JP2009019063A - Thermoplastic resin film - Google Patents
Thermoplastic resin film Download PDFInfo
- Publication number
- JP2009019063A JP2009019063A JP2007174300A JP2007174300A JP2009019063A JP 2009019063 A JP2009019063 A JP 2009019063A JP 2007174300 A JP2007174300 A JP 2007174300A JP 2007174300 A JP2007174300 A JP 2007174300A JP 2009019063 A JP2009019063 A JP 2009019063A
- Authority
- JP
- Japan
- Prior art keywords
- film
- layer
- thermoplastic resin
- antistatic agent
- ethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Packages (AREA)
- Wrappers (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
本発明は、帯電防止性能、特に、その安定持続性に優れた熱可塑性樹脂フィルムに関し、より詳細には、粉末食品その他の食品包装用材、医薬品包装用材、繊維製品包装用材、静電気シールドを目的とした半導体素子等の精密電子部品の包装材、容器材等に好適に用いられ、帯電防止性能、特に、その安定持続性に優れた単層又は多層の熱可塑性樹脂フィルムに関する。 The present invention relates to a thermoplastic resin film excellent in antistatic performance, in particular, its stability and sustainability, and more specifically for powdered food and other food packaging materials, pharmaceutical packaging materials, textile packaging materials, and electrostatic shielding. The present invention relates to a single-layer or multi-layer thermoplastic resin film that is suitably used for packaging materials, container materials, and the like for precision electronic parts such as semiconductor elements, and that is excellent in antistatic performance, in particular, its stability and sustainability.
物品の包装用、収納袋用、容器用等の用途に供される樹脂フィルムには程度の差はあれ帯電防止性が求められる場合が多く、例えば、厳密な静電シールド性が強く求められる半導体素子等の精密電子部品の包装材料、袋材、容器材等に用いる熱可塑性樹脂フィルムは勿論、粉末食品その他の食品包装、医薬品包装、繊維製品包装等の用途に用いる熱可塑性樹脂フィルムにもそれぞれ、その用途に応じた帯電防止性が求められる。 Resin films used for packaging of goods, storage bags, containers, etc. are often required to have antistatic properties to some extent, for example, semiconductors that require strict electrostatic shielding properties. In addition to thermoplastic resin films used for packaging materials for precision electronic parts such as elements, bags, containers, etc., it also applies to thermoplastic resin films used for powdered foods and other food packaging, pharmaceutical packaging, textile packaging, etc. Therefore, antistatic properties corresponding to the application are required.
従来から、このような要求に応ずる帯電防止性フィルムの発明も既に多数提案され、例えば、特許文献１には、非金属支持体としてのポリエチレンテレフタレートフィルムとアクリル系又はポリカーボネート系の結合剤樹脂に電解銅粉等の導電性粉末を分散させた導電層（塗膜層）との間に塩化ビニリデン樹脂層を介在させてなり、帯電防止を目的とした粉末食品包装用、医薬品包装用、繊維製品包装用等の用途の他、静電シールドを目的としたＩＣ部品の包装、保管、流通用等の用途にも用いることのできる導電性フィルムの発明が開示されている。 Conventionally, many inventions of antistatic films that meet such requirements have already been proposed. For example, Patent Document 1 discloses electrolysis of a polyethylene terephthalate film as a nonmetallic support and an acrylic or polycarbonate binder resin. A vinylidene chloride resin layer is interposed between a conductive layer (coating layer) in which conductive powder such as copper powder is dispersed, and for powdered food packaging, pharmaceutical packaging, and textile packaging for the purpose of antistatic In addition to uses such as applications, the invention of a conductive film that can be used for applications such as packaging, storage, and distribution of IC components for the purpose of electrostatic shielding is disclosed.
又、特許文献２には、精密電子部品の包装用材として、外層フィルム層、補強フィルム層、接着強化層及び熱接着剤層からなり、該熱接着剤層がポリアクリレート系のベース樹脂に帯電防止剤としてテトラアルキルアンモニウムクロライドを練込み配合した樹脂組成物からなるポリスチレン製エンボスキャリアテープ用のカバーテープの発明が開示されている。 Further, Patent Document 2 includes an outer film layer, a reinforcing film layer, an adhesion reinforcing layer, and a thermal adhesive layer as packaging materials for precision electronic components, and the thermal adhesive layer is antistatic to a polyacrylate base resin. An invention of a cover tape for a polystyrene embossed carrier tape comprising a resin composition in which a tetraalkylammonium chloride is kneaded and blended as an agent is disclosed.
しかしながら、特許文献１の発明のように帯電防止塗布層に重金属粉末を配合した包装材は、該塗膜層がやや脆く剥離しやすい欠点があり、重金属粉が医薬や食品等と直接接触した場合の触媒的作用による変質促進の危険性や太陽光暴露等の場合の光増感作用による内容物変質の危険性等の観点から、そのような影響を受けやすい医薬、食品と接する用途、或いは、重金属の存在を極端に嫌うＩＣチップ等の精密電子部品と接する用途等への使用は決して好ましいものではく、この点から使用が制限される場合も生じる。 However, the packaging material in which the heavy metal powder is blended in the antistatic coating layer as in the invention of Patent Document 1 has a drawback that the coating layer is somewhat brittle and easily peeled off, and the heavy metal powder is in direct contact with pharmaceuticals, foods, etc. From the viewpoint of the risk of alteration promotion due to the catalytic action of, and the risk of content alteration due to photosensitization in the case of exposure to sunlight, etc. Use in applications that come in contact with precision electronic components such as IC chips that are extremely disliked by the presence of heavy metals is not preferable, and use may be limited in this respect.
又、特許文献２の発明のように、熱接着剤層（ヒートシール層）に帯電防止剤を混入又は塗布したキャリアテープ用カバーテープ等のフィルム材の場合は、その製作日時からそれほど時間が経過しない初期には充分な帯電防止性能を有するが、製造後に長期間放置したものを使用した場合や、製造後すぐにキャリアテープに装着して包装体としたものでも、該包装体の状態で長期間貯蔵したもの等は、その帯電防止性能が徐々に低下し、それを開封した際、剥離により生じる静電気で塵埃等が付着する不都合を完全に阻止できない場合も生じ、このような帯電防止性能の経時的劣化が従来から問題となってる。
特に、近年、ＩＣ、ＬＳＩ等の高度集積化やその他の電子部品の細密化が進行するにつれてその改善が当業界で強く求められるようになって来ている。
In particular, in recent years, as high integration of ICs, LSIs, etc. and miniaturization of other electronic components have progressed, improvements in the industry have been strongly demanded.
本発明者等は、帯電防止に金属粉含有層等を用いることなく、然も、帯電防止性能の経時的劣化が無く、その持続性に優れた帯電防止フィルムを開発すべく鋭意研究を重ねた。
その結果、非金属系の帯電防止剤を含有する熱可塑性樹脂の単層フィルムまたは該帯電防止剤を含有する熱可塑性樹脂層を有する多層フィルムにおいて、帯電防止剤を含有する熱可塑性樹脂層の少なくとも片面に極性基付与処理を施したものが帯電防止性、特に、その経時的持続性に優れることを見出しこの知見に基づき本発明を完成した。
The inventors of the present invention did not use a metal powder-containing layer or the like for antistatic, and did no serious deterioration of antistatic performance over time, and conducted extensive research to develop an antistatic film with excellent durability. .
As a result, in a single layer film of a thermoplastic resin containing a non-metallic antistatic agent or a multilayer film having a thermoplastic resin layer containing the antistatic agent, at least the thermoplastic resin layer containing the antistatic agent Based on this finding, the present invention has been completed based on the finding that a material having a polar group imparting treatment on one surface is excellent in antistatic properties, in particular, long-term sustainability.
従って、本発明の目的は、帯電防止性に優れ、特に、その経時的持続性が改善された熱可塑性樹脂フィルム及び低温度での熱接着が可能であると共にフ゜ラスティックや紙等に対する熱接着強度が適度で、且つ、該熱可塑性樹脂同士の熱接着は充分な強度を有し、食品、医薬品、繊維製品等の包装用の他、精密電子部品の包装材料等にも好適に用いられる熱可塑性樹脂の単層又は多層フィルムを提供するにある。 Accordingly, an object of the present invention is to provide excellent antistatic properties, in particular, a thermoplastic resin film with improved temporal sustainability and thermal bonding at a low temperature, and a thermal bonding strength to plastic or paper. A thermoplastic resin that is moderate and has sufficient strength for thermal bonding between the thermoplastic resins, and is suitably used for packaging materials for precision electronic components as well as for packaging foods, pharmaceuticals, textile products, etc. It is in providing a single layer or multilayer film.
本発明によれば、帯電防止剤を含有する熱可塑性樹脂の単層フィルムまたは帯電防止剤を含有する熱可塑性樹脂層を有する多層フィルムにおいて、帯電防止剤を含有する熱可塑性樹脂層の少なくとも片面に極性基付与処理が施されていることを特徴とする熱可塑性樹脂の単層又は多層フィルムが提供される。 According to the present invention, in a multilayer film having a single layer film of a thermoplastic resin containing an antistatic agent or a thermoplastic resin layer containing an antistatic agent, at least one surface of the thermoplastic resin layer containing the antistatic agent is provided. A single layer or multilayer film of a thermoplastic resin characterized by being subjected to a polar group imparting treatment is provided.
本発明では、前記極性基付与処理はコロナ放電処理であることが好ましい。 In this invention, it is preferable that the said polar group provision process is a corona discharge process.
又、前記本発明の熱可塑性樹脂フィルムが多層フィルムである場合に於いて、該多層フィルムは、外層フィルム層を有し、且つ、前記帯電防止剤を含有する熱可塑性樹脂層は、その外層フィルム側と反対側の面に極性基付与処理が施されていることを特徴とする。 In the case where the thermoplastic resin film of the present invention is a multilayer film, the multilayer film has an outer film layer, and the thermoplastic resin layer containing the antistatic agent is an outer film. The surface opposite to the side is subjected to a polar group imparting treatment.
更に、前記多層フィルムが外層フィルム層と帯電防止剤を含有する熱可塑性樹脂層との間に中間層を更に有し、前記帯電防止剤を含有する熱可塑性樹脂層の中間層と接する側の反対側の面に極性基付与処理が施されている態様が特に好ましい。 Further, the multilayer film further includes an intermediate layer between the outer layer film layer and the thermoplastic resin layer containing the antistatic agent, and is opposite to the side in contact with the intermediate layer of the thermoplastic resin layer containing the antistatic agent. An embodiment in which a polar group imparting treatment is performed on the side surface is particularly preferable.
又、前記帯電防止剤を含有する熱可塑性樹脂層は熱接着性樹脂層であって、特に、該層が帯電防止剤を含有するエチレン・酢酸ビニル共重合体組成物からなる層であることが好ましい。 The thermoplastic resin layer containing the antistatic agent is a thermoadhesive resin layer, and in particular, the layer is a layer made of an ethylene / vinyl acetate copolymer composition containing an antistatic agent. preferable.
又、前記外層フィルム層はポリエステル樹脂からなることが好ましい。 The outer film layer is preferably made of a polyester resin.
更に、前記中間層は、エチレン・αオレフィン共重合体、エチレン・不飽和カルボン酸共重合体、エチレン・不飽和カルボン酸エステル共重合体、エチレン・不飽和カルボン酸・不飽和カルボン酸エステル共重合体、低密度ポリエチレン、直鎖状低密度ポリエチレン、メタロセン触媒重合ポリエチレンから選ばれた少なくとも１種からなることが好ましい。 Further, the intermediate layer comprises an ethylene / α-olefin copolymer, an ethylene / unsaturated carboxylic acid copolymer, an ethylene / unsaturated carboxylic acid ester copolymer, an ethylene / unsaturated carboxylic acid / unsaturated carboxylic acid ester copolymer. It is preferably made of at least one selected from coalescence, low density polyethylene, linear low density polyethylene, and metallocene catalyzed polyethylene.
更に、本発明の単層又は多層フィルムは物品の包装用材料として好適に用いられ、特に、前記帯電防止剤を含有する熱可塑性樹脂層のキャリアテープと接する面に極性基付与処理が施されている態様のキャリアテープ用カバーテープとして好適に用いられる。 Furthermore, the monolayer or multilayer film of the present invention is suitably used as a packaging material for articles, and in particular, the surface of the thermoplastic resin layer containing the antistatic agent that is in contact with the carrier tape is subjected to a polar group imparting treatment. It is suitably used as a cover tape for a carrier tape of the present embodiment.
本発明の帯電防止剤を含有する熱可塑性樹脂の単層フィルムまたは帯電防止剤を含有する熱可塑性樹脂層を有する多層フィルムは、帯電防止剤を含有する熱可塑性樹脂層の少なくとも片面に極性基付与処理が施されていることに起因して、帯電防止性に優れ、特に、その（帯電防止性の）経時的な安定持続性に顕著に優れる。
従って、例えば、粉末食品その他の食品包装、医薬品包装、繊維製品包装等の広範な包装用途に好適に用いることができるだけでなく、厳密な静電シールド性が強く求められる半導体素子等の精密電子部品の包装材料、袋材、容器材等にも好適で、特に、ポリエステル樹脂フィルム等からなる外層フィルム層とポリエチレンやエチレン系共重合体又はそれらを含む樹脂組成物からなる中間層と帯電防止剤含有エチレン・酢酸ビニル共重合体樹脂組成物等からなる帯電防止剤含有熱可塑性樹脂層とが積層されてなり、且つ、キャリアテープと接する側の帯電防止剤含有熱可塑性樹脂層面に極性基付与処理が施される態様の多層フィルムはキャリアテープ用カバーテープとして、低温度での熱接着が可能であると共にカバーテープとキャリアテープとの接着強度が、その剥離開封時にスムーズな剥離が達成できる程度の適度でバラツキの無い強度を有し、然も帯電防止性に優れ、特に、その経時的な安定持続性に顕著に優れる。
A single layer film of a thermoplastic resin containing an antistatic agent of the present invention or a multilayer film having a thermoplastic resin layer containing an antistatic agent is provided with a polar group on at least one surface of the thermoplastic resin layer containing the antistatic agent. Due to the treatment being performed, the antistatic property is excellent, and in particular, the antistatic property is remarkably excellent in the stability over time.
Therefore, for example, it can be used suitably for a wide range of packaging applications such as powdered foods and other food packaging, pharmaceutical packaging, textile packaging, etc., but also precision electronic parts such as semiconductor elements that require strong electrostatic shielding properties. Suitable for packaging materials, bag materials, container materials, etc., especially outer layer film layer made of polyester resin film, intermediate layer made of polyethylene or ethylene copolymer or resin composition containing them, and antistatic agent contained An antistatic agent-containing thermoplastic resin layer made of an ethylene / vinyl acetate copolymer resin composition or the like is laminated, and the antistatic agent-containing thermoplastic resin layer surface on the side in contact with the carrier tape is subjected to a polar group addition treatment. The multilayer film of the embodiment to be applied can be thermally bonded at a low temperature as a cover tape for a carrier tape, and the cover tape and the carrier tape. Adhesive strength between has a moderate and no intensity variation in the extent that can be achieved smoothly peeled off when the peeling opening, also excellent in antistatic property natural, in particular, superior significantly to its temporal stability persistence.
以下に、本発明の好適実施形態について、詳細且つ具体的に説明する。
既に述べたとおり、本発明は、少なくともその片面に極性基付与処理が施されている帯電防止剤含有熱可塑性樹脂の単層フィルム、及び、帯電防止剤を含有する熱可塑性樹脂層を有する多層フィルムであって、該帯電防止剤を含有する熱可塑性樹脂層の少なくとも片面に極性基付与処理が施されているものからなる。
Hereinafter, preferred embodiments of the present invention will be described in detail and specifically.
As described above, the present invention is a single layer film of an antistatic agent-containing thermoplastic resin that has been subjected to a polar group imparting treatment on at least one surface thereof, and a multilayer film having a thermoplastic resin layer containing an antistatic agent And at least one surface of the thermoplastic resin layer containing this antistatic agent consists of what gave the polar group provision process.
まず、本発明の単層フィルムについて述べる。
本発明に於いて、前記単層フィルムを構成する熱可塑性樹脂（ベース樹脂）としては、帯電防止剤の練込、混和が可能で、且つ、所定の柔軟性と強度を有しフィルム成形が可能な熱可塑性樹脂であれば特に限定されること無く使用できるが、本発明のフィルムが帯電防止性を求める物品の包装や収納に用いることを主目的とすることから、ポリエチレンやエチレン・酢酸ビニル共重合体系樹脂、エチレン・不飽和カルボン酸共重合体系樹脂、エチレン・不飽和カルボン酸エステル共重合体系樹脂、エチレン・不飽和カルボン酸・不飽和カルボン酸エステル共重合体系樹脂等のエチレン系共重合体樹脂を含むポリオレフィン系樹脂、ポリエステル系樹脂、ポリアミド系樹脂、アクリル系樹脂、ポリウレタン系樹脂、ポリエステルポリウレタン系樹脂、スチレン系樹脂等、又はこれらの二種以上の混合物を用いることが好ましい。
本発明の単層フィルムは、その用途からそれ自体を単独で使用する場合よりは、むしろ他材料に貼付けたり、粘着させたり、ヒートシール接合したりする使用態様が圧倒的に多く、この観点から該樹脂層には上記の樹脂の内でも熱接着性に優れた樹脂、特にヒートシール性樹脂を使用することが好ましく、この観点から、上記の内でも、エチレン共重合体樹脂、特に｛酢酸ビニル含量３〜１５重量％の｝エチレン・酢酸ビニル共重合体系樹脂が特に好ましい。
又、透明で低温ヒートシール性に優れたＣＭＰＳ（商品名：三井・デュポンポリケミカル社製多目的シール樹脂）等の市販品シール樹脂を用いることもできる。
First, the single layer film of the present invention will be described.
In the present invention, the thermoplastic resin (base resin) constituting the single-layer film can be kneaded and mixed with an antistatic agent, and can be formed into a film having a predetermined flexibility and strength. Any thermoplastic resin can be used without particular limitation. However, since the main purpose of the film of the present invention is to be used for packaging and storage of articles requiring antistatic properties, both polyethylene and ethylene / vinyl acetate can be used. Ethylene copolymers such as polymer resins, ethylene / unsaturated carboxylic acid copolymer resins, ethylene / unsaturated carboxylic acid ester copolymer resins, ethylene / unsaturated carboxylic acid / unsaturated carboxylic acid ester copolymer resins Polyolefin resin including resin, polyester resin, polyamide resin, acrylic resin, polyurethane resin, polyester polyurethane Fat, styrene resin or the like, or it is preferable to use these a mixture of two or more.
The single-layer film of the present invention has an overwhelmingly many usage modes in which it is affixed to other materials, adhered, or heat-sealed, rather than being used alone for its application. For the resin layer, it is preferable to use a resin having excellent thermal adhesiveness among the above-mentioned resins, in particular, a heat-sealable resin. From this viewpoint, among the above-mentioned resins, ethylene copolymer resins, particularly {vinyl acetate An ethylene / vinyl acetate copolymer resin having a content of 3 to 15% by weight is particularly preferred.
Commercially available seal resins such as CMPS (trade name: multi-purpose seal resin manufactured by Mitsui DuPont Polychemical Co., Ltd.) that is transparent and excellent in low-temperature heat sealability can also be used.
上記ベース樹脂に通常配合される練込形の帯電防止剤としては、アルキルサルフェート、アルキルアリールサルフェート等のアニオン系界面活性剤、テトラアルキルアンモニウムクロライドに代表される第四級アンモニウム塩などのカチオン系界面活性剤、グリセリンモノステアレート等の非イオン系界面活性剤、ジメチルアルキルベタイン等の両性界面活性剤、三級アルキルアミン等が例示され、更に酸化錫、酸化亜鉛、酸化チタン、カーボンブラックなども用途によっては用いることができる。
これらの内で練込型の帯電防止剤としてはグリセリンモノステアレート等の非イオン系界面活性剤が好ましい。
その配合量は用いる帯電防止剤の種類、ベース樹脂種、用途等により適宜定められるが、通常ベース樹脂１００重量部に対し０．１〜５重量部程度である。
Examples of kneaded antistatic agents that are usually blended into the base resin include anionic surfactants such as alkyl sulfates and alkylaryl sulfates, and cationic interfaces such as quaternary ammonium salts typified by tetraalkylammonium chlorides. Examples include activators, nonionic surfactants such as glycerin monostearate, amphoteric surfactants such as dimethylalkylbetaine, tertiary alkylamines, etc. In addition, tin oxide, zinc oxide, titanium oxide, carbon black, etc. are also used Can be used.
Among these, as the kneading type antistatic agent, a nonionic surfactant such as glycerin monostearate is preferable.
The blending amount is appropriately determined depending on the kind of the antistatic agent to be used, the type of the base resin, the use, etc., but is usually about 0.1 to 5 parts by weight with respect to 100 parts by weight of the base resin.
更に、上記熱可塑性樹脂に、粘着性付与樹脂を配合しても良く、粘着性付与樹脂としては、所謂タッキファイヤーと呼ばれるポリエチレン系樹脂、キシレン樹脂、水添石油樹脂、エステルガム、クマロン樹脂等が例示出来、その配合量は適宜である。
また前記フィルムの厚さは、内容物、用途等によって適宜設定されるが、通常５〜２００μｍ、好ましくは２０〜５０μｍである。
Furthermore, a tackifier resin may be blended with the thermoplastic resin, and examples of the tackifier resin include so-called tackifier polyethylene resin, xylene resin, hydrogenated petroleum resin, ester gum, coumarone resin, and the like. Examples can be given, and the blending amount is appropriate.
Moreover, although the thickness of the said film is suitably set by the content, a use, etc., it is 5-200 micrometers normally, Preferably it is 20-50 micrometers.
前記単層フィルムの製造方法としては、前記帯電防止剤の所定量を練込んだベース樹脂を、それぞれのベース樹脂に適した通常の製膜方法、例えば、インフレーション製膜法、Ｔダイ押出製膜法、カレンダリング製膜法等それ自体公知の方法を適宜用いて製造することができる。 As a method for producing the single-layer film, a base resin kneaded with a predetermined amount of the antistatic agent is used as a usual film-forming method suitable for each base resin, for example, an inflation film-forming method, a T-die extrusion film-forming method. It can be produced by appropriately using a method known per se such as a method and a calendering film forming method.
本発明ではこのようにして得られた帯電防止剤含有熱可塑性樹脂単層フィルムの片面又は両面に極性基付与処理を施す。
本発明で極性基付与処理とは前記処理面に、例えばカルボキシル基、カルボニル基等の極性基を付与（導入）する表面処理のことを言い、極性基を付与する処理の具体例としては、コロナ放電処理、プラズマ処理、火炎処理、紫外線照射処理等の表面処理方法が挙げられる。
この中で本発明ではコロナ放電処理が好ましい。
該コロナ放電処理に於ける放電密度は、帯電防止剤を含有する熱可塑性樹脂の種類、厚み、その他の諸条件により変化し適宜設定されるが、一般に５〜１５０ｗ・分／ｍ２程度、より好ましくは１０〜１００ｗ・分／ｍ２である。
In the present invention, polar group imparting treatment is performed on one side or both sides of the antistatic agent-containing thermoplastic resin single layer film thus obtained.
In the present invention, the polar group imparting treatment refers to a surface treatment for imparting (introducing), for example, a polar group such as a carboxyl group or a carbonyl group to the treated surface. As a specific example of the treatment for imparting a polar group, corona Examples of the surface treatment method include discharge treatment, plasma treatment, flame treatment, and ultraviolet irradiation treatment.
Of these, corona discharge treatment is preferred in the present invention.
The discharge density in the corona discharge treatment varies depending on the type, thickness and other conditions of the thermoplastic resin containing the antistatic agent, and is appropriately set, but is generally about 5 to 150 w · min / m 2 . It is preferably 10 to 100 w · min / m 2 .
次に、本発明の多層フィルムについて述べる。
本発明の多層フィルムに於いて、最も単純な層構成は外層フィルム層と帯電防止剤を含有する熱可塑性樹脂層の２層からなり、該帯電防止剤を含有する熱可塑性樹脂層の少なくとも１面に極性基付与処理が施された態様の積層フィルムであるが、本発明では、前記外層フィルム層と帯電防止剤含有熱可塑性樹脂層との間にエチレン系重合体樹脂からなる中間層を介在させた少なくとも３層からなる多層フィルムがより好ましい。
Next, the multilayer film of the present invention will be described.
In the multilayer film of the present invention, the simplest layer structure consists of two layers, an outer film layer and a thermoplastic resin layer containing an antistatic agent, and at least one surface of the thermoplastic resin layer containing the antistatic agent. In the present invention, an intermediate layer made of an ethylene polymer resin is interposed between the outer film layer and the antistatic agent-containing thermoplastic resin layer. A multilayer film consisting of at least three layers is more preferred.
又、多層フィルムに於いては、前記帯電防止剤を含有する熱可塑性樹脂層は、その外層フィルム側と反対側の面に極性基付与処理が施されていることを特徴とする。
この場合に於いて、前記中間層が外層フィルム層と帯電防止剤含有熱可塑性樹脂層との間に積層されている態様のものでは、前記極性基付与処理が中間層に接着した面と反対側の面に施される。
In addition, in the multilayer film, the thermoplastic resin layer containing the antistatic agent is characterized in that a polar group imparting treatment is performed on the surface opposite to the outer layer film side.
In this case, in the aspect in which the intermediate layer is laminated between the outer layer film layer and the antistatic agent-containing thermoplastic resin layer, the side opposite to the surface where the polar group imparting treatment is adhered to the intermediate layer Applied to the surface.
本発明に於いて、外層フィルム層の材質としては、それ自体公知の熱可塑性樹脂フィルムを使用でき、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステル樹脂フィルム、ポリプロピレン等のポリオレフィン樹脂フィルム、ナイロン等のポリアミド樹脂フィルム、ポリカーボネート樹脂フィルム等を例示することができる。
これらの内ではポリエステル樹脂フィルムが好ましく、特に、強度、耐熱性に優れ、比較的剛性が高く容易に透明品が得られるポリエチレンテレフタレートフィルムが好ましい。
これらフィルムは延伸、未延伸の何れも使用できるが、二軸延伸フィルムが好ましい。
In the present invention, as the material of the outer film layer, a known thermoplastic resin film can be used, polyester resin film such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyolefin resin film such as polypropylene, nylon, etc. Examples thereof include polyamide resin films, polycarbonate resin films and the like.
Among these, a polyester resin film is preferable, and a polyethylene terephthalate film which is excellent in strength and heat resistance, has a relatively high rigidity and can easily obtain a transparent product is particularly preferable.
These films can be either stretched or unstretched, but biaxially stretched films are preferred.
又、これらフィルムには帯電防止処理が施されることが好ましく、例えば、帯電防止剤が練り込まれたものや外表面を帯電防止コート処理したもの等が好適である。 These films are preferably subjected to an antistatic treatment, and for example, a film in which an antistatic agent is kneaded or a film in which an outer surface is treated with an antistatic coating is suitable.
又、中間層を設ける態様の多層フィルムに於いては、該層との間の接着強度を一層強化安定させるために、外層フィルムの中間層と接する面にサンドブラスト処理、コロナ処理、プラズマ処理、火炎処理、紫外線処理、アンカーコート処理等の表面処理を施しても良く、更に、必要に応じて、層中に慣用の添加剤、例えば、酸化防止剤、滑剤、ブロッキング防止剤、紫外線吸収剤、軟化剤、防錆剤等を添加しても良い。 In addition, in the case of a multilayer film in which an intermediate layer is provided, in order to further strengthen and stabilize the adhesive strength between the layers, the surface of the outer film in contact with the intermediate layer is sandblasted, corona treated, plasma treated, flame Surface treatment such as treatment, ultraviolet treatment, anchor coat treatment, etc. may be applied, and further, if necessary, conventional additives in the layer, such as antioxidants, lubricants, antiblocking agents, ultraviolet absorbers, softening An agent, an antirust agent, etc. may be added.
前記外層フィルム層の厚さは、内容物、用途によって適宜設定されるが、通常５〜５０μｍ、好ましくは９〜３０μｍである。 The thickness of the outer film layer is appropriately set depending on the contents and use, but is usually 5 to 50 μm, preferably 9 to 30 μm.
既に述べたとおり、本発明の多層フィルムには、前記外層フィルム層と帯電防止剤含有熱可塑性樹脂層の間に中間層を介在させることが好ましい。
本発明に於いて中間層は、外層フィルム層と帯電防止剤含有熱可塑性樹脂層（熱接着性樹脂からなることがより好ましい）との間に介在し、この中間層を介して該外層と帯電防止剤含有熱可塑性樹脂層間の接着を強固にし、かつ安定化する機能を有する。
As already described, in the multilayer film of the present invention, an intermediate layer is preferably interposed between the outer film layer and the antistatic agent-containing thermoplastic resin layer.
In the present invention, the intermediate layer is interposed between the outer film layer and the antistatic agent-containing thermoplastic resin layer (more preferably made of a thermoadhesive resin), and the outer layer is charged with the intermediate layer. It has the function of strengthening and stabilizing the adhesion between the inhibitor-containing thermoplastic resin layers.
本発明では、前記中間層の構成材として、エチレン系重合体又はそれらを含む樹脂組成物を用いる。
エチレン系重合体としてはエチレンの単独重合体、またはエチレン共重合体いずれも使用できるが、ポリエチレン、エチレン・αオレフィン共重合体、エチレン・不飽和カルボン酸共重合体、エチレン・不飽和カルボン酸エステル共重合体、エチレン・不飽和カルボン酸・不飽和カルボン酸エステル共重合体から選ばれた少なくとも１種の重合体、共重合体、それらの樹脂組成物が好適に用いられる。
In the present invention, an ethylene polymer or a resin composition containing them is used as a constituent material of the intermediate layer.
As the ethylene-based polymer, either an ethylene homopolymer or an ethylene copolymer can be used, but polyethylene, ethylene / α-olefin copolymer, ethylene / unsaturated carboxylic acid copolymer, ethylene / unsaturated carboxylic acid ester are used. A copolymer, at least one polymer selected from an ethylene / unsaturated carboxylic acid / unsaturated carboxylic acid ester copolymer, a copolymer, and a resin composition thereof are preferably used.
更に具体的には、エチレンホモポリマー又はエチレンと少量の炭素数３〜１２のα−オレフィンとの共重合体、たとえば高圧法低密度ポリエチレン、中・高密度ポリエチレン、直鎖低密度ポリエチレン、メタロセン触媒重合ポリエチレン、超低密度ポリエチレン等の所謂ポリエチレン類、エチレンと、例えば、プロピレン、１−ブテン、１ペンテン、１−ヘキセン等のα−オレフィン類との共重合体、所謂エチレン・α−オレフィン共重合体類、エチレン・酢酸ビニル共重合体、エチレン・プロピオン酸ビニル共重合体等のビニルエステル共重合体類、エチレンと、例えば、アクリル酸、メタクリル酸、マレイン酸モノエチル、無水マレイン酸等不飽和カルボン酸類との共重合体、所謂エチレン・不飽和カルボン酸共重合体類、又は、そのＮａ、Ｌｉ、ＺｎもしくはＭｇなどのアイオノマー類、エチレンと、例えば、アクリル酸メチル、アクリル酸エチル、アクリル酸イソブチル、アクリル酸ｎブチル、アクリル酸−２−エチルヘキシル、メタクリル酸メチル、メタクリル酸グリシジル、マレイン酸ジメチル等の不飽和カルボン酸エステル類との共重合体、所謂エチレン・不飽和カルボン酸エステル共重合体類、エチレンと上記のような不飽和カルボン酸と不飽和カルボン酸エステルの共重合体、所謂エチレン・不飽和カルボン酸・不飽和カルボン酸エステル共重合体類又はそのＮａ、Ｌｉ、ＺｎもしくはＭｇなどのアイオノマー類、エチレンと一酸化炭素と任意に不飽和カルボン酸エステルや酢酸ビニルとの共重合体等、エチレンと極性モノマーとの共重合体やこれらの２種以上の混合物などを好適例として挙げることができる。 More specifically, an ethylene homopolymer or a copolymer of ethylene and a small amount of an α-olefin having 3 to 12 carbon atoms, such as high-pressure low-density polyethylene, medium / high-density polyethylene, linear low-density polyethylene, metallocene catalyst Polymers, so-called polyethylenes such as ultra-low density polyethylene, copolymers of ethylene and α-olefins such as propylene, 1-butene, 1pentene, 1-hexene, so-called ethylene / α-olefin copolymer Polymers, vinyl ester copolymers such as ethylene / vinyl acetate copolymer, ethylene / vinyl propionate copolymer, ethylene and unsaturated carboxylic acids such as acrylic acid, methacrylic acid, monoethyl maleate, maleic anhydride, etc. Copolymers with acids, so-called ethylene / unsaturated carboxylic acid copolymers, or Na Ionomers such as Li, Zn or Mg, ethylene and, for example, methyl acrylate, ethyl acrylate, isobutyl acrylate, nbutyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, glycidyl methacrylate, dimethyl maleate Copolymers with unsaturated carboxylic acid esters such as so-called ethylene / unsaturated carboxylic acid ester copolymers, copolymers of ethylene and unsaturated carboxylic acids and unsaturated carboxylic acid esters as described above, so-called ethylene・ Unsaturated carboxylic acid / unsaturated carboxylic acid ester copolymers or ionomers such as Na, Li, Zn or Mg, copolymers of ethylene, carbon monoxide, and optionally unsaturated carboxylic acid ester or vinyl acetate Such as a copolymer of ethylene and a polar monomer or two or more of these It can be exemplified compounds or the like as a preferable example.
こら等の内では、低密度ポリエチレン、直鎖状低密度ポリエチレン、メタロセン触媒重合ポリエチレンやそれらの混合物が好ましい。 Of these, low-density polyethylene, linear low-density polyethylene, metallocene-catalyzed polyethylene, and mixtures thereof are preferable.
本発明の中間層に用いる前記素材樹脂は、その加工性や層強度の点からそのメルトフローレート（ＭＦＲ： ＪＩＳＫ ７２１０−１９９９に準拠、１９０℃、２１６０ｇ荷重 ）は１〜５０ｇ／１０分、より好ましくは３〜２０ｇ／１０分程度のものが好ましい。
又、前記中間層の厚さは、内容物、用途によって適宜設定されるが、通常５〜５０μｍ、好ましくは７〜２０μｍである。
The material resin used for the intermediate layer of the present invention has a melt flow rate (based on MFR: JISK 7210-1999, 190 ° C., 2160 g load) from 1 to 50 g / 10 min from the viewpoint of processability and layer strength. The thing of about 3-20 g / 10min is preferable.
The thickness of the intermediate layer is appropriately set depending on the contents and the use, but is usually 5 to 50 μm, preferably 7 to 20 μm.
更に、前記中間層は、その外層フィルム層及び／又は帯電防止剤含有熱可塑性樹脂層との間にアンカーコート剤を施用し、これを介して外層フィルム層や帯電防止剤含有熱可塑性樹脂層を積層しても良く、これにより中間層と外層フィルム層や帯電防止剤含有熱可塑性樹脂層との間の接着をより強化にできる。
本発明で使用するこのようなアンカーコート剤の好適例として、ポリエステル系樹脂とイソシアネート樹脂硬化剤との二液反応型アンカーコート剤、ポリウレタン系樹脂とイソシアネート系硬化剤との二液型アンカーコート剤、ポリイソシアネート系樹脂とアミン樹脂とのアンカーコート剤、ポリエチレンイミン系樹脂からなる一液型アンカーコート剤等の他、エポキシ系やオキサザリン系アンカーコート剤等を挙げることができる。
Furthermore, the intermediate layer is applied with an anchor coating agent between the outer layer film layer and / or the antistatic agent-containing thermoplastic resin layer, and the outer layer film layer and the antistatic agent-containing thermoplastic resin layer are interposed therebetween. Lamination may be performed, whereby adhesion between the intermediate layer and the outer film layer or the antistatic agent-containing thermoplastic resin layer can be further strengthened.
Preferred examples of such an anchor coating agent used in the present invention include a two-component reaction type anchor coating agent of a polyester resin and an isocyanate resin curing agent, and a two component anchor coating agent of a polyurethane resin and an isocyanate curing agent. In addition to an anchor coating agent of a polyisocyanate resin and an amine resin, a one-component anchor coating agent made of a polyethyleneimine resin, an epoxy-based or oxazaline-based anchor coating agent, and the like can be given.
前記アンカーコート剤の施用量は、内容物、用途によって適宜設定されるが、固形分濃度として通常０．０１〜５ｇ／ｍ２、好ましくは０．０１〜０．５ｇ／ｍ２である。 Application rates of the anchor coating agent, contents, and is set as appropriate depending on the application, usually 0.01-5 g / m 2 as solid content concentration is preferably 0.01 to 0.5 g / m 2.
前記多層フィルムの場合は、帯電防止剤を含有する熱可塑性樹脂層に熱接着性樹脂、特に、ヒートシール性樹脂を選択し、これをベース樹脂として、練込形帯電防止剤や必要に応じて粘着性付与樹脂等を配合して組成物としたものから該層を構成することが特に好ましい。
好適に用いることのできるベース樹脂として、ポリエチレンやエチレン・酢酸ビニル共重合体系樹脂等、既に述べた単層フィルムの構成樹脂と同じものを例示することができる。
これらの内では、単層フィルムの場合と同様、エチレン共重合体樹脂、特に｛酢酸ビニル含量３〜１５重量％の｝エチレン・酢酸ビニル共重合体系樹脂が好ましい。
又、ＣＭＰＳ等の市販品シール樹脂も用いることができる。
In the case of the multilayer film, a thermoadhesive resin, particularly a heat-sealable resin, is selected for the thermoplastic resin layer containing the antistatic agent, and this is used as a base resin, and a kneaded antistatic agent or as required. It is particularly preferable that the layer is composed of a composition obtained by blending a tackifying resin or the like.
Examples of the base resin that can be suitably used include the same resins as those already described for the single-layer film, such as polyethylene and ethylene / vinyl acetate copolymer resins.
Among these, as in the case of the single layer film, an ethylene copolymer resin, particularly an ethylene / vinyl acetate copolymer resin having a vinyl acetate content of 3 to 15% by weight is preferred.
Commercially available seal resins such as CMPS can also be used.
又、上記ベース樹脂に配合される練込形の帯電防止剤としては、これも既に単層フィルムで挙げたのと同じアニオン系界面活性剤、カチオン系界面活性剤、両性界面活性剤、非イオン系界面活性剤、アルキルアミン等を例示することができる。
これらの内で、押出しラミネート法による練込型の帯電防止剤としてはグリセリンモノステアレート等の非イオン系界面活性剤が好ましい。
その配合量は用いる帯電防止剤の種類、ベース樹脂種、用途等により適宜定められるが、通常ベース樹脂１００重量部に対し０．１〜５重量部程度である。
Also, as the kneaded antistatic agent blended in the base resin, the same anionic surfactant, cationic surfactant, amphoteric surfactant, nonionic as already mentioned for the single layer film. Examples thereof include system surfactants and alkylamines.
Of these, nonionic surfactants such as glycerin monostearate are preferred as the kneading type antistatic agent by the extrusion laminating method.
The blending amount is appropriately determined depending on the kind of the antistatic agent to be used, the type of the base resin, the use, etc., but is usually about 0.1 to 5 parts by weight with respect to 100 parts by weight of the base resin.
更に、該層には、粘着性付与樹脂を配合しても良く、粘着性付与樹脂としては、所謂タッキファイヤーと呼ばれるポリエチレン系樹脂、キシレン樹脂、水添石油樹脂、エステルガム、クマロン樹脂等が例示出来、その配合量は適宜である。 Further, the layer may contain a tackifier resin. Examples of the tackifier resin include so-called tackifier polyethylene resin, xylene resin, hydrogenated petroleum resin, ester gum, coumarone resin and the like. It is possible to mix them appropriately.
前記層の厚さは、内容物、用途等によって適宜設定されるが、通常５〜５０μｍ、好ましくは１０〜３０μｍである。
この層に施される極性基付与処理は、既に述べた単層フィルムの場合とほぼ同様に行われ、好適な処理方法であるコロナ放電処理の場合、その放電密度は、帯電防止剤を含有する熱可塑性樹脂の種類、厚み、その他の諸条件により変化して設定されるが、一般に５〜１５０ｗ・分／ｍ２程度、より好ましくは１０〜１００ｗ・分／ｍ２である。
The thickness of the layer is appropriately set depending on the contents, use, etc., but is usually 5 to 50 μm, preferably 10 to 30 μm.
The polar group imparting treatment applied to this layer is carried out in substantially the same manner as in the case of the already described single layer film. In the case of corona discharge treatment which is a preferred treatment method, the discharge density contains an antistatic agent. type of the thermoplastic resin, the thickness, but is set by changing the other conditions, generally 5～150W · min / m 2 or so, more preferably 10 to 100 W · min / m 2.
本発明の多層フィルムは、上記各層を、それ自体公知の方法により積層して得られる。
その製作法の一例を挙げると、まず、外層フィルム層として予め外面に帯電防止コートを施した二軸延伸ポリエステル樹脂フィルムを用意し、別に、中間層としてのポリエチレンと帯電防止剤含有熱可塑性樹脂層（ヒートシール層）としての帯電防止剤入りエチレン・酢酸ビニル共重合体系樹脂組成物（ＥＶＡ樹脂組成物）とをそれぞれ用意し、これらを、例えば、押出ラミネーターにより積層する。
即ち、押出機から前記ポリエチレンを二軸延伸ポリエステル樹脂フィルム上に押出し、更にその上にＥＶＡ樹脂組成物（帯電防止剤含有熱可塑性樹脂）を順次押出してラミネートフィルム（多層フィルム）が作製される。
ポリエステル樹脂フィルムには、その中間層（ポリエチレン層）を積層する面にアンカーコート剤（ＡＣ剤）を塗布したものを用いることが好ましい。
The multilayer film of the present invention is obtained by laminating each of the above layers by a method known per se.
As an example of the production method, first, as the outer layer film layer, a biaxially stretched polyester resin film having an antistatic coating applied to the outer surface in advance is prepared, and separately, an intermediate layer of polyethylene and an antistatic agent-containing thermoplastic resin layer is prepared. An antistatic agent-containing ethylene / vinyl acetate copolymer resin composition (EVA resin composition) as a (heat seal layer) is prepared, and these are laminated by, for example, an extrusion laminator.
That is, the polyethylene is extruded onto a biaxially stretched polyester resin film from an extruder, and an EVA resin composition (antistatic agent-containing thermoplastic resin) is sequentially extruded thereon to produce a laminate film (multilayer film).
It is preferable to use what applied the anchor coating agent (AC agent) to the surface which laminates | stacks the intermediate | middle layer (polyethylene layer) for a polyester resin film.
ラミネート方法としては、シングルラミネーターやタンデムラミネーターを用いて、ポリエチレン（中間層）とＥＶＡ樹脂組成物（帯電防止剤含有熱可塑性樹脂層）を順次押出しラミネートする方法、或は、中間層と帯電防止剤含有熱可塑性樹脂層を共押出する方法などがある。
次いで、得られた積層フィルムのＥＶＡ樹脂組成物層（帯電防止剤含有熱可塑性樹脂層）の二軸延伸ポリエステル樹脂フィルム層（外層フィルム層）側と反対側の面をコロナ処理して本発明の多層フィルムを得ることができる。
As a laminating method, a single laminator or tandem laminator is used to sequentially extrude and laminate polyethylene (intermediate layer) and EVA resin composition (antistatic agent-containing thermoplastic resin layer), or the intermediate layer and antistatic agent. There is a method of co-extrusion of the containing thermoplastic resin layer.
Subsequently, the surface opposite to the biaxially stretched polyester resin film layer (outer film layer) side of the EVA resin composition layer (antistatic agent-containing thermoplastic resin layer) of the obtained laminated film was subjected to corona treatment. A multilayer film can be obtained.
既に述べたとおり、帯電防止剤を含有する熱可塑性樹脂層の少なくとも片面に極性基付与処理が施されている本発明の単層、多層フィルムは帯電防止性能及びその安定持続性に優れ、食品包装、医薬品包装、繊維製品包装等広範な物品の包装に好適に用いることができるが、特に、厳密な静電シールド性が求められる半導体素子等の精密電子部品の包装材料、袋材、容器材、とりわけ、ＩＣチップ等を収納するキャリアテープのカバーテープ材料として有用である。
特に、ポリエステル樹脂フィルム等からなる外層フィルム層とポリエチレンやエチレン系共重合体又はそれらを含む樹脂組成物からなる中間層と帯電防止剤含有エチレン・酢酸ビニル共重合体樹脂組成物等からなる帯電防止剤含有熱可塑性樹脂層とが積層されてなり、且つ、キャリアテープと接する帯電防止剤含有熱可塑性樹脂層にコロナ処理等の極性基付与処理が施された態様の多層フィルムは、低温度での熱接着が可能であると共にカバーテープとキャリアテープとの接着強度が、その剥離開封時にスムーズな剥離が達成できる程度の適度でバラツキの無い強度を有し、然も帯電防止性に優れ、特に、その経時的な安定持続性に顕著に優れる。
As already stated, the single layer and multilayer film of the present invention in which the polar group imparting treatment is applied to at least one surface of the thermoplastic resin layer containing the antistatic agent is excellent in antistatic performance and its stability and sustainability, and food packaging It can be suitably used for packaging a wide range of articles such as pharmaceutical packaging and textile product packaging, but in particular, packaging materials for precision electronic parts such as semiconductor elements that require strict electrostatic shielding properties, bag materials, container materials, In particular, it is useful as a cover tape material for carrier tapes that store IC chips and the like.
In particular, an antistatic film comprising an outer film layer made of a polyester resin film, an intermediate layer made of polyethylene or an ethylene copolymer or a resin composition containing them, and an ethylene / vinyl acetate copolymer resin composition containing an antistatic agent. The multilayer film of the aspect in which the antistatic agent-containing thermoplastic resin layer in contact with the carrier tape is laminated with a polar group addition treatment such as corona treatment is laminated at a low temperature. Thermal bonding is possible and the adhesive strength between the cover tape and the carrier tape has moderate and non-uniform strength that can achieve smooth peeling at the time of peeling and opening. Its stability over time is remarkably excellent.
本発明を次の実施例により具体的に説明するが、本発明はこれら実施例により何ら限定されるものではない。 The present invention will be specifically described by the following examples, but the present invention is not limited to these examples.
「多層フィルム試料の作製」
外層フィルム材として、外面側に帯電防止コートを施した二軸延伸ポリエチレンテレフタレートフィルム（ＡＳコートＰＥＴ：厚さ２５μｍ）を用意し、別に、中間層用材として、低密度ポリエチレン（ＰＥ：ミラソン１６Ｐ：密度９２３ｋｇ／ｍ３、ＭＦＲ３．７ｇ／１０分）と帯電防止剤含有熱可塑性樹脂層用材として、エチレン・酢酸ビニル共重合体１００重量部にグリセリン脂肪酸エステル系帯電防止剤を０．５重量部、及び粘着付与剤（荒川化学工業株式会社 アルコンＡＭ１）を１０重量部混合してなるエチレン・酢酸ビニル共重合体系樹脂組成物（帯電防止剤入りＥＶＡ系樹脂）を用い、これらを押出機（６５ｍｍφ、Ｌ／Ｄ＝２８）、スクリュー（３ステージ型、溝深さ比＝４．７８）、ダイ（９００ｍｍ幅、インナーディケル型）を用いて、加工速度８０ｍ／分、樹脂温度（ＰＥ：３２０℃、ＥＶＡ系樹脂：２２０℃）、加工幅５００ｍｍの条件下で三層のラミネートフィルムを作製した。
"Production of multilayer film samples"
As an outer layer film material, a biaxially stretched polyethylene terephthalate film (AS-coated PET: thickness 25 μm) having an antistatic coating on the outer surface side is prepared, and separately, a low density polyethylene (PE: Milason 16P: density) is used as an intermediate layer material. 923 kg / m 3 , MFR 3.7 g / 10 min) and antistatic agent-containing thermoplastic resin layer material, 100 parts by weight of ethylene / vinyl acetate copolymer, 0.5 part by weight of glycerin fatty acid ester antistatic agent, and An ethylene / vinyl acetate copolymer resin composition (EVA resin with an antistatic agent) obtained by mixing 10 parts by weight of a tackifier (Arakawa Chemical Industries, Ltd., Alcon AM1) is used as an extruder (65 mmφ, L / D = 28), screw (3-stage type, groove depth ratio = 4.78), die (900 mm width, inner deck) A three-layer laminate film was produced under the conditions of a processing speed of 80 m / min, a resin temperature (PE: 320 ° C., EVA resin: 220 ° C.), and a processing width of 500 mm.
上記に並行して、前記二軸延伸ポリエチレンテレフタレートフィルムの内面側にアンカーコート剤（ＡＣ剤：大日精化製；セイカダイン２７１０Ａ／Ｃ；２液反応型）を塗布し、乾燥させた。
そして、ポリエチレン側面（中間層側面）と前記二軸延伸ポリエチレンテレフタレートフィルムのアンカーコート剤塗布面（内面側）とをラミネーターのラミネーション部で貼合せ、下記層構成の多層フィルム試料を得た。
多層フィルム試料の層構成：ＡＳコートＰＥＴ（２５μｍ）／ＡＣ剤・ＰＥ（１３μｍ）／帯電防止剤入りＥＶＡ系イージーピール樹脂（１７μｍ）。
In parallel with the above, an anchor coating agent (AC agent: manufactured by Dainichi Seika; Seikadyne 2710A / C; two-component reaction type) was applied to the inner surface side of the biaxially stretched polyethylene terephthalate film and dried.
And the polyethylene side surface (intermediate layer side surface) and the anchor coating agent application surface (inner surface side) of the biaxially stretched polyethylene terephthalate film were bonded together by a lamination part of a laminator to obtain a multilayer film sample having the following layer constitution.
Layer configuration of multilayer film sample: AS-coated PET (25 μm) / AC agent / PE (13 μm) / EV-based easy peel resin with antistatic agent (17 μm).
この試料フィルムを、その製作の４時間後に、該フィルムの帯電防止剤含有熱可塑性樹脂面（帯電防止剤入りＥＶＡ樹脂層面）に３５ｗ・分／ｍ２の放電処理密度でコロナ放電処理を施した。
更に、処理密度７０ｗ・分／ｍ２で同様にコロナ放電処理した試料フィルムも作製した。
This sample film was subjected to corona discharge treatment at a discharge treatment density of 35 w · min / m 2 on the surface of the antistatic agent-containing thermoplastic resin (surface of the EVA resin layer containing the antistatic agent) of the film 4 hours after the production. .
Further, a sample film subjected to corona discharge treatment at a treatment density of 70 w · min / m 2 was also produced.
「多層フィルム試料の耐電防止性能評価」
フィルム試料を、２３℃、相対湿度（ＲＨ）５０％（条件−１）、及び、４０℃、オーブン中（但し、測定はオーブンから取出した試料を条件−１の雰囲気に２４時間放置後に行った。）（条件−２）の各条件下に保管し、それぞれの試料について、測定器（ハイレスターＵＰ（三菱化学製））により、表面固有抵抗値の経時変化を測定した。
"Evaluation of anti-static performance of multilayer film samples"
The film sample was 23 ° C., relative humidity (RH) 50% (condition-1), and 40 ° C. in an oven (however, the measurement was performed after leaving the sample taken out of the oven in the atmosphere of condition-1 for 24 hours) .) (Condition-2) was stored under each condition, and the change in surface specific resistance value with time was measured for each sample with a measuring instrument (Hirester UP (manufactured by Mitsubishi Chemical)).
[実施例１]
上記層構成（ＡＳコートＰＥＴ（２５μｍ）／ＡＣ剤・ＰＥ（１３μｍ）／帯電防止剤入りＥＶＡ系樹脂（１７μｍ））の３５ｗ・分／ｍ２コロナ放電処理材に於ける２３℃（条件−１）、４０℃（条件−２）各保管品試料についてその帯電防止剤含有熱可塑性樹脂層面の表面固有抵抗値を経時的に測定した。
両保管品試料共に良好な実用レベルの値が得られた。
結果を表１に示す。
[Example 1]
23 ° C. (condition-1) in the above layer constitution (AS-coated PET (25 μm) / AC agent / PE (13 μm) / 35 wt.min / m 2 EVA resin with antistatic agent) ), 40 ° C. (Condition-2) The surface specific resistance value of the antistatic agent-containing thermoplastic resin layer surface of each stored product sample was measured over time.
Good values for practical use were obtained for both samples.
The results are shown in Table 1.
[実施例２]
測定試料として、７０ｗ・分／ｍ２コロナ放電処理試料を用いた以外は実施例１と同様に帯電防止剤含有熱可塑性樹脂層面の表面固有抵抗値を測定した。
実施例１と同様、両保管品試料共に良好な実用レベルの値が得られた。
結果を表１に示す。
[Example 2]
The surface resistivity of the antistatic agent-containing thermoplastic resin layer surface was measured in the same manner as in Example 1 except that a 70 w · min / m 2 corona discharge treatment sample was used as the measurement sample.
As in Example 1, good practical level values were obtained for both samples.
The results are shown in Table 1.
[比較例１]
帯電防止剤含有熱可塑性樹脂層面にコロナ放電処理を施さなかった以外は実施例１と同じ層構成に作製し、同様に保管した試料フィルムについて、その熱接着剤層面の表面固有抵抗値を測定した。
２３℃（条件−１）品の初期と４０℃（条件−２）品の７日後以降は表面固有抵抗値が高すぎて測定できなかった。
結果を表１に示す。
[Comparative Example 1]
The surface resistivity of the thermal adhesive layer surface of the sample film prepared in the same layer configuration as in Example 1 and stored in the same manner except that the antistatic agent-containing thermoplastic resin layer surface was not subjected to corona discharge treatment was measured. .
The initial value of the product at 23 ° C. (condition-1) and 7 days after the product at 40 ° C. (condition-2) were too high to measure the surface resistivity.
The results are shown in Table 1.
表１から、本発明の多層フィルムは、比較例品に比べ、帯電防止性、特に、その経時持続性に顕著に優れることが判る。
｛帯電防止剤含有熱可塑性樹脂層の少なくとも一面にコロナ処理を施した本願発明のフィルムが、従来品に比べて帯電防止性の経時的安定性に顕著に優れる理由は未だ解明されたわけではないが、コロナ処理により、該層中に練込まれた帯電防止剤が経時的に滲出拡散し熱接着剤層のキャリアテープと接する面からブリードアウトして散失するのが抑制されるためではないかと推定される。｝
From Table 1, it can be seen that the multilayer film of the present invention is remarkably superior in antistatic property, particularly in its temporal sustainability, as compared with the comparative product.
{The reason why the film of the present invention in which at least one surface of the antistatic agent-containing thermoplastic resin layer has been subjected to corona treatment is remarkably superior in anti-static properties over time compared to conventional products has not yet been elucidated. It is presumed that the antistatic agent kneaded in the layer is prevented from bleed out and dissipated from the surface contacting the carrier tape of the thermal adhesive layer and lost by corona treatment. Is done. }
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007174300A JP2009019063A (en) | 2007-06-11 | 2007-07-02 | Thermoplastic resin film |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007154315 | 2007-06-11 | ||
| JP2007174300A JP2009019063A (en) | 2007-06-11 | 2007-07-02 | Thermoplastic resin film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2009019063A true JP2009019063A (en) | 2009-01-29 |
Family
ID=40358994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007174300A Pending JP2009019063A (en) | 2007-06-11 | 2007-07-02 | Thermoplastic resin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009019063A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011063662A (en) * | 2009-09-15 | 2011-03-31 | Du Pont Mitsui Polychem Co Ltd | Sealant material, cover tape, and packaging body for transporting electronic component |
| JP2011162228A (en) * | 2010-02-09 | 2011-08-25 | Asahi Kasei Chemicals Corp | Cover tape |
| JP2012188509A (en) * | 2011-03-09 | 2012-10-04 | Du Pont Mitsui Polychem Co Ltd | Sealant material, cover tape, and package for transporting electronic component |
| WO2013056843A1 (en) | 2011-10-19 | 2013-04-25 | Relius Coatings Gmbh & Co. Kg | Use of antistats in interior coating compositions |
| WO2013184187A1 (en) | 2012-06-05 | 2013-12-12 | Dow Global Technologies Llc | Films containing functional ethylene-based polymer compositions |
| WO2014083102A1 (en) | 2012-11-30 | 2014-06-05 | Basf Se | Use of antistatic agents in coating agents |
| US8999502B2 (en) | 2009-08-31 | 2015-04-07 | Asahi Kasei Chemicals Corporation | Cover tape, method for manufacturing cover tape, and electronic part package |
| JP2016132459A (en) * | 2015-01-16 | 2016-07-25 | 三井化学東セロ株式会社 | Sealant film for cover tape and cover tape |
| KR102038247B1 (en) * | 2019-01-22 | 2019-10-29 | 윤용식 | A static electricity elimination film, and nongrounded static electricity elimination apparatus comprising the same |
| WO2020262007A1 (en) * | 2019-06-25 | 2020-12-30 | Dic株式会社 | Layered film and lid member |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495746B1 (en) * | 1965-05-31 | 1974-02-08 | ||
| JPS6372545A (en) * | 1986-09-16 | 1988-04-02 | 東レ株式会社 | Packaging bag |
| JPH03217426A (en) * | 1990-01-24 | 1991-09-25 | Matsushita Electric Ind Co Ltd | Antistatic film |
| JPH09175592A (en) * | 1995-12-26 | 1997-07-08 | Du Pont Mitsui Polychem Co Ltd | Cover tape for packing electronic part |
| JP2002321788A (en) * | 2001-04-23 | 2002-11-05 | Showa Denko Packaging Co Ltd | Uncharged adhesive film and electronic parts transportation body using it |
| JP2003266016A (en) * | 2001-12-20 | 2003-09-24 | Nitto Denko Corp | Cover tape for conveying electronic part, manufacturing method therefor and electronic part conveying body |
| JP2004231227A (en) * | 2003-01-30 | 2004-08-19 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component |
-
2007
- 2007-07-02 JP JP2007174300A patent/JP2009019063A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495746B1 (en) * | 1965-05-31 | 1974-02-08 | ||
| JPS6372545A (en) * | 1986-09-16 | 1988-04-02 | 東レ株式会社 | Packaging bag |
| JPH03217426A (en) * | 1990-01-24 | 1991-09-25 | Matsushita Electric Ind Co Ltd | Antistatic film |
| JPH09175592A (en) * | 1995-12-26 | 1997-07-08 | Du Pont Mitsui Polychem Co Ltd | Cover tape for packing electronic part |
| JP2002321788A (en) * | 2001-04-23 | 2002-11-05 | Showa Denko Packaging Co Ltd | Uncharged adhesive film and electronic parts transportation body using it |
| JP2003266016A (en) * | 2001-12-20 | 2003-09-24 | Nitto Denko Corp | Cover tape for conveying electronic part, manufacturing method therefor and electronic part conveying body |
| JP2004231227A (en) * | 2003-01-30 | 2004-08-19 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8999502B2 (en) | 2009-08-31 | 2015-04-07 | Asahi Kasei Chemicals Corporation | Cover tape, method for manufacturing cover tape, and electronic part package |
| JP2011063662A (en) * | 2009-09-15 | 2011-03-31 | Du Pont Mitsui Polychem Co Ltd | Sealant material, cover tape, and packaging body for transporting electronic component |
| JP2011162228A (en) * | 2010-02-09 | 2011-08-25 | Asahi Kasei Chemicals Corp | Cover tape |
| JP2012188509A (en) * | 2011-03-09 | 2012-10-04 | Du Pont Mitsui Polychem Co Ltd | Sealant material, cover tape, and package for transporting electronic component |
| WO2013056843A1 (en) | 2011-10-19 | 2013-04-25 | Relius Coatings Gmbh & Co. Kg | Use of antistats in interior coating compositions |
| WO2013184187A1 (en) | 2012-06-05 | 2013-12-12 | Dow Global Technologies Llc | Films containing functional ethylene-based polymer compositions |
| WO2014083102A1 (en) | 2012-11-30 | 2014-06-05 | Basf Se | Use of antistatic agents in coating agents |
| JP2016132459A (en) * | 2015-01-16 | 2016-07-25 | 三井化学東セロ株式会社 | Sealant film for cover tape and cover tape |
| KR102038247B1 (en) * | 2019-01-22 | 2019-10-29 | 윤용식 | A static electricity elimination film, and nongrounded static electricity elimination apparatus comprising the same |
| WO2020262007A1 (en) * | 2019-06-25 | 2020-12-30 | Dic株式会社 | Layered film and lid member |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009019063A (en) | Thermoplastic resin film | |
| JP5930577B2 (en) | Packaging bags and packaging containers | |
| JP6015135B2 (en) | Packaging materials | |
| JP5589613B2 (en) | Laminated film | |
| JP7331970B2 (en) | transparent conductive cover tape | |
| JP6923519B2 (en) | Packaging sheet and packaging | |
| JP4544563B2 (en) | Heat seal laminate and carrier tape package | |
| JP4942858B2 (en) | Resin composition, heat seal film, and laminated film | |
| JP5678571B2 (en) | Laminate for packaging materials | |
| JP2012045886A (en) | Coextruded multilayer film, and lid material using the same | |
| JP5962864B2 (en) | Anti-fogging multilayer film, laminate using the same, and packaging material | |
| JP4912970B2 (en) | Thermoplastic resin multilayer laminate | |
| JP7206747B2 (en) | Adhesive resin composition and easily peelable film | |
| JP5095509B2 (en) | Laminated film | |
| JP2017193120A (en) | Laminate and stick-shaped packaging bag using the same | |
| JP4334858B2 (en) | Cover tape for taping packaging of electronic parts | |
| JP2003145694A (en) | Seal film and laminate | |
| JP4904770B2 (en) | Easy-peelable adhesive for polyethylene and its structure | |
| JP2012087219A (en) | Resin composition and sealant layer for packaging material comprising the same | |
| JP5095508B2 (en) | Laminated film | |
| JPH0796585A (en) | Cover material | |
| JP4826018B2 (en) | Carrier tape lid | |
| JP4178847B2 (en) | Polyolefin polymer laminated film and package | |
| JP6590235B1 (en) | Easy-open laminated film, easy-open laminated film | |
| JP4438464B2 (en) | Cover tape for packaging electronic parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100513 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120427 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120508 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120627 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20121127 |