JP2009033127A - 半導体実装用ボンディングワイヤ - Google Patents
半導体実装用ボンディングワイヤ Download PDFInfo
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- JP2009033127A JP2009033127A JP2008163617A JP2008163617A JP2009033127A JP 2009033127 A JP2009033127 A JP 2009033127A JP 2008163617 A JP2008163617 A JP 2008163617A JP 2008163617 A JP2008163617 A JP 2008163617A JP 2009033127 A JP2009033127 A JP 2009033127A
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Abstract
【解決手段】半導体実装用ボンディングワイヤであって、破断伸びが7〜20%であり、伸び1%における応力が引張り強さの90%以上100%以下の範囲内であることを特徴とするボンディングワイヤである。
【選択図】なし
Description
Claims (8)
- 破断伸びが7〜20%であり、伸び1%における応力が引張り強さの90〜100%の範囲内であることを特徴とする半導体実装用ボンディングワイヤ。
- 10〜90質量%のAgを含有し、残部がAu、Auの不可避不純物及びAgの不可避不純物であることを特徴とする請求項1に記載の半導体実装用ボンディングワイヤ。
- 55〜75質量%のAgを含有し、残部がAu、Auの不可避不純物及びAgの不可避不純物であることを特徴とする請求項1に記載の半導体実装用ボンディングワイヤ。
- 15〜45質量%のAgを含有し、残部がAu、Auの不可避不純物及びAgの不可避不純物であることを特徴とする請求項1に記載の半導体実装用ボンディングワイヤ。
- 更に、Cu、Pr、Ti及びVの中から選ばれる1種もしくは2種以上の元素の総量が2〜10,000質量ppmであることを特徴とする請求項2〜4記載の半導体実装用ボンディングワイヤ。
- 更に、Al、Co、Fe、Ge、Mn、Ca、Be、In、Hf、Pd、La及びPt中から選ばれる1種もしくは2種以上の元素の総量が2〜100,000質量ppmであることを特徴とする請求項5記載の半導体実装用ボンディングワイヤ。
- 請求項1〜6のいずれか1項に記載の半導体実装用ボンディングワイヤを用い、Al又はAl合金である配線電極と接続したことを特徴とする半導体素子。
- 請求項1〜6のいずれか1項に記載の半導体実装用ボンディングワイヤを用い、半導体基板上の配線電極と、リード上のAgメッキ面又はPdメッキ面とを接続したことを特徴とする半導体素子。
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JP2008163617A JP5116101B2 (ja) | 2007-06-28 | 2008-06-23 | 半導体実装用ボンディングワイヤ及びその製造方法 |
US12/146,792 US8097960B2 (en) | 2007-06-28 | 2008-06-26 | Semiconductor mounting bonding wire |
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JP2007170613 | 2007-06-28 | ||
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JP2008163617A JP5116101B2 (ja) | 2007-06-28 | 2008-06-23 | 半導体実装用ボンディングワイヤ及びその製造方法 |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011129602A (ja) * | 2009-12-16 | 2011-06-30 | Tanaka Electronics Ind Co Ltd | 高強度、高伸び率金合金ボンディングワイヤ |
JP4771562B1 (ja) * | 2011-02-10 | 2011-09-14 | 田中電子工業株式会社 | Ag−Au−Pd三元合金系ボンディングワイヤ |
CN102418001A (zh) * | 2011-11-16 | 2012-04-18 | 浙江佳博科技股份有限公司 | 一种键合金丝及其制备方法 |
WO2012098771A1 (ja) * | 2011-01-20 | 2012-07-26 | タツタ電線株式会社 | ボールボンディング用ワイヤ |
JP2013048169A (ja) * | 2011-08-29 | 2013-03-07 | Tatsuta Electric Wire & Cable Co Ltd | ボールボンディング用ワイヤ |
DE112011100491T5 (de) | 2011-06-10 | 2013-06-13 | Tanaka Denshi Kogyo K.K. | Bonddraht aus Au-Legierung mit hoher Festigkeit und hoher Dehnungsrate |
JP2013135042A (ja) * | 2011-12-26 | 2013-07-08 | Tatsuta Electric Wire & Cable Co Ltd | ボールボンディング用ワイヤ |
WO2013129253A1 (ja) * | 2012-02-27 | 2013-09-06 | 日鉄住金マイクロメタル株式会社 | パワー半導体装置及びその製造方法並びにボンディングワイヤ |
JP5529992B1 (ja) * | 2013-03-14 | 2014-06-25 | タツタ電線株式会社 | ボンディング用ワイヤ |
JP5669335B1 (ja) * | 2014-09-26 | 2015-02-12 | 田中電子工業株式会社 | 銀金合金ボンディングワイヤ |
JP5839763B1 (ja) * | 2014-07-10 | 2016-01-06 | 新日鉄住金マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
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JP2013135042A (ja) * | 2011-12-26 | 2013-07-08 | Tatsuta Electric Wire & Cable Co Ltd | ボールボンディング用ワイヤ |
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