JP2001049419A - Parts for film forming device, and its manufacture - Google Patents
Parts for film forming device, and its manufactureInfo
- Publication number
- JP2001049419A JP2001049419A JP22775199A JP22775199A JP2001049419A JP 2001049419 A JP2001049419 A JP 2001049419A JP 22775199 A JP22775199 A JP 22775199A JP 22775199 A JP22775199 A JP 22775199A JP 2001049419 A JP2001049419 A JP 2001049419A
- Authority
- JP
- Japan
- Prior art keywords
- film
- film forming
- forming apparatus
- component
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【発明の属する技術分野】本発明は成膜装置内で使用さ
れる成膜装置用部品およびその製造方法に関するもので
あり、更に詳しくは、成膜原料の付着物が剥離し難い成
膜装置用部品およびその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component for a film forming apparatus used in a film forming apparatus and a method of manufacturing the same. The present invention relates to a component and a method for manufacturing the component.
【０００２】[0002]
【従来の技術】従来、ＬＳＩ、液晶ディスプレイ、光磁
気ディスク、ハードディスク等は基板上へ目的に応じた
成膜材料による薄膜を形成させて製造されるが、この成
膜時にパーティクルと称される粒子径が数μｍ程度の微
粒子が基板に付着して配線を短絡させるなどにより製品
収率を大幅に低下させ、更には製品の信頼性を損なうと
いう看過できない問題がある。2. Description of the Related Art Conventionally, LSIs, liquid crystal displays, magneto-optical disks, hard disks, and the like are manufactured by forming a thin film on a substrate using a film-forming material according to a purpose. Fine particles having a diameter of about several μm adhere to the substrate and short-circuit the wiring, thereby significantly reducing the product yield and further impairing the reliability of the product.
【０００３】これに対しては従来から種々の対策が講じ
られており、例えばスパタリングについて言えば、搬送
系から持ち込まれるもの、ターゲット材から発生するも
の等についてはほぼ解決され、現在では、成膜装置内に
組み込まれる構成部品、例えばシャッター（成膜源と基
板との間において成膜をオン・オフさせる部品）、遮蔽
板（成膜材料が基板以外の成膜装置へ付着することを防
ぐために配置される部品、防着板とも称される）、その
他に付着し、時間の経過と共に厚く成長した付着物が成
膜中に剥離、脱落して飛散することがパーティクルの発
生を招く大きい要因とされている。しかし、付着物が剥
離、脱落する前に成膜装置の運転を停止して頻繁にクリ
ーニングし付着物を除去することは成膜装置の稼働時間
を短くし、生産性を大幅に低下させる。Various countermeasures have conventionally been taken to solve this problem. For example, with respect to sputtering, those brought in from a transport system and those generated from a target material have been almost solved. Components incorporated in the apparatus, such as shutters (parts that turn on / off film formation between the film forming source and the substrate), shielding plates (to prevent film forming materials from adhering to film forming apparatuses other than the substrate) It is also a major factor that causes the generation of particles that the adhered substances that adhere to other parts and grow thickly over time, peel off, fall off, and scatter during film formation. Have been. However, stopping the operation of the film forming apparatus and removing the adhering matter frequently before the adhering matter is peeled off or dropped off shortens the operation time of the film forming apparatus and greatly reduces the productivity.
【０００４】上記の問題に対して、特開平３−８７３５
６号、特開平３−８７３５７号、特開平３−１６６３６
１号、特開平３−１６６３６２号の各公報には、エンボ
ス加工により多数の凹凸を形成させた金属箔や蛇腹状金
属箔を成膜装置用部品の表面に取り付ける技術が開示さ
れている。このなかで、エンボス加工によって多数の凹
凸を形成させた電解銅箔は既に市販されており、成膜装
置用部品の形状に応じて、その表面を覆うように重ね、
スポット溶接やリベットによって固定して使用されてい
る。そして、電解銅箔は部品と共に成膜装置内で使用さ
れて成膜材料が付着、堆積しても、付着物の剥離応力は
電解銅箔が変形することによって緩和されるので、付着
物の剥離、脱落の防止に有効であるとされている。In order to solve the above problem, Japanese Patent Laid-Open Publication No.
6, JP-A-3-87357, JP-A-3-16636
No. 1 and JP-A-3-166362 disclose a technique for attaching a metal foil or a bellows-shaped metal foil having a large number of irregularities formed by embossing to the surface of a component for a film forming apparatus. Among them, the electrolytic copper foil having a large number of irregularities formed by embossing is already commercially available, and is stacked so as to cover the surface thereof, depending on the shape of the component for the film forming apparatus.
It is fixed and used by spot welding and rivets. Even if the electrolytic copper foil is used together with the components in the film forming apparatus and the film-forming material adheres and deposits, the peeling stress of the adhered substance is relaxed by the deformation of the electrolytic copper foil. , It is said to be effective in preventing falling off.
【０００５】電解銅箔以外の方法としては、成膜装置用
部品の表面に対して、小径の鋼球やアルミナ粒子を噴射
させて吹き付けるショットブラストや、小径のガラス球
を噴射させて吹き付けるガラスビーズブラスト（ＧＢ
Ｂ）を行い、表面の清浄化を図ると共に凹凸を形成させ
て表面積を大にすることにより、付着物の付着強度を増
大させようとする試みがある。また、成膜装置用部品の
表面をショットブラストし、その上へ軟らかい金属溶射
膜、例えばアルミニウム溶射膜を形成させる方法があり
多用されている。この方法はアルミニウム溶射膜の上に
付着物が堆積しても、軟らかいアルミニウム溶射膜が変
形して剥離応力を緩和させるという点で合理的であり効
果もある。[0005] Other methods than the electrolytic copper foil include shot blasting in which small-diameter steel balls or alumina particles are sprayed and sprayed onto the surface of a component for a film forming apparatus, and glass beads in which small-diameter glass balls are sprayed and sprayed. Blast (GB
There is an attempt to increase the adhesive strength of the deposit by performing B) to clean the surface and increase the surface area by forming irregularities. In addition, there is a method in which the surface of a component for a film forming apparatus is shot blasted and a soft metal sprayed film, for example, an aluminum sprayed film is formed thereon. This method is reasonable and effective in that even if deposits are deposited on the aluminum sprayed film, the soft aluminum sprayed film is deformed to reduce the peeling stress.
【０００６】そのほか、特開平８−２７７４６０号公報
には母材の表面に機械加工して凹凸を設け、更に硫酸に
浸漬した成膜装置用部品が開示されており、特開平１１
−１２４６６１号公報には母材の表面に先ず銅（Ｃｕ）
膜を形成し、更にその上へステンレス鋼（ＳＵＳ４２０
Ｊ２）による多孔性金属膜を形成させた成膜装置用部品
が開示されている。In addition, Japanese Unexamined Patent Publication No. Hei 8-277460 discloses a component for a film forming apparatus in which the surface of a base material is provided with irregularities by machining, and further immersed in sulfuric acid.
No. 124661 discloses that copper (Cu) is first placed on the surface of a base material.
A film is formed, and a stainless steel (SUS420) is further formed thereon.
J2) discloses a component for a film forming apparatus on which a porous metal film is formed.
【０００７】[0007]
【発明が解決しようとする課題】従来のエンボス加工さ
れた電解銅箔を使用する方法は、電解銅箔が使い捨てで
あり繰り返しての使用ができず、その取り付け取り外し
作業が面倒であるほか、付着物の厚さが限度を越えると
剥離応力によって電解銅箔が引き裂かれ、成膜装置用部
品が露出するという問題を有している。また、成膜装置
用部品の表面をショットブラストする方法は付着物の剥
離、脱落の防止効果が十分でなく、その故にショットブ
ラストを何回も繰り返すことになり、成膜装置用部品に
ショットブラスト時の衝撃熱による歪みが蓄積されて破
損に至る場合がある。更には、表面にアルミニウム溶射
膜等を形成させた成膜装置用部品は、成膜材料が剥離応
力の大きいものである場合には、付着物の厚さが０．５
ｍｍ程度になると、アルミニウム溶射膜と母材との間で
剥離を生じるという問題があり、現在のところ、解決の
方法は見出だされていない。また、特開平８−２７７４
６０号公報および特開平１１−１２４６６１号公報によ
る成膜装置用部品は何れも硫酸等の酸を使用するので、
作業性に簡便さを欠く。本発明は上述の問題に鑑みてな
され、成膜材料が付着し厚膜化しても剥離、脱落を生じ
難い成膜装置用部品およびその製造方法を提供すること
を課題とする。The conventional method of using an electrolytic copper foil which has been embossed has a problem that the electrolytic copper foil is disposable and cannot be used repeatedly, and the work of attaching and detaching the copper foil is troublesome. If the thickness of the kimono exceeds the limit, there is a problem that the electrolytic copper foil is torn by the peeling stress and the parts for the film forming apparatus are exposed. In addition, the method of shot blasting the surface of a film forming device component is not sufficiently effective in preventing the adhered material from peeling off and falling off, so that shot blasting is repeated many times. In some cases, distortion due to shock heat is accumulated, leading to breakage. Further, in the case of a film forming apparatus component having an aluminum sprayed film or the like formed on the surface, if the film forming material has a large peeling stress, the thickness of the deposit is 0.5%.
When the thickness is about mm, there is a problem that separation occurs between the aluminum sprayed film and the base material, and no solution has been found at present. In addition, Japanese Patent Application Laid-Open No. 8-2774
No. 60 and Japanese Patent Application Laid-Open No. H11-124661 each use an acid such as sulfuric acid for the components for a film forming apparatus.
Lack of convenience in workability. The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a component for a film forming apparatus in which a film forming material is unlikely to be separated or dropped even when a film forming material is attached and the film is thickened, and a method of manufacturing the same.
【０００８】[0008]
【課題を解決するための手段】上記の課題は請求項１ま
たは請求項６によって解決されるが、その解決手段を説
明すれば、請求項１の成膜装置用部品は、成膜装置内で
使用され、表面に溶射膜が形成されている成膜装置用部
品において、溶射膜にそれ自体の表面粗さ（Ｒａ）より
大きい凹凸が多数に形成されている部品である。このよ
うな成膜装置用部品は、その溶射膜の凹凸が成膜材料の
付着物の投錨箇所として作用して付着強度を高めるほ
か、溶射膜が剥離応力を緩和させるので、付着物の厚さ
が比較的大になっても剥離、脱落することはない。Means for Solving the Problems The above-mentioned object is achieved by claim 1 or claim 6. According to the means for solving the problem, the component for the film forming apparatus according to claim 1 is provided within the film forming apparatus. A component used for a film forming apparatus having a sprayed film formed on its surface, wherein the sprayed film has a large number of irregularities larger than its own surface roughness (Ra). In such a component for a film forming apparatus, the unevenness of the sprayed film acts as an anchorage for the deposit of the deposition material to increase the adhesion strength, and the sprayed film reduces the peeling stress. Does not peel off or fall off even if the size is relatively large.
【０００９】請求項１に従属する請求項２の成膜装置用
部品は、凹凸が溶射膜上の任意の行方向と列方向にそれ
ぞれ一定のピッチで形成された柱状の凸部と、凸部に連
続し凸部とは反対形状の凹部との繰り返しからなり、凸
部および凹部の形状が円錐形状、円錐台形状、角錐形
状、角錐台形状、角柱形状、円柱形状、または端部が半
球状の円柱形状であるものである。このような成膜装置
用部品は、成膜材料の種類と成膜装置用部品の形状に応
じて上記の形状の何れかが適宜選択されることにより、
付着物の付着強度の増大、付着物の剥離応力の溶射膜に
よる緩和が溶射膜上で均等化され、付着物の剥離、脱落
を抑制する。According to a second aspect of the present invention, there is provided a component for a film forming apparatus according to the second aspect, wherein the projections and depressions are formed with a predetermined pitch in the row direction and the column direction on the sprayed film. The shape of the convex and concave portions is conical, frusto-conical, pyramid-shaped, truncated-pyramidal, prismatic, cylindrical, or has a hemispherical end. Of a cylindrical shape. Such a component for a film forming apparatus is configured such that any one of the above shapes is appropriately selected according to the type of a film forming material and the shape of the component for a film forming device,
The increase in the adhesion strength of the deposit and the relaxation of the peeling stress of the deposit by the sprayed film are equalized on the sprayed film, and the detachment and detachment of the deposit are suppressed.
【００１０】請求項１に従属する請求項３の成膜装置用
部品は、凹凸が溶射膜上の任意の一方向に一定のピッチ
で形成された山部と、山部に連続し山部とは反対形状の
谷部との繰り返しからなり、山部と谷部の形状が蛇腹形
状、簀の子形状、またはラックギア形状の部品である。
このような成膜装置用部品は、成膜材料の種類と成膜装
置用部品の形状に応じて上記の形状の何れかが適宜選択
されることにより、付着物の付着強度の増大、付着物の
剥離応力の溶射膜による緩和が溶射膜上で均等化され、
付着物の剥離、脱落を抑制する。[0010] According to a third aspect of the present invention, there is provided a component for a film forming apparatus according to the third aspect, wherein the unevenness is formed at a constant pitch in an arbitrary direction on the sprayed film; Is a repetition of a valley having an opposite shape, and the ridge and the valley are parts having a bellows shape, a shirako shape, or a rack gear shape.
Such a component for a film forming apparatus can increase the adhesion strength of the adhered substance and increase the adhered substance by appropriately selecting one of the above shapes according to the type of the film forming material and the shape of the component for the film deposited apparatus. The relaxation of the peel stress of the sprayed film is equalized on the sprayed film,
Suppresses detachment and detachment of attached matter.
【００１１】請求項１に従属する請求項４の成膜装置用
部品は、溶射膜の材料がアルミニウムまたはチタンであ
る部品である。このような成膜装置用部品は、溶射膜の
アルミニウムまたはチタンが比較的小さい弾性率の故に
変形され易く、付着物の剥離応力を緩和し、剥離、脱落
を抑制する。請求項１に従属する請求項５の成膜装置用
部品は、成膜装置内で使用される部品の中で、成膜源に
近接して配置される部品、気体状の成膜材料に接触する
部品である。このような成膜材料が付着し易い部品であ
っても、本発明の成膜装置用部品は付着物の剥離、脱落
を抑制する。[0011] The component for a film forming apparatus according to claim 4 which is dependent on claim 1 is a component in which the material of the sprayed film is aluminum or titanium. In such a component for a film forming apparatus, aluminum or titanium of the thermal sprayed film is easily deformed due to a relatively small elastic modulus, so that the peeling stress of the deposit is reduced, and peeling and falling off are suppressed. The component for a film forming apparatus according to claim 5 which is dependent on claim 1 contacts a component disposed close to a film forming source and a gaseous film forming material among components used in the film forming apparatus. It is a part to be done. Even for a component to which such a film-forming material easily adheres, the component for a film-forming apparatus of the present invention suppresses peeling and falling off of the attached matter.
【００１２】また請求項６の成膜装置用部品の製造方法
は、成膜装置内で使用され、表面に溶射膜が形成されて
いる成膜装置用部品の製造方法において、 成膜装置用
部品の母材の表面に対し格子状マスクまたは連子格子状
マスクを介して溶射を施すか、母材の表面に通常的に溶
射膜を形成させた後に、格子状マスクまたは連子格子状
マスクを介してブラスト処理を施すか、または、母材の
表面に通常的に溶射膜を形成させた後に、溶射膜の表面
にエッチングレジスト膜を所定のパターン状に形成し、
溶射膜の露出している部分を選択的にエッチング処理を
施すことにより、溶射膜自体の表面粗さ（Ｒａ）より大
きい多数の凹凸を有する溶射膜を形成させる方法であ
る。このような成膜装置用部品の製造方法は、凹凸を有
する溶射膜が形成された成膜装置用部品を容易に製造す
ることを可能ならしめる。According to a sixth aspect of the present invention, there is provided a method of manufacturing a component for a film forming apparatus, wherein the component is used in the film forming apparatus and has a sprayed film formed on a surface thereof. After applying a thermal spray to the surface of the base material through a lattice mask or a lattice lattice mask, or after forming a thermal spray film on the surface of the matrix material normally, a lattice mask or a lattice lattice mask is formed. After performing a blasting process, or after forming a sprayed film on the surface of the base material normally, an etching resist film is formed on the surface of the sprayed film in a predetermined pattern,
In this method, the exposed portion of the thermal spray film is selectively etched to form a thermal spray film having many irregularities larger than the surface roughness (Ra) of the thermal spray film itself. Such a method of manufacturing a component for a film forming apparatus makes it possible to easily manufacture a component for a film forming apparatus on which a sprayed film having irregularities is formed.
【００１３】請求項６に従属する請求項７の成膜装置用
部品の製造方法は、格子状マスクとして、格子の目が正
方形、正三角形、正六角形、または円形を単位としてパ
ターン状に形成されたものを使用する方法である。この
ような成膜装置用部品の製造方法は、成膜装置用部品の
形状や成膜材料の種類に応じて、上記の格子の目の形状
を選択し、好ましい形状の凹凸を有する溶射膜の形成さ
れた成膜装置用部品を製造することを可能にする。請求
項６に従属する請求項８の成膜装置用部品の製造方法
は、溶射、または溶射後のブラスト処理の途中におい
て、母材と、格子状マスクまたは連子格子状マスクとの
空間的な相対位置を変化させる方法である。このような
成膜装置用部品の製造方法は、成膜装置用部品の形状や
成膜材料の種類に応じて、好ましい形状の凹凸を有する
溶射膜が形成された成膜装置用部品を製造することを可
能にする。According to a sixth aspect of the present invention, in the method of manufacturing a component for a film forming apparatus according to the seventh aspect, the grids are formed in a pattern by using a square, regular triangle, regular hexagon, or circle as a unit. It is a method to use the thing. Such a method of manufacturing a component for a film forming apparatus, the shape of the grid is selected according to the shape of the component for a film forming device and the type of a film forming material, and a sprayed film having irregularities of a preferable shape is selected. It is possible to manufacture a formed component for a film forming apparatus. In the method for manufacturing a component for a film forming apparatus according to claim 8 which is dependent on claim 6, during the thermal spraying or the blasting process after the thermal spraying, the spatial relationship between the base material and the lattice-shaped mask or the reticulated lattice-shaped mask is reduced. This is a method of changing the relative position. Such a method of manufacturing a component for a film forming apparatus manufactures a component for a film forming apparatus on which a sprayed film having irregularities of a preferable shape is formed according to the shape of the component for a film forming apparatus and the type of a film forming material. Make it possible.
【００１４】[0014]
【発明の実施の形態】本発明の成膜装置用部品およびそ
の製造方法は、上述したように、表面に溶射膜が形成さ
れた成膜装置用部品において、溶射膜にそれ自体の表面
粗さ（Ｒａ）より大きい凹凸が多数に形成されている成
膜装置用部品と、格子状マスク等によって溶射膜に凹凸
を形成させる成膜装置用部品の製造方法であるが、以下
に本発明の実施の形態を図面によって説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, a component for a film forming apparatus and a method of manufacturing the same according to the present invention provide a component for a film forming apparatus having a sprayed film formed on its surface. (Ra) A method for manufacturing a component for a film forming apparatus in which a large number of irregularities larger than (Ra) are formed, and a method for manufacturing a component for a film forming apparatus in which irregularities are formed on a sprayed film by a lattice mask or the like. Will be described with reference to the drawings.
【００１５】図１は成膜装置用部品を製造する方法の一
例を示す図である。すなわち、図１のＡは溶射時に使用
される格子状マスク１２の部分平面図であり、行方向と
列方向に整列した正方形の格子の目１１が形成されてい
る。そして、図１のＢは格子状マスク１２を使用する成
膜装置用部品の製造方法を示す断面図である。なお、格
子状マスク１２の格子材の断面は長方形としたが、長方
形以外の形状としてもよい。図１のＢを参照して、成膜
装置用部品の母材１の表面から一定の高さ位置に格子状
マスク１２を保持し、上方から図示せずとも溶射ガン等
によって格子の目１１を通して例えば金属の溶射を行
い、母材１の表面に格子の目１１に対応する凹凸を持つ
溶射膜１３を形成させる。そして、図２は図１のＢに示
す方法によって製造された成膜装置用部品１０の部分斜
視図であり、母材１の表面に形成された角錐台形状の凹
凸を有する溶射膜１３を示す。なお、図１のＢ、図２
は、溶射膜１３の凹凸を概念的に示すものであり、凹凸
のピッチ、凹凸の各部の厚さは比例関係には示されてい
ない。FIG. 1 is a diagram showing an example of a method of manufacturing a part for a film forming apparatus. That is, FIG. 1A is a partial plan view of a grid-like mask 12 used at the time of thermal spraying, in which square grid eyes 11 aligned in a row direction and a column direction are formed. FIG. 1B is a cross-sectional view illustrating a method of manufacturing a component for a film forming apparatus using the lattice-shaped mask 12. The cross section of the lattice material of the lattice mask 12 is rectangular, but may be a shape other than rectangular. Referring to FIG. 1B, a grid-shaped mask 12 is held at a fixed height from the surface of the base material 1 of the component for a film forming apparatus. For example, metal spraying is performed to form a sprayed film 13 having irregularities corresponding to the grid lines 11 on the surface of the base material 1. FIG. 2 is a partial perspective view of the film forming apparatus component 10 manufactured by the method shown in FIG. 1B, and shows a sprayed film 13 having truncated pyramid-shaped irregularities formed on the surface of the base material 1. . It should be noted that FIG.
Schematically shows the unevenness of the thermal sprayed film 13, and the pitch of the unevenness and the thickness of each part of the unevenness are not shown in a proportional relationship.
【００１６】また、図３は一般な溶射膜３の表面粗さ
と、本発明の成膜装置用部品１０における溶射膜１３の
凹凸との関係を概念的に説明する図である。すなわち、
図３のＡは通常的に形成される溶射膜３の断面図であ
り、図３のＢは本発明の成膜装置用部品１０の断面図で
ある。図３のＡに示す溶射膜３は本来的には中心線平均
粗さＲａで示して１０〜２０μｍの表面粗さを有してい
る。これに対して図１のＢの方法によって製造される成
膜装置用部品１０の溶射膜１３は本来の表面粗さＲａと
共に、図３のＢに示すように、凹部の底面Ｂから凸部の
頂上Ｔまでの高さＨが５０μｍ程度の凹凸の場合から、
高さＨが２ｍｍ程度の凹凸の場合もあるが、何れにして
もその高さＨは溶射膜３が有する本来の表面粗さ（Ｒ
ａ）よりも遥かに大きい。FIG. 3 is a diagram conceptually illustrating the relationship between the surface roughness of the general thermal sprayed film 3 and the unevenness of the thermal sprayed film 13 in the film forming apparatus component 10 of the present invention. That is,
FIG. 3A is a cross-sectional view of a normally formed thermal sprayed film 3, and FIG. 3B is a cross-sectional view of a film forming apparatus component 10 of the present invention. The sprayed film 3 shown in FIG. 3A originally has a surface roughness of 10 to 20 μm as indicated by the center line average roughness Ra. On the other hand, as shown in FIG. 3B, the sprayed film 13 of the film forming apparatus component 10 manufactured by the method of FIG. From the case where the height H up to the top T is about 50 μm,
In some cases, the height H may be unevenness of about 2 mm, but in any case, the height H depends on the original surface roughness (R
Much larger than a).
【００１７】図２の凹凸を持つ溶射膜１３が形成されて
いる成膜装置用部品１０は、図４の断面図に示す別な方
法によっても製造することができる。図４のＡを参照し
て、成膜装置用部品１０の母材１の表面に通常的な溶射
を施して厚さが大で均等な溶射膜１３’を形成させる。
次いで、図４のＢを参照して、一点鎖線で示す均等な厚
さの溶射膜１３’の表面から一定の距離をあけた高さ位
置に格子状マスク１２を保持して、上方から図示せずと
もショットブラストガン等によって格子の目１１を通し
て例えばアルミナの粉末またはガラスビーズ等を吹きつ
けてブラスト処理を施すことにより、溶射膜１３’の表
面が部分的に削られて凹凸を有する溶射膜１３となり、
目的とする成膜装置用部品１０が製造される。図４のＢ
においても、図１のＢと同様、凹凸のピッチ、凹凸の各
部の厚さは比例関係には示されていない。The component 10 for a film forming apparatus on which the thermal sprayed film 13 having the unevenness shown in FIG. 2 is formed can be manufactured by another method shown in the sectional view of FIG. Referring to FIG. 4A, the surface of base material 1 of film-forming apparatus component 10 is subjected to ordinary spraying to form a sprayed film 13 'having a large and uniform thickness.
Next, referring to FIG. 4B, the grid-shaped mask 12 is held at a height position at a predetermined distance from the surface of the sprayed film 13 'having a uniform thickness indicated by a dashed line and shown from above. By spraying, for example, alumina powder or glass beads through a grid 11 with a shot blast gun or the like to perform blasting, the surface of the sprayed film 13 ′ is partly shaved and the Becomes
The intended film-forming-apparatus component 10 is manufactured. FIG. 4B
Also, as in B of FIG. 1, the pitch of the unevenness and the thickness of each part of the unevenness are not shown in a proportional relationship.
【００１８】そのほか、図４のＢ製造方法の変形とし
て、溶射膜１３’が例えばアルミニウム（Ａｌ）溶射膜
である場合には、格子状マスク１２に代えて、Ａｌ溶射
膜の表面に直接にエッチングレジスト膜をパターン状に
描画し、溶射膜１３’の露出している部分を塩化鉄、リ
ン酸、硝酸等の酸性液で選択的にエッチングし除去した
後、エッチングレジスト膜を取り除くエッチング処理を
施すことにより、凹凸を有する溶射膜１３の形成された
成膜装置用部品１０を同様に製造することができる。In addition, as a modification of the manufacturing method B of FIG. 4, when the thermal sprayed film 13 'is, for example, an aluminum (Al) thermal sprayed film, etching is performed directly on the surface of the Al thermal sprayed film instead of the lattice mask 12. The resist film is drawn in a pattern, and the exposed portion of the sprayed film 13 'is selectively etched and removed with an acid solution such as iron chloride, phosphoric acid, or nitric acid, and then an etching process for removing the etching resist film is performed. Thereby, the component 10 for a film forming apparatus on which the thermal sprayed film 13 having the unevenness is formed can be similarly manufactured.
【００１９】上記の図１のＢに示した製造方法は縦方向
と横方向との格子状マスク１２を使用する方法である
が、成膜材料の付着物の剥離応力が若干小さい場合に
は、図５に示すように、縦（または横）方向だけの連子
格子状マスク２２を使用して、台形の波状の凹凸を有す
る溶射膜２３の形成された成膜装置用部品２０を製造す
ることも可能である。図５を参照して、図５のＡは溶射
時に使用される連子格子状マスク２２の部分平面図であ
り、行方向（または列方向）の格子の目２１が形成され
ている。そして、図５のＢは連子格子状マスク２２を使
用する成膜装置用部品の製造方法を示す断面図である。
図５のＢを参照して、成膜装置用部品２０の母材１の表
面から一定の高さ位置に連子格子状マスク２２を保持
し、上方から図示せずとも溶射ガン等によって格子の目
２１を通して例えば金属の溶射を行い、母材１の表面に
格子の目２１に対応する凹凸を持つ溶射膜２３を形成さ
せる。そして、図６は図５のＢに示す方法によって製造
された成膜装置用部品２０の部分斜視図であり、母材１
の表面に形成された台形の波状の凹凸を有する溶射膜２
３を示す。図５のＢにおいても、図１のＢと同様、凹凸
のピッチ、凹凸の各部の厚さは比例関係に示されていな
い。The manufacturing method shown in FIG. 1B is a method using a lattice mask 12 in the vertical direction and the horizontal direction. However, when the peeling stress of the deposit on the film forming material is slightly small, As shown in FIG. 5, manufacturing a component 20 for a film forming apparatus on which a sprayed film 23 having trapezoidal wavy irregularities is formed using a lattice lattice-like mask 22 only in a vertical (or horizontal) direction. Is also possible. Referring to FIG. 5, FIG. 5A is a partial plan view of a reticulated lattice-shaped mask 22 used at the time of thermal spraying, in which grid lines 21 in a row direction (or a column direction) are formed. FIG. 5B is a cross-sectional view illustrating a method of manufacturing a component for a film forming apparatus using the reticulated lattice mask 22.
Referring to FIG. 5B, a grid 22 is held at a fixed height from the surface of the base material 1 of the component 20 for the film forming apparatus. For example, metal spraying is performed through the eyes 21 to form a sprayed film 23 having irregularities corresponding to the grid eyes 21 on the surface of the base material 1. FIG. 6 is a partial perspective view of the film forming apparatus component 20 manufactured by the method shown in FIG.
Sprayed film 2 having trapezoidal wavy irregularities formed on the surface of
3 is shown. Also in FIG. 5B, as in FIG. 1B, the pitch of the unevenness and the thickness of each part of the unevenness are not shown in a proportional relationship.
【００２０】なお、図４においては成膜装置用部品１０
の母材１の表面に厚さが大で均等な溶射膜１３’を形成
させてから、格子状マスク１２を介してショットブラス
ト処理を施す製造方法を説明したが、上記の方法で格子
状マスク１２に換えて連子格子状マスク２２を使用する
ことによっても、図６に示した台形の波状の凹凸を有す
る溶射膜２３の形成された成膜装置用部品２０を製造す
ることができる。It should be noted that in FIG.
A method of forming a sprayed film 13 'having a large thickness and a uniform thickness on the surface of the base material 1 and then performing a shot blast treatment through the grid-shaped mask 12 has been described. By using a reticulated lattice-shaped mask 22 instead of 12, it is possible to manufacture the film forming apparatus component 20 on which the sprayed film 23 having the trapezoidal wavy irregularities shown in FIG. 6 is formed.
【００２１】更には、上述した製造方法においては、成
膜装置用部品１０の母材１と格子状マスク１２（または
連子格子状マスク２２）との相対的位置を固定した状態
で溶射、または溶射後にショットブラスト処理する方法
を説明したが、溶射、または溶射後のショットブラスト
処理の途中に、少なくとも何れか一方を上下方向、水平
方向、またはその他の方向へ、連続的にまたは断続的に
移動させて、形成される溶射膜の凹凸形状に変化を与え
るようにしてもよい。また更には、溶射時における母材
と溶射ガンとの距離、および溶射に使用する圧縮空気の
圧力を溶射の途中で連続的にまたは断続的に変化させ
て、形成させる溶射膜の凹凸形状に変化を与えるように
してもよい。Further, in the above-described manufacturing method, thermal spraying is performed with the relative position between the base material 1 of the component 10 for the film forming apparatus and the lattice mask 12 (or the lattice lattice mask 22) fixed. Although the method of performing shot blasting after thermal spraying has been described, during thermal spraying, or during shot blasting after thermal spraying, at least one of the vertical, horizontal, or other directions is moved continuously or intermittently. By doing so, the unevenness of the formed thermal spray film may be changed. Further, the distance between the base material and the spray gun during the spraying, and the pressure of the compressed air used for the spraying are continuously or intermittently changed during the spraying to change the uneven shape of the sprayed film to be formed. May be given.
【００２２】また、図１のＢに示した製造方法において
は格子の目１１が正方形である格子状マスク１２を使用
する場合を示したが、格子の目は正方形以外の形状であ
ってもよいことは勿論である。すなわち、図７の部分平
面図に代表的な格子の目として、図１のＢの製造方法で
使用した正方形のほか、円形、正三角形、正六
角形、を示したが、勿論、格子の目はこれら以外の形状
であってもよく、また格子の目の配列形状も特に限定さ
れない。Further, in the manufacturing method shown in FIG. 1B, the case where the grid-like mask 12 having the square grids 11 is used is shown, but the grid grids may have a shape other than a square. Of course. That is, in addition to the square used in the manufacturing method of FIG. 1B, a circle, an equilateral triangle, and a regular hexagon are shown as typical grid eyes in the partial plan view of FIG. Shapes other than these may be used, and the arrangement shape of the grid eyes is not particularly limited.
【００２３】更には、図２には、角錐台形状の凹凸を有
する溶射膜１３が形成された成膜装置用部品１０を示し
たが、凹凸の形状は角錐台以外の形状であってもよいこ
とは勿論である。すなわち、図８の部分斜視図に代表的
な溶射膜の凹凸の形状として、円錐、円錐台、四
角錐、四角錐台、四角柱、円柱、端部が半球状
の円柱、を示し、図９の部分斜視図に、蛇腹、簀の
子、ラックギヤ、を示したが、勿論、凹凸の形状はこ
れら以外であってもよく、また凹凸の形成ピッチも特に
限定されない。Further, FIG. 2 shows the film-forming apparatus component 10 on which the sprayed film 13 having the truncated pyramid-shaped irregularities is formed, but the irregularities may have shapes other than the truncated pyramids. Of course. That is, as the typical irregularities of the sprayed film in the partial perspective view of FIG. 8, a cone, a truncated cone, a quadrangular pyramid, a truncated quadrangular pyramid, a quadrangular prism, a cylinder, and a cylinder having a hemispherical end are shown. Although the bellows, the lantern, and the rack gear are shown in the partial perspective view, the shape of the unevenness may be other than these, and the pitch for forming the unevenness is not particularly limited.
【００２４】[0024]
【実施例】次に、本発明における成膜装置用部品および
その製造方法を実施例と比較例によって具体的に説明す
る。Next, the components for a film forming apparatus and the method of manufacturing the same according to the present invention will be described in detail with reference to examples and comparative examples.
【００２５】（実施例１）スパッタ成膜装置内におい
て、成膜のオン・オフを行うシャッターの製造を目的と
して、図１のＢに示した方法により、格子の目が３ｍｍ
角の正方形で６ｍｍピッチの格子状マスクを使用して、
ステンレス鋼（ＳＵＳ３０４）製のシャッター母材の表
面にＡｌの溶射を行い、多数の角錐台形状の凹凸を有す
るＡｌ溶射膜の形成されたシャッターＳ1 を製造した。
そして、採取したＡｌ溶射膜の破断面を走査型電子顕微
鏡で観測して、凹凸の高さＨは約４００μｍであり、全
体の膜厚は約０．６ｍｍと測定された。また、Ａｌ溶射
膜の表面粗さＲａは１２．５μｍであった。(Example 1) In order to manufacture a shutter for turning on and off a film in a sputtering film forming apparatus, a grid of 3 mm was formed by the method shown in FIG. 1B.
Using a square mask with a square square and 6 mm pitch,
Perform spraying surface of the Al stainless steel (SUS304) manufactured by the shutter base material was produced shutter S 1 formed of thermally sprayed Al film having an uneven number of truncated pyramid.
Then, the fracture surface of the collected Al sprayed film was observed with a scanning electron microscope, and the height H of the irregularities was about 400 μm, and the overall film thickness was measured to be about 0.6 mm. The surface roughness Ra of the Al sprayed film was 12.5 μm.
【００２６】上記のＡｌ溶射膜を有するシャッターＳ1
をスパッタ成膜装置内に組み込んで、連続的に供給され
てくる多数個の対象基材に窒化チタン（ＴｉＮ）膜を形
成させた。その時のスパッタ成膜の条件は圧力３ｘ１０
-3Ｔｏｒｒ、スパッタ出力６００Ｖ、１２Ａ（＝７．２
ｋＷ）であった。この時、成膜をオン・オフさせるシャ
ッタ−Ｓ1 にもＴｉＮが付着し厚膜として堆積した。ス
パッタ成膜装置に付属の成膜レートモニターによる膜厚
が５０μｍ増大する毎に、目視によってシャッターＳ1
からのＴｉＮ厚膜の剥離の有無を観察したが、剥離が発
生した時のＴｉＮ厚膜の膜厚は１．３ｍｍであった。こ
の結果は他例と共に表１に示した。The shutter S 1 having the Al sprayed film described above.
Was incorporated in a sputtering film forming apparatus to form a titanium nitride (TiN) film on a large number of continuously supplied target substrates. At this time, the conditions for the sputter film formation were a pressure of 3 × 10
-3 Torr, sputter output 600V, 12A (= 7.2
kW). In this case, TiN is also the shutter -S 1 for turning on and off the deposition is deposited as deposited thick film. Each time the film thickness increased by 50 μm using a film formation rate monitor attached to the sputtering film forming apparatus, the shutter S 1 was visually observed.
The presence or absence of peeling of the TiN thick film from the substrate was observed. When the peeling occurred, the thickness of the TiN thick film was 1.3 mm. The results are shown in Table 1 together with other examples.
【００２７】（実施例２）実施例１で使用したものと同
様なシャッター母材の表面に、図４に示した方法によっ
て凹凸を有するチタン（Ｔｉ）の溶射膜を形成させた。
すなわち、図４のＡに示すように、シャッター母材の表
面にＴｉを溶射して厚さ０．５ｍｍのＴｉ溶射膜を形成
させた後、図４のＢに示すように、Ｔｉ溶射膜に格子状
マスク１２を介して粒度４６メッシュのアルミナ（Ａｌ
2 Ｏ3 ）粒子によるショットブラスト処理を施すことに
より、多数の凹凸を有するＴｉ溶射膜の形成されたシャ
ッターＳ2 を製造した。その凹凸の高さＨはほぼ３００
μｍであった。また、Ｔｉ溶射膜１３の表面粗さＲａは
１２．０μｍであった。(Example 2) A sprayed film of titanium (Ti) having irregularities was formed on the surface of a shutter base material similar to that used in Example 1 by the method shown in FIG.
That is, as shown in FIG. 4A, after spraying Ti on the surface of the shutter base material to form a Ti sprayed film having a thickness of 0.5 mm, as shown in FIG. Alumina of 46 mesh size (Al
By performing shot blasting with 2 O 3 ) particles, a shutter S 2 on which a Ti sprayed film having many irregularities was formed was manufactured. The height H of the unevenness is almost 300
μm. The surface roughness Ra of the Ti sprayed film 13 was 12.0 μm.
【００２８】上記のＴｉ溶射膜を有するシャッターＳ2
を実施例１で使用したスパッタ成膜装置内に組み込み、
対象基材へのＴｉＮの成膜に伴って、シャッターＳ2 に
付着し堆積するＴｉＮ厚膜の剥離状況を実施例１と同様
に観察した。シャッターＳ2からの剥離が認められた時
のＴｉＮ厚膜の厚さは１．２ｍｍであった。その結果は
表１に示した。Shutter S 2 having the above-mentioned Ti sprayed film
Was incorporated into the sputtering film forming apparatus used in Example 1,
With the formation of the TiN to the target substrate, was observed the state of peeling of the TiN thick to adhere to the shutter S 2 deposited in the same manner as in Example 1. The thickness of the TiN thick film when peeled from the shutter S 2 was observed was 1.2 mm. The results are shown in Table 1.
【００２９】（比較例１）実施例１で使用したものと同
様なシャッター母材の表面に、粒度４６メッシュのアル
ミナ（Ａｌ2 Ｏ3 ）粒子を用いるショットブラストのみ
を施してシャッターＳ3 を製造した。得られたショット
ブラスト面の表面粗さＲａは３．４μｍであった。この
シャッターＳ3 を実施例１で使用したスパッタ成膜装置
内に組み込み、対象基材へのＴｉＮの成膜に伴って、シ
ャッターＳ3 に堆積するＴｉＮ厚膜の剥離状況を実施例
１と同様に観察したが、シャッターＳ3 からのＴｉＮ厚
膜の剥離は膜厚が０．２ｍｍの時に発生した。その結果
は表１に示した。[0029] surface of (Comparative Example 1) used in Example 1 and the same shutter matrix, producing the shutter S 3 is subjected to only shot blasting using alumina (Al 2 O 3) particles of size 46 mesh did. The surface roughness Ra of the obtained shot blast surface was 3.4 μm. Incorporating the shutter S 3 into the sputtering deposition apparatus used in Example 1, with the formation of the TiN to the target substrate, similar to the state of peeling of the TiN thick deposited on the shutter S 3 Example 1 was observed, delamination of TiN thick from the shutter S 3 film thickness occurs at the time of 0.2 mm. The results are shown in Table 1.
【００３０】（比較例２）実施例１で使用したものと同
様なシャッター母材の表面にショットブラストを施し、
更に厚さ０．５ｍｍの通常的なＡｌ溶射膜を形成させて
シャッターＳ4 を製造した。Ａｌ溶射膜の表面粗さＲａ
は１２．５μｍであった。このシャッターＳ4 を実施例
１で使用したスパッタ成膜装置内に組み込み、対象基材
へのＴｉＮの成膜に伴って、シャッターＳ4 に付着し堆
積するＴｉＮ厚膜の剥離状況を実施例１と同様に観察し
たところ、シャッターＳ4 からのＴｉＮ厚膜の剥離は膜
厚が０．６ｍｍの時に発生した。その結果は表１に示し
た。Comparative Example 2 Shot blasting was performed on the surface of a shutter base material similar to that used in Example 1,
Further to form a normal specific thermally sprayed Al film having a thickness of 0.5mm was produced shutter S 4 in. Surface roughness Ra of Al sprayed film
Was 12.5 μm. Incorporating the shutter S 4 in the sputtering apparatus used in Example 1, with the formation of the TiN to the target substrate, a peeling status embodiment of TiN thick film which adheres to the shutter S 4 deposited 1 was observed in the same manner as the peeling of the TiN thick from the shutter S 4 has a film thickness occurs at the time of 0.6 mm. The results are shown in Table 1.
【００３１】[0031]
【表１】 [Table 1]
【００３２】表１から明らかなように、比較例１の単に
アルミナ粒子によるショットブラストを施したシャッタ
ーＳ3 はＴｉＮ厚膜が厚さ０．２ｍｍになると剥離を生
じ、比較例２のＡｌ溶射膜を形成させたシャッターＳ4
はＴｉＮ厚膜が厚さ０．６ｍｍになると剥離を生じたに
対して、実施例１のシャッターＳ1 、実施例２のシャッ
ターＳ2 はＴｉＮ厚膜が比較例２のシャッターＳ4 の場
合の２倍の厚さ１．２ｍｍまでは剥離を発生せず、成膜
装置用部品からＴｉＮ厚膜を取り除くため、また成膜装
置用部品を交換するための成膜装置のクリーニングの間
隔を大幅に延長することが可能になることを示す。As is clear from Table 1, the shutter S 3 of Comparative Example 1 which was simply shot blasted with alumina particles peeled off when the TiN thick film became 0.2 mm thick, and the Al sprayed film of Comparative Example 2 Shutter S 4 that formed
When the TiN thick film was 0.6 mm thick, peeling occurred. On the other hand, the shutter S 1 of the first embodiment and the shutter S 2 of the second embodiment were the same as the shutter S 4 of the second comparative example. No separation occurs up to a thickness of 1.2 mm, which is twice as large. To remove the thick TiN film from the parts for the film forming apparatus, and greatly increase the cleaning interval of the film forming apparatus for replacing the parts for the film forming apparatus. Indicates that extension is possible.
【００３３】本発明の実施の形態は以上のように構成さ
れ作用するが、勿論、本発明はこれらに限定されること
なく、本発明の技術的思想に基づいて種々の変形が可能
である。Although the embodiment of the present invention is constructed and operates as described above, the present invention is, of course, not limited to these, and various modifications can be made based on the technical idea of the present invention.
【００３４】例えば本実施の形態においては、一定の形
状の凹凸が一定のピッチで形成された溶射膜を有する成
膜装置用部品およびその製造方法を説明したが、凹凸が
付着物の技錨箇所として作用し、付着物の付着強度を増
大させる限りにおいて、凹凸は一定の形状であることを
必要とせず、また一定のピッチで形成されたものである
ことを必要としない。For example, in this embodiment, a component for a film forming apparatus having a sprayed film in which irregularities of a constant shape are formed at a constant pitch and a method of manufacturing the same have been described. The irregularities do not need to have a constant shape and do not need to be formed at a constant pitch, as long as the adhesion strength of the deposit is increased.
【００３５】また本実施の形態においては、本発明の成
膜装置用部品が使用される成膜装置としてスパッタ成膜
装置を例示したが、それ以外の全ての成膜装置、例えば
真空蒸着装置、ＣＶＤ（化学的気相成長）装置、イオン
プレーティング装置にも同様に使用される。In this embodiment, a sputter film forming apparatus is exemplified as a film forming apparatus using the film forming apparatus component of the present invention. However, all other film forming apparatuses, for example, a vacuum deposition apparatus, It is similarly used in a CVD (chemical vapor deposition) apparatus and an ion plating apparatus.
【００３６】また本実施の形態においては、成膜装置用
部品としてシャッターを例示したが、本発明の成膜装置
用部品は、成膜装置内で使用され成膜材料が付着し堆積
し易い全ての部品が該当し、具体的には上記のシャッタ
ー以外に、例えば成膜させるべき基板以外の箇所へ成膜
材料が付着することを防ぐために配置される遮蔽板（防
着板）、成膜材料の蒸気を基板へ導くためのチムニー、
基板をその周縁部で固定するための基板ホールダ（カバ
ーリング）、基板面に部分的に膜を形成させるために基
板上に載置されるマスク、ＣＶＤ成膜装置において原料
ガスを均等に導入するための整流板、プラズマスパッタ
成膜装置においてターゲットの周囲に配置されるアース
シールド等が含まれる。In this embodiment, a shutter is exemplified as a component for a film forming apparatus. However, the component for a film forming apparatus according to the present invention may be any component that is used in a film forming apparatus and is likely to adhere to and deposit a film forming material. Parts, specifically, a shielding plate (an adhesion-preventing plate) arranged to prevent the film-forming material from adhering to a portion other than the substrate on which the film is to be formed, in addition to the shutter, for example, Chimney to guide the steam to the substrate,
A substrate holder (covering) for fixing the substrate at its peripheral edge, a mask placed on the substrate to partially form a film on the substrate surface, and a source gas evenly introduced in a CVD film forming apparatus. Rectifier plate, an earth shield disposed around the target in the plasma sputtering film forming apparatus, and the like.
【００３７】また本実施の形態においては、Ａｌ溶射
膜、Ｔｉ溶射膜を空孔のない膜として示したが、溶射膜
は本来的には多少の空孔を有している。この本来の空孔
以外に、溶射条件を調節して、意図的に多孔性の金属溶
射膜を形成させてもよく、表面に付着し堆積する厚膜の
剥離応力を緩和し易い溶射膜が得られる。Further, in the present embodiment, the Al sprayed film and the Ti sprayed film are shown as films without holes, but the sprayed film inherently has some holes. In addition to the original pores, the spraying conditions may be adjusted to intentionally form a porous metal sprayed film, and a sprayed film that is easy to relieve the peeling stress of a thick film deposited and deposited on the surface is obtained. Can be
【００３８】また本実施の形態においては、成膜装置用
部品の母材に形成させる凹凸を持っ溶射膜の材料として
ＡｌおよびＴｉを例示したが、溶射膜の材料には、成膜
条件に耐え、かつ形成される膜の剥離応力を緩和し易い
材料であれば、その種類は問わない。例えば、上記のＡ
ｌ、Ｔｉのほかニオブ（Ｎｂ）、バナジウム（Ｖ）、銅
（Ｃｕ）、また、成膜装置内の温度が比較的低い場合に
はアンチモン（Ｓｂ）、錫（Ｓｎ）、亜鉛（Ｚｎ）の使
用も可能である。上記の金属は合金であってもよい。Further, in this embodiment, Al and Ti are exemplified as the material of the thermal sprayed film having irregularities formed on the base material of the component for the film forming apparatus. Any kind of material can be used as long as the material easily reduces the peeling stress of the formed film. For example, A
l, Ti, niobium (Nb), vanadium (V), copper (Cu), and antimony (Sb), tin (Sn), zinc (Zn) when the temperature in the film forming apparatus is relatively low. Use is also possible. The above metals may be alloys.
【００３９】また本実施の形態においては、溶射装置に
ついては言及しなかったが、一般的に採用されている溶
射ガンをそのまま適用することができる。加熱はプラズ
マ式、アーク式、ガス燃焼式の何れであってもよく、ま
た溶射膜の材料は粉末、線、棒の何れの状態で供給する
ものであってもよい。Further, in this embodiment, the thermal spraying apparatus is not described, but a generally employed thermal spray gun can be applied as it is. Heating may be performed by any of a plasma method, an arc method, and a gas combustion method, and the material of the sprayed film may be supplied in any state of powder, wire, and rod.
【００４０】[0040]
【発明の効果】本発明の成膜装置用部品およびその製造
方法は以上に説明したような形態で実施され、次ぎに記
載するような効果を奏する。The components for a film forming apparatus and the method of manufacturing the same according to the present invention are implemented in the form described above, and have the following effects.
【００４１】請求項１の成膜装置用部品によれば、形成
されている溶射膜の有するそれ自体の表面粗さ（Ｒａ）
より大きい凹凸が成膜材料の付着物の投錨箇所となって
接着強度を増大させるほか、溶射膜が付着物の剥離応力
を緩和するので、付着物が成膜装置用部品から剥離し脱
落することによるパーティクルの発生を防ぎ、製品の収
率、品質を向上させることができ、更には成膜装置の稼
働を停止して行うクリーニングの間隔を長期間化するこ
とができるので、成膜装置の稼働率を高くし生産性を向
上させる。According to the component for the film forming apparatus of the first aspect, the surface roughness (Ra) of the sprayed film formed has itself.
The larger irregularities serve as anchor points for deposits on the film-forming material and increase the bonding strength. In addition, the sprayed film reduces the peeling stress of the deposits, so that the deposits can be peeled off from the components for the film-forming equipment and fall off. Can prevent the generation of particles, improve the yield and quality of the product, and can prolong the interval of cleaning performed by stopping the operation of the film forming apparatus. Increase rates and increase productivity.
【００４２】請求項２の成膜装置用部品によれば、柱状
の凸部と、それに反対形状の凹部との繰り返しからなる
凹凸が溶射膜の行方向と列方向とに一定のピッチで形成
されているので、付着物の接着強度を均等に増大させ、
溶射膜が付着物の剥離応力を均等に緩和し、成膜装置用
部品からの付着物の剥離、脱落を更に抑制して、パーテ
ィクルの発生を防ぎ、クリーニングの間隔を更に長期間
化する。請求項３の成膜装置用部品によれば、山部と谷
部とからなる凹凸が溶射膜上の任意の一方向に一定のピ
ッチで形成されているので、剥離応力が若干小さい付着
物に対して、その接着強度を均等に増大させ、溶射膜が
付着物の剥離応力を均等に緩和し、成膜装置用部品から
の付着物の剥離、脱落を更に抑制し、クリーニングの間
隔を更に長期間化する。According to the component for a film forming apparatus of the present invention, irregularities formed by repeating a columnar convex portion and a concave portion having the opposite shape are formed at a constant pitch in the row direction and the column direction of the sprayed film. So that evenly increase the adhesion strength of the deposit,
The thermal sprayed film uniformly reduces the peeling stress of the deposit, further suppresses the detachment and falling off of the deposit from the component for the film forming apparatus, prevents the generation of particles, and further extends the cleaning interval. According to the component for a film forming apparatus of the third aspect, since the irregularities formed by the peaks and the valleys are formed at a constant pitch in any one direction on the sprayed film, it is possible to remove the adhering material having a slightly smaller peeling stress. On the other hand, the adhesive strength is evenly increased, the sprayed film uniformly reduces the peeling stress of the deposits, further suppresses the detachment and detachment of the deposits from the components for the film forming apparatus, and further increases the cleaning interval. Period.
【００４３】請求項４の成膜装置用部品によれば、溶射
膜の材料が変形し易いアルミニウムまたはチタンである
ので、付着物の剥離応力を緩和し、成膜装置用部品から
の付着物の剥離、脱落を更に抑制し、クリーニングの間
隔を更に長期間化する。請求項５の成膜装置用部品によ
れば、成膜装置用部品が成膜源に近接して配置される部
品、または気体状の成膜材料に接触する部品であり、付
着物が成長し易い部品であっても、付着物の剥離、脱落
を抑制し、クリーニングの間隔を長期間化する。According to the fourth aspect of the present invention, since the material of the sprayed film is aluminum or titanium which is easily deformed, the peeling stress of the deposit is reduced, and the deposit of the deposit from the component for the deposition apparatus is reduced. Separation and falling off are further suppressed, and the cleaning interval is further lengthened. According to the component for a film forming apparatus of claim 5, the component for a film forming apparatus is a component disposed close to a film forming source or a component that comes into contact with a gaseous film forming material, and an attached substance grows. Even if it is a component that is easy to be removed, the separation and detachment of the attached matter are suppressed, and the cleaning interval is lengthened.
【００４４】請求項６の成膜装置用部品の製造方法によ
れば、成膜装置用部品の母材の表面に対し格子状マスク
または連子格子状マスクを介して溶射を施すか、または
通常的に溶射膜を形成させた後に格子状マスクまたは連
子格子状マスクを介してショットブラスト処理を施す
か、または通常的に溶射膜を形成させた後にエッチング
レジスト膜を描画し溶射膜の露出している部分を選択的
にエッチング処理を施すことにより、それ自体の表面粗
さ（Ｒａ）より大きい凹凸を有する溶射膜の形成された
成膜装置用部品を容易に製造することができ、得られる
成膜装置用部品は成膜材料が付着し厚膜化しても剥離、
脱落することを抑制し、製品の収率、品質を向上させる
と共に、成膜装置の稼働率、生産性を向上させる。According to the method for manufacturing a component for a film forming apparatus of the sixth aspect, the surface of the base material of the component for a film forming apparatus is thermally sprayed through a lattice mask or a reticulated lattice mask. After a thermal spray film is formed, a shot blasting process is performed through a lattice mask or a lattice lattice mask, or an etching resist film is usually drawn after forming a thermal spray film to expose the thermal spray film. By selectively performing the etching process on the portion where the film is formed, it is possible to easily manufacture and obtain a component for a film forming apparatus on which a sprayed film having irregularities larger than its own surface roughness (Ra) is formed. Even if the film forming material adheres and thickens the film forming device parts,
Dropping is suppressed, the product yield and quality are improved, and the operation rate and productivity of the film forming apparatus are improved.
【００４５】請求項７の成膜装置用部品の製造方法によ
れば、格子状マスクとして、格子の目が正方形、正三角
形、正六角形、または円形を単位としてパターン状とさ
れたもの中から選択して、成膜装置用部品の形状や成膜
材料の種類に応じて、好ましい形状の凹凸を有する溶射
膜の形成された成膜装置用部品を製造することができ、
得られる成膜装置用部品は成膜材料が付着し厚膜化して
も剥離、脱落することを抑制する。請求項８の成膜装置
用部品の製造方法によれば、溶射または溶射後のブラス
ト処理の途中において、母材と、格子状マスクまたは連
子格子状マスクとの空間的な相対位置を変化させて、成
膜装置用部品の形状や成膜材料の種類に応じて、好まし
い形状の凹凸を有する溶射膜の形成された成膜装置用部
品を製造することができ、得られる成膜装置用部品は成
膜材料が付着し厚膜化しても剥離、脱落することを抑制
する。According to the method of manufacturing a component for a film forming apparatus of the present invention, the grid-like mask is selected from those in which the grids are square, equilateral triangular, equilateral hexagonal, or circular. Then, depending on the shape of the component for the film forming apparatus and the type of the film forming material, it is possible to manufacture the component for the film forming apparatus on which the sprayed film having the unevenness of the preferable shape is formed,
The resulting film-forming apparatus component suppresses peeling and falling off even if the film-forming material adheres and the film becomes thick. According to the method for manufacturing a component for a film forming apparatus of claim 8, the spatial relative position between the base material and the lattice-shaped mask or the reticulated lattice-shaped mask is changed during the blasting after the thermal spraying or the thermal spraying. According to the shape of the component for the film forming apparatus and the type of the film forming material, it is possible to manufacture the component for the film forming apparatus on which the sprayed film having the unevenness having a preferable shape is formed, and the obtained component for the film forming apparatus is obtained. Suppresses peeling and falling off even when a film forming material is attached and the film becomes thick.
【図１】格子状マスクを介して溶射膜を形成させて成膜
装置用部品を製造する方法を示す図であり、Ａは格子状
マスクの部分平面図、Ｂは製造途中の状態を示す断面図
である。FIG. 1 is a diagram showing a method of manufacturing a film forming apparatus component by forming a sprayed film through a lattice-like mask, wherein A is a partial plan view of the lattice-like mask, and B is a cross-section showing a state in the course of production. FIG.
【図２】図１Ｂの方法によって得られる成膜装置用部品
の部分斜視図である。FIG. 2 is a partial perspective view of a film forming apparatus component obtained by the method of FIG. 1B.
【図３】本発明による溶射膜の凹凸と溶射膜の本来の表
面粗さとを関係を概念的に示す図であり、Ａは通常的に
得られる溶射膜を示す断面図、Ｂは本発明による溶射膜
の凹凸を本来の表面粗さと共に示す断面図である。FIG. 3 is a view conceptually showing the relationship between the unevenness of a thermal sprayed film according to the present invention and the original surface roughness of the thermal sprayed film, wherein A is a cross-sectional view showing a normally obtained thermal sprayed film, and B is according to the present invention. It is sectional drawing which shows the unevenness | corrugation of a sprayed film with original surface roughness.
【図４】他の製造方法を示す断面図であり、Ａは厚さが
大で均等な溶射膜が形成された状態を示し、Ｂはその後
に格子状マスクを介してショットブラスト処理している
状態を示す。FIG. 4 is a cross-sectional view showing another manufacturing method, in which A shows a state in which a sprayed film having a large thickness and a uniform thickness is formed, and B shows a state in which shot blasting is performed through a lattice-shaped mask thereafter. Indicates the status.
【図５】連子格子状マスクを介して溶射膜を形成させて
成膜装置用部品を製造する方法を示し、Ａは連子格子状
マスクの部分平面図、Ｂは製造途中の状態を示す断面図
である。FIG. 5 shows a method of manufacturing a component for a film forming apparatus by forming a sprayed film through a reticulated lattice mask, wherein A is a partial plan view of the reticulated lattice mask, and B shows a state in the course of production. It is sectional drawing.
【図６】図５のＢの方法によって得られる成膜装置用部
品の部分斜視図である。FIG. 6 is a partial perspective view of a film forming apparatus component obtained by the method of FIG. 5B.
【図７】格子状マスクの目の代表例を示す部分平面図で
ある。FIG. 7 is a partial plan view showing a typical example of the eyes of a lattice mask.
【図８】図９と共に溶射膜の凹凸の代表例を示す部分斜
視図である。8 is a partial perspective view showing a typical example of unevenness of a sprayed film together with FIG.
【図９】図８と共に溶射膜の凹凸の代表例を示す部分斜
視図である。FIG. 9 is a partial perspective view showing a typical example of unevenness of a thermal sprayed film together with FIG. 8;
１ 母材 ３ 溶射膜 １０ 成膜装置用部品 １２ 格子状マスク １３ 溶射膜 １３’ 溶射膜 ２０ 成膜装置用部品 ２２ 連子格子状マスク ２３ 溶射膜 DESCRIPTION OF SYMBOLS 1 Base material 3 Thermal spray film 10 Parts for film forming apparatus 12 Lattice mask 13 Thermal spray film 13 'Thermal spray film 20 Parts for film forming apparatus 22 Reticulated lattice mask 23 Thermal spray film
Claims (8)
形成されている成膜装置用部品において、 前記溶射膜にそれ自体の表面粗さ（Ｒａ）より大きい凹
凸が多数に形成されていることを特徴とする成膜装置用
部品。1. A part for a film forming apparatus, which is used in a film forming apparatus and has a sprayed film formed on a surface thereof, wherein the sprayed film has a large number of irregularities larger than its own surface roughness (Ra). A component for a film forming apparatus, characterized in that:
と列方向にそれぞれ一定のピッチで形成された柱状の凸
部と、前記凸部に連続し前記凸部とは反対形状の凹部と
の繰り返しからなり、前記凸部および前記凹部の形状が
円錐形状、円錐台形状、角錐形状、角錐台形状、角柱形
状、円柱形状、または端部が半球状の円柱形状である請
求項１に記載の成膜装置用部品。2. A column-shaped convex portion in which the irregularities are formed at a constant pitch in arbitrary row and column directions on the sprayed film, and a concave portion which is continuous with the convex portion and has a shape opposite to the convex portion. Wherein the shape of the convex portion and the concave portion is a conical shape, a truncated cone shape, a pyramid shape, a truncated pyramid shape, a prism shape, a column shape, or an end portion is a hemispherical column shape. A part for a film forming apparatus according to the above.
に一定のピッチで形成された山部と、前記山部に連続し
前記山部とは反対形状の谷部との繰り返しからなり、前
記山部と前記谷部との形状が蛇腹形状、簀の子形状、ま
たはラックギア形状である請求項１に記載の成膜装置用
部品。3. The method according to claim 1, wherein the concave and convex portions are formed by repeating a peak portion formed at a constant pitch in an arbitrary direction on the sprayed film, and a valley portion continuous with the peak portion and having a shape opposite to the peak portion. The component for a film forming apparatus according to claim 1, wherein the shape of the peak and the valley is a bellows shape, a skewer shape, or a rack gear shape.
チタンである請求項１から請求項３までの何れかに記載
の成膜装置用部品。4. The component for a film forming apparatus according to claim 1, wherein the material of the sprayed film is aluminum or titanium.
配置される部品、または気体状の成膜材料に接触する部
品である請求項１から請求項４までの何れかに記載の成
膜装置用部品。5. The film forming apparatus component according to claim 1, wherein the component is a component disposed close to a film forming source or a component contacting a gaseous film forming material. For film forming equipment.
形成されている成膜装置用部品の製造方法において、 前記成膜装置用部品の母材の表面に対し格子状マスクま
たは連子格子状マスクを介して溶射を施すか、 前記母材の表面に通常的に前記溶射膜を形成させた後
に、前記格子状マスクまたは前記連子格子状マスクを介
してブラスト処理を施すか、 または、前記母材の表面に通常的に前記溶射膜を形成さ
せた後に、前記溶射膜にエッチングレジスト膜をパター
ン状に形成し、前記溶射膜の露出している部分を選択的
にエッチング処理を施すことにより、 前記溶射膜自体の表面粗さ（Ｒａ）より大きい多数の凹
凸を有する溶射膜を形成させることを特徴とする成膜装
置用部品の製造方法。6. A method for manufacturing a component for a film forming apparatus having a sprayed film formed on a surface thereof used in the film forming apparatus, wherein a grid-like mask or a continuous mask is formed on a surface of a base material of the component for the film forming apparatus. Spraying through a lattice lattice mask, or after forming the thermal sprayed film on the surface of the base material normally, blasting through the lattice mask or the reticulated lattice mask, Alternatively, after the thermal spray film is formed on the surface of the base material, an etching resist film is formed on the thermal spray film in a pattern, and an exposed portion of the thermal spray film is selectively etched. A method for manufacturing a component for a film forming apparatus, comprising forming a sprayed film having a large number of irregularities larger than the surface roughness (Ra) of the sprayed film itself by performing the spraying.
方形、正三角形、正六角形、または円形を単位としパタ
ーン状に形成されたものを使用する請求項６に記載の成
膜装置用部品の製造方法。7. The component for a film forming apparatus according to claim 6, wherein the grid-shaped mask is formed by using grids each having a grid shape formed in a unit of a square, a regular triangle, a regular hexagon, or a circle. Production method.
理の途中において、前記母材と、前記格子状マスクまた
は前記連子格子状マスクとの空間的な相対位置を変化さ
せる請求項６または請求項７に記載の成膜装置用部品の
製造方法。8. The method according to claim 6, wherein a spatial relative position between the base material and the lattice-shaped mask or the lattice lattice-shaped mask is changed during the blasting after the thermal spraying or the thermal spraying. 8. The method for manufacturing a component for a film forming apparatus according to 7.
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|---|---|---|---|
| JP22775199A JP3815591B2 (en) | 1999-08-11 | 1999-08-11 | Method for manufacturing film forming apparatus parts and film forming apparatus parts |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22775199A JP3815591B2 (en) | 1999-08-11 | 1999-08-11 | Method for manufacturing film forming apparatus parts and film forming apparatus parts |
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| Publication Number | Publication Date |
|---|---|
| JP2001049419A true JP2001049419A (en) | 2001-02-20 |
| JP3815591B2 JP3815591B2 (en) | 2006-08-30 |
Family
ID=16865812
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22775199A Expired - Fee Related JP3815591B2 (en) | 1999-08-11 | 1999-08-11 | Method for manufacturing film forming apparatus parts and film forming apparatus parts |
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|---|---|
| JP (1) | JP3815591B2 (en) |
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