５２が配線基板５０に拘束されて、配線基板５０の突出電極５２及びその取り付け部に過大な負荷が加わることはない。従って、突出電極５２が配線基板５０から外れるおそれはない。   Further, since the protruding electrode 52 is supported by the wiring substrate 50 at one end, when the LED package 10 is assembled to the wiring substrate 50 or when the LED package 10 generates heat, the protruding electrode is supported as if it was supported at both ends. 52 is constrained by the wiring board 50, and an excessive load is not applied to the protruding electrode 52 of the wiring board 50 and its mounting portion. Therefore, there is no possibility that the protruding electrode 52 is detached from the wiring board 50.

また、突出電極５２を平面視直線状に形成したので、突出電極５２に外力、熱等により変形が生じたとしても、突出電極５２は平面視一方向に変形して直線上を伸縮するので素子搭載基板１３から外れ難い。仮に、突出電極５２を平面視曲線状やクランク状に形成すると、平面視他方向に変形して撓むので素子搭載基板１３から外れ易くなる。   In addition, since the protruding electrode 52 is formed in a linear shape in plan view, even if the protruding electrode 52 is deformed by an external force, heat, or the like, the protruding electrode 52 is deformed in one direction in plan view and expands and contracts on the straight line. Hard to come off the mounting substrate 13. If the protruding electrode 52 is formed in a curved shape or a crank shape in plan view, the protruding electrode 52 is deformed and bent in the other direction in plan view, so that it can be easily detached from the element mounting substrate 13.

また、素子搭載基板１３の四隅を４つの突出基板５２により付勢するようにしたので、突出基板５２から素子搭載基板１３へ加わる付勢力を前後及び左右について均等とすることができる。従って、素子搭載基板１３が付勢力によって所期の姿勢から傾倒することはない。   In addition, since the four corners of the element mounting substrate 13 are urged by the four protruding substrates 52, the urging force applied from the protruding substrate 52 to the element mounting substrate 13 can be made uniform in the front and rear and left and right directions. Therefore, the element mounting substrate 13 is not tilted from the intended posture by the biasing force.

また、素子搭載基板１３の上面を封止樹脂１５により全面的に覆うようにし、カバー２０が被覆部１５ｂを介して素子搭載基板１３と当接するようにしたので、ＬＥＤパッケージ１０側にてカバー２０を弾性的に受け止めることができる。従って、突出電極５２と封止樹脂１５に内部応力を分散させることができ、突出電極５２への応力集中を回避することができる。本実施形態においては、封止樹脂１５として比較的弾性係数の大きいシリコーンを用いているので、比較的弾性係数の小さいエポキシ樹脂を用いた場合よりも、応力集中の回避が効果的である。また、被覆部１５ｂが素子搭載基板１３とカバー２０の間のシールとして機能し、内部への塵埃の侵入を阻止するとともに、内部の気密性を向上させてＬＥＤパッケージ１０の劣化を抑制することができる。   In addition, since the upper surface of the element mounting substrate 13 is entirely covered with the sealing resin 15 and the cover 20 is in contact with the element mounting substrate 13 through the covering portion 15b, the cover 20 is provided on the LED package 10 side. Can be received elastically. Therefore, internal stress can be dispersed in the protruding electrode 52 and the sealing resin 15, and stress concentration on the protruding electrode 52 can be avoided. In the present embodiment, since silicone having a relatively large elastic coefficient is used as the sealing resin 15, avoiding stress concentration is more effective than using an epoxy resin having a relatively small elastic coefficient. In addition, the covering portion 15b functions as a seal between the element mounting substrate 13 and the cover 20, and prevents dust from entering the inside and improves airtightness inside to suppress deterioration of the LED package 10. it can.

また、アノード電極パターン１１とカソード電極パターン１２を２つずつ形成するとともに、アノード電極５２ａとカソード電極５２ｂを２つずつ形成し、２箇所で電気的に接続されるようにしたので、万が一、１箇所で接触不良や断線が生じたとしても、直ちにＬＥＤ素子１４が不灯となることはない。   In addition, two anode electrode patterns 11 and two cathode electrode patterns 12 are formed, and two anode electrodes 52a and two cathode electrodes 52b are formed so as to be electrically connected at two locations. Even if contact failure or disconnection occurs at a location, the LED element 14 is not immediately turned off.

尚、前記実施形態においては、４つの突出電極５２によりＬＥＤパッケージ１０が付勢されるものを示したが、突出電極をアノード側とカソード側で１つずつとしてもよい。この場合、素子搭載基板１３の四隅以外の領域に電極形成領域１３ａを形成してもよい。   In the above embodiment, the LED package 10 is urged by the four protruding electrodes 52. However, one protruding electrode may be provided for each of the anode side and the cathode side. In this case, the electrode formation region 13 a may be formed in a region other than the four corners of the element mounting substrate 13.

また、前記実施形態においては、突出電極の２つのアノード電極５２ａとカソード電極５２ｂが互いに平行なものを示したが、例えば図８に示すように２つのアノード電極１５２ａとカソード電極１５２ｂを先端へ向かって互いに離隔するよう形成してもよく、突出電極の形状、構成等は任意である。図８では、ＬＥＤパッケージ１１０の放熱領域１１３ｃは、平面視にて、アノード電極１５２ａとカソード電極１５２ｂの延長線によって囲まれた領域に当該延長線上を避けて形成されている。図８のＬＥＤパッケージ１１０は、素子搭載基板１３に設けられる放熱用の金属１１３ｂが放熱領域１１３ｃにて露出している。この発光装置では、アノード電極１５２ａ及びカソード電極１５２ｂが膨張したとしても、その先端が放熱領域１１３ｃへ進入することはなく、突出電極が金属１１３ｂと接触することによる短絡を防止することができる。   In the above-described embodiment, the two anode electrodes 52a and the cathode electrode 52b of the protruding electrode are shown as being parallel to each other. For example, as shown in FIG. 8, the two anode electrodes 152a and the cathode electrode 152b are directed toward the tip. The protruding electrodes may be formed with any shape and configuration. In FIG. 8, the heat dissipation region 113c of the LED package 110 is formed in a region surrounded by the extension lines of the anode electrode 152a and the cathode electrode 152b while avoiding the extension line in a plan view. In the LED package 110 of FIG. 8, a heat radiating metal 113b provided on the element mounting substrate 13 is exposed in the heat radiating region 113c. In this light emitting device, even if the anode electrode 152a and the cathode electrode 152b expand, the tips thereof do not enter the heat dissipation region 113c, and a short circuit due to the protruding electrode coming into contact with the metal 113b can be prevented.

また、前記実施形態においては、ねじ４０によりカバー２０とヒートシンク３０を固定するものを示したが、固定部の構成は放熱部材と保持部材を突出電極の先端が電極パターンへ付勢されるよう素子搭載基板及び配線基板を挟んで固定するものであれば任意である。例えば、固定部は、ねじ４０でなくリベットを有するものであってもよいし、カバー及びヒートシンクの一方に形成され他方に引っ掛かる爪を有するものであってもよいし、カバー及びヒートシンクに形成された凸部及び凹部を嵌合させて固定するものであってもよい。   In the above embodiment, the cover 20 and the heat sink 30 are fixed by the screw 40. However, the fixing portion is configured so that the heat radiating member and the holding member are biased toward the electrode pattern by the tip of the protruding electrode. Any device may be used as long as it is fixed with the mounting substrate and the wiring substrate interposed therebetween. For example, the fixing portion may have a rivet instead of the screw 40, or may have a claw formed on one of the cover and the heat sink and hooked on the other, or formed on the cover and the heat sink. The convex part and the concave part may be fitted and fixed.

また、保持部材と放熱部材の形状も任意であり、例えば図９に示すように、発光装置２０１のカバー２２０にＬＥＤパッケージ１０から発した光のリフレクタ２２９を設けてもよい。また、保持部材を透明樹脂とする場合は、光学レンズ形状とすることもできる。また、発光素子としてＬＥＤ素子でなく例えばＬＤ（Laser Diode）素子を用いてもよいし、発光素子の発光色も任意であり、その他、具体的な細部構造等についても適宜に変更可能であることは勿論である。   Further, the shape of the holding member and the heat radiating member is also arbitrary. For example, as shown in FIG. 9, a reflector 229 for light emitted from the LED package 10 may be provided on the cover 220 of the light emitting device 201. Further, when the holding member is made of a transparent resin, it can be formed in an optical lens shape. In addition, for example, an LD (Laser Diode) element may be used as the light emitting element, and the light emission color of the light emitting element is arbitrary, and other specific details such as a detailed structure can be appropriately changed. Of course.

図１は本発明の一実施形態を示す斜め上方から見た発光装置の外観斜視図である。FIG. 1 is an external perspective view of a light emitting device as viewed from obliquely above, showing an embodiment of the present invention. 図２は斜め下方から見た発光装置の外観斜視図である。FIG. 2 is an external perspective view of the light emitting device as viewed obliquely from below. 図３は斜め下方から見た発光装置の分解斜視図である。FIG. 3 is an exploded perspective view of the light emitting device as viewed from obliquely below. 図４はヒートシンクを取り外した状態の発光装置の底面図である。FIG. 4 is a bottom view of the light emitting device with the heat sink removed. 図５はＬＥＤパッケージの底面図である。FIG. 5 is a bottom view of the LED package. 図６は図４のＡ−Ａ断面図である。6 is a cross-sectional view taken along line AA of FIG. 図７は図４のＢ−Ｂ断面図である。7 is a cross-sectional view taken along the line BB in FIG. 図８は変形例を示すＬＥＤパッケージの底面図である。FIG. 8 is a bottom view of an LED package showing a modification. 図９は変形例を示す斜め上方から見た発光装置の外観斜視図である。FIG. 9 is an external perspective view of the light emitting device as seen from an obliquely upper side showing a modification.

符号の説明Explanation of symbols

１…発光装置、１０…ＬＥＤパッケージ、１１…アノード電極パターン、１２…カソード電極パターン、１３…素子搭載基板、１３ａ…電極形成領域、１３ｂ…金属、１３ｃ…放熱領域、１４…ＬＥＤ素子、１５…封止樹脂、１５ａ…封止部、１５ｂ…被覆部、２０…カバー、２１…円板部、２２…露出孔、２３…フランジ、２４…ボス、２５…ねじ孔、２６…切欠、２７…受容穴、２７ａ…傾斜面、２８…突出部、２８ａ…傾斜面、３０…ヒートシンク、３１…円板部、３２…フィン、３３…孔、４０…ねじ、５０…配線基板、５１…基板本体、５２…突出電極、５２ａ…アノード電極、５２ｂ…カソード電極、５２ｃ…基端部、５２ｄ…傾斜部、５２ｅ…折り返し部、５３…孔、５４…受容部、５５…外部接続端子、５６…切欠、５７…金属層、１１０…ＬＥＤパッケージ、１１３ｂ…金属、１１３ｃ…放熱領域、１５２ａ…アノード電極、１５２ｂ…カソード電極、２０１…発光装置、２２０…カバー、２２９…リフレクタ。   DESCRIPTION OF SYMBOLS 1 ... Light-emitting device, 10 ... LED package, 11 ... Anode electrode pattern, 12 ... Cathode electrode pattern, 13 ... Element mounting substrate, 13a ... Electrode formation area, 13b ... Metal, 13c ... Heat dissipation area, 14 ... LED element, 15 ... Sealing resin, 15a ... sealing part, 15b ... covering part, 20 ... cover, 21 ... disc part, 22 ... exposed hole, 23 ... flange, 24 ... boss, 25 ... screw hole, 26 ... notch, 27 ... accepting Hole, 27a ... inclined surface, 28 ... projecting portion, 28a ... inclined surface, 30 ... heat sink, 31 ... disk portion, 32 ... fin, 33 ... hole, 40 ... screw, 50 ... wiring board, 51 ... substrate body, 52 ... projecting electrode, 52a ... anode electrode, 52b ... cathode electrode, 52c ... base end part, 52d ... inclined part, 52e ... folded part, 53 ... hole, 54 ... receiving part, 55 ... external connection terminal, 56 ... notch, 57 ... Genus layer, 110 ... LED package, 113b ... metal, 113c ... radiating area, 152a ... anode electrode, 152 b ... cathode electrode, 201 ... light-emitting device, 220 ... cover, 229 ... reflector.

Claims (5)

発光素子及び前記発光素子が上面に搭載される素子搭載基板を含み、前記素子搭載基板の下面の中央側が放熱領域をなし、該下面の外縁側の少なくとも一部が放熱領域よりも薄く段差を有するよう形成された電極形成領域をなし、前記電極形成領域に電極パターンが形成される発光パッケージと、
前記素子搭載基板の前記下面の前記放熱領域と当接する放熱部材と、
前記素子搭載基板の前記上面と当接する保持部材と、
前記放熱部材と前記保持部材により挟まれる基板本体と、前記基板本体に基端が接続され先端が前記素子搭載基板の前記下面の前記電極形成領域と摺動可能に接触する突出電極と、を有する配線基板と、
前記放熱部材と前記保持部材を、前記突出電極の前記先端が前記電極パターンへ付勢されるよう前記素子搭載基板及び前記配線基板を挟んで固定する固定部と、を備えた発光装置。 A light emitting element and an element mounting substrate on which the light emitting element is mounted on the upper surface, the center side of the lower surface of the element mounting substrate forms a heat dissipation region, and at least a part of the outer edge side of the lower surface has a step that is thinner than the heat dissipation region A light emitting package having an electrode formation region formed in such a manner that an electrode pattern is formed in the electrode formation region;
A heat dissipating member in contact with the heat dissipating region of the lower surface of the element mounting substrate;
A holding member in contact with the upper surface of the element mounting substrate;
A substrate body sandwiched between the heat radiating member and the holding member; and a projecting electrode having a proximal end connected to the substrate body and a distal end slidably in contact with the electrode formation region on the lower surface of the element mounting substrate. A wiring board;
A light emitting device comprising: a fixing portion that fixes the heat radiating member and the holding member with the element mounting substrate and the wiring substrate interposed therebetween so that the tip of the protruding electrode is biased toward the electrode pattern. 前記素子搭載基板は、平面視にて四角形状を呈し、前記電極形成領域が前記下面の四隅に形成され、
４つの前記突出電極が互いに独立して前記電極形成領域と接触する請求項１に記載の発光装置。 The element mounting substrate has a quadrangular shape in plan view, and the electrode forming regions are formed at the four corners of the lower surface,
The light emitting device according to claim 1, wherein the four protruding electrodes are in contact with the electrode forming region independently of each other. 前記各突出電極は、平面視にて直線状に形成され、
前記放熱領域は、平面視にて、前記各突出電極の延長線によって囲まれた領域に当該延長線上を避けて形成されている請求項２に記載の発光装置。 Each of the protruding electrodes is formed linearly in a plan view,
The light-emitting device according to claim 2, wherein the heat dissipation area is formed in a region surrounded by the extension line of each protruding electrode so as to avoid the extension line in a plan view. 前記発光パッケージは、前記素子搭載基板上にて前記発光素子を封止するとともに前記素子搭載基板の前記上面を全面的に覆う封止樹脂を有し、
前記保持部材は、前記封止樹脂を介して前記素子搭載基板の前記上面と当接する請求項３に記載の発光装置。 The light emitting package has a sealing resin that seals the light emitting element on the element mounting substrate and covers the entire upper surface of the element mounting substrate.
The light-emitting device according to claim 3, wherein the holding member is in contact with the upper surface of the element mounting substrate through the sealing resin. 前記固定部は、前記放熱部材と前記保持部材の少なくとも一方と螺合するねじを有する請求項４に記載の発光装置。   The light emitting device according to claim 4, wherein the fixing portion includes a screw that is screwed into at least one of the heat dissipation member and the holding member.
JP2008094815A 2008-04-01 2008-04-01 Light-emitting device Pending JP2009252767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008094815A JP2009252767A (en) 2008-04-01 2008-04-01 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008094815A JP2009252767A (en) 2008-04-01 2008-04-01 Light-emitting device

Publications (1)

Publication Number Publication Date
JP2009252767A true JP2009252767A (en) 2009-10-29

Family

ID=41313239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008094815A Pending JP2009252767A (en) 2008-04-01 2008-04-01 Light-emitting device

Country Status (1)

Country Link
JP (1) JP2009252767A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103904448A (en) * 2012-12-26 2014-07-02 Smk株式会社 Flyconnector for LED module board
JP2014203729A (en) * 2013-04-08 2014-10-27 岩崎電気株式会社 Line light source device and irradiation apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103904448A (en) * 2012-12-26 2014-07-02 Smk株式会社 Flyconnector for LED module board
KR101567808B1 (en) * 2012-12-26 2015-11-11 에스에무케이 가부시키가이샤 Connector for led substrate module
JP2014203729A (en) * 2013-04-08 2014-10-27 岩崎電気株式会社 Line light source device and irradiation apparatus

Similar Documents

Publication Publication Date Title
JP4622985B2 (en) lighting equipment
TWI470845B (en) Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
JP4497186B2 (en) lighting equipment
JP2005183531A (en) Semiconductor light emitting device
US9076952B2 (en) Semiconductor light-emitting device
JP4674487B2 (en) Surface mount light emitting device
JP4863193B2 (en) Semiconductor light emitting device
WO2017209149A1 (en) Light-emitting device
JP2004207367A (en) Light emitting diode and light emitting diode arrangement plate
JP5352938B2 (en) Light emitting diode device
JP2003069083A (en) Light emitting device
JP4655735B2 (en) LED unit
JP2012048969A (en) Led illumination unit
JP5530321B2 (en) Lamp and lighting device
JP2009088373A (en) Led lamp module
JP2009252767A (en) Light-emitting device
JP7024410B2 (en) Semiconductor light emitting device
JP2009170642A (en) Electric device
JP6085459B2 (en) Lighting device
JP7021444B2 (en) Luminous module
KR102148846B1 (en) PRINTED CIRCUIT BOARD AND luminous device INCLUDING THE SAME
JP2013004824A (en) Led lighting device and method for manufacturing led lighting device
JP7089661B2 (en) Holder for light emitting device and light source device
JP2019087570A (en) Light-emitting device and led package
JP5809440B2 (en) LED module