JP2009033056A - 反力処理装置 - Google Patents
反力処理装置 Download PDFInfo
- Publication number
- JP2009033056A JP2009033056A JP2007197912A JP2007197912A JP2009033056A JP 2009033056 A JP2009033056 A JP 2009033056A JP 2007197912 A JP2007197912 A JP 2007197912A JP 2007197912 A JP2007197912 A JP 2007197912A JP 2009033056 A JP2009033056 A JP 2009033056A
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- Prior art keywords
- reaction force
- surface plate
- processing apparatus
- forces
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002955 isolation Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70766—Reaction force control means, e.g. countermass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S248/00—Supports
- Y10S248/913—Two axis article engaging means, e.g. x - y device
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
【解決手段】反力処理装置1は、互いに高さの異なる複数の盤面18,19を有すると共に床25に除振バネ16,16を介して設置された定盤11と、盤面18,19上にそれぞれ配設され当該盤面18,19上を移動するステージ121,122と、を具備するステージ装置10に設けられ、ステージ121,122の移動で定盤11に生じる反力F1,F2を処理する。また、反力処理装置1は、カウンタ推力R1,R2を定盤11に印加する第1及び第2反力処理アクチュエータ21,22と、カウンタ推力R1,R2の大きさを制御する制御部31と、を備えている。この反力処理装置1では、定盤11におけるカウンタ推力R1,R2の作用点高さが互いに異なっており、制御部31が反力F1,F2を合力及び合モーメントとして相殺するように、カウンタ推力R1,R2を制御する。
【選択図】図1
Description
Claims (3)
- 互いに高さの異なる複数の盤面を有すると共に基礎に除振手段を介して設置された定盤と、前記盤面上にそれぞれ配設され当該盤面上を移動する複数のステージと、を具備するステージ装置に設けられ、前記ステージの移動で前記定盤に生じる複数の反力を処理するための反力処理装置であって、
前記複数の反力を協働して処理するための第1及び第2の力それぞれを前記定盤に印加する第1及び第2印加手段と、
前記第1及び第2の力の大きさを制御する制御手段と、を備え、
前記定盤における前記第1及び第2の力の作用点高さが互いに異なっており、
前記制御手段は、前記複数の反力を合力及び合モーメントとして相殺するように、前記第1及び第2の力を制御することを特徴とする反力処理装置。 - 前記第1及び第2印加手段は、前記定盤が被さるように当該定盤の盤面と前記基礎との間に配置されていることを特徴とする請求項1記載の反力処理装置。
- 前記第1及び第2印加手段の少なくとも一方は、前記定盤の底面と前記基礎との間に設けられていることを特徴とする請求項2記載の反力処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007197912A JP4485550B2 (ja) | 2007-07-30 | 2007-07-30 | 反力処理装置 |
TW097128431A TW200925815A (en) | 2007-07-30 | 2008-07-25 | Reactive force processing device |
US12/219,846 US7948198B2 (en) | 2007-07-30 | 2008-07-29 | Reaction force cancel system |
KR1020080074527A KR100981604B1 (ko) | 2007-07-30 | 2008-07-30 | 반력처리장치 |
CN2008101311515A CN101359184B (zh) | 2007-07-30 | 2008-07-30 | 反力处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007197912A JP4485550B2 (ja) | 2007-07-30 | 2007-07-30 | 反力処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009033056A true JP2009033056A (ja) | 2009-02-12 |
JP4485550B2 JP4485550B2 (ja) | 2010-06-23 |
Family
ID=40331656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007197912A Expired - Fee Related JP4485550B2 (ja) | 2007-07-30 | 2007-07-30 | 反力処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7948198B2 (ja) |
JP (1) | JP4485550B2 (ja) |
KR (1) | KR100981604B1 (ja) |
CN (1) | CN101359184B (ja) |
TW (1) | TW200925815A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009033058A (ja) * | 2007-07-30 | 2009-02-12 | Sumitomo Heavy Ind Ltd | 反力処理装置 |
CN104111669A (zh) * | 2013-04-18 | 2014-10-22 | 陈明灯 | 一种载物可变重量悬垂定点位移受力平衡调控装置 |
JP2016022702A (ja) * | 2014-07-23 | 2016-02-08 | 住友重機械工業株式会社 | 射出成形機 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5674316B2 (ja) * | 2010-01-06 | 2015-02-25 | オークマ株式会社 | 構造体のたわみ抑制方法 |
JP5941705B2 (ja) * | 2012-02-29 | 2016-06-29 | ファスフォードテクノロジ株式会社 | 2軸駆動機構及びダイボンダ |
JP2014220265A (ja) * | 2013-04-30 | 2014-11-20 | キヤノン株式会社 | ステージ装置、リソグラフィ装置、および物品の製造方法 |
NL2024767A (en) * | 2019-03-01 | 2020-09-04 | Asml Netherlands Bv | Object positioner device, stage support, lithographic apparatus, object inspection apparatus, method for adapting an object positioner device, device manufacturing method |
JP2024039768A (ja) * | 2022-09-12 | 2024-03-25 | キヤノン株式会社 | ステージ装置、パターン形成装置、及び物品の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08288198A (ja) * | 1995-04-14 | 1996-11-01 | Nikon Corp | 露光装置 |
JPH11329962A (ja) * | 1998-03-04 | 1999-11-30 | Nikon Corp | ステ―ジ装置およびその駆動方法 |
JP2000170827A (ja) * | 1998-12-08 | 2000-06-23 | Fujita Corp | アクティブ型除振装置 |
JP2005057876A (ja) * | 2003-08-04 | 2005-03-03 | Sumitomo Heavy Ind Ltd | ステージ装置用の反力処理システム |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW448487B (en) * | 1997-11-22 | 2001-08-01 | Nippon Kogaku Kk | Exposure apparatus, exposure method and manufacturing method of device |
JP3554186B2 (ja) * | 1998-04-08 | 2004-08-18 | キヤノン株式会社 | 露光装置、デバイス製造方法および反力受け方法 |
JP4146952B2 (ja) * | 1999-01-11 | 2008-09-10 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
TW466542B (en) * | 1999-02-26 | 2001-12-01 | Nippon Kogaku Kk | A stage device and a method of manufacturing same, a position controlling method, an exposure device and a method of manufacturing same, and a device and a method of manufacturing same |
JP2001148341A (ja) * | 1999-11-19 | 2001-05-29 | Nikon Corp | 露光装置 |
JP2001160530A (ja) * | 1999-12-01 | 2001-06-12 | Nikon Corp | ステージ装置及び露光装置 |
JP3814453B2 (ja) * | 2000-01-11 | 2006-08-30 | キヤノン株式会社 | 位置決め装置、半導体露光装置およびデバイス製造方法 |
JP2001257143A (ja) * | 2000-03-09 | 2001-09-21 | Nikon Corp | ステージ装置及び露光装置、並びにデバイス製造方法 |
US6788385B2 (en) * | 2001-06-21 | 2004-09-07 | Nikon Corporation | Stage device, exposure apparatus and method |
US6844694B2 (en) * | 2001-08-10 | 2005-01-18 | Nikon Corporation | Stage assembly and exposure apparatus including the same |
US6621241B2 (en) * | 2001-12-20 | 2003-09-16 | Dac International, Inc. | System and method for reducing oscillating tool-induced reaction forces |
JP3679776B2 (ja) * | 2002-04-22 | 2005-08-03 | キヤノン株式会社 | 駆動装置、露光装置及びデバイス製造方法 |
-
2007
- 2007-07-30 JP JP2007197912A patent/JP4485550B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-25 TW TW097128431A patent/TW200925815A/zh not_active IP Right Cessation
- 2008-07-29 US US12/219,846 patent/US7948198B2/en not_active Expired - Fee Related
- 2008-07-30 CN CN2008101311515A patent/CN101359184B/zh not_active Expired - Fee Related
- 2008-07-30 KR KR1020080074527A patent/KR100981604B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08288198A (ja) * | 1995-04-14 | 1996-11-01 | Nikon Corp | 露光装置 |
JPH11329962A (ja) * | 1998-03-04 | 1999-11-30 | Nikon Corp | ステ―ジ装置およびその駆動方法 |
JP2000170827A (ja) * | 1998-12-08 | 2000-06-23 | Fujita Corp | アクティブ型除振装置 |
JP2005057876A (ja) * | 2003-08-04 | 2005-03-03 | Sumitomo Heavy Ind Ltd | ステージ装置用の反力処理システム |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009033058A (ja) * | 2007-07-30 | 2009-02-12 | Sumitomo Heavy Ind Ltd | 反力処理装置 |
CN104111669A (zh) * | 2013-04-18 | 2014-10-22 | 陈明灯 | 一种载物可变重量悬垂定点位移受力平衡调控装置 |
JP2016022702A (ja) * | 2014-07-23 | 2016-02-08 | 住友重機械工業株式会社 | 射出成形機 |
Also Published As
Publication number | Publication date |
---|---|
CN101359184B (zh) | 2010-09-22 |
TWI378331B (ja) | 2012-12-01 |
KR100981604B1 (ko) | 2010-09-10 |
US7948198B2 (en) | 2011-05-24 |
CN101359184A (zh) | 2009-02-04 |
KR20090013103A (ko) | 2009-02-04 |
US20090278411A1 (en) | 2009-11-12 |
JP4485550B2 (ja) | 2010-06-23 |
TW200925815A (en) | 2009-06-16 |
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