JP2008540134A - 実質的に物質を除去しないスケールの製造方法および装置 - Google Patents
実質的に物質を除去しないスケールの製造方法および装置 Download PDFInfo
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- JP2008540134A JP2008540134A JP2008510640A JP2008510640A JP2008540134A JP 2008540134 A JP2008540134 A JP 2008540134A JP 2008510640 A JP2008510640 A JP 2008510640A JP 2008510640 A JP2008510640 A JP 2008510640A JP 2008540134 A JP2008540134 A JP 2008540134A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 title claims description 32
- 239000000463 material Substances 0.000 title claims description 22
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 238000005303 weighing Methods 0.000 claims abstract description 7
- 239000007769 metal material Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/347—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells using displacement encoding scales
- G01D5/34707—Scales; Discs, e.g. fixation, fabrication, compensation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Optical Transform (AREA)
- Medicines Containing Material From Animals Or Micro-Organisms (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
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Abstract
Description
それよりむしろ、目盛り線が、スケール基板における異なる高さの部分によりもたらされる。
Claims (25)
- スケール基板を用意し、
レーザー光線を前記スケール基板に導くことを含み、
レーザーパラメータが、前記レーザー光線が入射する前記スケール基板における局所が、変位され、従って、目盛り線を作るようにある読取装置のための計量スケールを製造する方法。 - 前記レーザー光線は、パルス状である請求項1記載の方法。
- 前記スケール基板の局所は、物質の実質的な除去なしに変位される請求項1または請求項2記載の方法。
- 前記レーザーパラメータは、前記レーザー光線が導かれる前記スケール基板の局所が溶融されるようにある請求項1乃至3のうちのいずれかに記載の方法。
- 基板物質の前記変位は、前記基板を軟化させる最初の工程と、それから、レーザーエネルギーを使って基板を変位させる工程とを含む請求項1乃至4のうちのいずれかに記載の方法。
- 前記スケール基板の変位により作られる前記目盛り線は、交互に窪みおよび***を含む請求項1乃至5のうちのいずれかに記載の方法。
- 前記窪みの深さは、レーザー光の多数のパルス、制御される該パルス相互間の間隔を使用することにより、増大され、前記目盛り線の深さに影響を及ぼす請求項6記載の方法。
- 前記目盛り線は、前記隣接する***が結合するように十分に接近している請求項6または請求項7記載の方法。
- 前記レーザーパラメータは、少なくとも一つの波長またはパルス持続時間を含む請求項1乃至8のうちのいずれかに記載の方法。
- 前記レーザーの出力は、前記スケール基板の局所を溶融させるように十分であるが、前記物質が沸騰または昇華を受けるように強力すぎない請求項1乃至9のうちのいずれかに記載の方法。
- 前記レーザー光線が、前記スケール基板に当てられる請求項1乃至10のうちのいずれかに記載の方法。
- 前記レーザーは、レンズを使って前記スケール基板に当てられる請求項11記載の方法。
- 前記レンズは、レーザーからの光が直線にあたるように集束させる請求項12記載の方法。
- マスクプロジェクションが、スケール形状を作るように使用される請求項1乃至10のうちのいずれかに記載される方法。
- 前記レーザーは、エキシマレーザーである請求項14記載の方法。
- 前記スケール基板が、金属物質である請求項1乃至15のうちのいずれかに記載される方法。
- 前記スケール基板が、均一な金属物質を含む請求項16に記載されるスケール基板。
- 前記スケール基板が、非金属物質上にメタリックコーティングしたものである請求項16に記載されるスケール基板。
- 前記スケール基板は、非金属物質である請求項1乃至15のうちのいずれかに記載される方法。
- 前記スケール基板は、均一な非金属物質である請求項19記載のスケール基板。
- 前記スケール基板は、他の物質上に非メタリックコーティングしたものを含む請求項19記載のスケール基板。
- 前記スケール基板は、ポリマーまたはガラスを含む請求項19乃至請求項21のうちのいずれかに記載のスケール基板。
- 前記スケールは、スケールが、様々なパラメータを有する異なるセグメントを有するフェーススケールを含む請求項1乃至22のうちのいずれかに記載の方法。
- 前記方法は、反射被覆が前記スケールに塗布される付加的な工程を含む請求項1乃至16、請求項19、または請求項23のうちのいずれかに記載の方法。
- 前記方法は、前記目盛り線が作られた場合、前記スケールが清浄される付加的な工程を含む請求項1乃至16、または、請求項19、請求項23、請求項24のうちのいずれかに記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0509727.4 | 2005-05-13 | ||
GBGB0509727.4A GB0509727D0 (en) | 2005-05-13 | 2005-05-13 | Method and apparatus for scale manufacture |
PCT/GB2006/001714 WO2006120440A1 (en) | 2005-05-13 | 2006-05-10 | Method and apparatus for scale manufacture without substantial removal of material |
Publications (2)
Publication Number | Publication Date |
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JP2008540134A true JP2008540134A (ja) | 2008-11-20 |
JP5280197B2 JP5280197B2 (ja) | 2013-09-04 |
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JP2008510640A Expired - Fee Related JP5280197B2 (ja) | 2005-05-13 | 2006-05-10 | 実質的に物質を除去しないスケールの製造方法および装置 |
Country Status (8)
Country | Link |
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US (1) | US8674258B2 (ja) |
EP (1) | EP1896217B1 (ja) |
JP (1) | JP5280197B2 (ja) |
CN (1) | CN101175597B (ja) |
AT (1) | ATE490836T1 (ja) |
DE (1) | DE602006018734D1 (ja) |
GB (1) | GB0509727D0 (ja) |
WO (1) | WO2006120440A1 (ja) |
Cited By (2)
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JP2011117766A (ja) * | 2009-12-01 | 2011-06-16 | Canon Inc | 干渉計測方法 |
JP2015001412A (ja) * | 2013-06-14 | 2015-01-05 | 株式会社ミツトヨ | 光電式測定器用スケール、エンコーダ及びスケールの形成方法 |
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-
2005
- 2005-05-13 GB GBGB0509727.4A patent/GB0509727D0/en not_active Ceased
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2006
- 2006-05-10 AT AT06727070T patent/ATE490836T1/de not_active IP Right Cessation
- 2006-05-10 EP EP06727070A patent/EP1896217B1/en not_active Not-in-force
- 2006-05-10 JP JP2008510640A patent/JP5280197B2/ja not_active Expired - Fee Related
- 2006-05-10 DE DE602006018734T patent/DE602006018734D1/de active Active
- 2006-05-10 CN CN2006800165309A patent/CN101175597B/zh not_active Expired - Fee Related
- 2006-05-10 US US11/918,986 patent/US8674258B2/en active Active
- 2006-05-10 WO PCT/GB2006/001714 patent/WO2006120440A1/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011117766A (ja) * | 2009-12-01 | 2011-06-16 | Canon Inc | 干渉計測方法 |
JP2015001412A (ja) * | 2013-06-14 | 2015-01-05 | 株式会社ミツトヨ | 光電式測定器用スケール、エンコーダ及びスケールの形成方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2006120440A1 (en) | 2006-11-16 |
JP5280197B2 (ja) | 2013-09-04 |
US8674258B2 (en) | 2014-03-18 |
CN101175597B (zh) | 2011-07-13 |
DE602006018734D1 (de) | 2011-01-20 |
EP1896217B1 (en) | 2010-12-08 |
CN101175597A (zh) | 2008-05-07 |
US20090026184A1 (en) | 2009-01-29 |
EP1896217A1 (en) | 2008-03-12 |
ATE490836T1 (de) | 2010-12-15 |
GB0509727D0 (en) | 2005-06-22 |
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