JP2007273783A - 固体電解コンデンサ及びその製造方法 - Google Patents
固体電解コンデンサ及びその製造方法 Download PDFInfo
- Publication number
- JP2007273783A JP2007273783A JP2006098387A JP2006098387A JP2007273783A JP 2007273783 A JP2007273783 A JP 2007273783A JP 2006098387 A JP2006098387 A JP 2006098387A JP 2006098387 A JP2006098387 A JP 2006098387A JP 2007273783 A JP2007273783 A JP 2007273783A
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- solid electrolytic
- electrolytic capacitor
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- capacitor element
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Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 108
- 239000007787 solid Substances 0.000 title claims abstract description 62
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 64
- 239000011347 resin Substances 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 description 22
- 238000002360 preparation method Methods 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000002131 composite material Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000005518 polymer electrolyte Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007784 solid electrolyte Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- FLDCSPABIQBYKP-UHFFFAOYSA-N 5-chloro-1,2-dimethylbenzimidazole Chemical compound ClC1=CC=C2N(C)C(C)=NC2=C1 FLDCSPABIQBYKP-UHFFFAOYSA-N 0.000 description 1
- 239000001741 Ammonium adipate Substances 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 235000019293 ammonium adipate Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-M toluene-4-sulfonate Chemical compound CC1=CC=C(S([O-])(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-M 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
【解決手段】 本発明に係る固体電解コンデンサ10においては、コンデンサ素子20が搭載される基板90は、リードフレーム50の陽極電極部62A,62B及び陰極電極部63A,63Bと樹脂プレート70とを含んでおり、樹脂プレート70の上面70aから露出した部分62a,63bによって陽極電極端子64及び陰極電極端子65が構成されている。そのため、この基板90は、リードフレーム50の陽極電極部62A,62B及び陰極電極部63A,63Bを、樹脂プレート70でモールド封止することにより、容易に作製することができる。従って、このような基板を用いた本発明に係る固体電解コンデンサ10に関しても容易に作製することができる。
【選択図】 図8
Description
(第1実施形態)
は、絶縁性を有するエポキシ系樹脂等からなるレジスト29が設けられている。レジスト
29は、固体高分子電解質層24aを形成するために弁金属基体26を溶液に浸漬させて
いるときに、ポーラス状になっている弁金属基体26の表面における毛細管現象により溶
液が所定の領域よりも図1の右側の方へ上がってくることを防止する。
(第2実施形態)
Claims (2)
- コンデンサ素子と、
前記コンデンサ素子が搭載される基板であって、複数の金属片と樹脂とを含み、前記樹脂から露出した部分の前記金属片によって、前記コンデンサ素子の電極部に接続される複数の電極端子が構成された基板と、
前記コンデンサ素子と前記基板とを一体的に封止する樹脂モールドと
を備える、固体電解コンデンサ。 - 複数の金属片と樹脂とを含み、前記樹脂から露出した部分の前記金属片によって複数の電極端子が構成された基板を準備する工程と、
前記基板にコンデンサ素子を、前記コンデンサ素子の電極部が前記基板の前記複数の電極端子に接続されるように搭載する工程と、
前記コンデンサ素子と前記基板とを樹脂モールドによって一体的に封止する工程と
を有する、固体電解コンデンサの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006098387A JP4626556B2 (ja) | 2006-03-31 | 2006-03-31 | 固体電解コンデンサ及びその製造方法 |
US11/727,149 US7508652B2 (en) | 2006-03-31 | 2007-03-23 | Solid electrolytic capacitor and method of making same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006098387A JP4626556B2 (ja) | 2006-03-31 | 2006-03-31 | 固体電解コンデンサ及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007273783A true JP2007273783A (ja) | 2007-10-18 |
JP4626556B2 JP4626556B2 (ja) | 2011-02-09 |
Family
ID=38558575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006098387A Expired - Fee Related JP4626556B2 (ja) | 2006-03-31 | 2006-03-31 | 固体電解コンデンサ及びその製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7508652B2 (ja) |
JP (1) | JP4626556B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012044112A (ja) * | 2010-08-23 | 2012-03-01 | Rubycon Carlit Co Ltd | コンデンサ素子を含むデバイス |
KR20160054810A (ko) * | 2014-11-07 | 2016-05-17 | 삼성전기주식회사 | 탄탈륨 캐패시터 및 그 제조 방법 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4905254B2 (ja) * | 2007-05-25 | 2012-03-28 | トヨタ自動車株式会社 | コンデンサ一体バスバーの製造方法 |
JP5004232B2 (ja) | 2007-11-06 | 2012-08-22 | Necトーキン株式会社 | 固体電解コンデンサ、固体電解コンデンサ素子およびその製造方法 |
US10143087B2 (en) * | 2016-05-18 | 2018-11-27 | Murata Manufacturing Co., Ltd. | Capacitor element-mounted structure |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6289127U (ja) * | 1985-11-25 | 1987-06-08 | ||
JP2003100556A (ja) * | 2001-09-26 | 2003-04-04 | Nec Tokin Toyama Ltd | チップ型固体電解コンデンサ及びその製造方法並びにリードフレーム |
JP2004281716A (ja) * | 2003-03-17 | 2004-10-07 | Nichicon Corp | チップ状固体電解コンデンサ |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579813A (en) * | 1968-12-23 | 1971-05-25 | Matsuo Electric Co | Method of making electronic components on comblike metal fingers and severing the fingers |
US6517892B1 (en) * | 1999-05-24 | 2003-02-11 | Showa Denko K.K. | Solid electrolytic capacitor and method for producing the same |
EP2259276A1 (en) * | 1999-05-28 | 2010-12-08 | Murata Manufacturing Co., Ltd. | Solid electrolytic capacitor and manufacturing method thereof |
JP3942000B2 (ja) * | 1999-06-01 | 2007-07-11 | ローム株式会社 | パッケージ型固体電解コンデンサの構造及びその製造方法 |
JP3568432B2 (ja) | 1999-09-30 | 2004-09-22 | 三洋電機株式会社 | 固体電解コンデンサの製造方法 |
JP3881480B2 (ja) * | 1999-10-14 | 2007-02-14 | ローム株式会社 | 固体電解コンデンサおよびその製法 |
US6324051B1 (en) * | 1999-10-29 | 2001-11-27 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
GB9926975D0 (en) * | 1999-11-15 | 2000-01-12 | Avx Ltd | Solid state capacitors and methods of manufacturing them |
JP4160223B2 (ja) * | 1999-12-14 | 2008-10-01 | ローム株式会社 | 固体電解コンデンサ |
JP3541001B2 (ja) * | 2000-11-13 | 2004-07-07 | Necトーキン富山株式会社 | チップ型固体電解コンデンサ |
US6625009B2 (en) * | 2001-04-05 | 2003-09-23 | Rohm Co., Ltd. | Solid electrolytic capacitor and method of making the same |
WO2003028050A1 (en) * | 2001-09-20 | 2003-04-03 | Matsushita Electric Industrial Co., Ltd. | Capacitor, laminated capacitor, and capacitor built-in board |
TWI279080B (en) * | 2001-09-20 | 2007-04-11 | Nec Corp | Shielded strip line device and method of manufacture thereof |
JP2004253615A (ja) * | 2003-02-20 | 2004-09-09 | Nec Tokin Corp | 固体電解コンデンサ及びその製造方法 |
JP4138621B2 (ja) | 2003-09-26 | 2008-08-27 | Tdk株式会社 | 固体電解コンデンサ |
JP4392237B2 (ja) * | 2003-12-26 | 2009-12-24 | ローム株式会社 | 固体電解コンデンサ |
-
2006
- 2006-03-31 JP JP2006098387A patent/JP4626556B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-23 US US11/727,149 patent/US7508652B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6289127U (ja) * | 1985-11-25 | 1987-06-08 | ||
JP2003100556A (ja) * | 2001-09-26 | 2003-04-04 | Nec Tokin Toyama Ltd | チップ型固体電解コンデンサ及びその製造方法並びにリードフレーム |
JP2004281716A (ja) * | 2003-03-17 | 2004-10-07 | Nichicon Corp | チップ状固体電解コンデンサ |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012044112A (ja) * | 2010-08-23 | 2012-03-01 | Rubycon Carlit Co Ltd | コンデンサ素子を含むデバイス |
KR20160054810A (ko) * | 2014-11-07 | 2016-05-17 | 삼성전기주식회사 | 탄탈륨 캐패시터 및 그 제조 방법 |
KR102052764B1 (ko) | 2014-11-07 | 2019-12-05 | 삼성전기주식회사 | 탄탈륨 캐패시터 및 그 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
JP4626556B2 (ja) | 2011-02-09 |
US20070230091A1 (en) | 2007-10-04 |
US7508652B2 (en) | 2009-03-24 |
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