JP2008196028A - Base material treating apparatus - Google Patents

Base material treating apparatus Download PDF

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JP2008196028A
JP2008196028A JP2007034354A JP2007034354A JP2008196028A JP 2008196028 A JP2008196028 A JP 2008196028A JP 2007034354 A JP2007034354 A JP 2007034354A JP 2007034354 A JP2007034354 A JP 2007034354A JP 2008196028 A JP2008196028 A JP 2008196028A
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base material
rotating roller
opening
plating
tank
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JP4894547B2 (en
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Naoki Kato
直樹 加藤
Kazuaki Senbokuya
和明 仙北屋
Takuma Katase
琢磨 片瀬
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a base material treating apparatus provided with a seal mechanism for suppressing the flow-out of a treating liquid from an opening formed in a treating vessel without holding the base material by a seal roller. <P>SOLUTION: A long opening 10 through which the base material (w) transported toward the vertical direction is passed is formed in the opposing lateral surfaces 1b of a treating vessel 1 and the seal mechanism 2 around each opening is provided in the base material treating apparatus. As the seal mechanism, a pair of rotary rollers 20 arranged to be freely rotatable around the axial line turned toward the vertical direction and a rotation driving means for the rotary roller are provided. The rotary roller has a length ranging from the under side of the liquid level up to the lower end part of the opening, is arranged at a position ≥0.1 mm and ≤2.5 mm away from the base material and is driven by the rotation driving means so that the opposed part of the outer peripheral surface to the base material side rotates in the same direction as the base material while synchronizing the peripheral speed of the outer peripheral surface of the rotary roller with the transportation speed of the base material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、帯状の被処理用の基材にメッキ液等の処理液によってメッキ処理等の湿式処理を施し、フレキシブル基板等を製造する基材処理装置に関するものである。   The present invention relates to a base material processing apparatus for manufacturing a flexible substrate or the like by performing wet processing such as plating processing on a strip-shaped base material to be processed with a processing solution such as a plating solution.

このフレキシブル基板の一例として、例えば、携帯電話やディスプレイ等のプリント配線板として利用される銅積層ポリイミドフィルム等がある。この銅積層ポリイミドフィルムは、一般的に、厚さ数十μｍのポリイミドフィルムの片面又は両面に、順次、ニッケルクロム合金のスパッタ層と、この合金スパッタ層の上に銅スパッタ層とが形成された帯状の被処理用の基材に、銅メッキ処理が施されることによって構成されている。   As an example of this flexible substrate, there is, for example, a copper laminated polyimide film used as a printed wiring board for a mobile phone or a display. In general, this copper laminated polyimide film has a nickel chromium alloy sputter layer and a copper sputter layer formed on the alloy sputter layer sequentially on one or both sides of a polyimide film having a thickness of several tens of μm. The belt-shaped substrate for processing is configured by performing copper plating.

そして、この銅メッキ処理は、基材を硫酸銅等のメッキ液が充填されたメッキ槽に供給し、メッキ槽の外部に配設された電極によって合金スパッタ層と銅スパッタ層とからなるスパッタ層が通電され、銅スパッタ層の上に、メッキ層を形成することにより行われる。その際、基材は、スパッタ層の膜厚が著しく薄いため、スパッタ層を流れる電流量に上限があり、１槽のメッキ槽によるメッキ処理では、銅スパッタ層上に薄いメッキ層しか形成されない。   And this copper plating process supplies a base material to the plating tank filled with plating solutions, such as copper sulfate, and the sputter layer which consists of an alloy sputter layer and a copper sputter layer with the electrode arrange | positioned outside the plating tank Is carried out by forming a plating layer on the copper sputter layer. In that case, since the film thickness of the sputter layer is extremely thin, there is an upper limit on the amount of current flowing through the sputter layer, and only a thin plating layer is formed on the copper sputter layer in the plating process by one plating tank.

このため、銅積層ポリイミドフィルムの製造装置は、一般に、製造ラインに沿って複数のメッキ槽が配設されており、各メッキ槽は、対向側面にそれぞれ基板を通過させる細長状の開口が上下方向に向けて形成されている。   For this reason, the copper laminated polyimide film manufacturing apparatus is generally provided with a plurality of plating tanks along the manufacturing line, and each plating tank has an elongated opening through which the substrate passes on the opposite side surface in the vertical direction. It is formed towards.

一方、基材は、その帯幅方向が上下方向に向けて配設され、順次、各メッキ槽に形成された開口を通じて、各メッキ槽内に供給されるとともに、各メッキ槽外に排出され、製造ラインに沿って搬送される。そして基材は、１槽目のメッキ槽において薄いメッキ層が形成されると、２槽目のメッキ槽においてスパッタ層と銅メッキ層の肉厚分だけ電流量が流れるため、１槽目のメッキ層よりも膜厚のメッキ層が形成され、同様に、３槽目、４槽目と段階的に膜厚のメッキ層が形成され、最終的に薄いスパッタ層上に漸次、膜厚の銅メッキ層が形成され、所望の厚みの銅メッキ層が形成された銅積層ポリイミドフィルムとなる。   On the other hand, the base material is disposed in the vertical direction in the band width direction, and is sequentially supplied into each plating tank through an opening formed in each plating tank, and is discharged out of each plating tank. It is transported along the production line. And when a thin plating layer is formed in the first plating tank, the substrate flows in the second plating tank because the amount of current flows by the thickness of the sputter layer and the copper plating layer. A plating layer having a thickness larger than that of the first layer is formed, and similarly, a plating layer having a film thickness is formed step by step in the third and fourth tanks, and finally, copper plating having a thickness is gradually formed on the thin sputter layer. A layer is formed, and a copper laminated polyimide film in which a copper plating layer having a desired thickness is formed.

ところで、この銅積層ポリイミドフィルムの製造装置は、上述のように、メッキ槽の対向側面に一対の開口が形成され、この開口を通じて基材が搬送されるため、そのままでは基材とともに開口から硫酸銅等のメッキ液が流出してしまう。
このため、各メッキ槽は、それぞれ上記開口の周囲に、上記メッキ液の流出を抑制するシール機構を設けて、製造ラインに沿って配設される必要があり、このシール機構としては、一般的に、特許文献１に示すように、上記開口の周囲において基材を挟持する一対のシールローラを備えたものが知られている。
この一対のシールローラは、上記開口を封じるように配設することによって、基材を挟持しつつ上記メッキ液の流出を抑制することができる。 By the way, this copper laminated polyimide film manufacturing apparatus, as described above, has a pair of openings formed on the opposite side surfaces of the plating tank, and the base material is conveyed through these openings. The plating solution such as spills out.
For this reason, each plating tank needs to be provided along the production line by providing a sealing mechanism that suppresses the outflow of the plating solution around the opening. In addition, as shown in Patent Document 1, there is known one provided with a pair of seal rollers that sandwich a base material around the opening.
By arranging the pair of seal rollers so as to seal the opening, it is possible to suppress the outflow of the plating solution while sandwiching the base material.

しかしながら、このシールローラは、上記開口からのメッキ液の流出を抑制するために基材に強く密着させており、これによって、当該ローラに異物が付着している場合、この異物を基材に転写してしまう恐れがある。一方、基材は、繰り返し、メッキ槽に供給されるために、銅スパッタ層又はメッキ層上に異物が転写される確率が高くなり、異物が転写されると、その転写された異物上にメッキ処理が施されてしまう。このため、基板には、異物上にメッキ層が形成されることによって突起が形成され、又は異物上にメッキ層が付着しないことによって凹部が形成されてしまう。   However, this seal roller is in close contact with the base material in order to suppress the outflow of the plating solution from the opening, and when the foreign matter adheres to the roller, the foreign matter is transferred to the base material. There is a risk of doing. On the other hand, since the base material is repeatedly supplied to the plating tank, the probability that foreign matter is transferred onto the copper sputtered layer or the plating layer increases, and when the foreign matter is transferred, plating is performed on the transferred foreign matter. Processing will be performed. For this reason, protrusions are formed on the substrate by forming the plating layer on the foreign matter, or concave portions are formed by not attaching the plating layer on the foreign matter.

加えて、シールローラは、その回転速度が基材の搬送速度と一致していない場合に、基材の表面を擦りつけて、基材の表面に擦り傷を形成してしまうことがある。すると、基材には、繰り返しのメッキ処理によって、この擦り傷上に所望の膜厚のメッキ層が形成されずに凹部が形成され、又はメッキ層の下に擦り傷が残存してしまう。
このようにして、シールローラは、銅メッキ層の欠陥発生原因となっていた。 In addition, when the rotational speed of the seal roller does not coincide with the conveyance speed of the substrate, the surface of the substrate may be rubbed to form a scratch on the surface of the substrate. As a result, a repeated plating treatment does not form a plating layer having a desired film thickness on the scratches, but a recess is formed on the substrate, or scratches remain below the plating layer.
In this way, the seal roller has caused a defect in the copper plating layer.

特開２００３−１４７５８２号公報JP 2003-147582 A

本発明は、かかる事情に鑑みてなされたもので、シールローラによって基材を挟持することなく、メッキ槽等の処理槽に形成された開口からのメッキ液等の処理液の流出を抑制できるシール機構を備えた基材処理装置を提供することを課題とするものである。   The present invention has been made in view of such circumstances, and a seal capable of suppressing the outflow of a processing solution such as a plating solution from an opening formed in a processing bath such as a plating bath without sandwiching a base material by a seal roller. It is an object of the present invention to provide a substrate processing apparatus provided with a mechanism.

本発明者らは、シールローラによって基材に付着する異物がメッキ液中に浮遊するメッキ処理用のアノード電極から発生するスライムであり、シールローラの材質を変更してもシールローラによる基材への異物の転写を防ぐことができないことを見出し、本発明を完成させたものである。   The present inventors are slimes generated from the anode electrode for the plating process in which foreign matter adhering to the base material by the seal roller floats in the plating solution, and even if the material of the seal roller is changed, the base material by the seal roller is used. The present invention has been completed by finding out that the transfer of foreign matter cannot be prevented.

すなわち、請求項１に記載の発明に係る基材処理装置は、内部に処理液が収容された処理槽を有し、上記処理槽の対向側面に、それぞれ帯幅方向を上下方向に向けた状態で搬送される帯状の基材を通過させる細長状の開口が形成され、上記開口の周囲にそれぞれ上記処理液の流出を抑制するシール機構が備えられた基材処理装置であって、上記シール機構は、上記基材の両側方に軸線方向を上下方向に向けて回転自在に配設された一対の回転ローラと、これら回転ローラの回転駆動手段とを備えており、上記回転ローラは、少なくとも上記開口の液面下から当該開口の下端部に至る長さ寸法を有し、かつその外周面が上記基材との間に０．１ｍｍ以上であって２．５ｍｍ以下の間隔を隔てた位置に配設されるとともに、上記回転駆動手段は、上記外周面の周速が上記基材の搬送速度と同期して、上記外周面の上記基材側の対向部が上記基材と同方向に回転するように、上記回転ローラを駆動することを特徴としている。   That is, the substrate processing apparatus according to the first aspect of the present invention has a processing tank in which a processing liquid is accommodated, and the band width direction is directed vertically on the opposite side surfaces of the processing tank. A substrate processing apparatus provided with a sealing mechanism for forming a long and narrow opening through which the belt-shaped substrate conveyed by the substrate passes, and suppressing the outflow of the processing liquid around each of the openings. Comprises a pair of rotating rollers rotatably disposed on both sides of the base material with the axial direction facing the up and down direction, and a rotation driving means for the rotating rollers, and the rotating roller includes at least the above-described rotating rollers. It has a length dimension from below the liquid level of the opening to the lower end of the opening, and its outer peripheral surface is at a position of 0.1 mm or more and 2.5 mm or less from the base material. And the rotational drive means is The rotation roller is driven so that the peripheral speed of the outer peripheral surface is synchronized with the conveyance speed of the base material and the facing portion of the outer peripheral surface on the base material side rotates in the same direction as the base material. It is a feature.

請求項２に記載の発明は、請求項１に記載の基材処理装置において、上記処理槽の外部には、上記対向側面を一側面として上記開口を囲繞し、当該開口から流出した上記処理液を回収する有底筒状の回収槽が設けられており、上記回転ローラは、上記回収槽内に設けられるとともに、それぞれ当該回転ローラの上記基材に対して背面側の外方に設けられた流路形成部材によって回転自在に支持されており、上記流路形成部材は、上記一側面と一体的に設けられるとともに、少なくとも上記回転ローラよりも上下方向に向けて大きく形成されて、上記回転ローラ側の対向面と上記基材との間には、上記開口に連通する上記処理液の狭小の流出路が形成され、かつ上記対向面には、上記回転ローラに対向する位置に凹部が形成されて、この凹部と回転ローラとの間には、最小の路幅が０．０５ｍｍ以上であって０．５ｍｍ以下の幅狭の流路が形成されていることを特徴としている。   According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the processing liquid that surrounds the opening with the opposite side surface as one side surface and flows out from the opening is disposed outside the processing tank. A bottomed cylindrical recovery tank is provided, and the rotating roller is provided in the recovery tank and is provided on the outer side of the back surface of the rotating roller with respect to the base material. The flow path forming member is rotatably supported by the flow path forming member, and the flow path forming member is provided integrally with the one side surface and is formed to be at least larger in the vertical direction than the rotary roller, and the rotary roller A narrow outflow passage for the processing liquid communicating with the opening is formed between the opposite facing surface and the base material, and a recess is formed on the facing surface at a position facing the rotating roller. And this recess Rolling between the rollers, the minimum road width is characterized in that the flow path of the following narrow a is 0.05mm or 0.5mm are formed.

請求項１又は２に記載の発明によれば、基材の両側方に、少なくとも開口の液面下から開口の下端部に至る長さ寸法を有する回転ローラを、基材との間に０．１ｍｍ以上であって２．５ｍｍ以下の間隔を保つようにして配設したため、処理槽の開口から基材の両面に沿っての処理液の流出を充分に抑制できるとともに、回転ローラによる基材表面への異物の転写を防止することができる。
加えて、回転駆動手段によって、回転ローラを、外周面の周速が基材の搬送速度と同期して、基材側の対向部が基材と同方向に回転するように駆動させるため、万が一、回転ローラが基材に接触して、基材に点状の傷が形成されることがあっても、基材表面を擦ってしまうことにより、基材に線状の擦り傷が形成されることを阻止でき、基材やメッキ層に製品化に際して問題となる欠陥が生じることを防止できる。 According to the first or second aspect of the present invention, a rotating roller having a length dimension extending at least from the lower surface of the opening to the lower end of the opening is provided between the substrate and the both sides of the substrate. Since it was arranged so as to maintain an interval of 1 mm or more and 2.5 mm or less, the outflow of the processing liquid along both surfaces of the base material from the opening of the processing tank can be sufficiently suppressed, and the base material surface by the rotating roller It is possible to prevent the transfer of foreign matter to the surface.
In addition, the rotation driving means drives the rotating roller so that the peripheral speed of the outer peripheral surface is synchronized with the transport speed of the base material so that the facing portion on the base material side rotates in the same direction as the base material. Even if the rotating roller comes into contact with the base material and dot-like scratches may be formed on the base material, linear scratches may be formed on the base material by rubbing the surface of the base material. It is possible to prevent the occurrence of defects that cause problems in the production of the substrate and the plating layer.

特に、請求項２に記載の発明によれば、回転ローラを回転自在に支持する流路形成部材を、一側面と一体的に設けるとともに、少なくとも上記回転ローラよりも上下方向に向けて大きく形成して、流路形成部材の回転ローラ側の対向面と基材との間に開口に連通する狭小の流出路を形成したため、この流出路に滞留する処理液の液圧によって上流側の処理液を処理槽側に押圧することができ、処理液の流出量を減少させることができる。   In particular, according to the second aspect of the present invention, the flow path forming member that rotatably supports the rotating roller is provided integrally with one side surface, and at least larger than the rotating roller in the vertical direction. Thus, a narrow outflow passage communicating with the opening is formed between the opposite surface of the flow path forming member on the rotating roller side and the base material, so that the upstream processing liquid is discharged by the liquid pressure of the processing liquid staying in the outflow path. The pressure can be pushed to the treatment tank side, and the outflow amount of the treatment liquid can be reduced.

加えて、この流路形成部材における回転ローラに対向する位置に凹部を形成することによって、この凹部と回転ローラとの間に形成される狭小の流路の最小の路幅を０．５ｍｍ以下としたため、回転ローラの基材ｗに対して背面側の離間部が処理槽側に向けて回転することによって流路内の処理液を処理槽側に向けて流動させることができ、処理液の流出を抑制することができる。
他方、この流路の最小の路幅を０．０５ｍｍ以上としたため、回転ローラの回転の自由度を確保することができ、確実に回転ローラを基材と同期させて回転させることができる。 In addition, by forming a recess at a position facing the rotating roller in the channel forming member, the minimum path width of the narrow channel formed between the recess and the rotating roller is 0.5 mm or less. Therefore, the processing liquid in the flow path can be made to flow toward the processing tank side by rotating the separation portion on the back side with respect to the base material w of the rotating roller toward the processing tank side, and the outflow of the processing liquid Can be suppressed.
On the other hand, since the minimum path width of the flow path is set to 0.05 mm or more, the degree of freedom of rotation of the rotating roller can be ensured, and the rotating roller can be reliably rotated in synchronization with the base material.

以下、本発明に係るメッキ装置について、図１ないし図５を用いて説明する。   Hereinafter, a plating apparatus according to the present invention will be described with reference to FIGS.

本実施形態のメッキ装置は、内部に硫酸銅のメッキ液が充填されるメッキ槽（処理槽）１を有しており、このメッキ槽１は基体１９によって床上に支持されている。   The plating apparatus of this embodiment has a plating tank (treatment tank) 1 in which a copper sulfate plating solution is filled, and this plating tank 1 is supported on a floor by a base 19.

メッキ槽１は、上部が大気中に開放された平面視長方形状に構成されており、長手方向に沿って配設された１対の側壁１ａと長手方向の両端部に配設された１対の端部側壁（対向側面）１ｂと底部とによって構成されている。そして、端部側壁１ｂには、それぞれ側壁１ａ間の中央部に帯状の基材ｗを通過させる細長矩形状のスリット（開口）１０が互いに対向して垂直に形成されている。これらのスリット１０は、それぞれスリット幅が基材ｗの厚みよりも大きく形成されるとともに、基材ｗの接触防止及びメッキ液の流出防止の観点から、その全長が基材ｗの垂直方向の全長よりも長く形成されて、その上端及び下端がそれぞれ基材ｗの上端及び下端との間に、１０ｍｍ以下、より好ましくは５ｍｍ以下の隙間を有するように形成されている。   The plating tank 1 has a rectangular shape in plan view with an upper part opened to the atmosphere, and a pair of side walls 1a disposed along the longitudinal direction and a pair disposed at both ends in the longitudinal direction. It is comprised by the edge part side wall (opposite side surface) 1b and the bottom part. In the end side wall 1b, elongated rectangular slits (openings) 10 through which the band-like base material w passes are formed perpendicularly to each other at the center between the side walls 1a. These slits 10 are each formed with a slit width larger than the thickness of the base material w, and the total length in the vertical direction of the base material w from the viewpoint of preventing contact of the base material w and preventing outflow of the plating solution. The upper end and the lower end are formed so as to have a gap of 10 mm or less, more preferably 5 mm or less, between the upper end and the lower end of the substrate w, respectively.

ここで、基材ｗは、厚さ数十μｍの帯状のポリイミドフィルムの片面全体にニッケルクロム合金のスパッタ層が形成され、この合金スパッタ層上に銅スパッタ層が形成された状態で、帯幅方向が垂直方向に向けて配設されている。そして、基材ｗは、スリット１０を通過して、メッキ槽１内に供給されるとともに、メッキ装置の上流側及び下流側の外部にそれぞれ配設された電極（図示を略す）によって、上記合金スパッタ層及び上記銅スパッタ層がメッキ装置内において通電されている。   Here, the substrate w has a band width in a state in which a sputter layer of a nickel chrome alloy is formed on one surface of a strip-shaped polyimide film having a thickness of several tens of μm, and a copper sputter layer is formed on the alloy sputter layer. The direction is arranged in the vertical direction. The base material w passes through the slit 10 and is supplied into the plating tank 1, and the above alloy is provided by electrodes (not shown) disposed on the upstream side and the downstream side of the plating apparatus. The sputter layer and the copper sputter layer are energized in the plating apparatus.

また、側壁１ａの上部には、基材ｗの上端よりも上方位置において、長手方向に沿ってメッキ槽１内の液面高さを一定に保持するためのスリット１１１が形成され、このスリット１１１から流出するメッキ液を一時的に貯留するオーバーフロー槽１１２が一体的に設けられている。このオーバーフロー槽１１２は、底板に接続された排出管１１３によって、スリット１１１から流出したメッキ液をメッキ槽１の下方に配設された循環液貯留槽３に排出するようになっている。   In addition, a slit 111 is formed in the upper portion of the side wall 1a so as to keep the liquid level in the plating tank 1 constant along the longitudinal direction at a position above the upper end of the base material w. An overflow tank 112 for temporarily storing the plating solution flowing out from the tank is integrally provided. The overflow tank 112 is configured to discharge the plating solution flowing out from the slit 111 to the circulating solution storage tank 3 disposed below the plating tank 1 by a discharge pipe 113 connected to the bottom plate.

メッキ槽１の底部は、側壁１ａ間の中央部が最深部となるように、漸次、幅方向の両端部から上記中央部に向けて下方に位置するように傾斜して形成されており、メッキ槽１の上記最深部には、長手方向に沿ってメッキ液を流動させるディフューザー１３が配設されている。   The bottom of the plating tank 1 is formed so as to be gradually inclined from the both end portions in the width direction toward the center portion so that the center portion between the side walls 1a becomes the deepest portion. A diffuser 13 for flowing the plating solution along the longitudinal direction is disposed at the deepest portion of the tank 1.

このディフューザー１３は、円筒状に形成され、内部に、配設方向に沿ってエアーを噴出させるパイプ１３ａが配設されるとともに、循環液貯留槽３内のメッキ液が配管及びポンプ等を備えた送液手段（図示を略す）によって供給されるようになっており、外周壁面に多数の穴が形成されている。   The diffuser 13 is formed in a cylindrical shape, and a pipe 13a for ejecting air along the arrangement direction is disposed therein, and the plating liquid in the circulating liquid storage tank 3 includes a pipe and a pump. It is supplied by liquid feeding means (not shown), and a large number of holes are formed in the outer peripheral wall surface.

さらに、両端部側壁１ｂには、それぞれ端部側壁１ｂを一側面として、スリット１０を囲繞し、スリット１０から流出したメッキ液を回収する有底筒状の回収槽２２が一体に形成されている。そして、これらの回収槽２２は、それぞれ端部側壁１ｂに対向する壁面２７に、基材ｗを通過させる細長状のスリット２７ａが垂直に形成されるとともに、内部にシール機構２が設けられている。   Further, the both end side walls 1b are integrally formed with a bottomed cylindrical collection tank 22 that surrounds the slit 10 with the end side wall 1b as one side surface and collects the plating solution flowing out of the slit 10. . These recovery tanks 22 are each provided with an elongated slit 27a that allows the base material w to pass vertically on the wall surface 27 that faces the end side wall 1b, and the sealing mechanism 2 is provided therein. .

このシール機構２は、基材ｗの両側方に軸線方向を上下方向に向けて配設された円柱状の１対の回転ローラ２０と、これら回転ローラ２０を回転自在に支持する流路形成部材２１と、これら回転ローラ２０の回転駆動手段４とによって概略構成されている。   The sealing mechanism 2 includes a pair of cylindrical rotating rollers 20 disposed on both sides of the base material w with the axial direction facing the vertical direction, and a flow path forming member that rotatably supports the rotating rollers 20. 21 and the rotational driving means 4 of the rotating roller 20 are schematically configured.

この回転ローラ２０は、少なくともスリット１０の液面下からスリット１０の下端部に至る長さ寸法を有し、かつ外周面と基材ｗとの間に０．１ｍｍ以上であって２．５ｍｍ以下、より好ましくは０．２ｍｍ以上であって１．５ｍｍ以下の微少の間隔Ｌ１を保つようにして配設されて、その外周面の基材ｗ側の対向部が基材ｗと同方向に回転するようになっている。
これは、間隔Ｌ１が０．１ｍｍ未満であると、基材ｗが回転ローラ２０に接触する可能性が高くなるとともに、間隔Ｌ１が２．５ｍｍを超えると、基材ｗと回転ローラ２０との間から流出するメッキ液量が著しく増大するためである。 The rotating roller 20 has at least a length dimension from the bottom of the liquid surface of the slit 10 to the lower end portion of the slit 10, and is 0.1 mm or more and 2.5 mm or less between the outer peripheral surface and the substrate w. More preferably, it is arranged so as to maintain a minute interval L1 of 0.2 mm or more and 1.5 mm or less, and the opposing portion of the outer peripheral surface on the base material w side rotates in the same direction as the base material w. It is supposed to be.
This is because when the distance L1 is less than 0.1 mm, the possibility that the base material w comes into contact with the rotating roller 20 increases. When the distance L1 exceeds 2.5 mm, the distance between the base material w and the rotating roller 20 increases. This is because the amount of plating solution flowing out from the gap increases remarkably.

また、回転ローラ２０は、基材ｗの接触による基材ｗの傷の形成を抑制すべく、少なくとも外周面がテフロン（登録商標）等の撥水性素材によって形成されている。さらに、回転ローラ２０は、その上下端部に回転軸２０ａが一体に設けられるとともに、この回転軸２０ａにブッシュ４４が嵌合されており、このブッシュ４４は、スラスト軸受け及びラジアル軸受けとして作用する。   The rotating roller 20 has at least an outer peripheral surface formed of a water-repellent material such as Teflon (registered trademark) in order to suppress the formation of scratches on the substrate w due to contact with the substrate w. Further, the rotary roller 20 is integrally provided with a rotary shaft 20a at the upper and lower ends thereof, and a bush 44 is fitted to the rotary shaft 20a, and the bush 44 acts as a thrust bearing and a radial bearing.

流路形成部材２１は、表面が端部側壁１ｂに接触している平板状の固定部２１０と、この固定部２１０の基材ｗ側の内方端部よりメッキ槽１から離間する方向に形成されて、回転ローラ２０の基材ｗに対して背面側の外方に設けられた流路形成部２１１とが一体に形成されている。   The flow path forming member 21 is formed in a direction away from the plating tank 1 from a flat plate-like fixing portion 210 whose surface is in contact with the end side wall 1b and an inner end portion of the fixing portion 210 on the base material w side. Thus, the flow path forming portion 211 provided on the outer side of the back surface with respect to the base material w of the rotating roller 20 is integrally formed.

固定部２１０は、それぞれ基材ｗの背面側の外方端部が複数のボルトナット等の固定部材２１４によって端部側壁１ｂに固定されており、これによって、流路形成部材２１は、端部側壁１ｂと一体的に設けられている。
また、流路形成部２１１は、少なくとも回転ローラ２０よりも上下方向に向けて大きく形成されており、この流路形成部２１１の回転ローラ２０側の対向面２１２と基材ｗとの間には、スリット１０に連通するメッキ液の狭小の流出路２４が形成されている。さらに、対向面２１２には、回転ローラ２０の外周に沿って略半円弧状に形成された凹部２１３を有しており、この凹部２１３と回転ローラ２０との間には、幅狭の流路２６が形成されている。そして、この流路２６は、その全長に亘って０．０５ｍｍ以上であって０．５ｍｍ以下、より好ましくは０．１ｍｍ以上であって０．３ｍｍ以下の略同一の路幅Ｌ２を有している。 Each of the fixed portions 210 has an outer end portion on the back side of the base material w fixed to the end side wall 1b by a plurality of fixing members 214 such as bolts and nuts. It is provided integrally with the side wall 1b.
Further, the flow path forming portion 211 is formed to be at least larger in the vertical direction than the rotating roller 20, and between the facing surface 212 on the rotating roller 20 side of the flow path forming portion 211 and the base material w. A narrow outflow passage 24 for the plating solution communicating with the slit 10 is formed. Further, the facing surface 212 has a recess 213 formed in a substantially semicircular arc shape along the outer periphery of the rotating roller 20, and a narrow flow path is provided between the recess 213 and the rotating roller 20. 26 is formed. The flow path 26 has substantially the same road width L2 of 0.05 mm or more and 0.5 mm or less, more preferably 0.1 mm or more and 0.3 mm or less over its entire length. Yes.

これは、路幅Ｌ２が０．０５ｍｍ未満であると、回転ローラ２０の回転の自由度を確実に確保することができないためであり、路幅Ｌ２が０．５ｍｍを超えると、回転ローラ２０の回転によって、すなわち、回転ローラ２０の基材ｗに対して背面側の離間部がメッキ槽１側に回転することによって、流路２６に滞留するメッキ液をメッキ槽１側に向けて流動させることができず、メッキ液の流出量が増大するためである。   This is because if the road width L2 is less than 0.05 mm, the degree of freedom of rotation of the rotary roller 20 cannot be ensured. If the road width L2 exceeds 0.5 mm, the rotation roller 20 By rotating, i.e., the separation portion on the back side with respect to the base material w of the rotating roller 20 rotates toward the plating tank 1, the plating solution staying in the flow path 26 is caused to flow toward the plating tank 1 side. This is because the amount of the plating solution flowing out increases.

さらに、流路形成部２１１は、その上下端部に、それぞれブッシュ４４及び回転軸２０ａを挿通させる円環状の軸受け部材２１６が固定部材２１５によって一体的に設けられている。
他方、上部の回転軸２０ａは、軸受け部材２１６を貫通しており、その上端部には、水平に配設された略円板状の歯車２０ｂが一体に設けられている。 Furthermore, in the flow path forming portion 211, annular bearing members 216 through which the bush 44 and the rotating shaft 20a are inserted are integrally provided at the upper and lower end portions thereof by a fixing member 215, respectively.
On the other hand, the upper rotating shaft 20a passes through the bearing member 216, and a substantially disc-shaped gear 20b disposed horizontally is integrally provided at the upper end portion thereof.

上記回転駆動手段４は、この歯車２０ｂに噛合する駆動歯車４０ａと、この駆動歯車４０ａを回転させるモータ４０とが備えられており、このモータ４０によって駆動歯車４０ａを所定回転数で回転させることによって、回転ローラ２０は、外周面の周速が基材ｗの搬送速度と同速度で同期して回転するようになっている。   The rotational driving means 4 includes a driving gear 40a meshing with the gear 20b and a motor 40 for rotating the driving gear 40a. By rotating the driving gear 40a at a predetermined rotational speed by the motor 40, the rotational driving means 4 is provided. The rotation roller 20 is configured such that the peripheral speed of the outer peripheral surface rotates in synchronization with the conveyance speed of the base material w.

次ぎに、上述のメッキ装置の作用について、説明する。
まず、基材ｗは、メッキ装置の上流側及び下流側の外部にそれぞれ配設された電極によって、スパッタ層が通電された状態で、順次、回収槽２２のスリット２７ａを通過し、一対の回転ローラ２０間を移動し、一方の端部側壁１ｂに形成されたスリット１０からメッキ槽１内に搬送される。 Next, the operation of the above plating apparatus will be described.
First, the base material w sequentially passes through the slit 27a of the collection tank 22 in a state in which the sputter layer is energized by the electrodes respectively disposed on the upstream side and the downstream side of the plating apparatus, and a pair of rotations. It moves between the rollers 20 and is conveyed into the plating tank 1 from the slit 10 formed in one end side wall 1b.

その際、基材ｗの両面に沿ってメッキ槽１内のメッキ液がスリット１０から流出するものの、このメッキ液は、狭小の流出路２４において、特に、基材ｗと回転ローラ２０との間隔Ｌ１によって、液圧が高くなるため、上流側のメッキ液をメッキ槽１側に押圧する。従って、メッキ液の流出量が減少するとともに、間隔Ｌ１が設けられているため、回転ローラ２０による基材ｗの表面への異物の転写が防止される。また、回転ローラ２０を基材ｗと同方向かつ同速度で回転させているため、万が一、回転ローラ２０が基材ｗに接触した場合にも、基材ｗの表面を擦って、基材ｗに線状の擦り傷が形成されて、基材ｗやメッキ層に製品化に際して問題となる欠陥が生じることが防止される。   At that time, although the plating solution in the plating tank 1 flows out from the slit 10 along both surfaces of the base material w, the plating solution flows in the narrow outflow path 24, particularly in the interval between the base material w and the rotating roller 20. Since the liquid pressure is increased by L1, the upstream plating solution is pressed against the plating tank 1 side. Accordingly, the amount of plating solution flowing out is reduced and the interval L1 is provided, so that the transfer of foreign matter to the surface of the substrate w by the rotating roller 20 is prevented. In addition, since the rotating roller 20 is rotated in the same direction and at the same speed as the base material w, even if the rotating roller 20 contacts the base material w, the surface of the base material w is rubbed to rub the base material w. It is prevented that a linear scratch is formed on the base material w and a defect which causes a problem in the production of the base material w or the plated layer is prevented.

他方、流出路２４から流出したメッキ液は、排出口２２ａから排出管２５を通じて循環液貯留槽３に排出される。   On the other hand, the plating solution flowing out from the outflow passage 24 is discharged from the discharge port 22a to the circulating liquid storage tank 3 through the discharge pipe 25.

一方、メッキ槽１内に供給された基材ｗは、漸次、メッキ液によってスパッタ層上に銅メッキ層が形成された後、メッキ槽１の他方の端部側壁１ｂに形成されたスリット１０を通過し、一対の回転ローラ２０間を移動し、壁面２７のスリット２７ａから外方へと搬出される。   On the other hand, the base material w supplied into the plating tank 1 gradually forms a slit 10 formed on the other side wall 1b of the plating tank 1 after a copper plating layer is formed on the sputter layer by the plating solution. Passes, moves between the pair of rotating rollers 20, and is carried out from the slit 27a of the wall surface 27 to the outside.

その際、メッキ液は、前述と同様に、スリット１０から基材ｗの両面に沿って流出するものの、流出路２４の液圧によってメッキ槽１内に向けて押圧されて、流出量が減少するとともに、流出路２４から流出したメッキ液は、排出口２２ａから排出管２５を通じて循環液貯留槽３に排出される。   At that time, the plating solution flows out from the slit 10 along both surfaces of the base material w as described above, but is pressed toward the plating tank 1 by the liquid pressure in the outflow passage 24, and the outflow amount is reduced. At the same time, the plating solution flowing out from the outflow passage 24 is discharged from the discharge port 22a to the circulating solution storage tank 3 through the discharge pipe 25.

一方、メッキ槽１内のメッキ液は、スリット１１１から溢れた場合にも、オーバーフロー槽１１２を介して循環液貯留槽３に排出されるとともに、循環液貯留槽３から上記送液手段によってディフューザー１３内に循環供給され、攪拌されるようになっている。   On the other hand, when the plating solution in the plating tank 1 overflows from the slit 111, the plating solution is discharged to the circulating liquid storage tank 3 through the overflow tank 112, and from the circulating liquid storage tank 3 to the diffuser 13 by the liquid feeding means. It is circulated and supplied to the inside.

上述のメッキ装置によれば、基材ｗの両側方に、少なくともスリット１０の液面下からスリット１０の下端部に至る長さ寸法を有する回転ローラ２０を、基材ｗとの間に間隔Ｌ１を保つようにして配設し、かつこれら回転ローラ２０の背面側の外方に流路形成部材２１を設けて、これらの流路形成部材２１の基材ｗ側の対向面２１２と基材ｗとの間にそれぞれ狭小の流出路２４を形成したため、特に、間隔Ｌ１によって流出路２４の液圧が高圧になり、これによって、スリット１０から基材ｗの両面に沿って流出するメッキ液の流出量を減少させることができるとともに、回転ローラ２０の接触による基材ｗへの異物の転写を防止することができる。   According to the above-described plating apparatus, the distance L1 between the rotating roller 20 having a length dimension at least from the lower surface of the slit 10 to the lower end of the slit 10 on both sides of the base material w is separated from the base material w. The flow path forming member 21 is provided outside the rotating roller 20 on the back side thereof, and the opposing surface 212 of the flow path forming member 21 on the base material w side and the base material w are provided. Since the narrow outflow passages 24 are formed between them, the liquid pressure in the outflow passage 24 becomes high particularly by the interval L1, and thereby the outflow of the plating solution flowing out from the slit 10 along both surfaces of the base material w. The amount can be reduced and the transfer of foreign matter to the substrate w due to the contact of the rotating roller 20 can be prevented.

さらには、回転駆動手段４によって、回転ローラ２０の対向部を、基材ｗと同方向かつ同速度で回転させるため、万が一、回転ローラ２０が基材ｗに接触した場合にも、基材ｗに線状の擦り傷が形成されることを阻止でき、これによって、基材ｗやメッキ層に製品化に際して問題となる欠陥が生じることを防止できる。
加えて、流路形成部材２１の凹部２１３と回転ローラ２０との間に流路２６が形成されているため、回転ローラ２０の回転の自由度を確保することができるとともに、回転ローラ２０の背面側の離間部がメッキ槽１側に向けて回転するため、流路２６に滞留するメッキ液をメッキ槽１側に向けて流動させることができ、メッキ液の流出を抑制することができる。 Furthermore, since the rotation roller 4 rotates the opposite portion of the rotating roller 20 in the same direction and at the same speed as the base material w, the base material w can be used even if the rotating roller 20 contacts the base material w. It is possible to prevent the formation of linear scratches on the substrate, thereby preventing the substrate w or the plating layer from generating a defect that causes a problem in commercialization.
In addition, since the flow path 26 is formed between the concave portion 213 of the flow path forming member 21 and the rotating roller 20, the degree of freedom of rotation of the rotating roller 20 can be secured and the back surface of the rotating roller 20. Since the separation portion on the side rotates toward the plating tank 1, the plating liquid staying in the flow path 26 can be flowed toward the plating tank 1, and the outflow of the plating liquid can be suppressed.

なお、本発明は、上述の実施形態に何ら限定されるものでなく、例えば、回転ローラ２０は、上述の円柱状でなく、漸次上部から下部に向けて拡径する切頭円錐状に形成されていてもよい。
この場合には、メッキ槽１が大気中に開放されているため、スリット１０の下部から流出するメッキ液の流出圧力が高くなるが、基材ｗの下部に沿って流出されるメッキ液の液量を減少させることが可能である。他方、基材ｗの上部が液圧が低いために基材ｗの搬送方向に交差する方向に左右に振れやすいものの、基材ｗと回転ローラ２０とが離間して位置するため、回転ローラ２０の接触による基材ｗ表面の傷の形成が抑制される。
但し、この場合にも、回転ローラ２０は、長手方向の全長に亘って、基材ｗとの間の間隔Ｌ１及び対向面２１２との間の路幅Ｌ２を保つように配設されている。 The present invention is not limited to the above-described embodiment. For example, the rotating roller 20 is not formed in the above-described columnar shape, but is formed in a truncated cone shape whose diameter gradually increases from the upper part toward the lower part. It may be.
In this case, since the plating tank 1 is open to the atmosphere, the outflow pressure of the plating solution flowing out from the lower portion of the slit 10 increases, but the plating solution flowing out along the lower portion of the base material w. It is possible to reduce the amount. On the other hand, since the upper part of the base material w has a low hydraulic pressure, it tends to swing left and right in the direction intersecting the transport direction of the base material w. The formation of scratches on the surface of the substrate w due to the contact is suppressed.
However, also in this case, the rotation roller 20 is disposed so as to maintain the distance L1 between the base material w and the road width L2 between the opposing surface 212 over the entire length in the longitudinal direction.

また、流路形成部材２１の対向面２１２に形成された凹部２１３は、回転ローラ２０の外周に沿って略半円弧状に形成されて、回転ローラ２０との間に形成される流路２６が全長に亘って略同一の路幅Ｌ２を有するように形成されたものに限らず、流路２６の幅が全長に亘って増減するように形成されたものであってもよい。この場合には、流路２６の最小幅が上記路幅Ｌ２に相当する。   Further, the recess 213 formed on the facing surface 212 of the flow path forming member 21 is formed in a substantially semicircular arc shape along the outer periphery of the rotary roller 20, and the flow path 26 formed between the rotary roller 20 and the recess 213 is formed. It is not limited to those formed so as to have substantially the same road width L2 over the entire length, but may be formed so that the width of the flow path 26 increases or decreases over the entire length. In this case, the minimum width of the flow path 26 corresponds to the road width L2.

第１の実施形態におけるメッキ装置の横断面図である。It is a cross-sectional view of the plating apparatus in the first embodiment. 図１のII−II線矢示図である。It is an II-II line arrow figure of FIG. 図２のIII−III線矢示図である。FIG. 3 is a view taken along line III-III in FIG. 2. 図１の要部拡大図である。It is a principal part enlarged view of FIG. 図４のＶ−Ｖ線矢示図である。It is the VV line arrow figure of FIG.

符号の説明Explanation of symbols

１ 処理槽（メッキ槽）
１ｂ 端部側壁（対向側面）
２ シール機構
４ 回転駆動手段
１０ スリット（開口）
２０ 回転ローラ 1 treatment tank (plating tank)
1b End side wall (opposite side)
2 Seal mechanism 4 Rotation drive means 10 Slit (opening)
20 Rotating roller

Claims (2)

内部に処理液が収容された処理槽を有し、上記処理槽の対向側面に、それぞれ帯幅方向を上下方向に向けた状態で搬送される帯状の基材を通過させる細長状の開口が形成され、上記開口の周囲にそれぞれ上記処理液の流出を抑制するシール機構が備えられた基材処理装置であって、
上記シール機構は、上記基材の両側方に軸線方向を上下方向に向けて回転自在に配設された一対の回転ローラと、これら回転ローラの回転駆動手段とを備えており、
上記回転ローラは、少なくとも上記開口の液面下から当該開口の下端部に至る長さ寸法を有し、かつその外周面が上記基材との間に０．１ｍｍ以上であって２．５ｍｍ以下の間隔を隔てた位置に配設されるとともに、
上記回転駆動手段は、上記外周面の周速が上記基材の搬送速度と同期して、上記外周面の上記基材側の対向部が上記基材と同方向に回転するように、上記回転ローラを駆動することを特徴とする基材処理装置。 An elongated opening is formed on the opposite side surface of the treatment tank, through which the belt-shaped base material that is transported in a state where the band width direction is directed in the vertical direction is passed through the treatment tank. And a substrate processing apparatus provided with a sealing mechanism for suppressing the outflow of the processing liquid around each of the openings,
The sealing mechanism includes a pair of rotating rollers disposed on both sides of the base material so as to be rotatable with the axial direction facing the up and down direction, and rotation driving means for the rotating rollers,
The rotating roller has at least a length from the bottom of the opening to the lower end of the opening, and the outer peripheral surface is 0.1 mm or more and 2.5 mm or less between the base material. Are arranged at positions spaced apart from each other,
The rotation driving means is configured to rotate the outer peripheral surface so that a peripheral portion of the outer peripheral surface is rotated in the same direction as the base material in synchronism with a conveyance speed of the base material. A substrate processing apparatus characterized by driving a roller. 上記処理槽の外部には、上記対向側面を一側面として上記開口を囲繞し、当該開口から流出した上記処理液を回収する有底筒状の回収槽が設けられており、
上記回転ローラは、上記回収槽内に設けられるとともに、それぞれ当該回転ローラの上記基材に対して背面側の外方に設けられた流路形成部材によって回転自在に支持されており、
上記流路形成部材は、上記一側面と一体的に設けられるとともに、少なくとも上記回転ローラよりも上下方向に向けて大きく形成されて、上記回転ローラ側の対向面と上記基材との間には、上記開口に連通する上記処理液の狭小の流出路が形成され、かつ
上記対向面には、上記回転ローラに対向する位置に凹部が形成されて、この凹部と回転ローラとの間には、最小の路幅が０．０５ｍｍ以上であって０．５ｍｍ以下の幅狭の流路が形成されていることを特徴とする請求項１に記載の基材処理装置。 Outside the processing tank, a bottomed cylindrical recovery tank is provided that surrounds the opening with the opposite side surface as one side surface and recovers the processing liquid flowing out from the opening,
The rotating roller is provided in the recovery tank, and is rotatably supported by a flow path forming member provided on the outer side of the back side with respect to the base material of the rotating roller,
The flow path forming member is provided integrally with the one side surface, and is formed to be larger in the vertical direction than at least the rotating roller, and between the facing surface on the rotating roller side and the base material. In addition, a narrow outflow path of the processing liquid communicating with the opening is formed, and a concave portion is formed on the facing surface at a position facing the rotating roller. Between the concave portion and the rotating roller, The substrate processing apparatus according to claim 1, wherein a narrow channel having a minimum channel width of 0.05 mm or more and 0.5 mm or less is formed.
JP2007034354A 2007-02-15 2007-02-15 Substrate processing equipment Expired - Fee Related JP4894547B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108677238A (en) * 2018-06-22 2018-10-19 昆山硕凯自动化科技有限公司 A kind of immersion plating slot rotation weir plate

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JPH07278877A (en) * 1994-04-07 1995-10-24 Hitachi Cable Ltd Plating device of hoop material
JPH09263980A (en) * 1996-03-27 1997-10-07 Nippon Steel Corp Rotary seal method of strip such as steel sheet
JP2002030482A (en) * 2000-07-11 2002-01-31 Casio Micronics Co Ltd Chemical treating apparatus and chemical treating method using the same
JP2002030490A (en) * 2000-07-11 2002-01-31 Casio Micronics Co Ltd Chemical treatment device, and chemical treatment method using the same
JP2003147582A (en) * 2001-11-09 2003-05-21 Nichiyo Engineering Kk Continuous wet treatment method and apparatus and liquid sealing method and device
JP2006257454A (en) * 2005-03-15 2006-09-28 Toray Ind Inc Treatment device for sheet and production method for sheet using the same
JP2006265636A (en) * 2005-03-24 2006-10-05 Jfe Steel Kk Method for producing surface-treated metal sheet having excellent surface appearance

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Publication number Priority date Publication date Assignee Title
JPH07278877A (en) * 1994-04-07 1995-10-24 Hitachi Cable Ltd Plating device of hoop material
JPH09263980A (en) * 1996-03-27 1997-10-07 Nippon Steel Corp Rotary seal method of strip such as steel sheet
JP2002030482A (en) * 2000-07-11 2002-01-31 Casio Micronics Co Ltd Chemical treating apparatus and chemical treating method using the same
JP2002030490A (en) * 2000-07-11 2002-01-31 Casio Micronics Co Ltd Chemical treatment device, and chemical treatment method using the same
JP2003147582A (en) * 2001-11-09 2003-05-21 Nichiyo Engineering Kk Continuous wet treatment method and apparatus and liquid sealing method and device
JP2006257454A (en) * 2005-03-15 2006-09-28 Toray Ind Inc Treatment device for sheet and production method for sheet using the same
JP2006265636A (en) * 2005-03-24 2006-10-05 Jfe Steel Kk Method for producing surface-treated metal sheet having excellent surface appearance

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108677238A (en) * 2018-06-22 2018-10-19 昆山硕凯自动化科技有限公司 A kind of immersion plating slot rotation weir plate

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