JP2008189763A - Insulation coating, heat-radiating insulation coating, electronic part and semiconductor device - Google Patents
Insulation coating, heat-radiating insulation coating, electronic part and semiconductor device Download PDFInfo
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- JP2008189763A JP2008189763A JP2007024398A JP2007024398A JP2008189763A JP 2008189763 A JP2008189763 A JP 2008189763A JP 2007024398 A JP2007024398 A JP 2007024398A JP 2007024398 A JP2007024398 A JP 2007024398A JP 2008189763 A JP2008189763 A JP 2008189763A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Abstract
Description
本発明は、絶縁性、及び、半導体チップ等の部材に対する接着性に長期間優れ、かつ、必要に応じて容易に部材から剥離可能な絶縁塗料、絶縁性、放熱性、及び、半導体チップ等の部材に対する接着性に長期間優れ、かつ、必要に応じて容易に部材から剥離可能な放熱絶縁塗料、該絶縁塗料又は放熱絶縁塗料を用いてなる電子部品、並びに、該放熱絶縁塗料を用いてなる半導体装置に関する。 The present invention has an insulating property and excellent adhesion to a member such as a semiconductor chip for a long period of time, and can be easily peeled off from a member as necessary, such as an insulating paint, an insulating property, a heat dissipation property, and a semiconductor chip. A heat dissipating insulating paint that is excellent in adhesion to a member for a long period of time and can be easily peeled off from a member as necessary, an electronic component using the insulating paint or the heat dissipating insulating paint, and the heat insulating insulating paint The present invention relates to a semiconductor device.
電子部品は、年々小型化及び多機能化が進んでおり、これを制御する電子部品においては、絶縁コーティング材を塗付して保護コーティング膜を形成する処理が施されている。
従来、絶縁塗料として、例えば、特許文献１には、アクリル樹脂、ポリオレフィン、又はポリウレタンを用い、溶剤として酢酸ｎ−ブチルを用いた絶縁塗料が開示されている。
しかしながら、このような絶縁塗料を用いた場合、電子部品への絶縁塗料の塗布工程で塗布不良等が発生した場合、一旦塗布した絶縁塗膜を除去しようとした場合に電子部品に損傷を与えてしまう場合があった。
Electronic components are becoming smaller and more multifunctional year by year, and electronic components that control the electronic components are subjected to a process of applying an insulating coating material to form a protective coating film.
Conventionally, for example,
However, when such an insulating paint is used, if an application failure occurs in the process of applying the insulating paint to the electronic component, damage to the electronic component may occur if an attempt is made to remove the applied insulating coating. There was a case.
また、近年、発熱性電子部品の高性能化や小型化により、いかに発熱性電子部品から熱を効率よく発散させていくかという要求が高まっている。電子部品から熱を発散させるには、従来、放熱シート、放熱スペーサー、放熱グリース、フェーズチェンジ型放熱部材等の放熱材料が用いられており、熱をより効率よく発散させる方法としては、これらの放熱材料を薄膜化させて用いることが好適であるとされている。特に、容易に薄膜化させることができ、かつ、安価であることから、放熱グリースが好適であるとされている。
しかし、従来の放熱グリースは、含有されるベース油分が時間の経過とともに分離しまうため、発熱性電子部品に用いると熱抵抗が上昇し、放熱性が低下するという問題があった。
In recent years, there has been an increasing demand for how to efficiently dissipate heat from heat-generating electronic components due to high performance and downsizing of heat-generating electronic components. In order to dissipate heat from electronic components, heat dissipating materials such as heat dissipating sheets, heat dissipating spacers, heat dissipating grease, and phase change heat dissipating members have been used in the past. It is said that it is preferable to use a thin film of the material. In particular, a heat dissipating grease is suitable because it can be easily thinned and is inexpensive.
However, the conventional heat-dissipating grease has a problem that since the contained base oil component is separated over time, when it is used for a heat-generating electronic component, the heat resistance increases and the heat-dissipation property decreases.
例えば、特許文献２には、増ちょう剤を含有する潤滑油と熱伝導性粉体とからなる放熱グリースが開示されている。特許文献２に開示された放熱グリースは、塗布性が高く、かつ、ベース油分の分離を極度に抑えることができるため、作業性、放熱性に優れたものとなるとされている。
しかし、特許文献２に記載された放熱グリースでは、平均粒径の比較的大きな熱伝導性粉体が用いられているため、薄膜化することが困難であり、充分な放熱ができないという問題があった。
For example,
However, since the heat dissipating grease described in
このような問題に対し、特許文献３には、オルガノポリシロキサン、一定の粒径のアルミナ粉、及び、窒化アルミニウム粉からなる放熱グリースが開示されている。特許文献３に開示された放熱グリースは、熱伝導性が高く、また、薄膜化が容易であるため放熱性に優れるとされている。
しかしながら、このような放熱グリースは、長期間の使用とともに放熱性が低下し、また、半導体チップ等の部材に対して塗布する部位を誤った場合には剥離することができないという問題があった。
However, such heat dissipating grease has a problem that its heat dissipating property decreases with long-term use, and it cannot be peeled off if the part applied to a member such as a semiconductor chip is wrong.
本発明は、上記現状に鑑み、絶縁性、及び、半導体チップ等の部材に対する接着性に長期間優れ、かつ、必要に応じて容易に部材から剥離可能な絶縁塗料、絶縁性、放熱性、及び、半導体チップ等の部材に対する接着性に長期間優れ、かつ、必要に応じて容易に部材から剥離可能な放熱絶縁塗料、該絶縁塗料又は放熱絶縁塗料を用いてなる電子部品、並びに、該放熱絶縁塗料を用いてなる半導体装置を提供することを目的とする。 In view of the above situation, the present invention is an insulating paint that is excellent in insulation and adhesion to a member such as a semiconductor chip for a long period of time, and can be easily peeled off from a member as necessary. , A heat-dissipating insulating paint excellent in adhesion to a member such as a semiconductor chip for a long period of time and easily peelable from the member if necessary, an electronic component using the insulating paint or the heat-dissipating insulating paint, and the heat dissipating insulation An object of the present invention is to provide a semiconductor device using a paint.
本発明は、Ａ−Ｂ−Ａ型スチレンブロック共重合体及び／又はその水素化物と粘着性付与樹脂とを有する樹脂組成物、並びに、溶剤を含有する絶縁塗料であって、前記樹脂組成物１００重量部に対して、前記溶剤を５０〜１５０重量部含有する絶縁塗料である。
以下に本発明を詳述する。
The present invention is an ABA type styrene block copolymer and / or a resin composition having a hydride thereof and a tackifying resin, and an insulating paint containing a solvent, the resin composition 100 An insulating paint containing 50 to 150 parts by weight of the solvent with respect to parts by weight.
The present invention is described in detail below.
本発明者らは、鋭意検討の結果、絶縁塗料において、Ａ−Ｂ−Ａ型スチレンブロック共重合体及び／又はその水素化物と粘着性付与樹脂とを含有させることにより、絶縁性、及び、半導体チップ等の部材に対する接着性に長期間優れ、かつ、必要に応じて容易に部材から剥離可能な絶縁塗料を得ることができ、更に、この絶縁塗料を用いることにより長期間に渡って絶縁性、及び、放熱性に優れる放熱絶縁塗料を得ることができるということを見出し、本発明を完成させるに至った。 As a result of intensive studies, the inventors of the present invention have made it possible to include an ABA type styrene block copolymer and / or a hydride thereof and a tackifying resin in an insulating coating, thereby providing insulating properties and semiconductors. It is excellent in adhesion to a member such as a chip for a long period of time, and can obtain an insulating coating that can be easily peeled off from the member as needed. And it discovered that the thermal radiation insulation coating material excellent in heat dissipation could be obtained, and came to complete this invention.
本発明の絶縁塗料は、Ａ−Ｂ−Ａ型スチレンブロック共重合体及び／又はその水素化物と粘着性付与樹脂とを有する樹脂組成物を含有する。
上記Ａ−Ｂ−Ａ型スチレンブロック共重合体又はその水素化物としては特に限定されず、例えば、スチレン−ブタジエン−スチレンブロック共重合体ゴム（ＳＢＳ）、スチレン−イソプレン−スチレンブロック共重合体ゴム（ＳＩＳ）、スチレン−ビニル・イソプレン−スチレンブロック共重合体ゴム（ＳＶＩＳ）、スチレン−エチレン／ブチレン−スチレンブロック共重合体ゴム（ＳＥＢＳ）、スチレン−エチレン／プロピレン−スチレンブロック共重合体ゴム（ＳＥＰＳ）、スチレン−ブタジエン−ブチレン−スチレン共重合体ゴム（ＳＢＢＳ）等が挙げられる。なかでも、剥離性の観点からは、ＳＢＳ又はＳＢＢＳが好ましく、耐熱性の観点からは、ＳＢＢＳ、ＳＥＢＳ、ＳＩＢＳが好ましい。
また、上記Ａ−Ｂ−Ａ型スチレンブロック共重合体として、ブタジエン骨格を有するものは、乾燥後の塗膜強度に優れることから好ましい。なかでも、ブタジエン骨格を有するＡ−Ｂ−Ａ型スチレンブロック共重合体としては、剥離性、耐熱性、塗膜強度を兼ね備える点から、ＳＢＢＳが特に好ましく用いられる。
なお、上記Ａ−Ｂ−Ａ型スチレンブロック共重合体におけるスチレン含有量としては特に限定されないが、好ましい下限は２０ｍｏｌ％、好ましい上限は６０ｍｏｌ％である。２０ｍｏｌ％未満であると、本発明の絶縁塗料の接着性が強すぎ、塗布乾燥後剥離が難しくなることがあり、６０ｍｏｌ％を超えると、塗布乾燥後の本発明の絶縁塗料が堅くなりすぎ、密着性が不充分になることがある。
The insulating paint of this invention contains the resin composition which has an ABA type styrene block copolymer and / or its hydride, and tackifying resin.
The ABA type styrene block copolymer or its hydride is not particularly limited, and examples thereof include styrene-butadiene-styrene block copolymer rubber (SBS), styrene-isoprene-styrene block copolymer rubber ( SIS), styrene-vinyl / isoprene-styrene block copolymer rubber (SVIS), styrene-ethylene / butylene-styrene block copolymer rubber (SEBS), styrene-ethylene / propylene-styrene block copolymer rubber (SEPS). Styrene-butadiene-butylene-styrene copolymer rubber (SBBS) and the like. Of these, SBS or SBBS is preferable from the viewpoint of peelability, and SBBS, SEBS, or SIBS is preferable from the viewpoint of heat resistance.
Moreover, what has a butadiene skeleton as said ABA type styrene block copolymer is preferable from the outstanding coating-film intensity | strength after drying. Among these, SBBS is particularly preferably used as the ABA type styrene block copolymer having a butadiene skeleton from the viewpoint of having peelability, heat resistance, and coating strength.
In addition, although it does not specifically limit as styrene content in the said ABA type styrene block copolymer, A preferable minimum is 20 mol% and a preferable upper limit is 60 mol%. If it is less than 20 mol%, the adhesiveness of the insulating paint of the present invention is too strong, and peeling after coating and drying may be difficult. If it exceeds 60 mol%, the insulating coating of the present invention after coating and drying becomes too hard, Adhesion may be insufficient.
上記樹脂組成物において、上記Ａ−Ｂ−Ａ型スチレンブロック共重合体及び／又はその水素化物の含有量の好ましい下限は３０重量％、好ましい上限は９０重量％である。３０重量％未満であると、本発明の絶縁塗料の防湿性が劣ることがあり、９０重量％を超えると、ガラス、プリント基板、半導体チップ等の部材との接着性が劣ることがある。より好ましい下限は４０重量％、より好ましい上限は８５重量％であり、更に好ましい下限は５０重量％、更に好ましい上限は８０重量％である。 The said resin composition WHEREIN: The minimum with preferable content of the said ABA type styrene block copolymer and / or its hydride is 30 weight%, and a preferable upper limit is 90 weight%. If it is less than 30% by weight, the moisture-proof property of the insulating paint of the present invention may be inferior, and if it exceeds 90% by weight, the adhesion to members such as glass, printed circuit boards, and semiconductor chips may be inferior. A more preferred lower limit is 40% by weight, a more preferred upper limit is 85% by weight, a still more preferred lower limit is 50% by weight, and a still more preferred upper limit is 80% by weight.
上記樹脂組成物は、粘着性付与樹脂を含有する。
上記粘着性付与樹脂を含有することにより、本発明の絶縁塗料のガラス、プリント基板、半導体チップ等の部材に対する接着性を向上させることができる。
The resin composition contains a tackifying resin.
By containing the tackifying resin, it is possible to improve the adhesion of the insulating coating of the present invention to members such as glass, printed circuit boards and semiconductor chips.
上記粘着性付与樹脂としては特に限定されないが、石油系樹脂、ロジン系樹脂、及び、テルペン樹脂からなる群より選択される少なくとも１種であることが好ましい。 The tackifier resin is not particularly limited, but is preferably at least one selected from the group consisting of petroleum resins, rosin resins, and terpene resins.
上記石油系樹脂としては特に限定されず、例えば、脂肪族系石油樹脂、芳香族系石油樹脂、脂環式系石油樹脂、脂肪族／芳香族共重合系石油樹脂及びそれらの水添石油樹脂が挙げられる。 The petroleum resin is not particularly limited, and examples thereof include aliphatic petroleum resins, aromatic petroleum resins, alicyclic petroleum resins, aliphatic / aromatic copolymer petroleum resins, and hydrogenated petroleum resins thereof. Can be mentioned.
上記ロジン系樹脂としては特に限定されず、例えば、ロジン、ロジン変性樹脂及びその誘導体等が挙げられる。
上記テルペン系樹脂としては特に限定されず、例えば、ポリテルペン、テルペンフェノール系樹脂及びそれらの水添樹脂等が挙げられる。
The rosin resin is not particularly limited, and examples thereof include rosin, rosin modified resin and derivatives thereof.
The terpene resin is not particularly limited, and examples thereof include polyterpenes, terpene phenol resins, and hydrogenated resins thereof.
上記粘着性付与樹脂の市販品としては、例えば、ＫＥ３１１、ＫＥ６０４、Ｐ１００、Ｐ１２５、Ｐ１４０、Ｍ１００、Ｍ１１５、Ｍ１３５、スーパーエステルＡ１００、Ｓ１００、ビームセット１０１、１０２（荒川化学社製）、ＹＳレジンＴＯ１２５、ＴＲ１０５、クリアロンＰ１２５、クリアロンＭ１１５、クリアロンＫ１１０、クリアロンＫ４０９０（ヤスハラケミカル社製）等が挙げられる。 Examples of commercially available tackifying resins include KE311, KE604, P100, P125, P140, M100, M115, M135, Superester A100, S100, Beamset 101, 102 (Arakawa Chemical Co., Ltd.), YS Resin TO125. TR105, Clearon P125, Clearon M115, Clearon K110, Clearon K4090 (manufactured by Yasuhara Chemical Co., Ltd.), and the like.
上記粘着性付与樹脂の軟化点としては特に限定されないが、環球法により測定した好ましい下限が１００℃、好ましい上限が１５０℃である。１００℃未満であると、本発明の絶縁塗料の耐湿性が劣ることがあり、１５０℃を超えると、本発明の絶縁塗料の密着性に劣ることがある。より好ましい下限は１１０℃、より好ましい上限は１４０℃である。 Although it does not specifically limit as a softening point of the said tackifying resin, The preferable minimum measured by the ring and ball method is 100 degreeC, and a preferable upper limit is 150 degreeC. When it is less than 100 ° C., the moisture resistance of the insulating paint of the present invention may be inferior, and when it exceeds 150 ° C., the adhesiveness of the insulating paint of the present invention may be inferior. A more preferred lower limit is 110 ° C., and a more preferred upper limit is 140 ° C.
上記樹脂組成物において、上記粘着性付与樹脂の含有量としては、好ましい下限が１０重量％、好ましい上限が７０重量％である。１０重量％未満であると、ガラス、プリント基板、半導体チップ等の部材との接着性が劣ることがあり、７０重量％を超えると、本発明の絶縁塗料の防湿性が劣ることがある。より好ましい下限は１５重量％、より好ましい上限は６５重量％であり、更に好ましい下限は２０重量％、更に好ましい上限は６０重量％である。 In the resin composition, the content of the tackifying resin is preferably 10% by weight and preferably 70% by weight. If it is less than 10% by weight, the adhesion to a member such as glass, a printed circuit board or a semiconductor chip may be inferior, and if it exceeds 70% by weight, the moisture resistance of the insulating coating of the present invention may be inferior. A more preferred lower limit is 15% by weight, a more preferred upper limit is 65% by weight, a still more preferred lower limit is 20% by weight, and a still more preferred upper limit is 60% by weight.
本発明の絶縁塗料は、溶剤を含有する。
上記溶剤としては特に限定されず、例えば、アセトン、メチルエチルケトン等のケトン系溶剤、トルエン、キシレン等の芳香族系溶剤、シクロヘキサン、メチルシクロヘキサン、エチルシクロヘキサン等の脂肪族系溶剤、酢酸エチル、酢酸ブチル、酢酸イソプロピル等のエステル系溶剤、エタノール、ブタノール等のアルコール系溶剤、パラフィン油、ナフテン油等のパラフィン系溶剤、ミネラルターペン、ナフサ等の石油系溶剤等が挙げられる。
The insulating paint of the present invention contains a solvent.
The solvent is not particularly limited, for example, ketone solvents such as acetone and methyl ethyl ketone, aromatic solvents such as toluene and xylene, aliphatic solvents such as cyclohexane, methylcyclohexane and ethylcyclohexane, ethyl acetate, butyl acetate, Examples thereof include ester solvents such as isopropyl acetate, alcohol solvents such as ethanol and butanol, paraffin solvents such as paraffin oil and naphthene oil, and petroleum solvents such as mineral terpenes and naphtha.
上記溶剤の含有量は、上記樹脂組成物１００重量部に対して下限が５０重量部、上限が５００重量部である。５０重量部未満であると、本発明の絶縁塗料の粘度が高くなりすぎ、所望の形状に塗工することができず、５００重量部を超えると、本発明の絶縁塗料の粘度が低くなりすぎ、塗工後の形状を維持することが困難となる。好ましい下限は６０重量部、好ましい上限は３００重量部である。 The lower limit of the content of the solvent is 50 parts by weight and the upper limit is 500 parts by weight with respect to 100 parts by weight of the resin composition. If the amount is less than 50 parts by weight, the viscosity of the insulating paint of the present invention becomes too high to be applied in a desired shape, and if it exceeds 500 parts by weight, the viscosity of the insulating paint of the present invention becomes too low. It becomes difficult to maintain the shape after coating. A preferred lower limit is 60 parts by weight and a preferred upper limit is 300 parts by weight.
また、本発明の絶縁塗料の乾燥を室温で行う場合は、作業性も考慮して上記溶剤としては、シクロヘキサン、メチルシクロヘキサン、酢酸エチル、酢酸ブチル等の沸点が７０℃以上１４０℃以下であるものを用いることが好ましい。沸点が７０℃未満であると、皮張り等作業性に問題が生じる場合があり、沸点が１４０℃を超えると、溶剤が充分に乾燥しない場合がある。 In addition, when the insulating paint of the present invention is dried at room temperature, considering the workability, the solvent has a boiling point of 70 ° C. or higher and 140 ° C. or lower as cyclohexane, methylcyclohexane, ethyl acetate, butyl acetate or the like. Is preferably used. If the boiling point is less than 70 ° C, there may be a problem in workability such as skinning, and if the boiling point exceeds 140 ° C, the solvent may not be sufficiently dried.
本発明の絶縁塗料、更にシランカップリング剤を含有することが好ましい。
上記シランカップリング剤としては特に限定されず、例えば、（メタ）アクリロキシ系、アミノ系、イソシアヌル系又はこれらの混合物等が挙げられる。
It is preferable that the insulating paint of the present invention further contains a silane coupling agent.
It does not specifically limit as said silane coupling agent, For example, (meth) acryloxy type | system | group, an amino type, an isocyanuric type | system | group, or these mixtures etc. are mentioned.
上記シランカップリング剤の具体的なものとしては、例えば、ＫＢＭ−６０２、ＫＢＭ−５１０３、ＫＢＭ―１４０３、ＫＢＭ―５０３、ＫＢＥ―９００７、Ｘ１２−９６５（いずれも信越化学工業社製）等が挙げられる。 Specific examples of the silane coupling agent include KBM-602, KBM-5103, KBM-1403, KBM-503, KBE-9007, and X12-965 (all manufactured by Shin-Etsu Chemical Co., Ltd.). It is done.
上記シランカップリング剤の含有量としては特に限定されないが、上記樹脂組成物１００重量部に対して好ましい下限が０．１重量部、好ましい上限が５重量部である。０．１重量部未満であると、ガラス、プリント基板、半導体チップ等の部材との接着性が劣ることがあり、５重量部を超えると、耐湿性が劣ることがある。より好ましい下限は０．３重量部、より好ましい上限は３重量部である。 Although it does not specifically limit as content of the said silane coupling agent, A preferable minimum is 0.1 weight part with respect to 100 weight part of said resin compositions, and a preferable upper limit is 5 weight part. If it is less than 0.1 part by weight, the adhesion to a member such as glass, a printed circuit board or a semiconductor chip may be inferior, and if it exceeds 5 parts by weight, the moisture resistance may be inferior. A more preferred lower limit is 0.3 parts by weight, and a more preferred upper limit is 3 parts by weight.
また、本発明の絶縁塗料は、必要に応じて充填剤、改質剤、消泡剤、着色剤、接着性付与剤等を含有してもよい。 In addition, the insulating paint of the present invention may contain a filler, a modifier, an antifoaming agent, a colorant, an adhesiveness imparting agent, and the like as necessary.
上記充填剤としては特に限定されず、例えば、酸化ケイ素、酸化マグネシウム、水酸化アルミニウム、炭酸カルシウム等が挙げられる。なお、上記充填剤は、微粉末状であることが好ましい。 The filler is not particularly limited, and examples thereof include silicon oxide, magnesium oxide, aluminum hydroxide, and calcium carbonate. The filler is preferably in the form of fine powder.
上記改質剤としては特に限定されず、例えば、ナフテン酸マンガン、オクテン酸マンガン等の有機酸金属塩等が挙げられる。このような改質剤を含有させることにより、本発明の絶縁塗料は、より乾燥性に優れたものとなる。 The modifier is not particularly limited, and examples thereof include organic acid metal salts such as manganese naphthenate and manganese octenoate. By including such a modifier, the insulating paint of the present invention is more excellent in drying properties.
上記消泡剤としては特に限定されず、例えば、シリコーン系オイル、フッ素オイル、ポリカルボン酸系ポリマー等の公知の消泡剤が挙げられる。 It does not specifically limit as said antifoamer, For example, well-known antifoamers, such as a silicone type oil, a fluorine oil, a polycarboxylic acid type polymer, are mentioned.
上記着色剤としては特に限定されず、例えば、公知の無機顔料、有機系顔料、有機系染料等が挙げられる。 The colorant is not particularly limited, and examples thereof include known inorganic pigments, organic pigments, and organic dyes.
本発明の絶縁塗料は、粘度の好ましい下限が０．１Ｐａ・ｓ、好ましい上限が５０Ｐａ・ｓである。 The insulating paint of the present invention has a preferred lower limit of viscosity of 0.1 Pa · s and a preferred upper limit of 50 Pa · s.
本発明の絶縁塗料は、更に、放熱絶縁フィラーを含有することにより放熱絶縁塗料として好適に使用することができ、好ましい。上記放熱絶縁フィラーを含有することにより、本発明の絶縁塗料を塗布・乾燥させた後に高い絶縁性と放熱性とを担保させることができる。このような本発明の絶縁塗料に放熱絶縁フィラーを含有させた放熱絶縁塗料もまた、本発明の１つである。
すなわち、本発明の放熱絶縁塗料は、Ａ−Ｂ−Ａ型スチレンブロック共重合体及び／又はその水素化物と粘着性付与樹脂とを有する樹脂組成物、溶剤、並びに、酸化アルミニウム、窒化アルミニウム、窒化ホウ素、及び、酸化亜鉛からなる群より選択される少なくとも１種からなる放熱絶縁フィラーを含有する放熱絶縁塗料であって、前記樹脂組成物１００重量部に対して、前記溶剤を５０〜１５０重量部含有するものである。
The insulating paint of the present invention can be suitably used as a heat dissipating insulating paint by further containing a heat dissipating insulating filler, which is preferable. By containing the heat dissipation insulating filler, high insulation and heat dissipation can be ensured after applying and drying the insulating paint of the present invention. Such a heat radiation insulating paint containing the heat radiation insulating filler in the insulating paint of the present invention is also one aspect of the present invention.
That is, the heat-dissipating insulating paint of the present invention includes an ABA type styrene block copolymer and / or a resin composition having a hydride thereof and a tackifying resin, a solvent, and aluminum oxide, aluminum nitride, and nitride. A heat radiation insulating paint containing a heat radiation insulating filler consisting of at least one selected from the group consisting of boron and zinc oxide, wherein 50 to 150 parts by weight of the solvent with respect to 100 parts by weight of the resin composition It contains.
本発明の放熱絶縁塗料において、上記Ａ−Ｂ−Ａ型スチレンブロック共重合体及び／又はその水素化物と粘着性付与樹脂とを有する樹脂組成物、並びに、溶剤としては、上述した本発明の絶縁塗料と同様のものが挙げられる。
上記放熱絶縁フィラーは、酸化アルミニウム、窒化アルミニウム、窒化ホウ素、及び、酸化亜鉛からなる群より選択される少なくとも１種からなるものである。これらの放熱絶縁フィラーを含有することで本発明の放熱絶縁塗料の耐湿性が向上する。なかでも、酸化アルミニウム、窒化アルミニウム、窒化ホウ素より選択される少なくとも１種からなることが好ましい。
In the heat radiation insulating paint of the present invention, the ABA type styrene block copolymer and / or a hydride thereof and a resin composition having a tackifier resin, and a solvent include the above-described insulation of the present invention. The thing similar to a paint is mentioned.
The heat radiation insulating filler is made of at least one selected from the group consisting of aluminum oxide, aluminum nitride, boron nitride, and zinc oxide. By containing these heat radiation insulating fillers, the moisture resistance of the heat radiation insulating paint of the present invention is improved. Of these, at least one selected from aluminum oxide, aluminum nitride, and boron nitride is preferable.
上記放熱絶縁フィラーの平均粒子径としては特に限定されないが、好ましい下限は０．１μｍ、好ましい上限は５μｍである。０．１μｍ未満であると、充分な放熱性が得られないことがあり、５μｍを超えると、本発明の放熱絶縁塗料の塗布乾燥後の厚みを所望の薄さにすることができないことがある。 Although it does not specifically limit as an average particle diameter of the said thermal radiation insulation filler, A preferable minimum is 0.1 micrometer and a preferable upper limit is 5 micrometers. If the thickness is less than 0.1 μm, sufficient heat dissipation may not be obtained. If the thickness exceeds 5 μm, the thickness after application and drying of the heat radiation insulating paint of the present invention may not be reduced to a desired thickness. .
このような放熱絶縁フィラーの含有量としては、上述した樹脂組成物１００重量部に対して、好ましい下限が１００重量部、好ましい上限が９００重量部である。１００重量部未満であると、放熱性が充分に得られないことがあり、９００重量部を超えると、ガラス、プリント基板、半導体チップ等の部材に対する接着性が低下することがある。より好ましい下限は１２５重量部、より好ましい上限は７５０重量部であり、更に好ましい下限は１５０重量部、更に好ましい上限は６００重量部である。 As content of such a heat insulation insulating filler, a preferable minimum is 100 weight part and a preferable upper limit is 900 weight part with respect to 100 weight part of resin compositions mentioned above. When the amount is less than 100 parts by weight, heat dissipation may not be sufficiently obtained. When the amount exceeds 900 parts by weight, adhesion to members such as glass, a printed circuit board, and a semiconductor chip may be deteriorated. A more preferred lower limit is 125 parts by weight, a more preferred upper limit is 750 parts by weight, a still more preferred lower limit is 150 parts by weight, and a still more preferred upper limit is 600 parts by weight.
本発明の放熱絶縁塗料は、半導体チップ等の部材の放熱用途目的に好適に用いられる。
上述した本発明の絶縁塗料からなる絶縁膜、又は、本発明の放熱絶縁塗料からなる放熱絶縁膜を有する電子部品もまた、本発明の１つである。
The heat radiation insulating paint of the present invention is suitably used for the purpose of heat radiation of members such as semiconductor chips.
The electronic component having the above-described insulating film made of the insulating paint of the present invention or the heat insulating insulating film made of the heat dissipating insulating paint of the present invention is also one aspect of the present invention.
本発明の絶縁塗料又は本発明の放熱絶縁塗料を用いて絶縁される電子部品としては、例えば、マイクロコンピュータ、トランジスタ、コンデンサ、抵抗、リレー、トランス、及び、これらを搭載した実装回路板等が挙げられ、更にこれら電子部品に接合されるリード線、ハーネス、フィルム基板等も含むことができる。 Examples of the electronic components insulated using the insulating paint of the present invention or the heat insulating insulating paint of the present invention include a microcomputer, a transistor, a capacitor, a resistor, a relay, a transformer, and a mounting circuit board on which these are mounted. Furthermore, a lead wire, a harness, a film substrate, and the like joined to these electronic components can also be included.
また、図１のように、半導体チップ４と半導体用部材６と放熱部材３とを有する半導体装置１であって、上記半導体チップ４は、一方の面が該一方の面に設けられた電気的接続端子５を介して上記半導体用部材６と電気的に接続され、他方の面が該他方の面に設けられた本発明の放熱絶縁塗料からなる放熱絶縁膜２を介して上記放熱部材３と接続されている半導体装置１もまた、本発明の１つである。なお、図１は、本発明の放熱絶縁塗料を用いてなる半導体装置の一例を模式的に示す断面図である。
Further, as shown in FIG. 1, a
本発明によれば、絶縁性、及び、半導体チップ等の部材に対する接着性に長期間優れ、かつ、必要に応じて容易に部材から剥離可能な絶縁塗料、絶縁性、放熱性、及び、半導体チップ等の部材に対する接着性に長期間優れ、かつ、必要に応じて容易に部材から剥離可能な放熱絶縁塗料、該絶縁塗料又は放熱絶縁塗料を用いてなる電子部品、並びに、該放熱絶縁塗料を用いてなる半導体装置を提供することができる。 According to the present invention, the insulating coating material has excellent insulating properties and adhesion to a member such as a semiconductor chip for a long period of time, and can be easily peeled off from the member as needed, insulating property, heat dissipation property, and semiconductor chip. A heat-dissipating insulating paint that is excellent in adhesion to a member for a long period of time and can be easily peeled off from a member as required, an electronic component using the insulating paint or heat-dissipating insulating paint, and the heat dissipating insulating paint A semiconductor device can be provided.
以下に実施例を掲げて本発明を更に詳しく説明するが、本発明はこれら実施例のみに限定されるものではない。 Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.
（実施例１〜３、比較例１）
表１に示す組成比になるように各成分を配合し、４０℃で加温しながら３時間攪拌することにより実施例１〜３及び比較例１の絶縁塗料を調製した。
(Examples 1 to 3, Comparative Example 1)
Insulating paints of Examples 1 to 3 and Comparative Example 1 were prepared by blending each component so as to have the composition ratio shown in Table 1 and stirring for 3 hours while heating at 40 ° C.
＜評価＞
実施例１〜３及び比較例１で得られた絶縁塗料について以下の評価を行った。結果を表１に示した。
<Evaluation>
The following evaluations were performed on the insulating paints obtained in Examples 1 to 3 and Comparative Example 1. The results are shown in Table 1.
（１）剥離性
実施例１〜３及び比較例１の絶縁塗料について、乾燥後の塗膜が１０ｃｍ×１０ｃｍ×８０μｍとなるようにガラス基板に塗布した後、乾燥させてカッター刃にて剥離し、材料のガラス基板への付着なく剥離できた場合を○、付着無く剥離はできるが剥離した膜が破れた場合を△、付着が見られた場合を×とした。
(1) Peelability About the insulating paints of Examples 1 to 3 and Comparative Example 1, the coated film after drying was applied to a glass substrate so as to be 10 cm × 10 cm × 80 μm, and then dried and peeled with a cutter blade. The case where the material could be peeled off without adhering to the glass substrate was rated as “◯”, the case where the material could be peeled off without adhering, but the peeled film was broken, and the case where the adhering was observed was marked as “X”.
（２）透湿度
実施例１〜３及び比較例１の絶縁塗料について、ＪＩＳＺ０２０８の「防湿包装材料の透湿度試験方法（カップ法）」に準じ試験を行った。なお、塗膜については、フッ素樹脂板に塗膜の厚みが１００μｍとなるように絶縁塗料を塗布し、２５℃で２４時間乾燥し試験塗膜を作製した。
(2) Moisture permeability The insulating paints of Examples 1 to 3 and Comparative Example 1 were tested in accordance with JISZ0208 “Moisture permeability test method for moisture-proof packaging materials (cup method)”. In addition, about the coating film, the insulating coating material was apply | coated to the fluororesin board so that the thickness of a coating film might be 100 micrometers, and it dried at 25 degreeC for 24 hours, and produced the test coating film.
（実施例４、５、比較例２）
表２に示す組成比になるように各成分を配合し、４０℃で加温しながら３時間攪拌することにより実施例４、５及び比較例２の放熱絶縁塗料を調製した。
(Examples 4 and 5 and Comparative Example 2)
Each component was mix | blended so that it might become a composition ratio shown in Table 2, and the thermal radiation insulation coating material of Examples 4, 5 and the comparative example 2 was prepared by stirring for 3 hours, heating at 40 degreeC.
＜評価＞
実施例４、５及び比較例２で得られた放熱絶縁塗料について以下の評価を行った。結果を表２に示した。
<Evaluation>
The following evaluation was performed about the heat-radiation insulation coating material obtained in Examples 4 and 5 and Comparative Example 2. The results are shown in Table 2.
（１）剥離性
実施例４、５及び比較例２の放熱絶縁塗料について、乾燥後の塗膜が１０ｃｍ×１０ｃｍ×８０μｍとなるようにガラス基板に塗布した後、乾燥させてカッター刃にて剥離し、材料のガラス基板への付着なく剥離できた場合を○、付着無く剥離はできるが剥離した膜が破れた場合を△、付着が見られた場合を×とした。
(1) Peelability Regarding the heat-dissipating insulating paints of Examples 4 and 5 and Comparative Example 2, the coated film after drying was applied to a glass substrate so as to be 10 cm × 10 cm × 80 μm, and then dried and peeled with a cutter blade. In the case where the material could be peeled off without adhering to the glass substrate, the case where the material was able to be peeled off without adhesion but the peeled film was torn was indicated as Δ.
（２）初期の熱抵抗測定
実施例４、５及び比較例２に記載の放熱絶縁塗料を、先端が□１０ｍｍのヒーターを埋め込んだ銅製治具と、□１０ｍｍの銅製冷却治具との間に試料を挟み、４．２ｋｇの荷重をかけてセットした後、ヒーターに電力２０Ｗをかけて３０分間保持し、銅製ヒーターケースと銅板との温度差（℃）を測定し、下記式により算出した。
熱抵抗（℃／Ｗ）＝温度差（℃）／電力（Ｗ）
(2) Initial thermal resistance measurement The heat-dissipating insulating paint described in Examples 4 and 5 and Comparative Example 2 was placed between a copper jig in which a heater with a tip of □ 10 mm was embedded, and a □ 10 mm copper cooling jig. The sample was sandwiched and set under a load of 4.2 kg, and then the heater was applied with electric power of 20 W and held for 30 minutes, and the temperature difference (° C.) between the copper heater case and the copper plate was measured and calculated according to the following formula.
Thermal resistance (℃ / W) = Temperature difference (℃) / Power (W)
（３）ヒートサイクル後の熱抵抗測定
ヒートサイクル装置に（２）で用いた銅製治具と銅製冷却治具に試料を挟みこんだ状態のままセットし、−４０℃×３０分間→１２０℃×３０分間を１サイクルとする試験を２０００サイクル行った後、（２）と同様にして熱抵抗を測定した。
(3) Thermal resistance measurement after heat cycle Set the sample in the heat cycle device with the sample sandwiched between the copper jig and copper cooling jig used in (2), −40 ° C. × 30 minutes → 120 ° C. × After 2000 cycles of a test with 30 minutes as one cycle, the thermal resistance was measured in the same manner as in (2).
本発明によれば、絶縁性、及び、半導体チップ等の部材に対する接着性に長期間優れ、かつ、必要に応じて容易に部材から剥離可能な絶縁塗料、絶縁性、放熱性、及び、半導体チップ等の部材に対する接着性に長期間優れ、かつ、必要に応じて容易に部材から剥離可能な放熱絶縁塗料、該絶縁塗料又は放熱絶縁塗料を用いてなる電子部品、並びに、該放熱絶縁塗料を用いてなる半導体装置を提供することができる。 According to the present invention, the insulating coating material has excellent insulating properties and adhesion to a member such as a semiconductor chip for a long period of time, and can be easily peeled off from the member as needed, insulating property, heat dissipation property, and semiconductor chip. A heat-dissipating insulating paint that is excellent in adhesion to a member for a long period of time and can be easily peeled off from a member as required, an electronic component using the insulating paint or heat-dissipating insulating paint, and the heat dissipating insulating paint A semiconductor device can be provided.
１ 半導体装置
２ 放熱絶縁膜
３ 放熱部材
４ 半導体チップ
５ 電気的接続端子
６ 半導体用部材
DESCRIPTION OF
Claims (7)
前記半導体チップは、一方の面が該一方の面に設けられた電気的接続端子を介して前記半導体用部材と電気的に接続され、他方の面が該他方の面に設けられた請求項５記載の放熱絶縁塗料からなる放熱絶縁膜を介して前記放熱部材と接続されている
ことを特徴とする半導体装置。 A semiconductor device having a semiconductor chip, a semiconductor member, and a heat dissipation member,
6. The semiconductor chip, wherein one surface is electrically connected to the semiconductor member via an electrical connection terminal provided on the one surface, and the other surface is provided on the other surface. A semiconductor device, wherein the semiconductor device is connected to the heat radiating member via a heat radiating insulating film made of the heat radiating insulating paint described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007024398A JP2008189763A (en) | 2007-02-02 | 2007-02-02 | Insulation coating, heat-radiating insulation coating, electronic part and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007024398A JP2008189763A (en) | 2007-02-02 | 2007-02-02 | Insulation coating, heat-radiating insulation coating, electronic part and semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2008189763A true JP2008189763A (en) | 2008-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007024398A Pending JP2008189763A (en) | 2007-02-02 | 2007-02-02 | Insulation coating, heat-radiating insulation coating, electronic part and semiconductor device |
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| JP (1) | JP2008189763A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011162686A (en) * | 2010-02-10 | 2011-08-25 | Showa Denko Kk | Moisture-proof insulation coating for packaging circuit board, and electronic part |
| WO2012053483A1 (en) * | 2010-10-22 | 2012-04-26 | 昭和電工株式会社 | Moisture-proof insulating material |
| JP2012229414A (en) * | 2011-04-26 | 2012-11-22 | Chi Mei Corp | Moisture-proof insulation coating materal and use thereof |
| KR101211131B1 (en) | 2012-08-07 | 2012-12-18 | 이승욱 | Canning method of radiant heat paint of spray can |
| CN106318101A (en) * | 2015-06-30 | 2017-01-11 | 奇美实业股份有限公司 | moisture-proof insulating paint and application thereof |
| CN108883687A (en) * | 2016-03-30 | 2018-11-23 | 阿莫善斯有限公司 | Positive temperature coefficient unit for vehicle heater, the positive temperature coefficient heater and Vehicular air-conditioning apparatus including it |
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2007
- 2007-02-02 JP JP2007024398A patent/JP2008189763A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011162686A (en) * | 2010-02-10 | 2011-08-25 | Showa Denko Kk | Moisture-proof insulation coating for packaging circuit board, and electronic part |
| WO2012053483A1 (en) * | 2010-10-22 | 2012-04-26 | 昭和電工株式会社 | Moisture-proof insulating material |
| KR20130021416A (en) * | 2010-10-22 | 2013-03-05 | 쇼와 덴코 가부시키가이샤 | Moisture-proof insulating material |
| CN103068914A (en) * | 2010-10-22 | 2013-04-24 | 昭和电工株式会社 | Moisture-proof insulating material |
| JP5791623B2 (en) * | 2010-10-22 | 2015-10-07 | 昭和電工株式会社 | Moisture-proof insulation material |
| KR101587510B1 (en) * | 2010-10-22 | 2016-01-21 | 쇼와 덴코 가부시키가이샤 | Moisture-proof insulating material |
| JP2012229414A (en) * | 2011-04-26 | 2012-11-22 | Chi Mei Corp | Moisture-proof insulation coating materal and use thereof |
| TWI512060B (en) * | 2011-04-26 | 2015-12-11 | Chi Mei Corp | Moisture-proof and insulating coating material and uses thereof |
| KR101211131B1 (en) | 2012-08-07 | 2012-12-18 | 이승욱 | Canning method of radiant heat paint of spray can |
| CN106318101A (en) * | 2015-06-30 | 2017-01-11 | 奇美实业股份有限公司 | moisture-proof insulating paint and application thereof |
| CN108883687A (en) * | 2016-03-30 | 2018-11-23 | 阿莫善斯有限公司 | Positive temperature coefficient unit for vehicle heater, the positive temperature coefficient heater and Vehicular air-conditioning apparatus including it |
| CN108883687B (en) * | 2016-03-30 | 2021-07-27 | 阿莫善斯有限公司 | Positive temperature coefficient unit for vehicle heater, positive temperature coefficient heater including the same, and vehicle air conditioner |
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