JP2008150437A - Silicone rubber composition for sealing optical semiconductor and optical semiconductor apparatus - Google Patents

Silicone rubber composition for sealing optical semiconductor and optical semiconductor apparatus Download PDF

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JP2008150437A
JP2008150437A JP2006337654A JP2006337654A JP2008150437A JP 2008150437 A JP2008150437 A JP 2008150437A JP 2006337654 A JP2006337654 A JP 2006337654A JP 2006337654 A JP2006337654 A JP 2006337654A JP 2008150437 A JP2008150437 A JP 2008150437A
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optical semiconductor
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silicone rubber
rubber composition
sealing
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JP5138924B2 (en
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Koji Taiko
弘二 大皷
Nobuo Hirai
信男 平井
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Momentive Performance Materials Japan LLC
Momentive Performance Materials Inc
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Momentive Performance Materials Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To obtain a silicone rubber composition for sealing an optical semiconductor, which provides a cured product having excellent strength to molding pressure in sealing with a molding resin and is suitable as a sealant for an optical semiconductor and to provide an optical semiconductor apparatus. <P>SOLUTION: The silicone rubber composition for sealing an optical semiconductor comprises (A) a polyorganosiloxane containing ≥0.2 alkenyl group in one molecule on the average, (B) a polyorganohydrogensiloxane composed of (B1) a siloxane containing an SiH group in the middle of a molecular chain and (B2) a siloxane containing SiH groups at both molecular chain terminals, (C) a platinum-based catalyst in which the amount of the component (B) mixed is an amount to give the total of the SiH groups of the component (B) of 0.2-2.0 based on one alkenyl group of the component (A), the ratio of the SiH group of the component (B2) is 0.1-0.8 based on the total of the SiH groups of the component (B) and the amount of the SiH group of the component (B1) is 0.2-1.0 based on one alkenyl group of the component A and has hardness (type E) after curing of 5-50. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、例えば反射型フォトカプラの発光素子と受光素子等の光半導体素子の封止剤として好適な光半導体封止用シリコーンゴム組成物およびこれを用いた光半導体装置に関する。   The present invention relates to a silicone rubber composition for encapsulating an optical semiconductor suitable as an encapsulant for an optical semiconductor element such as a light emitting element and a light receiving element of a reflective photocoupler, and an optical semiconductor device using the same.

光半導体装置として知られるフォトカプラは、光半導体素子として発光素子と受光素子とを有し、発光素子側リードフレームにダイボンドした発光素子と、受光素子側リードフレームにダイボンドした受光素子とを透明なシリコーン樹脂で封止し、外部環境から保護するために、さらにこのシリコーン樹脂の周囲をエポキシ樹脂等のモールド樹脂で封止した構成である。これら発光素子と受光素子とを封止するシリコーン樹脂としては、付加反応硬化型のシリコーン組成物が使用されている（例えば、特許文献１参照）。   A photocoupler known as an optical semiconductor device has a light emitting element and a light receiving element as optical semiconductor elements, and transparently connects a light emitting element die-bonded to a light emitting element side lead frame and a light receiving element die bonded to a light receiving element side lead frame. In order to seal with a silicone resin and protect from the external environment, the periphery of the silicone resin is further sealed with a mold resin such as an epoxy resin. As a silicone resin for sealing the light emitting element and the light receiving element, an addition reaction curable silicone composition is used (for example, see Patent Document 1).

フォトカプラのなかでも、反射型フォトカプラは、発光素子と受光素子とを同一平面上に配置した構成であり、発光素子から出射した光をシリコーン樹脂の硬化物表面で反射させて受光素子で受光する。   Among photocouplers, a reflective photocoupler has a configuration in which a light emitting element and a light receiving element are arranged on the same plane, and the light emitted from the light emitting element is reflected on the surface of the cured silicone resin and received by the light receiving element. To do.

しかしながら、反射型フォトカプラの製造工程において、発光素子と受光素子に従来の付加反応硬化型シリコーン組成物を充填し、加熱して該組成物の硬化物を作成した後、この硬化物の外周を例えば射出成型等によりエポキシ樹脂等のモールド樹脂で封止した場合に、そのモールド圧力に対して、従来のシリコーン組成物ではその硬化物の強度が十分ではないため、硬化物の変形を招く。   However, in the manufacturing process of the reflective photocoupler, the light-emitting element and the light-receiving element are filled with a conventional addition reaction curable silicone composition and heated to form a cured product of the composition. For example, when sealing with a mold resin such as an epoxy resin by injection molding or the like, the strength of the cured product is not sufficient with the conventional silicone composition with respect to the mold pressure, and thus the cured product is deformed.

このため、シリコーン組成物の硬化物の変形によって、発光素子と受光素子との満足な光結合路を確保できず、光結合効率が低下し、得られる反射型フォトカプラの信頼性が低下する問題があった。
特開２００４−１４３３６１号公報 For this reason, due to the deformation of the cured product of the silicone composition, a satisfactory optical coupling path between the light emitting element and the light receiving element cannot be secured, the optical coupling efficiency is lowered, and the reliability of the obtained reflective photocoupler is lowered. was there.
JP 2004-143361 A

本発明の目的は、このような課題に対処するためになされたもので、外周をモールド樹脂で封止した場合のモールド圧力に対して優れた強度を備えた硬化物を与え、光半導体素子の封止剤として好適な光半導体封止用シリコーンゴム組成物および高信頼性の光半導体装置を提供することにある。   An object of the present invention is to address such problems, and provides a cured product having excellent strength against mold pressure when the outer periphery is sealed with a mold resin. An object of the present invention is to provide an optical semiconductor sealing silicone rubber composition and a highly reliable optical semiconductor device suitable as a sealing agent.

本発明者らは、上記目的を達成するために鋭意検討した結果、（Ｂ）成分として、（Ｂ１）直鎖状で、ケイ素原子結合水素原子（Ｓｉ−Ｈ基）を分子鎖途中に有するポリオルガノハイドロジェンシロキサンと、（Ｂ２）直鎖状で、Ｓｉ−Ｈ基を分子鎖両末端に有するポリオルガノハイドロジェンシロキサンとを特定量で併用して、硬化後の硬さを所定の範囲にすることにより、外周をモールド樹脂で封止した場合のモールド圧力に対して優れた強度を備えた硬化物を与える光半導体封止用シリコーンゴム組成物および光半導体装置が得られることを見出し、本発明をなすに至った。   As a result of intensive studies to achieve the above object, the inventors of the present invention have (B1) a straight-chain (B1) silicon atom-bonded hydrogen atom (Si-H group) as a component in the molecular chain. Use a specific amount of organohydrogensiloxane and (B2) linear organopolysiloxane having Si-H groups at both ends of the molecular chain to bring the hardness after curing to a predetermined range. Thus, it has been found that a silicone rubber composition for optical semiconductor encapsulation and an optical semiconductor device that give a cured product having excellent strength against mold pressure when the outer periphery is sealed with a mold resin can be obtained. It came to make.

すなわち、本発明の光半導体封止用シリコーンゴム組成物は、
（Ａ）２５℃における粘度が０．１〜１０００Ｐａ・ｓであり、１分子中にケイ素原子に結合したアルケニル基を平均０．２個以上有するポリオルガノシロキサン １００重量部、（Ｂ）
（Ｂ１）１分子中にケイ素原子に結合した水素原子を少なくとも２個有し、一般式：

Figure 2008150437
（式中、Ｒ１は脂肪族不飽和結合を除く同一または異なる置換または非置換の１価炭化水素基であり、Ｒ２は水素原子またはＲ１と同一であり、ｐ，ｑはｐ＋ｑは３〜５００の整数、かつ、０．２≦ｐ／（ｐ＋ｑ）≦１を満足する数。）で表されるシロキサン、及び
（Ｂ２）一般式：
Figure 2008150437
 （式中、Ｒ１は前記規定の通り、ｒは３〜３００の整数である。）で表されるシロキサンからなるポリオルガノハイドロジェンシロキサン （Ａ）成分のケイ素原子に結合したアルケニル基１個に対して（Ｂ）成分のケイ素原子に結合した水素原子の個数の総和が０．２〜２．０個となる量（但し、（Ｂ２）のケイ素原子に結合した水素原子の個数が（Ｂ）成分のケイ素原子に結合した水素原子の個数の総和に対して０．１〜０．８となる割合であり、かつ、（Ａ）成分のケイ素原子に結合したアルケニル基１個に対して（Ｂ１）のケイ素原子に結合した水素原子の個数が０．２〜１．０個となる量。）、
ならびに
（Ｃ）白金系触媒
を含有する光半導体封止用シリコーンゴム組成物であって、硬化後の硬さ（ＪＩＳ Ｋ ６２４９ タイプＥ）が、５〜５０であることを特徴とする。 That is, the silicone rubber composition for optical semiconductor encapsulation of the present invention is
(A) 100 parts by weight of a polyorganosiloxane having a viscosity of 0.1 to 1000 Pa · s at 25 ° C. and having an average of 0.2 or more alkenyl groups bonded to silicon atoms in one molecule, (B)
(B1) It has at least two hydrogen atoms bonded to silicon atoms in one molecule, and has the general formula:
Figure 2008150437
 (Wherein R 1 is the same or different substituted or unsubstituted monovalent hydrocarbon group excluding an aliphatic unsaturated bond, R 2 is the same as a hydrogen atom or R 1 , and p and q are p + q is 3 An integer of ˜500 and a number satisfying 0.2 ≦ p / (p + q) ≦ 1), and (B2) general formula:
Figure 2008150437
 (In the formula, R 1 is as defined above, r is an integer of 3 to 300). Polyorganohydrogensiloxane composed of siloxane represented by (A) One alkenyl group bonded to a silicon atom of component In contrast, the amount of the total number of hydrogen atoms bonded to the silicon atoms of component (B) is 0.2 to 2.0 (provided that the number of hydrogen atoms bonded to silicon atoms in (B2) is (B) The ratio is 0.1 to 0.8 with respect to the total number of hydrogen atoms bonded to the silicon atom of the component, and (B1) with respect to one alkenyl group bonded to the silicon atom of the component (A) ) In which the number of hydrogen atoms bonded to silicon atoms is 0.2 to 1.0.
And (C) a silicone rubber composition for sealing an optical semiconductor containing a platinum-based catalyst, wherein the hardness after curing (JIS K 6249 type E) is 5 to 50.

また、本発明の光半導体装置は、光半導体封止用シリコーンゴム組成物の硬化物によって光半導体素子が封止されていることを特徴とする。   The optical semiconductor device of the present invention is characterized in that the optical semiconductor element is sealed with a cured product of a silicone rubber composition for sealing an optical semiconductor.

上記構成によれば、外周をモールド樹脂で封止した場合のモールド圧力に対して優れた強度を備えた硬化物を与え、光半導体素子の封止剤として好適な光半導体封止用シリコーンゴム組成物および高信頼性の光半導体装置を提供することができる。   According to the said structure, the hardened | cured material provided with the intensity | strength excellent with respect to the mold pressure at the time of sealing an outer periphery with mold resin is given, The silicone rubber composition for optical semiconductor sealing suitable as a sealing agent of an optical semiconductor element And an optical semiconductor device with high reliability can be provided.

以下、本発明の光半導体封止用シリコーンゴム組成物について説明する。   Hereinafter, the silicone rubber composition for sealing an optical semiconductor of the present invention will be described.

［（Ａ）成分］
（Ａ）成分はベースポリマーであり、得られる組成物を十分に硬化させる上で、１分子中にケイ素原子に結合したアルケニル基を平均０．２個以上、好ましくは平均０．５個以上、より好ましくは平均２個以上有する。その分子構造は、直鎖状、環状、分岐鎖状のいずれでもよいが、硬化物のゴム物性の点から、直鎖状が好ましく、１種単独または２種以上を組み合わせてもよい。 [(A) component]
Component (A) is a base polymer, and in order to sufficiently cure the resulting composition, an average of 0.2 or more, preferably 0.5 or more, alkenyl groups bonded to silicon atoms in one molecule. More preferably, it has two or more on average. The molecular structure may be linear, cyclic, or branched, but is preferably linear from the viewpoint of rubber physical properties of the cured product, and may be used alone or in combination of two or more.

ケイ素原子に結合したアルケニル基としては、例えばビニル基、アリル基、ブテニル基、ペテニル基、ヘキセニル基などが例示され、好ましくはビニル基である。このアルケニル基は、分子鎖末端のケイ素原子に結合していても、分子鎖途中のケイ素原子に結合していても、両者に結合していてもよいが、得られる組成物の硬化速度、硬化後の物性の点から、少なくとも分子鎖末端のケイ素原子、特に、分子鎖両末端のケイ素原子に結合していることが好ましい。   Examples of the alkenyl group bonded to the silicon atom include a vinyl group, an allyl group, a butenyl group, a petenyl group, and a hexenyl group, and a vinyl group is preferable. The alkenyl group may be bonded to the silicon atom at the end of the molecular chain, or may be bonded to the silicon atom in the middle of the molecular chain, or may be bonded to both. From the standpoint of the later physical properties, it is preferable that it is bonded to at least the silicon atom at the molecular chain terminal, in particular, the silicon atom at both molecular chain terminals.

また、アルケニル基以外のケイ素原子に結合した有機基としては、例えばメチル基、エチル基、プロピル基等のアルキル基、シクロペンチル基、シクロヘキシル基等のシクロアルキル基、フェニル基、トリル基、キシリル基等のアリール基あるいはこれらの水素原子が部分的に塩素原子、フッ素原子などで置換されたハロゲン化炭化水素基などの、炭素原子数１〜１２個、好ましくは炭素原子数１〜８個のものが挙げられ、好ましくはアルキル基、アリール基であり、より好ましくはメチル基、フェニル基である。   Examples of organic groups bonded to silicon atoms other than alkenyl groups include alkyl groups such as methyl, ethyl and propyl groups, cycloalkyl groups such as cyclopentyl and cyclohexyl groups, phenyl groups, tolyl groups and xylyl groups. Having 1 to 12 carbon atoms, preferably 1 to 8 carbon atoms, such as aryl groups or halogenated hydrocarbon groups in which these hydrogen atoms are partially substituted with chlorine atoms, fluorine atoms, etc. Preferably an alkyl group and an aryl group, more preferably a methyl group and a phenyl group.

（Ａ）成分の２５℃における粘度は、０．１〜１０００Ｐａ・ｓ、好ましくは０．５〜１００Ｐａ・ｓである。粘度が０．１Ｐａ・ｓ未満であると、硬化後の機械的強度が低下しやすい。一方、１０００Ｐａ・ｓを超えると、得られる組成物の作業性が低下しやすい。   (A) The viscosity in 25 degreeC of a component is 0.1-1000 Pa.s, Preferably it is 0.5-100 Pa.s. When the viscosity is less than 0.1 Pa · s, the mechanical strength after curing tends to decrease. On the other hand, when it exceeds 1000 Pa · s, the workability of the obtained composition tends to be lowered.

［（Ｂ）成分］
（Ｂ）成分は架橋剤であり、本発明の特徴を付与する成分である。すなわち、外周をモールド樹脂で封止した場合のモールド圧力に対して硬化物が変形し難くなるような、所望の硬さを付与する成分である。 [Component (B)]
Component (B) is a crosslinking agent and is a component that imparts the characteristics of the present invention. That is, it is a component that imparts desired hardness such that the cured product is less likely to be deformed with respect to mold pressure when the outer periphery is sealed with mold resin.

（Ｂ）成分は、（Ｂ１）１分子中にケイ素原子に結合した水素原子を少なくとも２個有し、この水素原子が分子鎖途中のケイ素原子に結合する直鎖状のポリオルガノハイドロジェンシロキサン、及び（Ｂ２）水素原子が分子鎖両末端のケイ素原子に結合する直鎖状のポリオルガノハイドロジェンシロキサンからなる。   Component (B) is (B1) a linear polyorganohydrogensiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule, and these hydrogen atoms bonded to silicon atoms in the middle of the molecular chain, And (B2) a linear polyorganohydrogensiloxane in which hydrogen atoms are bonded to silicon atoms at both ends of the molecular chain.

（Ｂ１）は、１分子中にケイ素原子に結合した水素原子を少なくとも２個、好ましくは３個以上有し、一般式：

Figure 2008150437
で表されるポリオルガノハイドロジェンシロキサンである。 (B1) has at least 2, preferably 3 or more hydrogen atoms bonded to a silicon atom in one molecule, and has the general formula:
Figure 2008150437
 It is polyorganohydrogensiloxane represented by these.

式中、Ｒ１は脂肪族不飽和結合を除く同一または異なる置換または非置換の１価炭化水素基であり、例えばメチル基、エチル基、プロピル基等のアルキル基、シクロペンチル基、シクロヘキシル基等のシクロアルキル基、フェニル基、トリル基、キシリル基等のアリール基あるいはこれらの水素原子が部分的に塩素原子、フッ素原子などで置換されたハロゲン化炭化水素基などの、炭素原子数１〜１２個、好ましくは炭素原子数１〜８個のものが挙げられ、好ましくはアルキル基であり、合成のし易さ、コストの点から、より好ましくはメチル基である。 In the formula, R 1 is the same or different substituted or unsubstituted monovalent hydrocarbon group excluding an aliphatic unsaturated bond, such as an alkyl group such as a methyl group, an ethyl group, and a propyl group, a cyclopentyl group, a cyclohexyl group, etc. 1-12 carbon atoms, such as aryl groups such as cycloalkyl groups, phenyl groups, tolyl groups, xylyl groups, or halogenated hydrocarbon groups in which these hydrogen atoms are partially substituted by chlorine atoms, fluorine atoms, etc. The alkyl group is preferably an alkyl group, and more preferably a methyl group from the viewpoint of ease of synthesis and cost.

Ｒ２は水素原子またはＲ１と同一であり、好ましくはメチル基である。 R 2 is the same as a hydrogen atom or R 1 , and preferably a methyl group.

ｐ，ｑはｐ＋ｑは３〜５００、好ましくは１０〜３００の整数であり、かつ、０．２≦ｐ／（ｐ＋ｑ）≦１、好ましくは０．３≦ｐ／（ｐ＋ｑ）≦０．９を満足する数である。ｐ／（ｐ＋ｑ）が０．２未満であると、十分な架橋が得られない。なお、ｐ，ｑは、（Ｂ１）の一般式での組成、数値を示しているにすぎず、分子レベルを制限するものではない。   p and q are integers of p + q of 3 to 500, preferably 10 to 300, and 0.2 ≦ p / (p + q) ≦ 1, preferably 0.3 ≦ p / (p + q) ≦ 0.9. It is a satisfactory number. If p / (p + q) is less than 0.2, sufficient crosslinking cannot be obtained. Note that p and q merely indicate the composition and numerical value in the general formula (B1), and do not limit the molecular level.

一方、（Ｂ２）は、一般式：

Figure 2008150437
で表されるポリオルガノハイドロジェンシロキサンである。 On the other hand, (B2) is a general formula:
Figure 2008150437
 It is polyorganohydrogensiloxane represented by these.

式中、Ｒ１は脂肪族不飽和結合を除く同一または異なる置換または非置換の１価炭化水素基であり、（Ｂ１）で上述したとおりであり、好ましくはメチル基である。 In the formula, R 1 is the same or different substituted or unsubstituted monovalent hydrocarbon group excluding an aliphatic unsaturated bond, as described above for (B1), and preferably a methyl group.

ｒは３〜３００、好ましくは５〜２００の整数である。ｒが３未満であると、揮発し易くなり電子部品には不適である。一方、３００を超えると、得られる組成物の粘度が高くなり作業性が低下する。   r is an integer of 3 to 300, preferably 5 to 200. If r is less than 3, it tends to volatilize and is unsuitable for electronic components. On the other hand, when 300 is exceeded, the viscosity of the composition obtained will become high and workability | operativity will fall.

（Ｂ）成分の配合量は、（Ａ）成分のケイ素原子に結合したアルケニル基１個に対して、（Ｂ）成分のケイ素原子に結合した水素原子の個数の総和が０．２〜２．０個となる量、好ましくは０．４〜１．８となる量である。０．２個未満では、十分な架橋が得られない。一方、２個を越えると、未反応のＳｉ−Ｈ基が残存し、硬化後のゴム物性が不安定になりやすい。   The blending amount of the component (B) is such that the total number of hydrogen atoms bonded to the silicon atom of the component (B) is 0.2 to 2 with respect to one alkenyl group bonded to the silicon atom of the component (A). The amount is 0, preferably 0.4 to 1.8. If it is less than 0.2, sufficient crosslinking cannot be obtained. On the other hand, when the number exceeds 2, unreacted Si-H groups remain, and the rubber physical properties after curing tend to be unstable.

但し、（Ｂ２）のケイ素原子に結合した水素原子の個数は、（Ｂ）成分のケイ素原子に結合した水素原子の個数の総和（（Ｂ１）と（Ｂ２）との合計量）に対して０．１〜０．８となる割合、好ましくは０．２〜０．７となる割合である。   However, the number of hydrogen atoms bonded to silicon atoms in (B2) is 0 with respect to the total number of hydrogen atoms bonded to silicon atoms in component (B) (total amount of (B1) and (B2)). A ratio of 1 to 0.8, preferably a ratio of 0.2 to 0.7.

さらに、（Ｂ１）のケイ素原子に結合した水素原子の個数が、（Ａ）成分のケイ素原子に結合したアルケニル基１個に対して０．２〜１．０個となる量、好ましくは０．３〜０．９個となる量である。０．２個未満であると、硬化後、十分な硬さが得られ難くなるため、例えば反射型フォトカプラ等の製造工程で、モールド圧力に対して硬化物の強度が不十分となり、変形を起こしやすい。一方、１．０を越えると、硬化後、硬くなりすぎて、モールド樹脂への形状追随性が乏しく、例えば反射型フォトカプラが熱衝撃を受けた場合に生じる応力を緩和し難くなり、不良個数の増加を招く。   Further, the amount of hydrogen atoms bonded to the silicon atom of (B1) is 0.2 to 1.0 with respect to one alkenyl group bonded to the silicon atom of component (A), preferably 0.8. The amount is 3 to 0.9. If it is less than 0.2, it will be difficult to obtain sufficient hardness after curing. For example, in the production process of a reflective photocoupler, the strength of the cured product will be insufficient with respect to the mold pressure, causing deformation. Easy to wake up. On the other hand, if it exceeds 1.0, it becomes too hard after curing, and the shape following property to the mold resin is poor. For example, it becomes difficult to relieve the stress generated when the reflection type photocoupler is subjected to thermal shock. Increase.

［（Ｃ）成分］
（Ｃ）成分は、本組成物の硬化を促進させる成分である。 [Component (C)]
(C) component is a component which accelerates | stimulates hardening of this composition.

（Ｃ）成分としては、ヒドロシリル化反応に用いられる周知の触媒を使用することができる。例えば白金黒、塩化第２白金、塩化白金酸、塩化白金酸と１価アルコールとの反応物、塩化白金酸とオレフィン類やビニルシロキサンとの錯体、白金ビスアセトアセテート等が挙げられる。   As the component (C), a known catalyst used in hydrosilylation reaction can be used. For example, platinum black, secondary platinum chloride, chloroplatinic acid, a reaction product of chloroplatinic acid and a monohydric alcohol, a complex of chloroplatinic acid and olefins or vinyl siloxane, platinum bisacetoacetate, or the like can be given.

（Ｃ）成分の配合量は、硬化に必要な量であればよく、所望の硬化速度などに応じて適宜調整することができる。通常、得られる組成物の合計量に対し、白金元素に換算して０．１〜１０００ｐｐｍの範囲、好ましくは０．５〜５００ｐｐｍの範囲である。   The blending amount of the component (C) may be an amount necessary for curing, and can be appropriately adjusted according to a desired curing rate. Usually, it is in the range of 0.1 to 1000 ppm, preferably in the range of 0.5 to 500 ppm in terms of platinum element, based on the total amount of the composition obtained.

本発明の光半導体封止用シリコーンゴム組成物は、上記（Ａ）〜（Ｃ）の各成分を基本成分とし、これらに必要に応じて、その他任意成分として硬化速度を調整するための反応抑制剤、着色剤、難燃性付与剤、耐熱性向上剤、可塑剤、補強性シリカ、接着性付与剤等を本発明の目的を損なわない範囲で添加してもよい。   The silicone rubber composition for sealing an optical semiconductor of the present invention comprises the above components (A) to (C) as basic components, and if necessary, reaction suppression for adjusting the curing rate as other optional components. An agent, a colorant, a flame retardant, a heat resistance improver, a plasticizer, reinforcing silica, an adhesion promoter, and the like may be added as long as the object of the present invention is not impaired.

本発明の光半導体封止用シリコーンゴム組成物の製造方法としては、例えば（Ａ）〜（Ｃ）成分及びその他任意成分をプラネタリーミキサー、ニーダー、品川ミキサー等の混合機で混合する方法等が挙げられる。   As a manufacturing method of the silicone rubber composition for optical semiconductor sealing of this invention, the method etc. which mix (A)-(C) component and other arbitrary components with mixers, such as a planetary mixer, a kneader, and a Shinagawa mixer, etc., for example. Can be mentioned.

本発明の光半導体封止用シリコーンゴム組成物の粘度は、２５℃で０．１〜１０００Ｐａ・ｓ、好ましくは０．５〜１０００Ｐａ・ｓである。   The viscosity of the silicone rubber composition for sealing an optical semiconductor of the present invention is 0.1 to 1000 Pa · s, preferably 0.5 to 1000 Pa · s at 25 ° C.

本発明の光半導体封止用シリコーンゴム組成物の硬化方法は、該組成物を成形した後、室温で放置する方法や、５０〜２００℃で加熱する方法が挙げられるが、迅速に硬化させる上で、加熱する方法が好ましい。   Examples of the method for curing the silicone rubber composition for sealing an optical semiconductor of the present invention include a method of molding the composition and then allowing it to stand at room temperature and a method of heating at 50 to 200 ° C. And the method of heating is preferable.

硬化後の硬さ（ＪＩＳ Ｋ ６２４９ タイプＥ）は、５〜５０、好ましくは１０〜４０である。硬さが５未満であると、例えば反射型フォトカプラの製造工程において、硬化物の外周をモールド樹脂で樹脂封止する際に、モールド圧力に対して硬化物の強度が不十分であり、硬化物の変形を起こしやすい。一方、５０を越えると、モールド樹脂に対する形状追随性が得られない。   The hardness after curing (JIS K 6249 type E) is 5 to 50, preferably 10 to 40. When the hardness is less than 5, for example, in the manufacturing process of a reflective photocoupler, when the outer periphery of the cured product is resin-sealed with a mold resin, the strength of the cured product is insufficient with respect to the mold pressure, It is easy to cause deformation of things. On the other hand, if it exceeds 50, shape followability to the mold resin cannot be obtained.

硬化物はゴム状であり、モールド圧力に対する十分な強度と高い透明性を備えているため、発光素子と受光素子とを備えるフォトカプラのなかでも、モールド圧力に対して硬化物の形状を保持しにくい形態を有する、例えば反射型フォトカプラの発光素子、受光素子の封止剤として好適である。   The cured product is rubber-like and has sufficient strength against mold pressure and high transparency. Therefore, among photocouplers equipped with a light-emitting element and a light-receiving element, it maintains the shape of the cured product against the mold pressure. For example, it is suitable as a sealant for a light emitting element or a light receiving element of a reflective photocoupler having a difficult form.

次に、本発明の光半導体装置について図面を参照して説明する。図１は、本発明に係る光半導体装置の一例を示す断面図であり、反射型フォトカプラを示している。反射型フォトカプラ１は、発光素子２から出射し、上述した光半導体用シリコーンゴム組成物の硬化物４の表面で反射した光を受光素子３で受光する。   Next, the optical semiconductor device of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an example of an optical semiconductor device according to the present invention, and shows a reflective photocoupler. The reflective photocoupler 1 receives light emitted from the light emitting element 2 and reflected by the surface of the cured product 4 of the above-described silicone rubber composition for optical semiconductors by the light receiving element 3.

反射型フォトカプラ１は、発光素子２と受光素子３が、光半導体封止用シリコーンゴム組成物の硬化物４で封止され、さらにこの硬化物４がエポキシ樹脂等のモールド樹脂５で樹脂封止されている。   In the reflective photocoupler 1, the light emitting element 2 and the light receiving element 3 are sealed with a cured product 4 of a silicone rubber composition for sealing an optical semiconductor, and the cured product 4 is sealed with a mold resin 5 such as an epoxy resin. It has been stopped.

この反射型フォトカプラ１は、例えば以下のようにして作製される。   The reflection type photocoupler 1 is manufactured as follows, for example.

まず、発光素子側リードフレーム６にダイボンドされた発光素子２と、受光素子側リードフレーム７にダイボンドされた受光素子３とを、光半導体封止用シリコーンゴム組成物で充填した後、例えば１５０℃で１時間加熱して硬化させ、硬化物４を形成する。   First, after filling the light-emitting element 2 die-bonded to the light-emitting element-side lead frame 6 and the light-receiving element 3 die-bonded to the light-receiving element-side lead frame 7 with a silicone rubber composition for optical semiconductor sealing, for example, 150 ° C. And cured by heating for 1 hour to form a cured product 4.

次に、トランスファー成形、射出成形、圧縮成形等の公知の成形方法により、硬化物４の外周を透明なエポキシ樹脂等のモールド樹脂５で封止する。   Next, the outer periphery of the cured product 4 is sealed with a mold resin 5 such as a transparent epoxy resin by a known molding method such as transfer molding, injection molding, or compression molding.

このようにして得られる反射型フォトカプラ１は、硬化物４がモールド圧力に対して変形し難いため、発光素子２と受光素子３との満足な光結合路を確保でき、高光結合効率が得られ、信頼性に優れた反射型フォトカプラ１を提供できる。   In the reflection type photocoupler 1 obtained in this way, since the cured product 4 is not easily deformed with respect to the mold pressure, a satisfactory optical coupling path between the light emitting element 2 and the light receiving element 3 can be secured, and high optical coupling efficiency is obtained. Therefore, the reflection type photocoupler 1 having excellent reliability can be provided.

なお、上記実施形態では、光半導体装置の一例として反射型フォトカプラを用いて説明したが、これ以外に、外周をモールド樹脂で封止した場合のモールド圧力に対して変形しやすい形態を有するような光半導体装置にも、本発明の光半導体封止用シリコーンゴム組成物を適用することができる。   In the above embodiment, the reflection type photocoupler has been described as an example of the optical semiconductor device. However, other than this, the outer periphery is easily deformed with respect to the mold pressure when the outer periphery is sealed with the mold resin. The silicone rubber composition for sealing an optical semiconductor of the present invention can also be applied to such an optical semiconductor device.

本発明を実施例により詳細に説明するが、本発明は実施例に限定されるものではない。実施例及び比較例で得られた光半導体封止用シリコーンゴム組成物は、以下のようにして評価し、結果を表１に示した。表１に示した特性は、２５℃において測定した値である。   Examples The present invention will be described in detail by examples, but the present invention is not limited to the examples. The silicone rubber compositions for sealing an optical semiconductor obtained in Examples and Comparative Examples were evaluated as follows, and the results are shown in Table 1. The characteristics shown in Table 1 are values measured at 25 ° C.

［硬化後の硬さ］
得られた組成物を６ｍｍ厚の金型に充填し、１５０℃で１時間加熱硬化させて厚さ６ｍｍのシリコーンゴムシートを作製し、ＪＩＳ Ｋ ６２４９ タイプＥに準拠して測定した。 [Hardness after curing]
The obtained composition was filled into a 6 mm-thick mold and cured by heating at 150 ° C. for 1 hour to produce a 6 mm-thick silicone rubber sheet, and measured according to JIS K 6249 type E.

［硬化後の切断時伸び］
得られた光半導体封止用シリコーンゴム組成物を２ｍｍ厚の金型に充填し、１５０℃で１時間加熱硬化させ、厚さ２ｍｍのシリコーンゴムシートを用いて、ＪＩＳ Ｋ ６２４９に準じて、測定した。 [Elongation at cutting after curing]
The obtained silicone rubber composition for encapsulating an optical semiconductor was filled in a 2 mm thick mold, heated and cured at 150 ° C. for 1 hour, and measured according to JIS K 6249 using a 2 mm thick silicone rubber sheet. did.

［反射型フォトカプラの信頼性評価］
図１で示した反射型フォトカプラ１を次のようにして作製した。すなわち、発光素子側リードフレーム６と受光素子側リードフレーム７にそれぞれダイボンドされた発光素子２と受光素子３を光半導体封止用シリコーンゴム組成物で充填した後、１５０℃で１時間加熱して硬化物４を形成した。続けて、射出成型により、硬化物４の外周をモールド樹脂５（透明エポキシ樹脂）で封止した。
このようにして１０個の反射型フォトカプラを作製した。これらの反射型フォトカプラについて、冷熱サイクル試験（１サイクル：−４０℃×３０分＋１５０℃×３０分）を１０００サイクル行った。冷熱サイクル試験後の硬化物４を１００倍の顕微鏡（ＫＨ−７０００、ＫＥＹＥＮＣＥ社製）を用いて観察した。硬化物４に割れのある反射型フォトカプラを不良とし、その不良個数を調べて不良率を算出した。 [Reliability evaluation of reflective photocouplers]
The reflective photocoupler 1 shown in FIG. 1 was produced as follows. That is, the light-emitting element 2 and the light-receiving element 3 die-bonded to the light-emitting element-side lead frame 6 and the light-receiving element-side lead frame 7 are filled with the silicone rubber composition for sealing an optical semiconductor, and then heated at 150 ° C. for 1 hour. A cured product 4 was formed. Subsequently, the outer periphery of the cured product 4 was sealed with a mold resin 5 (transparent epoxy resin) by injection molding.
In this way, 10 reflective photocouplers were produced. These reflective photocouplers were subjected to 1000 cycles of a thermal cycle test (1 cycle: −40 ° C. × 30 minutes + 150 ° C. × 30 minutes). The cured product 4 after the cooling and heating cycle test was observed using a 100 × microscope (KH-7000, manufactured by KEYENCE). A reflection type photocoupler having a crack in the cured product 4 was regarded as defective, the number of defects was examined, and the defect rate was calculated.

［実施例１］
（Ａ）２５℃における粘度が３Ｐａ・ｓであり、式：
［（ＣＨ２＝ＣＨ）（ＣＨ３）２ＳｉＯ１／２］［（Ｃ６Ｈ５）２ＳｉＯ２／２］１３［（ＣＨ３）２ＳｉＯ２／２］２４７［（ＣＨ２＝ＣＨ）（ＣＨ３）２ＳｉＯ１／２］
で表されるビニル基含有ポリオルガノシロキサン１００重量部、（Ｂ１）式：
［（ＣＨ３）３ＳｉＯ１／２］［（ＣＨ３）ＨＳｉＯ２／２］２０［（ＣＨ３）２ＳｉＯ２／２］２０［（ＣＨ３）３ＳｉＯ１／２］
で表されるポリオルガノハイドロジェンシロキサン０．５８重量部、（Ｂ２）式：
［（ＣＨ３）２ＨＳｉＯ１／２］［（ＣＨ３）２ＳｉＯ２／２］２０［（ＣＨ３）２ＨＳｉＯ１／２］
で表されるポリオルガノハイドロジェンシロキサン４．９４重量部、（Ｃ）塩化白金酸のビニルシロキサン錯体（白金元素換算）５ｐｐｍ、１‐エチニル‐１‐シクロヘキサノール０．１重量部を混合して、光半導体封止用シリコーンゴム組成物を得た。
この組成物の特性を測定し、結果を表１に示した。 [Example 1]
(A) The viscosity at 25 ° C. is 3 Pa · s, and the formula:
[(CH 2 = CH) (CH 3 ) 2 SiO 1/2 ] [(C 6 H 5 ) 2 SiO 2/2 ] 13 [(CH 3 ) 2 SiO 2/2 ] 247 [(CH 2 = CH) (CH 3 ) 2 SiO 1/2 ]
100 parts by weight of a vinyl group-containing polyorganosiloxane represented by formula (B1):
[(CH 3 ) 3 SiO 1/2 ] [(CH 3 ) HSiO 2/2 ] 20 [(CH 3 ) 2 SiO 2/2 ] 20 [(CH 3 ) 3 SiO 1/2 ]
0.58 parts by weight of polyorganohydrogensiloxane represented by formula (B2):
[(CH 3 ) 2 HSiO 1/2 ] [(CH 3 ) 2 SiO 2/2 ] 20 [(CH 3 ) 2 HSiO 1/2 ]
And (C) vinyl siloxane complex of chloroplatinic acid (in terms of platinum element) 5 ppm, 1-ethynyl-1-cyclohexanol 0.1 part by weight, A silicone rubber composition for sealing an optical semiconductor was obtained.
The properties of this composition were measured and the results are shown in Table 1.

［実施例２］
（Ａ）２５℃における粘度が３Ｐａ・ｓであり、式：
［（ＣＨ２＝ＣＨ）（ＣＨ３）２ＳｉＯ１／２］［（Ｃ６Ｈ５）２ＳｉＯ２／２］１３［（ＣＨ３）２ＳｉＯ２／２］２４７［（ＣＨ２＝ＣＨ）（ＣＨ３）２ＳｉＯ１／２］
で表されるビニル基含有ポリオルガノシロキサン１００重量部、（Ｂ１）式：
［（ＣＨ３）３ＳｉＯ１／２］［（ＣＨ３）ＨＳｉＯ２／２］２０［（ＣＨ３）２ＳｉＯ２／２］２０［（ＣＨ３）３ＳｉＯ１／２］
で表されるポリオルガノハイドロジェンシロキサン０．８８重量部、（Ｂ２）式：
［（ＣＨ３）２ＨＳｉＯ１／２］［（ＣＨ３）２ＳｉＯ２／２］２０［（ＣＨ３）２ＨＳｉＯ１／２］
で表されるポリオルガノハイドロジェンシロキサン４．２９重量部、（Ｃ）塩化白金酸のビニルシロキサン錯体（白金元素換算）５ｐｐｍ、１‐エチニル‐１‐シクロヘキサノール０．１重量部を混合して、光半導体封止用シリコーンゴム組成物を得た。
この組成物の特性を測定し、結果を表１に示した。 [Example 2]
(A) The viscosity at 25 ° C. is 3 Pa · s, and the formula:
[(CH 2 = CH) (CH 3 ) 2 SiO 1/2 ] [(C 6 H 5 ) 2 SiO 2/2 ] 13 [(CH 3 ) 2 SiO 2/2 ] 247 [(CH 2 = CH) (CH 3 ) 2 SiO 1/2 ]
100 parts by weight of a vinyl group-containing polyorganosiloxane represented by formula (B1):
[(CH 3 ) 3 SiO 1/2 ] [(CH 3 ) HSiO 2/2 ] 20 [(CH 3 ) 2 SiO 2/2 ] 20 [(CH 3 ) 3 SiO 1/2 ]
0.88 parts by weight of a polyorganohydrogensiloxane represented by formula (B2):
[(CH 3 ) 2 HSiO 1/2 ] [(CH 3 ) 2 SiO 2/2 ] 20 [(CH 3 ) 2 HSiO 1/2 ]
4.29 parts by weight of a polyorganohydrogensiloxane represented by the following formula: (C) 5 ppm of a vinyl siloxane complex of chloroplatinic acid (in terms of platinum element), 0.1 part by weight of 1-ethynyl-1-cyclohexanol, A silicone rubber composition for sealing an optical semiconductor was obtained.
The properties of this composition were measured and the results are shown in Table 1.

［比較例１］
（Ａ）２５℃における粘度が３Ｐａ・ｓであり、式：
［（ＣＨ２＝ＣＨ）（ＣＨ３）２ＳｉＯ１／２］［（Ｃ６Ｈ５）２ＳｉＯ２／２］１３［（ＣＨ３）２ＳｉＯ２／２］２４７［（ＣＨ２＝ＣＨ）（ＣＨ３）２ＳｉＯ１／２］
で表されるビニル基含有ポリオルガノシロキサン１００重量部、（Ｂ１）式：
［（ＣＨ３）３ＳｉＯ１／２］［（ＣＨ３）ＨＳｉＯ２／２］２０［（ＣＨ３）２ＳｉＯ２／２］２０［（ＣＨ３）３ＳｉＯ１／２］
で表されるポリオルガノハイドロジェンシロキサン０．２５重量部、（Ｂ２）式：
［（ＣＨ３）２ＨＳｉＯ１／２］［（ＣＨ３）２ＳｉＯ２／２］２０［（ＣＨ３）２ＨＳｉＯ１／２］
で表されるポリオルガノハイドロジェンシロキサン４．９４重量部、（Ｃ）塩化白金酸のビニルシロキサン錯体（白金元素換算）５ｐｐｍ、１‐エチニル‐１‐シクロヘキサノール０．１重量部を混合して、光半導体封止用シリコーンゴム組成物を得た。
この組成物の特性を測定し、結果を表１に示した。 [Comparative Example 1]
(A) The viscosity at 25 ° C. is 3 Pa · s, and the formula:
[(CH 2 = CH) (CH 3 ) 2 SiO 1/2 ] [(C 6 H 5 ) 2 SiO 2/2 ] 13 [(CH 3 ) 2 SiO 2/2 ] 247 [(CH 2 = CH) (CH 3 ) 2 SiO 1/2 ]
100 parts by weight of a vinyl group-containing polyorganosiloxane represented by formula (B1):
[(CH 3 ) 3 SiO 1/2 ] [(CH 3 ) HSiO 2/2 ] 20 [(CH 3 ) 2 SiO 2/2 ] 20 [(CH 3 ) 3 SiO 1/2 ]
0.25 parts by weight of polyorganohydrogensiloxane represented by formula (B2):
[(CH 3 ) 2 HSiO 1/2 ] [(CH 3 ) 2 SiO 2/2 ] 20 [(CH 3 ) 2 HSiO 1/2 ]
4 parts by weight of a polyorganohydrogensiloxane represented by the following formula: (C) 5 ppm of a vinyl siloxane complex of chloroplatinic acid (in terms of platinum element), 0.1 part by weight of 1-ethynyl-1-cyclohexanol, A silicone rubber composition for sealing an optical semiconductor was obtained.
The properties of this composition were measured and the results are shown in Table 1.

［比較例２］
（Ａ）２５℃における粘度が３Ｐａ・ｓであり、式：
［（ＣＨ２＝ＣＨ）（ＣＨ３）２ＳｉＯ１／２］［（Ｃ６Ｈ５）２ＳｉＯ２／２］１３［（ＣＨ３）２ＳｉＯ２／２］２４７［（ＣＨ２＝ＣＨ）（ＣＨ３）２ＳｉＯ１／２］
で表されるビニル基含有ポリオルガノシロキサン１００重量部、（Ｂ１）式：
［（ＣＨ３）３ＳｉＯ１／２］［（ＣＨ３）ＨＳｉＯ２／２］２０［（ＣＨ３）２ＳｉＯ２／２］２０［（ＣＨ３）３ＳｉＯ１／２］
で表されるポリオルガノハイドロジェンシロキサン１．３５重量部、（Ｂ２）式：
［（ＣＨ３）２ＨＳｉＯ１／２］［（ＣＨ３）２ＳｉＯ２／２］２０［（ＣＨ３）２ＨＳｉＯ１／２］
で表されるポリオルガノハイドロジェンシロキサン４．２９重量部、（Ｃ）塩化白金酸のビニルシロキサン錯体（白金元素換算）５ｐｐｍ、１‐エチニル‐１‐シクロヘキサノール０．１重量部を混合して、光半導体封止用シリコーンゴム組成物を得た。
この組成物の特性を測定し、結果を表１に示した。 [Comparative Example 2]
(A) The viscosity at 25 ° C. is 3 Pa · s, and the formula:
[(CH 2 = CH) (CH 3 ) 2 SiO 1/2 ] [(C 6 H 5 ) 2 SiO 2/2 ] 13 [(CH 3 ) 2 SiO 2/2 ] 247 [(CH 2 = CH) (CH 3 ) 2 SiO 1/2 ]
100 parts by weight of a vinyl group-containing polyorganosiloxane represented by formula (B1):
[(CH 3 ) 3 SiO 1/2 ] [(CH 3 ) HSiO 2/2 ] 20 [(CH 3 ) 2 SiO 2/2 ] 20 [(CH 3 ) 3 SiO 1/2 ]
1.35 parts by weight of polyorganohydrogensiloxane represented by formula (B2):
[(CH 3 ) 2 HSiO 1/2 ] [(CH 3 ) 2 SiO 2/2 ] 20 [(CH 3 ) 2 HSiO 1/2 ]
4.29 parts by weight of a polyorganohydrogensiloxane represented by the following formula: (C) 5 ppm of a vinyl siloxane complex of chloroplatinic acid (in terms of platinum element), 0.1 part by weight of 1-ethynyl-1-cyclohexanol, A silicone rubber composition for sealing an optical semiconductor was obtained.
The properties of this composition were measured and the results are shown in Table 1.

［比較例３］
（Ａ）２５℃における粘度が３Ｐａ・ｓであり、式：
［（ＣＨ２＝ＣＨ）（ＣＨ３）２ＳｉＯ１／２］［（Ｃ６Ｈ５）２ＳｉＯ２／２］１３［（ＣＨ３）２ＳｉＯ２／２］２４７［（ＣＨ２＝ＣＨ）（ＣＨ３）２ＳｉＯ１／２］
で表されるビニル基含有ポリオルガノシロキサン１００重量部、（Ｂ１）式：
［（ＣＨ３）３ＳｉＯ１／２］［（ＣＨ３）ＨＳｉＯ２／２］２０［（ＣＨ３）２ＳｉＯ２／２］２０［（ＣＨ３）３ＳｉＯ１／２］
で表されるポリオルガノハイドロジェンシロキサン０．１９重量部、（Ｂ２）式：
［（ＣＨ３）２ＨＳｉＯ１／２］［（ＣＨ３）２ＳｉＯ２／２］２０［（ＣＨ３）２ＨＳｉＯ１／２］
で表されるポリオルガノハイドロジェンシロキサン６．１７重量部、（Ｃ）塩化白金酸のビニルシロキサン錯体（白金元素換算）５ｐｐｍ、１‐エチニル‐１‐シクロヘキサノール０．１重量部を混合して、光半導体封止用シリコーンゴム組成物を得た。
この組成物の特性を測定し、結果を表１に示した。

Figure 2008150437
[Comparative Example 3]
(A) The viscosity at 25 ° C. is 3 Pa · s, and the formula:
[(CH 2 = CH) (CH 3 ) 2 SiO 1/2 ] [(C 6 H 5 ) 2 SiO 2/2 ] 13 [(CH 3 ) 2 SiO 2/2 ] 247 [(CH 2 = CH) (CH 3 ) 2 SiO 1/2 ]
100 parts by weight of a vinyl group-containing polyorganosiloxane represented by formula (B1):
[(CH 3 ) 3 SiO 1/2 ] [(CH 3 ) HSiO 2/2 ] 20 [(CH 3 ) 2 SiO 2/2 ] 20 [(CH 3 ) 3 SiO 1/2 ]
0.19 part by weight of a polyorganohydrogensiloxane represented by formula (B2):
[(CH 3 ) 2 HSiO 1/2 ] [(CH 3 ) 2 SiO 2/2 ] 20 [(CH 3 ) 2 HSiO 1/2 ]
6.17 parts by weight of a polyorganohydrogensiloxane represented by the following formula: (C) 5 ppm of a vinyl siloxane complex of chloroplatinic acid (in terms of platinum element), 0.1 part by weight of 1-ethynyl-1-cyclohexanol, A silicone rubber composition for sealing an optical semiconductor was obtained.
The properties of this composition were measured and the results are shown in Table 1.
Figure 2008150437

表１から明らかなように、（Ｂ）成分として（Ｂ１）直鎖状で、ケイ素原子に結合した水素原子（Ｓｉ−Ｈ基）を分子鎖途中に有するポリオルガノハイドロジェンシロキサンと、（Ｂ２）直鎖状で、Ｓｉ−Ｈ基を分子鎖両末端に有するポリオルガノハイドロジェンシロキサンとを、（Ｂ１）のＳｉ−Ｈ基が、（Ａ）成分のアルケニル基１個に対して０．２〜１．０個となる量であり、かつ、（Ｂ１）と（Ｂ２）のＳｉ−Ｈ基の総和に対して（Ｂ２）のＳｉ−Ｈ基が０．１〜０．８となる割合で併用した各実施例は、硬化後の硬さ（タイプＥ）が５〜５０の範囲であり、モールド圧力に対して優れた強度を発揮する硬化物が得られ、硬化物の形状を良好に保持できる。   As is clear from Table 1, as the component (B), (B1) a polyorganohydrogensiloxane having a straight chain and a hydrogen atom (Si-H group) bonded to a silicon atom in the middle of the molecular chain, and (B2) A polyorganohydrogensiloxane that is linear and has Si—H groups at both ends of the molecular chain, wherein the Si—H group of (B1) is 0.2 to 1 alkenyl group of component (A). It is the quantity which becomes 1.0, and it uses together in the ratio from which the Si-H group of (B2) becomes 0.1-0.8 with respect to the sum total of the Si-H group of (B1) and (B2) In each of the examples, the hardness after curing (type E) is in the range of 5 to 50, and a cured product exhibiting excellent strength against mold pressure can be obtained, and the shape of the cured product can be maintained well. .

したがって、本発明の光半導体封止用シリコーンゴム組成物は、モールド圧力に対する十分な強度を備えているため、例えば反射型フォトカプラの発光素子および受光素子などの光半導体素子の封止剤として好適である。   Therefore, the silicone rubber composition for sealing an optical semiconductor of the present invention has a sufficient strength against the molding pressure, and is therefore suitable as a sealing agent for an optical semiconductor element such as a light emitting element and a light receiving element of a reflective photocoupler. It is.

本発明の光半導体装置の構成の一例を模式的に示す断面図。Sectional drawing which shows typically an example of a structure of the optical semiconductor device of this invention.

符号の説明Explanation of symbols

１…反射型フォトカプラ、２…発光素子、３…受光素子、４…光半導体封止用シリコーンゴム組成物の硬化物、５…モールド樹脂、６…発光素子側リードフレーム、７…受光素子側リードフレーム。   DESCRIPTION OF SYMBOLS 1 ... Reflective type photocoupler, 2 ... Light emitting element, 3 ... Light receiving element, 4 ... Hardened | cured material of silicone rubber composition for optical semiconductor sealing, 5 ... Mold resin, 6 ... Light emitting element side lead frame, 7 ... Light receiving element side Lead frame.

Claims (4)

（Ａ）２５℃における粘度が０．１〜１０００Ｐａ・ｓであり、１分子中にケイ素原子に結合したアルケニル基を平均０．２個以上有するポリオルガノシロキサン １００重量部、（Ｂ）
（Ｂ１）１分子中にケイ素原子に結合した水素原子を少なくとも２個有し、一般式：
Figure 2008150437
 （式中、Ｒ１は脂肪族不飽和結合を除く同一または異なる置換または非置換の１価炭化水素基であり、Ｒ２は水素原子またはＲ１と同一であり、ｐ，ｑはｐ＋ｑは３〜５００の整数、かつ、０．２≦ｐ／（ｐ＋ｑ）≦１を満足する数。）で表されるシロキサン、及び
（Ｂ２）一般式：
Figure 2008150437
 （式中、Ｒ１は前記規定の通り、ｒは３〜３００の整数である。）で表されるシロキサンからなるポリオルガノハイドロジェンシロキサン （Ａ）成分のケイ素原子に結合したアルケニル基１個に対して（Ｂ）成分のケイ素原子に結合した水素原子の個数の総和が０．２〜２．０個となる量（但し、（Ｂ２）のケイ素原子に結合した水素原子の個数が（Ｂ）成分のケイ素原子に結合した水素原子の個数の総和に対して０．１〜０．８となる割合であり、かつ、（Ａ）成分のケイ素原子に結合したアルケニル基１個に対して（Ｂ１）のケイ素原子に結合した水素原子の個数が０．２〜１．０個となる量。）、
ならびに
（Ｃ）白金系触媒
を含有する光半導体封止用シリコーンゴム組成物であって、
硬化後の硬さ（ＪＩＳ Ｋ ６２４９ タイプＥ）が、５〜５０であることを特徴とする光半導体封止用シリコーンゴム組成物。 (A) 100 parts by weight of a polyorganosiloxane having a viscosity of 0.1 to 1000 Pa · s at 25 ° C. and having an average of 0.2 or more alkenyl groups bonded to silicon atoms in one molecule, (B)
(B1) It has at least two hydrogen atoms bonded to silicon atoms in one molecule, and has the general formula:
Figure 2008150437
 (Wherein R 1 is the same or different substituted or unsubstituted monovalent hydrocarbon group excluding an aliphatic unsaturated bond, R 2 is the same as a hydrogen atom or R 1 , and p and q are p + q is 3 An integer of ˜500 and a number satisfying 0.2 ≦ p / (p + q) ≦ 1), and (B2) general formula:
Figure 2008150437
 (In the formula, R 1 is as defined above, r is an integer of 3 to 300). Polyorganohydrogensiloxane composed of siloxane represented by (A) One alkenyl group bonded to a silicon atom of component In contrast, the amount of the total number of hydrogen atoms bonded to the silicon atoms of component (B) is 0.2 to 2.0 (provided that the number of hydrogen atoms bonded to silicon atoms in (B2) is (B) The ratio is 0.1 to 0.8 with respect to the total number of hydrogen atoms bonded to the silicon atom of the component, and (B1) with respect to one alkenyl group bonded to the silicon atom of the component (A) ) In which the number of hydrogen atoms bonded to silicon atoms is 0.2 to 1.0.
And (C) a silicone rubber composition for sealing an optical semiconductor containing a platinum-based catalyst,
A silicone rubber composition for sealing an optical semiconductor, wherein the hardness after curing (JIS K 6249 type E) is 5 to 50. 請求項１に記載の光半導体封止用シリコーンゴム組成物の硬化物によって光半導体素子が封止されていることを特徴とする光半導体装置。   An optical semiconductor device, wherein an optical semiconductor element is sealed with a cured product of the silicone rubber composition for sealing an optical semiconductor according to claim 1. 前記光半導体素子が、発光素子と受光素子からなることを特徴とする請求項２に記載の光半導体装置。   The optical semiconductor device according to claim 2, wherein the optical semiconductor element includes a light emitting element and a light receiving element. 前記発光素子から出射した光を、前記光半導体用シリコーンゴム組成物の硬化物表面で反射させて前記受光素子で受光する反射型フォトカプラであることを特徴とする請求項３に記載の光半導体装置。   4. The optical semiconductor according to claim 3, wherein the optical semiconductor is a reflective photocoupler that reflects light emitted from the light emitting element on the surface of the cured product of the silicone rubber composition for optical semiconductors and receives the light by the light receiving element. 5. apparatus.
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