JP2007284758A - Vacuum device member, its manufacturing method, and vacuum device - Google Patents

Vacuum device member, its manufacturing method, and vacuum device Download PDF

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JP2007284758A
JP2007284758A JP2006114743A JP2006114743A JP2007284758A JP 2007284758 A JP2007284758 A JP 2007284758A JP 2006114743 A JP2006114743 A JP 2006114743A JP 2006114743 A JP2006114743 A JP 2006114743A JP 2007284758 A JP2007284758 A JP 2007284758A
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film
pleated
sprayed film
splats
base material
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JP4910465B2 (en
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Michio Okamoto
美智雄 岡本
Koyata Takahashi
小弥太 高橋
Osamu Matsunaga
修 松永
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Tosoh Corp
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Tosoh Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum device member to be used for film deposition on a substrate of a semi-conductor, a flat panel display or the like, which has a holding power effective for even a film-like substance with very weak deposition property that a film deposited on a target is peeled off during the film deposition operation and re-deposited on the periphery thereof, and is free from generation of any particles or abnormal discharge, and continuously usable for a long time. <P>SOLUTION: In the vacuum device member, a pleat-like spray deposit film is provided on a base material, in which lump-shaped projections with splats stacked in an inclined manner and valley parts with few splats stacked are alternately present. Preferably, the width of the lump-shaped projections is 50-500 μm, the width of the valleys is 100-500 μm, the depth of the valleys is 100-1,000 μm, and the stacking direction of the lumped projection forms an angle of 30-80° with respect to the base material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、半導体やフラットパネルディスプレイ等の製造における成膜用真空装置に係わり、装置内に装着されて、製造工程で付着する膜状物質をより多く保持し、剥離による発塵が少ない真空装置部材を提供するものである。   The present invention relates to a vacuum apparatus for film formation in the manufacture of semiconductors, flat panel displays, etc., and is a vacuum apparatus that is mounted in the apparatus and holds more film-like substances adhering in the manufacturing process and generates less dust due to peeling. A member is provided.

半導体やフラットパネルディスプレイ等の製造工程で用いられる成膜用真空装置では、その装置内部に用いられる部材上に膜状物質が付着する。このような状態で成膜処理を連続で行うと、付着した膜状物質が厚くなり、それらがやがて剥離して装置内の発塵となり、装置内及び基板を汚染することが知られている。この現象は製品基板の品質低下や歩留まり低下の原因となる大きな問題であった。   In a film forming vacuum apparatus used in a manufacturing process of a semiconductor, a flat panel display, or the like, a film-like substance adheres to a member used in the apparatus. It is known that when the film forming process is continuously performed in such a state, the attached film-like substances become thick, and eventually peel off to generate dust in the apparatus, which contaminates the apparatus and the substrate. This phenomenon is a major problem that causes a reduction in product substrate quality and yield.

従来、膜状付着物の剥離による発塵を低減する方法としては、真空装置部材にアーク溶射法を用いて比較的凹凸の大きい面を形成することにより、膜状物質の付着性を高める事が知られている（例えば、特許文献１参照）。また、プラズマ溶射法を用いて、表面の凹凸を精密に制御することで膜状付着物の付着性を大きくする方法も知られている（例えば、特許文献２参照）。これらの溶射膜は、シールド（防着板）やバッキングプレート等のターゲット周辺部材に施されることも知られている（例えば、特許文献３参照）。   Conventionally, as a method of reducing dust generation due to peeling of film-like deposits, it is possible to increase the adhesion of film-like substances by forming a relatively uneven surface on the vacuum apparatus member using arc spraying. It is known (see, for example, Patent Document 1). In addition, there is also known a method of increasing the adhesion of a film-like deposit by precisely controlling surface irregularities using a plasma spraying method (see, for example, Patent Document 2). It is also known that these sprayed films are applied to target peripheral members such as a shield (a deposition preventing plate) and a backing plate (see, for example, Patent Document 3).

特開平０９−２７２９６５号公報JP 09-272965 A 特開２００１−２４９５７号公報JP 2001-24957 A ＷＯ２００２／０４０７３３号公報WO2002 / 040733

上述した従来のアーク溶射法やプラズマ溶射法を用いて、真空装置部材表面に溶射膜を形成することにより、膜状物質の保持性が高まり、真空装置部材を比較的長期に使用することが可能である。しかしながら、これらの溶射膜が形成された真空装置部材をターゲットを用いた成膜装置に使用した場合、当該部材は、成膜操作中にターゲット上に付着した膜が剥がれてその周辺に再付着した、「付着性が非常に弱い膜状物質」に対して十分な効果がないため、この膜状物質は再飛散しパーティクルや異常放電の原因となっていた。   By using the conventional arc spraying method or plasma spraying method described above to form a sprayed film on the surface of the vacuum device member, the retention of the film-like substance is enhanced, and the vacuum device member can be used for a relatively long period of time. It is. However, when the vacuum apparatus member on which these sprayed films are formed is used for a film forming apparatus using a target, the member attached to the target peels off during the film forming operation and reattaches to the periphery thereof. Since the film-like substance does not have a sufficient effect on the “film-like substance having very weak adhesion”, the film-like substance rescatters and causes particles and abnormal discharge.

本発明は、半導体やフラットパネルディスプレイ等の基板への成膜に用いる真空装置の部材において、従来よりもさらに、膜状物質の保持性を高め、付着性が非常に弱い膜状物質に対しても長時間の連続使用が可能な部材を提供するものである。   The present invention relates to a vacuum apparatus member used for forming a film on a substrate such as a semiconductor or a flat panel display. The present invention also provides a member that can be used continuously for a long time.

本発明者は、上述のような現状に鑑み、鋭意検討を行った結果、基材面に対し比較的小さな角度で溶射することで、スプラットが傾斜して積み重なった塊状突起と、溶射中に塊上突起の影となりスプラットが積み重なっていない谷の部分が交互に存在するひだ状溶射膜を形成することが可能で、該ひだ状溶射膜を真空装置部材に施すことで、付着性が非常に弱い膜状物質に対しても優れた保持性を有することを見い出し、本発明を完成させるに至ったものである。   As a result of diligent examination in view of the above-described present situation, the present inventor has performed thermal spraying at a relatively small angle with respect to the base material surface, so that lumped protrusions in which splats are inclined and stacked, and masses during spraying. It is possible to form a pleated sprayed film in which the valleys where the splats are not stacked are shaded by the upper projections, and the adhesion is very weak by applying the pleated sprayed film to the vacuum apparatus member. It has been found that the film-like substance has excellent retention, and the present invention has been completed.

以下に本発明を詳細に説明する。   The present invention is described in detail below.

本発明の真空装置部材は図１に示すように、基材１０上にスプラット１１が傾斜して積み重なった塊状突起１２とスプラットが積み重なっていない谷１３の部分が交互に存在するひだ状溶射膜１４を施したものである。ここでスプラットとは、図２に示すように、溶射される粉末２３が溶射ガン２０より発生する溶射のフレーム２１へ投入されて溶融し、フレームの流れにより加速２４されて、基材２２に衝突し、扁平して付着した粒子２５のことである。連続的に粉末を供給することでスプラット２５が積み重なり、溶射膜が得られる。   As shown in FIG. 1, the vacuum apparatus member of the present invention has a pleated sprayed film 14 in which lumped protrusions 12 in which splats 11 are inclined and stacked on a substrate 10 and valleys 13 where splats are not stacked alternately exist. Is given. Here, as shown in FIG. 2, the splat means that the powder 23 to be sprayed is introduced into the spray frame 21 generated by the spray gun 20 and melted, accelerated 24 by the flow of the frame, and collided with the base material 22. The particles 25 are flat and adhered. By continuously supplying the powder, the splats 25 are stacked to obtain a sprayed film.

本発明のひだ状溶射膜は、塊状突起の幅が５０〜５００μｍであり、ひだ状溶射膜の谷部分の幅が１００〜５００μｍであり、ひだ状溶射膜の谷の深さが１００〜１０００μｍであり、塊状突起の積み重なる方向が基材に対し、３０〜８０度であることをが好ましい。   In the pleated sprayed film of the present invention, the width of the massive projection is 50 to 500 μm, the width of the valley portion of the pleated sprayed film is 100 to 500 μm, and the depth of the valley of the pleated sprayed film is 100 to 1000 μm. It is preferable that the direction in which the massive protrusions are stacked is 30 to 80 degrees with respect to the base material.

本発明でいう塊状突起の幅、ひだ状溶射膜の谷の幅、谷の深さ及び塊状突起の堆積する角度とは、図３のように、塊状突起の２倍以上の幅で、基材３０の凸の頂点３点と凹の頂点３点の中心高さの線を、基材の表面線３１とし、表面線に対し塊状突起の最頂上までの高さを３２として、表面線と塊状突起最頂部の中心線３３を引き、中心線と交わる塊状突起部分を幅３４とし、塊状突起で定めた中心線３３と交わる谷の部分を谷の幅３５とした。また、塊状突起の最頂部までの高さ３２を谷の深さとし、塊状突起の積み重なる方向の中心線３６を引き、基材との角度を３７とした。   In the present invention, the width of the massive protrusion, the width of the valley of the pleated sprayed film, the depth of the valley, and the angle at which the massive protrusion is deposited are, as shown in FIG. The line of the center height of 30 convex vertices and 3 concave vertices is the surface line 31 of the base material, and the height to the top of the massive protrusion is 32 with respect to the surface line. The center line 33 at the top of the protrusion was drawn, and a lump portion intersecting the center line was defined as a width 34, and a trough portion intersecting the center line 33 defined by the lump protrusion was defined as a valley width 35. Further, the height 32 to the top of the massive protrusion was defined as the depth of the valley, the center line 36 in the direction in which the massive protrusions were stacked was drawn, and the angle with the substrate was 37.

突起の幅３４に関して、幅が５０μｍより小さい場合には、溶射膜上に膜状物質が付着する際に、膜状物質の持つ応力により塊状突起が破損しやすくなる。一方、５００μｍを超える場合には、塊状突起の間の谷が狭くなり、付着性が非常に弱い膜状物質の保持性が低下する。そのため、塊状突起の幅は、８０〜３００μｍの範囲がさらに好ましい。   With respect to the width 34 of the protrusion, when the width is smaller than 50 μm, when the film-like substance is deposited on the sprayed film, the massive protrusion is easily damaged by the stress of the film-like substance. On the other hand, when it exceeds 500 μm, the valleys between the massive projections are narrowed, and the retention of the film-like substance having very weak adhesion is lowered. Therefore, the width of the massive protrusion is more preferably in the range of 80 to 300 μm.

ひだ状溶射膜の谷の幅３５が１００μｍ未満では、溶射膜上において、付着性が非常に弱い膜状物質を保持するための隙間が小さくなって、保持性が低下する。一方、谷の幅が５００μｍを超えると隣り合う塊状突起の隙間が大きくなりすぎ、単位面積あたりの塊状突起の密度が少なくなり、膜状物質の保持性が低下する。上述した理由より、ひだ状溶射膜の谷の幅は、１００〜３００μｍの範囲がさらに好ましい。   When the width 35 of the valley of the pleated sprayed film is less than 100 μm, the gap for holding the film-like substance having very weak adhesion is reduced on the sprayed film, and the retainability is lowered. On the other hand, when the width of the valley exceeds 500 μm, the gap between adjacent massive projections becomes too large, the density of massive projections per unit area decreases, and the retention of the film-like substance decreases. For the reasons described above, the width of the valley of the pleated sprayed film is more preferably in the range of 100 to 300 μm.

なお、谷の部分においてはスプラットがないことが好ましいが、現実的には溶射条件によって谷の部分にスプラットが積み重なることがある。しかしながら、この部分の厚みが塊状突起の高さに対して１００μｍ以上の差があれば、実質的には問題がない。   In addition, although it is preferable that there is no splat in the valley portion, in reality, the splat may be stacked in the valley portion depending on the spraying condition. However, if there is a difference of 100 μm or more in the thickness of this portion with respect to the height of the massive protrusion, there is substantially no problem.

ひだ状溶射膜の谷の深さ３２は１００〜１０００μｍが好ましい。谷の深さが１００μｍ未満では谷が浅くなり、付着性が非常に弱い膜状物質の保持性が低下する。一方、谷の深さが１０００μｍを超えるとひだ状溶射膜の膜厚みが１０００μｍを超え、製造することが困難となる。上述した理由より、ひだ状溶射膜の谷の深さは、１００〜５００μｍの範囲がさらに好ましい。   The depth 32 of the valley of the pleated sprayed film is preferably 100 to 1000 μm. If the depth of the valley is less than 100 μm, the valley becomes shallow and the retention of the film-like substance having very weak adhesion is lowered. On the other hand, if the depth of the valley exceeds 1000 μm, the film thickness of the pleated sprayed film exceeds 1000 μm, which makes it difficult to manufacture. For the reason described above, the depth of the valley of the pleated sprayed film is more preferably in the range of 100 to 500 μm.

塊状突起の積み重なる角度３７は基材に対し、３０度より小さいとひだ状溶射膜の谷の幅が狭くなり、付着性が非常に弱い膜状物質の保持性が低下する。一方、角度が８０度を超えると塊状突起間の急峻な谷の存在が無くなり、付着性が非常に弱い膜状物質の保持性が低下してパーティクルが発生し易くなる。上述した理由より、塊状突起の積み重なる角度は、基材に対し、３５〜７０度の範囲がより好ましく、さらに好ましくは４０〜６０度の範囲である。   If the angle 37 at which the massive projections are stacked is less than 30 degrees with respect to the base material, the width of the valley of the pleated sprayed film becomes narrow, and the retention of the film-like substance having very weak adhesion is lowered. On the other hand, when the angle exceeds 80 degrees, the existence of steep valleys between the massive protrusions is eliminated, and the retention of the film-like substance having very weak adhesion is lowered and particles are easily generated. For the reasons described above, the stacking angle of the massive protrusions is more preferably in the range of 35 to 70 degrees, and further preferably in the range of 40 to 60 degrees with respect to the base material.

次に、本発明においては、スプラットを堆積させる基材４０上に均等にスプラットが付着し堆積した溶射膜４１を下地層として用い、その上にひだ状溶射膜４２を形成しても良い。ひだ状溶射膜の塊状突起の基材への密着力をより高めることができ、好ましい。   Next, in the present invention, the sprayed film 41 on which the splats are uniformly deposited and deposited on the base material 40 on which the splats are deposited may be used as the underlayer, and the pleated sprayed film 42 may be formed thereon. The adhesion force of the lumped projections of the pleated sprayed film to the substrate can be further increased, which is preferable.

下地層の材質としては、塊状突起と基材との密着性を低下させないものであれば、特に制限なく用いることができるが、塊状突起を形成する材質と同じものが好ましい。なお、下地層を形成した場合の表面線は、先に述べた基材表面線３１のかわりに、塊状突起の２倍以上の幅における下地層の凸の頂点３点と凹の頂点３点の中心高さの線とする。   The material for the underlayer can be used without particular limitation as long as it does not reduce the adhesion between the massive protrusions and the substrate, but the same material as that for forming the massive protrusions is preferable. In addition, the surface line in the case of forming an underlayer has three convex vertices and three concave vertices of the underlayer in a width more than twice that of the massive protrusion, instead of the substrate surface line 31 described above. The line is the center height.

本発明のひだ状溶射膜を施した真空装置部材は、基板へ成膜したり、基板をエッチングしてチャンバーに膜が付着するような真空装置に用いることが出来る。特にスパッタ装置ではターゲットから剥離してくる、付着性が非常に弱い膜状物質が付着するバッキングプレートやその周辺部材への溶射が効果的である。   The vacuum apparatus member provided with the pleated sprayed film of the present invention can be used for a vacuum apparatus in which a film is formed on a substrate or a film is adhered to a chamber by etching the substrate. Particularly, in the sputtering apparatus, thermal spraying onto a backing plate and its peripheral members to which a film-like substance having very weak adhesion is peeled off from the target is effective.

本発明のひだ状溶射膜は、付着性が非常に弱い膜状物質に対して、谷の部分に保持し再飛散を防止する効果が大きい。例えば、図５に示すようにターゲット５０に対し、シールド５１にひだ状溶射膜５２を施す場合においては、ひだ状溶射膜の谷の部分への付着を効果的に行うために、ひだ状溶射膜の谷の開口方向５３が重力５４の反対方向に向けることがさらに好ましい。タ−ゲット及び基板５５の位置関係は図５に囚われず、逆でもよい。   The pleated sprayed coating of the present invention has a great effect of preventing re-scattering by holding it in the valley portion with respect to a film-like substance having very weak adhesion. For example, as shown in FIG. 5, when a pleated sprayed film 52 is applied to the shield 51 with respect to the target 50, the pleated sprayed film is effectively applied to the valley portion of the pleated sprayed film. More preferably, the opening direction 53 of the trough is directed in the direction opposite to the gravity 54. The positional relationship between the target and the substrate 55 is not restricted by FIG. 5 and may be reversed.

基材の材質としては、特に限定されないが、例えば、石英ガラス、アルミナ、ジルコニア、ムライト等のセラミック基材や、銅、アルミ、ステンレス、チタン等のメタル基材を使用してもよい。   The material of the base material is not particularly limited, and for example, a ceramic base material such as quartz glass, alumina, zirconia, or mullite, or a metal base material such as copper, aluminum, stainless steel, or titanium may be used.

本発明のひだ状溶射膜を構成する材料としては、金属においてはＡｌ、Ｔｉ、Ｃｕ、Ｍｏ、Ｗ等、合金においては、ＮｉとＡｌ、ＭｏとＣ、ＡｌとＳｉ等、セラミックにおいてはアルミナ、ジルコニア、チタニア、スピネル、ジルコン等、溶射可能な材料であればよい。   As materials constituting the pleated sprayed film of the present invention, Al, Ti, Cu, Mo, W, etc. for metals, Ni and Al, Mo and C, Al and Si, etc. for alloys, alumina for ceramics, Any material that can be thermally sprayed, such as zirconia, titania, spinel, and zircon, may be used.

次に、本発明のひだ状溶射膜を形成した真空装置部材の製造方法を説明する。   Next, the manufacturing method of the vacuum apparatus member which formed the pleated sprayed film of this invention is demonstrated.

本発明の真空装置部材に形成するひだ状溶射膜の溶射の方式としては特に限定されず、フレーム溶射、アーク溶射、プラズマ溶射などを用いることができる。   The method of spraying the pleated spray film formed on the vacuum apparatus member of the present invention is not particularly limited, and flame spraying, arc spraying, plasma spraying, and the like can be used.

本発明の真空装置部材に形成するひだ状溶射膜の溶射条件としては、溶射ガス流量が３０〜１００リットル毎分、溶射電力が２０〜４０ｋＷ等、溶射膜が形成できる条件であれば良い。   The spraying conditions for the pleated spray film formed on the vacuum apparatus member of the present invention may be any conditions that allow the sprayed film to be formed, such as a spray gas flow rate of 30 to 100 liters per minute and a spray power of 20 to 40 kW.

基材面に対し比較的小さな角度で溶射することで、塊状突起（傾斜して積み重なるスプラット）の影と形成させ、同時に塊状突起による影を利用し、スプラットが付着しない部分、所謂、ひだ状溶射膜の谷を形成させる。上述する塊状突起とひだ状溶射膜の谷を交互に存在するひだ状溶射膜の形成方法において、基材と溶射ガンとの角度とは、図６に示すように、基材６０の表面の水平線６１に対し、溶射ガン６２が投射する方向６３に対し、基材と溶射ガンの角度６４とするが、ひだ状溶射膜を形成するためには、角度を５〜４０度の範囲で溶射することが好ましい。角度が５度より小さいと、基材と溶射ガンが接触し溶射膜を形成させることが困難であり、角度が４０度より大きいと、突起同士の境界が無くなり、塊状突起と谷が形成されにくくなる。そのため表面が平坦となり、付着性が非常に弱い膜状物質の保持性が低下してパーティクルが発生し易くなる。角度は、１０〜３５度の範囲がより好ましく、さらに好ましくは１５〜３０度の範囲である。   By spraying at a relatively small angle with respect to the substrate surface, it is formed as a shadow of massive protrusions (splats that are tilted and stacked), and at the same time, the shadow caused by massive protrusions is used to prevent the splats from adhering, so-called pleated thermal spraying A valley of the film is formed. In the above-described method for forming a pleated sprayed film in which the bumps and pleated sprayed film valleys exist alternately, the angle between the base material and the spray gun is the horizontal line on the surface of the base material 60 as shown in FIG. 61, an angle 64 between the base material and the spray gun is set to a direction 63 projected by the spray gun 62. In order to form a pleated spray film, the angle should be sprayed in the range of 5 to 40 degrees. Is preferred. If the angle is less than 5 degrees, it is difficult to form a sprayed film by contacting the substrate and the spray gun. If the angle is greater than 40 degrees, there is no boundary between the protrusions, and it is difficult to form massive protrusions and valleys. Become. As a result, the surface becomes flat, the retention of the film-like substance having very weak adhesion is lowered, and particles are easily generated. The angle is more preferably in the range of 10 to 35 degrees, and still more preferably in the range of 15 to 30 degrees.

下地層は、基材に対して４５〜９０度の角度で溶射することが好ましい。４５度より小さいと均等に堆積した溶射膜を得ることが難しくなる場合がある。   The underlayer is preferably sprayed at an angle of 45 to 90 degrees with respect to the substrate. If it is less than 45 degrees, it may be difficult to obtain a sprayed film deposited uniformly.

本発明の真空装置部材は、従来部品に比べて成膜装置やターゲット周辺部材においては、付着性が非常に弱い膜状物質の保持性を向上させ、飛散に起因する発塵による製品汚染がなく、なおかつ長時間の連続使用が可能である。   The vacuum apparatus member of the present invention improves the retention of film-like substances with very weak adhesion in the film forming apparatus and target peripheral members compared to conventional parts, and there is no product contamination due to dust generation due to scattering. Moreover, continuous use for a long time is possible.

本発明を実施例に基づき更に詳細に説明するが、本発明はこれらの実施例のみに限定されるものではない。   The present invention will be described in more detail based on examples, but the present invention is not limited only to these examples.

実施例１
ターゲットを使用して成膜する真空装置において使用される部材である、ステンレス製シールドの表面を、ホワイトアルミナのグリットＷＡ＃６０を用いて、圧力０．５ＭＰａでブラスト後、シールド表面に、プラズマガスとしてＡｒと水素の混合ガスを用い、プラズマ電力を３２ｋＷに設定し、原料粉末としてアルミナ純度９９．９９％、平均粒径４５μｍの粉末を用い、プラズマガンとシールド表面の角度を７０度として溶射を行ない、均等に堆積した溶射膜（下地層）１００μｍを形成した。その上に、プラズマガンとシールド表面の角度を１５度として、上記原料粉末を溶射し、ひだ状溶射膜を２００μｍ形成した。溶射後、超純水で超音波洗浄し、クリーンオーブンで乾燥してシールド部材を完成させた。 Example 1
The surface of a stainless steel shield, which is a member used in a vacuum apparatus for forming a film using a target, is blasted with white alumina grit WA # 60 at a pressure of 0.5 MPa, and then plasma gas is applied to the shield surface. As a raw material powder, a powder with an alumina purity of 99.99% and an average particle size of 45 μm is used, and an angle between the plasma gun and the shield surface is set to 70 degrees. Then, a sprayed film (underlayer) 100 μm deposited uniformly was formed. On top of that, the raw material powder was sprayed at an angle between the plasma gun and the shield surface of 15 degrees to form a pleated sprayed film of 200 μm. After spraying, it was ultrasonically cleaned with ultrapure water and dried in a clean oven to complete the shield member.

ステンレス製シールドと同一の条件にて、５インチ角のステンレス基材に該ひだ状溶射膜を製造した。基材からサンプルを切り出して、ＳＥＭ観察を実施し、２００倍にて撮影した４０枚の断面写真より１００個の突起状粒子を抽出して計測したところ、塊状突起の幅は１００〜２００μｍであり、ひだ状溶射膜の谷の幅は１００〜２００μｍであり、ひだ状溶射膜の谷の深さは１８０〜２３０μｍであり、塊状突起の角度は、４５〜６０度であった。   The pleated sprayed film was manufactured on a 5-inch square stainless steel substrate under the same conditions as the stainless steel shield. A sample was cut out from the substrate, SEM observation was carried out, and 100 protruding particles were extracted from 40 cross-sectional photographs taken at 200 times and measured. The width of the massive protrusion was 100 to 200 μm. The width of the valley of the pleated sprayed film was 100 to 200 μm, the depth of the valley of the pleated sprayed film was 180 to 230 μm, and the angle of the massive protrusions was 45 to 60 degrees.

上述した方法により製造したステンレス製シールドを、ＩＴＯ（酸化インジウムと酸化スズの混合セラミック）のターゲットを用いた成膜装置内に、ひだ状溶射膜の谷の開口方向を重力の反対方法になるように取り付けて使用した。ターゲットの交換寿命においても、装置内部に付着性が非常に弱い膜状物質の散乱は認められなかった。   The stainless steel shield manufactured by the method described above is placed in a film forming apparatus using an ITO (mixed ceramic of indium oxide and tin oxide) target so that the opening direction of the valley of the pleated sprayed film becomes a method opposite to gravity. Used by attaching to. Even in the replacement life of the target, scattering of a film-like substance having very weak adhesion was not observed inside the apparatus.

比較例１
ステンレス製シールドの基材に対しプラズマガンの投射角度を１５度のかわりに６５度に維持すること以外は、実施例１と同様の方法として、ステンレス製シールドを完成した。 Comparative Example 1
A stainless steel shield was completed as the same method as Example 1 except that the projection angle of the plasma gun was maintained at 65 degrees instead of 15 degrees with respect to the stainless steel shield substrate.

ステンレス製シールドと同一の条件にて、５インチ角のステンレス板基材にアルミナ溶射膜を作製した。基材からサンプルを切り出して、実施例１と同様の方法にてＳＥＭ観察を実施したところ、溶射膜は均等に堆積する溶射膜となっており、ひだ状溶射膜は見られなかった。   An alumina sprayed film was produced on a 5-inch square stainless steel plate base material under the same conditions as the stainless steel shield. When the sample was cut out from the base material and SEM observation was performed by the same method as in Example 1, the sprayed film was a sprayed film deposited uniformly and no pleated sprayed film was seen.

上述した方法により製造したステンレス製シールドをスパッタリング装置に取り付けて使用した。ターゲット交換寿命に近づくにつれて、異常放電が多くなり、ターゲット交換寿命のために、装置をあけると付着性が非常に弱い膜状物質がシールドからチャンバー内部に多数落ちており、パーティクル発生が明瞭であった。   A stainless steel shield manufactured by the method described above was used by attaching it to a sputtering apparatus. As the target replacement life is approached, abnormal discharge increases, and due to the target replacement life, when the device is opened, many film-like substances with very weak adhesion have fallen from the shield into the chamber, and particle generation is clear. It was.

実施例２
銅製のバッキングプレート表面をホワイトアルミナのグリットＷＡ＃６０を用いて、圧力０．５ＭＰａでブラスト後、その後、バッキングプレート表面に、プラズマガスとしてＡｒガスを使用し、プラズマ電力を３０ｋＷに設定し、原料粉末としてアルミニウム純度９９．７％、平均粒径６０μｍの粉末を用い、プラズマガンとバッキングプレート表面の角度を３０度として、プラズマ溶射によりひだ状溶射膜を５００μｍ形成した。溶射後、超純水で超音波洗浄し、クリーンオーブンで乾燥し、バッキングプレートを製造した。 Example 2
After blasting the copper backing plate surface with white alumina grit WA # 60 at a pressure of 0.5 MPa, Ar gas is used as the plasma gas on the backing plate surface, and the plasma power is set to 30 kW. A powder having an aluminum purity of 99.7% and an average particle size of 60 μm was used as the powder, and an angle between the plasma gun and the backing plate surface was set to 30 degrees, and a pleated sprayed film was formed to 500 μm by plasma spraying. After spraying, the substrate was ultrasonically cleaned with ultrapure water and dried in a clean oven to produce a backing plate.

バッキングプレートへの溶射条件と同一の条件にて、５インチ角の銅基材に該ひだ状溶射膜を製造した。基材からサンプルを切り出して、ＳＥＭ観察を実施し、２００倍にて撮影した４０枚の断面写真より１００個の突起状粒子を抽出して計測したところ、塊状突起の幅は１５０〜２５０μｍであり、ひだ状溶射膜の谷の幅は２００〜２５０μｍであり、ひだ状溶射膜の谷の深さは４５０〜５００μｍであり、塊状突起の角度は、６０〜７０度であった。   The pleated sprayed film was produced on a 5-inch square copper base material under the same conditions as the spraying conditions on the backing plate. A sample was cut out from the substrate, SEM observation was performed, and 100 protruding particles were extracted and measured from 40 cross-sectional photographs taken at 200 times, and the width of the massive protrusion was 150 to 250 μm. The width of the valley of the pleated sprayed film was 200 to 250 μm, the depth of the valley of the pleated sprayed film was 450 to 500 μm, and the angle of the massive protrusions was 60 to 70 degrees.

上述した方法により製造したバッキングプレートにＩＴＯ（酸化インジウムと酸化スズのセラミック）ターゲットを接合したものをスパッタリング装置に取り付けて成膜した。ターゲットの交換寿命においても、装置内部に付着性が非常に弱い膜状物質の散乱は認められなかった。   A film obtained by attaching an ITO (indium oxide and tin oxide ceramic) target bonded to the backing plate manufactured by the above-described method in a sputtering apparatus was formed. Even in the replacement life of the target, scattering of a film-like substance having very weak adhesion was not observed inside the apparatus.

比較例２
銅製バッキングプレートの基材に対しプラズマガンの投射角度を３０度のかわりに９０度とすること以外は、実施例２と同様の方法として、バッキングプレートを製造した。 Comparative Example 2
A backing plate was produced in the same manner as in Example 2, except that the projection angle of the plasma gun was set to 90 degrees instead of 30 degrees with respect to the copper backing plate substrate.

バッキングプレートへの溶射条件と同一の条件にて、５インチ角の銅板基材にアルミ溶射膜を製造した。基材からサンプルを切り出して、実施例２と同様の方法にてＳＥＭ観察を実施したところ、スプラットが均等に堆積した膜となっており、ひだ状溶射膜は見られなかった。   An aluminum sprayed film was produced on a 5-inch square copper plate base material under the same conditions as the spraying conditions on the backing plate. When a sample was cut out from the substrate and SEM observation was carried out in the same manner as in Example 2, it was a film in which splats were uniformly deposited, and no pleated sprayed film was seen.

上述した方法により製造したバッキングプレートにＩＴＯターゲットを接合したものをスパッタリング装置に取り付けて成膜した。ターゲット交換寿命に近づくにつれて、異常放電が多くなり、ターゲット交換寿命のために、装置をあけると付着性が非常に弱い膜状物質がシールドからチャンバー内部に多数落ちており、パーティクル発生が明瞭であった。   A film formed by attaching an ITO target to a backing plate manufactured by the above-described method was attached to a sputtering apparatus. As the target replacement life is approached, abnormal discharge increases, and due to the target replacement life, when the device is opened, many film-like substances with very weak adhesion have fallen from the shield into the chamber, and particle generation is clear. It was.

本発明のひだ状溶射膜の塊状突起及び谷を示す図である。It is a figure which shows the massive protrusion and trough of the pleated sprayed film of this invention. 溶射におけるスプラットの形成を示す図である。It is a figure which shows formation of the splat in thermal spraying. 本発明のひだ状溶射膜の塊状突起の幅、及びひだ状溶射膜の谷の幅並びに深さ、ひだ状溶射膜の塊状突起の角度を示す図である。It is a figure which shows the width | variety of the massive processus | protrusion of the pleated sprayed film of this invention, the width | variety and depth of the trough of a pleated sprayed film, and the angle of the massive processus | protrusion of a pleated sprayed film. 下地に均等に付着する溶射膜上にひだ状溶射膜を形成した図である。It is the figure which formed the pleated sprayed film on the sprayed film which adheres uniformly to the foundation | substrate. 請求項５の真空様装置部材の取り付け例を示した図である。It is the figure which showed the example of attachment of the vacuum-like apparatus member of Claim 5. 本発明のひだ状溶射膜の製造方法を示す図である。It is a figure which shows the manufacturing method of the pleated sprayed film of this invention.

符号の説明Explanation of symbols

１０：基材
１１：スプラット
１２：塊状突起
１３：塊状突起の谷
１４：ひだ状溶射膜
２０：溶射ガン
２１：フレーム
２２：基材
２３：粉末（溶射材料）
２４：溶融加速された粒子
２５：扁平し付着した粒子（スプラット）
３０：基材
３１：基材表面線
３２：塊状突起の高さ
３３：塊状突起の高さの中心線
３４：塊状突起の幅
３５：ひだ状溶射膜の谷幅
３６：塊状突起の中心線
３７：塊状突起の中心線の角度
４０：基材
４１：均等な溶射膜
４２：ひだ状溶射膜
５０：ターゲット
５１：シールド
５２：ひだ状溶射膜（塊状突起）
５３：谷の開口方向
５４：重力
５５：基板（ウエハ等）
６０：基材
６１：基材表面の水平線
６２：溶射ガン
６３：溶射ガンの投射する方向
６４：角度
10: base material 11: splat 12: massive protrusion 13: trough valley 14: pleated thermal spray film 20: thermal spray gun 21: frame 22: base material 23: powder (thermal spray material)
24: Melt accelerated particles 25: Flattened and adhered particles (splats)
30: Base material 31: Surface line of base material 32: Height of massive protrusion 33: Center line of height of massive protrusion 34: Width of massive protrusion 35: Valley width of pleated sprayed film 36: Center line of massive protrusion 37 : Angle of center line of massive projection 40: base material 41: uniform sprayed film 42: pleated sprayed film 50: target 51: shield 52: pleated sprayed film (lumped projection)
53: Opening direction of valley 54: Gravity 55: Substrate (wafer, etc.)
60: Substrate 61: Horizontal line on substrate surface
62: Thermal spray gun
63: Direction of spray gun
64: Angle

Claims (6)

基材上にひだ状溶射膜を形成した真空装置部材であって、該ひだ状の溶射膜は溶射膜を構成するスプラットが傾斜して積み重なった塊状突起とスプラットが積み重なっていない谷の部分とが交互に存在する事を特徴とする真空装置部材。 A vacuum apparatus member in which a pleated sprayed film is formed on a substrate, and the pleated sprayed film is composed of massive projections in which splats constituting the sprayed film are stacked and inclined and valley portions where splats are not stacked. A vacuum device member characterized by being alternately present. 前記ひだ状溶射膜の塊状突起の幅が５０〜５００μｍであり、ひだ状溶射膜の谷の幅が１００〜５００μｍであり、ひだ状溶射膜の谷の深さが１００〜１０００μｍであり、塊状突起の積み重なる方向が基材に対し、３０〜８０度であることを特徴とする請求項１に記載の真空装置部材。 The ridge-like sprayed film has a massive projection having a width of 50 to 500 μm, the pleated sprayed film has a valley width of 100 to 500 μm, the pleated sprayed film has a valley depth of 100 to 1000 μm, The vacuum device member according to claim 1, wherein the stacking direction is 30 to 80 degrees with respect to the base material. ひだ状溶射膜と基材との間に、溶射膜により形成した下地層を有していることを特徴とする請求項１または請求項２に記載の真空装置部材。 The vacuum apparatus member according to claim 1 or 2, further comprising an underlayer formed of a sprayed film between the pleated sprayed film and the substrate. 真空装置部材が、ターゲットを用いた成膜装置に用いられる部材であることを特徴とする請求項１〜３のいずれか１項に記載の真空装置部材。 The vacuum apparatus member according to any one of claims 1 to 3, wherein the vacuum apparatus member is a member used in a film forming apparatus using a target. 成膜に用いられる真空装置において、請求項１〜４のいずれか１項に記載の真空装置部材が、塊状突起の谷の開口方向が、重力と反対方向になるように取り付けられていることを特徴とする真空装置。 The vacuum apparatus used for film-forming WHEREIN: The vacuum apparatus member of any one of Claims 1-4 is attached so that the opening direction of the trough of a massive protrusion may turn into a direction opposite to gravity. Features vacuum equipment. 基材と溶射ガンとの角度を５〜４０度の範囲に設定してスプラットを基材に積み重ねるに際し、スプラットを傾斜して積み重ねる部分とスプラットを積み重ねない部分とを交互に存在させて、ひだ状溶射膜を形成することを特徴とする真空装置部材の製造方法。
When stacking the splats on the base material with the angle between the base material and the spray gun set in the range of 5 to 40 degrees, the splats are inclined and the splats are alternately stacked and the splats are not stacked. A method of manufacturing a vacuum apparatus member, comprising forming a sprayed film.
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JP2015533934A (en) * 2012-08-31 2015-11-26 ゼネラル・エレクトリック・カンパニイ Thermal barrier coating system and its production and use

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