JP2009141009A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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Abstract
【解決手段】半導体ウェハ2の回路面25側に、回路面25に貼り付けられたフィルム状の感光性接着剤1と感光性接着剤1の半導体ウェハ2とは反対側に積層された粘着フィルム50とを設ける工程と、半導体ウェハ2を粘着フィルム50とは反対側からの研磨により薄くする工程と、粘着フィルム50を感光性接着剤1から剥離する工程と、露光及び現像により感光性接着剤1をパターニングする工程と、半導体ウェハ2を複数の半導体チップ20に切り分ける工程と、半導体チップ2を、パターニングされた感光性接着剤1とともに支持基材7にマウントする工程と、を備える、半導体装置の製造方法。
【選択図】図2
Description
Claims (9)
- 半導体ウェハの回路面側に、該回路面に貼り付けられたフィルム状の感光性接着剤と該感光性接着剤の前記半導体ウェハとは反対側に積層された粘着フィルムとを設ける工程と、
前記半導体ウェハを前記粘着フィルムとは反対側からの研磨により薄くする工程と、
前記粘着フィルムを前記感光性接着剤から剥離する工程と、
露光及び現像により前記感光性接着剤をパターニングする工程と、
前記粘着フィルムを剥離する工程及び前記感光性接着剤をパターニングする工程の後、前記半導体ウェハを複数の半導体チップに切り分ける工程と、
前記半導体チップを、パターニングされた前記感光性接着剤とともに支持基材にマウントする工程と、
を備える、半導体装置の製造方法。 - 前記支持基材にマウントされた前記半導体チップの回路面上のパターニングされた前記感光性接着剤に、他の半導体チップを直接接着する工程を更に備える、請求項1記載の製造方法。
- 前記感光性接着剤が、アルカリ可溶性ポリマーと、放射線重合性化合物と、光重合開始剤と、を含有する請求項1又は2記載の製造方法。
- 前記アルカリ可溶性ポリマーがカルボキシル基又はフェノール性水酸基を有する、請求項3記載の製造方法。
- 前記アルカリ可溶性ポリマーのガラス転移温度が150℃以下である、請求項3又は4記載の製造方法。
- 前記アルカリ可溶性ポリマーがポリイミドである、請求項3〜5のいずれか一項に記載の製造方法。
- 前記感光性接着剤が熱硬化性樹脂を更に含有する、請求項3〜7のいずれか一項に記載の製造方法。
- 請求項1〜8のいずれか一項に記載の製造方法により得られる半導体装置。
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JP2007313797A JP5092719B2 (ja) | 2007-12-04 | 2007-12-04 | 半導体装置及びその製造方法 |
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JP2009141009A true JP2009141009A (ja) | 2009-06-25 |
JP5092719B2 JP5092719B2 (ja) | 2012-12-05 |
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Cited By (4)
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JP2011042775A (ja) * | 2009-07-22 | 2011-03-03 | Hitachi Chem Co Ltd | 感光性接着剤組成物、感光性エレメント、レジストパターンの製造方法及び接着体の製造方法 |
WO2012049939A1 (ja) * | 2010-10-14 | 2012-04-19 | 電気化学工業株式会社 | 電子部品の製造方法 |
US8975347B2 (en) | 2010-10-14 | 2015-03-10 | Denki Kagaku Kogyo Kabushiki Kaisha | Method for manufacturing electronic component |
WO2018159665A1 (ja) * | 2017-03-03 | 2018-09-07 | 日産化学株式会社 | 異物除去用コーティング膜形成組成物 |
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JP2004022996A (ja) * | 2002-06-19 | 2004-01-22 | Mitsui Chemicals Inc | 半導体チップの積層方法 |
JP2004063799A (ja) * | 2002-07-29 | 2004-02-26 | Sony Corp | 半導体装置の製造方法 |
JP2004186254A (ja) * | 2002-11-29 | 2004-07-02 | Furukawa Electric Co Ltd:The | 加工体製造方法 |
JP2004214310A (ja) * | 2002-12-27 | 2004-07-29 | Mitsui Chemicals Inc | 半導体ウェハ表面保護フィルム及び該保護フィルムを用いる半導体ウェハの製造方法 |
JP2004253483A (ja) * | 2003-02-18 | 2004-09-09 | Dainippon Printing Co Ltd | 半導体ウエハの製造方法 |
WO2007083810A1 (ja) * | 2006-01-23 | 2007-07-26 | Hitachi Chemical Co., Ltd. | 接着剤組成物、フィルム状接着剤、接着シート、並びにそれを用いた半導体装置 |
JP2007250789A (ja) * | 2006-03-15 | 2007-09-27 | Shin Etsu Polymer Co Ltd | 半導体ウエハの保護構造およびこれを用いた半導体ウエハの研削方法 |
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JP2004022996A (ja) * | 2002-06-19 | 2004-01-22 | Mitsui Chemicals Inc | 半導体チップの積層方法 |
JP2004063799A (ja) * | 2002-07-29 | 2004-02-26 | Sony Corp | 半導体装置の製造方法 |
JP2004186254A (ja) * | 2002-11-29 | 2004-07-02 | Furukawa Electric Co Ltd:The | 加工体製造方法 |
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Cited By (14)
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JP2011042775A (ja) * | 2009-07-22 | 2011-03-03 | Hitachi Chem Co Ltd | 感光性接着剤組成物、感光性エレメント、レジストパターンの製造方法及び接着体の製造方法 |
WO2012049939A1 (ja) * | 2010-10-14 | 2012-04-19 | 電気化学工業株式会社 | 電子部品の製造方法 |
JP2012084759A (ja) * | 2010-10-14 | 2012-04-26 | Denki Kagaku Kogyo Kk | 電子部品の製造方法 |
US8652942B2 (en) | 2010-10-14 | 2014-02-18 | Denki Kagaku Kogyo Kabushiki Kaisha | Method for manufacturing electronic parts |
US8975347B2 (en) | 2010-10-14 | 2015-03-10 | Denki Kagaku Kogyo Kabushiki Kaisha | Method for manufacturing electronic component |
WO2018159665A1 (ja) * | 2017-03-03 | 2018-09-07 | 日産化学株式会社 | 異物除去用コーティング膜形成組成物 |
CN110366768A (zh) * | 2017-03-03 | 2019-10-22 | 日产化学株式会社 | 用于异物除去的涂膜形成用组合物 |
KR20190120234A (ko) * | 2017-03-03 | 2019-10-23 | 닛산 가가쿠 가부시키가이샤 | 이물제거용 코팅막 형성 조성물 |
JPWO2018159665A1 (ja) * | 2017-03-03 | 2019-12-26 | 日産化学株式会社 | 異物除去用コーティング膜形成組成物 |
US11319514B2 (en) | 2017-03-03 | 2022-05-03 | Nissan Chemical Corporation | Composition for forming a coating film for removing foreign matters |
KR102501979B1 (ko) * | 2017-03-03 | 2023-02-21 | 닛산 가가쿠 가부시키가이샤 | 이물제거용 코팅막 형성 조성물 |
JP7268595B2 (ja) | 2017-03-03 | 2023-05-08 | 日産化学株式会社 | 異物除去用コーティング膜形成組成物 |
CN110366768B (zh) * | 2017-03-03 | 2023-09-26 | 日产化学株式会社 | 用于异物除去的涂膜形成用组合物 |
TWI834604B (zh) * | 2017-03-03 | 2024-03-11 | 日商日產化學工業股份有限公司 | 異物除去用塗膜形成組成物 |
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