JP2009200272A - プローブカード - Google Patents
プローブカード Download PDFInfo
- Publication number
- JP2009200272A JP2009200272A JP2008040806A JP2008040806A JP2009200272A JP 2009200272 A JP2009200272 A JP 2009200272A JP 2008040806 A JP2008040806 A JP 2008040806A JP 2008040806 A JP2008040806 A JP 2008040806A JP 2009200272 A JP2009200272 A JP 2009200272A
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- Prior art keywords
- probe
- heat
- probe card
- substrate
- reinforcing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000523 sample Substances 0.000 title claims abstract description 237
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 238000012546 transfer Methods 0.000 claims abstract description 42
- 238000009826 distribution Methods 0.000 claims abstract description 12
- 230000007423 decrease Effects 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 52
- 230000003014 reinforcing effect Effects 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 19
- 239000002470 thermal conductor Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920013716 polyethylene resin Polymers 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 2
- 238000012360 testing method Methods 0.000 abstract description 48
- 239000004065 semiconductor Substances 0.000 abstract description 31
- 238000007689 inspection Methods 0.000 abstract description 6
- 238000005728 strengthening Methods 0.000 abstract 4
- 229910052751 metal Inorganic materials 0.000 description 26
- 239000002184 metal Substances 0.000 description 26
- 230000002093 peripheral effect Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003320 cold-resistant material Substances 0.000 description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 2
- 239000003779 heat-resistant material Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
【解決手段】回路基板、上記回路基板の一方の面側に配置され、表面の所定位置に複数のプローブを保持するプローブ基板、上記回路基板の他方の側に配置された補強板、および上記プローブ基板と上記補強板との間に介在し、上記プローブ基板の熱を上記補強板に伝達することによって、上記プローブ基板の温度と上記補強板の温度とを平衡させる伝熱部材を備え、上記伝熱部材が単数又は複数の棒状良熱伝導体であって、上記プローブ基板の中央部分に設け、又は、その伝熱機能の分布を上記プローブ基板の中央部を中心として、中心から周辺に徐々に少なくなるように配置したことを特徴とする。
【選択図】図1
Description
3a:接続端子 3b:プローブ接続端子 4:回路基板
4a:テスタ接続端子 5:中継接続ピン 5a:接続端子
6:補強板 7:支持体 8:支持ボルト
10:熱伝導体 11,12:接合部 13:被覆層
20:半導体ウエハ 21:ウエハ載置台 22:プローバ
25:高温低温試験装置 30:テスタ
α:プローブ群の先端部ライン β:プローブ基板のたわみ
Claims (6)
- 回路基板、上記回路基板の一方の面側に配置され、表面の所定位置に複数のプローブを保持するプローブ基板、上記回路基板の他方の側に配置され、プローブカード全体の変形を抑制する補強板、および上記プローブ基板と上記補強板との間に介在し、上記プローブ基板の熱を上記補強板に伝達することによって、上記プローブ基板の温度と上記補強板の温度とを平衡させる伝熱部材を備えたことを特徴とするプローブカード。
- 上記伝熱部材が単数又は複数の棒状良熱伝導体であって、上記プローブ基板の中央部分に設けることを特徴とする請求項1記載のプローブカード。
- 上記伝熱部材が複数の棒状良熱伝導体であって、その伝熱機能の分布を上記プローブ基板の中央部を中心として、中心から周辺に徐々に少なくなるように配置したことを特徴とする請求項1記載のプローブカード。
- 上記良熱伝導体が、銀、銅、アルミニウムのいずれかの熱伝導率が高い金属材料、或いはそれらの複合材料からなることを特徴とする請求項2又は3に記載のプローブカード。
- 上記補強板の上表面を耐熱及び耐寒性のある熱伝導率の小さい材料又は熱放射率の小さい材料により被覆することを特徴とする請求項1から4のいずれかに記載のプローブカード。
- 上記耐熱及び耐寒性のある熱伝導率の小さい材料がエポキシ樹脂、シリコン樹脂、ポリエチレン樹脂のいずれかであることを特徴とする請求項5に記載のプローブカード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008040806A JP5021519B2 (ja) | 2008-02-22 | 2008-02-22 | プローブカード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008040806A JP5021519B2 (ja) | 2008-02-22 | 2008-02-22 | プローブカード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009200272A true JP2009200272A (ja) | 2009-09-03 |
JP5021519B2 JP5021519B2 (ja) | 2012-09-12 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008040806A Active JP5021519B2 (ja) | 2008-02-22 | 2008-02-22 | プローブカード |
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JP (1) | JP5021519B2 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101083026B1 (ko) | 2009-12-08 | 2011-11-16 | 주식회사 엔아이씨테크 | 인쇄회로기판 검사 장치 |
JP2012021826A (ja) * | 2010-07-13 | 2012-02-02 | Japan Electronic Materials Corp | 電気的接続装置及びその製造方法 |
JP2012145509A (ja) * | 2011-01-14 | 2012-08-02 | Japan Electronic Materials Corp | プローブカード |
JP2014020979A (ja) * | 2012-07-20 | 2014-02-03 | Mitsubishi Electric Corp | 接続構造、及び、半導体検査装置 |
JP2014149288A (ja) * | 2013-01-08 | 2014-08-21 | Honda Motor Co Ltd | 電流印加装置及び半導体素子の製造方法 |
CN104655885A (zh) * | 2013-11-15 | 2015-05-27 | 本田技研工业株式会社 | 电流施加装置以及半导体元件的制造方法 |
CN104777335A (zh) * | 2014-01-09 | 2015-07-15 | 本田技研工业株式会社 | 电流施加装置以及半导体元件的制造方法 |
JP2015132524A (ja) * | 2014-01-10 | 2015-07-23 | 富士通セミコンダクター株式会社 | 試験装置 |
KR20160031453A (ko) * | 2013-05-06 | 2016-03-22 | 폼팩터, 인크. | 전자 디바이스들을 테스트하기 위한 프로브 카드 조립체 |
CN111007373A (zh) * | 2018-10-05 | 2020-04-14 | 塞莱敦体系股份有限公司 | 高压探针卡*** |
WO2024132800A1 (en) * | 2022-12-21 | 2024-06-27 | Technoprobe S.P.A. | Probe card for a testing apparatus of electronic devices with improved thermal management |
WO2024132831A1 (en) * | 2022-12-21 | 2024-06-27 | Technoprobe S.P.A. | Probe card for a testing apparatus of electronic devices |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102393600B1 (ko) * | 2020-09-11 | 2022-05-03 | 스테코 주식회사 | 프로브 카드 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005069019A1 (ja) * | 2004-01-20 | 2005-07-28 | Tokyo Electron Limited | プローブカード |
WO2006113708A2 (en) * | 2005-04-19 | 2006-10-26 | Formfactor, Inc. | Apparatus and method for managing thermally induced motion of a probe card assembly |
JP2008134170A (ja) * | 2006-11-29 | 2008-06-12 | Micronics Japan Co Ltd | 電気的接続装置 |
-
2008
- 2008-02-22 JP JP2008040806A patent/JP5021519B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005069019A1 (ja) * | 2004-01-20 | 2005-07-28 | Tokyo Electron Limited | プローブカード |
WO2006113708A2 (en) * | 2005-04-19 | 2006-10-26 | Formfactor, Inc. | Apparatus and method for managing thermally induced motion of a probe card assembly |
JP2008134170A (ja) * | 2006-11-29 | 2008-06-12 | Micronics Japan Co Ltd | 電気的接続装置 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101083026B1 (ko) | 2009-12-08 | 2011-11-16 | 주식회사 엔아이씨테크 | 인쇄회로기판 검사 장치 |
JP2012021826A (ja) * | 2010-07-13 | 2012-02-02 | Japan Electronic Materials Corp | 電気的接続装置及びその製造方法 |
JP2012145509A (ja) * | 2011-01-14 | 2012-08-02 | Japan Electronic Materials Corp | プローブカード |
JP2014020979A (ja) * | 2012-07-20 | 2014-02-03 | Mitsubishi Electric Corp | 接続構造、及び、半導体検査装置 |
JP2014149288A (ja) * | 2013-01-08 | 2014-08-21 | Honda Motor Co Ltd | 電流印加装置及び半導体素子の製造方法 |
US9541577B2 (en) | 2013-01-08 | 2017-01-10 | Honda Motor Co., Ltd. | Current application device and manufacturing method of semiconductor element |
JP2016524137A (ja) * | 2013-05-06 | 2016-08-12 | フォームファクター, インコーポレイテッド | 電子デバイスを試験するためのプローブカードアセンブリ |
KR20160031453A (ko) * | 2013-05-06 | 2016-03-22 | 폼팩터, 인크. | 전자 디바이스들을 테스트하기 위한 프로브 카드 조립체 |
KR102213726B1 (ko) * | 2013-05-06 | 2021-02-08 | 폼팩터, 인크. | 전자 디바이스들을 테스트하기 위한 프로브 카드 조립체 |
CN104655885A (zh) * | 2013-11-15 | 2015-05-27 | 本田技研工业株式会社 | 电流施加装置以及半导体元件的制造方法 |
CN104777335A (zh) * | 2014-01-09 | 2015-07-15 | 本田技研工业株式会社 | 电流施加装置以及半导体元件的制造方法 |
JP2015132524A (ja) * | 2014-01-10 | 2015-07-23 | 富士通セミコンダクター株式会社 | 試験装置 |
CN111007373A (zh) * | 2018-10-05 | 2020-04-14 | 塞莱敦体系股份有限公司 | 高压探针卡*** |
WO2024132800A1 (en) * | 2022-12-21 | 2024-06-27 | Technoprobe S.P.A. | Probe card for a testing apparatus of electronic devices with improved thermal management |
WO2024132831A1 (en) * | 2022-12-21 | 2024-06-27 | Technoprobe S.P.A. | Probe card for a testing apparatus of electronic devices |
Also Published As
Publication number | Publication date |
---|---|
JP5021519B2 (ja) | 2012-09-12 |
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