JP2007305830A - Method for manufacturig electronic component, electronic component, and electronic equipment - Google Patents

Method for manufacturig electronic component, electronic component, and electronic equipment Download PDF

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JP2007305830A
JP2007305830A JP2006133445A JP2006133445A JP2007305830A JP 2007305830 A JP2007305830 A JP 2007305830A JP 2006133445 A JP2006133445 A JP 2006133445A JP 2006133445 A JP2006133445 A JP 2006133445A JP 2007305830 A JP2007305830 A JP 2007305830A
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external electrode
electronic component
conductive adhesive
electrode
manufacturing
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Toshio Kawabata
利夫 河端
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To obtain a method for manufacturing an electronic component capable of suppressing a short-circuit caused by a conductive adhesive agent, and to provide the electronic component and electronic equipment. <P>SOLUTION: An upper layer outside electrode (a second outside electrode) 6 electrically connected to a spiral coil formed in a sintered body 10 is formed by respectively immersing the both end parts of the sintered body 10 with foundation outside electrodes (first outside electrodes) 4, 5 formed into an Ag/Pd paste bathig fluid. The obtained lamination coil component 1A comprises an almost all regions of outside electrodes formed on a mounting surface 1a compising two layers with the electrodes 4, 5 and the electrode 6 laminated. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子部品の製造方法、特に、導電性接着剤にてプリント基板に実装される積層タイプの電子部品の製造方法、電子部品、及び電子機器に関する。   The present invention relates to a method for manufacturing an electronic component, and more particularly to a method for manufacturing a laminated type electronic component mounted on a printed board with a conductive adhesive, an electronic component, and an electronic device.

従来、特許文献１には、導電性接着剤を用いて表面実装部品を実装するためのパッドを表面に有するプリント基板において、パッドとこれに近接する他の回路パターンとの間に凹部を形成したものが記載されている。このプリント基板によれば、表面実装部品の実装に伴う余分な導電性接着剤が凹部に導かれ、パッドとこれに近接する他の回路パターンとの間の短絡を防止できる。   Conventionally, in Patent Document 1, in a printed circuit board having a pad on the surface for mounting a surface mounting component using a conductive adhesive, a recess is formed between the pad and another circuit pattern adjacent thereto. Things are listed. According to this printed circuit board, excess conductive adhesive accompanying the mounting of the surface-mounted component is guided to the concave portion, and a short circuit between the pad and another circuit pattern adjacent to the pad can be prevented.

また、特許文献２には、外部電極に導電性接着剤を収容する凹部を設けた電子部品が記載されている。この電子部品によれば、プリント基板に実装された際に、余分な導電性接着剤が凹部に収容され、外部電極間の導電性接着剤による短絡を防止できる。   Patent Document 2 describes an electronic component in which a concave portion for accommodating a conductive adhesive is provided in an external electrode. According to this electronic component, when mounted on a printed circuit board, excess conductive adhesive is accommodated in the recess, and a short circuit due to the conductive adhesive between the external electrodes can be prevented.

しかしながら、特許文献１に記載のプリント基板にあっては、個々の電子部品に対して適切な凹部をプリント基板に形成することは困難であった。また、特許文献２に記載の電子部品にあっては、外部電極への凹部形成方法が明らかではなく、製造方法によっては凹部の深さ寸法のばらつきが大きくなるおそれがある。このため、従来のものでは、余分な導電性接着剤が凹部に充分収容されず、短絡が生じてしまう可能性があった。
特開平９−７４２６０号公報 特開２００１−１１９１２１号公報 However, in the printed circuit board described in Patent Document 1, it has been difficult to form an appropriate recess in the printed circuit board for each electronic component. Further, in the electronic component described in Patent Document 2, the method of forming the recesses on the external electrodes is not clear, and depending on the manufacturing method, there is a possibility that the variation in the depth dimension of the recesses becomes large. For this reason, in the conventional one, excess conductive adhesive is not sufficiently accommodated in the recess, and there is a possibility that a short circuit occurs.
JP-A-9-74260 JP 2001-119121 A

そこで、本発明の目的は、導電性接着剤による短絡を抑えることができる電子部品の製造方法、電子部品、及び電子機器を提供することにある。   Then, the objective of this invention is providing the manufacturing method of an electronic component, an electronic component, and an electronic device which can suppress the short circuit by a conductive adhesive.

前記目的を達成するため、本発明に係る電子部品の製造方法は、
内部電極を設けた複数のセラミックグリーンシートを積層して積層体を形成する工程と、
積層体の実装面に第１の外部電極を形成する工程と、
積層体を焼成して焼結体を得る工程と、
第１の外部電極を含む焼結体の表面に、内部電極と電気的に接続する第２の外部電極を形成する工程と、
を備えたことを特徴とする。 In order to achieve the above object, a method for manufacturing an electronic component according to the present invention includes:
Laminating a plurality of ceramic green sheets provided with internal electrodes to form a laminate;
Forming a first external electrode on the mounting surface of the laminate;
Firing the laminate to obtain a sintered body;
Forming a second external electrode electrically connected to the internal electrode on the surface of the sintered body including the first external electrode;
It is provided with.

本発明に係る電子部品の製造方法において、第１の外部電極はセラミックグリーンシートに導電ペーストを印刷して形成することができる。また、第２の外部電極は焼結体を導電ペーストに浸漬させて形成することができる。そして、第１の外部電極は実装面の第２の外部電極が形成される領域の一部にのみ形成されている。   In the method for manufacturing an electronic component according to the present invention, the first external electrode can be formed by printing a conductive paste on a ceramic green sheet. The second external electrode can be formed by immersing the sintered body in a conductive paste. The first external electrode is formed only in a part of the region where the second external electrode is formed on the mounting surface.

以上の方法により、電子部品の実装面に形成された外部電極の一部の領域が、第１の外部電極と第２の外部電極を積層した少なくとも２層からなる電子部品を得ることができる。さらに、この電子部品を基板に導電性接着剤によって実装することで、ＬＣフィルタや高周波共振器などの電子機器を得ることができる。   By the above method, an electronic component having at least two layers in which a part of the external electrode formed on the mounting surface of the electronic component is formed by stacking the first external electrode and the second external electrode can be obtained. Furthermore, electronic devices such as LC filters and high-frequency resonators can be obtained by mounting this electronic component on a substrate with a conductive adhesive.

本発明によれば、外部電極を、第１の外部電極及び第２の外部電極で構成することで、外部電極の厚さを所望の厚さに形成することができ、電子部品と実装基板の間に所定の隙間を設けることができる。これにより、実装時に用いる導電性接着剤による短絡を防止することができる。   According to the present invention, by configuring the external electrode with the first external electrode and the second external electrode, the thickness of the external electrode can be formed to a desired thickness. A predetermined gap can be provided between them. Thereby, the short circuit by the conductive adhesive used at the time of mounting can be prevented.

以下に、本発明に係る電子部品の製造方法、電子部品、及び電子機器の実施例について添付図面を参照して説明する。   Embodiments of an electronic component manufacturing method, an electronic component, and an electronic device according to the present invention will be described below with reference to the accompanying drawings.

（第１実施例、図１〜図４参照）
図１は第１実施例である積層コイル部品１Ａの分解構成図である。この積層コイル部品１Ａは、内部電極３を表面に形成したセラミックグリーンシート２ａと、予め表面に電極が形成されていないセラミックグリーンシート２ｂと、下地外部電極（第１の外部電極）４，５をそれぞれ表面及び裏面に形成したセラミックグリーンシート２ｃとを積層したものである。 (Refer 1st Example and FIGS. 1-4)
FIG. 1 is an exploded view of a laminated coil component 1A according to the first embodiment. This laminated coil component 1A comprises a ceramic green sheet 2a having an internal electrode 3 formed on the surface, a ceramic green sheet 2b having no electrode formed on the surface in advance, and base external electrodes (first external electrodes) 4 and 5. The ceramic green sheets 2c formed on the front and back surfaces are laminated.

セラミックグリーンシート２ａ，２ｂ，２ｃは以下の方法で製作される。即ち、ＮｉＣｕＺｎフェライトなどの磁性体セラミック粉末に、溶媒、分散剤及びバインダを加えて十分に混合した後、ドクターブレード法によって厚みが３０μｍ程度のセラミックグリーンシートを成形する。   The ceramic green sheets 2a, 2b, 2c are manufactured by the following method. That is, after adding a solvent, a dispersant, and a binder to magnetic ceramic powder such as NiCuZn ferrite and mixing well, a ceramic green sheet having a thickness of about 30 μm is formed by a doctor blade method.

さらに、内層用セラミックグリーンシート２ａの所定の位置にレーザビームなどにてビアホール穴を形成する。その後、表面にＡｇペーストをスクリーン印刷によって塗布し、内部電極３を形成すると同時に、ビアホール穴にＡｇペーストを充填してビアホール導体７を形成する。   Further, a via hole is formed at a predetermined position of the inner layer ceramic green sheet 2a with a laser beam or the like. Thereafter, an Ag paste is applied to the surface by screen printing to form the internal electrode 3, and simultaneously, the via hole is filled with the Ag paste to form the via hole conductor 7.

次に、最外層（最上面）用セラミックグリーンシート２ｃの表面に、外部電極ペーストをスクリーン印刷によって塗布し、厚みが３０μｍ程度の下地外部電極４を形成する。同様に、最外層（最下面）用セラミックグリーンシート２ｃの裏面に、外部電極ペーストをスクリーン印刷によって塗布し、厚みが３０μｍ程度の下地外部電極５を形成する。このように、最上面と最下面に下地外部電極４，５を形成すると、いずれの面を実装面にしてもよく、積層コイル部品１Ａのプリント基板への実装が容易となる。なお、実装面となる一方の面にのみ下地外部電極を形成してもよいことは言うまでもない。また、外部電極ペーストをスクリーン印刷によって塗布すると、内部電極を形成する方法と同じ方法で塗布できるので、容易に下地外部電極を形成することができる。   Next, an external electrode paste is applied to the surface of the ceramic green sheet 2c for the outermost layer (uppermost surface) by screen printing to form a base external electrode 4 having a thickness of about 30 μm. Similarly, an external electrode paste is applied by screen printing to the back surface of the ceramic green sheet 2c for the outermost layer (lowermost surface) to form a base external electrode 5 having a thickness of about 30 μm. As described above, when the base external electrodes 4 and 5 are formed on the uppermost surface and the lowermost surface, any surface may be used as the mounting surface, and the multilayer coil component 1A can be easily mounted on the printed board. Needless to say, the base external electrode may be formed only on one surface to be the mounting surface. Further, when the external electrode paste is applied by screen printing, it can be applied by the same method as the method of forming the internal electrode, so that the base external electrode can be easily formed.

こうして得られた複数のセラミックグリーンシート２ａ，２ｂ，２ｃを順次積み重ねて圧着して積層体を形成する。この積層体を所定の製品サイズにカットして脱バインダ及び焼成し、図２に示すような焼結体１０を得る。そして、この焼結体１０をバレル研磨する。   A plurality of ceramic green sheets 2a, 2b, 2c obtained in this way are sequentially stacked and pressed to form a laminate. This laminated body is cut into a predetermined product size, removed from the binder and fired to obtain a sintered body 10 as shown in FIG. And this sintered compact 10 is barrel-polished.

内部電極３はビアホール導体７を介して電気的に直列に接続して、焼結体１０内に螺旋状コイルを形成する。また、焼成後の下地外部電極４，５の厚みは、ペースト比重と金属コンテント、ワニス量を調整して１８μｍ程度になるようにした。   The internal electrode 3 is electrically connected in series via the via-hole conductor 7 to form a helical coil in the sintered body 10. The thickness of the base external electrodes 4 and 5 after firing was adjusted to about 18 μm by adjusting the paste specific gravity, the metal content, and the amount of varnish.

次に、図３に示すように、下地外部電極４，５が形成されている焼結体１０の両端部を、それぞれＡｇ／Ｐｄ（重量比８０／２０）ペースト浴に浸漬させて、焼結体１０内に形成された螺旋状コイルと電気的に接続する上層外部電極（第２の外部電極）６を形成する。このときのＡｇ／Ｐｄペーストには、ペースト比重と金属コンテント、ワニス量を調整して、下地外部電極４，５がない焼結体１０上（側面）に厚みが１８μｍ程度の上層外部電極６が形成されるようにしたものを用いた。なお、上層外部電極６を、内部電極３や下地外部電極４，５と同様のＡｇペーストで形成してもよい。   Next, as shown in FIG. 3, both end portions of the sintered body 10 on which the base external electrodes 4 and 5 are formed are respectively immersed in an Ag / Pd (weight ratio 80/20) paste bath, and sintered. An upper external electrode (second external electrode) 6 that is electrically connected to the spiral coil formed in the body 10 is formed. In this case, the Ag / Pd paste has an upper external electrode 6 with a thickness of about 18 μm on the sintered body 10 (side surface) without the base external electrodes 4 and 5 by adjusting the paste specific gravity, metal content, and varnish amount. What was formed was used. The upper external electrode 6 may be formed of the same Ag paste as the internal electrode 3 and the base external electrodes 4 and 5.

こうして得られた積層コイル部品１Ａは、図４に示すように、表裏面（実装面１ａ）に形成された外部電極の略全部の領域が、下地外部電極５と上層外部電極６を積層した２層からなり、その厚み寸法は３０μｍ程度であった。なお、積層コイル部品１Ａの大きさは、長さ１．６ｍｍ、幅及び高さ０．８ｍｍであった。そして、外部電極を２層で構成することで、外部電極の厚さを所望の厚さに形成することができる。即ち、外部電極を形成する際、特に焼結体をペーストに浸漬させて外部電極を形成すると、ペーストが伸び広がるために、外部電極を所望の厚さに形成することができない。しかし、予め下地外部電極４，５を形成しておき、その下地外部電極４，５上にさらに上層外部電極６を形成すると、上層外部電極６の厚みに下地外部電極４，５の厚みが加わるので、厚みの厚い外部電極を形成することができる。この結果、基板と積層コイル部品との間に所定の隙間ができるので、積層コイル部品を導電性接着剤でプリント基板に実装する際、導電性接着剤が積層体の長辺方向に伸び広がり難くなり、長辺方向に対向する外部電極間の導電性接着剤による短絡を防止することができる。   In the laminated coil component 1A thus obtained, as shown in FIG. 4, the entire region of the external electrodes formed on the front and back surfaces (mounting surface 1a) is formed by laminating the base external electrode 5 and the upper external electrode 6 2 It consisted of layers, and its thickness dimension was about 30 μm. The size of the laminated coil component 1A was 1.6 mm in length, 0.8 mm in width and height. Then, by configuring the external electrode with two layers, the thickness of the external electrode can be formed to a desired thickness. That is, when forming the external electrode, in particular, when the external electrode is formed by immersing the sintered body in the paste, the paste extends and spreads, so that the external electrode cannot be formed to a desired thickness. However, if the base external electrodes 4 and 5 are formed in advance and the upper external electrode 6 is further formed on the base external electrodes 4 and 5, the thickness of the base external electrodes 4 and 5 is added to the thickness of the upper external electrode 6. Therefore, a thick external electrode can be formed. As a result, a predetermined gap is formed between the substrate and the laminated coil component. Therefore, when the laminated coil component is mounted on the printed circuit board with the conductive adhesive, the conductive adhesive does not easily extend in the long side direction of the laminated body. Thus, a short circuit due to the conductive adhesive between the external electrodes facing in the long side direction can be prevented.

具体的には、プリント基板のパッド上に５０μｍの厚みの導電性接着剤を塗布し、積層コイル部品を実装した。すると、下地外部電極４，５がなく１８μｍの厚みの上層外部電極６だけの従来の積層コイル部品では、導電性接着剤のはみ出しが０．２ｍｍであった。これに対して、本発明品である積層コイル部品１Ａでは、導電性接着剤のはみ出しが０．０９ｍｍと減少した。   Specifically, a conductive adhesive having a thickness of 50 μm was applied on a pad of a printed circuit board, and a laminated coil component was mounted. Then, in the conventional laminated coil component having only the upper external electrode 6 having a thickness of 18 μm without the base external electrodes 4 and 5, the protrusion of the conductive adhesive was 0.2 mm. On the other hand, in the laminated coil component 1A according to the present invention, the protrusion of the conductive adhesive was reduced to 0.09 mm.

（第２実施例、図５及び図６参照）
また、図５に示すように、第２実施例である積層コイル部品１Ｂは、表裏面（実装面１ａ）にそれぞれ形成する下地外部電極１５，１６を略コ字形状にして、実質的に外部電極間の距離を長くしたものである。これにより、図６に示すように、外部電極に導電性接着剤を収容する段差３２が形成される。この積層コイル部品１Ｂが導電性接着剤３５でプリント基板３０のパッド３１上に実装された際には、余分な導電性接着剤３５ａが段差３２に収容され、外部電極間の導電性接着剤による短絡をより確実に防止できる。 (Refer to the second embodiment, FIGS. 5 and 6)
Further, as shown in FIG. 5, the laminated coil component 1B according to the second embodiment has a substantially U-shaped base external electrode 15 and 16 formed on the front and back surfaces (mounting surface 1a), respectively. The distance between the electrodes is increased. As a result, as shown in FIG. 6, a step 32 for accommodating the conductive adhesive in the external electrode is formed. When the laminated coil component 1B is mounted on the pad 31 of the printed circuit board 30 with the conductive adhesive 35, the excess conductive adhesive 35a is accommodated in the step 32, and is formed by the conductive adhesive between the external electrodes. Short circuit can be prevented more reliably.

具体的には、プリント基板３０のパッド３１上に５０μｍの厚みの導電性接着剤３５を塗布し、積層コイル部品１Ｂを実装した。この場合、導電性接着剤３５のはみ出しは０．０４ｍｍであった。   Specifically, a conductive adhesive 35 having a thickness of 50 μm was applied on the pad 31 of the printed circuit board 30, and the laminated coil component 1B was mounted. In this case, the protrusion of the conductive adhesive 35 was 0.04 mm.

（第３実施例、図７参照）
また、図７に示すように、第３実施例である積層コイル部品１Ｃは、表裏面（実装面１ａ）にそれぞれ形成する下地外部電極１７を正方形形状にして、実質的に外部電極の面積を小さくしたものである。これにより、この積層コイル部品１Ｃが導電性接着剤でプリント基板に実装された際には、余分な導電性接着剤が段差に収容され、外部電極間の導電性接着剤による短絡をより確実に防止できる。 (Refer to the third embodiment, FIG. 7)
Further, as shown in FIG. 7, in the laminated coil component 1C according to the third embodiment, the base external electrode 17 formed on the front and back surfaces (mounting surface 1a) is formed in a square shape so that the area of the external electrode is substantially reduced. It is a small one. Thereby, when this laminated coil component 1C is mounted on the printed circuit board with the conductive adhesive, the excess conductive adhesive is accommodated in the step, and the short circuit due to the conductive adhesive between the external electrodes is more reliably performed. Can be prevented.

具体的には、プリント基板のパッド上に５０μｍの厚みの導電性接着剤を塗布し、積層コイル部品１Ｃを実装した。この場合、導電性接着剤のはみ出しは０．０３ｍｍであった。   Specifically, a conductive adhesive having a thickness of 50 μm was applied on the pad of the printed board, and the laminated coil component 1C was mounted. In this case, the protrusion of the conductive adhesive was 0.03 mm.

（電子機器）
以上は螺旋状コイルを内蔵した電子部品について説明したが、これらの電子部品を基板上に搭載してＬＣフィルタや高周波共振器などの電子機器を構成することができる。 (Electronics)
Although the above description has been made on the electronic component incorporating the spiral coil, it is possible to configure an electronic device such as an LC filter or a high-frequency resonator by mounting these electronic components on a substrate.

（他の実施例）
なお、本発明に係る電子部品の製造方法、電子部品、及び電子機器は、前記実施例に限定するものではなく、その要旨の範囲内で種々に変更することができる。 (Other examples)
The electronic component manufacturing method, the electronic component, and the electronic device according to the present invention are not limited to the above-described embodiments, and can be variously modified within the scope of the gist thereof.

例えば、図８及び図９に示すように、表裏面（実装面１ａ）に帯状の下地外部電極２１，２２を形成した積層コイル部品１Ｄ，１Ｅであってもよい。この積層コイル部品１Ｄ，１Ｅにあっては、導電性接着剤が帯状の下地外部電極２１，２２によって堰き止められ、導電性接着剤のはみ出しをより確実に防止できる。さらに、導電性接着剤が帯状の下地外部電極２１，２２に沿って積層コイル部品１Ｄ，１Ｅの短辺方向に徐々に移動するため、導電性接着剤の内部に気泡を残留させないで実装することができる。   For example, as shown in FIGS. 8 and 9, laminated coil components 1 </ b> D and 1 </ b> E in which strip-shaped base external electrodes 21 and 22 are formed on the front and back surfaces (mounting surface 1 a) may be used. In the laminated coil components 1D and 1E, the conductive adhesive is blocked by the strip-shaped base external electrodes 21 and 22, and the protruding of the conductive adhesive can be more reliably prevented. Furthermore, since the conductive adhesive gradually moves along the strip-shaped base external electrodes 21 and 22 in the short side direction of the laminated coil components 1D and 1E, mounting without leaving bubbles inside the conductive adhesive. Can do.

また、前記実施例では、外部電極を２層構造としているが、３層構造以上であってもよい。例えば、下地外部電極（第１の外部電極）を２層以上に形成してもよいし、上層外部電極（第２の外部電極）を２層以上に形成してもよい。内部電極の形状や配置は勿論任意である。   In the embodiment, the external electrode has a two-layer structure, but it may have a three-layer structure or more. For example, the base external electrode (first external electrode) may be formed in two or more layers, and the upper external electrode (second external electrode) may be formed in two or more layers. Of course, the shape and arrangement of the internal electrodes are arbitrary.

本発明に係る電子部品の第１実施例を示す分解構成図。1 is an exploded configuration diagram showing a first embodiment of an electronic component according to the present invention. 図１に示した電子部品の製造方法の一実施例を示す斜視図。The perspective view which shows one Example of the manufacturing method of the electronic component shown in FIG. 図２に続く製造方法を示す斜視図。The perspective view which shows the manufacturing method following FIG. 図３に示した電子部品の外部電極の要部断面図。FIG. 4 is an essential part cross-sectional view of an external electrode of the electronic component shown in FIG. 3. 本発明に係る電子部品の第２実施例を示す斜視図。The perspective view which shows 2nd Example of the electronic component which concerns on this invention. 図５に示した電子部品をプリント基板に実装した状態を模式的に示す立面図。FIG. 6 is an elevational view schematically showing a state where the electronic component shown in FIG. 5 is mounted on a printed board. 本発明に係る電子部品の第３実施例を示す斜視図。The perspective view which shows 3rd Example of the electronic component which concerns on this invention. 本発明に係る電子部品の他の実施例を模式的に示す平面図。The top view which shows typically the other Example of the electronic component which concerns on this invention. 本発明に係る電子部品のさらに他の実施例を模式的に示す平面図。The top view which shows typically the further another Example of the electronic component which concerns on this invention.

符号の説明Explanation of symbols

１Ａ〜１Ｅ…積層コイル部品
１ａ…実装面
２ａ，２ｂ，２ｃ…セラミックグリーンシート
３…内部電極
４，５，１５，１６，１７，２１，２２…下地外部電極（第１の外部電極）
６…上層外部電極（第２の外部電極）
１０…焼結体 DESCRIPTION OF SYMBOLS 1A-1E ... Laminated coil component 1a ... Mounting surface 2a, 2b, 2c ... Ceramic green sheet 3 ... Internal electrode 4, 5, 15, 16, 17, 21, 22 ... Base external electrode (1st external electrode)
6: Upper external electrode (second external electrode)
10 ... Sintered body

Claims (6)

内部電極を設けた複数のセラミックグリーンシートを積層して積層体を形成する工程と、
前記積層体の実装面に第１の外部電極を形成する工程と、
前記積層体を焼成して焼結体を得る工程と、
前記第１の外部電極を含む前記焼結体の表面に、前記内部電極と電気的に接続する第２の外部電極を形成する工程と、
を備えたことを特徴とする電子部品の製造方法。 Laminating a plurality of ceramic green sheets provided with internal electrodes to form a laminate;
Forming a first external electrode on the mounting surface of the laminate;
Firing the laminate to obtain a sintered body;
Forming a second external electrode electrically connected to the internal electrode on the surface of the sintered body including the first external electrode;
A method for manufacturing an electronic component, comprising: 前記第１の外部電極はセラミックグリーンシートに導電ペーストを印刷して形成することを特徴とする請求項１に記載の電子部品の製造方法。   The method of manufacturing an electronic component according to claim 1, wherein the first external electrode is formed by printing a conductive paste on a ceramic green sheet. 前記第２の外部電極は前記焼結体を導電ペーストに浸漬させて形成することを特徴とする請求項１又は請求項２に記載の電子部品の製造方法。   The method of manufacturing an electronic component according to claim 1, wherein the second external electrode is formed by immersing the sintered body in a conductive paste. 前記第１の外部電極は前記実装面の前記第２の外部電極が形成される領域の一部にのみ形成されていることを特徴とする請求項１ないし請求項３のいずれかに記載の電子部品の製造方法。   4. The electron according to claim 1, wherein the first external electrode is formed only in a part of a region of the mounting surface where the second external electrode is formed. 5. A manufacturing method for parts. 請求項１ないし請求項４のいずれかに記載の電子部品の製造方法によって製造された電子部品であって、該電子部品の実装面に形成された外部電極の一部の領域が、前記第１の外部電極と前記第２の外部電極を積層した少なくとも２層からなることを特徴とする電子部品。   5. The electronic component manufactured by the electronic component manufacturing method according to claim 1, wherein a partial region of the external electrode formed on the mounting surface of the electronic component is the first component. An electronic component comprising at least two layers in which the external electrode and the second external electrode are laminated. 基板に導電性接着剤によって実装された請求項５に記載の電子部品を備えたことを特徴とする電子機器。   An electronic device comprising the electronic component according to claim 5 mounted on a substrate with a conductive adhesive.
JP2006133445A 2006-05-12 2006-05-12 Method for manufacturig electronic component, electronic component, and electronic equipment Pending JP2007305830A (en)

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JP2010510644A (en) * 2006-11-16 2010-04-02 エプコス アクチエンゲゼルシャフト Component structure
JP2013084701A (en) * 2011-10-07 2013-05-09 Taiyo Yuden Co Ltd Electronic component and method of manufacturing the same
JP2016032050A (en) * 2014-07-29 2016-03-07 太陽誘電株式会社 Coil component, manufacturing method thereof, and electronic apparatus
US20190096568A1 (en) * 2017-09-22 2019-03-28 Samsung Electro-Mechanics Co., Ltd. Electronic component
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Publication number Priority date Publication date Assignee Title
JP2010510644A (en) * 2006-11-16 2010-04-02 エプコス アクチエンゲゼルシャフト Component structure
JP2009128229A (en) * 2007-11-26 2009-06-11 Rohm Co Ltd Microchip
JP2013084701A (en) * 2011-10-07 2013-05-09 Taiyo Yuden Co Ltd Electronic component and method of manufacturing the same
JP2016032050A (en) * 2014-07-29 2016-03-07 太陽誘電株式会社 Coil component, manufacturing method thereof, and electronic apparatus
KR20190033765A (en) * 2017-09-22 2019-04-01 삼성전기주식회사 Electronic component
CN109545503A (en) * 2017-09-22 2019-03-29 三星电机株式会社 Electronic building brick
US20190096568A1 (en) * 2017-09-22 2019-03-28 Samsung Electro-Mechanics Co., Ltd. Electronic component
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US11101065B2 (en) 2017-09-22 2021-08-24 Samsung Electro-Mechanics Co., Ltd. Electronic component
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US11398343B2 (en) 2018-04-25 2022-07-26 Samsung Electro-Mechanics Co., Ltd. Coil component

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