JP2007268627A - Electro-deposited wire saw - Google Patents
Electro-deposited wire saw Download PDFInfo
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- JP2007268627A JP2007268627A JP2006094393A JP2006094393A JP2007268627A JP 2007268627 A JP2007268627 A JP 2007268627A JP 2006094393 A JP2006094393 A JP 2006094393A JP 2006094393 A JP2006094393 A JP 2006094393A JP 2007268627 A JP2007268627 A JP 2007268627A
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- abrasive grains
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Description
本発明は、製造に要する時間を短縮することが可能な電着ワイヤソーに関する。 The present invention relates to an electrodeposited wire saw that can reduce the time required for production.
電着ワイヤソーは通常、芯線の周囲にダイヤモンド等からなる砥粒をニッケルめっきによって固着して形成される。電着ワイヤソーを製造するにあたり、製造に要する時間が短いほど生産性が向上するが、砥粒を確実に固着するためには、めっき層を所定の厚みに形成することが必要であるため、製造時間を短縮することは困難である場合が多い。 An electrodeposited wire saw is usually formed by adhering abrasive grains made of diamond or the like around a core wire by nickel plating. In producing an electrodeposited wire saw, the shorter the time required for production, the better the productivity. However, in order to securely fix the abrasive grains, it is necessary to form a plating layer with a predetermined thickness. It is often difficult to shorten the time.
また、電着ワイヤソーは砥粒の保持力が強いという利点がある一方で、砥粒が凝集しやすく、ろう付けで砥粒を固着する場合のように、砥粒間隔を正確にコントロールすることが難しい。砥粒間隔が適正に維持されないと、ワイヤソーの切断性能が低下することとなる。
砥粒の集中度を適正化する目的で、砥粒の平均粒径より小さい粒径の粒子を混在させた超砥粒ワイヤソーが、特許文献1に記載されている。また、工作物に対して化学的作用を及ぼす液状物質を内包したマイクロカプセルと砥粒とを結合剤中に分散添加してなる砥粒工具が、特許文献2に記載されている。
Electrodeposited wire saws also have the advantage of a strong holding power for abrasive grains. On the other hand, abrasive grains tend to agglomerate. difficult. If the abrasive interval is not properly maintained, the cutting performance of the wire saw will deteriorate.
For the purpose of optimizing the degree of concentration of abrasive grains, a superabrasive wire saw in which particles having a particle size smaller than the average particle size of abrasive grains are mixed is described in Patent Document 1. Further,
しかし、特許文献1に記載されたものでは、結合材がレジンボンドであるため保持力が十分に得られず、砥粒の保持力を維持したまま、砥粒間隔を適正にして切れ味を向上させることができない。また、特許文献2に記載されたものは、加工時に工作物と砥粒工具の接触によってマイクロカプセル壁が破壊され、このカプセルに内包した化学的作用を及ぼす液状物質が放出されることによって、工作物に対して化学的作用を生じさせ、工作物の表面を除去し易い物質に変化させるとともに、その変質層を逐次除去することを意図したものであり、このようなマイクロカプセルを用いても、砥粒の凝集を防止して砥粒間隔を正確にコントロールすることはできない。
However, in the one described in Patent Document 1, since the binding material is a resin bond, a sufficient holding power cannot be obtained, and while maintaining the holding power of the abrasive grains, the abrasive interval is made appropriate to improve the sharpness. I can't. In addition, what is described in
本発明は、以上の問題点を解決するためになされたもので、めっきに要する時間を短縮して生産性を向上するとともに、砥粒の凝集を防止して切断性能を向上させた電着ワイヤソーを提供することを目的とする。 The present invention has been made in order to solve the above-described problems, and is an electrodeposited wire saw that improves productivity by reducing the time required for plating, and improves cutting performance by preventing agglomeration of abrasive grains. The purpose is to provide.
以上の課題を解決するために、本発明の電着ワイヤソーは、芯線の周囲に、砥粒とともに無機質の微粒子をニッケルめっきによって固着したことを特徴とする。 In order to solve the above-described problems, the electrodeposited wire saw of the present invention is characterized in that inorganic fine particles are fixed together with abrasive grains around the core wire by nickel plating.
無機質の微粒子をめっき液に含有してめっきすることにより、めっき層の体積を減らしてめっき層の厚みを所定の厚みに維持することができ、砥粒を短時間で固着することができる。また、微粒子と砥粒とをめっき液に混合することで、砥粒の沈降速度を下げることができ、芯線への砥粒の固着率が向上する。さらに、砥粒の間に微粒子が介在するようになるため、砥粒の凝集を防止して砥粒間隔を適正なものとすることができ、ワイヤソーの性能の安定性が向上する。 By plating by containing inorganic fine particles in the plating solution, the volume of the plating layer can be reduced, the thickness of the plating layer can be maintained at a predetermined thickness, and the abrasive grains can be fixed in a short time. Further, by mixing the fine particles and the abrasive grains in the plating solution, the settling speed of the abrasive grains can be lowered, and the adhesion rate of the abrasive grains to the core wire is improved. Further, since fine particles are interposed between the abrasive grains, the aggregation of the abrasive grains can be prevented to make the abrasive interval proper, and the stability of the performance of the wire saw is improved.
本発明においては、無機質の微粒子としてシリカまたはアルミナを用いることができる。シリカまたはアルミナは、非導電性かつ耐薬品性のある材料であるため、めっき液に混合する微粒子として好ましい。 In the present invention, silica or alumina can be used as the inorganic fine particles. Since silica or alumina is a non-conductive and chemical-resistant material, it is preferable as fine particles mixed in the plating solution.
本発明においては、微粒子の粒径は砥粒の粒径の3%以上50%以下であることを特徴とする。
微粒子の粒径を砥粒の粒径の3%以上50%以下とすることにより、砥粒の間に適度に微粒子が介在するようになるため、砥粒の凝集を有効に防止することができる。微粒子の粒径が砥粒の粒径の3%未満であると、析出するめっき量が減少するため、砥粒の保持力が脆弱となって好ましくなく、50%を超えると、切り屑の排出性が悪くなって目詰まりを起こし短寿命となって好ましくない。
In the present invention, the particle diameter of the fine particles is 3% or more and 50% or less of the particle diameter of the abrasive grains.
By setting the particle size of the fine particles to 3% or more and 50% or less of the particle size of the abrasive grains, the fine particles are appropriately interposed between the abrasive grains, so that aggregation of the abrasive grains can be effectively prevented. . If the particle size of the fine particles is less than 3% of the particle size of the abrasive particles, the amount of plating deposited decreases, so the holding power of the abrasive particles becomes fragile. It is not preferable because the properties deteriorate and clogging occurs, resulting in a short life.
本発明においては、微粒子の含有量は、ニッケルめっきの10体積%以上50体積%以下であることを特徴とする。
微粒子の含有量は、ニッケルめっきの10体積%以上50体積%以下とすることにより、加工能率が向上する。微粒子の含有量が、ニッケルめっきの10体積%未満であると、微粒子数が少ないために、砥粒の凝集が多くなって好ましくなく、50%を超えると、析出するめっき量が減少するため、砥粒の保持力が脆弱となって好ましくない。
In the present invention, the content of fine particles is 10 volume% or more and 50 volume% or less of nickel plating.
By making the content of the
本発明によると、めっきに要する時間を短縮して生産性を向上するとともに、砥粒の凝集を防止して切断性能を向上させた電着ワイヤソーを実現することができる。 According to the present invention, it is possible to realize an electrodeposition wire saw in which the time required for plating is shortened to improve productivity, and the agglomeration of abrasive grains is prevented to improve cutting performance.
以下に、本発明をその実施形態に基づいて説明する。
図1に、本発明の実施形態に係る電着ワイヤソーの構成を示す。
図1に示す電着ワイヤソー1において、芯線2の周囲に砥粒3と微粒子4とがニッケルめっき5により固着されている。砥粒3は、ダイヤモンドやcBNなどからなる硬質砥粒であり、微粒子4は、シリカまたはアルミナなどの無機質の微粒子である。微粒子4の粒径は砥粒3の粒径の3%以上50%以下としている。また、微粒子4の含有量は、ニッケルめっき5の10体積%以上50体積%以下としている。
Below, this invention is demonstrated based on the embodiment.
FIG. 1 shows the configuration of an electrodeposited wire saw according to an embodiment of the present invention.
In the electrodeposited wire saw 1 shown in FIG. 1,
この構成の電着ワイヤソーを作製し、試験を行った。電着ワイヤソーの作製条件、および試験条件は、以下の通りである。
電流密度:2A/dm2、
微粒子種類:アルミナ
微粒子の平均粒径:50μm
An electrodeposited wire saw with this configuration was produced and tested. The production conditions and test conditions of the electrodeposited wire saw are as follows.
Current density: 2 A / dm 2
Fine particle type: Alumina Fine particle average particle size: 50 μm
試験結果を以下に説明する。
図2に、微粒子をめっき液に加えてめっきしたときと、微粒子を加えずにめっきしたときとを比較して、めっきに要する時間を測定した結果を示す。微粒子をめっき液に加えると、微粒子を加えないときに比べて、所定のめっき厚みを形成する時間が約半分に短縮された。
The test results are described below.
FIG. 2 shows the results of measuring the time required for plating by comparing the case where plating is performed by adding fine particles to the plating solution and the case where plating is performed without adding fine particles. When the fine particles were added to the plating solution, the time for forming the predetermined plating thickness was shortened by about half compared to when the fine particles were not added.
図3に、微粒子の含有量を変えたときの加工能率を示す。この結果から、ニッケルめっき層に対する微粒子の占有率が10体積%以上50体積%以下のときに、加工能率が向上していることがわかる。微粒子の含有量が、ニッケルめっきの50%を超えたときに加工能率が低下しているのは、析出するめっき量が減少するため、砥粒の保持力が脆弱となるためである。 FIG. 3 shows the processing efficiency when the content of the fine particles is changed. From this result, it is understood that the processing efficiency is improved when the occupation ratio of the fine particles to the nickel plating layer is 10% by volume or more and 50% by volume or less. The reason why the processing efficiency is reduced when the content of the fine particles exceeds 50% of the nickel plating is that the holding power of the abrasive grains becomes weak because the amount of plating deposited decreases.
図4に、微粒子の粒径を変えたときの寿命を示す。この結果から、微粒子の径が砥粒の粒径の3%以上50%以下のときに、寿命が向上していることがわかる。微粒子の粒径が砥粒の粒径の3%未満のときに寿命が低下しているのは、析出するめっき量が減少して砥粒の保持力が脆弱となるためであり、50%を超えたときに寿命が低下しているのは、切り屑の排出性が悪くなって目詰まりを起こしているためである。 FIG. 4 shows the lifetime when the particle size of the fine particles is changed. From this result, it can be seen that the life is improved when the particle diameter is 3% or more and 50% or less of the particle diameter of the abrasive grains. The reason why the life is reduced when the particle size of the fine particles is less than 3% of the particle size of the abrasive grains is that the amount of plating deposited decreases and the holding power of the abrasive grains becomes weak, and 50% The reason why the life is reduced when the amount exceeds the limit is that clogging occurs due to poor chip discharge.
本発明は、めっきに要する時間を短縮して生産性を向上するとともに、砥粒の凝集を防止して切断性能を向上させた電着ワイヤソーとして利用することができる。 INDUSTRIAL APPLICABILITY The present invention can be used as an electrodeposited wire saw that shortens the time required for plating and improves productivity, and prevents agglomeration of abrasive grains to improve cutting performance.
1 電着ワイヤソー
2 芯線
3 砥粒
4 微粒子
5 ニッケルめっき
DESCRIPTION OF SYMBOLS 1 Electrodeposited wire saw 2
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