JP2007274350A - Method of manufacturing piezoelectric vibrator - Google Patents

Method of manufacturing piezoelectric vibrator Download PDF

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JP2007274350A
JP2007274350A JP2006097479A JP2006097479A JP2007274350A JP 2007274350 A JP2007274350 A JP 2007274350A JP 2006097479 A JP2006097479 A JP 2006097479A JP 2006097479 A JP2006097479 A JP 2006097479A JP 2007274350 A JP2007274350 A JP 2007274350A
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piezoelectric vibrator
vibrating piece
piezoelectric
base
piezoelectric vibrating
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JP4890913B2 (en
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Hirokazu Kobayashi
宏和 小林
Yoshinori Nasu
義紀 那須
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Kyocera Crystal Device Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric vibrator which removes an interface film of electroconductive glue which performs fastening and conduction when the piezoelectric vibrator chip is mounted, which is used as the piezoelectric vibrator microminiaturized. <P>SOLUTION: In the method of manufacturing the piezoelectric vibrator which composes a sealing structure by a base and a lid body and contains the piezoelectric vibrator chips, the problem is solved by mounting the piezoelectric vibrator chips using a process to paste the glue material on the base and a process giving ultrasonic vibration when the piezoelectric vibrator chips are mounted intervening the glue material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、超小型化する水晶振動子に用いる圧電振動片を実装する際に超音波振動を与えることで、実装強度を向上させることを目的とする圧電振動子の製造方法である。   The present invention is a method of manufacturing a piezoelectric vibrator that aims to improve mounting strength by applying ultrasonic vibration when mounting a piezoelectric vibrating piece used for an ultra-miniaturized quartz crystal vibrator.

昨今のデジタル家電、携帯用端末、あるいは通信機器、自動車の電子制御関連と幅広く圧電(水晶)振動子が活躍している。圧電振動子の中でも代表とする材料の水晶材料が水晶振動子として広く利用されているのが現状である。また、水晶振動子の中でも最も広く使われている仕様には、低温から高温にかけて3次曲線の温度特性を持つ一般的な水晶のカットアングルがATカットの水晶基板を用いたものが主流である。   Piezoelectric (crystal) resonators are widely used in recent digital home appliances, portable terminals, communication devices, and electronic control related to automobiles. At present, quartz materials, which are representative materials among piezoelectric vibrators, are widely used as crystal vibrators. In addition, the most widely used specifications for quartz resonators are those that use an AT-cut quartz substrate with a general crystal cut angle that has a temperature characteristic of a cubic curve from low to high temperatures. .

また、昨今では水晶振動子の外形寸法が極小型化、薄型化することで一例としては水晶振動子の外形寸法が3.2mm×2.5mm、2.5mm×2.0mm、2.0mm×1.6mmと小型化しており、これらの外形寸法に収納する圧電振動片の外形寸法は、縦×横1mm台の寸法により構成されたものが使われている。このように水晶振動子の外形寸法は搭載する電子機器、家電製品の小型化に追従したものであるが、その一方で水晶振動子の製造や、水晶振動子の核となる圧電振動片の小型化技術についても、日々改善と工夫が重ねられている。   In addition, in recent years, the external dimensions of crystal resonators are extremely small and thin, and as an example, the external dimensions of crystal resonators are 3.2 mm × 2.5 mm, 2.5 mm × 2.0 mm, 2.0 mm × The size is reduced to 1.6 mm, and the outer dimensions of the piezoelectric vibrating reed housed in these outer dimensions are configured by dimensions of vertical × horizontal 1 mm. In this way, the external dimensions of the crystal unit follow the miniaturization of the electronic equipment and home appliances to be mounted, but on the other hand, the manufacture of the crystal unit and the small size of the piezoelectric vibrating piece that is the core of the crystal unit Improvements and ingenuity are also being made on a daily basis.

上述するように水晶振動子の小型化に伴い、圧電振動片を収納する(水晶振動子の)容器については、従来のUM(ウルトラミニ)タイプやSMD(表面実装デバイス)タイプを継承しつつ、更に小型化した形状や材料を用いたものが開発されているのが現状である。   As described above, with the miniaturization of the crystal unit, the container (of the crystal unit) that stores the piezoelectric resonator element inherits the conventional UM (Ultra Mini) type and SMD (Surface Mount Device) type, In addition, there are currently developed products using smaller shapes and materials.

ところで、水晶振動子の核となる圧電振動片とは、水晶ブランク則ち、人工水晶から所望の切断角(カットアングル)で切り出した水晶板を、所望の出力周波数を得るまで厚み研磨を行い水晶板を薄く加工し、所望の厚みになった水晶板(水晶ブランク)に電極金属を付着させ、この電極金属から電荷を印加することにより安定した一定周期の出力周波数を得ることができる。要するに電極金属を付着した状態の水晶板を総称して水晶振動片と呼んでいる。   By the way, the piezoelectric vibrating piece that is the core of the crystal unit is a crystal blank, that is, a quartz plate cut out from an artificial crystal with a desired cutting angle (cut angle), and then polished to obtain a desired output frequency. By processing the plate thinly, attaching an electrode metal to a quartz plate (quartz blank) having a desired thickness, and applying an electric charge from the electrode metal, a stable output frequency with a constant period can be obtained. In short, the crystal plate with the electrode metal attached is generically called a crystal resonator element.

一例として、表面実装型の矩形状の水晶振動子の形状は、特許文献1、特許文献2に示すように、密閉容器構造の中に上述する水晶振動片を実装した構成で、水晶振動片を容器に収納することで水晶振動子の形態となる。また、水晶振動子に半導体部品を組み込むことで水晶発振器を得ることで、水晶振動子同様、水晶発振器も昨今では広い分野で多用されている。そして、これらの水晶振動子は密閉容器構造の内部に水晶振動片を接着部材により固着、実装することが一般的な構造である。
特開2006−005027号公報 特開2000−295059号公報 なお、出願人は前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を、本件出願時までに発見するに至らなかった。
As an example, as shown in Patent Document 1 and Patent Document 2, the surface-mounted rectangular crystal resonator has a configuration in which the above-described crystal resonator element is mounted in a sealed container structure. When stored in a container, a crystal resonator is formed. Further, by obtaining a crystal oscillator by incorporating a semiconductor component into a crystal resonator, crystal oscillators are now widely used in a wide range of fields as well as crystal resonators. These crystal resonators generally have a structure in which a crystal resonator element is fixed and mounted inside an airtight container structure with an adhesive member.
JP 2006-005027 A JP, 2000-295059, A In addition to the prior art documents specified by the prior art document information described above, the applicant has not found prior art documents related to the present invention by the time of filing of the present application. .

従来技術に示す水晶振動子の内部構造に述べるように、圧電振動片は導電性接着剤を代表とするいわゆる導電性接着部材により固着と導通が取られている。また最近でははんだや金材料を用いたバンプ形態で圧電振動片を固着する場合もある。しかしながら、導電性接着剤が最も扱い易くその主成分としてはエポキシ系やシリコン系のものに導通金属粉を含有させたものが多用されてい
る。
As described in the internal structure of the crystal resonator shown in the prior art, the piezoelectric vibrating piece is fixed and electrically connected by a so-called conductive adhesive member typified by a conductive adhesive. Recently, the piezoelectric vibrating piece may be fixed in a bump form using a solder or a gold material. However, conductive adhesives are the easiest to handle, and as their main component, epoxy-based or silicon-based ones containing conductive metal powder are frequently used.

特にシリコン系の導電性接着剤は硬化後も一定の柔軟性があり振動子に対する固着応力の影響を受けにくいという効果があり、温度特性に対する周波数安定度が高いことから上述するように導電性接着剤の有利性がある。   In particular, silicon-based conductive adhesives have a certain degree of flexibility after curing and are less susceptible to the effects of sticking stress on the vibrator, and have high frequency stability with respect to temperature characteristics. There are advantages of the agent.

ところで、ベースに実装する圧電振動片は上述する導電性接着剤を介して固着と導通することは言うまでも無いが、組立機の構造上導電性接着剤を塗布後短時間ながら間隔をあけて圧電振動片を実装し、導電性接着剤を乾燥する雰囲気工程で導電性接着剤を硬化させている。   By the way, it goes without saying that the piezoelectric vibrating reed mounted on the base is electrically connected to the fixing via the above-mentioned conductive adhesive, but the structure of the assembly machine has a short interval after applying the conductive adhesive. The conductive adhesive is cured in an atmosphere process in which the piezoelectric vibrating piece is mounted and the conductive adhesive is dried.

ここで、導電性接着剤を塗布後一定間隔の時間差をあけて圧電振動片を実装するにあたり、その実装までの時間に拘わらず塗布した導電性接着剤の表面には溶剤に含まれる皮膜を形成していまうことが考えられる。特にシリコン系の導電性接着剤の成分には、導電性接着剤の界面に皮膜がてきやすく、この皮膜を要因とする接着状態の不安定さが圧電振動子の実装後の諸特性を不安定にすることが考えられる。   Here, when mounting the piezoelectric vibrating piece with a certain time interval after applying the conductive adhesive, a film containing a solvent is formed on the surface of the applied conductive adhesive regardless of the time until the mounting. It is possible to continue. In particular, components of silicon-based conductive adhesives tend to have a film at the interface of the conductive adhesive, and the unstable bonding state caused by this film causes unstable characteristics after mounting the piezoelectric vibrator. Can be considered.

特に従来技術に示すよう、昨今の圧電振動子の形態が極小型化することにより、必然的に圧電振動子に収納する圧電振動片も極小型化になることから、ベースと圧電振動片を実装するのに用いる導電性接着剤の量も微量になることから、更に導電性接着剤の表面には被膜ができやすくなる環境にもあることが考えられる。   In particular, as shown in the prior art, the piezoelectric vibrator piece housed in the piezoelectric vibrator is inevitably miniaturized due to the recent miniaturization of the piezoelectric vibrator, so the base and the piezoelectric vibrator piece are mounted. Since the amount of the conductive adhesive used for this is also a very small amount, it may be possible that the surface of the conductive adhesive is more likely to form a coating.

そこで上述する課題を解決するために本発明は、ベースと蓋体とにより密閉構造を構成する圧電振動片を収納した圧電振動子の製造方法において、前記ベースに接着部材を塗布する工程と、前記圧電振動片を前記接着部材を介して実装するときに超音波振動を与える工程とにより圧電振動片を実装する圧電振動子の製造方法である。   Accordingly, in order to solve the above-described problem, the present invention provides a method for manufacturing a piezoelectric vibrator that houses a piezoelectric vibrating piece that forms a sealed structure with a base and a lid, and a step of applying an adhesive member to the base; A method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating piece is mounted by a step of applying ultrasonic vibration when the piezoelectric vibrating piece is mounted via the adhesive member.

この場合、超音波振動を与える機構には、前記圧電振動片を保持するジグを振動させる方法あるいは、前記ベースを保持するジグのいずれかに超音波振動を与えることにより、接着部材を介して実装する圧電振動片の実装時に、例え接着部材の界面に被膜があったとしても超音波振動の作用によりこの被膜を破壊し、本来の接着面を確保することにより安定した接着を確保することができる。   In this case, the mechanism for applying ultrasonic vibration is mounted via an adhesive member by applying ultrasonic vibration to either the jig holding the piezoelectric vibrating piece or the jig holding the base. When mounting the piezoelectric vibrating piece, even if there is a coating on the interface of the adhesive member, this coating is destroyed by the action of ultrasonic vibration, and stable adhesion can be secured by securing the original adhesive surface. .

上述のように、導電性接着剤の界面に被膜ができても、超音波振動により皮膜を破壊することで、仮に導電性接着剤の塗布量が極微量になったとしても、同様に超音波振動により導電性接着剤の界面の皮膜を除去することができ、圧電振動片の実装時の固着と導通の確保を実現することにより課題を解決するものである。   As described above, even if a coating is formed on the interface of the conductive adhesive, even if the coating amount of the conductive adhesive becomes extremely small by destroying the coating by ultrasonic vibration, the ultrasonic wave is similarly applied. The film at the interface of the conductive adhesive can be removed by vibration, and the problem can be solved by realizing securing and conduction when the piezoelectric vibrating piece is mounted.

本発明によれば、導電性接着剤を塗布後時間を経過した後でも、あるいは導電性接着剤の塗布量が極微量になったとしても、導電性接着剤界面に存在する皮膜を超音波振動により破壊しながら期待する圧電振動片の実装を実現することにより、製造工程における製造歩留まりと品質の向上を実現し、製造コストを低減できる。   According to the present invention, even after a lapse of time after the application of the conductive adhesive, or even when the amount of the conductive adhesive applied becomes extremely small, the film existing at the interface of the conductive adhesive is subjected to ultrasonic vibration. By realizing the mounting of the expected piezoelectric vibrating piece while being broken by the above, it is possible to improve the manufacturing yield and quality in the manufacturing process and reduce the manufacturing cost.

以下、添付図面に従ってこの発明の実施例を説明する。なお、各図において同一の符号は同様の対称を示すものとする。図1に示すのは本発明の圧電振動子の圧電振動片の実装フロー図を示すものである。密閉容器を構成する容器材質については、特に制限は無いがここではセラミックベースに金属製の蓋体を被せた構造に圧電振動子を実装するものとする。   Embodiments of the present invention will be described below with reference to the accompanying drawings. In the drawings, the same reference numerals indicate the same symmetry. FIG. 1 shows a mounting flow diagram of the piezoelectric vibrating piece of the piezoelectric vibrator of the present invention. Although there is no restriction | limiting in particular about the container material which comprises an airtight container, Here, a piezoelectric vibrator shall be mounted in the structure which covered the metal cover body on the ceramic base.

圧電振動片やセラミックベース、蓋体の準備工程などは図1のフロー図には描画していないが、ベースに接着部材を塗布する工程と、圧電振動片を接着部材を介して実装するときに超音波振動を与える工程とにより圧電振動片を実装する一連の流れを示している。なお、接着部材の硬化は実装後に処理するものである。   The steps for preparing the piezoelectric vibrating piece, ceramic base, lid, etc. are not drawn in the flow chart of FIG. 1, but when applying the adhesive member to the base and mounting the piezoelectric vibrating piece through the adhesive member A series of flows for mounting a piezoelectric vibrating piece by a process of applying ultrasonic vibration is shown. The curing of the adhesive member is processed after mounting.

ここで、超音波振動を与える機構には、圧電振動片をベースに実装する際に
保持するジグ(例えば吸着ヘッド)を振動させる方法あるいは、ベースを保持するジグ(例えばベースの整列トレー)のいずれかに超音波振動を与えることにより、ベースに塗布する導電性接着剤の界面に発生する皮膜を超音波振動により破壊しながら圧電振動片を実装することが可能となる。
Here, as a mechanism for applying ultrasonic vibration, either a method of vibrating a jig (for example, a suction head) that is held when a piezoelectric vibrating piece is mounted on a base or a jig for holding a base (for example, an alignment tray of a base) is used. By applying the ultrasonic vibration, it is possible to mount the piezoelectric vibrating piece while destroying the film generated at the interface of the conductive adhesive applied to the base by the ultrasonic vibration.

図2は上述する超音波振動を与える場面を模式図で示したものである。図2(a)は圧電振動片をベースに実装する際に保持するジグ(例えば吸着ヘッド)を振動させる方法であり、図2(b)はベースを保持するジグ(例えばベースの整列トレー)を振動させる方法を示すものである。勿論、図2(a)(b)の両方の状態に超音波振動を与えても良い。このとき、超音波振動の振動量は適宜最良の条件を設定するものであり、また、超音波振動を与える処理時間やタイミングについての制限は無い。   FIG. 2 is a schematic diagram showing a scene where the above-described ultrasonic vibration is applied. 2A shows a method of vibrating a jig (for example, a suction head) that is held when the piezoelectric vibrating piece is mounted on the base, and FIG. 2B shows a jig for holding the base (for example, an alignment tray of the base). The method of vibrating is shown. Of course, ultrasonic vibrations may be applied to both states of FIGS. At this time, the vibration amount of the ultrasonic vibration sets the best condition as appropriate, and there is no restriction on the processing time and timing for applying the ultrasonic vibration.

上述のように、超音波振動を用いることで、ベースと圧電振動片の間に介在する導電性接着剤の界面に存在する皮膜だけを効率良く破壊することができ、ベース本体あるいは、圧電振動片自体を破壊することは無い。そして、超音波を発生させる手段についても、最近では小型で軽量なものが出回っていることから、図2(a)、(b)のいずれの場合でも簡単に超音波を発生させる装置を組み込むことができ、安価な費用で大きな工程改善を実現することができる。   As described above, by using ultrasonic vibration, it is possible to efficiently destroy only the film present at the interface of the conductive adhesive interposed between the base and the piezoelectric vibrating piece. It will not destroy itself. Also, as a means for generating an ultrasonic wave, a small and lightweight device has recently been circulated, so a device for generating an ultrasonic wave easily can be incorporated in either case of FIGS. 2 (a) and 2 (b). Therefore, a large process improvement can be realized at a low cost.

上述する内容は圧電振動片の実装時に超音波振動を与えて圧電振動子を得るものであるが、圧電振動片の実装以外にも弾性表面波素子や半導体部品の実装にも応用できることは言うまでも無い。   The above description is to obtain a piezoelectric vibrator by applying ultrasonic vibration during mounting of the piezoelectric vibrating piece, but it can be applied to mounting of surface acoustic wave elements and semiconductor parts in addition to mounting of the piezoelectric vibrating piece. There is no.

本発明の製造の流れを示すフロー図である。It is a flowchart which shows the flow of manufacture of this invention. 本発明の超音波振動を与える手段を説明する概念図である。It is a conceptual diagram explaining the means to provide the ultrasonic vibration of this invention.

Claims (2)

ベースと蓋体とにより密閉構造を構成する圧電振動片を収納した圧電振動子の製造方法において、
前記ベースに接着部材を塗布する工程と、前記圧電振動片を前記接着部材を介して実装するときに超音波振動を与える工程とにより圧電振動片を実装することを特徴とする圧電振動子の製造方法。
In a method of manufacturing a piezoelectric vibrator that houses a piezoelectric vibrating piece that forms a sealed structure with a base and a lid,
Manufacturing of a piezoelectric vibrator comprising: mounting a piezoelectric vibrating piece by applying an adhesive member to the base; and applying ultrasonic vibration when mounting the piezoelectric vibrating piece through the adhesive member Method.
請求項1記載の超音波振動を与える機構には、前記圧電振動片を保持するジグを振動させる方法あるいは、前記ベースを保持するジグのいずれかに超音波振動を与えることを特徴とする圧電振動子の製造方法。 2. The piezoelectric vibration mechanism according to claim 1, wherein the ultrasonic vibration is applied to either the method of vibrating the jig holding the piezoelectric vibrating piece or the jig holding the base. Child manufacturing method.
JP2006097479A 2006-03-31 2006-03-31 Method for manufacturing piezoelectric vibrator Expired - Fee Related JP4890913B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009272795A (en) * 2008-05-02 2009-11-19 Epson Toyocom Corp Piezoelectric vibration element, and piezoelectric device and method of manufacturing the same

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JP2003188505A (en) * 2001-12-21 2003-07-04 Matsushita Electric Ind Co Ltd Method of manufacturing electronic package
JP2004289237A (en) * 2003-03-19 2004-10-14 Seiko Epson Corp Crystal oscilation piece and working method thereof, crystal device and mobile phone employing the crystal device, and electronic equipment employing the crystal device
JP2005286896A (en) * 2004-03-30 2005-10-13 Kyocera Kinseki Corp Piezoelectric vibrator and its fabricating method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188505A (en) * 2001-12-21 2003-07-04 Matsushita Electric Ind Co Ltd Method of manufacturing electronic package
JP2004289237A (en) * 2003-03-19 2004-10-14 Seiko Epson Corp Crystal oscilation piece and working method thereof, crystal device and mobile phone employing the crystal device, and electronic equipment employing the crystal device
JP2005286896A (en) * 2004-03-30 2005-10-13 Kyocera Kinseki Corp Piezoelectric vibrator and its fabricating method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009272795A (en) * 2008-05-02 2009-11-19 Epson Toyocom Corp Piezoelectric vibration element, and piezoelectric device and method of manufacturing the same

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