JP2008088515A - めっき基板およびその製造方法 - Google Patents
めっき基板およびその製造方法 Download PDFInfo
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Abstract
【解決手段】本発明にかかるめっき基板100の製造方法は、無電解めっき法により金属層を形成するめっき基板の製造方法であって、無電解めっき用の触媒として機能する触媒金属31を含有する任意のパターンの樹脂成形体22を基板上に形成する工程と、無電解めっき液に前記基板を浸漬することにより、前記樹脂成形体上に金属を析出させて金属層を形成する工程と、を含む。
【選択図】図8
Description
基板と、
基板上に形成され、無電解めっき用の触媒として機能する触媒金属を含有する任意のパターンの樹脂成形体と、
前記樹脂層の上面に形成された金属層と、
を含む。
前記金属層は、前記樹脂成形体の上面および側面に形成されており、
前記樹脂成形体の上面に形成された金属層の膜厚は、前記樹脂成形体の側面に形成された金属層の膜厚より大きいことができる。
前記樹脂成形体は、フォトレジストからなることができる。
前記基体は所定の波長の光を透過する透明基板であることができる。
無電解めっき法により金属層を形成するめっき基板の製造方法であって、
(a)無電解めっき用の触媒として機能する触媒金属を含有する任意のパターンの樹脂成形体を基板上に形成する工程と、
(b)無電解めっき液に前記基板を浸漬することにより、前記樹脂成形体上に金属を析出させて金属層を形成する工程と、
を含む。
前記工程(a)は、
前記触媒金属を含有する流動状態の樹脂材料を基板に塗布する工程と、
所定パターンの凹パターンを有するナノスタンパを前記基板上に押し付けて、前記樹脂材料に前記所定パターンを転写する工程と、
前記樹脂材料を硬化させる工程と、
を含む。
前記工程(a)と(b)との間に、
アッシングによって、硬化させた樹脂材料の上部および前記所定パターン以外の領域の樹脂材料を除去することができる。
前記樹脂成形体は、フォトレジストからなり、
前記工程(a)では、干渉露光法を用いて前記樹脂成形体を形成することができる。
図1〜図7は、本実施の形態にかかるめっき基板100(図8参照)の製造方法を示す図である。本実施の形態では、無電解めっきを適用してめっき基板を製造する。
上述した方法により製造されためっき基板100について、図9を用いて説明する。図9は、本実施の形態にかかるめっき基板100を模式的に示す斜視図である。めっき基板100は、基板10と当該基板10上に形成された金属層33とを含む。金属層33は、所定のパターンを有する。所定のパターンは、たとえば1次元または2次元の周期的なパターンであることができる。金属層33の内部には、樹脂成形体22が金属層33と同様のパターンに設けられている。めっき基板100は、光透過性基板上に所定のパターンを有することにより、偏光板等の光学素子基板として機能することができる。たとえば図9に示すように、めっき基板100は、一定の間隔dと一定の幅cの直線状の金属層がX軸方向に繰り返し設けられている1次元の周期的なパターン(ストライプ形状)であることができる。周期方向(X軸方向)における幅cが可視光の波長以下であり、かつ基板10が光透過性基板からなる場合には、めっき基板100は、偏光板として機能することができる。
図10は、本実施の形態にかかるめっき基板の製造方法によって製造されるめっき基板を適用した電子デバイスの一例を示す。基板10が絶縁基板である場合には、めっき基板100は、配線基板として機能することができる。電子デバイス1000は、配線基板としてのめっき基板100と、集積回路チップ90と、他の基板92とを含む。
Claims (8)
- 基板と、
基板上に形成され、無電解めっき用の触媒として機能する触媒金属を含有する任意のパターンの樹脂成形体と、
前記樹脂層の上面に形成された金属層と、
を含む、めっき基板。 - 請求項1において、
前記金属層は、前記樹脂成形体の上面および側面に形成されており、
前記樹脂成形体の上面に形成された金属層の膜厚は、前記樹脂成形体の側面に形成された金属層の膜厚より大きい、めっき基板。 - 請求項1または2において、
前記樹脂成形体は、フォトレジストからなる、めっき基板。 - 請求項1ないし3のいずれかにおいて、
前記基体は所定の波長の光を透過する透明基板である、めっき基板。 - 無電解めっき法により金属層を形成するめっき基板の製造方法であって、
(a)無電解めっき用の触媒として機能する触媒金属を含有する任意のパターンの樹脂成形体を基板上に形成する工程と、
(b)無電解めっき液に前記基板を浸漬することにより、前記樹脂成形体上に金属を析出させて金属層を形成する工程と、
を含む、めっき基板の製造方法。 - 請求項5において、
前記工程(a)は、
前記触媒金属を含有する流動状態の樹脂材料を基板に塗布する工程と、
所定パターンの凹パターンを有するナノスタンパを前記基板上に押し付けて、前記樹脂材料に前記所定パターンを転写する工程と、
前記樹脂材料を硬化させる工程と、
を含む、めっき基板の製造方法。 - 請求項6において、
前記工程(a)と(b)との間に、
アッシングによって、硬化させた樹脂材料の上部および前記所定パターン以外の領域の樹脂材料を除去する、めっき基板の製造方法。 - 請求項5において、
前記樹脂成形体は、フォトレジストからなり、
前記工程(a)では、干渉露光法を用いて前記樹脂成形体を形成する、めっき基板の製造方法。
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US11/866,038 US20080299356A1 (en) | 2006-10-03 | 2007-10-02 | Plated substrate and its fabrication method |
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JP2006271806A JP2008088515A (ja) | 2006-10-03 | 2006-10-03 | めっき基板およびその製造方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010238626A (ja) * | 2009-03-31 | 2010-10-21 | Nissha Printing Co Ltd | 透明導電性シートとその製造方法、加飾成形品 |
JP2016058545A (ja) * | 2014-09-09 | 2016-04-21 | 住友電気工業株式会社 | プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110195542A1 (en) * | 2010-02-05 | 2011-08-11 | E-Chem Enterprise Corp. | Method of providing solar cell electrode by electroless plating and an activator used therein |
TWI524229B (zh) * | 2014-03-04 | 2016-03-01 | 綠點高新科技股份有限公司 | 具有二維觸控結構的殼體及其製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS62273226A (ja) * | 1986-05-20 | 1987-11-27 | Nippon Soda Co Ltd | 無電解メッキ用光硬化性レジスト樹脂組成物 |
JPS6318686A (ja) * | 1986-07-10 | 1988-01-26 | Sharp Corp | 半導体レ−ザ素子 |
US5260170A (en) * | 1990-01-08 | 1993-11-09 | Motorola, Inc. | Dielectric layered sequentially processed circuit board |
DE4400200C2 (de) * | 1993-01-05 | 1997-09-04 | Toshiba Kawasaki Kk | Halbleitervorrichtung mit verbesserter Verdrahtungsstruktur und Verfahren zu ihrer Herstellung |
US5772905A (en) * | 1995-11-15 | 1998-06-30 | Regents Of The University Of Minnesota | Nanoimprint lithography |
JP3986743B2 (ja) * | 2000-10-03 | 2007-10-03 | 株式会社日立製作所 | 配線基板とその製造方法及びそれに用いる無電解銅めっき液 |
EP1696719A4 (en) * | 2003-11-14 | 2008-10-29 | Bridgestone Corp | ELECTROMAGNETIC SHIELDING TRANSLUCENT WINDOW MATERIAL AND METHOD OF MANUFACTURING THEREOF |
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2006
- 2006-10-03 JP JP2006271806A patent/JP2008088515A/ja not_active Withdrawn
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010238626A (ja) * | 2009-03-31 | 2010-10-21 | Nissha Printing Co Ltd | 透明導電性シートとその製造方法、加飾成形品 |
JP2016058545A (ja) * | 2014-09-09 | 2016-04-21 | 住友電気工業株式会社 | プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法 |
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