JP2007502904A - ポリエキシ樹脂用ポリホスホネート難燃硬化剤 - Google Patents
ポリエキシ樹脂用ポリホスホネート難燃硬化剤 Download PDFInfo
- Publication number
- JP2007502904A JP2007502904A JP2006533410A JP2006533410A JP2007502904A JP 2007502904 A JP2007502904 A JP 2007502904A JP 2006533410 A JP2006533410 A JP 2006533410A JP 2006533410 A JP2006533410 A JP 2006533410A JP 2007502904 A JP2007502904 A JP 2007502904A
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- Prior art keywords
- epoxy
- polyphosphonate
- composition
- curing agent
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 0 *c(cc1)ccc1OP(*)(Oc1ccc(*)cc1)=N Chemical compound *c(cc1)ccc1OP(*)(Oc1ccc(*)cc1)=N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
この硬化剤は式:
次に本発明を実施例で例証する。
ビスフェノールA型エポキシ(エポキシ当量:180)のサンプル10gを窒素パージした179℃のオーブンに100分間入れた。サンプルは硬化もゲル化もしなかった。それは室温で粘性液体でありアセトンに完全溶解した。
〔比較例2〕
式:
ジメチルメチルホスホネート、P2O5及びエチレンオキシド(アクゾノベル社製商品名FYROLHP)の反応生成物(ヒドロキシ数125mg KOH/g)であるポリホスホネートをビスフェノールAジエポキシ樹脂(エポキシ当量:180)と混合してエポキシ樹脂70%とポリホスホネート30%の混合物をつくった。この混合物を150℃のオーブン中で1時間半加熱した。硬化は起こらなかった。
Claims (6)
- エポキシ樹脂及びその有効な硬化剤としてのエポキシ−反応性ポリホスホネートからなることを特徴とするエポキシ樹脂組成物。
- エポキシ樹脂の量が組成物の合計重量の約50〜約95%である請求項1の組成物。
- エポキシ樹脂の量が組成物の合計重量の約65〜約90%である請求項1の組成物。
- エポキシ−反応性ポリホスホネートの量が組成物の合計重量の約5〜約50%である請求項1の組成物。
- エポキシ−反応性ポリホスホネートの量が組成物の合計重量の約10〜約35%である請求項1の組成物。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US47265403P | 2003-05-22 | 2003-05-22 | |
PCT/US2004/016459 WO2004113411A1 (en) | 2003-05-22 | 2004-05-19 | Polyphosphonate flame retardant curing agent for epoxy resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007502904A true JP2007502904A (ja) | 2007-02-15 |
JP2007502904A5 JP2007502904A5 (ja) | 2007-07-12 |
Family
ID=33539043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006533410A Pending JP2007502904A (ja) | 2003-05-22 | 2004-05-19 | ポリエキシ樹脂用ポリホスホネート難燃硬化剤 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1625171A1 (ja) |
JP (1) | JP2007502904A (ja) |
KR (1) | KR20060019547A (ja) |
CN (1) | CN1795223A (ja) |
CA (1) | CA2525856A1 (ja) |
WO (1) | WO2004113411A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010530017A (ja) * | 2007-06-14 | 2010-09-02 | ビーエーエスエフ ソシエタス・ヨーロピア | 難燃剤組成物 |
JP4782789B2 (ja) * | 2004-08-31 | 2011-09-28 | スプレスタ エルエルシー | アルキルホスホン酸ジアリールエステルならびにそのアルキルホスホン酸アリーレン誘導体のオリゴマー/ポリマー誘導体の調製方法 |
JP2012507599A (ja) * | 2008-10-29 | 2012-03-29 | アイシーエル−アイピー アメリカ インコーポレイテッド | リン含有難燃性エポキシ樹脂組成物、プリプレグおよびその積層板 |
WO2012165665A1 (ja) * | 2011-06-03 | 2012-12-06 | Arisawa Mfg. Co., Ltd. | 難燃性樹脂組成物、並びに該樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、フレキシブルプリント配線板用接着シート及びフレキシブルプリント配線板 |
US10167377B2 (en) | 2013-01-22 | 2019-01-01 | Frx Polymers, Inc. | Phosphorus containing epoxy compounds and compositions therefrom |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110132646A1 (en) * | 2009-06-12 | 2011-06-09 | Icl-Ip America Inc. | Flame retardant epoxy resin composition, prepreg and laminate thereof |
EP2655383B1 (en) * | 2010-12-22 | 2017-03-01 | FRX Polymers, Inc. | Hyperbranched oligomeric phosphonates and compositions including the same |
TWI475052B (zh) * | 2011-12-22 | 2015-03-01 | Frx Polymers Inc | 寡聚膦酸酯及包含該寡聚膦酸酯之組成物 |
KR101469270B1 (ko) * | 2011-12-30 | 2014-12-08 | 제일모직주식회사 | 폴리포스포네이트 공중합체, 그 제조 방법 및 이를 포함하는 난연성 열가소성 수지 조성물 |
CN105801814B (zh) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板 |
CN105802127B (zh) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板 |
CN105330824A (zh) * | 2015-12-09 | 2016-02-17 | 西安元创化工科技股份有限公司 | 一种用于环氧树脂的阻燃固化剂及其制备方法 |
TWI620785B (zh) * | 2016-08-10 | 2018-04-11 | Taiwan Union Technology Corporation | 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板 |
TWI620763B (zh) * | 2017-04-27 | 2018-04-11 | Taiwan Union Technology Corporation | 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板 |
EP4375310A3 (en) * | 2017-09-13 | 2024-07-10 | Westlake Epoxy Inc. | Epoxy resin systems |
CN107778456A (zh) * | 2017-11-22 | 2018-03-09 | 吉林省高性能复合材料制造业创新中心有限公司 | 中低温固化环氧树脂及其制备方法与在大丝束碳纤维环氧复合传动轴中的应用 |
CN107903383A (zh) * | 2017-11-22 | 2018-04-13 | 吉林省高性能复合材料制造业创新中心有限公司 | 中低温固化环氧树脂及其制备方法与在大小丝束碳纤维环氧复合传动轴中的应用 |
CN109705530B (zh) * | 2018-12-29 | 2021-06-04 | 广东生益科技股份有限公司 | 热固性树脂组合物及含有它的预浸料、层压板和高频电路基板 |
CN112480373A (zh) * | 2019-09-11 | 2021-03-12 | 广东广山新材料股份有限公司 | 一种阻燃性环氧树脂组合物及其制备方法和应用 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1180178A (ja) * | 1997-09-12 | 1999-03-26 | Hitachi Chem Co Ltd | リン含有フェノール末端オリゴマー及びその製造法 |
JP2001019746A (ja) * | 1999-07-09 | 2001-01-23 | Asahi Denka Kogyo Kk | 難燃性エポキシ樹脂組成物 |
JP2002363259A (ja) * | 2001-06-04 | 2002-12-18 | Mitsubishi Gas Chem Co Inc | 難燃性樹脂組成物 |
WO2003029258A1 (en) * | 2001-10-04 | 2003-04-10 | Akzo Nobel N.V. | Oligomeric, hydroxy-terminated phosphonates |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE494329T1 (de) * | 2002-11-08 | 2011-01-15 | Akzo Nobel Nv | Vernetzungsverfahren für eine epoxidharzzusammensetzung enthaltend reaktives phosphonat |
DE10300462A1 (de) * | 2003-01-07 | 2004-07-15 | Bakelite Ag | Phosphormodifiziertes Epoxidharz |
-
2004
- 2004-05-19 CN CNA2004800140798A patent/CN1795223A/zh active Pending
- 2004-05-19 KR KR1020057022045A patent/KR20060019547A/ko not_active Application Discontinuation
- 2004-05-19 EP EP04776110A patent/EP1625171A1/en not_active Withdrawn
- 2004-05-19 CA CA002525856A patent/CA2525856A1/en not_active Abandoned
- 2004-05-19 WO PCT/US2004/016459 patent/WO2004113411A1/en active Application Filing
- 2004-05-19 JP JP2006533410A patent/JP2007502904A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1180178A (ja) * | 1997-09-12 | 1999-03-26 | Hitachi Chem Co Ltd | リン含有フェノール末端オリゴマー及びその製造法 |
JP2001019746A (ja) * | 1999-07-09 | 2001-01-23 | Asahi Denka Kogyo Kk | 難燃性エポキシ樹脂組成物 |
JP2002363259A (ja) * | 2001-06-04 | 2002-12-18 | Mitsubishi Gas Chem Co Inc | 難燃性樹脂組成物 |
WO2003029258A1 (en) * | 2001-10-04 | 2003-04-10 | Akzo Nobel N.V. | Oligomeric, hydroxy-terminated phosphonates |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4782789B2 (ja) * | 2004-08-31 | 2011-09-28 | スプレスタ エルエルシー | アルキルホスホン酸ジアリールエステルならびにそのアルキルホスホン酸アリーレン誘導体のオリゴマー/ポリマー誘導体の調製方法 |
JP2010530017A (ja) * | 2007-06-14 | 2010-09-02 | ビーエーエスエフ ソシエタス・ヨーロピア | 難燃剤組成物 |
JP2012507599A (ja) * | 2008-10-29 | 2012-03-29 | アイシーエル−アイピー アメリカ インコーポレイテッド | リン含有難燃性エポキシ樹脂組成物、プリプレグおよびその積層板 |
WO2012165665A1 (ja) * | 2011-06-03 | 2012-12-06 | Arisawa Mfg. Co., Ltd. | 難燃性樹脂組成物、並びに該樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、フレキシブルプリント配線板用接着シート及びフレキシブルプリント配線板 |
US10167377B2 (en) | 2013-01-22 | 2019-01-01 | Frx Polymers, Inc. | Phosphorus containing epoxy compounds and compositions therefrom |
Also Published As
Publication number | Publication date |
---|---|
CA2525856A1 (en) | 2004-12-29 |
WO2004113411A1 (en) | 2004-12-29 |
EP1625171A1 (en) | 2006-02-15 |
KR20060019547A (ko) | 2006-03-03 |
CN1795223A (zh) | 2006-06-28 |
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