JP2008269833A - Mounting structure of conductor - Google Patents
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- JP2008269833A JP2008269833A JP2007108158A JP2007108158A JP2008269833A JP 2008269833 A JP2008269833 A JP 2008269833A JP 2007108158 A JP2007108158 A JP 2007108158A JP 2007108158 A JP2007108158 A JP 2007108158A JP 2008269833 A JP2008269833 A JP 2008269833A
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Abstract
Description
本発明は、特に大電流を扱う２つの導体を、絶縁性を確保しつつコンパクトに配置する導体の取付構造に関する。 The present invention particularly relates to a conductor mounting structure in which two conductors that handle a large current are arranged in a compact manner while ensuring insulation.
一般的なスイッチング電源装置では、スイッチング素子をスイッチング動作させて、トランスの一次巻線に断続的に入力電圧を印加し、二次側となるトランスの二次巻線に誘起した電圧を二次側出力回路で整流平滑して、出力端子から負荷に直流電圧を供給する構成となっているが、大容量のスイッチング電源装置では、二次側に大電流が流れるため、例えばバスバーのような金属導体による板金配線が広く採用され、本願出願人も特許文献１などで、その具体的な構造を開示している。 In a general switching power supply device, the switching element is switched, an input voltage is intermittently applied to the primary winding of the transformer, and the voltage induced in the secondary winding of the transformer on the secondary side is applied to the secondary side. The output circuit rectifies and smoothes and supplies a DC voltage from the output terminal to the load. However, in a large-capacity switching power supply device, a large current flows on the secondary side, so a metal conductor such as a bus bar is used. Is widely adopted, and the applicant of the present application discloses a specific structure thereof in Patent Document 1 and the like.
ここで、本願出願人が特願２００６−３０６５１４号などで提案した二次側出力回路の要部構成を、図８に基づき説明する。同図において、101，102は、二次側出力回路の出力電圧配線路を形成する第１および第２の金属導体（バスバー）で、ここでは第２の金属導体102を基準として、第１の金属導体101に正極性の電位が発生するようになっている。 Here, the configuration of the main part of the secondary output circuit proposed by the present applicant in Japanese Patent Application No. 2006-306514 will be described with reference to FIG. In the figure, reference numerals 101 and 102 denote first and second metal conductors (bus bars) that form the output voltage wiring path of the secondary output circuit. Here, the first metal conductor 102 is used as a reference for the first metal conductor (bus bar). A positive potential is generated in the metal conductor 101.
第１の金属導体101は、二次側出力回路を構成する整流ダイオード（図示せず）のカソードから一方の出力端子に至る正極側の出力電圧配線路を構成するもので、これは正面方向から見てコ字状に折り返された左右一対の受熱部111，112と、この受熱部111，112の後端部どうしを連結する平板状の連結部113と、連結部113の後端側から上方向垂直に延びるコンデンサ取付部114，115と、コンデンサ取付部115の後端から外側に折曲げ形成された垂直な延出部116と、延出部116から後方に延び、正極側の出力端子に相当する端子部117とにより形成される。そして、前記受熱部111，112は、連結部113から枝分かれして、平面視において左右対称になるように配置される。また、受熱部111の上下に向かい合う両方の当接片111Ａ，111Ｂには、前記複数の整流ダイオードの背面に形成したカソードと電気的および熱的に接続するために、複数のねじ孔119が等間隔に設けられる。同じ目的で、受熱部112の上下に向かい合う両方の当接片112Ａ，112Ｂにも、複数のねじ孔119が等間隔に設けられる。 The first metal conductor 101 constitutes an output voltage wiring path on the positive electrode side from the cathode of a rectifier diode (not shown) constituting the secondary side output circuit to one output terminal. A pair of left and right heat receiving portions 111, 112 folded back in a U shape, a flat plate-like connecting portion 113 connecting the rear end portions of the heat receiving portions 111, 112, and an upper side from the rear end side of the connecting portion 113 Capacitor mounting portions 114 and 115 extending vertically, a vertical extending portion 116 bent outward from the rear end of the capacitor mounting portion 115, and extending rearward from the extending portion 116 to serve as a positive output terminal. The corresponding terminal portion 117 is formed. The heat receiving portions 111 and 112 are arranged so as to be branched from the connecting portion 113 and symmetrical in a plan view. In addition, a plurality of screw holes 119 are provided in both contact pieces 111A and 111B facing the upper and lower sides of the heat receiving portion 111 in order to electrically and thermally connect to the cathodes formed on the back surfaces of the plurality of rectifier diodes. Provided at intervals. For the same purpose, a plurality of screw holes 119 are also provided at equal intervals in both contact pieces 112A and 112B facing the top and bottom of the heat receiving portion 112.
一方、別な第２の金属導体102は、二次側出力回路を構成する平滑用のチョークコイル（図示せず）から他方の出力端子に至る負極側の出力電圧配線路を構成するもので、前記チョークコイルとの接続部となる連結部121と、この連結部121から上方向垂直に延びるコンデンサ取付部122，123と、コンデンサ取付部123の前方より外側に折曲げ形成された垂直な延出部124と、延出部124から後方に延び、負極側の出力端子に相当する端子部125とにより構成される。 On the other hand, another second metal conductor 102 constitutes a negative output voltage wiring path from a smoothing choke coil (not shown) constituting the secondary output circuit to the other output terminal, A connecting part 121 to be a connecting part with the choke coil, capacitor attaching parts 122 and 123 extending vertically upward from the connecting part 121, and a vertical extension formed bent outward from the front of the capacitor attaching part 123 Part 124 and a terminal part 125 extending rearward from the extension part 124 and corresponding to an output terminal on the negative electrode side.
そして、前記第１の金属導体101と第２の金属導体102は、双方の連結部113，121が非接触状態で上下に向かい合い、且つ一方のコンデンサ取付部114，122の外側面と、他方のコンデンサ取付部115，123の外側面が、非接触状態で何れも一つの面として並ぶように配置される。 The first metal conductor 101 and the second metal conductor 102 are vertically connected to each other with the connecting portions 113 and 121 in a non-contact state, and the outer surface of one of the capacitor mounting portions 114 and 122 and the other The outer surfaces of the capacitor mounting portions 115 and 123 are arranged so that both are arranged as one surface in a non-contact state.
131は、二次側出力回路を構成する平滑用の出力コンデンサである。この出力コンデンサ131は、コンデンサ取付部114，122の外側面と、コンデンサ取付部115，123の外側面にそれぞれ半田付け接続される基板132，133上に実装される。なお、図８では、基板132，133に６個ずつの出力コンデンサ131が実装されているが、その個数は特に限定されない。何れにせよ、コンデンサ取付部114，122の外側面を跨ぐようにして、ここに一方の基板132の半田面を半田付け接続し、また別なコンデンサ取付部115，123の外側面を跨ぐようにして、ここにもう一方の基板133の半田面を半田付け接続することで、基板132，133に実装する全ての出力コンデンサ131の一端を正極側の出力電圧配線路に接続し、他端を負極側の出力電圧配線路間に接続することが可能になる。またこの場合は、被接合部材として、横に並んだコンデンサ取付部114，122とコンデンサ取付部115，123の各外側面に出力コンデンサ131付きの基板132，133を配置できるため、電源装置としての小型化を達成できる。
上述したような大容量の電源装置では、電位の異なる２つの大電流を扱う金属導体101，102が、限られたスペース内で近接して配置され、その金属導体101，102の間に例えば出力コンデンサ131などの電子部品や基板132，133が接続固定される。しかし、金属導体101，102の間は絶縁が必要であり、その間には一定の距離を確保しなければならない。例えば図９に示すように、双方の金属導体101，102を並べて、その表面に基板132，133を接続する場合、金属導体101，102の間には全長に渡って一定の絶縁距離ｔが必要となるため、各金属導体101，102が同じ幅ｗ１，ｗ２に形成されているとすると、その幅ｗ１，ｗ２は自ずと基板132，133の幅ｗ３の半分以下となり、金属導体101，102の表面に対して基板132，133の接合部が小さく制限される。 In the large-capacity power supply device as described above, the metal conductors 101 and 102 that handle two large currents having different potentials are arranged close to each other in a limited space, and, for example, an output is provided between the metal conductors 101 and 102. Electronic components such as the capacitor 131 and the substrates 132 and 133 are connected and fixed. However, insulation is necessary between the metal conductors 101 and 102, and a certain distance must be ensured between them. For example, as shown in FIG. 9, when both metal conductors 101 and 102 are arranged side by side and the substrates 132 and 133 are connected to the surfaces thereof, a constant insulation distance t is required between the metal conductors 101 and 102 over the entire length. Therefore, if the metal conductors 101 and 102 are formed to have the same widths w1 and w2, the widths w1 and w2 are naturally less than half the width w3 of the substrates 132 and 133, and the surface of the metal conductors 101 and 102 On the other hand, the joint between the substrates 132 and 133 is limited to be small.
また、板状をなす金属導体101，102の平板面両側から、何れもその両方に接続する基板132，133を取付けようとする場合、単純に各金属導体101，102の平板面が一つの面を形成するように、金属導体101，102を縦に並べただけでは、高さ方向の寸法が著しく増大して、コンパクトな取付け構造を実現することができない。そのような構造を避け、且つ前記金属導体101，102の各幅ｗ１，ｗ２を最大に確保するために、前述した図８では、コンデンサ取付部114，122とコンデンサ取付部115，123を重ね合わせるようにして横に並べ、その外表面にそれぞれ基板132，133を接続できるような構造を採用している。しかし、この場合は、各金属導体101，102により形成される一つの面を、別々な位置に２つ設けなければならず、しかも、そうした一つの面を形成するコンデンサ取付部114，122とコンデンサ取付部115，123どうしも、一定の絶縁間隔ｔを必要とすることから、金属導体101，102自体の構造が複雑化して、コンパクトな構造を実現できない。 In addition, when mounting the boards 132 and 133 that are connected to both of the flat surfaces of the metal conductors 101 and 102 having a plate shape, the flat surfaces of the metal conductors 101 and 102 are simply one surface. If the metal conductors 101 and 102 are simply arranged vertically so as to form, the height dimension is remarkably increased, and a compact mounting structure cannot be realized. In order to avoid such a structure and to ensure the maximum widths w1 and w2 of the metal conductors 101 and 102, in FIG. 8 described above, the capacitor mounting portions 114 and 122 and the capacitor mounting portions 115 and 123 are overlapped. In this way, a structure is employed in which the substrates 132 and 133 can be connected side by side and connected to the outer surface thereof. However, in this case, two surfaces formed by the metal conductors 101 and 102 must be provided at different positions, and the capacitor mounting portions 114 and 122 and the capacitors that form the one surface are provided. Since the mounting portions 115 and 123 require a certain insulation interval t, the structure of the metal conductors 101 and 102 itself is complicated, and a compact structure cannot be realized.
さらに、こうした構造の複雑化を回避するために、第１の金属導体101だけで基板132（またはコンデンサ131の一方の端子）を取付ける一つの面を有する第１の取付部を形成し、別な第２の金属導体102だけで基板133（またはコンデンサ131の他方の端子）を取付けるもう一つの面を有する第２の取付部を形成すると共に、基板132から第２の取付部に繋がる接続体が第１の取付部を貫通できるように、この第１の取付部に切欠きなどの貫通部を形成し、同様に第２の取付部にも、基板133から第１の金属導体101に繋がる接続体の貫通部を形成することが考えられる。しかし、この場合も第１の取付部と第２の取付部の間に一定の絶縁間隔ｔが必要となり、やはりコンパクトな構造を実現できない。 Furthermore, in order to avoid such complication of the structure, the first mounting portion having one surface to which the substrate 132 (or one terminal of the capacitor 131) is attached only by the first metal conductor 101 is formed. A second attachment portion having another surface to which the substrate 133 (or the other terminal of the capacitor 131) is attached only by the second metal conductor 102, and a connection body connected from the substrate 132 to the second attachment portion is provided. A through-hole such as a notch is formed in the first attachment portion so that the first attachment portion can be penetrated. Similarly, a connection connecting the substrate 133 to the first metal conductor 101 is also formed in the second attachment portion. It is conceivable to form a body penetration. However, in this case as well, a constant insulation interval t is required between the first mounting portion and the second mounting portion, so that a compact structure cannot be realized.
そこで本発明の目的は、被接合部材に対する接触面を広く確保し、第１の導体と第２の導体との間の絶縁性を確保しつつ、簡単でコンパクトな構造を実現できる導体の取付構造を提供することにある。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a conductor mounting structure capable of realizing a simple and compact structure while ensuring a wide contact surface with respect to a member to be joined and ensuring insulation between the first conductor and the second conductor. Is to provide.
本発明の請求項１における導体の取付構造は、第１の被接合体が取付けられる外表面を、一定の厚さを有する第１の板状部に形成してなる第１の導体と、第２の被接合体が取付けられる外表面を、一定の厚さを有する第２の板状部に形成してなる第２の導体と、前記第１の板状部の内表面に当接し、前記第２の被接合体が取付けられる外表面を有する第１の保持体と、前記第２の板状部の内表面に当接し、前記第１の被接合体が取付けられる外表面を有する第２の保持体と、により構成され、前記第１の板状部の外表面と前記第２の保持体の外表面に前記第１の被接合体が取付可能となり、前記第２の板状部の外表面と前記第１の保持体の外表面に前記第２の被接合体が取付可能となるように、前記第１の板状部と前記第２の板状部とを前記厚さ方向に並べて配置したときに、前記第１の板状部の内表面と前記第２の板状部の内表面との間に、絶縁体を介挿可能な中間隙間が形成されるように、前記第２の板状部よりも大きな厚さで前記第１の保持体を形成すると共に、前記第１の板状部よりも大きな厚さで前記第２の保持体を形成したものである。 According to a first aspect of the present invention, there is provided a conductor mounting structure comprising: a first conductor formed by forming a first plate-like portion having a certain thickness on an outer surface to which a first object to be joined is attached; A second conductor formed on a second plate-shaped portion having a constant thickness, and an outer surface to which the two objects to be joined are attached, and an inner surface of the first plate-shaped portion; A first holding body having an outer surface to which the second body to be joined is attached, and a second holding body abutting on the inner surface of the second plate-like portion and having the outer surface to which the first body to be joined is attached. The first body to be joined can be attached to the outer surface of the first plate-like portion and the outer surface of the second holder, and the second plate-like portion The first plate-like portion and the second plate-like portion are arranged so that the second bonded body can be attached to the outer surface and the outer surface of the first holding body. An intermediate gap in which an insulator can be inserted is formed between the inner surface of the first plate-like portion and the inner surface of the second plate-like portion when arranged side by side in the vertical direction. The first holding body is formed with a thickness larger than that of the second plate-shaped portion, and the second holding body is formed with a thickness larger than that of the first plate-shaped portion. .
また、本発明の請求項２における導体の取付構造は、前記厚さ方向に直交して、前記第１の板状部と前記第２の保持体との間に形成される隙間と、前記第２の板状部と前記第１の保持体との間に形成される隙間よりも、前記中間隙間を狭く形成したものである。 According to a second aspect of the present invention, there is provided a conductor mounting structure including a gap formed between the first plate-like portion and the second holding body perpendicular to the thickness direction, and the first The intermediate gap is formed narrower than the gap formed between the two plate-like portions and the first holding body.
さらに、本発明の請求項３における導体の取付構造は、前記中間隙間を形成した状態で、前記第１の板状部の外表面と前記第２の保持体の外表面が段差のない一つの面として形成され、前記第２の板状部の外表面と前記第１の保持体の外表面が段差のない一つの面として形成される。 Furthermore, in the conductor mounting structure according to claim 3 of the present invention, the outer surface of the first plate-shaped portion and the outer surface of the second holding body are not stepped in a state where the intermediate gap is formed. The outer surface of the second plate-shaped portion and the outer surface of the first holding body are formed as one surface having no step.
本発明の請求項１では、第１の被接合体に対する第１の導体の接合面として、第１の板状部の外表面が形成され、第２の導体の接合面として、第２の保持体の外表面が形成されると共に、第２の被接合体に対する第２の導体の接合面として、第２の板状部の外表面が形成され、第２の導体の接合面として、第１の保持体の外表面が形成される。したがって、第１および第２の被接合体と第１および第２の導体との間の接合面を広く確保でき、接触抵抗の低減が可能になる。 According to the first aspect of the present invention, the outer surface of the first plate-shaped portion is formed as the bonding surface of the first conductor to the first object to be bonded, and the second holding is performed as the bonding surface of the second conductor. The outer surface of the body is formed, and the outer surface of the second plate-shaped portion is formed as the bonding surface of the second conductor to the second bonded body, and the first conductor is bonded as the bonding surface of the second conductor. The outer surface of the holder is formed. Therefore, a wide bonding surface between the first and second objects to be bonded and the first and second conductors can be secured, and the contact resistance can be reduced.
また、第１の保持体の厚さが第２の板状部の厚さよりも大きく、第２の保持体の厚さが第１の板状部の厚さよりも大きいので、第１の板状部の内表面と第２の板状部の内表面との間には、中間隙間が必然的に形成される。したがって、この中間隙間に絶縁体を介在させることで、第１の板状部と第２の板状部とを厚さ方向に最小の間隔で並べて配置することができ、第１のおよび第２の導体間の絶縁性を絶縁体により確保しつつ、簡単でコンパクトな構造を実現できる。 Further, since the thickness of the first holding body is larger than the thickness of the second plate-shaped portion, and the thickness of the second holding body is larger than the thickness of the first plate-shaped portion, the first plate-shaped An intermediate gap is inevitably formed between the inner surface of the part and the inner surface of the second plate-like part. Therefore, by interposing an insulator in the intermediate gap, the first plate-like portion and the second plate-like portion can be arranged side by side with a minimum spacing in the thickness direction, and the first and second It is possible to realize a simple and compact structure while ensuring the insulation between the conductors by the insulator.
本発明の請求項２では、中間隙間に絶縁体を介在させない場合は、第１の板状部と第２の保持体との間に形成される隙間や、第２の板状部と第１の保持体との間に形成される隙間と少なくとも同じ若しくはそれ以上の距離で、中間隙間を形成しなければならないが、中間隙間に絶縁体を介在させることで、中間隙間をさらに狭く形成でき、第１および第２の板状部の特に厚さ方向のコンパクト化を実現できる。 In the second aspect of the present invention, when no insulator is interposed in the intermediate gap, the gap formed between the first plate-like portion and the second holding body, or the second plate-like portion and the first An intermediate gap must be formed at a distance at least equal to or greater than the gap formed between the holding body and the intermediate gap can be further narrowed by interposing an insulator in the intermediate gap, The first and second plate-like portions can be made particularly compact in the thickness direction.
本発明の請求項３では、第１の被接合体や第２の被接合体が、基板のような板状の部材である場合、第１の板状部の外表面と第２の保持体の外表面に、第１の被接合体を隙間なく接合できると共に、第２の板状部の外表面と第１の保持体の外表面に、第２の被接合体を隙間なく接合でき、双方の部材間の接触抵抗をさらに低減できる。 In Claim 3 of this invention, when the 1st to-be-joined body or the 2nd to-be-joined body is a plate-shaped member like a board | substrate, the outer surface of a 1st plate-shaped part, and a 2nd holding body The first object to be joined can be joined to the outer surface of the second plate without gaps, and the second object to be joined can be joined to the outer surface of the second plate-like portion and the outer surface of the first holding body without gaps, The contact resistance between both members can be further reduced.
以下、添付図面を参照しながら、本発明における導体の取付構造について、好ましい実施例を説明する。 Hereinafter, preferred embodiments of a conductor mounting structure according to the present invention will be described with reference to the accompanying drawings.
図１は、本実施例に係わる各部の分解斜視図であり、図２および図３は、その完成状態を示す斜視図および平面図を示している。また、図４〜図６は導体ユニット単独の構成を示している。さらに、図７は完成状態における要部の正面図を示している。 FIG. 1 is an exploded perspective view of each part according to the present embodiment, and FIGS. 2 and 3 are a perspective view and a plan view showing a completed state, respectively. 4 to 6 show the configuration of a single conductor unit. Further, FIG. 7 shows a front view of the main part in the completed state.
これらの各図において、１は第１の導体に相当する金属導体、２は第２の導体に相当する金属導体で、第１の金属導体１は、二次側出力回路を構成する整流ダイオード（図示せず）のカソードから、一方の出力端子に至る正極側の出力電圧配線路を構成し、第２の金属導体２は、二次側出力回路を構成する平滑用のチョークコイル（図示せず）から、他方の出力端子に至る負極側の出力電圧配線路を構成している。 In each of these drawings, 1 is a metal conductor corresponding to a first conductor, 2 is a metal conductor corresponding to a second conductor, and the first metal conductor 1 is a rectifier diode ( A positive output voltage wiring path extending from the cathode of one of the output terminals to the one output terminal is configured, and the second metal conductor 2 is a smoothing choke coil (not illustrated) that configures the secondary output circuit. ) To the other output terminal of the negative output voltage wiring path.
第１の金属導体１は、前記整流ダイオードのカソードに接続する孔付きの接続部11と、この接続部11から垂直に立ち上がる第１の板状部12と、第１の板状部12の後端から外側に折曲げ形成された垂直な延出部13と、延出部13から後方に延び、正極側の出力端子に相当する端子部14とにより形成される。第１の板状部12は、後述する基板51の半田面51Ａに取付可能な外表面12Ａと、この外表面12Ａの反対側に形成された内表面12Ｂとを有し、これらの外表面12Ａと内表面12Ｂとの間を貫通して、タップのない挿通孔15と、タップ付きのタップ孔16が、各々所定の位置に複数個形成される。 The first metal conductor 1 includes a connecting portion 11 with a hole connected to the cathode of the rectifier diode, a first plate-like portion 12 rising vertically from the connecting portion 11, and a rear portion of the first plate-like portion 12. It is formed by a vertically extending portion 13 bent outward from the end and a terminal portion 14 extending rearward from the extending portion 13 and corresponding to the positive-side output terminal. The first plate-like portion 12 has an outer surface 12A that can be attached to a solder surface 51A of a substrate 51 to be described later, and an inner surface 12B formed on the opposite side of the outer surface 12A, and these outer surfaces 12A. And a plurality of tap holes 16 with taps and tap holes 16 with taps are formed at predetermined positions.
第２の金属導体２は、前記平滑用チョークコイルに接続する孔付きの接続部21と、この接続部21から垂直に立ち上がる第２の板状部22と、第２の板状部22の後端から外側に折曲げ形成された垂直な延出部23と、延出部23から後方に延び、負極側の出力端子に相当する端子部24とにより形成される。ここでも第２の板状部22は、後述する基板52の半田面52Ａに取付可能な外表面22Ａと、この外表面22Ａの反対側に形成された内表面22Ｂとを有し、これらの外表面22Ａと内表面22Ｂとの間を貫通して、タップのない挿通孔25と、タップ付きのタップ孔26が、各々所定の位置に複数個形成される。 The second metal conductor 2 includes a connecting portion 21 with a hole connected to the smoothing choke coil, a second plate-like portion 22 rising vertically from the connecting portion 21, and a rear portion of the second plate-like portion 22. It is formed by a vertical extending portion 23 bent outward from the end, and a terminal portion 24 extending rearward from the extending portion 23 and corresponding to an output terminal on the negative electrode side. Again, the second plate-like portion 22 has an outer surface 22A that can be attached to a solder surface 52A of the substrate 52, which will be described later, and an inner surface 22B formed on the opposite side of the outer surface 22A. A plurality of insertion holes 25 without taps and tap holes 26 with taps are formed at predetermined positions so as to penetrate between the surface 22A and the inner surface 22B.
なお、図７に示すように、前述した第１の板状部12は、その全体が一定の厚さＴ１を有し、同様に第２の板状部22も、その全体が一定の厚さＴ２を有しているが、本実施例では共通する金属板金から第１の金属導体１と第２の金属導体２を形成している関係で、第１および第２の板状部12，22は他の部位を含めて、何れも同じの厚さＴ１，Ｔ２に形成される。勿論、第１および第２の板状部12，22は、それぞれが別な厚さＴ１，Ｔ２を有していても構わないし、例えば第１の板状部12だけが、第１の金属導体１の別な部位（延出部13や端子部14など）と部分的に異なる厚さＴ１であってもよい。また、第１および第２の板状部12，22全体が直線状ではない例えば湾曲した形状であっても、一定の厚さＴ１，Ｔ２が確保されていれば構わない。 As shown in FIG. 7, the first plate-like portion 12 described above has a constant thickness T1 as a whole, and similarly, the second plate-like portion 22 also has a constant thickness as a whole. In this embodiment, the first metal conductor 1 and the second metal conductor 2 are formed from a common metal sheet, so that the first and second plate-like portions 12, 22 are included. Are formed to have the same thickness T1, T2 including other parts. Of course, the first and second plate-like portions 12 and 22 may have different thicknesses T1 and T2, respectively. For example, only the first plate-like portion 12 is the first metal conductor. It may be a thickness T1 that is partially different from one other part (such as the extension part 13 and the terminal part 14). Even if the first and second plate-like parts 12 and 22 are not linear, for example, they may be curved, as long as the constant thicknesses T1 and T2 are secured.
前記第２の板状部22の内表面22Ｂには、この内表面22Ｂの一部分に接触して第１の保持体31が取付けられる。当該第１の保持体31は全体が板状で、図７に示すように、その厚さＴ11は少なくとも第２の板状部22の厚さＴ２よりも大きく形成される。また、第１の保持体31は、板状部22の外表面22Ａと共に後述する基板52の半田面52Ａに取付可能な外表面31Ａと、この外表面31Ａの反対側に形成された内表面31Ｂとを有し、これらの外表面31Ａと内表面31Ｂとの間を貫通するように、タップのない挿通孔35とタップ付きのタップ孔36が、前記第１の板状部12のタップ孔16と挿通孔15のそれぞれ対応した位置に形成される。 A first holding body 31 is attached to the inner surface 22B of the second plate-like portion 22 in contact with a part of the inner surface 22B. The entire first holding body 31 is plate-shaped, and as shown in FIG. 7, the thickness T11 is formed to be at least larger than the thickness T2 of the second plate-shaped portion 22. The first holding body 31 includes an outer surface 31A that can be attached to a solder surface 52A of the substrate 52, which will be described later, together with an outer surface 22A of the plate-like portion 22, and an inner surface 31B formed on the opposite side of the outer surface 31A. The tapped hole 35 and the tapped tapped hole 36 are formed in the tapped hole 16 of the first plate-like portion 12 so as to penetrate between the outer surface 31A and the inner surface 31B. And the insertion hole 15 are formed at corresponding positions.
同様に、前記第１の板状部12の内表面12Ｂには、この内表面12Ｂの一部分に接触して第２の保持体41が取付けられる。当該第２の保持体41は全体が板状で、図７に示すように、その厚さＴ21は少なくとも第１の板状部12の厚さＴ１よりも大きく形成される。また、第２の保持体41は、第１の板状部12の外表面12Ａと共に後述する基板51の半田面51Ａに取付可能な外表面41Ａと、この外表面41Ａの反対側に形成された内表面41Ｂとを有し、これらの外表面41Ａと内表面41Ｂとの間を貫通するように、タップのない挿通孔45とタップ付きのタップ孔46が、前記第２の板状部22のタップ孔26と挿通孔25のそれぞれ対応した位置に形成される。 Similarly, the second holding body 41 is attached to the inner surface 12B of the first plate-like portion 12 in contact with a part of the inner surface 12B. The entire second holding body 41 is plate-shaped, and as shown in FIG. 7, the thickness T21 is formed to be at least larger than the thickness T1 of the first plate-shaped portion 12. In addition, the second holding body 41 is formed on the opposite side of the outer surface 41A and the outer surface 41A that can be attached to the solder surface 51A of the substrate 51 described later together with the outer surface 12A of the first plate-like portion 12. The tapped hole 45 and the tapped tapped hole 46 of the second plate-like portion 22 have an inner surface 41B and penetrate between the outer surface 41A and the inner surface 41B. The tap hole 26 and the insertion hole 25 are formed at corresponding positions.
なお、前述したように第１および第２の板状部12，22全体が例えば湾曲した形状である場合には、第１および第２の保持体31，41も同様に湾曲した形状とするのが好ましい。 As described above, when the first and second plate-like parts 12 and 22 are entirely curved, for example, the first and second holding bodies 31 and 41 are similarly curved. Is preferred.
第１および第２の板状部12，22は、基板51，52との接合を図るためだけでなく、電源装置として主たる電流経路としても用いられる。第１および第２の保持体31，41は、第１および第２の板状部12，22から離れた位置ある基板51，52と、当該第１および第２の板状部12，22との接続に用いられるもので、何れも異極どうしの第１の保持体31および第２の板状部22と、第２の保持体41および第１の板状部12との間には、後述するような絶縁に必要な隙間73，74がそれぞれ形成される。 The first and second plate-like portions 12 and 22 are used not only for joining the substrates 51 and 52 but also as a main current path as a power supply device. The first and second holding bodies 31 and 41 include substrates 51 and 52 located away from the first and second plate-like portions 12 and 22, and the first and second plate-like portions 12 and 22, Between the first holding body 31 and the second plate-like part 22 of different polarities, and between the second holding body 41 and the first plate-like part 12, As will be described later, gaps 73 and 74 necessary for insulation are formed.
51，52は、一乃至複数の出力コンデンサ53を実装する被接合体としての基板で、一方の基板51は、その半田面51Ａが第１の板状部12の外表面12Ａと第２の保持体41の外表面41Ａに接合して取付けられ、また他方の基板52は、その半田面52Ａが第２の板状部22の外表面22Ａと第１の保持体31の外表面31Ａに接合して取付けられる。また、二次側出力回路を構成する平滑用の出力コンデンサ53は、基板51，52に４個ずつ実装されているが、その個数は特に限定されない。何れにせよ、段差のない一つの面で形成された第１の板状部12の外表面12Ａと第２の保持体41の外表面41Ａに、一方の基板51の半田面51Ａを接合し、同じく段差の内一つの面で形成された別な第２の板状部22の外表面22Ａと第１の保持体31の外表面31Ａに、もう一方の基板52の半田面52Ａを接合することで、基板51，52に実装する全ての出力コンデンサ53の一端を正極側の出力電圧配線路に接続し、他端を負極側の出力電圧配線路間に接続することが可能になる。 Reference numerals 51 and 52 denote substrates to be joined on which one or a plurality of output capacitors 53 are mounted. One of the substrates 51 has a solder surface 51A and a second holding surface of the outer surface 12A of the first plate-like portion 12. The other substrate 52 is bonded to the outer surface 41A of the body 41, and the solder surface 52A of the other substrate 52 is bonded to the outer surface 22A of the second plate 22 and the outer surface 31A of the first holding body 31. Installed. Four smoothing output capacitors 53 constituting the secondary output circuit are mounted on the boards 51 and 52, respectively, but the number is not particularly limited. In any case, the solder surface 51A of one substrate 51 is joined to the outer surface 12A of the first plate-like portion 12 and the outer surface 41A of the second holding body 41 formed by one surface having no step. Similarly, the solder surface 52A of the other substrate 52 is joined to the outer surface 22A of another second plate-like portion 22 formed on one surface of the step and the outer surface 31A of the first holding body 31. Thus, one end of all the output capacitors 53 mounted on the boards 51 and 52 can be connected to the positive output voltage wiring path, and the other end can be connected between the negative output voltage wiring paths.
その他、前記基板51には、第１の板状部12の挿通孔15と、第２の保持体41の挿通孔45のそれぞれ対応する位置に、固定具であるねじ61のねじ部が挿通できる取付孔55が設けられる。同様に、基板52にも、第２の板状部22の挿通孔25と、第１の保持体31の挿通孔45のそれぞれ対応する位置に、固定具であるねじ61のねじ部が挿通できる取付孔56が設けられる。 In addition, the screw portion of the screw 61 that is a fixture can be inserted into the substrate 51 at positions corresponding to the insertion hole 15 of the first plate-like portion 12 and the insertion hole 45 of the second holding body 41. A mounting hole 55 is provided. Similarly, the screw portion of the screw 61 that is a fixing tool can be inserted into the substrate 52 at the corresponding positions of the insertion hole 25 of the second plate-like portion 22 and the insertion hole 45 of the first holding body 31. A mounting hole 56 is provided.
71は、第１の板状部12の内表面12Ｂと、第２の板状部22の内表面22Ｂとの間に介在するシート状の絶縁体（インシュレータ）である。この絶縁体71は、板状の基板51，52を取付ける際に、第１の板状部12の外表面12Ａと第２の保持体41の外表面41Ａとを同一面にし、且つ第２の板状部22の外表面22Ａと第１の保持体31の外表面31Ａとを同一面にするように、第１の板状部12と第２の板状部22とを左右の横方向に並べて配置したときに、第１の保持体31が当接していない内表面12Ｂの露出した部分と、第２の保持体41が当接していない内表面22Ｂの露出した部分との間に形成される中間隙間72に設けられる。特に、この中間隙間72の距離Ｔａは、絶縁体71によって内表面12Ｂ，22Ｂ間の絶縁性が確保される最小寸法よりも広く、且つ第１および第２の板状部12，22の厚さ方向に直交して、第１の板状部12と第２の保持体41との間に形成される隙間73の距離Ｔｂや、第２の板状部22と第１の保持体31との間に形成される隙間74の距離Ｔｃよりも狭く形成される。それにより、第１および第２の板状部12，22間の絶縁性を確保しつつ、当該第１および第２の板状部12，22の厚さ方向の寸法を最小にすることができる。絶縁体71は、第１および第２の板状部12，22間の中間隙間72から後方に延び、前記延出部13，23の間に介在する。これにより第１および第２の板状部12，22のみならず、延出部13，23の間の隙間をも最小にしつつ、絶縁性を確保することができる。 71 is a sheet-like insulator (insulator) interposed between the inner surface 12B of the first plate-like portion 12 and the inner surface 22B of the second plate-like portion 22. The insulator 71 has the outer surface 12A of the first plate-like portion 12 and the outer surface 41A of the second holding body 41 flush with each other when the plate-like substrates 51 and 52 are attached. The first plate-like portion 12 and the second plate-like portion 22 are horizontally arranged so that the outer surface 22A of the plate-like portion 22 and the outer surface 31A of the first holding body 31 are flush with each other. When arranged side by side, it is formed between the exposed portion of the inner surface 12B where the first holding body 31 is not in contact and the exposed portion of the inner surface 22B where the second holding body 41 is not in contact. Provided in the intermediate gap 72. In particular, the distance Ta of the intermediate gap 72 is wider than the minimum dimension by which the insulation between the inner surfaces 12B and 22B is ensured by the insulator 71, and the thicknesses of the first and second plate-like portions 12 and 22 are increased. The distance Tb of the gap 73 formed between the first plate-like portion 12 and the second holding body 41 and the second plate-like portion 22 and the first holding body 31 perpendicular to the direction. It is formed narrower than the distance Tc of the gap 74 formed therebetween. Thereby, the dimension in the thickness direction of the first and second plate-like portions 12 and 22 can be minimized while ensuring the insulation between the first and second plate-like portions 12 and 22. . The insulator 71 extends rearward from an intermediate gap 72 between the first and second plate-like portions 12 and 22 and is interposed between the extending portions 13 and 23. As a result, it is possible to ensure insulation while minimizing not only the first and second plate-like parts 12 and 22 but also the gap between the extending parts 13 and 23.
次に、上記構成について、図２や図３に示す出力ユニットの組立工程を説明する。予め複数の出力コンデンサ53を実装した基板51の半田面51Ａを、第１の板状部12の外表面12Ａに当接した状態で、基板51に形成した取付孔55と、第１の板状部12に形成した挿通孔15とを一致させ、ここに基板51の外面側からねじ61を挿通する。そして、第１の板状部12の内表面12Ｂと第１の保持体31の内表面31Ｂとを向かい合わせて、第１の板状部12の内表面12Ｂから突出したねじ61の頭部に、第１の保持体31のタップ孔36を螺合させることで、第１の板状部12の外表面12Ａおよび内表面12Ｂに、基板51と第１の保持体31とをそれぞれ取付け固定した第１のサブユニットを組立てる。 Next, the assembly process of the output unit shown in FIGS. A mounting hole 55 formed in the substrate 51 and a first plate-like shape in a state where the solder surface 51A of the substrate 51 on which a plurality of output capacitors 53 are mounted in advance is in contact with the outer surface 12A of the first plate-like portion 12. The insertion hole 15 formed in the part 12 is aligned with the screw 61, and the screw 61 is inserted through the board 51 from the outer surface side. Then, the inner surface 12B of the first plate-like portion 12 and the inner surface 31B of the first holding body 31 face each other, and the head of the screw 61 protruding from the inner surface 12B of the first plate-like portion 12 The substrate 51 and the first holding body 31 are fixedly attached to the outer surface 12A and the inner surface 12B of the first plate-like portion 12 by screwing the tap holes 36 of the first holding body 31, respectively. Assemble the first subunit.
同様に、予め複数の出力コンデンサ53を実装した別な基板52の半田面52Ａを、第２の板状部22の外表面22Ａに当接した状態で、基板52に形成した取付孔56と、第２の板状部22に形成した挿通孔25とを一致させ、ここに基板52の外面側からねじ61を挿通する。そして、第２の板状部22の内表面22Ｂと第２の保持体41の内表面41Ｂとを向かい合わせて、第２の板状部22の内表面22Ｂから突出したねじ61の頭部に、第２の保持体41のタップ孔46を螺合させることで、第２の板状部22の外表面22Ａおよび内表面22Ｂに、基板52と第２の保持体41とをそれぞれ取付け固定した第２のサブユニットを組立てる。 Similarly, the mounting surface 56 formed in the substrate 52 in a state where the solder surface 52A of another substrate 52 on which a plurality of output capacitors 53 are mounted in advance is in contact with the outer surface 22A of the second plate-like portion 22, The insertion holes 25 formed in the second plate-like portion 22 are made to coincide with each other, and screws 61 are inserted through the board 52 from the outer surface side. Then, the inner surface 22B of the second plate-like portion 22 and the inner surface 41B of the second holding body 41 face each other, and the head of the screw 61 protruding from the inner surface 22B of the second plate-like portion 22 is attached. Then, the substrate 52 and the second holding body 41 are respectively attached and fixed to the outer surface 22A and the inner surface 22B of the second plate-like portion 22 by screwing the tap holes 46 of the second holding body 41. Assemble the second subunit.
次に、前記絶縁体71を間に介在させた状態で、第１の板状部12における内表面12Ｂの露出した部分と、第２の板状部22における内表面22Ｂの露出した部分が向かい合うように、これらの板状部12，22を横方向に並べ、第１の保持体31の外表面31Ａが、基板52の出力コンデンサ53を実装していない半田面52Ａに突き当たると共に、第２の保持体41の外表面41Ａが、基板51の出力コンデンサ53を実装していない半田面51Ａに突き当たる位置にまで、第１および第２の板状部12，22を近接させる。そして、基板51に形成した取付孔55と、第２の保持体41に形成した挿通孔45とを一致させ、ここに基板51の外面側からねじ61を挿通して、当該ねじ61のねじ部を第２の板状部22のタップ孔26に螺合させる。また、同様に基板52に形成した取付孔56と、第１の保持体31に形成した挿通孔35とを一致させ、ここに基板52の外面側からねじ61を挿通して、当該ねじ61のねじ部を第１の板状部12のタップ孔16に螺合させる。これにより、図２や図３に示す出力ユニットの組立てが完成する。 Next, with the insulator 71 interposed, the exposed portion of the inner surface 12B of the first plate-like portion 12 and the exposed portion of the inner surface 22B of the second plate-like portion 22 face each other. As described above, the plate-like portions 12 and 22 are arranged in the horizontal direction, and the outer surface 31A of the first holding body 31 abuts against the solder surface 52A on which the output capacitor 53 of the substrate 52 is not mounted, and the second The first and second plate-like portions 12 and 22 are brought close to each other until the outer surface 41A of the holding body 41 abuts against the solder surface 51A on which the output capacitor 53 of the substrate 51 is not mounted. Then, the mounting hole 55 formed in the substrate 51 and the insertion hole 45 formed in the second holding body 41 are made to coincide with each other, and a screw 61 is inserted into the screw 51 from the outer surface side of the substrate 51. Is screwed into the tap hole 26 of the second plate-like portion 22. Similarly, the mounting hole 56 formed in the substrate 52 and the insertion hole 35 formed in the first holding body 31 are made to coincide with each other, and a screw 61 is inserted from the outer surface side of the substrate 52 to The screw part is screwed into the tap hole 16 of the first plate-like part 12. Thereby, the assembly of the output unit shown in FIGS. 2 and 3 is completed.
ユニットの完成状態では、第１の保持体31の厚さＴ11が第２の板状部22の厚さＴ２よりも大きく（Ｔ11＞Ｔ２）、第２の保持体41の厚さＴ12が第１の板状部12の厚さＴ１よりも大きいので（Ｔ12＞Ｔ１）、第１の板状部12の内表面12Ｂと第２の板状部22の内表面22Ｂとの間には、絶縁体71を遊挿状態で介在できる中間隙間72が必然的に形成される。絶縁体71は、第１および第２の板状部12，22の間の絶縁を行なうためのもので、同じく絶縁を必要とする第１の板状部12と第２の保持体41との間に形成される隙間73の距離Ｔｂや、第２の板状部22と第１の保持体31との間に形成される隙間74の距離Ｔｃよりも、絶縁体71を介在させた分だけ、中間隙間72の距離Ｔａを狭く最小に形成できる。 In the completed state of the unit, the thickness T11 of the first holding body 31 is larger than the thickness T2 of the second plate 22 (T11> T2), and the thickness T12 of the second holding body 41 is the first. Since the thickness T1 of the plate-like portion 12 is larger (T12> T1), an insulator is provided between the inner surface 12B of the first plate-like portion 12 and the inner surface 22B of the second plate-like portion 22. An intermediate gap 72 in which 71 can be interposed in the loosely inserted state is inevitably formed. The insulator 71 is used to insulate between the first and second plate-like portions 12 and 22, and the first plate-like portion 12 and the second holding body 41 that also require insulation are used. More than the distance Tb of the gap 73 formed between them and the distance Tc of the gap 74 formed between the second plate-like portion 22 and the first holding body 31, the amount of the insulation 71 is interposed. In addition, the distance Ta of the intermediate gap 72 can be narrowed and minimized.
中間隙間72の距離Ｔａは、板状に形成される第１および第２の保持体31，41の厚さＴ11，Ｔ12を調整するだけで簡単に変更できる。また、隙間73，74の距離Ｔｂ，Ｔｃも、第１および第２の保持体31，41の厚さ方向に直交する側面の寸法を調整するだけで簡単に変更できる。そのため、予め形状の異なる複数の第１および第２の保持体31，41を用意するだけで、第１および第２の板状部12，22を流れる電流容量に応じて、最適な中間隙間72の距離Ｔａと、最適な隙間73，74の距離Ｔｂ，Ｔｃを、何れも簡単に得ることができる。 The distance Ta of the intermediate gap 72 can be easily changed simply by adjusting the thicknesses T11 and T12 of the first and second holding bodies 31 and 41 formed in a plate shape. Further, the distances Tb and Tc of the gaps 73 and 74 can be easily changed only by adjusting the dimensions of the side surfaces orthogonal to the thickness direction of the first and second holding bodies 31 and 41. Therefore, an optimum intermediate gap 72 can be obtained only by preparing a plurality of first and second holding bodies 31 and 41 having different shapes in advance according to the current capacity flowing through the first and second plate-like parts 12 and 22. The distance Ta and the optimum distances Tb and Tc of the gaps 73 and 74 can be easily obtained.
以上のように本実施例では、第１の被接合体である基板51が取付けられる外表面12Ａを、一定の厚さＴ１を有する第１の板状部12に形成してなる第１の導体としての金属導体１と、第２の被接合体である基板52が取付けられる外表面22Ａを、一定の厚さＴ２を有する第２の板状部22に形成してなる第２の導体としての金属導体２と、第１の板状部12の内表面12Ｂに当接し、基板52が取付けられる外表面31Ａを有する第１の保持体31と、第２の板状部22の内表面22Ｂに当接し、基板51が取付けられる外表面41Ａを有する第２の保持体41と、により構成され、第１の板状部12の外表面12Ａと第２の保持体41の外表面41Ａに基板51が取付可能となり、第２の板状部22の外表面22Ａと第１の保持体31の外表面31Ａに基板52が取付可能となるように、第１および第２の板状部12，22を前記厚さＴ１，Ｔ２の方向に並べて配置したときに、第１の板状部12の内表面12Ｂと第２の板状部22の内表面22Ｂとの間に、絶縁体71を介挿可能な中間隙間72が形成されるように、第２の板状部22よりも大きな厚さＴ11を有して第１の保持体31を形成すると共に、第１の板状部12よりも大きな厚さＴ21を有して第２の保持体41を形成している。 As described above, in this embodiment, the first conductor is formed by forming the outer surface 12A to which the substrate 51, which is the first object to be bonded, is attached, on the first plate-like portion 12 having a certain thickness T1. As a second conductor formed by forming, on the second plate-like portion 22 having a certain thickness T2, the outer surface 22A on which the metal conductor 1 and the substrate 52, which is the second joined body, are attached. The first holding body 31 having an outer surface 31A that is in contact with the metal conductor 2, the inner surface 12B of the first plate-like portion 12 and to which the substrate 52 is attached, and the inner surface 22B of the second plate-like portion 22 And a second holding body 41 having an outer surface 41A to which the substrate 51 is attached. The substrate 51 is attached to the outer surface 12A of the first plate-like portion 12 and the outer surface 41A of the second holding body 41. Can be attached, and the first and second plate-like members can be attached to the outer surface 22A of the second plate-like portion 22 and the outer surface 31A of the first holding member 31. When the portions 12 and 22 are arranged in the direction of the thicknesses T1 and T2, an insulator is provided between the inner surface 12B of the first plate-like portion 12 and the inner surface 22B of the second plate-like portion 22. The first holding member 31 is formed with a thickness T11 larger than the second plate-like portion 22 so that the intermediate gap 72 into which the 71 can be inserted is formed, and the first plate-like portion The second holding body 41 is formed with a thickness T21 larger than 12.
このようにすると、基板51に対する第１の金属導体１の接合面として、第１の板状部12の外表面12Ａが形成され、第２の金属導体２の接合面として、第２の保持体41の外表面41Ａが形成されると共に、基板52に対する第２の金属導体２の接合面として、第２の板状部22の外表面22Ａが形成され、第２の金属導体２の接合面として、第１の保持体31の外表面31Ａが形成される。したがって、基板51，52と第１および第２の金属導体１，２との接合面を広く確保でき、接触抵抗（インピーダンス）の低減が可能になる。 If it does in this way, 12 A of outer surfaces of the 1st plate-shaped part 12 will be formed as a joint surface of the 1st metal conductor 1 with respect to the board | substrate 51, and a 2nd holding body will be used as a joint surface of the 2nd metal conductor 2. An outer surface 41A of 41 is formed, and an outer surface 22A of the second plate-like portion 22 is formed as a joint surface of the second metal conductor 2 to the substrate 52, and as a joint surface of the second metal conductor 2 The outer surface 31A of the first holding body 31 is formed. Therefore, a wide joint surface between the substrates 51 and 52 and the first and second metal conductors 1 and 2 can be secured, and the contact resistance (impedance) can be reduced.
また、第１の保持体31の厚さＴ11が第２の板状部22の厚さＴ２よりも大きく、第２の保持体41の厚さＴ12が第１の板状部12の厚さＴ１よりも大きいので、第１の板状部12の外表面12Ａと第２の保持体41の外表面41Ａに基板51が取付可能となり、第２の板状部22の外表面22Ａと第１の保持体31の外表面31Ａに基板52が取付可能となるように、第１および第２の板状部12，22を前記厚さＴ１，Ｔ２の方向に並べて配置すれば、第１の板状部12の内表面12Ｂと第２の板状部22の内表面22Ｂとの間に、中間隙間72が必然的に形成される。したがって、この中間隙間72に絶縁体71を介在させることで、第１の板状部11と第２の板状部12とを厚さ方向に最小の間隔で並べて配置することができ、第１の金属導体１と第２の金属導体２との間の絶縁性を絶縁体71により確保しつつ、簡単でコンパクトな構造を実現できる。 Further, the thickness T11 of the first holding body 31 is larger than the thickness T2 of the second plate-like portion 22, and the thickness T12 of the second holding body 41 is the thickness T1 of the first plate-like portion 12. Therefore, the substrate 51 can be attached to the outer surface 12A of the first plate-like portion 12 and the outer surface 41A of the second holding body 41, and the outer surface 22A of the second plate-like portion 22 and the first surface If the first and second plate-like parts 12 and 22 are arranged in the direction of the thicknesses T1 and T2 so that the substrate 52 can be attached to the outer surface 31A of the holding body 31, the first plate-like shape An intermediate gap 72 is inevitably formed between the inner surface 12B of the portion 12 and the inner surface 22B of the second plate-like portion 22. Therefore, by interposing the insulator 71 in the intermediate gap 72, the first plate-like portion 11 and the second plate-like portion 12 can be arranged side by side with a minimum interval in the thickness direction. A simple and compact structure can be realized while ensuring the insulation between the metal conductor 1 and the second metal conductor 2 by the insulator 71.
また本実施例では、前記厚さＴ１，Ｔ２の方向に直交して、第１の板状部12と第２の保持体41との間に形成される隙間73の距離Ｔｂと、第２の板状部22と第１の保持体31との間に形成される隙間74の距離Ｔｃよりも、中間隙間72の距離Ｔａを狭く形成している。 In the present embodiment, the distance Tb of the gap 73 formed between the first plate-like portion 12 and the second holding body 41 perpendicular to the direction of the thicknesses T1 and T2, and the second The distance Ta of the intermediate gap 72 is formed narrower than the distance Tc of the gap 74 formed between the plate-like portion 22 and the first holding body 31.
こうすると、中間隙間72に絶縁体71を介在させない場合は、第１の板状部12と第２の保持体41との間に形成される隙間73や、第２の板状部22と第１の保持体31との間に形成される隙間74と少なくとも同じ若しくはそれ以上の距離で、中間隙間72を形成しなければならないが、中間隙間72に絶縁体71を介在させることで、中間隙間72をそれよりもさらに狭く形成でき、第１および第２の板状部12，22の特に厚さＴ１，Ｔ２の方向のコンパクト化を実現できる。 Thus, when the insulator 71 is not interposed in the intermediate gap 72, the gap 73 formed between the first plate-like portion 12 and the second holding body 41, the second plate-like portion 22 and the second gap The intermediate gap 72 must be formed at a distance at least equal to or greater than the gap 74 formed between the holding body 31 and the intermediate gap 72 by interposing the insulator 71 therebetween. 72 can be formed narrower than that, and the first and second plate-like portions 12 and 22 can be made compact, particularly in the thickness T1 and T2 directions.
さらに本実施例では、中間隙間72を形成した状態で、第１の板状部12の外表面12Ａと第２の保持体41の外表面41Ａが段差のない一つの面として形成され、第２の板状部22の外表面22Ａと第１の保持体31の外表面31Ａが段差のない一つの面として形成される。 Further, in the present embodiment, the outer surface 12A of the first plate-like portion 12 and the outer surface 41A of the second holding body 41 are formed as one surface having no step in the state where the intermediate gap 72 is formed. The outer surface 22A of the plate-like portion 22 and the outer surface 31A of the first holding body 31 are formed as one surface having no step.
こうすると、第１の被接合体や第２の被接合体が、基板51，52のような板状の部材である場合、第１の板状部12の外表面12Ａと第２の保持体41の外表面41Ａに、基板51を隙間なく接合できると共に、第２の板状部22の外表面22Ａと第１の保持体31の外表面31Ａにも、基板52を隙間なく接合でき、双方の部材間の接触抵抗をさらに低減できる。 Thus, when the first and second objects to be joined are plate-like members such as the substrates 51 and 52, the outer surface 12A of the first plate-like portion 12 and the second holding body. The substrate 51 can be joined to the outer surface 41A of the 41 without any gap, and the substrate 52 can be joined to the outer surface 22A of the second plate-like portion 22 and the outer surface 31A of the first holding body 31 without any gap. The contact resistance between these members can be further reduced.
なお、本発明は、上記実施例に限定されるものではなく、本発明の趣旨を逸脱しない範囲で変更可能である。例えば、実施例では、第１および第２の板状部12，22と、第１および第２の保持体31，41を別部材で構成したが、これらを一体の部材として構成してもよい。また、第１および第２の板状部12，22に接合する被接合体として、基板51，52以外に出力コンデンサ53のような電子部品であってもよく、その場合には、第１の板状部12の外表面12Ａと第２の保持体41の外表面41Ａや、第２の板状部22の外表面22Ａと第１の保持体31の外表面31Ａを、段差を持たせた面に形成しても構わない。 In addition, this invention is not limited to the said Example, It can change in the range which does not deviate from the meaning of this invention. For example, in the embodiment, the first and second plate-like portions 12 and 22 and the first and second holding bodies 31 and 41 are configured as separate members, but these may be configured as an integral member. . In addition to the substrates 51 and 52, an electronic component such as the output capacitor 53 may be used as a member to be joined to the first and second plate-like portions 12 and 22, and in this case, the first The outer surface 12A of the plate-like part 12 and the outer surface 41A of the second holding body 41, or the outer surface 22A of the second plate-like part 22 and the outer surface 31A of the first holding body 31 are provided with steps. It may be formed on the surface.
１ 金属導体（第１の導体）
２ 金属導体（第２の導体）
12 第１の板状部
22 第２の板状部
31 第１の保持体
41 第２の保持体
51 基板（第１の被接合体）
52 基板（第２の被接合体）
71 絶縁体
72 中間隙間
73，74 隙間
1 Metal conductor (first conductor)
2 Metal conductor (second conductor)
12 First plate
22 Second plate
31 First holding body
41 Second holder
51 Substrate (first object to be joined)
52 Substrate (second object to be joined)
71 Insulator
72 Intermediate gap
73, 74 Clearance
Claims (3)
第２の被接合体が取付けられる外表面を、一定の厚さを有する第２の板状部に形成してなる第２の導体と、
前記第１の板状部の内表面に当接し、前記第２の被接合体が取付けられる外表面を有する第１の保持体と、
前記第２の板状部の内表面に当接し、前記第１の被接合体が取付けられる外表面を有する第２の保持体と、により構成され、
前記第１の板状部の外表面と前記第２の保持体の外表面に前記第１の被接合体が取付可能となり、前記第２の板状部の外表面と前記第１の保持体の外表面に前記第２の被接合体が取付可能となるように、前記第１の板状部と前記第２の板状部とを前記厚さ方向に並べて配置したときに、前記第１の板状部の内表面と前記第２の板状部の内表面との間に、絶縁体を介挿可能な中間隙間が形成されるように、前記第２の板状部よりも大きな厚さで前記第１の保持体を形成すると共に、前記第１の板状部よりも大きな厚さで前記第２の保持体を形成したことを特徴とする導体の取付構造。 A first conductor formed by forming an outer surface on which a first bonded body is attached to a first plate-like portion having a certain thickness;
A second conductor formed by forming an outer surface to which the second bonded body is attached on a second plate-like portion having a certain thickness;
A first holding body that has an outer surface that is in contact with an inner surface of the first plate-like portion and to which the second joined body is attached;
A second holding body having an outer surface that abuts on the inner surface of the second plate-like portion and to which the first joined body is attached;
The first joined body can be attached to the outer surface of the first plate-like portion and the outer surface of the second holding body, and the outer surface of the second plate-like portion and the first holding body. When the first plate-like portion and the second plate-like portion are arranged side by side in the thickness direction so that the second bonded body can be attached to the outer surface of the first, A thickness larger than that of the second plate-like portion so that an intermediate gap capable of interposing an insulator is formed between the inner surface of the plate-like portion and the inner surface of the second plate-like portion. Then, the first holding body is formed, and the second holding body is formed with a thickness larger than that of the first plate-like portion.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10340630A (en) * | 1998-05-20 | 1998-12-22 | Furukawa Electric Co Ltd:The | Bus plate layered body with internal terminal |
| JP2000060145A (en) * | 1998-08-17 | 2000-02-25 | Ebara Densan Ltd | Driving device |
| JP2006019367A (en) * | 2004-06-30 | 2006-01-19 | Nippon Chemicon Corp | Connector, electronic component connecting structure, and electronic component device |
| JP2006302520A (en) * | 2005-04-15 | 2006-11-02 | Densei Lambda Kk | Sheet metal wiring structure |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10340630A (en) * | 1998-05-20 | 1998-12-22 | Furukawa Electric Co Ltd:The | Bus plate layered body with internal terminal |
| JP2000060145A (en) * | 1998-08-17 | 2000-02-25 | Ebara Densan Ltd | Driving device |
| JP2006019367A (en) * | 2004-06-30 | 2006-01-19 | Nippon Chemicon Corp | Connector, electronic component connecting structure, and electronic component device |
| JP2006302520A (en) * | 2005-04-15 | 2006-11-02 | Densei Lambda Kk | Sheet metal wiring structure |
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