JP2008227467A - 発光素子アレイチップおよび露光光源装置 - Google Patents
発光素子アレイチップおよび露光光源装置 Download PDFInfo
- Publication number
- JP2008227467A JP2008227467A JP2008019209A JP2008019209A JP2008227467A JP 2008227467 A JP2008227467 A JP 2008227467A JP 2008019209 A JP2008019209 A JP 2008019209A JP 2008019209 A JP2008019209 A JP 2008019209A JP 2008227467 A JP2008227467 A JP 2008227467A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- element array
- array chip
- long side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
【解決手段】基板上に複数の発光素子が二次元配列してなる発光素子アレイチップであって、発光素子アレイチップの形状は、各長辺と各短辺とが互いに鋭角または鈍角をなして構成される平行四辺形である。一つの共通電極に接続されている複数の前記発光素子が、前記長辺の方向に複数列、かつ前記短辺の方向に複数列並ぶことで1つのセグメントが形成され、前記セグメントが前記長辺の方向に沿って複数並ぶことで1つのブロックが形成され、更に前記ブロックが前記長辺の方向に沿って複数並ぶことにより発光素子アレイが形成されている。前記発光素子アレイチップの端部にある前記ブロックに対応する前記電極パッドは、前記発光素子アレイチップの形状を規定する前記長辺と前記短辺とが鋭角をなしている個所の該長辺の側に設けられている。
【選択図】図1
Description
n−Al0.35Ga0.65As層:〜1μm;Siドーピング
p−Al0.13Ga0.87As層:〜0.5μm;Cドーピング
p−Al0.35Ga0.65As層:〜1μm;Cドーピング
p−GaAs層:0.1〜0.5μm;Cドーピング
2 8セグメント(64発光素子)からなるブロック
3 ワイヤーボンディング用の共有電極パッド
4 8素子からなるセグメント
5 発光点(発光素子)
6 異なるセグメントに属する発光素子の電極を接続する配線
7 ワイヤーボンディング用の電極パッド
11 長辺
12 長辺
13 短辺
23 ワイヤーボンディング用の共有電極パッド
24 8素子からなるセグメント
25 発光点(発光素子)
26 異なるセグメントに属する発光素子の電極を接続する配線
27 ワイヤーボンディング用の電極パッド
201 発光素子アレイチップ
202 発光素子アレイチップ
299 接続部
1000 チップ
1001 チップ
1002 チップ
1010 発光点
1500 接続部
1600 チップの短辺
1999 チップの長手方向
3000 ロッドレンズアレイ
3050 ドライバIC
4000 発光素子チップアレイ
5000 配線基板
Claims (4)
- 基板上に複数の発光素子が二次元配列してなる発光素子アレイチップであって、
該発光素子アレイチップの形状は、2つの長辺と2つの短辺を含み、各長辺と各短辺とが互いに鋭角または鈍角をなして構成される平行四辺形であり、
一つの共通電極に接続されている複数の前記発光素子が、前記長辺の方向に複数列、かつ前記短辺の方向に複数列並ぶことで1つのセグメントが形成され、
前記セグメントが前記長辺の方向に沿って複数並ぶことで1つのブロックが形成され、
前記ブロックが前記長辺の方向に沿って複数並ぶことにより発光素子アレイが形成されており、
互いに異なる前記セグメントに属する複数の前記発光素子同士を電気的に接続する配線を有し、
前記配線には、ワイヤーボンディング用の電極パッドが形成されており、
前記発光素子アレイチップの端部にある前記ブロックに対応する前記電極パッドは、前記発光素子アレイチップの形状を規定する前記長辺と前記短辺とが鋭角をなしている個所の該長辺の側に設けられていることを特徴とする発光素子アレイチップ。 - 請求項1に記載の発光素子アレイチップを備え、かつ該発光素子アレイチップから放射される光を集光し結像するためのロッドレンズアレイを有することを特徴とする露光光源装置。
- 同一の前記ブロック内に存在する複数の前記発光素子は、時分割で駆動されることを特徴とする請求項2に記載の露光光源装置。
- 互いに異なる前記ブロックに属する各発光素子は、同時に駆動されることを特徴とする請求項2または3に記載の露光光源装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008019209A JP5127481B2 (ja) | 2007-02-16 | 2008-01-30 | 発光素子アレイチップおよび露光光源装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007036360 | 2007-02-16 | ||
JP2007036360 | 2007-02-16 | ||
JP2008019209A JP5127481B2 (ja) | 2007-02-16 | 2008-01-30 | 発光素子アレイチップおよび露光光源装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008227467A true JP2008227467A (ja) | 2008-09-25 |
JP5127481B2 JP5127481B2 (ja) | 2013-01-23 |
Family
ID=39706482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008019209A Expired - Fee Related JP5127481B2 (ja) | 2007-02-16 | 2008-01-30 | 発光素子アレイチップおよび露光光源装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080198592A1 (ja) |
JP (1) | JP5127481B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013172163A1 (ja) * | 2012-05-16 | 2013-11-21 | 株式会社ブイ・テクノロジー | 露光装置 |
JP2015193169A (ja) * | 2014-03-31 | 2015-11-05 | 株式会社沖データ | 半導体装置、半導体装置の製造方法、プリントヘッド、及び画像形成装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9472594B2 (en) * | 2012-02-10 | 2016-10-18 | Oculus Vr, Llc | Light emitting diode chip |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09266329A (ja) * | 1996-03-28 | 1997-10-07 | Fuji Xerox Co Ltd | 光電変換素子アレイ装置、半導体発光素子アレイを用いた光源装置、およびその製造方法 |
JPH10144955A (ja) * | 1996-11-12 | 1998-05-29 | Oki Electric Ind Co Ltd | 発光素子アレイ及びその製造方法 |
JP2001024232A (ja) * | 1999-07-12 | 2001-01-26 | Nippon Sheet Glass Co Ltd | 発光素子アレイ装置 |
JP2003069078A (ja) * | 2001-08-22 | 2003-03-07 | Sanyo Electric Co Ltd | 発光素子および光プリントヘッド |
JP2004023019A (ja) * | 2002-06-20 | 2004-01-22 | Sanyo Electric Co Ltd | 発光素子アレイ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6388696B1 (en) * | 1997-05-28 | 2002-05-14 | Oki Electric Industry Co., Ltd | Led array, and led printer head |
US6163036A (en) * | 1997-09-15 | 2000-12-19 | Oki Data Corporation | Light emitting element module with a parallelogram-shaped chip and a staggered chip array |
US20050151828A1 (en) * | 2004-01-14 | 2005-07-14 | Xerox Corporation. | Xerographic printing system with VCSEL-micro-optic laser printbar |
-
2008
- 2008-01-30 JP JP2008019209A patent/JP5127481B2/ja not_active Expired - Fee Related
- 2008-02-14 US US12/031,087 patent/US20080198592A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09266329A (ja) * | 1996-03-28 | 1997-10-07 | Fuji Xerox Co Ltd | 光電変換素子アレイ装置、半導体発光素子アレイを用いた光源装置、およびその製造方法 |
JPH10144955A (ja) * | 1996-11-12 | 1998-05-29 | Oki Electric Ind Co Ltd | 発光素子アレイ及びその製造方法 |
JP2001024232A (ja) * | 1999-07-12 | 2001-01-26 | Nippon Sheet Glass Co Ltd | 発光素子アレイ装置 |
JP2003069078A (ja) * | 2001-08-22 | 2003-03-07 | Sanyo Electric Co Ltd | 発光素子および光プリントヘッド |
JP2004023019A (ja) * | 2002-06-20 | 2004-01-22 | Sanyo Electric Co Ltd | 発光素子アレイ |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013172163A1 (ja) * | 2012-05-16 | 2013-11-21 | 株式会社ブイ・テクノロジー | 露光装置 |
JP2013239626A (ja) * | 2012-05-16 | 2013-11-28 | V Technology Co Ltd | 露光装置 |
JP2015193169A (ja) * | 2014-03-31 | 2015-11-05 | 株式会社沖データ | 半導体装置、半導体装置の製造方法、プリントヘッド、及び画像形成装置 |
Also Published As
Publication number | Publication date |
---|---|
US20080198592A1 (en) | 2008-08-21 |
JP5127481B2 (ja) | 2013-01-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6163036A (en) | Light emitting element module with a parallelogram-shaped chip and a staggered chip array | |
US5258629A (en) | Light-emitting diode print head with staggered electrodes | |
US20010002139A1 (en) | Image exposure apparatus and image forming apparatus with it | |
JP2005064104A (ja) | 発光ダイオードアレイ | |
US6262540B1 (en) | Semiconductor device and image formation apparatus using same | |
JP2009081341A (ja) | 2次元面発光レーザアレイ | |
JP5625778B2 (ja) | 発光チップ、発光装置、プリントヘッドおよび画像形成装置 | |
JP5127481B2 (ja) | 発光素子アレイチップおよび露光光源装置 | |
JPH01225377A (ja) | Ledアレイ | |
US8963125B2 (en) | LED device, LED device array, and method of driving the LED device array | |
JP2016051815A (ja) | 半導体装置、半導体装置の製造方法、プリントヘッド、及び画像形成装置 | |
JP2000289250A (ja) | Ledアレイチップおよびledアレイプリントヘッド | |
US6825866B2 (en) | LED array architecture for high resolution printbars | |
JP2008066579A (ja) | 発光制御方法および発光装置 | |
JPH0542718A (ja) | 半導体発光装置 | |
JPS59164161A (ja) | 発光ダイオ−ドアレイヘツド | |
JPH09252166A (ja) | 半導体発光装置 | |
JP2008227071A (ja) | 半導体発光素子アレイチップ、その製造方法、及び露光光源装置 | |
JP3093439B2 (ja) | 半導体発光装置 | |
JP5438308B2 (ja) | パターン光発光装置 | |
JP2000022215A (ja) | Ledアレイ | |
JP2005184035A (ja) | 半導体発光装置 | |
JP3115576B2 (ja) | 半導体発光装置 | |
JP4947945B2 (ja) | 発光ダイオードアレイ | |
JPH0381164A (ja) | Ledアレイチップ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20090324 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20100201 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20100630 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20101130 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120424 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120425 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120622 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121002 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121030 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151109 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |