JP2009098551A - Electro-optic device, method for manufacturing electro-optic device, and electronic equipment - Google Patents

Electro-optic device, method for manufacturing electro-optic device, and electronic equipment Download PDF

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JP2009098551A
JP2009098551A JP2007272169A JP2007272169A JP2009098551A JP 2009098551 A JP2009098551 A JP 2009098551A JP 2007272169 A JP2007272169 A JP 2007272169A JP 2007272169 A JP2007272169 A JP 2007272169A JP 2009098551 A JP2009098551 A JP 2009098551A
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Shunji Matsuzawa
俊次 松澤
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Seiko Epson Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optic device capable of preventing generation of display failure by preventing ingression of light for curing a photocurable adhesive from ingressing into a liquid crystal through a side face along an external connection terminal of a cover glass by a simple technology, the photosetting adhesive used for reinforcing the connection of an FPC to the external connection terminal. <P>SOLUTION: The electro-optic device has an external connection terminal 102 provided along one side face 10s1 on the surface 10f of a TFT substrate 10, an FPC 112 electrically connected to the external connection terminal 102 and connecting a liquid crystal panel 100 to an external circuit outside the liquid crystal panel 100, and a photocurable adhesive 70 adhering the side face 10s1 of the TFT substrate 10 with the FPC 112, wherein a light scattering face 90 is formed on at least one side face 30s1 of a cover glass 30 to prevent UV light used for curing the photocurable adhesive 70 from ingressing into the liquid crystal layer 50. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、第１の基板と該第１の基板に対向する第２の基板との間に電気光学物質が介在されるとともに、少なくとも第１の基板に第３の基板が貼着された電気光学パネルを具備する電気光学装置、電気光学装置の製造方法、電子機器に関する。   According to the present invention, an electro-optical material is interposed between a first substrate and a second substrate facing the first substrate, and at least a third substrate is attached to the first substrate. The present invention relates to an electro-optical device including an optical panel, a method for manufacturing the electro-optical device, and an electronic apparatus.

周知のように、電気光学装置、例えば光透過型の液晶装置は、ガラス基板、石英基板等からなる２枚の基板間に液晶が介在されて構成された電気光学パネルである液晶パネルが実装ケース等に収容されて構成されている。   2. Description of the Related Art As is well known, an electro-optical device, for example, a light transmission type liquid crystal device, has a mounting case in which a liquid crystal panel, which is an electro-optical panel constructed by interposing liquid crystal between two substrates made of a glass substrate, a quartz substrate, etc. It is accommodated and configured.

また、液晶装置は、液晶パネルの一方の基板に、例えば薄膜トランジスタ(Thin Film Transistor、以下、ＴＦＴと称す)等のスイッチング素子及び画素電極をマトリクス状に配置し、他方の基板に対向電極を配置して、両基板間に介在された液晶層による光学応答を画像信号に応じて変化させることで、画像表示を可能としている。   In addition, in a liquid crystal device, switching elements such as thin film transistors (hereinafter referred to as TFTs) and pixel electrodes are arranged in a matrix on one substrate of a liquid crystal panel, and a counter electrode is arranged on the other substrate. Thus, an image can be displayed by changing the optical response of the liquid crystal layer interposed between the two substrates in accordance with the image signal.

また、ＴＦＴを配置した第１の基板であるＴＦＴ基板と、このＴＦＴ基板に相対して配置される第２の基板である対向基板とは、別々に製造される。ＴＦＴ基板及び対向基板は、例えば石英基板上に、所定のパターンを有する半導体薄膜、絶縁性薄膜又は導電性薄膜を積層することによって構成される。半導体薄膜、絶縁性薄膜又は導電性薄膜は、層毎に各種膜の成膜工程とフォトリソグラフィ工程を繰り返すことによって形成されるのである。   In addition, a TFT substrate, which is a first substrate on which TFTs are arranged, and a counter substrate, which is a second substrate arranged relative to the TFT substrate, are manufactured separately. The TFT substrate and the counter substrate are configured, for example, by laminating a semiconductor thin film, an insulating thin film, or a conductive thin film having a predetermined pattern on a quartz substrate. The semiconductor thin film, the insulating thin film, or the conductive thin film is formed by repeating a film forming process and a photolithography process for various films for each layer.

このようにして形成されたＴＦＴ基板及び対向基板は、例えば液晶封入方式により、ＴＦＴ基板と対向基板との間に液晶が介在される場合には、一部に切り欠きを有するよう略周状に塗布されたシール材を介して、パネル組立工程において高精度（例えばアライメント誤差１μ以内）に貼り合わされる。   When the liquid crystal is interposed between the TFT substrate and the counter substrate, for example, by the liquid crystal sealing method, the TFT substrate and the counter substrate formed in this way have a substantially circumferential shape so as to have a notch in part. Through the applied sealing material, it is bonded with high precision (for example, within an alignment error of 1 μm) in the panel assembling process.

次いでアライメントが施されてそれぞれ圧着硬化された後、シール材の一部に設けられた切り欠きを介して液晶が封入され、切り欠きが、熱等により硬化された封止材により封止される。   Next, after alignment is performed and each is cured by pressure bonding, liquid crystal is sealed through a notch provided in a part of the sealing material, and the notch is sealed with a sealing material cured by heat or the like. .

その後、ＴＦＴ基板及び対向基板の外面となる露出面に、第３の基板である防塵ガラス（以下、カバーガラスと称す）が、接着剤を介してそれぞれ貼着されることにより、液晶パネルは製造される。ＴＦＴ基板及び対向基板の露出面にカバーガラスが貼着されていることにより、各露出面における表示領域に、塵埃等が付着してしまうのを防止することができるとともに、カバーガラスの露出面に塵埃等が付着してしまったとしても、塵埃等と液晶との間の距離がカバーガラスの厚み分だけ長くなることから、液晶パネルを具備する液晶装置がプロジェクタ等の投射装置に用いられた場合、投射された塵埃等の像がデフォーカスされ、スクリーン上に大きくぼやけて表示されるため、目立たなくなるといった効果がある。   Thereafter, a dust-proof glass (hereinafter referred to as a cover glass), which is a third substrate, is adhered to the exposed surfaces which are the outer surfaces of the TFT substrate and the counter substrate, respectively, through an adhesive, whereby the liquid crystal panel is manufactured. Is done. By attaching the cover glass to the exposed surfaces of the TFT substrate and the counter substrate, it is possible to prevent dust and the like from adhering to the display area on each exposed surface, and to the exposed surface of the cover glass. Even if dust or the like has adhered, the distance between the dust or the like and the liquid crystal is increased by the thickness of the cover glass, so that a liquid crystal device equipped with a liquid crystal panel is used in a projection device such as a projector. Since the projected image of dust or the like is defocused and displayed on the screen in a largely blurred manner, there is an effect that it becomes inconspicuous.

その後、例えばＴＦＴ基板が対向基板より平面視した状態で大きく形成されることによりＴＦＴ基板の対向基板が貼り合わされた面の一部に形成された張り出し部に設けられた外部接続端子に、プロジェクタ等の電子機器の外部回路と電気的に接続する、特定の長さを有する柔軟な図示しない薄板状基板であるフレキシブル配線基板（Flexible Printed Circuits、以下ＦＰＣと称す）の一端が、圧着等により電気的に接続され、最後に、液晶パネルが実装ケース等に収容されることにより、液晶装置が形成される。   After that, for example, the TFT substrate is formed in a larger size in a plan view than the counter substrate, so that the external connection terminal provided on the projecting portion formed on a part of the surface of the TFT substrate on which the counter substrate is bonded is connected to the projector or the like. One end of a flexible printed circuit board (Flexible Printed Circuits, hereinafter referred to as FPC), which is a flexible thin plate substrate (not shown) having a specific length and electrically connected to an external circuit of an electronic device, is electrically connected by crimping or the like. Finally, the liquid crystal panel is accommodated in a mounting case or the like to form a liquid crystal device.

このように、液晶装置をプロジェクタ等の電子機器の外部回路と電気的に接続するため、液晶装置の一方の基板の張り出し部に設けられた外部接続端子に、液晶装置と電子機器の外部回路とを電気的に接続するＦＰＣの一端を接続する技術は、例えば特許文献１に開示されている。   Thus, in order to electrically connect the liquid crystal device to an external circuit of an electronic device such as a projector, the external connection terminal provided on the projecting portion of one substrate of the liquid crystal device is connected to the external circuit of the liquid crystal device and the electronic device. For example, Patent Document 1 discloses a technique for connecting one end of an FPC that electrically connects the two.

特許文献１には、外部接続端子に対して、ＦＰＣの一端が異方性導電接着剤等により電気的に接着され、接着部が樹脂により封止されて補強されることにより、不意にＦＰＣが引っ張られたとしても、外部接続端子からＦＰＣの一端が外れてしまうことが防止された構成が開示されている。
特開平１１−１２５８１０号公報 In Patent Document 1, one end of an FPC is electrically bonded to an external connection terminal with an anisotropic conductive adhesive or the like, and the bonded portion is sealed and reinforced with a resin. A configuration is disclosed in which one end of the FPC is prevented from being detached from the external connection terminal even when pulled.
Japanese Patent Laid-Open No. 11-125810

ところで、特許文献１に開示された構成よりも、より強固に、外部接続端子からＦＰＣの一端が不意に外れてしまうことを防止する技術として、ＦＰＣの一端を外部接続端子に対して異方性導電接着剤等により電気的に接続した後、外部接続端子が形成された基板の外部接続端子に沿った一側面に対しＦＰＣを、平面視した状態で一側面に沿って直線状に塗布した光硬化型接着剤で接着し、該光硬化型接着剤に、ＵＶ光等の光を照射して硬化させることにより、光硬化型接着剤によって、外部接続端子に対するＦＰＣの一端の接続をさらに補強する手法も周知である。   By the way, as a technique for preventing one end of the FPC from being unexpectedly detached from the external connection terminal more firmly than the configuration disclosed in Patent Document 1, one end of the FPC is anisotropic with respect to the external connection terminal. After electrically connecting with a conductive adhesive or the like, light in which FPC is linearly applied along one side surface in a plan view on one side surface along the external connection terminal of the substrate on which the external connection terminal is formed By bonding with a curable adhesive, and curing the photocurable adhesive by irradiating light such as UV light, the connection of one end of the FPC to the external connection terminal is further reinforced by the photocurable adhesive. The technique is also well known.

しかしながら、このような手法において、光硬化型接着剤に光を照射すると、例えばＴＦＴ基板に外部接続端子が設けられている場合、ＴＦＴ基板に貼着されたカバーガラスの外部接続端子に沿った側面から光が液晶中に進入してしまい、液晶分子の配列を乱した結果、液晶装置を用いた表示に線状の表示不良が発生してしまうといった問題があった。   However, in such a method, when light is applied to the photocurable adhesive, for example, when an external connection terminal is provided on the TFT substrate, the side surface along the external connection terminal of the cover glass attached to the TFT substrate As a result, light enters the liquid crystal and disturbs the alignment of the liquid crystal molecules, resulting in a problem that a linear display defect occurs in the display using the liquid crystal device.

このような問題に鑑み、光硬化型接着剤に光を照射する際、光照射装置を、カバーガラスの外部接続端子に沿った側面から光照射装置の光照射範囲ぎりぎりまで離間させて、カバーガラスの側面から液晶内に光が進入しないように光硬化型接着剤のみに光照射する技術も周知である。ところが、光照射装置の位置調整を行うのが煩雑な他、液晶パネルを小型化すると、外部接続端子を設ける領域も小さくなり、光硬化型接着剤の接着領域も小さくなることから、光硬化型接着剤のみに光照射を行うことが難しくなるといった問題もある。   In view of such problems, when irradiating light to the photocurable adhesive, the light irradiation device is separated from the side surface along the external connection terminal of the cover glass to the limit of the light irradiation range of the light irradiation device, and the cover glass A technique for irradiating only a photo-curable adhesive with light so that light does not enter the liquid crystal from the side surface is also well known. However, it is troublesome to adjust the position of the light irradiation device, and when the liquid crystal panel is downsized, the area where the external connection terminals are provided is reduced, and the adhesive area of the photocurable adhesive is also reduced. There is also a problem that it is difficult to perform light irradiation only on the adhesive.

本発明は上記問題点に着目してなされたものであり、簡単な手法にて、外部接続端子へのＦＰＣの接続を補強する光硬化型接着剤を硬化させる光がカバーガラスの外部接続端子に沿った側面から液晶に進入してしまうことを防ぐことにより、表示不良の発生が防止できる電気光学装置、電気光学装置の製造方法、電子機器を提供することを目的とする。   The present invention has been made paying attention to the above problems, and light that cures the photo-curing adhesive that reinforces the connection of the FPC to the external connection terminal is applied to the external connection terminal of the cover glass by a simple method. It is an object of the present invention to provide an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus that can prevent the occurrence of display defects by preventing the liquid crystal from entering the liquid crystal from the side surface.

上記目的を達成するために本発明に係る電気光学装置は、第１の基板と該第１の基板に対向する前記第１の基板よりも外形が小さい第２の基板との間に電気光学物質が介在されるとともに、少なくとも前記第１の基板に第３の基板が貼着された電気光学パネルを具備する電気光学装置であって、前記第１の基板の前記第２の基板が貼り合わされた領域外における前記第２の基板への対向面において、平面視した状態で前記電気光学パネルの一側面に沿って設けられた外部接続端子部と、前記外部接続端子部に電気的に接続された、前記電気光学パネルを該電気光学パネル外の外部回路に接続する薄板状基板と、前記薄板状基板と前記第１の基板における前記一側面とを接着する光硬化型接着剤と、を具備し、少なくとも前記第３の基板の前記一側面に、前記光硬化型接着剤の硬化に用いる光が前記電気光学物質に進入するのを防止する光散乱面が形成されていることを特徴とする。   In order to achieve the above object, an electro-optical device according to the present invention includes an electro-optical material between a first substrate and a second substrate having a smaller outer shape than the first substrate facing the first substrate. And an electro-optical device including an electro-optical panel having a third substrate attached to at least the first substrate, wherein the second substrate of the first substrate is attached. An external connection terminal portion provided along one side surface of the electro-optical panel in a plan view on the surface facing the second substrate outside the region, and electrically connected to the external connection terminal portion A thin plate-like substrate for connecting the electro-optic panel to an external circuit outside the electro-optic panel, and a photo-curing adhesive for adhering the thin plate-like substrate and the one side surface of the first substrate. , At least of the third substrate On the side surface, wherein the light used for curing the light curing adhesive light scattering surface to prevent the entering the electro-optical material is formed.

本発明によれば、第３の基板の外部接続端子に沿った一側面に、光散乱面が形成されていることにより、外部接続端子に電気的に接続された薄板状基板の外部接続端子への接続を補強するため、外部接続端子と第１の基板の一側面とを光硬化型接着剤で接着し、光硬化型接着剤に光を照射して硬化させる際、光が第３の基板の一側面から液晶内に進入して液晶分子の配列を乱し、表示不良が発生してしまうことを、第３の基板の一側面に形成された光散乱面によって、簡単かつ確実に防止することができる電気光学装置を提供することができる。   According to the present invention, the light scattering surface is formed on one side surface along the external connection terminal of the third substrate, so that the external connection terminal of the thin plate substrate electrically connected to the external connection terminal can be obtained. In order to reinforce the connection, the external connection terminal and one side surface of the first substrate are bonded with a photo-curing adhesive, and when the photo-curing adhesive is irradiated with light and cured, the light is transmitted to the third substrate. The light scattering surface formed on one side surface of the third substrate can easily and reliably prevent liquid crystal molecules from entering one side of the liquid crystal and disturbing the alignment of the liquid crystal molecules to cause display defects. An electro-optical device that can be provided can be provided.

また、前記第３の基板の前記一側面の表面粗さは、前記第３の基板における他の側面の表面粗さよりも粗いことを特徴とする。   Further, the surface roughness of the one side surface of the third substrate is rougher than the surface roughness of the other side surface of the third substrate.

本発明によれば、第３の基板の外部接続端子に沿った一側面が、他の側面よりも表面粗さが粗く形成されて、一側面に光散乱面が形成されていることにより、外部接続端子に電気的に接続された薄板状基板の外部接続端子への接続を補強するため、外部接続端子と第１の基板の一側面とを光硬化型接着剤で接着し、光硬化型接着剤に光を照射して硬化させる際、光が第３の基板の一側面から液晶内に進入して液晶分子の配列を乱し、表示不良が発生してしまうことを、第３の基板の一側面に形成された光散乱面によって、簡単かつ確実に防止することができる電気光学装置を提供することができる。   According to the present invention, one side surface along the external connection terminal of the third substrate is formed to have a rougher surface roughness than the other side surface, and the light scattering surface is formed on the one side surface. In order to reinforce the connection of the thin plate-like substrate electrically connected to the connection terminal to the external connection terminal, the external connection terminal and one side surface of the first substrate are bonded with a photo-curing adhesive, and photo-curing adhesive When the agent is irradiated with light and cured, the light enters the liquid crystal from one side of the third substrate and disturbs the alignment of the liquid crystal molecules, resulting in display defects. An electro-optical device that can be easily and reliably prevented by the light scattering surface formed on one side surface can be provided.

さらに、前記光散乱面は、前記第１の基板における前記一側面にさらに形成されていることを特徴とする。   Furthermore, the light scattering surface is further formed on the one side surface of the first substrate.

本発明によれば、第３の基板及び第１の基板の外部接続端子に沿った各一側面に、光散乱面が形成されていることにより、外部接続端子に電気的に接続された薄板状基板の外部接続端子への接続を補強するため、外部接続端子と第１の基板の一側面とを光硬化型接着剤で接着し、光硬化型接着剤に光を照射して硬化させる際、光が第３の基板及び第１の基板の一側面から液晶内に進入して液晶分子の配列を乱し、表示不良が発生してしまうことを、第３の基板及び第１の基板の各一側面に形成された光散乱面によって、簡単かつより確実に防止することができる電気光学装置を提供することができる。また、第１の基板の一側面にも光散乱面が形成されていることにより、第１基板の一側面に対する光硬化型接着剤の接着性が向上する。   According to the present invention, the light scattering surface is formed on each side surface along the external connection terminal of the third substrate and the first substrate, so that the thin plate is electrically connected to the external connection terminal. In order to reinforce the connection of the substrate to the external connection terminal, the external connection terminal and one side surface of the first substrate are bonded with a photocurable adhesive, and when the photocurable adhesive is cured by irradiating light, Each of the third substrate and the first substrate indicates that light enters the liquid crystal from one side surface of the third substrate and the first substrate, disturbs the alignment of the liquid crystal molecules, and causes a display defect. An electro-optical device that can be easily and more reliably prevented by the light scattering surface formed on one side surface can be provided. Further, since the light scattering surface is also formed on one side surface of the first substrate, the adhesiveness of the photocurable adhesive to the one side surface of the first substrate is improved.

また、前記第１の基板及び前記第３の基板の前記一側面の表面粗さは、前記第１の基板及び前記第３の基板における他の側面の表面粗さよりも粗いことを特徴とする。   The surface roughness of the one side surface of the first substrate and the third substrate is rougher than the surface roughness of the other side surface of the first substrate and the third substrate.

本発明によれば、第３の基板及び第１の基板の外部接続端子に沿った各一側面が、他の側面よりも表面粗さが粗く形成されて、各一側面に光散乱面が形成されていることにより、外部接続端子に電気的に接続された薄板状基板の外部接続端子への接続を補強するため、外部接続端子と第１の基板の一側面とを光硬化型接着剤で接着し、光硬化型接着剤に光を照射して硬化させる際、光が第３の基板及び第１の基板の一側面から液晶内に進入して液晶分子の配列を乱し、表示不良が発生してしまうことを、第３の基板及び第１の基板の各一側面に形成された光散乱面によって、簡単かつ確実に防止することができる電気光学装置を提供することができる。また、第１の基板の一側面にも光散乱面が形成されていることにより、第１基板の一側面に対する光硬化型接着剤の接着性が向上する。   According to the present invention, each side surface along the external connection terminal of the third substrate and the first substrate is formed to have a surface roughness rougher than the other side surface, and a light scattering surface is formed on each one side surface. In order to reinforce the connection of the thin board electrically connected to the external connection terminal to the external connection terminal, the external connection terminal and one side surface of the first substrate are bonded with a photocurable adhesive. When the adhesive is cured and light is applied to the photo-curing adhesive, the light enters the liquid crystal from one side surface of the third substrate and the first substrate, disturbs the alignment of the liquid crystal molecules, and causes a display defect. It is possible to provide an electro-optical device that can easily and surely prevent the occurrence by the light scattering surface formed on each side surface of the third substrate and the first substrate. Further, since the light scattering surface is also formed on one side surface of the first substrate, the adhesiveness of the photocurable adhesive to the one side surface of the first substrate is improved.

本発明に係る電気光学装置の製造方法は、第１の基板と該第１の基板に対向する前記第１の基板よりも外形が小さい第２の基板との間に電気光学物質が介在されるとともに、少なくとも前記第１の基板に第３の基板が貼着された電気光学パネルを具備する電気光学装置の製造方法であって、前記第３の基板は、第１の大板基板に構成されており、少なくとも前記第３の基板を、前記第１の基板の前記第２の基板が貼り合わされた領域外における前記第２の基板への対向面において設けられた外部接続端子部に沿った前記電気光学パネルの一側面に光散乱面が形成されるよう、前記第１の大板基板から、所定の大きさに切断して形成する切断工程を具備していることを特徴とする。   In the electro-optical device manufacturing method according to the present invention, an electro-optical material is interposed between a first substrate and a second substrate having an outer shape smaller than that of the first substrate facing the first substrate. And an electro-optical device manufacturing method including an electro-optical panel having at least a third substrate attached to the first substrate, wherein the third substrate is configured as a first large substrate. And at least the third substrate along the external connection terminal portion provided on the surface of the first substrate facing the second substrate outside the region where the second substrate is bonded. A cutting step of cutting the first large plate substrate into a predetermined size so as to form a light scattering surface on one side surface of the electro-optical panel is provided.

本発明によれば、第３の基板が構成された第１の大板基板から分断して第３の基板を形成する際、分断工程において、第３の基板の外部接続端子に沿った一側面に、光散乱面を形成することにより、外部接続端子に電気的に接続された薄板状基板の外部接続端子への接続を補強するため、外部接続端子と第１の基板の一側面とを光硬化型接着剤で接着し、光硬化型接着剤に光を照射して硬化させる際、光が第３の基板の一側面から液晶内に進入して液晶分子の配列を乱し、表示不良が発生してしまうことを、第３の基板の一側面に形成した光散乱面によって、工程数を増やすことなく簡単かつ確実に防止することができる電気光学装置の製造方法を提供することができる。   According to the present invention, when the third substrate is formed by dividing from the first large substrate on which the third substrate is formed, one side surface along the external connection terminal of the third substrate is formed in the dividing step. In addition, in order to reinforce the connection of the thin plate-like substrate electrically connected to the external connection terminal to the external connection terminal by forming a light scattering surface, the external connection terminal and one side surface of the first substrate are light-transmitted. When adhering with a curable adhesive and irradiating the photocurable adhesive with light, the light enters the liquid crystal from one side of the third substrate and disturbs the alignment of the liquid crystal molecules. It is possible to provide a method of manufacturing an electro-optical device that can easily and reliably prevent the occurrence of the occurrence without increasing the number of steps by the light scattering surface formed on one side surface of the third substrate.

また、前記切断工程は、前記第３の基板の前記一側面の表面粗さが、前記第３の基板における他の側面の表面粗さよりも粗くなるよう行うことを特徴とする。   Further, the cutting step is performed so that the surface roughness of the one side surface of the third substrate is rougher than the surface roughness of the other side surface of the third substrate.

本発明によれば、第３の基板が構成された第１の大板基板から分断して第３の基板を形成する際、分断工程において、第３の基板の外部接続端子に沿った一側面の表面粗さを、他の側面よりも粗く形成し、一側面に光散乱面を形成することにより、外部接続端子に電気的に接続された薄板状基板の外部接続端子への接続を補強するため、外部接続端子と第１の基板の一側面とを光硬化型接着剤で接着し、光硬化型接着剤に光を照射して硬化させる際、光が第３の基板の一側面から液晶内に進入して液晶分子の配列を乱し、表示不良が発生してしまうことを、第３の基板の一側面に形成した光散乱面によって、工程数を増やすことなく簡単かつ確実に防止することができる電気光学装置を提供することができる。   According to the present invention, when the third substrate is formed by dividing from the first large substrate on which the third substrate is formed, one side surface along the external connection terminal of the third substrate is formed in the dividing step. The surface roughness of the substrate is made rougher than the other side surface, and the light scattering surface is formed on one side surface, thereby reinforcing the connection to the external connection terminal of the thin board electrically connected to the external connection terminal. Therefore, when the external connection terminal and one side surface of the first substrate are bonded with a photo-curing adhesive, and the photo-curing adhesive is irradiated with light to be cured, the light is liquid crystal from one side of the third substrate. The light scattering surface formed on one side surface of the third substrate can easily and reliably prevent the liquid crystal molecules from being disturbed by entering the inside and causing the display defect to occur without increasing the number of steps. An electro-optical device that can be provided can be provided.

さらに、前記第１の基板は、第２の大板基板に構成されているとともに、該第２の大板基板は、前記第１の基板に対して前記第３の基板が貼着されるよう、前記第１の大板基板に貼着されており、前記切断工程は、前記第３の基板及び前記第１の基板を、前記第１の大板基板及び前記第２の大板基板から、前記第１の基板及び前記第３の基板の前記一側面に光散乱面が形成されるよう、所定の大きさに分断して形成する工程であることを特徴とする。   Further, the first substrate is configured as a second large substrate, and the second large substrate is attached to the third substrate with respect to the first substrate. The first large substrate is attached to the first large substrate, and the cutting step is performed by separating the third substrate and the first substrate from the first large substrate and the second large substrate. The first substrate and the third substrate are divided into predetermined sizes so that a light scattering surface is formed on the one side surface of the first substrate and the third substrate.

本発明によれば、第３の基板が構成された第１の大板基板に第１の基板が構成された第２の大板基板を貼着し、該貼着したものから分断して第３の基板が貼着された第１の基板を形成する際、分断工程において、第３の基板及び第１の基板の外部接続端子に沿った各一側面に、光散乱面を形成することにより、外部接続端子に電気的に接続された薄板状基板の外部接続端子への接続を補強するため、外部接続端子と第１の基板の一側面とを光硬化型接着剤で接着し、光硬化型接着剤に光を照射して硬化させる際、光が第３の基板及び第１の基板の一側面から液晶内に進入して液晶分子の配列を乱し、表示不良が発生してしまうことを、第３の基板及び第１の基板の各一側面に形成した光散乱面によって、工程数を増やすことなく簡単かつ確実に防止することができる電気光学装置の製造方法を提供することができる。また、第１の基板の一側面にも光散乱面を形成することにより、第１基板の一側面に対する光硬化型接着剤の接着性が向上する。   According to the present invention, the second large substrate having the first substrate is adhered to the first large substrate having the third substrate, and the second substrate having the first substrate is separated from the adhered substrate. By forming a light scattering surface on each side surface along the external connection terminals of the third substrate and the first substrate in the dividing step when forming the first substrate to which the third substrate is adhered In order to reinforce the connection of the thin plate-like substrate electrically connected to the external connection terminal to the external connection terminal, the external connection terminal and one side surface of the first substrate are bonded with a photo-curing adhesive, and light curing is performed. When the mold adhesive is irradiated with light and cured, the light enters the liquid crystal from one side of the third substrate and the first substrate, disturbs the alignment of the liquid crystal molecules, and causes a display defect. The light scattering surface formed on each side surface of the third substrate and the first substrate is simple and reliable without increasing the number of processes. Method of manufacturing an electro-optical device which can prevent can provide. Further, by forming a light scattering surface also on one side surface of the first substrate, the adhesiveness of the photocurable adhesive to one side surface of the first substrate is improved.

また、前記切断工程は、前記一側面の表面粗さが、前記第１の基板及び第３の基板における他の側面の表面粗さよりも粗くなるよう行うことを特徴とする。   Further, the cutting step is performed such that the surface roughness of the one side surface is rougher than the surface roughness of the other side surface of the first substrate and the third substrate.

本発明によれば、第３の基板が構成された第１の大板基板に第１の基板が構成された第２の大板基板を貼着し、該貼着したものから分断して第３の基板が貼着された第１の基板を形成する際、分断工程において、第３の基板及び第１の基板の外部接続端子に沿った各一側面の表面粗さを、他の側面よりも粗く形成し、各一側面に光散乱面を形成することにより、外部接続端子に電気的に接続された薄板状基板の外部接続端子への接続を補強するため、外部接続端子と第１の基板の一側面とを光硬化型接着剤で接着し、光硬化型接着剤に光を照射して硬化させる際、光が第３の基板及び第１の基板の一側面から液晶内に進入して液晶分子の配列を乱し、表示不良が発生してしまうことを、第３の基板及び第１の基板の各一側面に形成した光散乱面によって、工程数を増やすことなく簡単かつ確実に防止することができる電気光学装置も製造方法を提供することができる。また、第１の基板の一側面にも光散乱面を形成することにより、第１基板の一側面に対する光硬化型接着剤の接着性が向上する。   According to the present invention, the second large substrate having the first substrate is adhered to the first large substrate having the third substrate, and the second substrate having the first substrate is separated from the adhered substrate. When forming the first substrate to which the third substrate is adhered, the surface roughness of each side surface along the external connection terminals of the third substrate and the first substrate is determined from the other side surface in the dividing step. And forming a light scattering surface on each side surface to reinforce the connection of the thin board electrically connected to the external connection terminal to the external connection terminal. When one side of the substrate is bonded with a photo-curable adhesive, and the photo-curable adhesive is irradiated with light to be cured, light enters the liquid crystal from one side of the third substrate and the first substrate. The light scattering formed on each side surface of the third substrate and the first substrate indicates that the alignment of the liquid crystal molecules is disturbed and display defects occur. The electro-optical device which can be easily and reliably prevented that without increasing the number of steps it is possible to provide a manufacturing method. Further, by forming a light scattering surface also on one side surface of the first substrate, the adhesiveness of the photocurable adhesive to one side surface of the first substrate is improved.

さらに、前記切断工程は、レーザ光を切断位置に照射して改質層を形成することにより行われ、前記レーザ光の照射は、前記一側面における前記改質層の密度が、他の側面における前記改質層の密度よりも大きくなるよう行うことを特徴とする。   Further, the cutting step is performed by irradiating a cutting position with a laser beam to form a modified layer, and the irradiation with the laser beam is performed when the density of the modified layer on one side surface is on the other side surface. It is characterized by being performed so as to be larger than the density of the modified layer.

本発明によれば、第３の基板が構成された第１の大板基板から分断して第３の基板を形成する際、または第３の基板が構成された第１の大板基板に第１の基板が構成された第２の大板基板を貼着し、該貼着したものから分断して第３の基板が貼着された第１の基板を形成する際、分断工程において、第３の基板、または第３の基板及び第１の基板の外部接続端子に沿った一側面の改質層の密度が、他の側面の改質層の密度よりも大きくなるよう一側面にレーザ光を照射して一側面に光散乱面を形成することにより、外部接続端子に電気的に接続された薄板状基板の外部接続端子への接続を補強するため、外部接続端子と第１の基板の一側面とを光硬化型接着剤で接着し、光硬化型接着剤に光を照射して硬化させる際、光が第３の基板及び第１の基板の一側面から液晶内に進入して液晶分子の配列を乱し、表示不良が発生してしまうことを、第３の基板、または第３の基板及び第１の基板の一側面にレーザ光の照射によって形成した光散乱面によって、工程数を増やすことなく簡単かつ確実に防止することができる電気光学装置の製造方法を提供することができる。   According to the present invention, when the third substrate is formed by dividing from the first large substrate on which the third substrate is configured, or on the first large substrate on which the third substrate is configured. When the second substrate having the first substrate is attached and divided from the attached substrate to form the first substrate to which the third substrate is attached, in the dividing step, Laser beam on one side so that the density of the modified layer on one side along the external connection terminal of the third substrate or the third substrate and the first substrate is higher than the density of the modified layer on the other side. In order to reinforce the connection of the thin plate-like substrate electrically connected to the external connection terminal to the external connection terminal by forming a light scattering surface on one side surface, the external connection terminal and the first substrate When the one side surface is bonded with a photo-curing adhesive and the photo-curing adhesive is cured by irradiating light, the light is transmitted to the third substrate and the first substrate. Laser light is incident on the third substrate or the third substrate and one side surface of the first substrate to enter the liquid crystal from one side of the substrate to disturb the alignment of liquid crystal molecules and cause display defects. By the light scattering surface formed by the irradiation, it is possible to provide a method of manufacturing an electro-optical device that can be easily and reliably prevented without increasing the number of steps.

本発明に係る電子機器は、請求項１〜４のいずれか１項に記載の電気光学装置を具備することを特徴とする。   An electronic apparatus according to an aspect of the invention includes the electro-optical device according to any one of claims 1 to 4.

本発明によれば、第３の基板または第３の基板及び第１の基板の外部接続端子に沿った一側面に、光散乱面が形成されていることにより、外部接続端子に電気的に接続された薄板状基板の外部接続端子への接続を補強するため、外部接続端子と第１の基板の一側面とを光硬化型接着剤で接着し、光硬化型接着剤に光を照射して硬化させる際、光が第３の基板の一側面から液晶内に進入して液晶分子の配列を乱し、表示不良が発生してしまうことを、第３の基板または第３の基板及び第１の基板の一側面に形成された光散乱面によって、簡単かつ確実に防止することができる電気光学装置を具備する電子機器を提供することができる。   According to the present invention, the light scattering surface is formed on one side of the third substrate or the third substrate and the first substrate along the external connection terminal, so that it is electrically connected to the external connection terminal. In order to reinforce the connection of the thin plate-like substrate to the external connection terminal, the external connection terminal and one side surface of the first substrate are bonded with a photo-curing adhesive, and the photo-curing adhesive is irradiated with light. When curing, light enters the liquid crystal from one side surface of the third substrate and disturbs the alignment of the liquid crystal molecules, resulting in a display defect. The third substrate or the third substrate and the first substrate An electronic apparatus including an electro-optical device that can be easily and reliably prevented by the light scattering surface formed on one side of the substrate can be provided.

以下、図面を参照にして本発明の実施の形態を説明する。尚、以下に示す実施の形態において電気光学装置は、光透過型の液晶装置を例に挙げて説明する。よって、電気光学装置が具備する電気光学パネルは、液晶パネルを例に挙げて説明する。   Embodiments of the present invention will be described below with reference to the drawings. In the following embodiments, the electro-optical device will be described by taking a light transmission type liquid crystal device as an example. Therefore, the electro-optical panel included in the electro-optical device will be described using a liquid crystal panel as an example.

また、液晶パネルにおいて対向配置される一対の基板の内、一方の基板は、素子基板（以下、ＴＦＴ基板と称す）を、また他方の基板は、ＴＦＴ基板に対向する対向基板を例に挙げて説明する。   In addition, one of the pair of substrates opposed to each other in the liquid crystal panel is an element substrate (hereinafter referred to as a TFT substrate), and the other substrate is an example of a counter substrate facing the TFT substrate. explain.

図１は、本実施の形態の液晶装置における液晶パネルを薄板状基板とともに示す平面図、図２は、図１中のII-II線に沿って切断した液晶パネルを薄板状基板とともに示す断面図、図３は、図１の液晶パネルの背面側を、外部接続端子が設けられた部位を中心に薄板状基板とともに示す部分背面図、図４は、図２のＴＦＴ基板及びカバーガラスの一側面に形成された光散乱面を拡大して示す部分断面図である。   FIG. 1 is a plan view showing a liquid crystal panel together with a thin plate substrate in the liquid crystal device of the present embodiment, and FIG. 2 is a cross-sectional view showing a liquid crystal panel cut along the line II-II in FIG. 3 is a partial rear view showing the back side of the liquid crystal panel of FIG. 1 together with a thin plate-like substrate centering on a portion where external connection terminals are provided, and FIG. 4 is a side view of the TFT substrate and cover glass of FIG. It is a fragmentary sectional view which expands and shows the light-scattering surface formed in FIG.

図１、図２に示すように、液晶パネル１００は、例えば、石英基板やガラス基板等を用いた第１の基板であるＴＦＴ基板１０と、該ＴＦＴ基板１０に対向配置される、例えばガラス基板や石英基板等を用いたＴＦＴ基板１０よりも外形の小さい第２の基板である対向基板２０との間の内部空間に、電気光学物質である液晶５０が介在されて構成される。対向配置されたＴＦＴ基板１０と対向基板２０とは、シール材５２によって貼り合わされている。   As shown in FIGS. 1 and 2, the liquid crystal panel 100 includes a TFT substrate 10 that is a first substrate using, for example, a quartz substrate or a glass substrate, and a TFT substrate 10 that is disposed to face the TFT substrate 10. In addition, a liquid crystal 50 that is an electro-optical material is interposed in an internal space between the counter substrate 20 that is a second substrate having a smaller outer shape than the TFT substrate 10 using a quartz substrate or the like. The TFT substrate 10 and the counter substrate 20 that are arranged to face each other are bonded together by a sealing material 52.

ＴＦＴ基板１０の液晶５０と接する領域に、液晶パネル１００の表示領域４０を構成するＴＦＴ基板１０の表示領域１０ｈが構成されている。また、ＴＦＴ基板１０の対向基板２０に対向する対向面となる表面１０ｆ側における表示領域１０ｈに、画素を構成するとともに、後述する対向電極２１とともに液晶５０に駆動電圧を印加する画素電極９ａがマトリクス状に配置されている。   A display area 10 h of the TFT substrate 10 that constitutes the display area 40 of the liquid crystal panel 100 is formed in an area in contact with the liquid crystal 50 of the TFT substrate 10. A pixel electrode 9a that forms a pixel in the display region 10h on the surface 10f side that faces the counter substrate 20 of the TFT substrate 10 and applies a driving voltage to the liquid crystal 50 together with the counter electrode 21 described later is a matrix. Arranged in a shape.

また、対向基板２０の表面２０ｆ側における液晶５０と接する領域に、液晶５０に画素電極９ａとともに駆動電圧を印加する対向電極２１が設けられており、対向電極２１の表示領域１０ｈに対向する領域に、液晶パネル１００の表示領域４０を構成する対向基板２０の表示領域２０ｈが構成されている。   Further, a counter electrode 21 for applying a driving voltage to the liquid crystal 50 together with the pixel electrode 9a is provided in a region in contact with the liquid crystal 50 on the surface 20f side of the counter substrate 20, and the counter electrode 21 is provided in a region facing the display region 10h. A display area 20h of the counter substrate 20 constituting the display area 40 of the liquid crystal panel 100 is configured.

ＴＦＴ基板１０の画素電極９ａ上に、ラビング処理が施された配向膜１６が設けられており、また、対向基板２０上の全面に渡って形成された対向電極２１上にも、ラビング処理が施された配向膜２６が設けられている。各配向膜１６、２６は、例えば、ポリイミド膜等の透明な有機膜からなる。   An alignment film 16 that has been subjected to a rubbing process is provided on the pixel electrode 9 a of the TFT substrate 10, and the rubbing process is also performed on the counter electrode 21 formed over the entire surface of the counter substrate 20. An alignment film 26 is provided. Each alignment film 16, 26 is made of a transparent organic film such as a polyimide film, for example.

また、ＴＦＴ基板１０の表示領域１０ｈにおいては、複数本の図示しない走査線と複数本の図示しないデータ線とが交差するように配線され、走査線とデータ線とで区画された領域に画素電極９ａがマトリクス状に配置される。そして、走査線とデータ線との各交差部分に対応して図示しない薄膜トランジスタ（ＴＦＴ）が設けられ、このＴＦＴ毎に画素電極９ａが電気的に接続されている。   Further, in the display area 10h of the TFT substrate 10, a plurality of scanning lines (not shown) and a plurality of data lines (not shown) are wired so as to cross each other, and a pixel electrode is formed in an area partitioned by the scanning lines and the data lines. 9a are arranged in a matrix. A thin film transistor (TFT) (not shown) is provided corresponding to each intersection of the scanning line and the data line, and the pixel electrode 9a is electrically connected to each TFT.

ＴＦＴは走査線のＯＮ信号によってオンとなり、これにより、データ線に供給された画像信号が画素電極９ａに供給される。この画素電極９ａと対向基板２０に設けられた対向電極２１との間の電圧が液晶５０に印加される。   The TFT is turned on by the ON signal of the scanning line, whereby the image signal supplied to the data line is supplied to the pixel electrode 9a. A voltage between the pixel electrode 9 a and the counter electrode 21 provided on the counter substrate 20 is applied to the liquid crystal 50.

対向基板２０に、液晶パネル１００の表示領域４０を規定する額縁としての遮光膜５３が設けられている。   A light shielding film 53 is provided on the counter substrate 20 as a frame that defines the display area 40 of the liquid crystal panel 100.

液晶５０がＴＦＴ基板１０と対向基板２０との間の空間に、既知の液晶注入方式で注入される場合、シール材５２は、シール材５２の１辺の一部において欠落して塗布されている。   When the liquid crystal 50 is injected into the space between the TFT substrate 10 and the counter substrate 20 by a known liquid crystal injection method, the sealing material 52 is missing and applied at a part of one side of the sealing material 52. .

シール材５２の欠落した箇所は、該欠落した箇所から貼り合わされたＴＦＴ基板１０及び対向基板２０との間の空間において、シール材５２により囲まれた領域に液晶５０を注入するための切り欠きである液晶注入口１０８を構成している。液晶注入口１０８は、液晶注入後、封止材１０９によって封止される。   The missing part of the sealing material 52 is a notch for injecting the liquid crystal 50 into the region surrounded by the sealing material 52 in the space between the TFT substrate 10 and the counter substrate 20 bonded from the missing part. A liquid crystal injection port 108 is configured. The liquid crystal injection port 108 is sealed with a sealing material 109 after the liquid crystal is injected.

ＴＦＴ基板１０の表面１０ｆにおいて、シール材５２の外側の領域に、ＴＦＴ基板１０の図示しないデータ線に画像信号を所定のタイミングで供給して該データ線を駆動するドライバであるデータ線駆動回路１０１と外部回路との接続のための外部接続端子部（以下、外部接続端子と称す）１０２とが、ＴＦＴ基板１０の一側面１０ｓ１に沿って設けられている。尚、外部接続端子１０２は、対向基板２０に設けられていても構わない。   On the surface 10f of the TFT substrate 10, a data line driving circuit 101, which is a driver for driving the data line by supplying an image signal to a data line (not shown) of the TFT substrate 10 in a region outside the sealing material 52 at a predetermined timing. An external connection terminal portion (hereinafter referred to as an external connection terminal) 102 for connection between the TFT substrate 10 and the external circuit is provided along one side surface 10s1 of the TFT substrate 10. The external connection terminal 102 may be provided on the counter substrate 20.

外部接続端子１０２に、液晶パネル１００を、後述するプロジェクタ１１００（図１０参照）等の電子機器と電気的に接続する、特定の長さを有する柔軟な薄板状基板であるフレキシブル配線基板（Flexible Printed Circuits、以下ＦＰＣと称す）１１２の一端が、例えば圧着により接続されている。ＦＰＣ１１２の他端がプロジェクタ１１００等の電子機器に接続されることにより、液晶パネル１００と電子機器とは電気的に接続される。   A flexible printed circuit board (Flexible Printed Circuit Board), which is a flexible thin board having a specific length, electrically connects the liquid crystal panel 100 to an electronic device such as a projector 1100 (see FIG. 10) to be described later. One end of 112 (circuits, hereinafter referred to as FPC) 112 is connected by, for example, crimping. By connecting the other end of the FPC 112 to an electronic device such as the projector 1100, the liquid crystal panel 100 and the electronic device are electrically connected.

また、外部接続端子１０２とＦＰＣ１１２の一端との接続を補強するため、ＦＰＣ１１２と、ＴＦＴ基板１０の一側面１０ｓ１との間には、図３に示すように、一側面１０ｓ１に沿って直線状に光硬化型接着剤７０が設けられている。   Further, in order to reinforce the connection between the external connection terminal 102 and one end of the FPC 112, a straight line is formed between the FPC 112 and one side surface 10s1 of the TFT substrate 10 along the one side surface 10s1 as shown in FIG. A photo-curing adhesive 70 is provided.

尚、図４に示すように、一側面１０ｓ１の表面粗さが、ＴＦＴ基板１０の他の側面１０ｓ２、１０ｓ３、１０ｓ４の表面粗さよりも粗くなるよう形成されることにより、一側面１０ｓ１に光散乱面９０が形成されている。尚、後述するが、他の側面１０ｓ３も、一側面１０ｓ１と同じ表面粗さとなるように形成されていても構わない。   In addition, as shown in FIG. 4, when the surface roughness of one side surface 10s1 is formed to be rougher than the surface roughness of the other side surfaces 10s2, 10s3, and 10s4 of the TFT substrate 10, light scattering is performed on the one side surface 10s1. A surface 90 is formed. As will be described later, the other side surface 10s3 may also be formed to have the same surface roughness as the one side surface 10s1.

一側面１０ｓ１に光散乱面９０が形成されていることにより、光硬化型接着剤７０は、接着性が向上されて一側面１０ｓ１に接着されている。また、光硬化型接着剤７０を硬化させる際に照射される、後述するＵＶ光１８８（図８参照）が、ＴＦＴ基板１０の一側面１０ｓ１から液晶５０に進入してしまうのを防止する。   Since the light scattering surface 90 is formed on the one side surface 10s1, the adhesive property of the photocurable adhesive 70 is improved, and the light curable adhesive 70 is bonded to the one side surface 10s1. In addition, UV light 188 (see FIG. 8), which will be described later, irradiated when the photocurable adhesive 70 is cured is prevented from entering the liquid crystal 50 from one side surface 10s1 of the TFT substrate 10.

ＴＦＴ基板１０の表面１０ｆにおいて、外部接続端子１０２が設けられたＴＦＴ基板１０の一側面１０ｓ１に隣接する他側面１０ｓ２、１０ｓ４に沿って、ＴＦＴ基板１０の図示しない走査線及びゲート電極に、走査信号を所定のタイミングで供給することにより、ゲート電極を駆動するドライバである走査線駆動回路１０３、１０４が設けられている。走査線駆動回路１０３、１０４は、シール材５２の内側の遮光膜５３に対向する位置において、ＴＦＴ基板１０の表面１０ｆ上に形成されている。   On the surface 10f of the TFT substrate 10, along the other side surfaces 10s2 and 10s4 adjacent to the one side surface 10s1 of the TFT substrate 10 on which the external connection terminals 102 are provided, scanning signals are sent to scanning lines and gate electrodes (not shown) of the TFT substrate 10. Are supplied at a predetermined timing, and scanning line driving circuits 103 and 104 which are drivers for driving the gate electrode are provided. The scanning line driving circuits 103 and 104 are formed on the surface 10 f of the TFT substrate 10 at a position facing the light shielding film 53 inside the sealing material 52.

また、ＴＦＴ基板１０の表面１０ｆ上に、データ線駆動回路１０１、走査線駆動回路１０３、１０４、外部接続端子１０２及び上下導通端子１０７を接続する配線１０５が、遮光膜５３の３辺に対向して設けられている。   Further, on the surface 10 f of the TFT substrate 10, the wiring 105 connecting the data line driving circuit 101, the scanning line driving circuits 103 and 104, the external connection terminal 102 and the vertical conduction terminal 107 faces the three sides of the light shielding film 53. Is provided.

上下導通端子１０７は、シール材５２のコーナー部の４箇所のＴＦＴ基板１０上に形成されている。そして、ＴＦＴ基板１０と対向基板２０相互間に、下端が上下導通端子１０７に接触し上端が対向電極２１に接触する上下導通材１０６が設けられており、該上下導通材１０６によって、ＴＦＴ基板１０と対向基板２０との間で電気的な導通がとられている。   The vertical conduction terminals 107 are formed on the four TFT substrates 10 at the corners of the sealing material 52. Between the TFT substrate 10 and the counter substrate 20, a vertical conductive material 106 having a lower end in contact with the vertical conductive terminal 107 and an upper end in contact with the counter electrode 21 is provided. And the counter substrate 20 are electrically connected.

また、ＴＦＴ基板１０の裏面１０ｒに、第３の基板であるカバーガラス３０が貼着されている。同様に、対向基板２０の裏面２０ｒにも、第３の基板であるカバーガラス３１が貼着されている。   A cover glass 30 as a third substrate is attached to the back surface 10r of the TFT substrate 10. Similarly, a cover glass 31 that is a third substrate is also attached to the back surface 20r of the counter substrate 20.

各カバーガラス３０、３１は、ＴＦＴ基板１０及び対向基板２０の各裏面１０ｒ、２０ｒの少なくとも各表示領域１０ｈ、２０ｈに塵埃等が付着するのを防止するとともに、塵埃等を、各裏面１０ｒ、２０ｒから離間させてデフォーカスすることで、塵埃等の像を目立たなくする機能を有する。   The cover glasses 30 and 31 prevent dust and the like from adhering to at least the display areas 10h and 20h of the back surfaces 10r and 20r of the TFT substrate 10 and the counter substrate 20, respectively, and remove the dust and the like from the back surfaces 10r and 20r. It has a function of making an image such as dust inconspicuous by defocusing it away from the center.

カバーガラス３０のＴＦＴ基板１０の一側面１０ｓ１に沿った一側面３０ｓ１に、図４に示すように、一側面３０ｓ１の表面粗さが、カバーガラス３０の他の側面３０ｓ２、３０ｓ３、３０ｓ４の表面粗さよりも粗くなるよう形成されることにより、光散乱面９０が形成されている。尚、後述するが、他の側面３０ｓ３も、一側面３０ｓ１と同じ表面粗さとなるように形成されていても構わない。   On one side surface 30s1 along one side surface 10s1 of the TFT substrate 10 of the cover glass 30, as shown in FIG. 4, the surface roughness of the one side surface 30s1 is the surface roughness of the other side surfaces 30s2, 30s3, 30s4 of the cover glass 30. The light scattering surface 90 is formed by being formed to be rougher than the thickness. As will be described later, the other side surface 30s3 may also be formed to have the same surface roughness as the one side surface 30s1.

一側面３０ｓ１に光散乱面９０が形成されていることにより、光硬化型接着剤７０を硬化させる際に照射される、後述するＵＶ光１８８（図８参照）が、カバーガラス３０の一側面３０ｓ１から液晶５０に進入してしまうのを防止する。   Since the light scattering surface 90 is formed on the one side surface 30 s 1, UV light 188 (see FIG. 8), which will be described later, is emitted when the photocurable adhesive 70 is cured, and one side surface 30 s 1 of the cover glass 30. Is prevented from entering the liquid crystal 50.

次に、このように構成された液晶パネルの製造方法の一部を、図５〜図７を用いて示す。図５は、第１の大板基板が貼着されたＴＦＴ基板が複数構成された第２の大板基板に対し、ＴＦＴ基板毎に、カバーガラスが貼着されたチップ状の対向基板が複数貼着された構造体を示す斜視図、図６は、図５中のVI-VI線に沿う構造体を、レーザ照射装置とともに示す部分断面図、図７は、図６の第１の大板基板及び第２の大板基板の分断予定位置に、改質層が形成された状態を示す部分拡大断面図である。   Next, a part of a manufacturing method of the liquid crystal panel configured as described above will be described with reference to FIGS. FIG. 5 shows a plurality of chip-like counter substrates each having a cover glass attached to each TFT substrate with respect to a second large substrate having a plurality of TFT substrates to which the first large substrate is attached. FIG. 6 is a partial cross-sectional view showing the structure along the line VI-VI in FIG. 5 together with the laser irradiation device, and FIG. 7 is the first large plate of FIG. It is a partial expanded sectional view which shows the state in which the modified layer was formed in the parting plan position of a board | substrate and a 2nd large board | substrate.

尚、以下、液晶パネルの製造方法は、第１の大板基板が貼着されたＴＦＴ基板が複数構成された第２の大板基板に対し、ＴＦＴ基板毎に、カバーガラスが貼着されたチップ状の対向基板が複数貼着された構造体から、分断予定線に沿ってレーザ光により分断して複数の液晶パネルを形成する工程を示す。その他の液晶パネルの製造方法は、周知であるため、その説明は省略する。   In addition, hereinafter, the manufacturing method of the liquid crystal panel has a cover glass attached to each TFT substrate with respect to the second large substrate including a plurality of TFT substrates to which the first large substrate is attached. A process of forming a plurality of liquid crystal panels by dividing a structure body to which a plurality of chip-like counter substrates are attached along a planned dividing line with a laser beam is shown. Since other methods of manufacturing the liquid crystal panel are well known, description thereof is omitted.

先ず、図５に示すように、周知の工程を経て、表面１０ｆに所定のパターンを有する上述した各種薄膜が積層されて形成されたＴＦＴ基板１０が複数構成された第２の大板基板である大板基板１１０の表面１１０ｆに対し、ＴＦＴ基板１０毎に、上述したシール材５２を介して、チップ状のカバーガラス３１が貼着された表面２０ｆに上述した各種薄膜が積層されたチップ状の対向基板２０をそれぞれ貼り合わせ、その後、各ＴＦＴ基板１０と各対向基板２０との間に、液晶５０をそれぞれ注入した後、各液晶注入口１０８を、封止材１０９によってそれぞれ封止し、大板基板１１０の表面１１０ｆとは反対側の裏面１１０ｒに、大板基板１１０よりも若干外形が小さめな第１の大板基板である大板カバーガラス基板３００を貼着して、図５に示す構造体４００を形成する。   First, as shown in FIG. 5, it is a second large substrate in which a plurality of TFT substrates 10 formed by laminating the above-described various thin films having a predetermined pattern on the surface 10f through a known process are formed. For each TFT substrate 10 with respect to the surface 110f of the large substrate 110, the chip-shaped thin film described above is laminated on the surface 20f on which the chip-shaped cover glass 31 is bonded via the sealing material 52 described above. The counter substrates 20 are bonded to each other, and thereafter, the liquid crystal 50 is injected between the TFT substrates 10 and the counter substrates 20, respectively. Then, the liquid crystal injection ports 108 are respectively sealed with the sealing material 109. A large cover glass substrate 300, which is a first large substrate having a slightly smaller outer shape than the large substrate 110, is attached to the back surface 110r opposite to the front surface 110f of the plate substrate 110, and FIG. To form the structure 400 shown.

次いで、構造体４００から、複数の液晶パネル１００を分断する分断工程を行う。具体的には、大板基板１１０及び大板カバーガラス基板３００の分断予定位置Ｂに対し、図６に示すように、レーザ照射装置８０を用いてレーザ光Ｌを照射する。   Next, a dividing step of dividing the plurality of liquid crystal panels 100 from the structure 400 is performed. Specifically, as shown in FIG. 6, the laser beam L is irradiated to the planned division position B of the large plate substrate 110 and the large plate cover glass substrate 300 using a laser irradiation device 80.

レーザ光Ｌの照射は、図５に示すように、分断予定位置Ｂに対して、Ｘ方向Ｙ方向に走査して行うとともに、高さ方向Ｚに走査して、図７に示すように分断予定位置Ｂにおいて、高さ方向Ｚに形成した複数のボイド１４１から、改質層１４０、１４２を形成する。   As shown in FIG. 5, the irradiation of the laser beam L is performed by scanning in the X direction and the Y direction with respect to the planned division position B, and in the height direction Z, as shown in FIG. At the position B, the modified layers 140 and 142 are formed from the plurality of voids 141 formed in the height direction Z.

また、このレーザ光Ｌの照射は、分断予定位置Ｂにおいて、図７に示すように、分断後、液晶パネル１００のＴＦＴ基板１０の一側面１０ｓ１、大板カバーガラス基板３００の一側面３０ｓ１となる位置に形成する改質層１４０の密度が、液晶パネル１００のＴＦＴ基板１０の他側面１０ｓ２、１０ｓ３、１０ｓ４、大板カバーガラス基板３００の他側面３０ｓ２、３０ｓ３、３０ｓ４となる位置に形成する改質層１４２の密度よりも大きくなるように、一側面１０ｓ１、３０ｓ１に対して照射するレーザ光Ｌの照射エネルギを、他側面１０ｓ２〜１０ｓ４、３０ｓ２〜３０ｓ４に照射するレーザ光Ｌの照射エネルギよりも小さくして、照射回数を増やして行う。即ち照射条件を変えて行う。その結果、一側面１０ｓ１、３０ｓ１には、他側面１０ｓ２〜１０ｓ４、３０ｓ２〜３０ｓ４よりも、ボイド１４１が多く形成され、改質層１４０の密度が、改質層１４２の密度よりも大きくなる。   Further, as shown in FIG. 7, the irradiation with the laser light L is divided into one side surface 10 s 1 of the TFT substrate 10 of the liquid crystal panel 100 and one side surface 30 s 1 of the large cover glass substrate 300 after the division, as shown in FIG. The modified layer 140 is formed at a position where the density of the modified layer 140 formed at the position becomes the other side surfaces 10 s 2, 10 s 3, 10 s 4 of the TFT substrate 10 of the liquid crystal panel 100 and the other side surfaces 30 s 2, 30 s 3, 30 s 4 of the large cover glass substrate 300. The irradiation energy of the laser light L applied to the one side surface 10s1 and 30s1 is smaller than the irradiation energy of the laser light L applied to the other side surfaces 10s2 to 10s4 and 30s2 to 30s4 so as to be larger than the density of the layer 142. Then, increase the number of irradiations. That is, the irradiation conditions are changed. As a result, more voids 141 are formed on the one side surface 10s1 and 30s1 than on the other side surfaces 10s2 to 10s4 and 30s2 to 30s4, and the density of the modified layer 140 becomes higher than the density of the modified layer 142.

尚、この際、他側面１０ｓ３、３０ｓ３の改質層１４２の密度が、一側面１０ｓ１、３０ｓ１の改質層１４０の密度と同じになる場合がある。これは、構造体４００から複数の液晶パネル１００を分断した際、図５中、Ｘ方向に隣り合っていたＴＦＴ基板１０、カバーガラス３０は、分断後、一側面１０ｓ１、３０ｓ１と他側面１０ｓ３、３０ｓ３とが一致するためである。   At this time, the density of the modified layer 142 on the other side surfaces 10s3 and 30s3 may be the same as the density of the modified layer 140 on the one side surface 10s1 and 30s1. This is because when the plurality of liquid crystal panels 100 are divided from the structure 400, the TFT substrate 10 and the cover glass 30 that are adjacent in the X direction in FIG. 5 are divided into one side surface 10s1, 30s1 and the other side surface 10s3. This is because 30s3 matches.

レーザ光Ｌの照射後、例えば作業者が、分断予定位置Ｂに沿って構造体４００に分断力を付与すると、複数の液晶パネル１００が分断予定位置Ｂにおいて形成した改質層１４０、１４２に沿って分断され、その結果、複数の液晶パネル１００が形成される。   After irradiation with the laser light L, for example, when an operator applies a dividing force to the structure 400 along the planned dividing position B, the modified liquid crystal panels 100 are formed along the modified layers 140 and 142 formed at the planned dividing position B. As a result, a plurality of liquid crystal panels 100 are formed.

その結果、上述したように、各液晶パネル１００のＴＦＴ基板１０の一側面１０ｓ１、カバーガラス３０の一側面３０ｓ１に、改質層１４０による光散乱面９０が形成される。また、上述した理由により、ＴＦＴ基板１０の他側面１０ｓ３、カバーガラス３０の他側面３０ｓ３の一部にも、改質層１４０による光散乱面９０が形成される。   As a result, as described above, the light scattering surface 90 by the modified layer 140 is formed on the one side surface 10s1 of the TFT substrate 10 and the one side surface 30s1 of the cover glass 30 of each liquid crystal panel 100. For the above-described reason, the light scattering surface 90 by the modified layer 140 is also formed on the other side surface 10 s 3 of the TFT substrate 10 and a part of the other side surface 30 s 3 of the cover glass 30.

尚、一側面１０ｓ１、３０ｓ１は、他側面１０ｓ２〜１０ｓ４、３０ｓ２〜３０ｓ４よりも、ボイド１４１からなる改質層１４０の数が多く形成されたことにより、表面粗さが粗く形成されている。また、上述した理由により、他側面１０ｓ３、３０ｓ３の表面粗さが、一側面１０ｓ１、３０ｓ１の表面粗さと同じに形成される場合がある。   The one side surface 10s1, 30s1 is formed to have a rougher surface roughness because the number of the modified layers 140 including the void 141 is larger than those of the other side surfaces 10s2 to 10s4, 30s2 to 30s4. Further, for the reasons described above, the surface roughness of the other side surfaces 10s3 and 30s3 may be formed to be the same as the surface roughness of the one side surface 10s1 and 30s1.

次に、このようにして形成した液晶パネル１００のＴＦＴ基板１０の外部接続端子１０２に、ＦＰＣ１１２の一端を、圧着等により接続した後、該接続を補強するため、光硬化型接着材を塗布し、硬化させる工程について、図８、図９を用いて説明する。   Next, after connecting one end of the FPC 112 to the external connection terminal 102 of the TFT substrate 10 of the liquid crystal panel 100 thus formed by pressure bonding or the like, a photo-curing adhesive is applied to reinforce the connection. The curing process will be described with reference to FIGS.

図８は、液晶パネルに接続されるＦＰＣの接続箇所の補強に用いる光硬化型接着剤に、ＵＶ光を照射している状態を示す部分断面図、図９は、従来の液晶パネルに接続されるＦＰＣの接続箇所の補強に用いる光硬化型接着剤に、ＵＶ光を照射している状態を示す部分断面図である。   FIG. 8 is a partial cross-sectional view showing a state in which UV light is applied to a photocurable adhesive used to reinforce a connection portion of an FPC connected to a liquid crystal panel, and FIG. It is a fragmentary sectional view which shows the state which is irradiating UV light to the photocurable adhesive used for reinforcement of the connection location of FPC.

先ず、図８に示すように、液晶パネル１００のＴＦＴ基板１０の外部接続端子１０２に、圧着等によって、ＦＰＣ１１２の一端を電気的に接続した後、ＦＰＣ１１２と、ＴＦＴ基板１０の一側面１０ｓ１とを光硬化型接着剤７０にて接着する。この際、図３に示すように、光硬化型接着剤７０は、一側面１０ｓ１に沿って直線状に塗布する。   First, as shown in FIG. 8, after one end of the FPC 112 is electrically connected to the external connection terminal 102 of the TFT substrate 10 of the liquid crystal panel 100 by crimping or the like, the FPC 112 and one side surface 10s1 of the TFT substrate 10 are connected. Bonding is performed with a photocurable adhesive 70. At this time, as shown in FIG. 3, the photocurable adhesive 70 is applied linearly along the one side surface 10s1.

次いで、図３に示すように直線状に塗布した光硬化型接着剤７０に沿った形状の直線状の孔９６が形成されたスリット９５を、平面視した状態で、孔９６が光硬化型接着剤７０に対向するよう、光硬化型接着剤７０の上方に位置させた後、スリット９５の上方から、光照射装置３４０を用いて、光、例えばＵＶ光１８８を、孔９６を介して、光硬化型接着剤７０に照射する。その結果、光硬化型接着剤７０は、硬化し、ＦＰＣ１１２の一端と外部接続端子１０２との接続が補強される。   Next, as shown in FIG. 3, the hole 96 is photo-curing adhesive in a state where the slit 95 in which the linear hole 96 having a shape along the photo-curing adhesive 70 applied linearly is formed is viewed in plan view. After being positioned above the photocurable adhesive 70 so as to face the agent 70, light, for example, UV light 188 is emitted from above the slit 95 through the hole 96 using the light irradiation device 340. Irradiate the curable adhesive 70. As a result, the photocurable adhesive 70 is cured and the connection between one end of the FPC 112 and the external connection terminal 102 is reinforced.

尚、この光照射装置３４０からのＵＶ光１８８の照射の際、従来の液晶パネル５００であれば、図９に示すようにＵＶ光１８８は、カバーガラス３０の一側面３０ｓ１から液晶５０内に進入してしまうが、本実施の形態における液晶パネル１００は、カバーガラス３０の一側面３０ｓ１、及びＴＦＴ基板１０の一側面１０ｓ１に、光散乱面９０が形成されていることから、ＵＶ光１８８は、図８に示すように、光散乱面９０により、多方向に光散乱されるため、一側面１０ｓ１、３０ｓ１から液晶５０に進入してしまうことがない。   In the case of irradiation with the UV light 188 from the light irradiation device 340, if the conventional liquid crystal panel 500 is used, the UV light 188 enters the liquid crystal 50 from one side 30s1 of the cover glass 30 as shown in FIG. However, in the liquid crystal panel 100 according to the present embodiment, the light scattering surface 90 is formed on the one side surface 30s1 of the cover glass 30 and the one side surface 10s1 of the TFT substrate 10. As shown in FIG. 8, light is scattered in multiple directions by the light scattering surface 90, so that the liquid crystal 50 does not enter from one side surface 10s1, 30s1.

このように、本実施の形態においては、液晶パネル１００の外部接続端子１０２に沿ったＴＦＴ基板１０の一側面１０ｓ１、カバーガラス３０の一側面３０ｓ１に、表面粗さがＴＦＴ基板１０の他の側面１０ｓ２〜１０ｓ４、カバーガラス３０の他の側面３０ｓ２〜３０ｓ４よりも粗い光散乱面９０が形成されていると示した。   As described above, in the present embodiment, the surface roughness on the one side surface 10 s 1 of the TFT substrate 10 and the one side surface 30 s 1 of the cover glass 30 along the external connection terminal 102 of the liquid crystal panel 100 is the other side surface of the TFT substrate 10. 10s2 to 10s4, the light scattering surface 90 rougher than the other side surfaces 30s2 to 30s4 of the cover glass 30 is formed.

このことによれば、外部接続端子１０２に電気的に接続されたＦＰＣ１１２の外部接続端子１０２への接続を補強するため、外部接続端子１０２とＴＦＴ基板１０の一側面１０ｓ１とを光硬化型接着剤７０で接着し、光硬化型接着剤７０にＵＶ光１８８を照射して硬化させる際、ＵＶ光１８８がカバーガラス３０及びＴＦＴ基板１０の各一側面３０ｓ１、１０ｓ１から液晶５０内に進入して液晶分子の配列を乱し、表示不良が発生してしまうことを、各一側面３０ｓ１、１０ｓ１に形成された光散乱面９０によって、簡単かつ確実に防止することができる。   According to this, in order to reinforce the connection of the FPC 112 electrically connected to the external connection terminal 102 to the external connection terminal 102, the external connection terminal 102 and the one side surface 10s1 of the TFT substrate 10 are bonded with a photo-curing adhesive. 70, and when the photocurable adhesive 70 is irradiated with UV light 188 to be cured, the UV light 188 enters the liquid crystal 50 from the respective side surfaces 30s1, 10s1 of the cover glass 30 and the TFT substrate 10 and enters the liquid crystal. The light scattering surface 90 formed on each of the side surfaces 30 s 1 and 10 s 1 can easily and surely prevent disturbance of the molecular arrangement and display failure.

また、ＴＦＴ基板１０の一側面１０ｓ１にも光散乱面９０が形成されていることにより、ＴＦＴ基板１０の一側面１０ｓ１に対する光硬化型接着剤７０の接着性が向上する。   Further, since the light scattering surface 90 is also formed on the one side surface 10s1 of the TFT substrate 10, the adhesion of the photocurable adhesive 70 to the one side surface 10s1 of the TFT substrate 10 is improved.

さらに、本実施の形態においては、大板基板１１０及び大板カバーガラス基板３００の分断予定位置Ｂにレーザ光Ｌを照射して、複数のボイド１４１からなる改質層１４０、１４２を形成し、改質層１４０により、ＴＦＴ基板１０の一側面１０ｓ１、カバーガラス３０の一側面３０ｓ１に形成される光散乱面９０を形成すると示した。   Furthermore, in the present embodiment, the laser beam L is irradiated to the division position B of the large substrate 110 and the large cover glass substrate 300 to form the modified layers 140 and 142 composed of a plurality of voids 141, It has been shown that the light scattering surface 90 formed on one side surface 10s1 of the TFT substrate 10 and one side surface 30s1 of the cover glass 30 is formed by the modified layer 140.

具体的には、改質層１４０に、改質層１４２よりもボイド１４１を複数形成することにより、改質層１４０の密度を改質層１４２の密度よりも大きく形成することによって、ＴＦＴ基板１０の一側面１０ｓ１、カバーガラス３０の一側面３０ｓ１を、ＴＦＴ基板１０の他側面１０ｓ２〜１０ｓ４、カバーガラス３０の他側面３０ｓ２〜３０ｓ４よりも表面粗さを粗く形成して、ＴＦＴ基板１０の一側面１０ｓ１、カバーガラス３０の一側面３０ｓ１に改質層１４０によって光散乱面９０を形成すると示した。   Specifically, by forming a plurality of voids 141 in the modified layer 140 rather than the modified layer 142, the density of the modified layer 140 is made larger than the density of the modified layer 142, so that the TFT substrate 10. One side surface 10 s 1 of the cover glass 30 and one side surface 30 s 1 of the cover glass 30 are formed to have a rougher surface roughness than the other side surfaces 10 s 2 to 10 s 4 of the TFT substrate 10 and the other side surfaces 30 s 2 to 30 s 4 of the cover glass 30. It is shown that the light scattering surface 90 is formed by the modified layer 140 on one side surface 30s1 of the cover glass 30.

このことによれば、分断工程において、カバーガラス３０及びＴＦＴ基板１０の各一側面３０ｓ１、１０ｓ１を構成する改質層１４０の密度が、他の側面３０ｓ２〜３０ｓ４、１０ｓ２〜１０ｓ４の改質層１４２の密度よりも大きくなるよう一側面１０ｓ１、３０ｓ１にレーザ光Ｌを照射して一側面１０ｓ１、３０ｓ１に光散乱面９０を形成することにより、分断工程において、分断の際に各一側面１０ｓ１、３０ｓ１に光散乱面９０を形成することができることから、工程数を増やすことなく、簡単かつ確実に各一側面１０ｓ１、３０ｓ１に光散乱面９０を形成することができる。   According to this, in the dividing step, the density of the modified layer 140 constituting each side surface 30s1, 10s1 of the cover glass 30 and the TFT substrate 10 is the modified layer 142 of the other side surfaces 30s2 to 30s4, 10s2 to 10s4. The side surfaces 10s1 and 30s1 are irradiated with the laser light L to form the light scattering surface 90 on the side surfaces 10s1 and 30s1, so that the side surfaces 10s1 and 30s1 are separated at the time of division in the dividing step. In addition, since the light scattering surface 90 can be formed, the light scattering surface 90 can be easily and reliably formed on each of the side surfaces 10s1 and 30s1 without increasing the number of steps.

尚、以下、変形例を示す。本実施の形態においては、光散乱面９０は、ＴＦＴ基板１０の一側面１０ｓ１及びカバーガラス３０の一側面３０ｓ１に形成されていると示した。   Hereinafter, modifications will be described. In the present embodiment, it is shown that the light scattering surface 90 is formed on one side surface 10s1 of the TFT substrate 10 and one side surface 30s1 of the cover glass 30.

これに限らず、ＴＦＴ基板１０の一側面１０ｓ１が、光硬化型接着剤７０で覆われていれば、液晶５０へのＵＶ光１８８の進入は、カバーガラス３０の一側面３０ｓ１のみとなることから、光硬化型接着剤７０の一側面１０ｓ１への接着性の向上を無視すれば、カバーガラス３０の一側面３０ｓ１のみに光散乱面９０が形成されていても構わない。   Not limited to this, if one side surface 10 s 1 of the TFT substrate 10 is covered with the photocurable adhesive 70, the UV light 188 enters the liquid crystal 50 only from one side surface 30 s 1 of the cover glass 30. If the improvement in the adhesiveness to the one side surface 10s1 of the photocurable adhesive 70 is ignored, the light scattering surface 90 may be formed only on the one side surface 30s1 of the cover glass 30.

さらに、本実施の形態においては、ＴＦＴ基板１０の一側面１０ｓ１及びカバーガラス３０の一側面３０ｓ１への光散乱面９０の形成は、各一側面１０ｓ１、３０ｓ１に対するレーザ光Ｌの照射条件を、ＴＦＴ基板２０の他側面１０ｓ２〜１０ｓ４、カバーガラス３０の他側面３０ｓ２〜３０ｓ４に対するレーザ光Ｌの照射条件と変えてレーザ光Ｌを照射することにより行うと示した。   Further, in the present embodiment, the light scattering surface 90 is formed on the one side surface 10s1 of the TFT substrate 10 and the one side surface 30s1 of the cover glass 30 by changing the irradiation condition of the laser light L to each of the one side surfaces 10s1 and 30s1. It was shown that the irradiation was performed by irradiating the laser beam L in place of the irradiation conditions of the laser beam L to the other side surfaces 10s2 to 10s4 of the substrate 20 and the other side surfaces 30s2 to 30s4 of the cover glass 30.

これに限らず、工程数が増えてしまうことを無視すれば、全側面に対して同じ照射条件にてレーザ光Ｌを照射して、構造体４００から複数の液晶パネル１００を分断した後、ＴＦＴ基板１０の一側面１０ｓ１及びカバーガラス３０の一側面３０ｓ１に対して、表面を荒らす光散乱処理を行って、光散乱面９０を形成しても、本実施の形態と同様の効果を得ることができる。   If the increase in the number of processes is not limited to this, and if the increase in the number of processes is ignored, the laser light L is irradiated on the entire side surface under the same irradiation conditions, and the plurality of liquid crystal panels 100 are divided from the structure 400, and then the TFT Even if the light scattering surface 90 is formed by roughening the surface of the one side surface 10s1 of the substrate 10 and the one side surface 30s1 of the cover glass 30, the same effect as that of the present embodiment can be obtained. it can.

また、液晶パネルは、上述の図示例にのみ限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々変更を加え得ることは勿論である。例えば、上述した液晶パネルは、ＴＦＴ（薄膜トランジスタ）等のアクティブ素子（能動素子）を用いたアクティブマトリクス方式の液晶表示モジュールを例に挙げて説明したが、これに限らず、ＴＦＤ（薄膜ダイオード）等のアクティブ素子（能動素子）を用いたアクティブマトリクス方式の液晶表示モジュールであっても構わない。   Further, the liquid crystal panel is not limited to the above-described illustrated examples, and various modifications can be made without departing from the scope of the present invention. For example, the liquid crystal panel described above has been described by taking an active matrix type liquid crystal display module using an active element (active element) such as a TFT (thin film transistor) as an example. However, the present invention is not limited to this, and a TFD (thin film diode) or the like. An active matrix type liquid crystal display module using the active element (active element) may be used.

さらに、本実施の形態においては、電気光学装置は、液晶装置を例に挙げて説明したが、本発明はこれに限定されず、エレクトロルミネッセンス装置、特に、有機エレクトロルミネッセンス装置、無機エレクトロルミネッセンス装置等や、プラズマディスプレイ装置、ＦＥＤ（Ｆｉｅｌｄ Ｅｍｉｓｓｉｏｎ Ｄｉｓｐｌａｙ）装置、ＳＥＤ(Ｓｕｒｆａｃｅ−Ｃｏｎｄｕｃｔｉｏｎ Ｅｌｅｃｔｒｏｎ−Ｅｍｉｔｔｅｒ Ｄｉｓｐｌａｙ)装置、ＬＥＤ（発光ダイオード）表示装置、電気泳動表示装置、薄型のブラウン管または液晶シャッター等を用いた装置などの各種の電気光学装置に適用できる。   Further, in the present embodiment, the electro-optical device has been described by taking a liquid crystal device as an example, but the present invention is not limited to this, and an electroluminescence device, in particular, an organic electroluminescence device, an inorganic electroluminescence device, or the like. A device using a plasma display device, a field emission display (FED) device, a surface-conduction electron-emitter display (SED) device, an LED (light emitting diode) display device, an electrophoretic display device, a thin cathode ray tube, or a liquid crystal shutter It can be applied to various electro-optical devices such as.

また、電気光学装置は、半導体基板に素子を形成する表示用デバイス、例えばＬＣＯＳ（Liquid Crystal On Silicon）等であっても構わない。ＬＣＯＳでは、素子基板として単結晶シリコン基板を用い、画素や周辺回路に用いるスイッチング素子としてトランジスタを単結晶シリコン基板に形成する。また、画素には、反射型の画素電極を用い、画素電極の下層に画素の各素子を形成する。   The electro-optical device may be a display device that forms elements on a semiconductor substrate, for example, LCOS (Liquid Crystal On Silicon). In LCOS, a single crystal silicon substrate is used as an element substrate, and a transistor is formed on a single crystal silicon substrate as a switching element used for a pixel or a peripheral circuit. In addition, a reflective pixel electrode is used for the pixel, and each element of the pixel is formed below the pixel electrode.

また、電気光学装置は、片側の基板の同一層に、一対の電極が形成される表示用デバイス、例えばＩＰＳ（In-Plane Switching）や、片側の基板において、絶縁膜を介して一対の電極が形成される表示用デバイスＦＦＳ（Fringe Field Switching）等であっても構わない。   In addition, the electro-optical device has a display device in which a pair of electrodes are formed on the same layer of a substrate on one side, for example, IPS (In-Plane Switching), or a pair of electrodes on one substrate via an insulating film. It may be a display device FFS (Fringe Field Switching) formed.

さらに、本発明の液晶装置が用いられる電子機器としては、投写型表示装置、具体的には、プロジェクタが挙げられる。図１０は、図１の液晶パネルを具備する液晶装置が３つ配設されたプロジェクタの構成を示す図である。   Furthermore, examples of the electronic apparatus in which the liquid crystal device of the present invention is used include a projection display device, specifically, a projector. FIG. 10 is a diagram showing a configuration of a projector in which three liquid crystal devices including the liquid crystal panel of FIG. 1 are arranged.

同図に示すように、プロジェクタ１１００に、液晶パネル１００を具備する液晶装置は、各々ＲＧＢ用のライトバルブとして、例えば３つ（１００Ｒ’，１００Ｇ’，１００Ｂ’）配設されている。   As shown in the figure, the projector 1100 includes, for example, three (100R ′, 100G ′, 100B ′) liquid crystal devices each including the liquid crystal panel 100 as RGB light valves.

プロジェクタ１１００では、メタルハライドランプ等の白色光源のランプユニット１１０２から投写光が発せされると、３枚のミラー１１０６及び２枚のダイクロイックミラー１１０８によって、ＲＧＢの３原色に対応する光成分Ｒ、Ｇ、Ｂに分けられ、各色に対応するライトバルブ１００Ｒ’，１００Ｇ’，１００Ｂ’に各々導かれる。   In the projector 1100, when projection light is emitted from a lamp unit 1102 of a white light source such as a metal halide lamp, light components R, G, and R corresponding to the three primary colors of RGB are obtained by three mirrors 1106 and two dichroic mirrors 1108. B is divided into light valves 100R ′, 100G ′, and 100B ′ corresponding to the respective colors.

この際、特にＢ光は、長い光路による光損失を防ぐため、入射レンズ１１２２、リレーレンズ１１２３及び出射レンズ１１２４からなるリレーレンズ系１１２１を介して導かれる。   At this time, in particular, the B light is guided through a relay lens system 1121 including an incident lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss due to a long optical path.

そして、ライトバルブ１００Ｒ’，１００Ｇ’，１００Ｂ’により各々変調された３原色に対応する光成分は、ダイクロイックプリズム１１１２により再度合成された後、投写レンズ１１１４を介してスクリーン１１２０にカラー画像として投写される。 The light components corresponding to the three primary colors modulated by the light valves 100R ′, 100G ′, and 100B ′ are synthesized again by the dichroic prism 1112 and then projected as a color image on the screen 1120 via the projection lens 1114. The

本実施の形態の液晶装置における液晶パネルを薄板状基板とともに示す平面図。The top view which shows the liquid crystal panel in the liquid crystal device of this Embodiment with a thin plate-shaped board | substrate. 図１中のII-II線に沿って切断した液晶パネルを薄板状基板とともに示す断面図。Sectional drawing which shows the liquid crystal panel cut | disconnected along the II-II line | wire in FIG. 1 with a thin plate-shaped board | substrate. 図１の液晶パネルの背面側を、外部接続端子が設けられた部位を中心に薄板状基板とともに示す部分背面図。The partial rear view which shows the back side of the liquid crystal panel of FIG. 1 with a thin plate-shaped board | substrate centering on the site | part in which the external connection terminal was provided. 図２のＴＦＴ基板及びカバーガラスの一側面に形成された光散乱面を拡大して示す部分断面図。The fragmentary sectional view which expands and shows the light-scattering surface formed in the TFT substrate and cover glass of FIG. 第１の大板基板が貼着されたＴＦＴ基板が複数構成された第２の大板基板に対し、ＴＦＴ基板毎に、カバーガラスが貼着されたチップ状の対向基板が複数貼着された構造体を示す斜視図。For each TFT substrate, a plurality of chip-like counter substrates each having a cover glass attached are attached to the second large substrate having a plurality of TFT substrates to which the first large substrate is attached. The perspective view which shows a structure. 図５中のVI-VI線に沿う構造体を、レーザ照射装置とともに示す部分断面図。The fragmentary sectional view which shows the structure in alignment with the VI-VI line in FIG. 5 with a laser irradiation apparatus. 図６の第１の大板基板及び第２の大板基板の分断予定位置に、改質層が形成された状態を示す部分拡大断面図。FIG. 7 is a partial enlarged cross-sectional view showing a state in which a modified layer is formed at a planned division position of the first large plate substrate and the second large plate substrate in FIG. 6. 液晶パネルに接続されるＦＰＣの接続箇所の補強に用いる光硬化型接着剤に、ＵＶ光を照射している状態を示す部分断面図。The fragmentary sectional view which shows the state which is irradiating UV light to the photocurable adhesive agent used for reinforcement of the connection location of FPC connected to a liquid crystal panel. 従来の液晶パネルに接続されるＦＰＣの接続箇所の補強に用いる光硬化型接着剤に、ＵＶ光を照射している状態を示す部分断面図。The fragmentary sectional view which shows the state which is irradiating UV light to the photocurable adhesive used for reinforcement of the connection location of FPC connected to the conventional liquid crystal panel. 図１の液晶パネルを具備する液晶装置が３つ配設されたプロジェクタの構成を示す図。FIG. 2 is a diagram illustrating a configuration of a projector in which three liquid crystal devices including the liquid crystal panel of FIG. 1 are arranged.

符号の説明Explanation of symbols

１０…ＴＦＴ基板（第１の基板）、１０ｆ…表面（対向面）、１０ｓ１…一側面、２０…対向基板（第２の基板）、３０…カバーガラス（第３の基板）、３０ｓ１…一側面、５０…液晶（電気光学物質）、７０…光硬化型接着剤、９０…光散乱面、１００…液晶パネル（電気光学パネル）、１０２…外部接続端子（外部接続端子部）、１１０…大板基板（第２の大板基板）、１１２…ＦＰＣ（薄板状基板）、１４０…改質層、１４２…改質層、３００…大板カバーガラス基板（第１の大板基板）、１１００…プロジェクタ（電子機器）、Ｌ…レーザ光。   DESCRIPTION OF SYMBOLS 10 ... TFT substrate (1st board | substrate), 10f ... Surface (opposite surface), 10s1 ... One side surface, 20 ... Counter substrate (2nd substrate), 30 ... Cover glass (3rd substrate), 30s1 ... One side surface DESCRIPTION OF SYMBOLS 50 ... Liquid crystal (electro-optical substance), 70 ... Light curable adhesive, 90 ... Light scattering surface, 100 ... Liquid crystal panel (electro-optical panel), 102 ... External connection terminal (external connection terminal part), 110 ... Large plate Substrate (second large substrate), 112 ... FPC (thin plate substrate), 140 ... modified layer, 142 ... modified layer, 300 ... large cover glass substrate (first large plate substrate), 1100 ... projector (Electronic equipment), L ... laser light.

Claims (10)

第１の基板と該第１の基板に対向する前記第１の基板よりも外形が小さい第２の基板との間に電気光学物質が介在されるとともに、少なくとも前記第１の基板に第３の基板が貼着された電気光学パネルを具備する電気光学装置であって、
前記第１の基板の前記第２の基板が貼り合わされた領域外における前記第２の基板への対向面において、平面視した状態で前記電気光学パネルの一側面に沿って設けられた外部接続端子部と、
前記外部接続端子部に電気的に接続された、前記電気光学パネルを該電気光学パネル外の外部回路に接続する薄板状基板と、
前記薄板状基板と前記第１の基板における前記一側面とを接着する光硬化型接着剤と、
を具備し、
少なくとも前記第３の基板の前記一側面に、前記光硬化型接着剤の硬化に用いる光が前記電気光学物質に進入するのを防止する光散乱面が形成されていることを特徴とする電気光学装置。 An electro-optic material is interposed between the first substrate and the second substrate having a smaller outer shape than the first substrate facing the first substrate, and at least a third is provided on the first substrate. An electro-optical device comprising an electro-optical panel having a substrate attached thereto,
External connection terminals provided along one side surface of the electro-optical panel in a plan view on a surface facing the second substrate outside the region where the second substrate is bonded to the first substrate. And
A thin plate-like substrate that is electrically connected to the external connection terminal portion and connects the electro-optical panel to an external circuit outside the electro-optical panel;
A photocurable adhesive that bonds the thin plate-like substrate and the one side surface of the first substrate;
Comprising
An electro-optic, wherein a light scattering surface for preventing light used for curing the photo-curing adhesive from entering the electro-optic material is formed on at least one side surface of the third substrate. apparatus. 前記第３の基板の前記一側面の表面粗さは、前記第３の基板における他の側面の表面粗さよりも粗いことを特徴とする請求項１に記載の電気光学装置。   The electro-optical device according to claim 1, wherein the surface roughness of the one side surface of the third substrate is rougher than the surface roughness of the other side surface of the third substrate. 前記光散乱面は、前記第１の基板における前記一側面にさらに形成されていることを特徴とする請求項１または２に記載の電気光学装置。   The electro-optical device according to claim 1, wherein the light scattering surface is further formed on the one side surface of the first substrate. 前記第１の基板及び前記第３の基板の前記一側面の表面粗さは、前記第１の基板及び前記第３の基板における他の側面の表面粗さよりも粗いことを特徴とする請求項３に記載の電気光学装置。   4. The surface roughness of the one side surface of the first substrate and the third substrate is rougher than the surface roughness of the other side surface of the first substrate and the third substrate. The electro-optical device according to 1. 第１の基板と該第１の基板に対向する前記第１の基板よりも外形が小さい第２の基板との間に電気光学物質が介在されるとともに、少なくとも前記第１の基板に第３の基板が貼着された電気光学パネルを具備する電気光学装置の製造方法であって、
前記第３の基板は、第１の大板基板に構成されており、
少なくとも前記第３の基板を、前記第１の基板の前記第２の基板が貼り合わされた領域外における前記第２の基板への対向面において設けられた外部接続端子部に沿った前記電気光学パネルの一側面に光散乱面が形成されるよう、前記第１の大板基板から、所定の大きさに切断して形成する切断工程を具備していることを特徴とする電気光学装置の製造方法。 An electro-optic material is interposed between the first substrate and the second substrate having a smaller outer shape than the first substrate facing the first substrate, and at least a third is provided on the first substrate. A method of manufacturing an electro-optical device including an electro-optical panel having a substrate attached thereto,
The third substrate is configured as a first large substrate,
The electro-optical panel along at least the third substrate along an external connection terminal provided on a surface facing the second substrate outside the region of the first substrate to which the second substrate is bonded. A method of manufacturing an electro-optical device, comprising: a cutting step of cutting the first large substrate into a predetermined size so that a light scattering surface is formed on one side surface of the substrate. . 前記切断工程は、前記第３の基板の前記一側面の表面粗さが、前記第３の基板における他の側面の表面粗さよりも粗くなるよう行うことを特徴とする請求項５に記載の電気光学装置の製造方法。   6. The electricity according to claim 5, wherein the cutting step is performed such that the surface roughness of the one side surface of the third substrate is rougher than the surface roughness of the other side surface of the third substrate. Manufacturing method of optical device. 前記第１の基板は、第２の大板基板に構成されているとともに、該第２の大板基板は、前記第１の基板に対して前記第３の基板が貼着されるよう、前記第１の大板基板に貼着されており、
前記切断工程は、前記第３の基板及び前記第１の基板を、前記第１の大板基板及び前記第２の大板基板から、前記第１の基板及び前記第３の基板の前記一側面に光散乱面が形成されるよう、所定の大きさに分断して形成する工程であることを特徴とする請求項５に記載の電気光学装置の製造方法。 The first substrate is configured as a second large substrate, and the second large substrate is configured such that the third substrate is attached to the first substrate. Affixed to the first large substrate,
In the cutting step, the third substrate and the first substrate are separated from the first large substrate and the second large substrate, and the one side surface of the first substrate and the third substrate. 6. The method of manufacturing an electro-optical device according to claim 5, wherein the method is a step of forming the light scattering surface in a predetermined size so as to form a light scattering surface. 前記切断工程は、前記一側面の表面粗さが、前記第１の基板及び第３の基板における他の側面の表面粗さよりも粗くなるよう行うことを特徴とする請求項７に記載の電気光学装置の製造方法。   8. The electro-optic according to claim 7, wherein the cutting step is performed such that the surface roughness of the one side surface is rougher than the surface roughness of the other side surface of the first substrate and the third substrate. Device manufacturing method. 前記切断工程は、レーザ光を切断位置に照射して改質層を形成することにより行われ、
前記レーザ光の照射は、前記一側面における前記改質層の密度が、他の側面における前記改質層の密度よりも大きくなるよう行うことを特徴とする請求項５〜８のいずれか１項に記載の電気光学装置の製造方法。 The cutting step is performed by irradiating the cutting position with a laser beam to form a modified layer,
The laser light irradiation is performed so that the density of the modified layer on the one side surface is larger than the density of the modified layer on the other side surface. A method for manufacturing the electro-optical device according to claim 1. 請求項１〜４のいずれか１項に記載の電気光学装置を具備することを特徴とする電子機器。   An electronic apparatus comprising the electro-optical device according to claim 1.
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CN103182367A (en) * 2011-12-27 2013-07-03 比亚迪股份有限公司 Method for curing ultraviolet (UV) adhesive on back of flexible printed circuit (FPC) of UV adhesive attached touch screen
WO2014091829A1 (en) * 2012-12-12 2014-06-19 日本電気硝子株式会社 Mobile-display cover glass, and mobile display
JP2016195133A (en) * 2010-10-28 2016-11-17 コーニング インコーポレイテッド Video screen cover glass lighting
JP2021071655A (en) * 2019-10-31 2021-05-06 キヤノン株式会社 Manufacturing method electronic module, manufacturing method optical module, electronic module, optical module, and apparatus

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Publication number Priority date Publication date Assignee Title
JP2016195133A (en) * 2010-10-28 2016-11-17 コーニング インコーポレイテッド Video screen cover glass lighting
CN103182367A (en) * 2011-12-27 2013-07-03 比亚迪股份有限公司 Method for curing ultraviolet (UV) adhesive on back of flexible printed circuit (FPC) of UV adhesive attached touch screen
WO2014091829A1 (en) * 2012-12-12 2014-06-19 日本電気硝子株式会社 Mobile-display cover glass, and mobile display
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