JP2008103773A - Heat dissipation fin - Google Patents

Heat dissipation fin Download PDF

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JP2008103773A
JP2008103773A JP2008008308A JP2008008308A JP2008103773A JP 2008103773 A JP2008103773 A JP 2008103773A JP 2008008308 A JP2008008308 A JP 2008008308A JP 2008008308 A JP2008008308 A JP 2008008308A JP 2008103773 A JP2008103773 A JP 2008103773A
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carbon fiber
base material
temporary
metal
heat
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Hiromoto Uchida
浩基 内田
Eiji Tokuhira
英士 徳平
Minoru Ishinabe
稔 石鍋
Hitoaki Date
仁昭 伊達
Atsushi Taniguchi
淳 谷口
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Fujitsu Ltd
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Fujitsu Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipation fin having a high cooling performance, of which the mechanical bonding between a carbon fiber and a base material is stiff. <P>SOLUTION: Metal plating (electroless Cu plating) is performed (a), (b) on a plurality of carbon fibers 2. The carbon fiber 2 having a metal plate layer 3 (Cu plating layer) is vertically stood on a plate like temporary base material 11 with electrostatic flocking for temporary bonding (c), (d) one end of the carbon fiber 2 on the temporary base material 11 by an adhesive 12. The carbon fiber 2 and a base member 1 are brazed (soldering) (e), (f) by contacting another end of the temporary adhered carbon fiber 2 to the base material 1 (Cu plate) applied with a solder paste 13 thereon, and melting and cooling the brazing material (solder). The heat dissipation fin 10 is formed (g) by immersing the base material 1 and the carbon fiber 2 into an organic solvent after the mechanical and thermal bonding of the base material 1 and the carbon fiber 2 are completed, and by peeling off the temporary bonded temporary base material 11 form the carbon fiber 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、コンピュータのＣＰＵチップ等の電子部品が発する熱を空気中に放散する放熱フィンに関し、特に、フィンとして炭素繊維製のピンフィンを用いた放熱フィンに関する。   The present invention relates to a heat radiating fin that radiates heat generated by an electronic component such as a CPU chip of a computer into the air, and more particularly, to a heat radiating fin using a pin fin made of carbon fiber as a fin.

近年の電子機器では、高集積化、高速化などにより電子部品の発熱量が著しく多くなっており、電子部品から発生する熱を効率良く外部へ放散する必要がある。電子部品からの熱を空気中に効率良く放散するためには、放熱面積を増加させることが有効である。放熱面積を増加させた例として、例えば電子機器の冷却構造として用いられている放熱フィンが知られている。   In recent electronic devices, the amount of heat generated by electronic components is remarkably increased due to high integration and high speed, and it is necessary to efficiently dissipate heat generated from the electronic components to the outside. In order to efficiently dissipate heat from the electronic components into the air, it is effective to increase the heat dissipation area. As an example in which the heat radiation area is increased, for example, a heat radiation fin used as a cooling structure for an electronic device is known.

放熱フィンは、熱伝導率が高い金属にて作製され、放熱フィンの表面に送風ファンから空気を送出して、冷却機能を発揮する。放熱フィンは、低コストでの製造が可能なアルミダイキャスト製品であることが多い。しかしながら、アルミダイキャスト製品である場合、金型から引き抜き易くするために、フィンのピッチ及び厚さを細かくできない。また、その他の材料による放熱フィンの場合にもアルミダイキャスト製品と同様に、製造面及びコスト面の観点から放熱面積の拡大には限界があり、冷却性能の向上を図る上での障害となっている。   The radiating fin is made of a metal having high thermal conductivity, and air is sent from the blower fan to the surface of the radiating fin to exert a cooling function. The heat radiating fins are often aluminum die cast products that can be manufactured at low cost. However, in the case of an aluminum die cast product, the pitch and thickness of the fins cannot be made fine in order to make it easy to pull out from the mold. Also, in the case of heat radiating fins made of other materials, as with aluminum die-cast products, there is a limit to the expansion of the heat radiating area from the viewpoint of manufacturing and cost, which is an obstacle to improving cooling performance. ing.

以上のように、電子部品からの熱を効率良く空気中に放散するためには、放熱フィンが高い熱伝導率と大きな放熱面積とを有することが望ましい。これらの性能を満たすために、炭素繊維製のピンフィンを持つ放熱フィンが提案されている（例えば、特許文献１参照）。この放熱フィンは、複数の炭素繊維を被植毛金属基材にロウ付けした構成をなしている。また、この放熱フィンの製造方法は以下の通りである。まず、シート状の仮植毛基材に接着剤を塗布し、炭素繊維を植毛して仮植毛基体を形成する。次いで、仮植毛基材に植毛した炭素繊維の先端と被植毛金属基材とを金属製のロウ材を介して固定し、仮植毛基体の炭素繊維を被植毛金属基材に転写固着する。
特開平８−３０３９７８号公報 As described above, in order to efficiently dissipate the heat from the electronic component into the air, it is desirable that the radiating fins have a high thermal conductivity and a large radiating area. In order to satisfy these performances, a heat dissipating fin having a pin fin made of carbon fiber has been proposed (see, for example, Patent Document 1). This heat radiating fin has a structure in which a plurality of carbon fibers are brazed to a to-be-grafted metal substrate. Moreover, the manufacturing method of this radiation fin is as follows. First, an adhesive is applied to a sheet-like temporary flocking base, and carbon fibers are flocked to form a temporary flocking base. Next, the tip of the carbon fiber planted on the temporary flocking substrate and the target hair metal substrate are fixed via a metal brazing material, and the carbon fiber of the temporary flocking substrate is transferred and fixed to the target metal substrate.
JP-A-8-303978

特許文献１の方法では、炭素繊維が容易に金属製のロウ材と馴染まないため、被植毛金属基材に炭素繊維を固着することが困難である。また、仮に固着できた場合にあっても、炭素繊維と被植毛金属基材との接合が弱いので、振動または衝撃などにより、炭素繊維が被植毛金属基材から簡単に脱落するという問題がある。また、このよう製造された放熱フィンでは、炭素繊維と被植毛金属基材との間の熱抵抗が大きいため、高い冷却性能が得られないという問題もある。   In the method of Patent Document 1, it is difficult to fix the carbon fiber to the to-be-grafted metal substrate because the carbon fiber is not easily compatible with the metal brazing material. In addition, even if it can be fixed, there is a problem that the carbon fiber easily drops off from the to-be-grafted metal substrate due to vibration or impact because the bonding between the carbon fiber and the to-be-grafted metal substrate is weak. . Moreover, since the heat radiation fin manufactured in this way has high thermal resistance between carbon fiber and a to-be-grafted metal base material, there also exists a problem that high cooling performance cannot be obtained.

本発明は斯かる事情に鑑みてなされたものであり、炭素繊維と基材との機械的な接合が強固である放熱フィンを提供することを目的とする。   The present invention has been made in view of such circumstances, and an object of the present invention is to provide a heat radiation fin in which mechanical bonding between a carbon fiber and a base material is strong.

本発明の他の目的は、高い冷却性能を発揮できる放熱フィンを提供することにある。   Another object of the present invention is to provide a radiating fin capable of exhibiting high cooling performance.

本発明に係る放熱フィンは、複数の炭素繊維を基材に設けてある放熱フィンにおいて、前記炭素繊維の先端部に金属めっきが施されており、前記炭素繊維の金属めっきされた先端部が前記基材にロウ付けされていることを特徴とする。   The heat dissipating fin according to the present invention is a heat dissipating fin in which a plurality of carbon fibers are provided on a base material, wherein a tip of the carbon fiber is metal-plated, and the tip of the carbon fiber is plated with the metal It is characterized by being brazed to the base material.

本発明の放熱フィンは、表面に金属めっきが施された炭素繊維を基材にロウ付け固定した構成をなす。炭素繊維の表面に金属めっきが施されているため、炭素繊維と基材とのロウ付けを行う際に、炭素繊維の表面が金属製のロウ材と濡れ易くなり、炭素繊維は基材に容易に固定され、炭素繊維と基材との機械的接合も強固である。また、炭素繊維と基材との間の熱抵抗も小さい。このため、電子部品からの熱が基材に伝わった後、非常に小さな熱抵抗を介して炭素繊維に伝わり、炭素繊維の表面から空気中に熱が放散されるため、冷却性能は高い。   The heat dissipating fin of the present invention has a configuration in which a carbon fiber having a metal plating on its surface is brazed and fixed to a base material. Since the surface of the carbon fiber is plated with metal, when the carbon fiber and the base material are brazed, the surface of the carbon fiber is easily wetted with the metal brazing material, and the carbon fiber is easily applied to the base material. The mechanical bonding between the carbon fiber and the substrate is also strong. Also, the thermal resistance between the carbon fiber and the substrate is small. For this reason, after the heat from the electronic component is transmitted to the base material, it is transmitted to the carbon fiber through a very small thermal resistance, and the heat is dissipated into the air from the surface of the carbon fiber, so that the cooling performance is high.

本発明に係る放熱フィンは、上記構成において、前記金属めっきの材料が、Ｃｕ，Ｎｉ，Ａｕ，Ｓｎ，Ａｇ，Ｐｄ及びＰｔからなる群から選ばれた１若しくは複数種の金属、または、前記群から選ばれた１若しくは複数種の金属を含む合金であることが好ましい。   The heat dissipating fin according to the present invention has the above-described configuration, wherein the metal plating material is one or more kinds of metals selected from the group consisting of Cu, Ni, Au, Sn, Ag, Pd and Pt, or the group An alloy containing one or more kinds of metals selected from the above is preferable.

本発明の放熱フィンは、Ｃｕ，Ｎｉ，Ａｕ，Ｓｎ，Ａｇ，Ｐｄ，Ｐｔの１種若しくは複数種の金属、または、これらの元素の中の１種若しくは複数種の金属を含む合金により、炭素繊維の表面にめっきが施されている。よって、接合のためのロウ材と濡れ性が良く、また、炭素繊維と基材との間の熱抵抗は非常に小さい。   The heat dissipating fin of the present invention is made of one or more kinds of metals such as Cu, Ni, Au, Sn, Ag, Pd, and Pt, or an alloy containing one or more kinds of these elements. The surface of the fiber is plated. Therefore, it has good wettability with the brazing material for bonding, and the thermal resistance between the carbon fiber and the substrate is very small.

本発明に係る放熱フィンは、上記構成において、前記基材の材料が、Ｃｕ，Ａｌ及びセラッミックからなる群から選ばれたものであることが好ましい。   In the above configuration, the heat dissipating fin according to the present invention is preferably such that the base material is selected from the group consisting of Cu, Al and ceramic.

Ｃｕ，Ａｌ，セラッミック等の熱伝導性が良好な材料にて基材を構成する。よって、電子部品からの熱が基材から炭素繊維へ効率良く伝えられる。   A base material is comprised with material with favorable heat conductivity, such as Cu, Al, and ceramics. Therefore, heat from the electronic component is efficiently transferred from the base material to the carbon fiber.

本発明の放熱フィンでは、金属めっきが施された炭素繊維を基材にロウ付け固定しているので、炭素繊維と基材とのロウ付けを行う際に、炭素繊維の表面が金属製のロウ材と濡れ易くなり、炭素繊維を基材に容易に固定でき、炭素繊維と基材との機械的接合を強固にすることができる。また、炭素繊維と基材との間の熱抵抗も小さいため、電子部品からの熱が基材に伝わった後、非常に小さな熱抵抗を介して炭素繊維に伝わり、炭素繊維の表面から空気中に熱が放散され、冷却性能を飛躍的に向上することができる。   In the radiating fin of the present invention, the carbon fiber subjected to metal plating is fixed to the base material by brazing. Therefore, when the carbon fiber and the base material are brazed, the surface of the carbon fiber is made of metal brazing. It becomes easy to get wet with the material, the carbon fiber can be easily fixed to the substrate, and the mechanical bonding between the carbon fiber and the substrate can be strengthened. In addition, since the thermal resistance between the carbon fiber and the substrate is small, the heat from the electronic component is transferred to the substrate after being transferred to the carbon fiber through the very small thermal resistance. The heat is dissipated in the air, and the cooling performance can be dramatically improved.

本発明の放熱フィンでは、金属めっきの材料として、Ｃｕ，Ｎｉ，Ａｕ，Ｓｎ，Ａｇ，Ｐｄ及びＰｔからなる群から選ばれた１若しくは複数種の金属、または、その群から選ばれた１若しくは複数種の金属を含む合金を用いるようにしたので、接合のためのロウ材と濡れ性が良く、また、炭素繊維と基材との間の熱抵抗を非常に小さくできる。   In the heat radiating fin of the present invention, as a material for metal plating, one or more kinds of metals selected from the group consisting of Cu, Ni, Au, Sn, Ag, Pd and Pt, or 1 or selected from the group Since an alloy containing a plurality of kinds of metals is used, the brazing material for bonding is good in wettability, and the thermal resistance between the carbon fiber and the substrate can be made extremely small.

本発明の放熱フィンでは、基材の材料として、Ｃｕ，Ａｌ及びセラッミックからなる群から選ばれたものを用いるようにしたので、基材の熱伝導性が良好であり、電子部品からの熱を基材から炭素繊維へ効率良く伝えることができる。   In the radiating fin of the present invention, since the material selected from the group consisting of Cu, Al, and ceramic is used as the material of the substrate, the substrate has good thermal conductivity, and heat from the electronic component is obtained. It can be efficiently transmitted from the base material to the carbon fiber.

以下、本発明をその実施の形態を示す図面を参照して具体的に説明する。図１は、本発明に係る放熱フィン１０の一例の構成を示す図である。   Hereinafter, the present invention will be described in detail with reference to the drawings showing embodiments thereof. FIG. 1 is a diagram showing a configuration of an example of a heat radiating fin 10 according to the present invention.

図１において、１は例えばＣｕ板からなる基材であり、２は表面に例えばＣｕからなる金属めっき層３を有する複数の炭素繊維である。各炭素繊維２の先端は、例えばはんだからなるロウ材４を介して、基材１に固着されている。   In FIG. 1, 1 is a base material made of, for example, a Cu plate, and 2 is a plurality of carbon fibers having a metal plating layer 3 made of, for example, Cu on the surface. The tip of each carbon fiber 2 is fixed to the base material 1 via a brazing material 4 made of, for example, solder.

炭素繊維２としては．例えば三菱化学産資製ダイアリード（Ｋ２２３ＨＧ）を用いることができるが、熱伝導率が高い炭素繊維であれば、これに限定されるものではない。また、炭素繊維２は、換算直径が１０μｍ〜１ｍｍ、アスペクト比が５〜１００である。このようなサイズであれば、静電植毛の際に、容易に炭素繊維２を飛ばすことができる。ここで、「換算直径」とは、繊維の断面積を同一断面積の円の直径に換算した値であり、「アスペクト比」とは、繊維の長さを太さで除した値である。   As carbon fiber 2,. For example, DIALEAD (K223HG) manufactured by Mitsubishi Chemical Corporation can be used, but is not limited to this as long as the carbon fiber has high thermal conductivity. The carbon fiber 2 has a converted diameter of 10 μm to 1 mm and an aspect ratio of 5 to 100. If it is such a size, the carbon fiber 2 can be easily skipped in the case of electrostatic flocking. Here, the “converted diameter” is a value obtained by converting the cross-sectional area of the fiber into the diameter of a circle having the same cross-sectional area, and the “aspect ratio” is a value obtained by dividing the length of the fiber by the thickness.

本発明の放熱フィン１０は、表面に金属めっき層３（Ｃｕめっき層）が施された炭素繊維２を基材１（Ｃｕ板）にロウ材４（はんだ）にてロウ付け固定して構成されている。炭素繊維２の表面が金属めっきされているため、炭素繊維２と基材１とのロウ付けを行う際に、炭素繊維２表面の金属めっき層３とロウ材４とは濡れ易くなり、炭素繊維２は基材１に容易に固定され、炭素繊維２と基材１との機械的接合も強固である。   The heat radiation fin 10 of the present invention is configured by brazing and fixing a carbon fiber 2 having a metal plating layer 3 (Cu plating layer) on a surface to a base material 1 (Cu plate) with a brazing material 4 (solder). ing. Since the surface of the carbon fiber 2 is metal-plated, when the carbon fiber 2 and the substrate 1 are brazed, the metal plating layer 3 and the brazing material 4 on the surface of the carbon fiber 2 are easily wetted. 2 is easily fixed to the base material 1, and mechanical bonding between the carbon fiber 2 and the base material 1 is also strong.

また、炭素繊維２と基材１との間に金属めっき層３及びロウ材４が介在され、その間の熱抵抗は小さい。このため、電子部品からの熱が基材１に伝わった後、非常に小さな熱抵抗を介して炭素繊維２に伝わり、炭素繊維２の表面から空気中に熱が放散されることになり、放熱フィン１０の冷却性能は飛躍的に向上する。   Moreover, the metal plating layer 3 and the brazing material 4 are interposed between the carbon fiber 2 and the substrate 1, and the thermal resistance therebetween is small. For this reason, after the heat from the electronic component is transmitted to the base material 1, the heat is transmitted to the carbon fiber 2 through a very small thermal resistance, and the heat is dissipated from the surface of the carbon fiber 2 into the air. The cooling performance of the fin 10 is dramatically improved.

図２は、本発明に係る放熱フィン１０の他の例の構成を示す図である。図１に示す例では、炭素繊維２の表面全域に金属めっき層３（Ｃｕめっき層）が設けられているが、図２に示す例では、はんだからなるロウ材４と接触する部分（先端部）のみに金属めっき層３（Ｃｕめっき層）が設けられている。この図２に示す例にあっては、図１に示す例と同様な効果を奏することに加えて、金属めっき層３の体積が少なくて済むので、低コスト化を図ることができる。   FIG. 2 is a diagram showing a configuration of another example of the heat radiating fin 10 according to the present invention. In the example shown in FIG. 1, the metal plating layer 3 (Cu plating layer) is provided over the entire surface of the carbon fiber 2, but in the example shown in FIG. 2, the portion (tip portion) that contacts the brazing material 4 made of solder. Only) is provided with a metal plating layer 3 (Cu plating layer). In the example shown in FIG. 2, in addition to the same effects as the example shown in FIG. 1, the volume of the metal plating layer 3 can be reduced, so that the cost can be reduced.

次に、放熱フィン１０の製造方法について説明する。図３は、本発明に係る放熱フィン１０の製造方法の一例の工程を示す図である。   Next, the manufacturing method of the radiation fin 10 is demonstrated. FIG. 3 is a diagram illustrating a process of an example of a method for manufacturing the radiating fin 10 according to the present invention.

まず、短く切断した複数の炭素繊維２（例えば、長さ：６ｍｍ、直径：１０μｍ、熱伝導率：６２０Ｗ／ｍＫ）に、金属めっき処理（例えば、無電解Ｃｕめっき処理）を施す（図３（ａ），（ｂ））。次に、金属めっき（Ｃｕめっき）処理された表面に金属めっき層３（Ｃｕめっき層）を有する炭素繊維２を、静電植毛により平板状の仮基材１１上に垂直に立てて、接着剤１２により炭素繊維２の一端を仮基材１１に仮付け接着する（図３（ｃ），（ｄ））。   First, a plurality of short cut carbon fibers 2 (for example, length: 6 mm, diameter: 10 μm, thermal conductivity: 620 W / mK) are subjected to metal plating (for example, electroless Cu plating) (FIG. 3 ( a), (b)). Next, the carbon fiber 2 having the metal plating layer 3 (Cu plating layer) on the surface subjected to metal plating (Cu plating) is vertically erected on the flat temporary substrate 11 by electrostatic flocking, and an adhesive. 12, one end of the carbon fiber 2 is temporarily attached to the temporary base 11 (FIGS. 3C and 3D).

仮基材１１としては、ステンレス板、Ａｌ，Ｃｕ等の金属板、耐熱性があるガラス布基材エポキシ樹脂基板など、はんだ付け温度である２００℃程度の耐熱性を有する材料の板であれば、任意のものを使用できる。また、仮固定用の接着剤１２としては、熱可塑性のポリアクリル樹脂，ポリウレタン樹脂，ポリ酢酸ビニル樹脂等の合成樹脂接着剤を使用でき、後工程での炭素繊維２と仮基材１１との分離を容易に行えるように可溶性の接着剤を用いても良い。静電植毛手法は公知の方法（例えば、特公平６−２４７９３号公報に開示された植毛方法）を用いることができ、アップ法、ダウン法のいずれでも可能であるが、接着強度、繊維の並び、繊維の直立状態などを考慮した場合、アップ法がより望ましい。   The temporary base material 11 is a plate made of a material having a heat resistance of about 200 ° C. which is a soldering temperature, such as a stainless steel plate, a metal plate such as Al, Cu, and a glass cloth base material epoxy resin substrate having heat resistance. Anything can be used. Moreover, as the adhesive 12 for temporary fixing, synthetic resin adhesives, such as thermoplastic polyacryl resin, a polyurethane resin, a polyvinyl acetate resin, can be used, and the carbon fiber 2 and the temporary base material 11 in a post process are used. A soluble adhesive may be used to facilitate separation. As the electrostatic flocking method, a known method (for example, the flocking method disclosed in Japanese Patent Publication No. 6-24793) can be used, and either the up method or the down method can be used. In consideration of the upright state of the fiber, the up method is more desirable.

次いで、ロウ材となるはんだペースト１３を表面に塗布した基材１（例えば、Ｃｕ板）に、炭素繊維２の仮付け接着されていない他端を接触させ、この状態でロウ材（はんだ）を溶融・冷却して、炭素繊維２と基材１（Ｃｕ板）とをロウ付け（はんだ付け）する（図３（ｅ），（ｆ））。ロウ材としては、炭素繊維２にＣｕめっきを施し、基材１としてＣｕ板を用いた場合、電子部品の一般的な実装に用いられているＳｎ−Ｐｂはんだペースト，Ｓｎ−Ａｇ系のはんだペーストを用いることができる。この状態でのロウ材（はんだ）の加熱は、ホットプレート，赤外線リフロー炉，熱風リフロー炉等を用いて行うことができ、いずれの場合でも、はんだの融点＋（３０〜１００）℃程度に加熱した後に冷却することにより、炭素繊維２と基材１（Ｃｕ板）とを確実に接合することができる。   Next, the other end of the carbon fiber 2 that is not temporarily bonded is brought into contact with the base material 1 (for example, a Cu plate) coated with solder paste 13 serving as a brazing material, and the brazing material (solder) is placed in this state. After melting and cooling, the carbon fiber 2 and the base material 1 (Cu plate) are brazed (soldered) (FIGS. 3E and 3F). As the brazing material, when the copper plating is applied to the carbon fiber 2 and a Cu plate is used as the base material 1, Sn—Pb solder paste and Sn—Ag solder paste used for general mounting of electronic components Can be used. In this state, the brazing material (solder) can be heated using a hot plate, an infrared reflow furnace, a hot-air reflow furnace, etc. In any case, the solder is heated to the melting point of the solder + (30 to 100) ° C. After cooling, the carbon fiber 2 and the substrate 1 (Cu plate) can be reliably bonded.

最後に、基材１（Ｃｕ板）と炭素繊維２との機械的・熱的接合が完了した後、エタノール，アセトン等の溶媒に浸漬して、仮付けされた仮基材１１を炭素繊維２から剥離して、図１に示すような放熱フィン１０を作製する（図３（ｇ））。なお、接着剤１２として熱可塑樹脂製の接着剤を用いた場合には、仮基材１１を炭素繊維２から剥離すべく、再度加熱しても良い。   Finally, after the mechanical and thermal bonding between the base material 1 (Cu plate) and the carbon fiber 2 is completed, the temporarily attached temporary base material 11 is immersed in a solvent such as ethanol, acetone, etc. The heat radiating fins 10 as shown in FIG. 1 are produced (FIG. 3G). In addition, when a thermoplastic resin adhesive is used as the adhesive 12, the temporary base 11 may be heated again in order to peel it from the carbon fiber 2.

図４は、本発明に係る放熱フィン１０の製造方法の他の例の工程を示す図である。まず、短く切断した複数の炭素繊維２（例えば、長さ：６ｍｍ、直径：１０μｍ、熱伝導率：６２０Ｗ／ｍＫ）を準備し、それらの炭素繊維２を、静電植毛により平板状の仮基材１１上に垂直に立てて、接着剤１２により炭素繊維２の一端を仮基材１１に仮付け接着する（図４（ａ），（ｂ））。なお、仮基材１１の材料、接着剤１２の材料、静電植毛の手法は、図３に示した例と同様である。   FIG. 4 is a diagram showing a process of another example of the method for manufacturing the radiating fin 10 according to the present invention. First, a plurality of short cut carbon fibers 2 (for example, length: 6 mm, diameter: 10 μm, thermal conductivity: 620 W / mK) are prepared, and the carbon fibers 2 are formed into a flat temporary base by electrostatic flocking. Standing vertically on the material 11, one end of the carbon fiber 2 is temporarily bonded to the temporary base material 11 with the adhesive 12 (FIGS. 4A and 4B). In addition, the material of the temporary base material 11, the material of the adhesive agent 12, and the method of electrostatic flocking are the same as the example shown in FIG.

次いで、炭素繊維２の仮付け接着されていない他端部をめっき液に浸漬させて金属めっき処理（例えば、電解Ｃｕめっき処理）を施し、炭素繊維２の他端部表面に金属めっき層３（Ｃｕめっき層）を形成する（図４（ｃ））。次いで、ロウ材となるはんだペースト１３を表面に塗布した基材１（例えば、Ｃｕ板）に、炭素繊維２の仮付け接着されていなくて金属めっき層３（Ｃｕめっき層）が形成された他端を接触させ、この状態でロウ材（はんだ）を溶融・冷却して、炭素繊維２と基材１（Ｃｕ板）とをロウ付け（はんだ付け）する（図４（ｄ），（ｅ））。なお、ロウ材の材料、ロウ材の加熱手法は、図３に示した例と同様である。   Next, the other end of the carbon fiber 2 that is not temporarily bonded is immersed in a plating solution and subjected to metal plating (for example, electrolytic Cu plating), and the metal plating layer 3 ( A Cu plating layer is formed (FIG. 4C). Next, the metal plating layer 3 (Cu plating layer) is formed on the base material 1 (for example, Cu plate) coated with the solder paste 13 serving as a brazing material without the carbon fiber 2 being temporarily attached. In this state, the brazing material (solder) is melted and cooled to braze (solder) the carbon fiber 2 and the substrate 1 (Cu plate) (FIGS. 4D and 4E). ). The brazing material and the brazing material heating method are the same as in the example shown in FIG.

最後に、基材１（Ｃｕ板）と炭素繊維２との機械的・熱的接合が完了した後、エタノール，アセトン等の溶媒に浸漬して、仮付けされた仮基材１１を炭素繊維２から剥離して、図２に示すような放熱フィン１０を作製する（図４（ｆ））。なお、接着剤１２として熱可塑樹脂製の接着剤を用いた場合には、仮基材１１を炭素繊維２から剥離すべく、再度加熱しても良い。   Finally, after the mechanical and thermal bonding between the base material 1 (Cu plate) and the carbon fiber 2 is completed, the temporarily attached temporary base material 11 is immersed in a solvent such as ethanol, acetone, etc. 2 to produce a heat radiating fin 10 as shown in FIG. 2 (FIG. 4F). In addition, when a thermoplastic resin adhesive is used as the adhesive 12, the temporary base 11 may be heated again in order to peel it from the carbon fiber 2.

なお、上述した図３，図４の例では、基材１（Ｃｕ板）にはんだペースト１３を設けるようにしたが、炭素繊維２の仮付け接着されていない他端にはんだペースト１３を設けて、炭素繊維２を基材１（Ｃｕ板）に接合するようにしても良い。   3 and 4, the solder paste 13 is provided on the base material 1 (Cu plate). However, the solder paste 13 is provided on the other end of the carbon fiber 2 that is not temporarily bonded. The carbon fiber 2 may be bonded to the substrate 1 (Cu plate).

上述した例では、炭素繊維２への金属めっきをＣｕめっきとしたが、これは一例であり、金属めっきの材料として、Ｃｕ，Ｎｉ，Ａｕ，Ｓｎ，Ａｇ，Ｐｄ及びＰｔからなる群から選ばれた１若しくは複数種の金属、または、その群から選ばれた１若しくは複数種の金属を含む合金を使用することができる。   In the above-described example, the metal plating on the carbon fiber 2 is Cu plating, but this is an example, and the metal plating material is selected from the group consisting of Cu, Ni, Au, Sn, Ag, Pd and Pt. In addition, an alloy containing one or more kinds of metals or one or more kinds of metals selected from the group can be used.

基材１としてＣｕ板を用いたが、これは一例であって、熱伝導性が良好であるＡｌ板，セラッミック板も使用可能である。また、Ｃｕめっき，Ｎｉ／Ａｕめっき等の表面処理を施した炭素板なども使用できる。   Although a Cu plate is used as the substrate 1, this is an example, and an Al plate or a ceramic plate having good thermal conductivity can also be used. Further, a carbon plate subjected to surface treatment such as Cu plating or Ni / Au plating can also be used.

本発明に係る放熱フィンの一例の構成を示す図である。It is a figure which shows the structure of an example of the radiation fin which concerns on this invention. 本発明に係る放熱フィンの他の例の構成を示す図である。It is a figure which shows the structure of the other example of the radiation fin which concerns on this invention. 本発明に係る放熱フィンの製造方法の一例の工程を示す図である。It is a figure which shows the process of an example of the manufacturing method of the radiation fin which concerns on this invention. 本発明に係る放熱フィンの製造方法の他の例の工程を示す図である。It is a figure which shows the process of the other example of the manufacturing method of the radiation fin which concerns on this invention.

符号の説明Explanation of symbols

１ 基材
２ 炭素繊維
３ 金属めっき層
４ ロウ材
１０ 放熱フィン
１１ 仮基材
１２ 接着剤
１３ はんだペースト DESCRIPTION OF SYMBOLS 1 Base material 2 Carbon fiber 3 Metal plating layer 4 Brazing material 10 Radiation fin 11 Temporary base material 12 Adhesive 13 Solder paste

Claims (3)

複数の炭素繊維を基材に設けてある放熱フィンにおいて、前記炭素繊維の先端部に金属めっきが施されており、前記炭素繊維の金属めっきされた先端部が前記基材にロウ付けされていることを特徴とする放熱フィン。   In the heat dissipating fin in which a plurality of carbon fibers are provided on the base material, the tip of the carbon fiber is metal-plated, and the tip of the carbon fiber that is metal-plated is brazed to the base A heat dissipating fin. 前記金属めっきの材料は、Ｃｕ，Ｎｉ，Ａｕ，Ｓｎ，Ａｇ，Ｐｄ及びＰｔからなる群から選ばれた１若しくは複数種の金属、または、前記群から選ばれた１若しくは複数種の金属を含む合金であることを特徴とする請求項１記載の放熱フィン。   The material of the metal plating includes one or more kinds of metals selected from the group consisting of Cu, Ni, Au, Sn, Ag, Pd and Pt, or one or more kinds of metals selected from the group. The heat dissipating fin according to claim 1, which is an alloy. 前記基材の材料は、Ｃｕ，Ａｌ及びセラッミックからなる群から選ばれたものであることを特徴とする請求項１または２記載の放熱フィン。   The heat radiating fin according to claim 1 or 2, wherein the material of the base material is selected from the group consisting of Cu, Al, and ceramic.
JP2008008308A 2008-01-17 2008-01-17 Heat dissipation fin Withdrawn JP2008103773A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018032764A (en) * 2016-08-25 2018-03-01 富士通株式会社 Heat-radiating sheet, electronic device, and method of manufacturing the same
JP2020165560A (en) * 2019-03-28 2020-10-08 ダイキン工業株式会社 Electric component box
WO2024054082A1 (en) * 2022-09-08 2024-03-14 주식회사 케이엠더블유 Heat dissipation apparatus for electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018032764A (en) * 2016-08-25 2018-03-01 富士通株式会社 Heat-radiating sheet, electronic device, and method of manufacturing the same
JP2020165560A (en) * 2019-03-28 2020-10-08 ダイキン工業株式会社 Electric component box
JP7355993B2 (en) 2019-03-28 2023-10-04 ダイキン工業株式会社 electrical equipment box
WO2024054082A1 (en) * 2022-09-08 2024-03-14 주식회사 케이엠더블유 Heat dissipation apparatus for electronic device

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