JP2008310163A - Proximity scanning exposure apparatus and its illuminance control method - Google Patents

Proximity scanning exposure apparatus and its illuminance control method Download PDF

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JP2008310163A
JP2008310163A JP2007159194A JP2007159194A JP2008310163A JP 2008310163 A JP2008310163 A JP 2008310163A JP 2007159194 A JP2007159194 A JP 2007159194A JP 2007159194 A JP2007159194 A JP 2007159194A JP 2008310163 A JP2008310163 A JP 2008310163A
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illuminance
mask
exposure light
substrate
illuminance sensor
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JP5057370B2 (en
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Toshiyuki Kondo
俊之 近藤
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NSK Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a proximity scanning apparatus for highly accurately performing exposure by controlling illuminance of each light source in a plurality of radiation parts in sameness, and to provide its illuminance control method. <P>SOLUTION: The proximity scanning apparatus 1 includes: a substrate conveying mechanism 10 for conveying substrates W in an X direction; a plurality of mask holding parts 11 arranged in zigzag along a Y direction by holding a plurality of masks M formed with patterns respectively; the plurality of the radiation parts 14 radiating exposure light by being arranged on the upper parts of the plurality of the mask holding parts respectively; a plurality of first illuminance sensors 41 arranged above the respective mask holding parts 11 for detecting the illuminance of the exposure light EL in the radiation parts 14 by being arranged in the plurality of the radiation parts 14 respectively; and a second illuminance sensor 42 for detecting the illuminance of each exposure light EL, capable of moving to each position being radiated by each exposure light EL from the plurality of the radiation parts 14. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、近接スキャン露光装置及びその照度制御方法に関し、より詳細には、複数の照射部を同一照度に制御可能な近接スキャン露光装置及びその照度制御方法に関する。   The present invention relates to a proximity scan exposure apparatus and an illuminance control method thereof, and more particularly to a proximity scan exposure apparatus and a illuminance control method thereof capable of controlling a plurality of irradiation units to the same illuminance.

従来、大型の薄形テレビ等に用いられる液晶ディスプレイやプラズマディスプレイ等の大型のフラットパネルディスプレイの製造方法として、基板を搬送しながら、基板上にマスクのパターンを露光転写するものが知られている（例えば、特許文献１参照。）。特許文献１に記載の露光装置では、複数のマスクと、マスク毎に光源を有する露光光学系とが設けられ、吸排気エアパッド上で浮上して搬送される基板に対して、光源からの露光用光を照射させ、マスクのパターンを基板に露光転写する。
特開２００７−７２２６７号公報 Conventionally, as a manufacturing method of a large flat panel display such as a liquid crystal display or a plasma display used for a large thin television, a method of exposing and transferring a mask pattern onto the substrate while conveying the substrate is known. (For example, refer to Patent Document 1). In the exposure apparatus described in Patent Document 1, a plurality of masks and an exposure optical system having a light source for each mask are provided, and for exposure from a light source to a substrate that is floated and conveyed on an intake / exhaust air pad. Light is irradiated, and the pattern of the mask is exposed and transferred to the substrate.
JP 2007-72267 A

ところで、高圧水銀ランプ等の光源の照度は、点灯時間に反比例して次第に低下する特性を有している。特に、特許文献１に記載の露光装置では、複数の光源を用いて露光が行われるため、各光源の照度に違いがあると露光ムラ等、露光精度が低下してしまう。特許文献１では、各光源の照度制御について具体的な記載はなく、各光源の照度を同一に制御することが望まれる。   Incidentally, the illuminance of a light source such as a high-pressure mercury lamp has a characteristic of gradually decreasing in inverse proportion to the lighting time. In particular, in the exposure apparatus described in Patent Document 1, since exposure is performed using a plurality of light sources, if there is a difference in the illuminance of each light source, exposure accuracy such as exposure unevenness decreases. In Patent Document 1, there is no specific description about the illuminance control of each light source, and it is desired to control the illuminance of each light source to be the same.

本発明は、上記の事情に鑑みてなされたものであり、その目的は、複数の照射部における各光源の照度を同一に制御することができ、高精度に露光を行うことができる近接スキャン露光装置及びその照度制御方法を提供することにある。   The present invention has been made in view of the above circumstances, and an object thereof is proximity scanning exposure that can control the illuminance of each light source in a plurality of irradiation units to be the same and perform exposure with high accuracy. An object of the present invention is to provide an apparatus and an illuminance control method thereof.

本発明の上記目的は、下記の構成により達成される。
（１） 所定方向に搬送される基板に対して近接する複数のマスクを介して露光用光を照射し、前記基板に前記複数のマスクのパターンを露光する近接スキャン露光装置であって、
前記基板を所定方向に搬送する基板搬送機構と、
前記パターンを形成した前記複数のマスクをそれぞれ保持し、前記所定方向と交差する方向に沿って千鳥状に配置される複数のマスク保持部と、
前記複数のマスク保持部の上部にそれぞれ配置され、露光用光を照射する複数の照射部と、
前記複数の照射部内にそれぞれ配置され、照射部内での前記露光用光の照度を検出する複数の第１照度センサと、
前記複数の照射部からの各露光用光が照射される各位置に移動可能で、前記各露光用光の照度を検出する第２照度センサと、
を備えることを特徴とする近接スキャン露光装置。
（２） 前記マスクを交換すべく、前記マスクを搬入又は搬出するための受け渡し位置と、前記各マスク保持部の下面と対向する交換位置との間を移動可能なマスクトレー部を有するマスクチェンジャーをさらに備え、
前記第２照度センサは、前記マスクトレー部に取り付けられることを特徴とする（１）に記載の近接スキャン露光装置。
（３） 基板を所定方向に搬送する基板搬送機構と、パターンを形成した複数のマスクをそれぞれ保持し、前記所定方向と交差する方向に沿って千鳥状に配置される複数のマスク保持部と、前記複数のマスク保持部の上部にそれぞれ配置され、露光用光を照射する光源をそれぞれ有する複数の照射部と、前記複数の照射部内にそれぞれ配置され、照射部内での前記露光用光の照度を検出する複数の第１照度センサと、前記複数の照射部からの各露光用光が照射される各位置に移動可能で、前記各露光用光の照度を検出する第２照度センサと、を備え、前記所定方向に搬送される基板に対して近接する前記複数のマスクを介して前記露光用光を照射し、前記基板に前記複数のマスクのパターンを露光する近接スキャン露光装置の照度制御方法であって、
前記第２照度センサを前記複数の照射部の各露光用光が照射される各位置に移動して、前記各露光用光の照度を検出する工程と、
前記第２照度センサによって検出される、前記複数の照射部から照射される各露光用光の照度値が目標照度値となるように前記光源の電流値を調整する工程と、
前記調整された前記各光源が照射する各露光用光の照度値を前記第１照度センサによって検出する工程と、
前記第１照度センサによって検出された前記各光源が照射する各露光用光の照度値が維持されるように、前記各光源の電流値を制御する工程と、
を有することを特徴とする近接スキャン露光装置の照度制御方法。
（４） 前記第２照度センサは、前記マスクを交換するためのマスクチェンジャーのマスクトレー部に取り付けられており、
前記第２照度センサによる照度の検出工程と、前記光源の電流値を調整する工程は、前記マスクトレー部が前記各マスク保持部の下面と対向する交換位置に移動した際に行われることを特徴とする（３）に記載の近接スキャン露光装置の照度制御方法。 The above object of the present invention can be achieved by the following constitution.
(1) A proximity scan exposure apparatus that irradiates exposure light through a plurality of masks close to a substrate conveyed in a predetermined direction and exposes the patterns of the plurality of masks on the substrate,
A substrate transport mechanism for transporting the substrate in a predetermined direction;
Each of the plurality of masks formed with the pattern is held, and a plurality of mask holding portions arranged in a staggered manner along a direction intersecting the predetermined direction,
A plurality of irradiation units that are respectively disposed on top of the plurality of mask holding units and irradiate exposure light; and
A plurality of first illuminance sensors that are respectively arranged in the plurality of irradiation units and detect the illuminance of the exposure light in the irradiation units;
A second illuminance sensor that is movable to each position irradiated with each exposure light from the plurality of irradiation units and detects the illuminance of each exposure light;
A proximity scan exposure apparatus comprising:
(2) A mask changer having a mask tray portion movable between a delivery position for carrying in or carrying out the mask and an exchange position facing the lower surface of each mask holding part in order to exchange the mask. In addition,
The proximity scan exposure apparatus according to (1), wherein the second illuminance sensor is attached to the mask tray portion.
(3) A substrate transport mechanism that transports the substrate in a predetermined direction, a plurality of masks that form patterns, and a plurality of mask holders that are arranged in a staggered manner along a direction that intersects the predetermined direction; A plurality of irradiation units respectively disposed on top of the plurality of mask holding units, each having a light source that irradiates exposure light, and disposed in each of the plurality of irradiation units, and the illuminance of the exposure light in the irradiation unit A plurality of first illuminance sensors to detect, and a second illuminance sensor that is movable to each position irradiated with each exposure light from the plurality of irradiation units and detects the illuminance of each exposure light. An illuminance control method for a proximity scan exposure apparatus that irradiates the exposure light through the plurality of masks close to the substrate conveyed in the predetermined direction and exposes the patterns of the plurality of masks on the substrate. Ah What
Moving the second illuminance sensor to each position where each exposure light of the plurality of irradiation units is irradiated, and detecting the illuminance of each exposure light;
Adjusting the current value of the light source so that the illuminance value of each exposure light emitted from the plurality of irradiating units detected by the second illuminance sensor becomes a target illuminance value;
Detecting the illuminance value of each exposure light irradiated by each of the adjusted light sources by the first illuminance sensor;
Controlling the current value of each light source such that the illuminance value of each exposure light emitted by each light source detected by the first illuminance sensor is maintained;
An illuminance control method for a proximity scan exposure apparatus, comprising:
(4) The second illuminance sensor is attached to a mask tray portion of a mask changer for replacing the mask.
The step of detecting the illuminance by the second illuminance sensor and the step of adjusting the current value of the light source are performed when the mask tray portion moves to an exchange position facing the lower surface of each mask holding portion. (3) The illuminance control method for the proximity scan exposure apparatus according to (3).

本発明の近接スキャン露光装置によれば、複数の照射部内にそれぞれ配置され、照射部内での露光用光の照度を検出する複数の第１照度センサと、複数の照射部からの各露光用光が照射される各位置に移動可能で、各露光用光の照度を検出する第２照度センサと、を備えるので、複数の照射部における各光源の照度を同一に制御することができ、高精度に露光を行うことができる。特に、複数の第１照度センサ間で測定誤差が生じる場合であっても、第２照度センサによって検出された照度に基づいて、各光源の電流値を制御することが可能となり、複数の第１照度センサを校正せずに照度制御することができる。   According to the proximity scan exposure apparatus of the present invention, a plurality of first illuminance sensors that are respectively arranged in a plurality of irradiation units and detect the illuminance of exposure light in the irradiation units, and each exposure light from the plurality of irradiation units. And a second illuminance sensor that detects the illuminance of each exposure light, so that the illuminance of each light source in the plurality of irradiation units can be controlled to be the same, with high accuracy. Can be exposed. In particular, even when a measurement error occurs between the plurality of first illuminance sensors, the current value of each light source can be controlled based on the illuminance detected by the second illuminance sensor, and the plurality of first illuminance sensors can be controlled. Illuminance can be controlled without calibrating the illuminance sensor.

また、本発明の近接スキャン露光装置の照度制御方法によれば、第２照度センサを複数の照射部の各露光用光が照射される各位置に移動して、各露光用光の照度を検出する工程と、第２照度センサによって検出される、複数の照射部から照射される各露光用光の照度値が目標照度値となるように光源の電流値を調整する工程と、調整された各光源が照射する各露光用光の照度値を第１照度センサによって検出する工程と、第１照度センサによって検出された各光源が照射する各露光用光の照度値が維持されるように、各光源の電流値を制御する工程と、を有するので、複数の照射部における各光源の照度を同一に制御しながら定照度運転することができ、高精度に露光を行うことができる。   Further, according to the illuminance control method of the proximity scan exposure apparatus of the present invention, the illuminance of each exposure light is detected by moving the second illuminance sensor to each position irradiated with each exposure light of the plurality of irradiation units. Adjusting the current value of the light source so that the illuminance value of each of the exposure light emitted from the plurality of irradiation units detected by the second illuminance sensor becomes the target illuminance value, and each adjusted The step of detecting the illuminance value of each exposure light emitted by the light source by the first illuminance sensor and the illuminance value of each exposure light emitted by each light source detected by the first illuminance sensor are maintained. And a step of controlling the current value of the light source. Therefore, the constant illuminance operation can be performed while the illuminance of each light source in the plurality of irradiation units is controlled to be the same, and exposure can be performed with high accuracy.

以下、本発明に係る近接スキャン露光装置及びその照度制御方法の実施形態を図面に基づいて詳細に説明する。   Embodiments of a proximity scan exposure apparatus and its illuminance control method according to the present invention will be described below in detail with reference to the drawings.

先ず、本実施形態の近接スキャン露光装置１の構成について概略説明する。図１及び図２に示すように、本実施形態の近接スキャン露光装置１は、基板（カラーフィルタ基板）Ｗを浮上させて支持すると共に、所定方向（図１のＸ方向）に搬送する基板搬送機構１０と、複数のマスクＭをそれぞれ保持し、所定方向と交差する方向（図１のＹ方向）に沿って千鳥状に二列配置された複数（図１に示す実施形態において、左右それぞれ６個）のマスク保持部１１と、マスク保持部１１を駆動するマスク駆動部１２と、複数のマスク保持部１１の上部にそれぞれ配置されて露光用光を照射する複数の照射部１４と、近接スキャン露光装置１の各作動部分の動きを制御する制御部１５と、を主に備える。   First, a schematic configuration of the proximity scan exposure apparatus 1 of the present embodiment will be described. As shown in FIGS. 1 and 2, the proximity scanning exposure apparatus 1 of the present embodiment floats and supports a substrate (color filter substrate) W and transports the substrate in a predetermined direction (X direction in FIG. 1). A plurality of mechanisms 10 and a plurality of masks M are respectively held and arranged in two rows in a staggered manner along a direction (Y direction in FIG. 1) intersecting a predetermined direction (in the embodiment shown in FIG. ) Mask holding units 11, a mask driving unit 12 that drives the mask holding units 11, a plurality of irradiation units 14 that are arranged above the plurality of mask holding units 11 and irradiate exposure light, and proximity scanning And a control unit 15 that controls the movement of each operating part of the exposure apparatus 1.

基板搬送機構１０は、基板ＷをＸ方向に搬送する領域、即ち、複数のマスク保持部１１の下方領域、及びその下方領域からＸ方向両側に亘る領域に設けられた浮上ユニット１６と、基板ＷのＹ方向一側（図１において上辺）を保持してＸ方向に搬送する基板駆動ユニット１７とを備える。浮上ユニット１６は、複数のフレーム１９上にそれぞれ設けられた複数の排気エアパッド２０及び吸排気エアパッド２１を備え、ポンプ（図示せず）やソレノイドバルブ（図示せず）を介して排気エアパッド２０や吸排気エアパッド２１からエアを排気或いは、吸排気する。基板駆動ユニット１７は、図１に示すように、浮上ユニット１６によって浮上、支持された基板Ｗの一端を保持する吸着パッド２２を備え、モータ２３、ボールねじ２４、及びナット（図示せず）からなるボールねじ機構２５によって、ガイドレール２６に沿って基板ＷをＸ方向に搬送する。なお、図２に示すように、複数のフレーム１９は、地面にレベルブロック１８を介して設置された装置ベース２７上に他のレベルブロック２８を介して配置されている。また、基板Ｗは、ボールねじ機構２５の代わりに、リニアサーボアクチュエータによって搬送されてもよい。   The substrate transport mechanism 10 includes a floating unit 16 provided in a region for transporting the substrate W in the X direction, that is, a region below the plurality of mask holders 11 and a region extending from the bottom region to both sides in the X direction. And a substrate driving unit 17 that holds the one side in the Y direction (the upper side in FIG. 1) and conveys it in the X direction. The levitation unit 16 includes a plurality of exhaust air pads 20 and intake / exhaust air pads 21 respectively provided on a plurality of frames 19, and the exhaust air pads 20 and the intake / exhaust air pads 21 are provided via pumps (not shown) and solenoid valves (not shown). Air is exhausted or sucked and exhausted from the exhaust air pad 21. As shown in FIG. 1, the substrate driving unit 17 includes a suction pad 22 that holds one end of the substrate W that is levitated and supported by the levitating unit 16, and includes a motor 23, a ball screw 24, and a nut (not shown). The substrate W is transported in the X direction along the guide rail 26 by the ball screw mechanism 25. As shown in FIG. 2, the plurality of frames 19 are arranged via another level block 28 on the apparatus base 27 installed on the ground via the level block 18. Further, the substrate W may be transported by a linear servo actuator instead of the ball screw mechanism 25.

マスク駆動部１２は、フレーム（図示せず）に取り付けられ、マスク保持部１１をＸ方向に沿って駆動するＸ方向駆動部３１と、Ｘ方向駆動部３１の先端に取り付けられ、マスク保持部１１をＹ方向に沿って駆動するＹ方向駆動部３２と、Ｙ方向駆動部３２の先端に取り付けられ、マスク保持部１１をθ方向（Ｘ，Ｙ方向からなる水平面の法線回り）に回転駆動するθ方向駆動部３３と、θ方向駆動部３３の先端に取り付けられ、マスク保持部１１をＺ方向（Ｘ，Ｙ方向からなる水平面の鉛直方向）に駆動するＺ方向駆動部３４と、を有する。これにより、Ｚ方向駆動部３４の先端に取り付けられたマスク保持部１１は、マスク駆動部１２によってＸ，Ｙ，Ｚ，θ方向に駆動可能である。なお、Ｘ，Ｙ，θ，Ｚ方向駆動部３１，３２，３３，３４の配置の順序は、適宜変更可能である。   The mask drive unit 12 is attached to a frame (not shown), and is attached to the X direction drive unit 31 that drives the mask holding unit 11 along the X direction, and the tip of the X direction drive unit 31. Is attached to the tip of the Y direction drive unit 32, and the mask holding unit 11 is rotationally driven in the θ direction (around the horizontal plane of the X and Y directions). A θ-direction drive unit 33 and a Z-direction drive unit 34 that is attached to the tip of the θ-direction drive unit 33 and drives the mask holding unit 11 in the Z direction (vertical direction of the horizontal plane composed of the X and Y directions). Accordingly, the mask holding unit 11 attached to the tip of the Z direction driving unit 34 can be driven in the X, Y, Z, and θ directions by the mask driving unit 12. Note that the order of arrangement of the X, Y, θ, and Z direction drive units 31, 32, 33, and 34 can be changed as appropriate.

図２に示すように、マスク保持部１１の上部に配置される照射部１４は、光源６、ミラー７、オプチカルインテグレータ（図示せず）、シャッター（図示せず）等を備える。光源６としては、紫外線を含んだ露光用光ＥＬを放射する、例えば超高圧水銀ランプ、キセノンランプ又は紫外線発光レーザが使用される。また、各照射部１４は、ミラー７の一部をハーフミラーとし、また、このハーフミラーを介して照射部１４内での光源６が照射する露光用光の照度を検出する第１照度センサ４１を備える。なお、第１照度センサ４１は、照射部１４内であれば、任意の位置に配置されていればよい。   As shown in FIG. 2, the irradiation unit 14 disposed on the upper part of the mask holding unit 11 includes a light source 6, a mirror 7, an optical integrator (not shown), a shutter (not shown), and the like. As the light source 6, for example, an ultra-high pressure mercury lamp, a xenon lamp or an ultraviolet light emitting laser that emits exposure light EL including ultraviolet light is used. Moreover, each irradiation part 14 makes a part of mirror 7 a half mirror, and the 1st illumination intensity sensor 41 which detects the illumination intensity of the light for exposure which the light source 6 in the irradiation part 14 irradiates through this half mirror. Is provided. In addition, the 1st illumination intensity sensor 41 should just be arrange | positioned in arbitrary positions, if it is in the irradiation part 14. FIG.

また、図１に示すように、千鳥状に二列配置された搬入側及び搬出側マスク保持部１１ａ，１１ｂ間には、各マスク保持部１１ａ，１１ｂのマスクＭを同時に交換可能なマスクチェンジャー２が配設されている。マスクチェンジャー２は、マスクＭを搬入又は搬出するための受け渡し位置ＷＰと、各マスク保持部１１の下面と対向する交換位置ＣＰとの間を移動可能な一対のマスクトレー部８を有し、使用済み或いは未使用のマスクＭを受け渡し位置ＷＰと交換位置ＣＰ間で搬送して、マスク交換を行う。また、マスクチェンジャー２により搬送される使用済み或いは未使用のマスクＭは、マスクストッカ３，４との間でローダー５により受け渡しが行われる。なお、マスクストッカ３，４とマスクチェンジャー２とで受け渡しが行われる間にマスクプリアライメント機構（図示せず）によってマスクＭのプリアライメントが行われる。また、一対のマスクトレー部８のマスクＭが載置される外側の位置には、それぞれ第２照度センサ４２が取り付けられている。第２照度センサ４２は、マスクトレー部８の各交換位置ＣＰへの移動とともに、複数の照射部１４からの各露光用光ＥＬが照射される各照度測定位置に移動し、複数の照射部１４から照射された各露光用光の照度を検出する。   Further, as shown in FIG. 1, a mask changer 2 capable of simultaneously exchanging the masks M of the mask holding portions 11a and 11b between the carry-in side and carry-out side mask holding portions 11a and 11b arranged in two rows in a staggered manner. Is arranged. The mask changer 2 has a pair of mask tray parts 8 that can move between a delivery position WP for carrying in or out the mask M and an exchange position CP facing the lower surface of each mask holding part 11. The used or unused mask M is transferred between the delivery position WP and the exchange position CP, and the mask is exchanged. The used or unused mask M conveyed by the mask changer 2 is transferred to and from the mask stockers 3 and 4 by the loader 5. The mask M is pre-aligned by a mask pre-alignment mechanism (not shown) during the transfer between the mask stockers 3 and 4 and the mask changer 2. Moreover, the 2nd illumination intensity sensor 42 is attached to the outer position where the mask M of a pair of mask tray part 8 is mounted, respectively. The second illuminance sensor 42 moves to each illuminance measurement position irradiated with each exposure light EL from the plurality of irradiation units 14 along with the movement of the mask tray unit 8 to each replacement position CP. The illuminance of each exposure light emitted from is detected.

このような近接スキャン露光装置１は、浮上ユニット１６の排気エアパッド２０及び吸排気エアパッド２１の空気流によって基板Ｗを浮上させて保持し、基板Ｗの一端を基板駆動ユニット１７で吸着してＸ方向に搬送する。そして、マスク保持部１１の下方に位置する基板Ｗに対して、照射部１４からの露光用光ＥＬが基板Ｗに近接するマスクＭを介して照射され、マスクＭのパターンを基板Ｗに塗布されたカラーレジストに転写する。   Such a proximity scan exposure apparatus 1 floats and holds the substrate W by the air flow of the exhaust air pad 20 and the intake / exhaust air pad 21 of the levitation unit 16, and adsorbs one end of the substrate W by the substrate drive unit 17 in the X direction. Transport to. Then, the exposure light EL from the irradiation unit 14 is irradiated to the substrate W located below the mask holding unit 11 through the mask M close to the substrate W, and the pattern of the mask M is applied to the substrate W. Transfer to the color resist.

また、本実施形態の近接スキャン露光装置１では、マスク交換時の段取り段階において、複数の照射部１４から照射される各露光用光ＥＬの照度を同一とするための照度調整が行われる。以下、このマスク交換時の照度制御方法について、図３〜図５を参照して説明する。   In the proximity scan exposure apparatus 1 of the present embodiment, the illuminance adjustment is performed to make the illuminances of the exposure light EL irradiated from the plurality of irradiation units 14 the same in the setup stage at the time of mask replacement. Hereinafter, the illuminance control method at the time of mask replacement will be described with reference to FIGS.

マスク交換は、図３に示すように、Ｙ方向一端に配置された１番目のマスク保持部１１ａ１，１１ｂ１から順次、隣のマスク保持部１１ａ２，１１ｂ２、・・・，１１ａ５，１１ｂ５にて行われ、最後に、Ｙ方向他端に配置された６番目のマスク保持部１１ａ６，１１ｂ６にて行われる。   As shown in FIG. 3, the mask exchange is performed sequentially from the first mask holding portions 11a1, 11b1 arranged at one end in the Y direction at the adjacent mask holding portions 11a2, 11b2, ..., 11a5, 11b5. Finally, the process is performed by the sixth mask holding portions 11a6 and 11b6 arranged at the other end in the Y direction.

まず、図４に示すように、１番目のマスク保持部１１ａ１，１１ｂ１のマスク交換を行うため、マスク保持部１１ａ１，１１ｂ１を上方に退避させ、マスクトレー部８をマスク保持部１１ａ１，１１ｂ１の下方の交換位置ＣＰに移動させる（ステップＳ１）。次に、マスク保持部１１ａ１，１１ｂ１に実装されているマスクＭをマスクトレー部８に受け渡す（ステップＳ２）。そして、マスクトレー部８の第２照度センサ４２をマスクＭが実装されていないマスク保持部１１ａ１，１１ｂ１の開口内の照度測定位置に移動させる（ステップＳ３）。この状態で、シャッターが開放されると（ステップＳ４）、第２照度センサ４２は、光源６から照射される露光用光ＥＬを測定可能となり、照度制御処理へ移行する（ステップＳ５）。   First, as shown in FIG. 4, in order to replace the masks of the first mask holding portions 11a1 and 11b1, the mask holding portions 11a1 and 11b1 are retracted upward, and the mask tray portion 8 is moved below the mask holding portions 11a1 and 11b1. Is moved to the exchange position CP (step S1). Next, the mask M mounted on the mask holding portions 11a1 and 11b1 is transferred to the mask tray portion 8 (step S2). And the 2nd illumination intensity sensor 42 of the mask tray part 8 is moved to the illumination intensity measurement position in opening of the mask holding | maintenance part 11a1, 11b1 in which the mask M is not mounted (step S3). In this state, when the shutter is released (step S4), the second illuminance sensor 42 can measure the exposure light EL emitted from the light source 6, and shifts to the illuminance control process (step S5).

ここで、図５に示すように、照度制御処理では、まず、第２照度センサ４２にて、マスク保持部１１ａ１，１１ｂ１上の照射部１４から照射される露光用光の照度を検出する（ステップＳ１１）。次に、第２照度センサ４２によって検出される、照射部１４から照射される露光用光ＥＬの照度値を設定された目標照度値、例えば、定照度運転を行なう際の仕様上の照度値に合わせ込むように、光源６の照射量、即ち、光源６の電流値を調整する（ステップＳ１２）。そして、第２照度センサ４２にて検出された照度値と目標照度値との差分が許容範囲内であるかどうか判定し（ステップＳ１３）、差分が許容範囲内となるまで、光源６の照射量を調整する。差分が許容範囲内となると、光源６の照射量、即ち、電流値を固定し（ステップＳ１４）、この照射量が固定された状態で、第１照度センサ４１は光源６が照射する露光用光の照度値を検出する（ステップＳ１５）。   Here, as shown in FIG. 5, in the illuminance control process, first, the illuminance of the exposure light irradiated from the irradiation unit 14 on the mask holding units 11a1 and 11b1 is detected by the second illuminance sensor 42 (step). S11). Next, the illuminance value of the exposure light EL emitted from the irradiating unit 14 detected by the second illuminance sensor 42 is set to a set target illuminance value, for example, an illuminance value on the specification when performing constant illuminance operation. The irradiation amount of the light source 6, that is, the current value of the light source 6 is adjusted so as to match (step S12). Then, it is determined whether or not the difference between the illuminance value detected by the second illuminance sensor 42 and the target illuminance value is within the allowable range (step S13), and the irradiation amount of the light source 6 until the difference is within the allowable range. Adjust. When the difference is within the allowable range, the irradiation amount of the light source 6, that is, the current value is fixed (step S 14), and the first illuminance sensor 41 irradiates the exposure light emitted by the light source 6 with this irradiation amount fixed. Is detected (step S15).

即ち、第１照度センサ４１と第２照度センサ４２との校正が完全に行われていれば、検出された各照度値の差分は０となるが、実際には多少のずれが生じる。このため、このずれ分がオフセット値として把握される。なお、オフセット値は、第１照度センサ４１で検出された照度値と目標照度値の差分であってもよい。そして、第１照度センサ４１が検出した照度値が維持されるように、光源６の照射量を制御する（ステップＳ１６）。   That is, if calibration between the first illuminance sensor 41 and the second illuminance sensor 42 is completely performed, the difference between the detected illuminance values is 0, but in reality, a slight deviation occurs. For this reason, this deviation is grasped as an offset value. The offset value may be a difference between the illuminance value detected by the first illuminance sensor 41 and the target illuminance value. Then, the irradiation amount of the light source 6 is controlled so that the illuminance value detected by the first illuminance sensor 41 is maintained (step S16).

照度制御処理が行われた後は、マスクトレー部８を第２照度センサ４２と共に露光領域内の各ポイントに移動させ、ポイント毎に照度測定を行い（ステップＳ６）、照度分布を取得する。その後、マスクトレー部８を受け渡し位置ＷＰに移動して（ステップＳ７）、使用済みマスクＭと未使用マスクＭの搬出、搬入が行なわれる。   After the illuminance control process is performed, the mask tray unit 8 is moved to each point in the exposure area together with the second illuminance sensor 42, and the illuminance measurement is performed for each point (step S6) to obtain the illuminance distribution. Thereafter, the mask tray unit 8 is moved to the delivery position WP (step S7), and the used mask M and the unused mask M are carried out and carried in.

そして、これら上記動作がマスク保持部１１ａ，１１ｂ毎に行われる。これにより、各照射部１４内に配置された第１照度センサ４１で検出された照度値と第２照度センサ４２（或いは、目標照度値）との差分によるオフセット値が各マスク保持部１１ａ，１１ｂに対して得られる。   These operations are performed for each of the mask holding portions 11a and 11b. Thereby, the offset value by the difference of the illumination value detected by the 1st illumination intensity sensor 41 arrange | positioned in each irradiation part 14 and the 2nd illumination intensity sensor 42 (or target illumination intensity value) is each mask holding | maintenance part 11a, 11b. Against.

従って、定照度運転を行なう場合には、各照射部１４の光源６がオフセット値を保つ、即ち、ステップＳ１６において第１照度センサ４１が検出した照度値を維持するように、各光源６の照射量を制御することで、露光転写時に複数のマスクＭを介して基板Ｗに照射される各露光用光の照度が同一となり、高精度に露光を行うことができる。   Therefore, when performing constant illuminance operation, the light source 6 of each irradiation unit 14 maintains the offset value, that is, the irradiation of each light source 6 so as to maintain the illuminance value detected by the first illuminance sensor 41 in step S16. By controlling the amount, the illuminance of each exposure light applied to the substrate W through the plurality of masks M during exposure transfer becomes the same, and exposure can be performed with high accuracy.

従って、本実施形態の近接スキャン露光装置１によれば、複数の照射部１４内にそれぞれ配置され、照射部１４内での露光用光ＥＬの照度を検出する複数の第１照度センサ４１と、複数の照射部１４からの各露光用光ＥＬが照射される各位置に移動可能で、各露光用光ＥＬの照度を検出する第２照度センサ４２と、を備えるので、複数の照射部１４における各光源６の照度を同一に制御することができ、高精度に露光を行うことができる。特に、複数の第１照度センサ４１間で測定誤差が生じる場合であっても、第２照度センサ４２によって検出された照度に基づいて、各光源６の電流値を制御することが可能となり、複数の第１照度センサ４１を校正せずに照度制御することができる。   Therefore, according to the proximity scan exposure apparatus 1 of the present embodiment, the plurality of first illuminance sensors 41 that are respectively arranged in the plurality of irradiation units 14 and detect the illuminance of the exposure light EL in the irradiation unit 14; A second illuminance sensor 42 that is movable to each position irradiated with each exposure light EL from the plurality of irradiation units 14 and detects the illuminance of each exposure light EL. The illuminance of each light source 6 can be controlled to be the same, and exposure can be performed with high accuracy. In particular, even when a measurement error occurs between the plurality of first illuminance sensors 41, the current value of each light source 6 can be controlled based on the illuminance detected by the second illuminance sensor 42. The illuminance can be controlled without calibrating the first illuminance sensor 41.

また、第２照度センサ４２は、マスクチェンジャー２のマスクトレー部８に取り付けられるので、上記照度制御を行うために第２照度センサ４２を移動させる機構を別途設ける必要がなく、装置のコストアップを防止することができる。   Further, since the second illuminance sensor 42 is attached to the mask tray portion 8 of the mask changer 2, it is not necessary to separately provide a mechanism for moving the second illuminance sensor 42 in order to perform the illuminance control, thereby increasing the cost of the apparatus. Can be prevented.

また、本実施形態の近接スキャン露光装置１の照度制御方法によれば、第２照度センサ４２を複数の照射部１４の各露光用光ＥＬが照射される各位置に移動して、各露光用光ＥＬの照度を検出する工程と、第２照度センサ４２によって検出される、複数の照射部１４から照射される各露光用光ＥＬの照度値が目標照度値となるように光源６の電流値を調整する工程と、調整された各光源６が照射する各露光用光ＥＬの照度値を第１照度センサ４１によって検出する工程と、第１照度センサ４１によって検出された各光源６が照射する各露光用光の照度値が維持されるように、各光源６の電流値を制御する工程と、を有するので、複数の照射部１４における各光源６の照度を同一に制御しながら定照度運転することができ、高精度に露光を行うことができる。   Further, according to the illuminance control method of the proximity scan exposure apparatus 1 of the present embodiment, the second illuminance sensor 42 is moved to each position where each exposure light EL of the plurality of irradiation units 14 is irradiated, and each exposure is performed. The step of detecting the illuminance of the light EL, and the current value of the light source 6 so that the illuminance value of each exposure light EL irradiated from the plurality of irradiation units 14 detected by the second illuminance sensor 42 becomes the target illuminance value. , The step of detecting the illuminance value of each exposure light EL irradiated by each adjusted light source 6 by the first illuminance sensor 41, and the each light source 6 detected by the first illuminance sensor 41 irradiate. And the step of controlling the current value of each light source 6 so that the illuminance value of each exposure light is maintained. Can be exposed with high precision Door can be.

また、第２照度センサは、マスクＭを交換するためのマスクチェンジャー２のマスクトレー部８に取り付けられており、第２照度センサ４２による照度の検出工程と、光源６の電流値を調整する工程は、マスクトレー部８が各マスク保持部１１の下面と対向する交換位置ＣＰに移動した際に行われるので、マスク交換の段取り段階に同時に行うことができ、段取り時間を削減することができる。   The second illuminance sensor is attached to the mask tray portion 8 of the mask changer 2 for exchanging the mask M, and the illuminance detection step by the second illuminance sensor 42 and the current value of the light source 6 are adjusted. Is performed when the mask tray unit 8 is moved to the replacement position CP facing the lower surface of each mask holding unit 11, so that it can be performed at the same time as the mask replacement setup stage, and the setup time can be reduced.

なお、本発明は、上記実施形態に限定されるものでなく、適宜、変更、改良等が可能である。
上記実施形態においては、第２照度センサ４２はマスクチェンジャー２のマスクトレー部８に取り付けられているが、第２照度センサ４２を各照射部１４の露光用光の照度を検出できるように第２照度センサ４２を移動する機構を別途設けても良い。 In addition, this invention is not limited to the said embodiment, A change, improvement, etc. are possible suitably.
In the above embodiment, the second illuminance sensor 42 is attached to the mask tray portion 8 of the mask changer 2, but the second illuminance sensor 42 is configured to detect the illuminance of the exposure light of each irradiation unit 14. A mechanism for moving the illuminance sensor 42 may be provided separately.

また、本実施形態では、一対の第２照度センサ４２を各マスクトレー部８にそれぞれ設け、搬入側及び搬出側の照射部１４毎に照度制御を行っているが、いずれかのマスクトレー部８に単一の第２照度センサ４２を設け、この単一の第２照度センサ４２による照度値を基準としてすべての照射部１４の照度制御を行うようにしてもよい。この場合、第２照度センサ４２を移動する機構は、Ｙ方向だけでなく、Ｘ方向にも駆動可能である。   Further, in the present embodiment, a pair of second illuminance sensors 42 are provided in each mask tray section 8 and the illuminance control is performed for each irradiation section 14 on the carry-in side and the carry-out side. Alternatively, a single second illuminance sensor 42 may be provided, and the illuminance control of all the irradiation units 14 may be performed based on the illuminance value by the single second illuminance sensor 42. In this case, the mechanism for moving the second illuminance sensor 42 can be driven not only in the Y direction but also in the X direction.

上記実施形態においては、基板搬送機構１０は、浮上ユニット１６と基板駆動ユニット１７によって基板Ｗを浮上して保持しながら搬送する場合について述べたが、これに限らず、基板を上面に載置しながら保持及び搬送するものであってもよい。   In the above-described embodiment, the substrate transport mechanism 10 has been described with respect to the case where the substrate W is transported while being floated and held by the floating unit 16 and the substrate driving unit 17. However, it may be held and transported.

そして、上記実施形態においては、基板Ｗがカラーフィルタ基板である場合について述べたが、これに限られず、所定の露光パターンを形成するものであれば半導体基板等如何なるものであってもよい。   In the above embodiment, the case where the substrate W is a color filter substrate has been described. However, the present invention is not limited to this, and any substrate such as a semiconductor substrate may be used as long as it forms a predetermined exposure pattern.

本発明の実施形態である近接スキャン露光装置の平面図である。It is a top view of the proximity scanning exposure apparatus which is embodiment of this invention. 図１における近接スキャン露光装置の正面図である。It is a front view of the proximity scan exposure apparatus in FIG. マスク交換及び照度制御を説明するためのマスク保持部の上面図である。It is a top view of the mask holding | maintenance part for demonstrating mask replacement | exchange and illumination intensity control. マスク交換時の手順を説明するためのフローチャートである。It is a flowchart for demonstrating the procedure at the time of mask exchange. 照度制御処理を説明するためのフローチャートである。It is a flowchart for illuminance control processing.

符号の説明Explanation of symbols

１ 近接スキャン露光装置
１０ 基板搬送機構
１１ マスク保持部
１５ 制御部
４１ 第１照度センサ
４２ 第２照度センサ
ＥＬ 露光用光
Ｍ マスク
Ｗ カラーフィルタ基板（基板） DESCRIPTION OF SYMBOLS 1 Proximity scanning exposure apparatus 10 Substrate conveyance mechanism 11 Mask holding part 15 Control part 41 1st illumination intensity sensor 42 2nd illumination intensity sensor EL Exposure light M Mask W Color filter board | substrate (board | substrate)

Claims (4)

所定方向に搬送される基板に対して近接する複数のマスクを介して露光用光を照射し、前記基板に前記複数のマスクのパターンを露光する近接スキャン露光装置であって、
前記基板を所定方向に搬送する基板搬送機構と、
前記パターンを形成した前記複数のマスクをそれぞれ保持し、前記所定方向と交差する方向に沿って千鳥状に配置される複数のマスク保持部と、
前記複数のマスク保持部の上部にそれぞれ配置され、露光用光を照射する複数の照射部と、
前記複数の照射部内にそれぞれ配置され、照射部内での前記露光用光の照度を検出する複数の第１照度センサと、
前記複数の照射部からの各露光用光が照射される各位置に移動可能で、前記各露光用光の照度を検出する第２照度センサと、
を備えることを特徴とする近接スキャン露光装置。 A proximity scan exposure apparatus that irradiates exposure light through a plurality of masks close to a substrate conveyed in a predetermined direction, and exposes the patterns of the plurality of masks on the substrate,
A substrate transport mechanism for transporting the substrate in a predetermined direction;
Each of the plurality of masks formed with the pattern is held, and a plurality of mask holding portions arranged in a staggered manner along a direction intersecting the predetermined direction,
A plurality of irradiation units that are respectively disposed on top of the plurality of mask holding units and irradiate exposure light; and
A plurality of first illuminance sensors that are respectively arranged in the plurality of irradiation units and detect the illuminance of the exposure light in the irradiation units;
A second illuminance sensor that is movable to each position irradiated with each exposure light from the plurality of irradiation units and detects the illuminance of each exposure light;
A proximity scan exposure apparatus comprising: 前記マスクを交換すべく、前記マスクを搬入又は搬出するための受け渡し位置と、前記各マスク保持部の下面と対向する交換位置との間を移動可能なマスクトレー部を有するマスクチェンジャーをさらに備え、
前記第２照度センサは、前記マスクトレー部に取り付けられることを特徴とする請求項１に記載の近接スキャン露光装置。 A mask changer having a mask tray part movable between a delivery position for carrying in or carrying out the mask and an exchange position facing the lower surface of each mask holding part in order to exchange the mask;
The proximity scan exposure apparatus according to claim 1, wherein the second illuminance sensor is attached to the mask tray unit. 基板を所定方向に搬送する基板搬送機構と、パターンを形成した複数のマスクをそれぞれ保持し、前記所定方向と交差する方向に沿って千鳥状に配置される複数のマスク保持部と、前記複数のマスク保持部の上部にそれぞれ配置され、露光用光を照射する光源をそれぞれ有する複数の照射部と、前記複数の照射部内にそれぞれ配置され、照射部内での前記露光用光の照度を検出する複数の第１照度センサと、前記複数の照射部からの各露光用光が照射される各位置に移動可能で、前記各露光用光の照度を検出する第２照度センサと、を備え、前記所定方向に搬送される基板に対して近接する前記複数のマスクを介して前記露光用光を照射し、前記基板に前記複数のマスクのパターンを露光する近接スキャン露光装置の照度制御方法であって、
前記第２照度センサを前記複数の照射部の各露光用光が照射される各位置に移動して、前記各露光用光の照度を検出する工程と、
前記第２照度センサによって検出される、前記複数の照射部から照射される各露光用光の照度値が目標照度値となるように前記光源の電流値を調整する工程と、
前記調整された前記各光源が照射する各露光用光の照度値を前記第１照度センサによって検出する工程と、
前記第１照度センサによって検出された前記各光源が照射する各露光用光の照度値が維持されるように、前記各光源の電流値を制御する工程と、
を有することを特徴とする近接スキャン露光装置の照度制御方法。 A substrate transport mechanism for transporting the substrate in a predetermined direction, a plurality of masks each having a pattern formed thereon, a plurality of mask holding portions arranged in a staggered manner along a direction intersecting the predetermined direction, and the plurality of masks A plurality of irradiation units respectively disposed on the top of the mask holding unit and having a light source for irradiating exposure light, and a plurality of irradiation units respectively disposed in the plurality of irradiation units and detecting the illuminance of the exposure light in the irradiation unit A first illuminance sensor, and a second illuminance sensor that is movable to each position irradiated with each exposure light from the plurality of irradiation units and detects the illuminance of each exposure light, An illumination control method for a proximity scan exposure apparatus that irradiates the exposure light through the plurality of masks close to a substrate conveyed in a direction and exposes the patterns of the plurality of masks on the substrate,
Moving the second illuminance sensor to each position where each exposure light of the plurality of irradiation units is irradiated, and detecting the illuminance of each exposure light;
Adjusting the current value of the light source so that the illuminance value of each exposure light emitted from the plurality of irradiating units detected by the second illuminance sensor becomes a target illuminance value;
Detecting the illuminance value of each exposure light irradiated by each of the adjusted light sources by the first illuminance sensor;
Controlling the current value of each light source such that the illuminance value of each exposure light emitted by each light source detected by the first illuminance sensor is maintained;
An illuminance control method for a proximity scan exposure apparatus, comprising: 前記第２照度センサは、前記マスクを交換するためのマスクチェンジャーのマスクトレー部に取り付けられており、
前記第２照度センサによる照度の検出工程と、前記光源の電流値を調整する工程は、前記マスクトレー部が前記各マスク保持部の下面と対向する交換位置に移動した際に行われることを特徴とする請求項３に記載の近接スキャン露光装置の照度制御方法。 The second illuminance sensor is attached to a mask tray portion of a mask changer for exchanging the mask,
The step of detecting the illuminance by the second illuminance sensor and the step of adjusting the current value of the light source are performed when the mask tray portion moves to an exchange position facing the lower surface of each mask holding portion. The illuminance control method of the proximity scan exposure apparatus according to claim 3.
JP2007159194A 2007-06-15 2007-06-15 Proximity scan exposure apparatus and illuminance control method thereof Expired - Fee Related JP5057370B2 (en)

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JP2003151880A (en) * 2001-11-12 2003-05-23 Nikon Corp Projection aligner, exposure method, and device- manufacturing method
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