JP2008268570A - Pellicle housing container and method for manufacturing the same - Google Patents

Pellicle housing container and method for manufacturing the same Download PDF

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JP2008268570A
JP2008268570A JP2007111595A JP2007111595A JP2008268570A JP 2008268570 A JP2008268570 A JP 2008268570A JP 2007111595 A JP2007111595 A JP 2007111595A JP 2007111595 A JP2007111595 A JP 2007111595A JP 2008268570 A JP2008268570 A JP 2008268570A
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storage container
pellicle
pellicle storage
manufacturing
container member
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JP4822357B2 (en
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Kazutoshi Sekihara
一敏 関原
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2007111595A priority Critical patent/JP4822357B2/en
Priority to KR1020080010487A priority patent/KR20080094549A/en
Priority to CN2008100884577A priority patent/CN101289000B/en
Priority to TW097111862A priority patent/TW200902400A/en
Publication of JP2008268570A publication Critical patent/JP2008268570A/en
Priority to HK08113924.6A priority patent/HK1120471A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Packaging Frangible Articles (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a clean pellicle housing container at a low cost, that having no defect such as flash at an end face by establishing an appropriate processing method in processing the periphery after vacuum forming. <P>SOLUTION: After a resin sheet material is vacuum formed, an excessive portion in the periphery of the sheet material is removed by cutting to obtain a pellicle housing container member. The surface portion after the excessive portion is removed is subjected to a dissolving process such as applying an organic solvent. As flashes formed on the surface after cutting can be easily dissolved and removed to form a smooth surface, the pellicle housing container with a clean end face can be obtained at a low cost. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、半導体デバイス、プリント基板あるいは液晶ディスプレイ等を製造する際のゴミ除けとして使用されるリソグラフィー用ペリクルを収納、保管、輸送するペリクル収納容器、および、その製造方法に関するものである。   The present invention relates to a pellicle storage container that stores, stores, and transports a pellicle for lithography used as a dust remover when manufacturing a semiconductor device, a printed circuit board, a liquid crystal display, or the like, and a method for manufacturing the same.

ＬＳＩ、超ＬＳＩなどの半導体製造或は液晶ディスプレイ等の製造においては、半導体ウエハーあるいは液晶用原板に光を照射してパターンを作製するが、この時に用いるフォトマスクあるいはレチクル（以下、単にフォトマスクと記述）にゴミが付着していると、このゴミが光を吸収したり光を曲げてしまうために、転写したパターンが変形したり、エッジががさついたものとなるほか、下地が黒く汚れたりするなど、寸法、品質、外観などが損なわれるという問題があった。   In the manufacture of semiconductors such as LSI and VLSI, or in the manufacture of liquid crystal displays and the like, a pattern is produced by irradiating a semiconductor wafer or liquid crystal master plate with light. A photomask or reticle (hereinafter simply referred to as a photomask) used at this time is used. If the dust adheres to (Description), the dust will absorb light or bend the light, so the transferred pattern will be deformed, the edges will be sticky, and the ground will be black. There was a problem that dimensions, quality, appearance, etc. were impaired.

このため、これらの作業は通常クリーンルームで行われているが、それでもフォトマスクを常に清浄に保つことが難しい。そこで、フォトマスク表面にゴミ除けとしてペリクルを貼り付けした後に露光を行っている。この場合、異物はフォトマスクの表面には直接付着せず、ペリクル上に付着するため、リソグラフィー時に焦点をフォトマスクのパターン上に合わせておけば、ペリクル上の異物は転写に無関係となる。   For this reason, these operations are usually performed in a clean room, but it is still difficult to keep the photomask clean. Therefore, exposure is performed after a pellicle is affixed to the photomask surface as a dust remover. In this case, the foreign matter does not directly adhere to the surface of the photomask, but adheres to the pellicle. Therefore, if the focus is set on the pattern of the photomask during lithography, the foreign matter on the pellicle becomes irrelevant to the transfer.

一般に、ペリクルは、光を良く透過させるニトロセルロース、酢酸セルロースあるいはフッ素樹脂などからなる透明なペリクル膜を、アルミニウム、ステンレス、ポリエチレンなどからなるペリクルフレームの上端面に貼り付けないし接着する。さらに、ペリクルフレームの下端にはフォトマスクに装着するためのポリブデン樹脂、ポリ酢酸ビニル樹脂、アクリル樹脂等からなる粘着層、及び粘着層の保護を目的とした離型層（セパレータ）が設けられる。   In general, a pellicle has a transparent pellicle film made of nitrocellulose, cellulose acetate, fluororesin, or the like that transmits light well, and is attached or bonded to the upper end surface of a pellicle frame made of aluminum, stainless steel, polyethylene, or the like. Further, an adhesive layer made of polybuden resin, polyvinyl acetate resin, acrylic resin or the like for mounting on a photomask, and a release layer (separator) for the purpose of protecting the adhesive layer are provided at the lower end of the pellicle frame.

しかしながら、ペリクルはマスクに貼付した後ではそれらが形成する閉空間の外部から内部への異物侵入防止効果はあるが、ペリクル自体に異物が付着して、かつそれが閉空間の内部にある場合には、フォトマスクへの異物付着を防ぐことは困難である。そのため、ペリクル自体に高い清浄性が求められることはもとより、保管、輸送に使用するペリクル収納容器（下記特許文献１参照）にもその清浄性を維持しうる性能が強く求められる。具体的には、帯電防止性能に優れ、擦れた際にも発塵の少ない材質、ペリクルおよび構成部品間の接触を極力防ぐ構造、外力が加わった際の変形を防ぐ高剛性な構造、といった点が要求される。   However, when the pellicle is attached to the mask, it has an effect of preventing foreign matter from entering the inside of the closed space formed by the pellicle, but when the foreign matter adheres to the pellicle itself and it is inside the closed space. It is difficult to prevent foreign matter from adhering to the photomask. For this reason, not only is the pellicle itself required to have high cleanliness, but also the pellicle storage container used for storage and transportation (see Patent Document 1 below) is strongly required to have the ability to maintain the cleanliness. Specifically, it has excellent antistatic performance, a material that generates little dust even when rubbed, a structure that prevents contact between the pellicle and components as much as possible, and a highly rigid structure that prevents deformation when external force is applied. Is required.

ペリクル収納容器は、通常、ＡＢＳ、アクリル等の樹脂を射出成形または真空成形することによって製造される。これらの成形方法が利用されるのは、表面が平滑で異物の付着や発塵の恐れが少ないこと、一体成形のため継ぎ目がなく発塵や異物侵入の恐れが少ないこと、複雑形状のものも容易に製造できること、量産性に優れ低コスト化が可能である、といったメリットがあるからである。外観の一例を図６に示す。ペリクルを載置する容器本体６１と、ペリクルを被覆すると共に容器本体と周縁部で嵌め合い係止する蓋体６２から構成され、容器本体は粘着テープ（図示しない）またはクリップ６３により蓋体と締結される。   The pellicle storage container is usually manufactured by injection molding or vacuum forming a resin such as ABS or acrylic. These molding methods are used because the surface is smooth and there is little risk of foreign matter adhesion and dust generation, because there is no seam because there is no joint and there is little risk of dust generation and foreign matter intrusion, and even complicated shapes This is because there are merits that it can be easily manufactured and is excellent in mass productivity and can be reduced in cost. An example of the appearance is shown in FIG. A container main body 61 for placing the pellicle and a lid body 62 that covers the pellicle and is fitted and locked at the peripheral edge of the container main body are fastened to the lid body by an adhesive tape (not shown) or a clip 63. Is done.

半導体用やプリント基板用ペリクルの収納容器は、外形の辺長が概ね２００〜３００ｍｍ前後で、これらは通常、射出成形を利用して製造される。一方、主として液晶用ペリクルに使用される辺長が５００ｍｍを超えるような大型のペリクル収納容器は、一般にＡＢＳ、アクリル等の合成樹脂シートを真空成形したものが使用される。これは、１箇所もしくは数箇所のゲートから金型内に樹脂を高速注入する射出成形では樹脂の流れる距離が長すぎるため、製法的に困難なためである。一方、真空成形法は、金型に加熱した樹脂シートを被せ、真空引きするだけで大型品も容易に成形が可能である。   Storage containers for semiconductor and printed circuit board pellicles have outer side lengths of approximately 200 to 300 mm, and these are usually manufactured using injection molding. On the other hand, a large pellicle storage container having a side length exceeding 500 mm mainly used for a liquid crystal pellicle is generally a vacuum-formed synthetic resin sheet such as ABS or acrylic. This is because the resin flow distance is too long in the injection molding in which the resin is injected at a high speed into the mold from one or several gates, which makes it difficult to manufacture. On the other hand, in the vacuum molding method, a large-sized product can be easily molded simply by placing a heated resin sheet on a mold and vacuuming.

射出成形法ではゲート部分を除けば成形だけで所望の形状が得られるのに対し、図５に示すように、真空成形法では成形だけでは所望の形状が得られない。それは、成形部分５１の周囲に、真空引き時の押さえ代でもある原料シートの端材５２が残るためである。そのため、真空成形法においては、成形後、周囲の余剰部分を機械加工により除去する工程が必要となる。   In the injection molding method, a desired shape can be obtained only by molding except for the gate portion, whereas in the vacuum molding method, a desired shape cannot be obtained only by molding as shown in FIG. This is because the end material 52 of the raw material sheet, which is also a press margin when evacuating, remains around the molded portion 51. Therefore, in the vacuum forming method, a step of removing the surrounding surplus portion by machining is necessary after the forming.

しかしながら、通常、真空成形法により製作されるペリクル収納容器の板厚は２〜５ｍｍ程度と薄く、十分な剛性が無い。そのため、切削加工の際には被切削部分に振動が生じ、凹凸の他、図３に示すようなヒゲ状のバリ３２やカエリが生じ、清浄な表面が得られにくいという問題点がある。   However, the thickness of the pellicle storage container manufactured by the vacuum forming method is usually as thin as about 2 to 5 mm and does not have sufficient rigidity. Therefore, there is a problem that vibration is generated in the portion to be cut during the cutting process, and in addition to the irregularities, the beard-like burrs 32 and burrs as shown in FIG. 3 are generated, and it is difficult to obtain a clean surface.

このことから、通常、切削加工後の後処理として、刃物によるバリの除去作業が行われる。しかし、刃物による切削によりまた新たにバリが生じることもあり、完全に清浄な状態を得るのは非常に困難であった。また、特に大型のペリクル収納容器においては外周長が５ｍを越すものもあり、このようなものではバリ取り処理に数十分を要するため、コスト的にも非常に問題であった。
特開２０００−１７３８８７号公報 For this reason, normally, as a post-process after cutting, a burr removal operation with a blade is performed. However, burrs may be newly generated by cutting with the blade, and it is very difficult to obtain a completely clean state. In particular, a large pellicle storage container has an outer peripheral length of more than 5 m, and such a product is very problematic in terms of cost because it requires several tens of minutes for the deburring process.
JP 2000-173887 A

以上のことから、本発明の目的は、真空成形後の外周加工において適切な加工方法を確立し、端面にバリ等の欠陥が無い清浄なペリクル収納容器を低コストで得ることにある。   In view of the above, an object of the present invention is to establish an appropriate processing method in outer periphery processing after vacuum forming, and to obtain a clean pellicle storage container having no defects such as burrs on the end surface at low cost.

本発明による製造方法は、樹脂のシート材をペリクル収納容器部材の形状に真空成形後、シート材周囲の余剰部分を切削除去してペリクル収納容器部材とし、次いで、前記余剰部分除去後の表面部分を溶解処理することを特徴とする。   In the manufacturing method according to the present invention, after the resin sheet material is vacuum-formed into the shape of the pellicle storage container member, the excess portion around the sheet material is cut and removed to form a pellicle storage container member, and then the surface portion after the excess portion removal Is dissolved.

ペリクル収納容器部材は、通常、ペリクル収納容器本体とペリクル収納容器蓋体であるが、その他、ペリクル収納容器構成用の部材であればその種類は問わない。   The pellicle storage container member is normally a pellicle storage container main body and a pellicle storage container lid, but any other type may be used as long as it is a pellicle storage container configuration member.

溶解処理は、有機溶剤の塗布によりなされるのが良い。また、これに代り熱風の吹き付けによるものとすることもできる。   The dissolution treatment is preferably performed by applying an organic solvent. Alternatively, hot air can be blown instead.

また、本発明は、上記製造方法によって得られたペリクル収納容器本体とペリクル収納容器蓋体とからなるペリクル収納容器であり、容器蓋体が、その周縁部で容器本体と嵌め合い係止する形態が望ましい。   Further, the present invention is a pellicle storage container comprising a pellicle storage container main body and a pellicle storage container lid obtained by the above manufacturing method, and the container lid is fitted and locked to the container main body at the peripheral edge thereof. Is desirable.

本発明によれば、切削加工後の表面に生じたバリを容易に溶解除去し平滑にすることができるため、端面が清浄なペリクル収納容器を低コストで得ることができる。端面が清浄であることにより、ペリクル収納容器に要求される清浄性が維持される。   According to the present invention, burrs generated on the surface after cutting can be easily dissolved and removed, so that a pellicle storage container having a clean end surface can be obtained at low cost. The cleanliness required for the pellicle storage container is maintained by the clean end face.

以下、本発明のペリクル収納容器の実施の形態を添付図面に基づいて説明する。   Embodiments of a pellicle storage container according to the present invention will be described below with reference to the accompanying drawings.

図１および図２は本発明によるペリクル収納容器部材端面処理の一例を示す説明図、図３は真空成形後の外周切削加工を行った際の外観の一例を示す説明図である。   1 and 2 are explanatory views showing an example of the end surface processing of the pellicle storage container member according to the present invention, and FIG. 3 is an explanatory view showing an example of the outer appearance when the outer peripheral cutting after vacuum forming is performed.

外周切削加工後のペリクル収納容器部材端面３１は、板厚や切削条件により差はあるものの、図３に示すようにヒゲ状のバリ３２が生じている。本発明では、図１に示すように溶媒保持手段１２に有機溶媒を浸潤させ、容器部材端面１１に押し当てながら移動させ、その表面に溶媒を塗布する。有機溶媒は、出来るだけ作業者に害が小さく、容器材質を溶解しつつも変色を生じさせないものを適宜選択すれば良いが、例えば、材質ＡＢＳ（アクリロニトリル・ブタンジエン・スチレン樹脂）に対してはアセトン、ＭＥＫ（メチルエチルケトン）等が好適である。溶媒保持手段１２は溶媒により侵されない材質を適宜選択すればよいが、ＭＥＫの場合、セルロース系のワイパーをきつく折り重ねたもの等が有効である。また、移動速度や溶媒の浸潤量、押し付けの強さなどは、塗布後の仕上がり具合を確認しながら適宜調節すれば良い。   As shown in FIG. 3, the pellicle storage container member end face 31 after the outer peripheral cutting has a difference depending on the plate thickness and cutting conditions. In the present invention, as shown in FIG. 1, the solvent holding means 12 is infiltrated with an organic solvent, moved while being pressed against the end surface 11 of the container member, and the solvent is applied to the surface. The organic solvent may be selected as appropriate so as not to cause any discoloration while dissolving the container material as much as possible. For example, acetone is used for the material ABS (acrylonitrile, butanediene, styrene resin). MEK (methyl ethyl ketone) and the like are preferable. The solvent holding means 12 may be appropriately selected from materials that are not affected by the solvent, but in the case of MEK, a material obtained by tightly folding a cellulosic wiper is effective. Further, the moving speed, the amount of solvent infiltration, the strength of pressing, etc. may be adjusted as appropriate while confirming the finished condition after application.

また、別の実施形態として、熱風吹き付けによるものを図２に示す。ペリクル収納容器部材端面２１にヒーター２３の先端に取り付けられたノズル２２から概ね１５０〜２００℃前後の熱風を吹き付けながら移動する。このとき、熱風の吹き付けによりヒゲ状のバリは縮れて焼け切れ、容易に表面から除去される。しかしながら、高温の熱風取り扱いが危険なこと、温度制御が難しく、長時間一箇所に吹き付けすぎると表面が痘痕状になってしまうことがある等の問題があり、専用の装置を用意して自動的に行うのであれば好適であるが、人手でこの作業を行うには、前記した有機溶媒による方法の方が実用的である。   FIG. 2 shows another embodiment by hot air blowing. The pellicle storage container member end surface 21 moves while blowing hot air of approximately 150 to 200 ° C. from a nozzle 22 attached to the tip of the heater 23. At this time, the whisker-like burrs are shrunk and burnt out by blowing hot air, and are easily removed from the surface. However, there are problems such as dangerous handling of hot hot air, difficult temperature control, and excessive spraying at one location for a long time, the surface may become scarred. However, the above-described method using an organic solvent is more practical for performing this operation manually.

以下、本発明の実施例を説明するが、本発明はこれらに限定されるものではない。   Examples of the present invention will be described below, but the present invention is not limited thereto.

［実施例１］
厚さ３ｍｍの帯電防止ＡＢＳ（商品名：トヨラックパレル（東レ株式会社製）：アクリロニトリル−ブタジエン−スチレン共重合体（約87%）とポリエーテルエステルアミド（約13%）の混合物）（黒色）シート材を、真空成形法により成形した。成形後の外観は図５に示すように周囲に余剰部分５２があり、これをＮＣルーターにより切削除去し、ペリクル収納容器部材を製造した。次に、図１に示すようにセルロース製ワイパー（商品名：ベンコットＰＳ２（旭化成株式会社製））をきつく折りたたんだものにＭＥＫを浸潤させ、容器端面全周に渡って塗布した。その後、１０ｍｉｎほど静置して完全に乾燥させたのち、純水にて洗浄してホコリ等を取り除き、外観を観察した。塗布部分の外観は光沢の具合が非塗布部と若干異なるものの、変色もなく、優れたものであった。また、この時点で確認できるバリは無かった。次に、白色の粘着テープ（商品名：アルマークテープ（アルマ社製））を端面に貼付し、引き剥がしてバリ等の付着が無いか確認したが、ヒゲ状のバリの付着は全く見られなかった。 [Example 1]
Antistatic ABS with a thickness of 3 mm (trade name: Toyolac Parrel (manufactured by Toray Industries, Inc.): Mixture of acrylonitrile-butadiene-styrene copolymer (about 87%) and polyetheresteramide (about 13%)) (black) The sheet material was formed by a vacuum forming method. As shown in FIG. 5, the appearance after molding had an excess portion 52 around it, and this was cut off by an NC router to produce a pellicle storage container member. Next, as shown in FIG. 1, MEK was infiltrated into a tightly folded cellulose wiper (trade name: Bencott PS2 (manufactured by Asahi Kasei Co., Ltd.)) and applied over the entire circumference of the container end face. Then, after leaving still for about 10 minutes and making it dry completely, it wash | cleaned with the pure water, dust etc. were removed, and the external appearance was observed. The appearance of the coated part was excellent with no discoloration although the glossiness was slightly different from that of the non-coated part. There were no burrs that could be confirmed at this point. Next, a white adhesive tape (trade name: Almark Tape (made by ALMA)) was applied to the end face and peeled off to confirm that there was no burrs attached. There wasn't.

［実施例２］
上記実施例１と全く同様にして、ペリクル収納容器部材を製作した。そして、図２に示すようにヒーター２３（八光電機製作所製）先端に取り付けられたノズル２２の先端から温度１８０〜２００℃の熱風を吹き付けながらノズル先端を約５ｍｍ／ｓの速度で移動させた。その後、洗浄してホコリを取り除いた後、外観を観察した。その結果、バリ等は見られなかったものの、数箇所に過熱によるものと思われる表面の荒れが見られた。また、上記実施例１と同じく粘着テープへのバリ付着を確認したが、バリの付着は全く見られなかった。 [Example 2]
A pellicle storage container member was manufactured in exactly the same manner as in Example 1 above. Then, as shown in FIG. 2, the nozzle tip was moved at a speed of about 5 mm / s while blowing hot air at a temperature of 180 to 200 ° C. from the tip of the nozzle 22 attached to the tip of the heater 23 (manufactured by Yoko Electric Manufacturing Co., Ltd.). . Then, after washing | cleaning and removing dust, the external appearance was observed. As a result, no burr or the like was observed, but surface roughness that was thought to be due to overheating was observed in several places. Moreover, although the burr | flash adhesion to the adhesive tape was confirmed similarly to the said Example 1, the adhesion | attachment of the burr | flash was not seen at all.

［比較例］
上記実施例１，２と全く同様にして、ペリクル収納容器部材を製作した。そして、図４に示すようにカッター４２で端面４１の稜線について面取りを行った。その後、純水洗浄にてホコリを取り除き、外観を観察したところ、バリの除去が不十分な所が数ヶ所、カッターによる削りすぎのところも数ヶ所見られた。さらに、上記実施例と同じく粘着テープによる評価を行ったところ、いたるところにヒゲ状のバリの付着が認められ、これは外観上および清浄性の観点から非常に好ましくないものであった。 [Comparative example]
Pellicle storage container members were manufactured in exactly the same manner as in Examples 1 and 2 above. Then, as shown in FIG. 4, the cutter 42 chamfered the ridgeline of the end surface 41. After that, dust was removed by washing with pure water and the appearance was observed. As a result, there were several places where the removal of burrs was insufficient, and there were some places where the cutter was excessively shaved. Furthermore, when the evaluation with the adhesive tape was performed in the same manner as in the above examples, the appearance of beard-like burrs was observed everywhere, which was very undesirable from the viewpoint of appearance and cleanliness.

本発明は、切削加工後の表面に生じたバリを容易に溶解除去し平滑にできるため、清浄性が特に要求されるペリクル収納容器の分野で好適に利用可能である。   INDUSTRIAL APPLICABILITY The present invention can be suitably used in the field of pellicle storage containers in which cleanliness is particularly required because burrs generated on the surface after cutting can be easily dissolved and removed and smoothed.

本発明によるペリクル収納容器部材端面処理方法の一例を示す説明図Explanatory drawing which shows an example of the pellicle storage container member end surface processing method by this invention 本発明によるペリクル収納容器部材端面処理方法の一例を示す説明図Explanatory drawing which shows an example of the pellicle storage container member end surface processing method by this invention 外周切削加工後の端面外観の一例を示す説明図Explanatory drawing which shows an example of the end face appearance after peripheral cutting 従来用いられてきたペリクル収納容器本体の端面処理方法の一例を示す説明図Explanatory drawing which shows an example of the end surface processing method of the pellicle storage container main body used conventionally 真空成形後のペリクル収納容器部材の状態を示した斜視図The perspective view which showed the state of the pellicle storage container member after vacuum forming ペリクル収納容器の外観の一例を示した斜視図The perspective view which showed an example of the external appearance of a pellicle storage container

符号の説明Explanation of symbols

１１ ペリクル収納容器部材端面
１２ 溶媒保持手段
２１ ペリクル収納容器部材端面
２２ ノズル
２３ ヒーター
３１ ペリクル収納容器部材端面
３２ バリ
４１ ペリクル収納容器部材端面
４２ カッター
５１ ペリクル収納容器部材（成形部分）
５２ 余剰部分（押さえ代）
６１ ペリクル収納容器本体
６２ ペリクル収納容器蓋体
６３ クリップ 11 Pellicle storage container member end surface 12 Solvent holding means 21 Pellicle storage container member end surface 22 Nozzle 23 Heater 31 Pellicle storage container member end surface 32 Burr 41 Pellicle storage container member end surface 42 Cutter 51 Pellicle storage container member (molded portion)
52 Surplus part (holding cost)
61 Pellicle storage container body 62 Pellicle storage container lid 63 Clip

Claims (7)

樹脂のシート材をペリクル収納容器部材の形状に真空成形後、シート材周囲の余剰部分を切削除去してペリクル収納容器部材とし、次いで、前記余剰部分除去後の表面部分を溶解処理することを特徴とするペリクル収納容器部材の製造方法。 After the resin sheet material is vacuum-formed into the shape of the pellicle storage container member, the excess portion around the sheet material is cut and removed to form a pellicle storage container member, and then the surface portion after the excess portion removal is subjected to a dissolution treatment A method for manufacturing a pellicle storage container member. ペリクル収納容器部材が、ペリクル収納容器本体である請求項１に記載の製造方法。 The manufacturing method according to claim 1, wherein the pellicle storage container member is a pellicle storage container main body. ペリクル収納容器部材が、ペリクル収納容器蓋体である請求項１に記載の製造方法。 The manufacturing method according to claim 1, wherein the pellicle storage container member is a pellicle storage container lid. 溶解処理が有機溶剤の塗布によりなされる請求項１〜３のいずれか１項記載の製造方法。 The manufacturing method according to claim 1, wherein the dissolution treatment is performed by application of an organic solvent. 溶解処理が熱風の吹き付けによりなされる請求項１〜３のいずれか１項記載の製造方法。 The manufacturing method according to any one of claims 1 to 3, wherein the dissolution treatment is performed by blowing hot air. 請求項２の製造方法によって得られたペリクル収納容器本体と、請求項３の製造方法によって得られたペリクル収納容器蓋体とからなるペリクル収納容器。 A pellicle storage container comprising a pellicle storage container main body obtained by the manufacturing method of claim 2 and a pellicle storage container lid obtained by the manufacturing method of claim 3. 容器蓋体が、その周縁部で容器本体と嵌め合い係止する請求項６に記載の収納容器。 The storage container according to claim 6, wherein the container lid is fitted and locked to the container main body at the peripheral edge thereof.
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CN101289000B (en) 2011-08-31
JP4822357B2 (en) 2011-11-24

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