JP2007335556A - 搬送システム - Google Patents
搬送システム Download PDFInfo
- Publication number
- JP2007335556A JP2007335556A JP2006164325A JP2006164325A JP2007335556A JP 2007335556 A JP2007335556 A JP 2007335556A JP 2006164325 A JP2006164325 A JP 2006164325A JP 2006164325 A JP2006164325 A JP 2006164325A JP 2007335556 A JP2007335556 A JP 2007335556A
- Authority
- JP
- Japan
- Prior art keywords
- pod
- tray
- stacking
- stacked
- pods
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】ポッド5を一つずつ搬送するポッド単数搬送手段10と、ポッド5を複数段積みするポッド段積み手段50と、段積みされたポッド5を搬送するポッド段積み搬送手段60と、段積みされたポッドを段ばらしするポッド段ばらし手段50とを設けた。
【選択図】図1
Description
この搬送システム70は、半導体基板や液晶表示板などを製造する工場において、その素材となる平板状ワーク(半導体ウエハや、ガラス板)にクリーンルーム内で種々の加工処理を施す際に、工程内では平板状ワークを一枚ずつトレイ1に収容した状態で複数枚単位で、又は、一枚単位で搬送し、工程間ではトレイ1を複数段積みしたポッド5単位で搬送するものである。
この加工処理ステーションSでは、トレイ1からワークWを取り出して、所定の加工処理を施したのち、また、トレイ1に戻すようにしている。
トレイ1、底蓋2と上殻3とから構成されるポッド5については、図2を用いて後に詳述する。
トレイ出し入れ手段20については、図3を用いて、後に詳述する。
なお、トレイ搬送手段30で搬送するトレイ1は、一枚ずつであってもよく(枚葉搬送)、複数段積みされた状態であっても良い。
トレイ段積み段ばらし手段40については、図4を用いて、後に説明する。
天井走行車57は、上下に昇降し、段積みされたポッド5の最下段の底蓋2を支える昇降アーム57aを備え、これにより、複数段積みされたポッド5を搬送することができる。
上殻3の下部開口部は、エアーチューブシール手段4を含めた底蓋2の外縁に沿う形状ではあるが、この下部開口部内縁と、蓋2の外縁との間には、自由な空気の流通を阻止しない程度の隙間があり、この隙間は、エアーチューブシール手段4によって開閉されるようになっている。
本発明においては、ポッド5から、トレイ1Mを出し入れするトレイ出し入れ手段20は、ポッド5自身が、上述したように、底蓋2にトレイ1を複数段積み載置し、上殻3に対しては、エアーチューブシール手段4によって、容易にシール解除と抵抗無く離脱が可能なものであるので、図1(b)でも解るように、トレイ出し入れ手段20は、この底蓋2を昇降させる非常に簡単な構造のもので足りる。
ポッド受板11は、底蓋2に嵌め込み凹所2aがあるので、これに嵌合する嵌め込み突起11aを設けるのがよく、その場合には、トレイ出し入れ手段20とポッド5との間の水平方向の位置決めがより確実になる。
この開口部13の周辺には、ここに載置されるポッド5の上殻3の下縁部分を押さえる、進退可能な押さえ板14が設けられている。
隔壁CAのトレイ出し入れ手段20が設けられている部分に、ポッド5が載置されると、押さえ板14で上殻3が固定される。この状態は、トレイ出し入れ手段20のポッド受板11にポッド5の底蓋2が載置されている状態でもある。
また、この例では、ポッド段積み段ばらし手段50を段積みと段ばらしとの双方の機能を発揮するものとして記載したが、同様のロボットアームを、段積み専用のものと、段おろし専用のものとして格別に用意するようにしてもよい。
2 底蓋
3 上殻
5 ポッド
10 ポッド単数搬送手段
20 トレイ出し入れ手段
30 トレイ搬送手段
40 トレイ段積み段ばらし手段
50 ポッド段積み段ばらし手段
60 ポッド段積み搬送手段
70 搬送システム
Claims (3)
- ポッドを一つずつ搬送するポッド単数搬送手段と、ポッドを複数段積みするポッド段積み手段と、段積みされたポッドを搬送するポッド段積み搬送手段と、段積みされたポッドを段ばらしするポッド段ばらし手段とを設けた搬送システム。
- 複数段積みされたトレイをポッドに対して出し入れするトレイ出し入れ手段を設けた請求項1記載の搬送システム。
- トレイを複数段積みし、あるいは複数段積みされたトレイを段ばらしするトレイ段積み段ばらし手段を設けた請求項2記載の搬送システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006164325A JP4367440B2 (ja) | 2006-06-14 | 2006-06-14 | 搬送システム |
KR1020070014351A KR20070119481A (ko) | 2006-06-14 | 2007-02-12 | 반송 시스템 |
TW096105100A TW200807605A (en) | 2006-06-14 | 2007-02-12 | Conveying system |
EP07006598A EP1867590A1 (en) | 2006-06-14 | 2007-03-29 | Conveying system |
US11/730,981 US7506749B2 (en) | 2006-06-14 | 2007-04-05 | Conveying system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006164325A JP4367440B2 (ja) | 2006-06-14 | 2006-06-14 | 搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007335556A true JP2007335556A (ja) | 2007-12-27 |
JP4367440B2 JP4367440B2 (ja) | 2009-11-18 |
Family
ID=38017061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006164325A Expired - Fee Related JP4367440B2 (ja) | 2006-06-14 | 2006-06-14 | 搬送システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US7506749B2 (ja) |
EP (1) | EP1867590A1 (ja) |
JP (1) | JP4367440B2 (ja) |
KR (1) | KR20070119481A (ja) |
TW (1) | TW200807605A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI392634B (zh) * | 2010-05-20 | 2013-04-11 | Chroma Ate Inc | Wafer conveying and dispensing device and method thereof |
JP2014503989A (ja) * | 2010-11-11 | 2014-02-13 | ツェットエス−ハンドリング ゲゼルシャフト ミット ベシュレンクテル ハフツング | プロセスカセットに対する装着及び取出し方法 |
WO2019065205A1 (ja) * | 2017-09-29 | 2019-04-04 | 日本電産サンキョー株式会社 | トレイ配置部および搬送システム |
WO2019065202A1 (ja) * | 2017-09-29 | 2019-04-04 | 日本電産サンキョー株式会社 | 搬送システム |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI280220B (en) * | 2004-10-25 | 2007-05-01 | Tokyo Electron Ltd | Carrying system, substrate treating device, and carrying method |
US20070029227A1 (en) * | 2005-07-08 | 2007-02-08 | Bonora Anthony C | Workpiece support structures and apparatus for accessing same |
JP4333701B2 (ja) * | 2006-06-14 | 2009-09-16 | 村田機械株式会社 | 搬送システム |
AT510516B1 (de) * | 2010-09-21 | 2013-10-15 | Trumpf Maschinen Austria Gmbh | Fertigungszelle mit einer werkteil- transfereinrichtung und transporteinrichtung für werkteile und teileträger |
US9646858B2 (en) | 2011-06-23 | 2017-05-09 | Brooks Automation, Inc. | Semiconductor cleaner systems and methods |
US11527425B2 (en) * | 2019-12-31 | 2022-12-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for tray cassette warehousing |
US11508596B2 (en) * | 2020-05-28 | 2022-11-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and methods for automatically handling die carriers |
US11302552B1 (en) * | 2021-01-07 | 2022-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multiple transport carrier docking device |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4014430A (en) * | 1970-12-28 | 1977-03-29 | B & K Hydraulic Co. | Automatic palletizer method and apparatus |
US4034846A (en) * | 1975-04-25 | 1977-07-12 | Bunting Magnetics Company | Method and apparatus for providing automatic stacking of manufactured parts |
US4582219A (en) | 1985-02-20 | 1986-04-15 | Empak, Inc. | Storage box having resilient fastening means |
US4865515A (en) * | 1987-06-24 | 1989-09-12 | Dorner Mfg. Corp. | Apparatus for unstacking and stacking containers |
EP0330609B1 (de) * | 1988-02-25 | 1992-12-16 | SIG Schweizerische Industrie-Gesellschaft | Verfahren und Anlage zum Transport von Nahrungsmittelscheiben von einer Portioniereinrichtung zu einer Verpackungsmaschine |
US5290141A (en) * | 1992-11-06 | 1994-03-01 | Brenton Engineering Inc. | Continuous down stacker apparatus |
US5478202A (en) * | 1994-03-07 | 1995-12-26 | Ishii; Toru | Case separating apparatus |
DE59611078D1 (de) * | 1995-03-28 | 2004-10-14 | Brooks Automation Gmbh | Be- und Entladestation für Halbleiterbearbeitungsanlagen |
JPH09205136A (ja) | 1996-01-25 | 1997-08-05 | Sony Corp | ウェハケース |
FR2747112B1 (fr) * | 1996-04-03 | 1998-05-07 | Commissariat Energie Atomique | Dispositif de transport d'objets plats et procede de transfert de ces objets entre ledit dispositif et une machine de traitement |
US5885045A (en) * | 1997-03-17 | 1999-03-23 | Fortrend Engineering Corporation | Integrated wafer pod-load/unload and mass-transfer system |
JP3591679B2 (ja) | 1997-04-17 | 2004-11-24 | 株式会社アドバンテスト | Ic用トレイ取出装置及びic用トレイ収納装置 |
JPH10305925A (ja) | 1997-05-06 | 1998-11-17 | Eretsutsu:Kk | リフターストッカーシステム |
US6579052B1 (en) * | 1997-07-11 | 2003-06-17 | Asyst Technologies, Inc. | SMIF pod storage, delivery and retrieval system |
JP2002509255A (ja) * | 1998-01-16 | 2002-03-26 | ディスカヴァリー テクノロジーズ アーゲー | 多数の類似する生物学的/化学的試験を微量分析規模で実施するための方法と装置 |
US5997238A (en) * | 1998-10-13 | 1999-12-07 | Sony Corporation | On-line package stacking apparatus and method |
JP2003086668A (ja) | 2001-09-14 | 2003-03-20 | Sony Corp | 生産装置および生産方法 |
US6663340B1 (en) * | 2002-08-30 | 2003-12-16 | Motorola, Inc. | Wafer carrier transport system for tool bays |
US7221993B2 (en) * | 2003-01-27 | 2007-05-22 | Applied Materials, Inc. | Systems and methods for transferring small lot size substrate carriers between processing tools |
JP4751827B2 (ja) * | 2003-07-11 | 2011-08-17 | テック・セム アーゲー | サブストレートを貯蔵又は輸送するための機器及びそれを用いた方法 |
JP4329536B2 (ja) | 2003-12-26 | 2009-09-09 | アキレス株式会社 | 半導体ウェハーの収納具 |
JP4337683B2 (ja) | 2004-08-16 | 2009-09-30 | 村田機械株式会社 | 搬送システム |
TWI280220B (en) | 2004-10-25 | 2007-05-01 | Tokyo Electron Ltd | Carrying system, substrate treating device, and carrying method |
-
2006
- 2006-06-14 JP JP2006164325A patent/JP4367440B2/ja not_active Expired - Fee Related
-
2007
- 2007-02-12 KR KR1020070014351A patent/KR20070119481A/ko not_active Application Discontinuation
- 2007-02-12 TW TW096105100A patent/TW200807605A/zh unknown
- 2007-03-29 EP EP07006598A patent/EP1867590A1/en not_active Withdrawn
- 2007-04-05 US US11/730,981 patent/US7506749B2/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI392634B (zh) * | 2010-05-20 | 2013-04-11 | Chroma Ate Inc | Wafer conveying and dispensing device and method thereof |
JP2014503989A (ja) * | 2010-11-11 | 2014-02-13 | ツェットエス−ハンドリング ゲゼルシャフト ミット ベシュレンクテル ハフツング | プロセスカセットに対する装着及び取出し方法 |
WO2019065205A1 (ja) * | 2017-09-29 | 2019-04-04 | 日本電産サンキョー株式会社 | トレイ配置部および搬送システム |
WO2019065202A1 (ja) * | 2017-09-29 | 2019-04-04 | 日本電産サンキョー株式会社 | 搬送システム |
Also Published As
Publication number | Publication date |
---|---|
US20070289844A1 (en) | 2007-12-20 |
JP4367440B2 (ja) | 2009-11-18 |
KR20070119481A (ko) | 2007-12-20 |
TW200807605A (en) | 2008-02-01 |
US7506749B2 (en) | 2009-03-24 |
EP1867590A1 (en) | 2007-12-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4367440B2 (ja) | 搬送システム | |
US11515189B2 (en) | Automatic handling buffer for bare stocker | |
JP3265252B2 (ja) | 半導体収納治具、ハンドリング方法及び生産システム | |
JP2008100805A (ja) | 基板保管庫 | |
JP4333701B2 (ja) | 搬送システム | |
JP2006347752A (ja) | 搬送システム | |
JP4348520B2 (ja) | 搬送システム | |
TW201348100A (zh) | 搬送系統 | |
JP2024023874A (ja) | 基板処理装置及び基板収納容器保管方法 | |
JP2006347753A (ja) | 搬送システム | |
JP2010241547A (ja) | 走行車システム | |
JP2010120774A (ja) | 容器群段おろし装置及び容器群段おろし方法 | |
JP2004203621A (ja) | 吸引式容器群搬送装置及び吸引式容器群搬送方法 | |
JP5277572B2 (ja) | 板状物の保管移送システムおよび板状物の保管移送方法 | |
JP2008100802A (ja) | 基板保管庫 | |
JP2005170682A (ja) | ディスプレイ用基板の取り出し機構およびディスプレイ用基板の取り出し方法 | |
EP2245656B1 (en) | Automatic handling buffer for bare stocker | |
JP2007134734A (ja) | 液晶基板の搬送装置 | |
JP4289093B2 (ja) | トレイ搬送システム | |
JP4269222B2 (ja) | トレイ搬送システム | |
JP2008010567A (ja) | クリーンルーム内で使用するための物品搬送用ポッド、及びこれを採用した物品搬送システム | |
JP2008066534A (ja) | 基板搬送システムおよび基板搬送方法 | |
JP2008100801A (ja) | 基板保管庫 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080404 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080430 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080624 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20080624 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090209 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090407 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090804 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090817 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120904 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120904 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130904 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130904 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140904 Year of fee payment: 5 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |