JP2008219191A

JP2008219191A - Piezoelectric oscillator

Info

Publication number: JP2008219191A
Application number: JP2007050653A
Authority: JP
Inventors: Shinji Hinokuchi; 慎司樋之口
Original assignee: Kyocera Crystal Device Corp
Current assignee: Kyocera Crystal Device Corp
Priority date: 2007-02-28
Filing date: 2007-02-28
Publication date: 2008-09-18

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator comprising an integrated circuit element, having a space for disposing the integrated circuit element even when the piezoelectric oscillator is reduced in size, and preventing electric short-circuit between a terminal portion and an electrode pad for connecting a casing of the integrated circuit element. <P>SOLUTION: The piezoelectric oscillator 100 comprises a piezoelectric resonator portion 10 equipped with a casing 11 having a concave portion, an electrode terminal 16 for connecting the terminal portion and an integrated circuit element mounting pad 17 which are formed on the bottom surface of an integrated circuit element rectangular in plan view of the casing, a piezoelectric resonator element 13 mounted in the concave portion, and a lid for sealing the concave portion; an integrated circuit element 50 having a pad 51 for connecting the casing to be connected to the integrated circuit element mounting pad 17; and a terminal portion connected to the electrode terminal 16 for connecting the terminal portion. In the piezoelectric oscillator, the integrated circuit element 50 is disposed so that the corner top portion of the integrated circuit element 50 may be positioned between the adjacent terminal portions along the side of the bottom surface of the integrated circuit element connection side. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子部品の一つである圧電発振器に関する。 The present invention relates to a piezoelectric oscillator that is one of electronic components.

従来から、携帯用通信機器等の電子機器には、電子部品の一つとして圧電発振器が基準信号発生源として用いられている。従来の圧電発振器３００は、図４及び図５に示されるように、大略的に圧電振動子部３０１と集積回路素子４０１と端子部５０４により構成されている。 Conventionally, in an electronic device such as a portable communication device, a piezoelectric oscillator is used as a reference signal generation source as one of electronic components. As shown in FIGS. 4 and 5, the conventional piezoelectric oscillator 300 is roughly composed of a piezoelectric vibrator portion 301, an integrated circuit element 401, and a terminal portion 504.

圧電振動子部３０１は、容器体３０２に形成された凹部３０３内に圧電振動素子３０４を収容しており、この凹部３０３の開口部が蓋体３０５により気密封止されている。又、凹部３０３内に収容されている圧電振動素子３０４と、圧電振動子部３０１の集積回路素子接続側底面に形成されている複数個の集積回路素子搭載パッド３０６のうちの所定の端子とは、電気的に接続されており、更に、圧電振動子部３０１の集積回路素子接続側底面の４つの角部には所定の集積回路素子搭載パッド３０６と電気的に接続した端子部接続用電極端子３０７が形成されている。 The piezoelectric vibrator 301 accommodates a piezoelectric vibration element 304 in a recess 303 formed in the container body 302, and an opening of the recess 303 is hermetically sealed by a lid 305. Also, the piezoelectric vibration element 304 housed in the recess 303 and the predetermined terminals of the plurality of integrated circuit element mounting pads 306 formed on the bottom face of the piezoelectric vibrator portion 301 on the integrated circuit element connection side are: In addition, electrode terminals for connecting a terminal part electrically connected to a predetermined integrated circuit element mounting pad 306 are provided at four corners on the bottom face of the piezoelectric vibrator part 301 on the side of the integrated circuit element connection. 307 is formed.

集積回路素子４０１は平面視矩形又は正方形の形状であり、この圧電振動子部３０１の外側底面の中央に、集積回路素子４０１の主面の外周各辺が圧電振動子部３０１の外側底面の各辺と平行になるように、圧電振動子部３０１の集積回路素子接続側底面に形成された複数個の集積回路素子搭載パッド３０６に接続搭載されている。 The integrated circuit element 401 has a rectangular or square shape in plan view, and the outer peripheral sides of the main surface of the integrated circuit element 401 are arranged on the outer bottom surface of the piezoelectric vibrator section 301 at the center of the outer bottom face of the piezoelectric vibrator section 301. It is connected and mounted on a plurality of integrated circuit element mounting pads 306 formed on the bottom surface of the piezoelectric vibrator section 301 on the side where the integrated circuit element is connected so as to be parallel to the side.

端子部５０１は、圧電発振器３００を外部の電子基板などに搭載した際に、集積回路素子４０１の表面が電子基板表面に接触しない高さ寸法を有する半田ボール等の球形状の導電体で形成されており、前記端子部接続用電極端子３０７それぞれに電気的且つ機械的に接続されている。（例えば、特許文献１，２又は３を参照。） The terminal portion 501 is formed of a spherical conductor such as a solder ball having a height such that the surface of the integrated circuit element 401 does not contact the surface of the electronic substrate when the piezoelectric oscillator 300 is mounted on an external electronic substrate or the like. And electrically and mechanically connected to each of the terminal portion connection electrode terminals 307. (For example, see Patent Documents 1, 2, or 3.)

特開２００２−２９７９４６号公報JP 2002-297946 A 特開２００３−３１８６５３号公報JP 2003-318653 A 特開２００３−４６２５１号公報JP 2003-46251 A

尚、前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献以外を、本件出願時までに発見するに至らなかった。 In addition, other than the prior art documents specified by the prior art document information described above, other than the prior art documents related to the present invention have not been found by the time of filing of the present application.

しかし、球形状の端子部の直径を小さくするのには、端子部を形成する装置や、端子部を各端子部接続用電極端子へ搭載する装置等の精密化の問題や、端子部小型化による作業困難性の問題により限界がある。そのため、圧電発振器の小型化が進んだ場合、形成装置や搭載装置の精密化や搭載作業困難性に問題が生じない所定の大きさの端子部を用いると、圧電振動子部の集積回路素子接続側底面上での端子部の配置スペースが、圧電振動子部の集積回路素子接続側底面に配置する必要がある集積回路素子の配置スペースにまで食い込んでしまい、所望する大きさの集積回路素子を配置するスペースを圧電振動子部の集積回路素子接続側底面に確保するのが困難であるという課題を有していた。 However, in order to reduce the diameter of the spherical terminal part, there is a problem of refinement such as a device for forming the terminal part, a device for mounting the terminal part on each terminal part connection electrode terminal, or a reduction in the size of the terminal part. There is a limit due to the problem of work difficulty due to. Therefore, when the piezoelectric oscillator is downsized, if the terminal part of a predetermined size that does not cause a problem in the precision of the forming device and the mounting device and the difficulty in mounting work is used, the integrated circuit element connection of the piezoelectric vibrator unit The arrangement space of the terminal part on the side bottom surface bites into the arrangement space of the integrated circuit element that needs to be disposed on the bottom surface of the piezoelectric vibrator unit on the side where the integrated circuit element is connected. There has been a problem that it is difficult to secure a space to be arranged on the bottom surface of the piezoelectric vibrator portion on the side where the integrated circuit element is connected.

又、集積回路素子の四隅部には容器接続用電極パッドを配置する必要があるため、従来の圧電発振器における集積回路素子の配置構造では、端子部接続用電極端子上の端子部と集積回路素子の角部が密接して配置する構造となっていた。そのため、圧電発振器を外部の電子基板へ搭載する際に、端子部と集積回路素子の容器接続用電極パッドとが、搭載時に使用する半田や導電性接着剤が不要に付着することで電気的に短絡するおそれがあった。 In addition, since it is necessary to dispose the electrode pads for container connection at the four corners of the integrated circuit element, in the conventional arrangement structure of the integrated circuit element in the piezoelectric oscillator, the terminal portion on the electrode terminal for terminal portion connection and the integrated circuit element The corners of the structure were arranged closely. Therefore, when the piezoelectric oscillator is mounted on an external electronic substrate, the terminal portion and the electrode pad for connecting the container of the integrated circuit element are electrically attached by unnecessary adhesion of solder and conductive adhesive used at the time of mounting. There was a risk of short circuit.

本発明の目的は、圧電発振器が小型化された場合においても、集積回路素子を配置するスペースを確保することが可能な形状の集積回路素子により構成され、且つ圧電発振器を外部の電子基板へ搭載する際に、端子部と集積回路素子の容器接続用電極パッドとが電気的に短絡することがない圧電発振器を提供することにある。 It is an object of the present invention to include an integrated circuit element having a shape capable of securing a space for arranging an integrated circuit element even when the piezoelectric oscillator is downsized, and mounting the piezoelectric oscillator on an external electronic substrate It is an object of the present invention to provide a piezoelectric oscillator in which the terminal portion and the container connection electrode pad of the integrated circuit element are not electrically short-circuited.

本発明は、前記課題を解決するために成されたものであり、一方の主面に開口する凹部を有する容器体と、この容器体の一方の主面とは反対側の平面視長方形の集積回路素子接続側底面の四隅部に形成された端子部接続用電極端子と、集積回路素子接続側底面の四隅部以外の所定の位置に形成された集積回路素子搭載パッドと、凹部内部に搭載された圧電振動素子と、凹部を封止する蓋部とを備える圧電振動子部と、集積回路素子搭載パッドと電気的且つ機械的に接続する容器接続用電極パッドが、一方の主面に形成された、少なくとも圧電振動素子と電気的に接続する発振回路が内蔵された集積回路素子と、端子部接続用電極端子に接続された端子部とにより構成されている圧電発振器であって、この集積回路素子の一方の主面の角頂部が、集積回路素子接続側底面の辺に沿って隣り合う端子部の間に位置するように集積回路素子が配置されていることを特徴とする圧電発振器である。 The present invention has been made to solve the above-mentioned problems, and is a container body having a recess opening on one main surface, and an accumulation of rectangles in plan view on the opposite side of the one main surface of the container body. Mounted inside the recess, electrode terminals for terminal portion connection formed at the four corners of the bottom surface of the circuit element connection side, integrated circuit element mounting pads formed at predetermined positions other than the four corners of the bottom surface of the integrated circuit element connection side A piezoelectric vibrator portion including a piezoelectric vibration element, a lid portion that seals the concave portion, and a container connection electrode pad that is electrically and mechanically connected to the integrated circuit element mounting pad are formed on one main surface. A piezoelectric oscillator comprising an integrated circuit element including an oscillation circuit that is electrically connected to at least a piezoelectric vibration element, and a terminal portion connected to a terminal portion connection electrode terminal. The apex of one main surface of the element is A piezoelectric oscillator, characterized in that the integrated circuit device so as to be positioned between the terminal portions adjacent along the sides of the integrated circuit device connection side bottom is arranged.

又、前記集積回路素子の一方の主面の平面視形状が４つの辺の長さが等しい四角形であり、且つ集積回路素子が、圧電振動子部の集積回路素子接続側底面の各辺の中心を通る中心線上に、集積回路素子の主面の各角頂部がそれぞれ位置する形態で配置されていることを特徴とする前記記載の圧電発振器でもある。 Further, the planar view shape of one main surface of the integrated circuit element is a quadrangle whose four sides are equal in length, and the integrated circuit element is the center of each side of the bottom surface of the piezoelectric vibrator portion on the side of the integrated circuit element connection side. Also, the piezoelectric oscillator described above is characterized in that each of the corner apexes of the main surface of the integrated circuit element is located on a center line passing through the piezoelectric oscillator.

更に、集積回路素子の一方の主面の平面視形状が正方形であることを特徴とする前記記載の圧電発振器でもある。 Further, in the piezoelectric oscillator as described above, the planar shape of one main surface of the integrated circuit element is square.

更に又、端子部の外形形状が球形状であることを特徴とする前記記載の圧電発振器でもある。 Furthermore, in the piezoelectric oscillator described above, the outer shape of the terminal portion is spherical.

本発明の圧電発振器によれば、集積回路素子の一方の主面の角頂部が、集積回路素子接続側底面の辺に沿って隣り合う端子部の間に位置するように集積回路素子が配置されており、特に平面視形状が４つの辺の長さが等しい四角形の集積回路素子を、圧電振動子部の集積回路素子接続側底面の各辺の中心線上に、この集積回路素子の一方の主面の各角頂部がそれぞれ位置する形態で圧電振動子部の集積回路素子接続側底面に配置しているので、端子部接続用電極端子が配置されている圧電振動子部の４つの角部と集積回路素子の側面との間に所望する端子部配置スペースを確保できる。因って、圧電発振器の小型化が進んだ場合においても、形成装置や搭載装置の精密化や搭載作業困難性に問題が生じない所定の大きさの端子部を用いつつ、従来と同等以上の大きさの集積回路素子を配置するスペースを圧電振動子部の集積回路素子接続側底面に確保するのが可能となる。 According to the piezoelectric oscillator of the present invention, the integrated circuit element is arranged so that the corner apex portion of one main surface of the integrated circuit element is located between the adjacent terminal portions along the side of the bottom surface on the integrated circuit element connection side. In particular, a rectangular integrated circuit element having a shape in plan view having the same length of four sides is placed on the center line of each side of the bottom surface of the piezoelectric vibrator portion on the side where the integrated circuit element is connected. Since each corner portion of the surface is located on the bottom surface of the piezoelectric vibrator portion on the side where the integrated circuit element is connected, the four corner portions of the piezoelectric vibrator portion on which the terminal portion connection electrode terminals are disposed and A desired terminal portion arrangement space can be ensured between the side surfaces of the integrated circuit element. Therefore, even when the size of the piezoelectric oscillator has been reduced, it is possible to use a terminal part of a predetermined size that does not cause a problem in the precision of the forming device and the mounting device and the difficulty in mounting work, and at least equivalent to the conventional one. It is possible to secure a space for arranging the size of the integrated circuit element on the bottom surface of the piezoelectric vibrator portion on the side where the integrated circuit element is connected.

又、集積回路素子の四隅部には、構造上安定的に集積回路素子を圧電振動子部へ接続する為に容器接続用電極パッドを配置する必要がある。従来の集積回路素子の配置構造では、端子部接続用電極端子上の端子部と集積回路素子の角部が密接して配置する構造となっていたが、本発明の集積回路素子の配置構造とすることで、圧電振動子部の集積回路素子接続側底面の四隅部に形成した端子部と、集積回路素子の四隅部に形成した容器接続用電極パッド間との十分な距離を確保できる。これにより、圧電発振器を外部の電子基板へ搭載する際に、端子部と集積回路素子の容器接続用電極パッドとが電気的に短絡することを防止することが可能となる。 In addition, it is necessary to dispose container connection electrode pads at the four corners of the integrated circuit element in order to connect the integrated circuit element to the piezoelectric vibrator portion in a structurally stable manner. In the conventional arrangement structure of the integrated circuit element, the terminal part on the terminal part connection electrode terminal and the corner part of the integrated circuit element are arranged in close contact with each other. By doing so, it is possible to secure a sufficient distance between the terminal portions formed at the four corners of the bottom face of the piezoelectric vibrator portion on the side of the integrated circuit element connection and the container connection electrode pads formed at the four corners of the integrated circuit element. Accordingly, when the piezoelectric oscillator is mounted on an external electronic substrate, it is possible to prevent the terminal portion and the electrode pad for connecting the container of the integrated circuit element from being electrically short-circuited.

因って、本発明により、従来の大きさの端子部及び集積回路素子を用いつつ小型化が可能で、且つ外部電子基板への搭載時に短絡不良の発生が著しく少ない圧電発振器を提供する効果を奏する。 Therefore, according to the present invention, there is provided an effect of providing a piezoelectric oscillator that can be miniaturized while using a terminal portion and an integrated circuit element having a conventional size and that has a remarkable occurrence of short-circuit failure when mounted on an external electronic substrate. Play.

本発明を実施するための最良の形態（以下、「実施形態」という。）について、適宜図面を参照しながら詳細に説明する。図１は、本発明の一実施形態に係る圧電発振器を、圧電発振器の実装側から示した平面図であり、図２は、図１記載の圧電発振器を同図記載の仮想切断線Ａ−Ａ′で切断した場合の断面図である。又、図３は、本発明の他の実施形態に係る圧電発振器を、圧電発振器の実装側から示した平面図である。なお、各図においての同一の符号は同じ対象を示すものとし、説明を明りょうにするため構造体の一部を図示せず、又図面に記載した寸法も一部誇張して図示している。 The best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described in detail with reference to the drawings as appropriate. FIG. 1 is a plan view showing a piezoelectric oscillator according to an embodiment of the present invention from the mounting side of the piezoelectric oscillator, and FIG. 2 is a virtual cutting line AA of the piezoelectric oscillator shown in FIG. It is sectional drawing at the time of cut | disconnecting by '. FIG. 3 is a plan view showing a piezoelectric oscillator according to another embodiment of the present invention from the mounting side of the piezoelectric oscillator. In addition, the same code | symbol in each figure shall show the same object, and in order to clarify description, a part of structure is not shown in figure, and the dimension described in drawing is also exaggerated and shown in figure. .

図１及び図２に示すように、本発明の一実施形態に係る圧電発振器１００は、圧電振動子部１０と端子部３０と集積回路素子５０とで大略的に構成され、又、図３に示すように、本発明の他の実施形態に係る圧電発振器２００は、圧電振動子部１０と端子部３０と集積回路素子５２とで大略的に構成され、圧電振動子部１０は容器体１１、蓋体１２及び圧電振動素子１３とから主に構成されている。 As shown in FIGS. 1 and 2, a piezoelectric oscillator 100 according to an embodiment of the present invention is roughly constituted by a piezoelectric vibrator section 10, a terminal section 30, and an integrated circuit element 50, and FIG. As shown, a piezoelectric oscillator 200 according to another embodiment of the present invention is roughly composed of a piezoelectric vibrator unit 10, a terminal unit 30, and an integrated circuit element 52. The piezoelectric vibrator unit 10 includes a container body 11, It mainly comprises a lid 12 and a piezoelectric vibration element 13.

圧電振動素子１３は、圧電素材を加工成形した平面視矩形状の圧電素板の表面に所定形状の電極を形成したものである。例えば、圧電素材として水晶を用いた場合は、人工水晶体より所定のカットアングルで切り出し外形加工を施した水晶素板の両主面に励振電極を対向して被着形成してなり、外部からの変動電圧が一対の励振電極を介して水晶素板に印加されると、所定の振動モードの振動を起こすようになっている。又、この電極は、引き回し電極パターンと接続して圧電素板の一外周端部側へ引き回されている。尚、圧電振動素子１３は、導電性接着剤を介して、後述する容器体１１に形成された凹部１４内底面に形成された圧電振動素子搭載パッド１５に実装される。これにより、圧電振動素子１３は圧電振動素子搭載パッド１５と電気的に接続された状態となる。 The piezoelectric vibration element 13 is formed by forming electrodes of a predetermined shape on the surface of a rectangular piezoelectric element plate that is formed by processing and forming a piezoelectric material. For example, when quartz is used as the piezoelectric material, excitation electrodes are formed on both main surfaces of the quartz base plate cut out from the artificial crystalline lens at a predetermined cut angle and subjected to external processing, and are formed from the outside. When the fluctuating voltage is applied to the quartz base plate via a pair of excitation electrodes, vibration in a predetermined vibration mode is caused. In addition, this electrode is connected to a lead electrode pattern and is routed to one outer peripheral end side of the piezoelectric element plate. The piezoelectric vibration element 13 is mounted on a piezoelectric vibration element mounting pad 15 formed on the inner bottom surface of the recess 14 formed in the container body 11 to be described later via a conductive adhesive. As a result, the piezoelectric vibration element 13 is electrically connected to the piezoelectric vibration element mounting pad 15.

図１及び図２に示す集積回路素子５０は、回路形成面に、周囲の温度状態を検知する温度センサ、圧電振動素子１３の温度特性を補償する温度補償データを有し、温度補償データに基づいて圧電振動素子１３の振動特性を温度変化に応じて補正する温度補償回路、温度補償回路に接続されて所定の発振出力を生成する発振回路等が設けられている。この発振回路で生成された発振出力信号は、所定の端子部３０を介して外部に出力された後、例えばクロック信号等の基準信号として利用されることとなる。 The integrated circuit element 50 shown in FIGS. 1 and 2 has, on the circuit formation surface, a temperature sensor that detects the ambient temperature state, and temperature compensation data that compensates for the temperature characteristics of the piezoelectric vibration element 13, and is based on the temperature compensation data. There are provided a temperature compensation circuit that corrects the vibration characteristics of the piezoelectric vibration element 13 according to a temperature change, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like. The oscillation output signal generated by the oscillation circuit is output to the outside via a predetermined terminal unit 30 and then used as a reference signal such as a clock signal.

又、図２に示すように、容器体１１は平板部１１ａと枠部１１ｂで構成され、平板部１１ａにおいて、容器体１１の凹部１４内の圧電振動素子搭載側底面となる平板部１１ａの一方の主面には、圧電振動素子１３の励振電極と接続する引き回しパターンに対応した位置に圧電振動素子搭載パッド１５が設けられている。又、平板部１１ａの他方の主面は圧電振動子部１０の集積回路素子接続側底面であり、この平板部１１ａの他方の主面の四隅部に端子部接続用電極端子１６が設けられている。平板部１１ａの他方の主面の所定の位置に集積回路素子５０を搭載するための集積回路素子搭載パッド１７が設けられている。尚、端子部接続用電極端子１６と後述する端子部３０とは半田等の導電性接着剤により電気的及び機械的に接続されている。 2, the container body 11 is composed of a flat plate portion 11a and a frame portion 11b. In the flat plate portion 11a, one of the flat plate portions 11a serving as the bottom surface of the piezoelectric vibration element mounting side in the recess 14 of the container body 11 is provided. Is provided with a piezoelectric vibration element mounting pad 15 at a position corresponding to a routing pattern connected to the excitation electrode of the piezoelectric vibration element 13. The other main surface of the flat plate portion 11a is the bottom surface of the piezoelectric vibrator portion 10 on the side where the integrated circuit element is connected, and terminal connection electrode terminals 16 are provided at the four corners of the other main surface of the flat plate portion 11a. Yes. An integrated circuit element mounting pad 17 for mounting the integrated circuit element 50 is provided at a predetermined position on the other main surface of the flat plate portion 11a. Note that the terminal portion connection electrode terminal 16 and a terminal portion 30 to be described later are electrically and mechanically connected by a conductive adhesive such as solder.

又、蓋体１２は、４２アロイ、コバール又はリン青銅等の金属からなり、蓋体１２の一方の主面には封止材が全面に設けられている。蓋体１２は、圧電振動素子搭載パッド１５に実装されている圧電振動素子６０を凹部１４内に収容された状態で封止材と、容器体１１を構成する枠部１１ｂに形成されたメタライズ層とを接合することにより、凹部１４を気密封止する。 The lid 12 is made of a metal such as 42 alloy, Kovar, or phosphor bronze, and a sealing material is provided on the entire main surface of the lid 12. The lid 12 includes a sealing material and a metallized layer formed on the frame 11 b constituting the container body 11 in a state where the piezoelectric vibration element 60 mounted on the piezoelectric vibration element mounting pad 15 is accommodated in the recess 14. And the recess 14 is hermetically sealed.

ここで、本実施形態においては、端子部３０が接続される端子部接続用電極端子１６と同一の圧電振動子部１０の集積回路素子接続側底面に形成された集積回路素子搭載パッド１７に、集積回路素子５０の一方の主面である回路形成面を対向させて搭載された構造となっている。この集積回路素子５０は、圧電振動子部１０の集積回路素子接続側底面の集積回路素子搭載パッド１７と、集積回路素子５０に形成された容器接続用電極パッド５１とを、半田バンプやＡｕバンプ等の金属バンプにより電気的かつ機械的に接続することで搭載されている。又、本発明の圧電発振器における集積回路素子は図１に示すように平面視形状が４つの辺の長さが等しい四角形の集積回路素子５０、又は図３に示すように平面視形状が正方形である集積回路素子５２である。尚、本実施形態及び図面では、集積回路素子の形状の説明を明瞭とするために、集積回路素子における圧電振動子部１０の集積回路素子接続側底面に対向する一方の主面の形状と、図１及び図３において図示されている集積回路素子の一方の主面とは反対側の主面の形状とを同一形状としている。 Here, in the present embodiment, the integrated circuit element mounting pad 17 formed on the integrated circuit element connection side bottom surface of the same piezoelectric vibrator unit 10 as the terminal unit connection electrode terminal 16 to which the terminal unit 30 is connected, The integrated circuit element 50 has a structure in which a circuit forming surface which is one main surface is mounted to face each other. The integrated circuit element 50 includes an integrated circuit element mounting pad 17 on the bottom face of the piezoelectric vibrator unit 10 on the side where the integrated circuit element is connected and a container connection electrode pad 51 formed on the integrated circuit element 50 by solder bumps or Au bumps. It is mounted by being electrically and mechanically connected by metal bumps such as. Further, the integrated circuit element in the piezoelectric oscillator of the present invention has a square integrated circuit element 50 in which the shape in plan view is equal to four sides as shown in FIG. 1, or a square shape in plan view as shown in FIG. This is an integrated circuit element 52. In the present embodiment and the drawings, in order to clarify the description of the shape of the integrated circuit element, the shape of one main surface facing the integrated circuit element connection side bottom surface of the piezoelectric vibrator unit 10 in the integrated circuit element, The shape of the main surface opposite to one main surface of the integrated circuit element shown in FIGS. 1 and 3 is the same shape.

このような形状の集積回路素子５０又は集積回路素子５２が、圧電振動子部１０の集積回路素子接続側底面の各辺の中心線Ｈ上に、集積回路素子５０又は集積回路素子５２の一方の主面の各角頂点がそれぞれ位置する形態で圧電振動子部１０に接続されている。これにより、端子部接続用電極端子１６が配置されている圧電振動子部１０底面の４つの角部と、集積回路素子５０又は集積回路素子５２の側面との間に、所望する大きさの端子部３０を配置することが可能な、従来の圧電発振器比べて広い端子部配置スペースを確保できる。 The integrated circuit element 50 or the integrated circuit element 52 having such a shape is placed on one of the integrated circuit element 50 and the integrated circuit element 52 on the center line H of each side of the bottom surface of the piezoelectric vibrator unit 10 on the side where the integrated circuit element is connected. Each corner vertex of the main surface is connected to the piezoelectric vibrator unit 10 in such a form. Accordingly, a terminal having a desired size is provided between the four corners on the bottom surface of the piezoelectric vibrator unit 10 where the terminal unit connection electrode terminal 16 is disposed and the side surface of the integrated circuit element 50 or the integrated circuit element 52. As compared with the conventional piezoelectric oscillator in which the portion 30 can be arranged, a wide terminal portion arrangement space can be secured.

又、集積回路素子の一方の主面の四隅部には、容器接続用電極パッドを配置する必要があるため、図４及び図５に示すような従来の集積回路素子の配置構造では、端子部接続用電極端子上の端子部と集積回路素子の角部が密接して配置する構造となっていたが、本発明の集積回路素子５０又は集積回路素子５２の形状及び配置構造とすることで、圧電振動子部１０底面の四隅部に形成した端子部３０と、集積回路素子５０又は集積回路素子５２の一方の主面の四隅部に形成した容器接続用電極パッド５１間との十分な距離を確保できる。これにより、圧電発振器１００を外部の電子基板等へ搭載する際に、端子部３０と集積回路素子５０又は集積回路素子５２の容器接続用電極パッドとが電気的に短絡することを防止することが可能となる。又、図２に示すように比較的直径の大きい球状の端子部３０を搭載可能となり、例えば、圧電振動子部底面の外形サイズが２．５ｍｍ×２．０ｍｍの圧電発振器の場合において、集積回路素子の主面形状が１．４ｍｍ角の正方形の場合には、従来の構造では球形状の端子部の直径を、短絡不良防止を考慮して０．４ｍｍ以下にしなくてはならないが、本発明の圧電発振器の構造では、従来と同じ主面面積の集積回路素子を搭載した場合でも、直径が０．６ｍｍ程度までの球形状の端子部３０を用いることができる。又、球形状の端子部の直径を従来の圧電発振器における最大の０．４ｍｍ程度にした場合は、端子部の直径が小さく形成できる分、圧電振動子部底面の外形サイズを２．５ｍｍ×２．０ｍｍより小さくすることができ、圧電発振器全体の小型化が可能となる。 In addition, since it is necessary to dispose container connecting electrode pads at the four corners of one main surface of the integrated circuit element, in the conventional arrangement structure of the integrated circuit element as shown in FIGS. Although the terminal portion on the connection electrode terminal and the corner portion of the integrated circuit element were arranged in close contact with each other, by adopting the shape and arrangement structure of the integrated circuit element 50 or the integrated circuit element 52 of the present invention, A sufficient distance between the terminal portions 30 formed at the four corners of the bottom surface of the piezoelectric vibrator unit 10 and the container connection electrode pads 51 formed at the four corners of one main surface of the integrated circuit element 50 or the integrated circuit element 52 is set. It can be secured. Thus, when the piezoelectric oscillator 100 is mounted on an external electronic substrate or the like, it is possible to prevent the terminal portion 30 and the electrode pad for container connection of the integrated circuit element 50 or the integrated circuit element 52 from being electrically short-circuited. It becomes possible. In addition, as shown in FIG. 2, a spherical terminal portion 30 having a relatively large diameter can be mounted. For example, in the case of a piezoelectric oscillator having a bottom surface of a piezoelectric vibrator portion of 2.5 mm × 2.0 mm, an integrated circuit When the main surface shape of the element is a square of 1.4 mm square, in the conventional structure, the diameter of the spherical terminal portion must be 0.4 mm or less in consideration of prevention of short circuit failure. With this piezoelectric oscillator structure, even when an integrated circuit element having the same main surface area as that of the conventional one is mounted, the spherical terminal portion 30 having a diameter of up to about 0.6 mm can be used. Further, when the diameter of the spherical terminal portion is about 0.4 mm, which is the maximum in the conventional piezoelectric oscillator, the outer size of the bottom surface of the piezoelectric vibrator portion is 2.5 mm × 2 as much as the diameter of the terminal portion can be reduced. It can be made smaller than 0.0 mm, and the entire piezoelectric oscillator can be downsized.

尚、集積回路素子５０又は集積回路素子５２は平板部１１ａ内に形成された導配線（不図示）を介して端子部３０に電気的に接続されている。又、同様に圧電振動素子１３と集積回路素子５０又は集積回路素子５２は、平板部１１ａ内に形成された別の導配線（不図示）により電気的に接続されている。 The integrated circuit element 50 or the integrated circuit element 52 is electrically connected to the terminal portion 30 via a conductive wiring (not shown) formed in the flat plate portion 11a. Similarly, the piezoelectric vibration element 13 and the integrated circuit element 50 or the integrated circuit element 52 are electrically connected by another conductive wiring (not shown) formed in the flat plate portion 11a.

本発明は上述の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。例えば、本発明の実施形態においては、端子部３０を球形状としているが球形状に変えて、楕円球状、半球状、１／４球状あるいは柱状としても構わない。この場合も本発明の技術的範囲に含まれることは言うまでも無い。 The present invention is not limited to the above-described embodiment, and various modifications and improvements can be made without departing from the scope of the present invention. For example, in the embodiment of the present invention, the terminal portion 30 has a spherical shape. However, the terminal portion 30 may be changed to a spherical shape, and may have an elliptical spherical shape, a hemispherical shape, a 1/4 spherical shape, or a columnar shape. Needless to say, this case is also included in the technical scope of the present invention.

図１は、本発明の一実施形態に係る圧電発振器を、圧電発振器の実装側から示す平面図である。FIG. 1 is a plan view showing a piezoelectric oscillator according to an embodiment of the present invention from the mounting side of the piezoelectric oscillator. 図２は、図１に示した本発明の一実施形態に係る圧電発振器を、同図記載の仮想切断線Ａ−Ａ′で切断した場合の断面図である。FIG. 2 is a cross-sectional view of the piezoelectric oscillator according to the embodiment of the present invention shown in FIG. 1 cut along a virtual cutting line AA ′ shown in FIG. 図３は、本発明の他の実施形態に係る圧電発振器を、圧電発振器の実装側から示す平面図である。FIG. 3 is a plan view showing a piezoelectric oscillator according to another embodiment of the present invention from the mounting side of the piezoelectric oscillator. 図４は、従来の圧電発振器を、圧電発振器の実装側から示す平面図である。FIG. 4 is a plan view showing a conventional piezoelectric oscillator from the mounting side of the piezoelectric oscillator. 図５は、図４に示した従来の圧電発振器を、同図記載の仮想切断線Ｂ−Ｂ′で切断した場合の断面図である。FIG. 5 is a cross-sectional view of the conventional piezoelectric oscillator shown in FIG. 4 taken along a virtual cutting line BB ′ shown in FIG.

符号の説明Explanation of symbols

１００，２００・・・圧電発振器
１０・・・圧電振動子部
１１・・・容器体
１１ａ・・・平板部
１１ｂ・・・枠部
１２・・・蓋体
１３・・・圧電振動素子
１４・・・凹部
１５・・・圧電振動素子搭載パッド
１６・・・端子部接続用電極端子
１７・・・集積回路素子搭載パッド
３０・・・端子部
５０，５２・・・集積回路素子
５１・・・容器体接続用電極パッド
Ｈ・・・中心線 DESCRIPTION OF SYMBOLS 100,200 ... Piezoelectric oscillator 10 ... Piezoelectric vibrator part 11 ... Container body 11a ... Flat plate part 11b ... Frame part
DESCRIPTION OF SYMBOLS 12 ... Lid 13 ... Piezoelectric vibration element 14 ... Recessed part 15 ... Piezoelectric vibration element mounting pad 16 ... Electrode terminal for terminal part connection 17 ... Integrated circuit element mounting pad 30 ... Terminal portion 50, 52 ... Integrated circuit element 51 ... Container body connection electrode pad H ... Center line

Claims

一方の主面に開口する凹部を有する容器体と、前記容器体の一方の主面とは反対側の平面視長方形の集積回路素子接続側底面の四隅部に形成された端子部接続用電極端子と、前記集積回路素子接続側底面の四隅部以外の所定の位置に形成された集積回路素子搭載パッドと、前記凹部内部に搭載された圧電振動素子と、前記凹部を封止する蓋部とを備える圧電振動子部と、
前記集積回路素子搭載パッドと電気的且つ機械的に接続する容器接続用電極パッドが、一方の主面に形成された、少なくとも前記圧電振動素子と電気的に接続する発振回路が内蔵された集積回路素子と、
前記端子部接続用電極端子に接続された端子部とにより構成されている圧電発振器であって、
前記集積回路素子の一方の主面の角頂部が、前記集積回路素子接続側底面の辺に沿って隣り合う前記端子部の間に位置するように前記集積回路素子が配置されていることを特徴とする圧電発振器。 A container body having a recess opening in one main surface, and terminal portion connection electrode terminals formed at the four corners of the rectangular integrated circuit element connection side bottom surface in a plan view opposite to the one main surface of the container body An integrated circuit element mounting pad formed at a predetermined position other than the four corners on the bottom surface of the integrated circuit element connection side, a piezoelectric vibration element mounted inside the recess, and a lid for sealing the recess A piezoelectric vibrator portion comprising:
An integrated circuit having a container connecting electrode pad electrically and mechanically connected to the integrated circuit element mounting pad formed on one main surface and including an oscillation circuit electrically connected to at least the piezoelectric vibration element Elements,
A piezoelectric oscillator composed of a terminal portion connected to the terminal portion connecting electrode terminal,
The integrated circuit element is disposed such that a corner apex portion of one main surface of the integrated circuit element is located between the terminal portions adjacent to each other along a side of the bottom surface on the integrated circuit element connection side. Piezoelectric oscillator.

前記集積回路素子の一方の主面の平面視形状が４つの辺の長さが等しい四角形であり、且つ前記集積回路素子が、前記圧電振動子部の前記集積回路素子接続側底面の各辺の中心を通る中心線上に、前記集積回路素子の主面の各角頂部がそれぞれ位置する形態で配置されていることを特徴とする請求項１記載の圧電発振器。 The planar view shape of one main surface of the integrated circuit element is a quadrangle whose four sides are equal in length, and the integrated circuit element is formed on each side of the bottom face of the piezoelectric vibrator portion on the side of the integrated circuit element connection side. 2. The piezoelectric oscillator according to claim 1, wherein each corner apex of the main surface of the integrated circuit element is disposed on a center line passing through the center.

前記集積回路素子の一方の主面の平面視形状が正方形であることを特徴とする請求項１又は請求項２記載の圧電発振器。 3. The piezoelectric oscillator according to claim 1, wherein a plan view shape of one main surface of the integrated circuit element is a square.

前記端子部の外形形状が球形状であることを特徴とする請求項１、請求項２又は請求項３記載の圧電発振器。 4. The piezoelectric oscillator according to claim 1, wherein the outer shape of the terminal portion is a spherical shape.