JP2008306039A - ボンディング装置用撮像装置及び撮像方法 - Google Patents
ボンディング装置用撮像装置及び撮像方法 Download PDFInfo
- Publication number
- JP2008306039A JP2008306039A JP2007152641A JP2007152641A JP2008306039A JP 2008306039 A JP2008306039 A JP 2008306039A JP 2007152641 A JP2007152641 A JP 2007152641A JP 2007152641 A JP2007152641 A JP 2007152641A JP 2008306039 A JP2008306039 A JP 2008306039A
- Authority
- JP
- Japan
- Prior art keywords
- imaging
- lens
- optical system
- image
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/18—Arrangements with more than one light path, e.g. for comparing two specimens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7865—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
- H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Microscoopes, Condenser (AREA)
- Die Bonding (AREA)
Abstract
【解決手段】高倍率レンズ34を経て複数の撮像面36,37に至り、高倍率レンズ34からの距離が異なる位置にある複数の被写体撮像範囲に対応して高倍率レンズ34から各撮像面36,37までの各光路長が異なる第1、第2の高倍率光路51,52を有する高倍率光学系と、低倍率レンズ35を経て撮像面38に至る低倍率光路53を有し、各高倍率光路51,52よりも広い視野を備える低倍率光学系と、を備え、高倍率光学系の各撮像面36,37を持つ各撮像素子31,32は半導体チップ63の画像を取得し、低倍率光学系の撮像面38を持つ撮像素子33はリードフレーム61の画像を取得する。
【選択図】図3
Description
Claims (7)
- 被写体であるリードフレームまたは基板とリードフレームまたは基板に取り付けられた多段積層半導体チップとの画像を取得するボンディング装置用撮像装置であって、
第1のレンズを経て複数の撮像面に至り、第1のレンズからの距離が異なる位置にある複数の被写体撮像範囲に対応して第1のレンズから各撮像面までの各光路長が異なる複数の光路を有する第1の光学系と、
第1のレンズの被写体側で第1の光学系から分岐し、第1のレンズよりも倍率の低い第2のレンズを経て撮像面に至る光路を有し、第1の光学系の視野よりも広い視野を備える第2の光学系と、
第1の光学系の各撮像面に設けられリードフレームまたは基板に取り付けられた多段積層半導体チップの各層の画像を取得する各撮像素子と、第2の光学系の撮像面に設けられリードフレームまたは基板の画像を取得する撮像素子と、
を有することを特徴とするボンディング装置用撮像装置。 - 被写体であるリードフレームまたは基板とリードフレームまたは基板に取り付けられた多段積層半導体チップとの画像を取得するボンディング装置用撮像装置であって、
被写体側レンズと第1の撮像面側レンズとを経て複数の撮像面に至り、被写体側レンズから各撮像面までの各光路長が異なる複数の光路を有する第1の光学系と、
被写体側レンズと第1の撮像面側レンズとの間で第1の光学系から分岐し、被写体側レンズと第1の撮像面側レンズとの合成レンズ倍率よりも被写体側レンズとの合成レンズ倍率が低い第2の撮像面側レンズを経て撮像面に至る光路を有し、第1の光学系の視野よりも広い視野を備える第2の光学系と、
第1の光学系の各撮像面に設けられリードフレームまたは基板に取り付けられた多段積層半導体チップの各層の画像を取得する各撮像素子と、第2の光学系の撮像面に設けられリードフレームまたは基板の画像を取得する撮像素子と、
を有することを特徴とするボンディング装置用撮像装置。 - 請求項1または2に記載のボンディング装置用撮像装置であって、
第1の光学系の各撮像素子は協働してリードフレームまたは基板に取り付けられた多段積層半導体チップの各層の画像を取得すること、
を特徴とするボンディング装置用撮像装置。 - 請求項2に記載のボンディング装置用撮像装置であって、
第1の光学系は、第1の撮像面側レンズと各撮像面との間の光路に、光路に沿った方向に取り付け位置を可変とした光路長調整用手段を有すること
を特徴とするボンディング装置用撮像装置。 - 請求項4に記載のボンディング装置用撮像装置であって、
光路長調整用手段は、光路長調整用レンズまたは透過性のガラス、プラスチック、セラミックスであること、
を特徴とするボンディング装置用撮像装置。 - 第1のレンズを経て複数の撮像面に至り、第1のレンズからの距離が異なる位置にある複数の被写体撮像範囲に対応して第1のレンズから各撮像面までの各光路長が異なる複数の光路を有する第1の光学系と、第1のレンズの被写体側で第1の光学系から分岐し、第1のレンズよりも倍率の低い第2のレンズを経て撮像面に至る光路を有し、第1の光学系の視野よりも広い視野を備える第2の光学系と、第1の光学系の各撮像面に設けられる各撮像素子と、第2の光学系の撮像面に設けられる撮像素子と、を備えるボンディング装置用撮像装置によって、被写体であるリードフレームまたは基板とリードフレームまたは基板に取り付けられた各多段積層半導体チップとの画像を取得する撮像方法であって、
第2の光学系の視野をリードフレーム面または基板面でスキャンさせ、第2の光学系の撮像面に設けられる撮像素子によって各多段積層半導体チップの全周の各リードを含むリードフレームまたは基板の画像を取得するリード画像撮像工程と、
第1の光学系の各撮像面に設けられる各撮像素子によって複数の高さ位置にある多段積層半導体チップの各層の画像を取得する半導体チップ撮像工程と、
を含むことを特徴とする撮像方法。 - 被写体側レンズと第1の撮像面側レンズとを経て複数の撮像面に至り、被写体側レンズからの距離が異なる位置にある複数の被写体撮像範囲に対応して第1の被写体側レンズから各撮像面までの各光路長が異なる複数の光路を有する第1の光学系と、被写体側レンズと第1の撮像面側レンズとの間で第1の光学系から分岐し、被写体側レンズと第1の撮像面側レンズとの合成レンズ倍率よりも被写体側レンズとの合成レンズ倍率が低い第2の撮像面側レンズを経て撮像面に至る光路を有し、第1の光学系の視野よりも広い視野を備える第2の光学系と、第1の光学系の各撮像面に設けられる各撮像素子と、第2の光学系の撮像面に設けられる撮像素子と、を備えるボンディング装置用撮像装置によって、被写体であるリードフレームまたは基板とリードフレームまたは基板に取り付けられた各多段積層半導体チップとの画像を取得する撮像方法であって、
第2の光学系の視野をリードフレーム面または基板面でスキャンさせ、第2の光学系の撮像面に設けられる撮像素子によって各多段積層半導体チップの全周の各リードを含むリードフレームまたは基板の画像を取得するリード画像撮像工程と、
第1の光学系の各撮像面に設けられる各撮像素子によって複数の高さ位置にある多段積層半導体チップの各層の画像を取得する半導体チップ撮像工程と、
を含むことを特徴とする撮像方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007152641A JP4825171B2 (ja) | 2007-06-08 | 2007-06-08 | ボンディング装置用撮像装置及び撮像方法 |
TW096139980A TW200848693A (en) | 2007-06-08 | 2007-10-25 | Photography apparatus and method thereof for chip bonding device |
KR1020070128130A KR100955626B1 (ko) | 2007-06-08 | 2007-12-11 | 본딩 장치용 촬상 장치 및 촬상 방법 |
CN2008101089695A CN101320703B (zh) | 2007-06-08 | 2008-06-05 | 焊接装置用摄像装置及摄像方法 |
US12/157,025 US7848022B2 (en) | 2007-06-08 | 2008-06-06 | Imaging device and method for a bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007152641A JP4825171B2 (ja) | 2007-06-08 | 2007-06-08 | ボンディング装置用撮像装置及び撮像方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008306039A true JP2008306039A (ja) | 2008-12-18 |
JP4825171B2 JP4825171B2 (ja) | 2011-11-30 |
Family
ID=40180674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007152641A Expired - Fee Related JP4825171B2 (ja) | 2007-06-08 | 2007-06-08 | ボンディング装置用撮像装置及び撮像方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7848022B2 (ja) |
JP (1) | JP4825171B2 (ja) |
KR (1) | KR100955626B1 (ja) |
CN (1) | CN101320703B (ja) |
TW (1) | TW200848693A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010256828A (ja) * | 2009-04-28 | 2010-11-11 | Fuji Mach Mfg Co Ltd | 撮像装置及びその撮像装置を備える切削機械 |
JP2013110648A (ja) * | 2011-11-22 | 2013-06-06 | Seiko Epson Corp | 棒状ワーク撮像装置および棒状ワークの先端同心判定装置 |
JP2020119972A (ja) * | 2019-01-23 | 2020-08-06 | 東レエンジニアリング株式会社 | 実装装置および実装方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4825172B2 (ja) * | 2007-06-08 | 2011-11-30 | 株式会社新川 | ボンディング装置用撮像装置及び撮像方法 |
KR101245530B1 (ko) * | 2011-05-26 | 2013-03-21 | 주식회사 탑 엔지니어링 | 광학검사장치 및 이를 구비하는 어레이 테스트 장치 |
CN104502360A (zh) * | 2014-12-25 | 2015-04-08 | 中国科学院半导体研究所 | 一种芯片外观缺陷检测*** |
DE102018211951A1 (de) * | 2017-07-20 | 2019-01-24 | Robert Bosch Gmbh | Kameravorrichtung für ein Fahrzeug zur Fahrerbeobachtung |
US11367703B2 (en) * | 2017-10-26 | 2022-06-21 | Shinkawa Ltd. | Bonding apparatus |
JP7114537B2 (ja) * | 2019-09-13 | 2022-08-08 | 株式会社東芝 | 半導体検査装置及び半導体装置の検査方法 |
CN111505819B (zh) * | 2020-05-21 | 2022-04-05 | 杨星瑶 | 显微仪器和利用数字序列图像进行重复定位与测量的方法 |
CN116931236B (zh) * | 2023-09-14 | 2023-11-28 | 长春长光智欧科技有限公司 | 一种基于探针对准晶圆的双倍率光学*** |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04240740A (ja) * | 1991-01-25 | 1992-08-28 | Nec Corp | ボンディング装置 |
JPH05332739A (ja) * | 1992-05-28 | 1993-12-14 | Fujitsu Ltd | 外観検査装置 |
JPH07270716A (ja) * | 1994-03-31 | 1995-10-20 | Ntn Corp | 光学装置 |
JPH08285539A (ja) * | 1995-04-18 | 1996-11-01 | Hitachi Ltd | パターン計測方法及びその装置 |
JP2006134917A (ja) * | 2004-11-02 | 2006-05-25 | Apic Yamada Corp | 樹脂封止方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02301148A (ja) | 1989-05-16 | 1990-12-13 | Nec Corp | ワイヤーボンディング装置用カメラ |
JPH0750329A (ja) * | 1992-06-24 | 1995-02-21 | Nippon Steel Corp | 半導体用ボンディングワイヤの形状測定方法および装置 |
JPH09155786A (ja) * | 1995-12-11 | 1997-06-17 | Copal Co Ltd | 電子部品の撮像装置 |
JP3272640B2 (ja) | 1997-07-11 | 2002-04-08 | 株式会社カイジョー | ボンディング装置 |
JP3626141B2 (ja) * | 2001-08-10 | 2005-03-02 | 株式会社ソキア | 撮像装置を備えた自動視準測量機 |
JP3857934B2 (ja) | 2002-03-08 | 2006-12-13 | 株式会社堀場製作所 | 半導体測定装置 |
-
2007
- 2007-06-08 JP JP2007152641A patent/JP4825171B2/ja not_active Expired - Fee Related
- 2007-10-25 TW TW096139980A patent/TW200848693A/zh not_active IP Right Cessation
- 2007-12-11 KR KR1020070128130A patent/KR100955626B1/ko not_active IP Right Cessation
-
2008
- 2008-06-05 CN CN2008101089695A patent/CN101320703B/zh not_active Expired - Fee Related
- 2008-06-06 US US12/157,025 patent/US7848022B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04240740A (ja) * | 1991-01-25 | 1992-08-28 | Nec Corp | ボンディング装置 |
JPH05332739A (ja) * | 1992-05-28 | 1993-12-14 | Fujitsu Ltd | 外観検査装置 |
JPH07270716A (ja) * | 1994-03-31 | 1995-10-20 | Ntn Corp | 光学装置 |
JPH08285539A (ja) * | 1995-04-18 | 1996-11-01 | Hitachi Ltd | パターン計測方法及びその装置 |
JP2006134917A (ja) * | 2004-11-02 | 2006-05-25 | Apic Yamada Corp | 樹脂封止方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010256828A (ja) * | 2009-04-28 | 2010-11-11 | Fuji Mach Mfg Co Ltd | 撮像装置及びその撮像装置を備える切削機械 |
US8885038B2 (en) | 2009-04-28 | 2014-11-11 | Fuji Machine Mfg. Co., Ltd. | Measuring apparatus and measuring method thereof, apparatus for correcting processing position of cutting machine and method thereof for correcting processing position, and imaging apparatus and cutting machine comprising the same |
JP2013110648A (ja) * | 2011-11-22 | 2013-06-06 | Seiko Epson Corp | 棒状ワーク撮像装置および棒状ワークの先端同心判定装置 |
JP2020119972A (ja) * | 2019-01-23 | 2020-08-06 | 東レエンジニアリング株式会社 | 実装装置および実装方法 |
JP7112341B2 (ja) | 2019-01-23 | 2022-08-03 | 東レエンジニアリング株式会社 | 実装装置および実装方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4825171B2 (ja) | 2011-11-30 |
KR100955626B1 (ko) | 2010-05-03 |
KR20080107973A (ko) | 2008-12-11 |
CN101320703A (zh) | 2008-12-10 |
US7848022B2 (en) | 2010-12-07 |
US20090124028A1 (en) | 2009-05-14 |
TWI340231B (ja) | 2011-04-11 |
TW200848693A (en) | 2008-12-16 |
CN101320703B (zh) | 2011-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4825171B2 (ja) | ボンディング装置用撮像装置及び撮像方法 | |
KR101944176B1 (ko) | 부품 실장 장치 | |
JP4596422B2 (ja) | ダイボンダ用撮像装置 | |
KR102327786B1 (ko) | 본딩 장치 | |
US10816322B2 (en) | Bonding apparatus and method for detecting height of bonding target | |
JP4825172B2 (ja) | ボンディング装置用撮像装置及び撮像方法 | |
US9370135B2 (en) | Electronic component mounting device and image reading method used by electronic component mounting device | |
JP2012248728A (ja) | ダイボンダ及びボンディング方法 | |
KR20040071590A (ko) | 다이본딩 방법 및 장치 | |
JP3356406B2 (ja) | 位置ずれ検出装置及びそれを用いた位置決め装置 | |
JP5243284B2 (ja) | 補正位置検出装置、補正位置検出方法及びボンディング装置 | |
WO2010131380A1 (ja) | ボンディング装置及びボンディング方法 | |
JP5051082B2 (ja) | 電子部品実装装置および電子部品実装装置における画像読取り方法 | |
JP2004259968A (ja) | ボンディングワイヤ検査装置および方法 | |
JP2006177730A (ja) | 撮像検査装置および方法 | |
KR20090063375A (ko) | 듀얼 정렬 광학계 및 그를 구비한 다이 본딩 장치 | |
JP2010080697A (ja) | 電子部品実装装置および電子部品実装装置における画像読取り装置 | |
JP2010278128A (ja) | ボンディング装置及びボンディング装置のオフセット量補正方法 | |
JP2005050213A (ja) | 画像認識装置 | |
KR20090020731A (ko) | 반도체 소자 두께 측정 장치 및 이를 구비하는 수지 몰딩기 | |
JPH11214428A (ja) | ボンディング装置 | |
JPH11330139A (ja) | ボンディング装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090724 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110711 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110719 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110811 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110830 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110909 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140916 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |