JP2007260940A5 - - Google Patents

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Publication number
JP2007260940A5
JP2007260940A5 JP2006085446A JP2006085446A JP2007260940A5 JP 2007260940 A5 JP2007260940 A5 JP 2007260940A5 JP 2006085446 A JP2006085446 A JP 2006085446A JP 2006085446 A JP2006085446 A JP 2006085446A JP 2007260940 A5 JP2007260940 A5 JP 2007260940A5
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JP
Japan
Prior art keywords
silver
pattern
thin film
forming
support
Prior art date
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Application number
JP2006085446A
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Japanese (ja)
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JP2007260940A (en
JP4624950B2 (en
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Priority to JP2006085446A priority Critical patent/JP4624950B2/en
Priority claimed from JP2006085446A external-priority patent/JP4624950B2/en
Publication of JP2007260940A publication Critical patent/JP2007260940A/en
Publication of JP2007260940A5 publication Critical patent/JP2007260940A5/ja
Application granted granted Critical
Publication of JP4624950B2 publication Critical patent/JP4624950B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (2)

支持体上に形成された銀薄膜パタン上に中性、あるいは塩基性の銅めっき浴により厚さ１μｍ以下のめっき層を形成した後、さらに厚付のための電解めっきすることを特徴とする金属パタンの形成方法。   A metal characterized by forming a plating layer having a thickness of 1 μm or less on a silver thin film pattern formed on a support with a neutral or basic copper plating bath and then performing electrolytic plating for further thickening Pattern formation method. 前記銀薄膜パタンが、支持体上に設けられたハロゲン化銀乳剤層に露光・現像処理を行うことにより得られる還元銀パタンであることを特徴とする請求項１に記載の金属パタンの形成方法。2. The method for forming a metal pattern according to claim 1, wherein the silver thin film pattern is a reduced silver pattern obtained by exposing and developing a silver halide emulsion layer provided on a support. .
JP2006085446A 2006-03-27 2006-03-27 Method for forming metal pattern Expired - Fee Related JP4624950B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006085446A JP4624950B2 (en) 2006-03-27 2006-03-27 Method for forming metal pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006085446A JP4624950B2 (en) 2006-03-27 2006-03-27 Method for forming metal pattern

Publications (3)

Publication Number Publication Date
JP2007260940A JP2007260940A (en) 2007-10-11
JP2007260940A5 true JP2007260940A5 (en) 2008-12-04
JP4624950B2 JP4624950B2 (en) 2011-02-02

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ID=38634427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006085446A Expired - Fee Related JP4624950B2 (en) 2006-03-27 2006-03-27 Method for forming metal pattern

Country Status (1)

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JP (1) JP4624950B2 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145757A (en) * 1997-11-11 1999-05-28 Miyota Kk Container for piezoelectric oscillator
JP4641719B2 (en) * 2002-12-27 2011-03-02 富士フイルム株式会社 Method for manufacturing translucent electromagnetic wave shielding film and translucent electromagnetic wave shielding film

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