JP2007013572A

JP2007013572A - Piezoelectric oscillator

Info

Publication number: JP2007013572A
Application number: JP2005191721A
Authority: JP
Inventors: Eiichi Fukiharu; 栄一吹春; Hiroyuki Miura; 浩之三浦
Original assignee: Kyocera Crystal Device Corp
Current assignee: Kyocera Crystal Device Corp
Priority date: 2005-06-30
Filing date: 2005-06-30
Publication date: 2007-01-18

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator capable of providing a piezoelectric oscillator which is easier to handle, small-sized, and excellent in productivity. <P>SOLUTION: In the piezoelectric oscillator, a capacitor mounting space 18 in which a recessed part 15 formed in a housing 10 mounts an integrated circuit element 7, where at least as an oscillation circuit is formed and built in, and a notch part 9 formed by notching a part of a side wall part 13 surrounding the recessed part 15 is included, a chip type capacitor 8 is mounted. A piezoelectric oscillator 1 which builds in a piezoelectric oscillation element 5 in the housing 10 is mechanically connected, and the piezoelectric oscillation element 5, the integrated circuit element 7, and the chip type capacitor 8 are electrically connected. A partition wall part 6 in a shape crossing and connecting the side walls 13 on both notched ends is formed in a part where the side wall part 13 is notched out of the capacitor mounting space 18 where the capacitor 8 is mounted. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、携帯用通信機器等の電子機器に用いられる電子部品である圧電発振器に関するものである。 The present invention relates to a piezoelectric oscillator that is an electronic component used in an electronic device such as a portable communication device.

従来より、携帯用通信機器等の電子機器には、電子部品と一つとして基準信号発生源となる圧電発振器が用いられている。 2. Description of the Related Art Conventionally, electronic devices such as portable communication devices have used a piezoelectric oscillator as a reference signal generation source as one electronic component.

かかる従来の圧電発振器としては、例えば図５に示す如く、内部に図５中には示されてはいないが、圧電振動素子が収容されている第１の容器体５３を、キャビティ部５５内に前記の圧電振動素子の振動に基づいて発振出力を制御する集積回路素子５６やコンデンサ等のチップ型電子素子が収容されている第２の容器体５１上に取着させた構造のものが知られており、かかる圧電発振器をマザーボード等の外部配線基板上に載置させた上、第２の容器体５１の下面に設けられている外部接続用端子を外部の回路母基板の配線又は電極パッドに半田接合することにより外部の回路母基板上に実装されている。 As such a conventional piezoelectric oscillator, for example, as shown in FIG. 5, a first container body 53 containing a piezoelectric vibration element, which is not shown in FIG. An integrated circuit element 56 for controlling the oscillation output based on the vibration of the piezoelectric vibration element and a structure attached to a second container body 51 containing a chip-type electronic element such as a capacitor are known. The piezoelectric oscillator is placed on an external wiring board such as a mother board, and the external connection terminals provided on the lower surface of the second container body 51 are connected to wirings or electrode pads on the external circuit mother board. It is mounted on an external circuit mother board by soldering.

尚、第１の容器体５３や第２の容器体５１は、通常、セラミックス材料によって形成されており、その内部や表面には配線導体が形成され、従来周知のセラミックグリーンシート積層法等を採用することにより製作される。 The first container body 53 and the second container body 51 are usually formed of a ceramic material, and a wiring conductor is formed inside or on the surface, and a conventionally known ceramic green sheet lamination method or the like is adopted. It is manufactured by doing.

又、前記集積回路素子５６の内部には、圧電振動素子の温度特性に応じて作成された温度補償データに基づいて圧電発振器の発振周波数を補正するための温度補償回路が設けられており、圧電発振器を組み立てた後、上述の温度補償データを集積回路素子５６のメモリ内に格納すべく、第２の容器体５１の下面や外側面等には温度補償データ書込用の書込制御端子５７が設けられていた。この書込制御端子５７に温度補償データ書込装置のプローブ針を当てて集積回路素子５６内のメモリに温度補償データを入力することにより、温度補償データが集積回路素子５６のメモリ内に格納される。 The integrated circuit element 56 is provided with a temperature compensation circuit for correcting the oscillation frequency of the piezoelectric oscillator based on temperature compensation data created according to the temperature characteristics of the piezoelectric vibration element. After assembling the oscillator, in order to store the temperature compensation data in the memory of the integrated circuit element 56, a write control terminal 57 for writing temperature compensation data is provided on the lower surface and the outer surface of the second container body 51. Was provided. The temperature compensation data is stored in the memory of the integrated circuit element 56 by applying the probe needle of the temperature compensation data writing device to the write control terminal 57 and inputting the temperature compensation data to the memory in the integrated circuit element 56. The

上述したような圧電発振器については、以下のような先行技術文献に開示がある。
特開２００４−１２９０９０号公報特開２００４−６４６５１号公報 The piezoelectric oscillator as described above is disclosed in the following prior art documents.
JP 2004-129090 A JP 2004-64651 A

なお、出願人は前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を、本件出願時までに発見するに至らなかった。 The applicant has not found any prior art documents related to the present invention other than the prior art documents specified by the prior art document information described above by the time of filing of the present application.

しかしながら、上述した従来の圧電発振器の集積回路素子５６が第２の容器体５１の凹状のキャビティ部５５に配置させてある場合、圧電発振器が小型化するにつれ、キャビティ部５５内には集積回路素子５６しか搭載できるスペースが設けられず、コンデンサ等のチップ型電子素子の搭載スペースとしては、キャビティ部５５を囲繞する第２の容器体５１の側壁部の一部を切り欠いて形成したスペース（以下切欠部という）を使用している。 However, when the integrated circuit element 56 of the conventional piezoelectric oscillator described above is disposed in the concave cavity portion 55 of the second container body 51, the integrated circuit element is included in the cavity portion 55 as the piezoelectric oscillator is downsized. A space for mounting only 56 is provided, and a space for forming a chip-type electronic element such as a capacitor is a space formed by cutting out a part of the side wall portion of the second container body 51 that surrounds the cavity portion 55 (hereinafter referred to as a space). Used as a notch).

又、このような形態の圧電発振器では、第２の容器体５１の凹状のキャビティ部内面と集積回路素子５６間の隙間が非常に狭くなり、集積回路素子５６の回路形成面（下面）と第２の容器体５１のキャビティ部内面間に保護材としての絶縁性の樹脂材を注入するのが困難なため、樹脂材の注入を行わなくなる傾向にある。 In the piezoelectric oscillator having such a configuration, the gap between the concave cavity inner surface of the second container body 51 and the integrated circuit element 56 becomes very narrow, and the circuit forming surface (lower surface) of the integrated circuit element 56 and the first Since it is difficult to inject an insulating resin material as a protective material between the inner surfaces of the cavity portions of the container body 51 of the second container body 51, the resin material tends not to be injected.

そのため、上記切欠部よりキャビティ部内に進入するダスト等のコンタミにより、保護材で被覆されていない、例えば集積回路素子の端子間にコンタミが入り込み、端子間で短絡を起こす等、不具合を発生させる懸念がある。 For this reason, there is a concern that a defect such as dust that enters the cavity from the notch is not covered with a protective material, for example, contamination enters between terminals of the integrated circuit element, causing a short circuit between the terminals. There is.

本発明は上記欠点に鑑み考え出されたものであり、従ってその目的は、信頼性が高く、かつ、生産性にも優れた小型の圧電発振器を得ることができる圧電発振器を提供することにある。 The present invention has been conceived in view of the above-described drawbacks. Accordingly, an object of the present invention is to provide a piezoelectric oscillator capable of obtaining a small piezoelectric oscillator having high reliability and excellent productivity. .

本発明の圧電発振器は、容器体に形成された凹形状の集積回路搭載空間には、少なくとも発振回路が形成内蔵されている集積回路素子が搭載され、且つこの集積回路搭載空間を囲繞する側壁部の一部を切り欠き形成した切欠部を含むコンデンサ搭載空間には、チップ型のコンデンサが搭載されており、この容器体に圧電振動素子を内蔵した圧電振動子を機械的に接続し、且つ圧電振動素子，集積回路素子及び該チップ型コンデンサを電気的に接続してなる圧電発振器において、
上記コンデンサが搭載されているコンデンサ搭載空間のうち側壁部を切り欠いた部分（切欠部）に、切り欠かれた両端の側壁部を横断連絡する形態の障壁部が形成されていることを特徴とする。 In the piezoelectric oscillator according to the present invention, an integrated circuit element in which at least an oscillation circuit is formed is mounted in a concave integrated circuit mounting space formed in a container body, and a side wall portion surrounding the integrated circuit mounting space A chip-type capacitor is mounted in a capacitor mounting space including a notch formed by cutting out a part of the piezoelectric element. A piezoelectric vibrator having a piezoelectric vibration element built into the container body is mechanically connected, and the piezoelectric In a piezoelectric oscillator formed by electrically connecting a vibration element, an integrated circuit element, and the chip capacitor,
In the capacitor mounting space in which the capacitor is mounted, a portion of the side wall notched (notched portion) is formed with a barrier portion configured to cross-connect the side walls at both the notched ends. To do.

又、本発明の圧電発振器は、上記構成において、障壁部は、容器体を構成する材質と同等の硬度に硬化できる樹脂により形成されていることを特徴とする。 Moreover, the piezoelectric oscillator according to the present invention is characterized in that, in the above-described configuration, the barrier portion is formed of a resin that can be cured to a hardness equivalent to that of a material constituting the container body.

更に、本発明の圧電発振器は、容器体に形成された凹形状の集積回路搭載空間には、少なくとも発振回路が形成内蔵されている集積回路素子が搭載され、且つこの集積回路搭載空間を囲繞する側壁部の一部を切り欠き形成した切欠部を含むコンデンサ搭載空間には、チップ型のコンデンサが搭載されており、この容器体に圧電振動素子を内蔵した圧電振動子を機械的に接続し、且つ圧電振動素子，集積回路素子及びチップ型コンデンサを電気的に接続してなる圧電発振器において、
上記コンデンサ搭載空間のうち、切欠部の長さ寸法がチップ型のコンデンサを搭載するコンデンサ接続用電極パッドの幅寸法とほぼ同等であり、且つこのコンデンサ接続用電極パッドが、切欠部底面に、コンデンサ接続用電極パッドに搭載するコンデンサが切欠部の長さ方向に対し直角に配置するような形態で、このコンデンサ接続用電極パッドうちの少なくとも一つが形成されており、コンデンサ接続用電極パッド上にコンデンサを配置し且つコンデンサと切欠部両端の側壁部端面との間がコンデンサとコンデンサ接続用電極パッドとを導通固着する導電性の接合材により塞がれていることを特徴とする。 Furthermore, in the piezoelectric oscillator of the present invention, an integrated circuit element in which at least an oscillation circuit is formed is mounted in the concave integrated circuit mounting space formed in the container body, and surrounds the integrated circuit mounting space. A chip-type capacitor is mounted in a capacitor mounting space including a cutout part formed by cutting out a part of the side wall, and a piezoelectric vibrator having a piezoelectric vibration element built in this container body is mechanically connected, And in the piezoelectric oscillator formed by electrically connecting the piezoelectric vibration element, the integrated circuit element, and the chip type capacitor,
In the capacitor mounting space, the length of the notch is substantially the same as the width of the capacitor connecting electrode pad on which the chip-type capacitor is mounted, and the capacitor connecting electrode pad is formed on the bottom of the notch. At least one of the capacitor connection electrode pads is formed in such a manner that the capacitor mounted on the connection electrode pad is disposed at right angles to the length direction of the notch, and the capacitor is formed on the capacitor connection electrode pad. And the gap between the capacitor and the end face of the side wall at both ends of the notch is blocked by a conductive bonding material that conductively fixes the capacitor and the capacitor connection electrode pad.

又、本発明の圧電発振器は、上記構成において、接合材が導電性接着剤であることを特徴とする。 The piezoelectric oscillator of the present invention is characterized in that, in the above configuration, the bonding material is a conductive adhesive.

本発明の圧電発振器によれば、容器体に形成された凹形状の集積回路搭載空間には、少なくとも発振回路が形成内蔵されている集積回路素子が搭載され、且つ該集積回路搭載空間を囲繞する側壁部の一部を切り欠き形成した切欠部を含むコンデンサ搭載空間には、チップ型のコンデンサが搭載されており、該容器体に圧電振動素子を内蔵した圧電振動子を機械的に接続し、且つ該圧電振動素子，該集積回路素子及び該チップ型コンデンサを電気的に接続してなる圧電発振器において、該コンデンサが搭載されている該コンデンサ搭載空間のうち側壁部を切り欠いた部分に、切り欠かれた両端の側壁部を横断連絡する形態の障壁部や導電性の接合材により塞がれていることから、障壁部や導電性の接合材により外部から集積回路搭載空間内へのダストや半田屑等のコンタミの侵入を抑えることが可能となる。 According to the piezoelectric oscillator of the present invention, an integrated circuit element in which at least an oscillation circuit is formed is mounted in the concave integrated circuit mounting space formed in the container body, and surrounds the integrated circuit mounting space. A chip-type capacitor is mounted in a capacitor mounting space including a cutout part formed by cutting out a part of the side wall, and a piezoelectric vibrator having a piezoelectric vibration element built in the container body is mechanically connected, Further, in the piezoelectric oscillator formed by electrically connecting the piezoelectric vibration element, the integrated circuit element, and the chip capacitor, a portion of the capacitor mounting space in which the capacitor is mounted is cut into a portion where the side wall is cut. Since it is blocked by a barrier portion or conductive bonding material that crosses the side wall portions at both ends, the barrier portion or conductive bonding material leads to the integrated circuit mounting space from the outside. It is possible to suppress the intrusion of the strikes or the solder chips like contamination.

このことにより、コンタミが原因となる不具合を防止でき、信頼性が高く、かつ、生産性にも優れた小型の圧電発振器を提供できる効果を奏する。 As a result, it is possible to prevent defects caused by contamination, provide a small piezoelectric oscillator that is highly reliable and excellent in productivity.

以下、本発明の形態を添付図面に基づいて詳細に説明する。なお、各図においての同一の符号は同じ対象を示すものとする。又、各図では、説明を明りょうにするため説明不要な構造体の一部を図示せず、また各構造物の寸法も一部誇張して図示している。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object. In addition, in each drawing, for the sake of clarity, a part of the structure that does not need to be described is not shown, and the dimensions of each structure are also exaggerated.

図１は本発明における圧電発振器の一形態を示した分解斜視図である。図２は、図１に開示の圧電発振器を組み立て後、図１に記載の仮想切断線Ａ１−Ａ２で切断した場合の断面図である。
図１に示す圧電発振器は、集積回路素子７を収容する集積回路素子搭載空間を形成する凹部１５を有する容器体１０の下面に外部接続電極端子１６が設けられ、集積回路素子７を収容する凹部１５の底面には集積回路素子７が搭載されている。また、集積回路素子７を収容する凹部１５を有する容器体１０の凹部１５を囲繞する側壁部１３の外側面には複数個の書込制御端子１１が形成されている。また、本発明の圧電発振器においては側壁部１３の一部には切欠部９が形成されており、また、図１に示すように側壁部１３の上面には、圧電振動素子５が収容されている圧電振動子１を載置して固定した構造を有している。 FIG. 1 is an exploded perspective view showing an embodiment of a piezoelectric oscillator according to the present invention. 2 is a cross-sectional view when the piezoelectric oscillator disclosed in FIG. 1 is assembled and then cut along a virtual cutting line A1-A2 shown in FIG.
The piezoelectric oscillator shown in FIG. 1 is provided with an external connection electrode terminal 16 on the lower surface of a container body 10 having a concave portion 15 that forms an integrated circuit element mounting space for accommodating an integrated circuit element 7. An integrated circuit element 7 is mounted on the bottom surface of 15. A plurality of write control terminals 11 are formed on the outer surface of the side wall portion 13 surrounding the recess 15 of the container body 10 having the recess 15 for accommodating the integrated circuit element 7. Further, in the piezoelectric oscillator of the present invention, a notch 9 is formed in a part of the side wall 13, and the piezoelectric vibration element 5 is accommodated on the upper surface of the side wall 13 as shown in FIG. The piezoelectric vibrator 1 is placed and fixed.

図１において圧電振動子１は、例えば、ガラス−セラミック、アルミナセラミックス等のセラミック材料から成る基板２と、基板２と同様のセラミック材料から成る側壁３、４２アロイやコバール，リン青銅等の金属から成る蓋体４とから成り、基板２の上面に側壁３を取着させ、その上面に蓋体４を載置して固定させることによって圧電振動子１が構成され、側壁３の内側に位置する基板２の上面に圧電振動素子５が実装されている。 In FIG. 1, a piezoelectric vibrator 1 includes, for example, a substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic, and side walls 3 and 42 made of a ceramic material similar to the substrate 2, such as a metal such as alloy, Kovar, or phosphor bronze. The piezoelectric vibrator 1 is configured by attaching the side wall 3 to the upper surface of the substrate 2 and mounting and fixing the lid body 4 on the upper surface of the substrate 2, and is located inside the side wall 3. A piezoelectric vibration element 5 is mounted on the upper surface of the substrate 2.

また、図１及び図２において集積回路素子７を収容する凹部１５を有する容器体１０の切欠部９は、側壁部１３の頂面から凹部１５の底面の位置まで側壁部の厚み全体にわたり切り欠かれている。この切欠部９の底面にはチップ型コンデンサ８が搭載されており、集積回路素子７の所定の電子回路網と電気的に接続している。 1 and 2, the notch 9 of the container body 10 having the recess 15 that accommodates the integrated circuit element 7 is notched over the entire thickness of the side wall from the top surface of the side wall 13 to the bottom surface of the recess 15. It has been. A chip-type capacitor 8 is mounted on the bottom surface of the notch 9 and is electrically connected to a predetermined electronic circuit network of the integrated circuit element 7.

前記圧電振動子１は、その内部に、具体的には、基板２の上面と側壁３の内面と蓋体４の下面とで囲まれる空間部内に圧電振動素子５を収容して気密封止されており、基板２の上面には圧電振動素子５の振動電極に接続される一対の素子接続用電極パッド等が、基板２の下面には、後述する容器体１０の側壁部１３頂面に形成されている振動子接続用電極端子１８に接続される複数個の容器体接続用電極端子１７がそれぞれ設けられ、これらのパッドや端子は基板２表面に形成した配線パターンや基板２内部に埋設されているビアホール等を介して、接続対応するもの間を相互に電気的に接続されている。 The piezoelectric vibrator 1 is hermetically sealed by housing the piezoelectric vibration element 5 inside the space, specifically, a space surrounded by the upper surface of the substrate 2, the inner surface of the side wall 3, and the lower surface of the lid body 4. A pair of element connection electrode pads connected to the vibration electrode of the piezoelectric vibration element 5 are formed on the upper surface of the substrate 2, and formed on the top surface of the side wall 13 of the container body 10 to be described later on the lower surface of the substrate 2. A plurality of container connection electrode terminals 17 connected to the vibrator connection electrode terminals 18 are provided, and these pads and terminals are embedded in the wiring pattern formed on the surface of the substrate 2 or inside the substrate 2. The corresponding parts are electrically connected to each other through via holes or the like.

一方、圧電振動子１の内部に収容される圧電振動素子５は、例えば圧電振動素子の一つである水晶振動素子の場合では、人工水晶結晶体の結晶軸から所定の角度でカットした水晶素板の両主面に一対の振動用電極を被着・形成して成り、外部からの変動電圧が一対の振動用電極を介して水晶片に印加されると、カット角度で既定された振動モードによる振動を起こす。 On the other hand, the piezoelectric vibrating element 5 housed in the piezoelectric vibrator 1 is a quartz crystal element cut at a predetermined angle from the crystal axis of the artificial quartz crystal in the case of a quartz vibrating element that is one of piezoelectric vibrating elements, for example. A vibration mode defined by the cut angle when a pair of vibration electrodes are attached to and formed on both main surfaces of the plate, and when an external variable voltage is applied to the crystal piece via the pair of vibration electrodes. Causes vibration.

そして、上述した圧電振動子１が取着される集積回路素子７を収容する凹部１５を有する容器体１０は概略矩形状を成しており、ガラス布基材エポキシ樹脂やポリカーボネイト，エポキシ樹脂，ポリイミド樹脂等の樹脂材料やガラス−セラミック，アルミナセラミックス等のセラミック材料等によって平板状を成すように形成されている。 A container body 10 having a recess 15 for accommodating the integrated circuit element 7 to which the piezoelectric vibrator 1 is attached has a substantially rectangular shape, and is made of glass cloth base epoxy resin, polycarbonate, epoxy resin, polyimide. It is formed so as to form a flat plate by a resin material such as a resin or a ceramic material such as glass-ceramic or alumina ceramic.

前記集積回路素子７を収容する凹部１５を有する容器体１０は、容器体１０外底面の四隅部に４つの外部接続電極端子１６（電源電圧端子、グランド端子、発振出力端子、発振制御端子）が形成され、凹部１５を囲繞する形態で側壁部１３が、又凹部１５内底面の中央域にはフリップチップ型の集積回路素子７が、更に側壁部１３の長さ方向外側側面には書込制御端子１１が設けられている。 The container body 10 having the recess 15 for accommodating the integrated circuit element 7 has four external connection electrode terminals 16 (power supply voltage terminal, ground terminal, oscillation output terminal, oscillation control terminal) at the four corners of the outer bottom surface of the container body 10. The side wall portion 13 is formed so as to surround the concave portion 15, the flip-chip type integrated circuit element 7 is provided in the central region of the inner bottom surface of the concave portion 15, and the side wall portion 13 is further controlled in writing on the side surface in the longitudinal direction. A terminal 11 is provided.

また、集積回路素子７を収容する凹部１５を有する容器体１０の外底面に設けられている４つの外部接続電極端子１６は、圧電発振器をマザーボード等の外部回路基板に接続するための端子として機能するものであり、圧電発振器を外部回路基板上に搭載する際、外部配線基板の回路配線と半田等の導電性接合材を介して電気的に接続されるように成っている。 In addition, the four external connection electrode terminals 16 provided on the outer bottom surface of the container body 10 having the recesses 15 for accommodating the integrated circuit elements 7 function as terminals for connecting the piezoelectric oscillator to an external circuit board such as a mother board. Therefore, when the piezoelectric oscillator is mounted on the external circuit board, it is electrically connected to the circuit wiring of the external wiring board via a conductive bonding material such as solder.

更に、側壁部１３は、集積回路素子７を収容する凹部１５を有する容器体１０と圧電振動子１との間に、集積回路素子７やチップ型コンデンサ８を配置させるのに必要な所定の間隔を確保しつつ、集積回路素子７を収容する凹部１５を有する容器体１０の素子接続用電極端子１８を圧電振動子１の容器体接続用電極端子１７に接続する機能も有する。 Further, the side wall portion 13 has a predetermined interval required for disposing the integrated circuit element 7 and the chip capacitor 8 between the container body 10 having the recess 15 for accommodating the integrated circuit element 7 and the piezoelectric vibrator 1. The element connection electrode terminal 18 of the container body 10 having the recess 15 that accommodates the integrated circuit element 7 is connected to the container body connection electrode terminal 17 of the piezoelectric vibrator 1.

凹部１５内底面の中央域には、複数個の集積回路素子接続用電極パッド（図示しない）が設けられており、これら集積回路素子接続用電極パッドに集積回路素子７側の電極端子を、Ａｕバンプ、半田又は異方性導電接着材等の導電性接合材を介して電気的且つ機械的に接続させることによって集積回路素子７が凹部１５内の所定位置に取着される。 A plurality of integrated circuit element connection electrode pads (not shown) are provided in the central area of the bottom surface of the recess 15, and the electrode terminals on the integrated circuit element 7 side are connected to these integrated circuit element connection electrode pads as Au. The integrated circuit element 7 is attached to a predetermined position in the recess 15 by being electrically and mechanically connected through a conductive bonding material such as a bump, solder, or anisotropic conductive adhesive.

上記集積回路素子７は、その回路形成面（下面）に、周囲の温度状態を検知する感温素子、圧電振動素子５の温度特性を補償する温度補償データを格納するメモリ、メモリ内の温度補償データに基づいて圧電振動素子５の振動特性を温度変化に応じて補正する温度補償回路、先の温度補償回路に接続されて所定の発振出力を生成する発振回路等が設けられており、この発振回路で生成された発振出力は、外部に出力された後、例えば、クロック信号等の基準信号として利用される。 The integrated circuit element 7 has, on its circuit formation surface (lower surface), a temperature sensing element for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristics of the piezoelectric vibration element 5, and temperature compensation in the memory. A temperature compensation circuit that corrects the vibration characteristics of the piezoelectric vibration element 5 according to temperature changes based on the data, an oscillation circuit that is connected to the previous temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the circuit is output to the outside and then used as a reference signal such as a clock signal.

尚、上述した集積回路素子７と凹部１５底面との間には従来の圧電発振器では必要であったエポキシ樹脂等から成る熱硬化性樹脂（一般的にアンダーフィルと呼称されるもの）は介在されておらず、これにより、圧電発振器の製造工程および工数削減が可能となっている。 Note that a thermosetting resin (generally referred to as an underfill) made of epoxy resin or the like necessary for a conventional piezoelectric oscillator is interposed between the integrated circuit element 7 and the bottom surface of the recess 15 described above. Thus, the manufacturing process and man-hours of the piezoelectric oscillator can be reduced.

ここで、本発明の一特徴部分は図１及び図２に示すように、チップ型コンデンサ８が搭載されているコンデンサ搭載空間のうち側壁部１３を切り欠いた部分（切欠部９）に、切り欠かれた両端の側壁部１３間を横断連絡する形態の絶縁性樹脂による障壁部６が形成されていることである。この障壁部６は一部チップ型コンデンサ８に掛かる形態で形成されている。又、障壁部６の高さは、障壁部６の頂面が、障壁部６を挟む側壁部１３の頂面と概略同一平面となるようにするのが望ましいが、後述する効果を奏するのであれば障壁部６の高さは側壁部１３の頂面より低くても構わない。 Here, as shown in FIGS. 1 and 2, one characteristic part of the present invention is that a portion of the capacitor mounting space in which the chip type capacitor 8 is mounted is cut into a portion where the side wall portion 13 is cut out (notched portion 9). That is, the barrier portion 6 is formed of an insulating resin in a form that crosses the side wall portions 13 at both ends. The barrier portion 6 is partially formed on the chip capacitor 8. The height of the barrier portion 6 is preferably set so that the top surface of the barrier portion 6 is substantially flush with the top surface of the side wall portion 13 sandwiching the barrier portion 6, although the effects described below can be achieved. For example, the height of the barrier portion 6 may be lower than the top surface of the side wall portion 13.

この障壁部６により、切欠部９が形成されたことにより空間的に連結してしまった凹部１５空間と外部空間とを遮断できることから、容器体１０外部からの切欠部９を介して凹部１５内にダストや半田屑等のコンタミの侵入を抑えることが可能となる。尚、この障壁部６の構成材料としては、容器体１０を構成する材質と同程度の硬度まで硬化できる樹脂等で形成されている。 The barrier portion 6 can block the recessed space 15 and the external space that are spatially connected due to the formation of the notched portion 9, so that the inside of the recessed portion 15 can be formed through the notched portion 9 from the outside of the container body 10. Intrusion of contaminants such as dust and solder scraps can be suppressed. In addition, as a constituent material of this barrier part 6, it is formed with resin etc. which can be hardened to the same hardness as the material which comprises the container body 10. FIG.

図３は本発明における圧電発振器の他の形態を示した分解斜視図である。図４は、図２に開示の圧電発振器を組み立て後、図２に記載の仮想切断線Ｂ１−Ｂ２で切断した場合の断面図である。
図３及び図４に記載の圧電発振器は、図１及び図２に記載の圧電発振器と比較して凹部１５内空間と外部空間とを隔てる障壁部の形態が異なる以外は、その構造形態及び構成部品は同一である。 FIG. 3 is an exploded perspective view showing another embodiment of the piezoelectric oscillator according to the present invention. 4 is a cross-sectional view when the piezoelectric oscillator disclosed in FIG. 2 is assembled and then cut along a virtual cutting line B1-B2 shown in FIG.
The piezoelectric oscillator shown in FIGS. 3 and 4 has a structural form and configuration except that the form of the barrier portion that separates the internal space of the recess 15 and the external space is different from that of the piezoelectric oscillator shown in FIGS. The parts are the same.

図３及び図４に示すように、切欠部９により形成されたコンデンサ搭載空間のうち、切欠部９の長さ寸法がコンデンサを搭載するコンデンサ接続用電極パッド２０の幅寸法とほぼ同等であり、且つコンデンサ接続用電極パッド２０が切欠部９底面に、コンデンサ接続用電極パッド２０に搭載するチップ型コンデンサ８が切欠部９の長さ方向に対し直角に配置するような形態で、一対のコンデンサ接続用電極パッド２０うちの少なくとも一つが形成されている。このコンデンサ接続用電極パッド２０の上にチップ型コンデンサ８を配置し且つチップ型コンデンサ８と切欠部９両端の側壁部１３端面との間が、チップ型コンデンサ８とコンデンサ接続用電極パッド２０とを導通固着する導電性接合材２１により塞がれている。 As shown in FIGS. 3 and 4, in the capacitor mounting space formed by the notch 9, the length of the notch 9 is substantially equal to the width of the capacitor connection electrode pad 20 on which the capacitor is mounted, In addition, the capacitor connection electrode pad 20 is disposed on the bottom surface of the notch 9 and the chip capacitor 8 mounted on the capacitor connection electrode pad 20 is disposed at right angles to the length direction of the notch 9, so that a pair of capacitor connections At least one of the electrode pads 20 is formed. The chip capacitor 8 is disposed on the capacitor connection electrode pad 20, and the chip capacitor 8 and the capacitor connection electrode pad 20 are connected between the chip capacitor 8 and the end faces of the side walls 13 at both ends of the notch 9. It is blocked by a conductive bonding material 21 that is conductively fixed.

このような形態で形成された接合材２１及びチップ型コンデンサ８は、上記実施例１に開示の障壁部６と同じように、切欠部９が形成されたことにより空間的に連結してしまった凹部１５空間と外部空間とを遮断できることから、容器体１０外部からの切欠部９を介して凹部１５内にダストや半田屑等のコンタミの侵入を抑えることが可能となる。 The bonding material 21 and the chip-type capacitor 8 formed in such a form are spatially connected due to the formation of the notch portion 9 as in the barrier portion 6 disclosed in the first embodiment. Since the recess 15 space and the external space can be shut off, it is possible to suppress the entry of contaminants such as dust and solder scraps into the recess 15 through the notch 9 from the outside of the container body 10.

尚、本発明は上述の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。例えば、圧電発振器の構造として各実施例では、圧電振動素子５を内部に搭載した圧電振動子１と、集積回路素子７等とを内部に搭載する容器体１０とを、分離可能な個別の構造体で形成したものを開示したが、他に圧電振動素子５を搭載する独立空間と集積回路素子等を搭載する独立空間とを、一つの容器体に形成した形態（例えば所謂Ｈ型構造形態がある）の圧電発振器においても、本発明を適用し同効果を奏することは可能である。 In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. For example, in each embodiment as the structure of the piezoelectric oscillator, the piezoelectric vibrator 1 in which the piezoelectric vibration element 5 is mounted and the container body 10 in which the integrated circuit element 7 and the like are mounted can be separated from each other. However, there is disclosed a form in which an independent space for mounting the piezoelectric vibration element 5 and an independent space for mounting an integrated circuit element or the like are formed in a single container body (for example, a so-called H-type structure is provided). The same effect can be obtained by applying the present invention to a piezoelectric oscillator of (some).

図１は、本発明における圧電発振器の一形態を示した分解斜視図である。FIG. 1 is an exploded perspective view showing an embodiment of a piezoelectric oscillator according to the present invention. 図２は、図１に開示の圧電発振器を組み立て後、図１に記載の仮想切断線Ａ１−Ａ２で切断した場合の断面図である。FIG. 2 is a cross-sectional view when the piezoelectric oscillator disclosed in FIG. 1 is assembled and cut along a virtual cutting line A1-A2 illustrated in FIG. 図３は本発明における圧電発振器の他の形態を示した分解斜視図である。FIG. 3 is an exploded perspective view showing another embodiment of the piezoelectric oscillator according to the present invention. 図４は、図３に開示の圧電発振器を組み立て後、図３に記載の仮想切断線Ｂ１−Ｂ２で切断した場合の断面図である。4 is a cross-sectional view when the piezoelectric oscillator disclosed in FIG. 3 is assembled and then cut along a virtual cutting line B1-B2 shown in FIG. 図５は、従来の圧電発振器の概略の斜視図である。FIG. 5 is a schematic perspective view of a conventional piezoelectric oscillator.

符号の説明Explanation of symbols

１・・・圧電振動子
５・・・圧電振動素子
６・・・障壁部
７・・・集積回路素子
８・・・チップ型コンデンサ
９・・・切欠部
１０・・・容器体
１１・・・書込制御端子
１３・・・側壁部
１５・・・凹部（集積回路素子搭載空間）
１６・・・外部接続電極端子
１７・・・容器体接続用電極端子
１８・・・素子接続用電極端子
２０・・・コンデンサ接続用電極パッド
２１・・・接合材 DESCRIPTION OF SYMBOLS 1 ... Piezoelectric vibrator 5 ... Piezoelectric vibration element 6 ... Barrier part 7 ... Integrated circuit element 8 ... Chip type capacitor 9 ... Notch part 10 ... Container body 11 ... Write control terminal 13... Side wall 15... Recess (integrated circuit element mounting space)
DESCRIPTION OF SYMBOLS 16 ... External connection electrode terminal 17 ... Container body connection electrode terminal 18 ... Element connection electrode terminal 20 ... Capacitor connection electrode pad 21 ... Bonding material

Claims

容器体に形成された凹形状の集積回路搭載空間には、少なくとも発振回路が形成内蔵されている集積回路素子が搭載され、且つ該集積回路搭載空間を囲繞する側壁部の一部を切り欠き形成した切欠部を含むコンデンサ搭載空間には、チップ型のコンデンサが搭載されており、該容器体に圧電振動素子を内蔵した圧電振動子を機械的に接続し、且つ該圧電振動素子，該集積回路素子及び該チップ型コンデンサを電気的に接続してなる圧電発振器において、
該コンデンサが搭載されている該コンデンサ搭載空間のうち側壁部を切り欠いた部分に、切り欠かれた両端の側壁部を横断連絡する形態の障壁部が形成されていることを特徴とする圧電発振器。 The concave integrated circuit mounting space formed in the container body is mounted with at least an integrated circuit element in which an oscillation circuit is formed and a part of a side wall portion surrounding the integrated circuit mounting space is cut out. In the capacitor mounting space including the cutout, a chip-type capacitor is mounted, a piezoelectric vibrator having a piezoelectric vibration element built in the container body is mechanically connected, and the piezoelectric vibration element and the integrated circuit are connected. In a piezoelectric oscillator formed by electrically connecting an element and the chip capacitor,
A piezoelectric oscillator characterized in that a barrier portion is formed in a portion where the side wall portion is cut out in the capacitor mounting space in which the capacitor is mounted so as to cross-connect the side wall portions at both ends. .

該障壁部は、該容器体を構成する材質と同等の硬度に硬化できる樹脂により形成されていることを特徴とする請求項１記載の圧電発振器。 2. The piezoelectric oscillator according to claim 1, wherein the barrier portion is formed of a resin that can be cured to a hardness equivalent to that of a material constituting the container body.

容器体に形成された凹形状の集積回路搭載空間には、少なくとも発振回路が形成内蔵されている集積回路素子が搭載され、且つ該集積回路搭載空間を囲繞する側壁部の一部を切り欠き形成した切欠部を含むコンデンサ搭載空間には、チップ型のコンデンサが搭載されており、該容器体に圧電振動素子を内蔵した圧電振動子を機械的に接続し、且つ該圧電振動素子，該集積回路素子及び該チップ型コンデンサを電気的に接続してなる圧電発振器において、
該コンデンサ搭載空間のうち該切欠部の長さ寸法が該コンデンサを搭載するコンデンサ接続用電極パッドの幅寸法とほぼ同等であり、且つ該コンデンサ接続用電極パッドが、該切欠部底面に、該コンデンサ接続用電極パッドに搭載する該コンデンサが該切欠部の長さ方向に対し直角に配置するような形態で、該コンデンサ接続用電極パッドうちの少なくとも一つが形成されており、該コンデンサ接続用電極パッド上にコンデンサを配置し且つ該コンデンサと切欠部両端の側壁部端面との間が該コンデンサとコンデンサ接続用電極パッドとを導通固着する導電性の接合材により塞がれていることを特徴とする圧電発振器。 The concave integrated circuit mounting space formed in the container body is mounted with at least an integrated circuit element in which an oscillation circuit is formed and a part of a side wall portion surrounding the integrated circuit mounting space is cut out. In the capacitor mounting space including the cutout, a chip-type capacitor is mounted, a piezoelectric vibrator having a piezoelectric vibration element built in the container body is mechanically connected, and the piezoelectric vibration element and the integrated circuit are connected. In a piezoelectric oscillator formed by electrically connecting an element and the chip capacitor,
The length dimension of the notch portion in the capacitor mounting space is substantially equal to the width dimension of the capacitor connecting electrode pad on which the capacitor is mounted, and the capacitor connecting electrode pad is located on the bottom surface of the notch portion. At least one of the capacitor connection electrode pads is formed such that the capacitor mounted on the connection electrode pad is disposed at right angles to the length direction of the notch, and the capacitor connection electrode pad is formed. A capacitor is disposed on the capacitor, and a gap between the capacitor and the side wall end faces of both ends of the notch is blocked by a conductive bonding material that conductively fixes the capacitor and the capacitor connection electrode pad. Piezoelectric oscillator.

該接合材が導電性接着剤であることを特徴とする請求項３記載の圧電発振器。 4. The piezoelectric oscillator according to claim 3, wherein the bonding material is a conductive adhesive.