JP2007258520A - Cooling device of electronics device - Google Patents

Cooling device of electronics device Download PDF

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Publication number
JP2007258520A
JP2007258520A JP2006082273A JP2006082273A JP2007258520A JP 2007258520 A JP2007258520 A JP 2007258520A JP 2006082273 A JP2006082273 A JP 2006082273A JP 2006082273 A JP2006082273 A JP 2006082273A JP 2007258520 A JP2007258520 A JP 2007258520A
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heat
component
peltier element
heat transfer
cooling
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Osamu Nanba
修 難波
Narumasa Yamagishi
成多 山岸
Kazunori Tanabe
和紀 田辺
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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<P>PROBLEM TO BE SOLVED: To provide a cooling device for an electronics device with an object to be cooled, a Peltier element, and a cooling module easily exchanged in case of their failure, capable of highly efficiently cooling with its broad degree of freedom, and capable of retarding an occurrence of dew condensation even though the Peltier element is used. <P>SOLUTION: The cooling device comprises the Peltier element 3 with a heat absorbing side firmly attached to a copper base substrate 2 with a heating element 1 mounted; a heat transfer component 4 having a heat radiating structure and firmly attached to the heat radiation side of the Peltier element 3; a depressing component 5 for depressing the element 1 and the element 3 to the component 4; a sealing case 6 for blocking the component 5, the element 1, and the element 3 out of the outside air with the component 4; an O-ring 7 arranged between the component 4 and the case 6; a dried gas 14 filled in an enclosed space formed by the component 4 and the case 6; and a radiator 8 closely attached to the component 4. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、ペルチェ素子を利用した冷却装置の交換が容易な結露防止構造を有する電子機器の冷却装置に関するものである。   The present invention relates to a cooling device for an electronic apparatus having a dew condensation prevention structure that facilitates replacement of a cooling device using a Peltier element.

近年、電気回路に半導体部品を多く使用する電子機器においては、半導体の製造技術の進歩に伴い、半導体で消費される電力も上昇し、発生する熱量が増加してきている。特に、発光ダイオード、またはレーザーダイオードからなる半導体光源を使用する投射型表示装置のような電子機器においては多大の熱量が発生する。部品の性能、信頼性及び寿命を確保するためには、半導体の温度を、ある温度範囲内に保つ必要があり、そこで、例えば、特許文献１に記載されているように、冷却素子であるペルチェ素子の吸熱側に半導体部品、放熱側に液冷受熱部品を配置するような構成が考えられる。図６にその概略図を示す。   In recent years, in an electronic device that uses many semiconductor components in an electric circuit, with the progress of semiconductor manufacturing technology, the power consumed by the semiconductor has also increased, and the amount of heat generated has increased. In particular, a large amount of heat is generated in an electronic apparatus such as a projection display device using a semiconductor light source composed of a light emitting diode or a laser diode. In order to ensure the performance, reliability, and life of the parts, it is necessary to keep the temperature of the semiconductor within a certain temperature range. For example, as described in Patent Document 1, a Peltier that is a cooling element is required. A configuration in which a semiconductor component is disposed on the heat absorption side of the element and a liquid-cooled heat reception component is disposed on the heat dissipation side is conceivable. FIG. 6 shows a schematic diagram thereof.

図６において、ペルチェ素子１０１の吸熱面１０１ａに冷却対象物１０２を、放熱面１０１ｂに液冷部品１０３が接して配置されており、液冷部品１０３に液体を流すことにより、ペルチェ素子１０１の放熱面１０１ｂを冷却することにより、ペルチェ素子１０１の吸熱能力を高め、冷却対象物１０２を効果的に冷却することができる。   In FIG. 6, an object to be cooled 102 is disposed in contact with the heat absorbing surface 101 a of the Peltier element 101, and a liquid cooling component 103 is in contact with the heat radiating surface 101 b. By cooling the surface 101b, the heat absorption capability of the Peltier element 101 can be increased, and the object to be cooled 102 can be effectively cooled.

しかしながら、ペルチェ素子１０１の吸熱面側が周囲温度以下になると、水分を含んだ周辺の空気により結露が発生し、この水が電気回路に入り込み、回路を短絡させたり、電子機器内の金属性の構造体に錆が発生するなどという問題がある。そこで、ペルチェ素子を使って冷却する場合の結露防止構造として、例えば、特許文献２、特許文献３に記載されているような、放熱部品とケース等により外気と遮断する構造の放熱器が考えられている。   However, when the endothermic surface side of the Peltier element 101 falls below the ambient temperature, dew condensation occurs due to the surrounding air containing moisture, and this water enters the electric circuit, short-circuiting the circuit, or metallic structure in the electronic device There is a problem that rust is generated on the body. Therefore, as a dew condensation prevention structure when cooling using a Peltier element, for example, a radiator having a structure that blocks the outside air by a heat radiation component and a case as described in Patent Document 2 and Patent Document 3 is conceivable. ing.

しかしながら、これらも冷却対象物の寿命や故障等で交換が発生した時には分解しなければならず、水分を含んだ外気を内部に取り込んでしまい、再駆動時には結露が発生してしまうため、放熱器ごとの交換を要してしまう。   However, these also have to be disassembled when replacement occurs due to the life or failure of the object to be cooled, and the outside air containing moisture is taken into the interior, and condensation occurs during reactivation. Every replacement is required.

そこで、図７に示すような交換が容易な密閉構造が考えられる。プリント基板２０１上に配置された発熱体２０２は熱拡散板２０３を介してペルチェ素子２０４の吸熱面側に配置され、ペルチェ素子２０４の放熱面の外縁部にはＯリング２０５が配置されて、発熱体２０２、ペルチェ素子２０４等は断熱材２０６と本体ケース２０７との間で締め付け固定されている。本体ケース２０７は上ケース２０８とＯリング２０９により密閉され、内部には水分を殆ど含まない気体、または、水分を含まない不活性ガスを封入することで、結露を防止している。本体ケース２０７の開口を通して、ペルチェ素子２０４の放熱面側に液冷部品２１０を密接させることで発熱部品２０２を冷却している。
特開平７−２６０２８７号公報 特開平９−１８６３７９号公報 特開２００４−３４２７７９号公報 Therefore, a sealed structure as shown in FIG. The heating element 202 disposed on the printed circuit board 201 is disposed on the heat absorbing surface side of the Peltier element 204 via the heat diffusion plate 203, and an O-ring 205 is disposed on the outer edge portion of the heat dissipation surface of the Peltier element 204 to generate heat. The body 202, the Peltier element 204, and the like are fastened and fixed between the heat insulating material 206 and the main body case 207. The main body case 207 is hermetically sealed by the upper case 208 and an O-ring 209, and dew condensation is prevented by enclosing a gas containing almost no moisture or an inert gas containing no moisture. The heat generating component 202 is cooled by bringing the liquid cooling component 210 into close contact with the heat radiating surface side of the Peltier element 204 through the opening of the main body case 207.
JP-A-7-260287 JP-A-9-186379 JP 2004-342779 A

しかしながら、上記図７の構成の冷却装置では、ペルチェ素子２０４の放熱面の外縁部にＯリング２０５があり、その部分は液冷部品と接していない為、吸熱対象物の背面に大きな空間が無い場合、発生した熱がペルチェ素子２０４の吸熱面側に逆流し冷却能力の低下を引き起こしたり、ペルチェ素子２０４の放熱面内での温度分布による熱膨張の差のためにペルチェ素子２０４内で半田クラックが発生してしまうという問題を有していた。   However, in the cooling device having the configuration shown in FIG. 7, the O-ring 205 is provided at the outer edge of the heat dissipation surface of the Peltier element 204, and that portion is not in contact with the liquid-cooled parts. In this case, the generated heat flows back to the heat absorption surface side of the Peltier element 204 to cause a decrease in cooling capacity, or a solder crack in the Peltier element 204 due to a difference in thermal expansion due to temperature distribution in the heat dissipation surface of the Peltier element 204. Had the problem that would occur.

本発明は上記従来の問題点を解決するもので、吸熱対象物、ペルチェ素子、液冷モジュールが万一故障を起こした場合にも容易に交換が可能で、また、吸熱対象物の背面側に大きな空間が無くても高効率な冷却が可能であり、ペルチェ素子内で半田クラックが発生することもなく、従ってレイアウトの自由度が広がり、さらに、ペルチェ素子を使用しても結露の発生を阻止することができる電子機器の冷却装置の提供を目的とする。   The present invention solves the above-mentioned conventional problems, and can be easily replaced in the event that the endothermic object, the Peltier element, and the liquid cooling module fail, and the rear end side of the endothermic object. Even if there is no large space, highly efficient cooling is possible, solder cracks do not occur in the Peltier element, so the degree of freedom of layout is widened, and even if a Peltier element is used, the occurrence of condensation is prevented It is an object of the present invention to provide a cooling device for electronic equipment.

本発明の請求項１に記載の発明は、ペルチェ素子により発熱部品の熱を吸熱する冷却装置において、半導体等の発熱体、またはその発熱体が実装された基板に吸熱側面を密着させたペルチェ素子と、前記ペルチェ素子の放熱側面の略全面に密接させた伝熱面を持つ熱伝達部品と、前記発熱体及び前記ペルチェ素子を前記熱伝達部品に加圧し押さえ付ける押圧部品と、前記熱伝達部品とにより前記発熱体及び前記ペルチェ素子を外気と遮断させる密閉ケースとを備えたことを特徴とする電子機器の冷却装置であり、ペルチェ素子の吸熱側が周囲温度以下に冷却されたとしても結露せず、かつ交換が容易で、さらに発熱体の周辺に大きな空間が無くても高い冷却性能が得られるという作用を有する。   The invention according to claim 1 of the present invention is a cooling device that absorbs heat of a heat-generating component by a Peltier element, and a Peltier element in which a heat-absorbing side surface is in close contact with a heating element such as a semiconductor or a substrate on which the heating element is mounted. A heat transfer component having a heat transfer surface in close contact with substantially the entire heat radiation side surface of the Peltier element, a pressing component that presses and presses the heating element and the Peltier element against the heat transfer component, and the heat transfer component And a sealing case for shutting off the heating element and the Peltier element from outside air, and no condensation occurs even if the heat absorption side of the Peltier element is cooled below the ambient temperature. In addition, it is easy to replace, and has a function of obtaining a high cooling performance even if there is no large space around the heating element.

請求項２に記載の発明は、前記熱伝達部品と前記密閉ケースにより挟まれる弾性体と、前記熱伝達部品と前記密閉ケースにより形成された密閉空間内に満たされた乾燥気体を有することを特徴とする請求項１記載の電子機器の冷却装置であり、密閉性を高め、さらに結露の発生が無くなる。   The invention according to claim 2 has an elastic body sandwiched between the heat transfer component and the sealed case, and a dry gas filled in a sealed space formed by the heat transfer component and the sealed case. The cooling apparatus for electronic equipment according to claim 1, wherein the airtightness is improved and the occurrence of condensation is eliminated.

請求項３に記載の発明は、前記熱伝達部品のペルチェ素子を密接させた伝熱面の反対面側に放熱器を密接させたことを特徴とする請求項１または請求項２記載の冷却装置であり、より高い冷却性能が得られるという作用を有する。   According to a third aspect of the present invention, there is provided the cooling device according to the first or second aspect, wherein a radiator is brought into intimate contact with the opposite side of the heat transfer surface where the Peltier element of the heat transfer component is in intimate contact. And has the effect that higher cooling performance can be obtained.

請求項４に記載の発明は、前記発熱体と前記ペルチェ素子の間に熱拡散部品を配置したことを特徴とする請求項１乃至請求項３のいずれかに記載の冷却装置であり、発熱部品の熱をペルチェ素子の吸熱面全体に伝えることでより高い冷却性能が得られるという作用を有する。   The invention according to claim 4 is the cooling device according to any one of claims 1 to 3, wherein a heat diffusion component is disposed between the heating element and the Peltier element. By transferring this heat to the entire endothermic surface of the Peltier element, there is an effect that higher cooling performance can be obtained.

請求項５に記載の発明は、前記放熱器が液冷方式であることを特徴とする請求項３乃至請求項５のいずれかに記載の電子機器の冷却装置であり、ペルチェ素子の放熱側で発生する熱をより大きな能力で冷却が可能となる作用を有する。   Invention of Claim 5 is a cooling device of the electronic device in any one of Claim 3 thru | or 5 by which the said heat radiator is a liquid cooling system, On the heat dissipation side of a Peltier element The generated heat can be cooled with a greater capacity.

請求項６に記載の発明は、前記発熱体が発光ダイオード、またはレーザーダイオードからなる半導体光源であり、前記密閉ケースに光を取り出す透明な光学部品を有していることを特徴とする請求項１乃至請求項４のいずれかに記載の電子機器の冷却装置であり、高く安定した光出力と光源の信頼性を得ることができるという作用を有する。   According to a sixth aspect of the present invention, the heating element is a semiconductor light source composed of a light emitting diode or a laser diode, and has a transparent optical component for extracting light into the sealed case. It is a cooling device of the electronic device in any one of Claim 4 thru | or 4, It has the effect | action that the highly stable light output and the reliability of a light source can be acquired.

請求項７に記載の発明は、請求項６記載の冷却装置を備えた光源を使用することを特徴とする投射型表示装置であり、安定性と明るさを備えた投射映像を得ることができるという作用を有する。   A seventh aspect of the present invention is a projection display device using the light source including the cooling device according to the sixth aspect, and can obtain a projected image having stability and brightness. It has the action.

以上のように本発明は、ペルチェ素子の吸熱側が周囲温度以下に冷却されても結露等を起こさず、ペルチェ素子内で半田クラックが発生することもなく、周辺の電子回路や、電源回路等の不具合や、金属部品の腐食が発生しないという優れた効果が得られる。また、吸熱対象物、ペルチェ素子、液冷モジュールが万一故障を起こした場合にも容易に交換ができ、交換部品のコスト削減が可能という優れた効果が得られる。さらに、ペルチェ素子の放熱側に取り付ける放熱手段として液冷モジュールを使用することで大きな冷却能力を可能で、かつ、吸熱対象物の背面に大きな空間が無くても省スペースでの冷却が可能でありレイアウトの自由度が広がるという優れた効果も得られる。   As described above, the present invention does not cause condensation even when the heat absorption side of the Peltier element is cooled below the ambient temperature, does not cause solder cracks in the Peltier element, and does not generate peripheral electronic circuits, power supply circuits, etc. An excellent effect is obtained that defects and corrosion of metal parts do not occur. In addition, even if the endothermic object, the Peltier element, and the liquid cooling module are broken, they can be easily replaced, and an excellent effect that the cost of replacement parts can be reduced is obtained. In addition, by using a liquid cooling module as a heat dissipation means attached to the heat dissipation side of the Peltier element, a large cooling capacity is possible, and even if there is no large space on the back of the endothermic object, it is possible to cool in a space-saving manner. An excellent effect of widening the layout is also obtained.

以下、本発明の実施の形態について、図１から図５を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

（実施の形態１）
図１は本発明の実施の形態１における電子機器の冷却装置の構成を示す分解斜視図、図２は冷却装置の断面図で、これら図１、２を用いて冷却装置の構成を説明する。 (Embodiment 1)
FIG. 1 is an exploded perspective view showing a configuration of a cooling device for an electronic device according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view of the cooling device. The configuration of the cooling device will be described with reference to FIGS.

図において、半導体等の発熱体１が実装された銅ベース基板２と、その背面に密着して取り付けられたペルチェ素子３と、ペルチェ素子３の放熱側に密接させた放熱構造を持つ熱伝達部品４と、発熱体１、銅ベース基板２及びペルチェ素子３を熱伝達部品４に加圧し押さえ付ける押圧部品５と、熱伝達部品４とにより押圧部品５、発熱体１、銅ベース基板２及びペルチェ素子３を外気と遮断させる密閉ケース６と、熱伝達部品４と密閉ケース６の間に配置された密閉性を確保する弾性体であるＯリング７と、熱伝達部品４と密閉ケース６とにより形成された密閉空間内に満たされた乾燥気体１４と、熱伝達部品４のペルチェ素子３が配置されていない面に密接された放熱器８とから構成されている。   In the figure, a copper base substrate 2 on which a heating element 1 such as a semiconductor is mounted, a Peltier element 3 attached in close contact with the back surface thereof, and a heat transfer component having a heat dissipation structure in close contact with the heat dissipation side of the Peltier element 3 4, the heating element 1, the copper base substrate 2, and the Peltier element 3 are pressed and pressed against the heat transfer component 4 and the heat transfer component 4, and the pressing component 5, the heating element 1, the copper base substrate 2, and the Peltier A sealed case 6 that shuts off the element 3 from the outside air, an O-ring 7 that is an elastic body that is disposed between the heat transfer component 4 and the seal case 6, and the heat transfer component 4 and the seal case 6. It is comprised from the dry gas 14 with which the formed sealed space was filled, and the heat radiator 8 closely_contact | adhered to the surface where the Peltier device 3 of the heat transfer component 4 is not arrange | positioned.

上記構成において、熱伝達部品４は、外周にフィン４ａやピン形状などの周辺空気との熱交換効率を上げる形状を有し、熱伝達率の良い純銅系や純アルミ系の材料が使用されている。また、押圧部品５は、ネジ（図示せず）等により熱伝達部品４に締め付けられるが、発熱体１、ペルチェ素子３及び熱伝達部品４間には、シリコングリース等の熱伝導部材があることが望ましく、また、ペルチェ素子３に加わる圧力は０．３ｋｇ/ｃｍ2以上で、ペルチェ素子３が破壊しない範囲であることが望ましい。また、ネジ等による締結を行わず、密閉ケース６をＯリング７を挟んで熱伝達部品４に取り付ける際に同時に押圧部品５を加圧するようにしてもよい。また、熱伝導部品と密閉ケースにより形成された密閉空間内に満たす乾燥気体１４としては、水分をほとんど含まない空気や不活性ガスを使用する。空気に水分を含まないようにするには、空気と共に乾燥剤を封入してもよい。 In the above configuration, the heat transfer component 4 has a shape that increases the heat exchange efficiency with the surrounding air, such as fins 4a and pins, on the outer periphery, and a pure copper or pure aluminum material having a good heat transfer coefficient is used. Yes. The pressing component 5 is fastened to the heat transfer component 4 by a screw (not shown) or the like, and there is a heat conducting member such as silicon grease between the heating element 1, the Peltier element 3, and the heat transfer component 4. Further, the pressure applied to the Peltier element 3 is preferably 0.3 kg / cm 2 or more, and it is desirable that the Peltier element 3 does not break. Alternatively, the pressing component 5 may be pressurized simultaneously when the sealed case 6 is attached to the heat transfer component 4 with the O-ring 7 interposed therebetween without fastening with screws or the like. Moreover, as the dry gas 14 filled in the sealed space formed by the heat conducting component and the sealed case, air or inert gas containing almost no moisture is used. In order to prevent moisture from being contained in the air, a desiccant may be enclosed together with the air.

以上のように構成された冷却装置について、その動作を説明する。   The operation of the cooling device configured as described above will be described.

発熱体１は消費される電力により温度上昇し、信頼性の面からこの温度を一定以下にする必要がある。ペルチェ素子３はその特性上、電流を流すことでその両面に温度差を生じ、吸熱側から放熱側に熱を移動させることができる。吸熱側に発熱体１の実装された銅ベース基板２を密着、放熱側に放熱構造を持つ熱伝達部品４を密着、熱伝達部品４の裏面に放熱器８を密着させて放熱することで、発熱体１の温度を制御することが可能になり、条件によってはペルチェ素子３の吸熱側の温度が周囲温度以下になる。しかし、熱伝達部品４、密閉ケース６と、それらの間に設置されたＯリング７により形成された密閉空間には水分含有量の極めて少ない乾燥気体１４が充填、封入されているため、ペルチェ素子３の吸熱側での結露発生を防止できる。また、放熱器８は、熱伝達部品４、密閉ケース６と、それらの間に設置されたＯリング７により形成された空間の密閉状態を保持したまま切り離しが可能で、発熱体１の発熱量が少ない場合には取り外せばよい。そして、発熱体１又はペルチェ素子３を交換する必要が生じたときにも、熱伝達部品４と密閉ケース６でモジュール化された部分のみを交換可能で、前もって、乾燥気体１４を封入したモジュールを供給することで、市場においても安定した交換作業が可能になる。また、密閉空間内部に乾燥剤を設置することで、モジュール化された物単位での交換ではなく、発熱体１またはペルチェ素子３のみでの交換も可能となる。   The temperature of the heating element 1 rises due to the electric power consumed, and it is necessary to keep this temperature below a certain level in terms of reliability. Due to its characteristics, the Peltier element 3 can cause a temperature difference between the two surfaces by passing an electric current, and can move heat from the heat absorption side to the heat radiation side. By closely adhering the copper base substrate 2 on which the heating element 1 is mounted on the heat absorption side, adhering the heat transfer component 4 having a heat dissipation structure on the heat dissipation side, and adhering the radiator 8 to the back surface of the heat transfer component 4, The temperature of the heating element 1 can be controlled, and depending on the conditions, the temperature on the heat absorption side of the Peltier element 3 becomes lower than the ambient temperature. However, since the sealed space formed by the heat transfer component 4, the sealed case 6, and the O-ring 7 installed therebetween is filled and sealed with a dry gas 14 having a very low water content, the Peltier element 3 can prevent condensation on the heat absorption side. The radiator 8 can be separated while maintaining the sealed state of the space formed by the heat transfer component 4, the sealed case 6, and the O-ring 7 installed between them, and the amount of heat generated by the heating element 1. If there is not enough, remove it. And when it becomes necessary to replace the heating element 1 or the Peltier element 3, only the part that is modularized by the heat transfer component 4 and the sealed case 6 can be replaced. Supplying it enables stable replacement work even in the market. In addition, by installing a desiccant inside the sealed space, it is possible to replace only the heating element 1 or the Peltier element 3 instead of replacing in modular units.

また、放熱構造を持つ熱伝達部品４または放熱器８をファン（図示せず）によって強制空冷することで、冷却能力を高めることが可能となる。   Moreover, it becomes possible to raise a cooling capability by carrying out forced air cooling of the heat-transfer component 4 or the heat radiator 8 with a heat dissipation structure with a fan (not shown).

（実施の形態２）
図３は本発明の実施の形態２における電子機器の冷却装置の構成を示す断面図である。実施の形態１における図１、２と同様の構成は同一の番号を付与し説明を省略する。 (Embodiment 2)
FIG. 3 is a cross-sectional view showing the configuration of the electronic apparatus cooling apparatus according to Embodiment 2 of the present invention. The same configurations as those in FIGS. 1 and 2 in the first embodiment are given the same numbers, and description thereof is omitted.

図において、半導体等の発熱体１が実装された銅ベース基板２と、その背面に密着して取り付けられ、ペルチェ素子３の吸熱面以上の面積を有し、熱伝達率の良い純銅系や純アルミ系の材料でできた熱拡散部品９と、その背面に密着して取り付けられたペルチェ素子３と、ペルチェ素子３の放熱側に密接させた放熱構造を持つ熱伝達部品４と、発熱体１、銅ベース基板２及びペルチェ素子３を熱伝達部品４に加圧し押さえ付ける断熱部品５と、熱伝達部品４とにより押圧部品５、発熱体１、銅ベース基板２及びペルチェ素子３を外気と遮断させる密閉ケース６と、熱伝達部品４と密閉ケース６の間に配置された密閉性を確保するＯリング７と、熱伝達部品４と密閉ケース６とにより形成された密閉空間内に満たされた乾燥気体１４と、熱伝達部品４のペルチェ素子３が配置されていない面に密接された放熱器８とから構成されている。実施の形態１と異なるところは、熱拡散部品９を追加した点である。   In the figure, a copper base substrate 2 on which a heating element 1 such as a semiconductor is mounted, and attached to the back surface of the copper base substrate 2, has an area larger than the heat absorption surface of the Peltier element 3, and has a high heat transfer coefficient such as pure copper or pure copper. A heat diffusion component 9 made of an aluminum-based material, a Peltier element 3 attached in close contact with the back surface thereof, a heat transfer component 4 having a heat dissipation structure in close contact with the heat dissipation side of the Peltier element 3, and a heating element 1 The heat insulating component 5 that presses and holds the copper base substrate 2 and the Peltier element 3 against the heat transfer component 4 and the heat transfer component 4 block the pressing component 5, the heating element 1, the copper base substrate 2, and the Peltier element 3 from the outside air. The sealed space formed by the sealed case 6, the O-ring 7 arranged between the heat transfer component 4 and the sealed case 6 to ensure the sealing property, and the heat transfer component 4 and the sealed case 6 is filled. Dry gas 14 and heat transfer Goods 4 of the Peltier element 3 and a close have been radiator 8 Metropolitan the surface not disposed. The difference from the first embodiment is that a heat diffusion component 9 is added.

以上のように構成された冷却装置について、実施の形態１と異なる部分の動作を説明する。発熱体１の実装された銅ベース基板２がペルチェ素子３の吸熱面よりも面積が小さい場合、発熱体１で発生する熱をペルチェ素子３の吸熱面全体に伝えることができないため、冷却能力を十分に引き出すことが出来ない。ペルチェ素子３の吸熱面以上の面積を有し、熱伝達率の良い純銅系や純アルミ系の材料でできた熱拡散部品９により発熱体１で発生する熱をペルチェ素子３の吸熱面全体に伝えることが可能となり、効率よく冷却することができる。また、銅ベース基板２がペルチェ素子３と同等の面積を持っている場合においても、その厚さが薄いとペルチェ素子３の面横方向への熱の広がりが悪い為、ペルチェ素子３の冷却能力を十分に引き出すことが出来なくなってしまう。発熱体１とペルチェ素子３のサイズの関係、また、素材により左右されるが、発熱体１の温度が上がらない範囲での厚さを持つ熱拡散部品９により、発熱体１で発生する熱をペルチェ素子３の吸熱面全体に伝えることが可能となり、効率よく冷却することができる。   About the cooling device comprised as mentioned above, operation | movement of a different part from Embodiment 1 is demonstrated. If the copper base substrate 2 on which the heating element 1 is mounted has a smaller area than the endothermic surface of the Peltier element 3, the heat generated by the heating element 1 cannot be transferred to the entire endothermic surface of the Peltier element 3, so It cannot be pulled out sufficiently. Heat generated in the heating element 1 by the heat diffusion component 9 made of a pure copper or pure aluminum material having an area larger than the heat absorption surface of the Peltier element 3 and having a good heat transfer coefficient is applied to the entire heat absorption surface of the Peltier element 3. It is possible to communicate and cool efficiently. Even when the copper base substrate 2 has an area equivalent to that of the Peltier element 3, if the thickness is small, the heat spread in the lateral direction of the Peltier element 3 is poor. Cannot be fully extracted. Although it depends on the relationship between the size of the heating element 1 and the Peltier element 3 and the material, the heat diffusion component 9 has a thickness within a range where the temperature of the heating element 1 does not rise. It becomes possible to transmit to the whole heat absorption surface of the Peltier element 3, and it can cool efficiently.

（実施の形態３）
図４は本発明の実施の形態３における電子機器の冷却装置で、発熱体として半導体光源が使用される投射型表示装置のような電子機器の冷却装置の構成を示す断面図である。実施の形態２における図３と同様の構成は同一の番号を付与し説明を省略する。 (Embodiment 3)
FIG. 4 is a cross-sectional view showing a configuration of a cooling device for an electronic device such as a projection display device in which a semiconductor light source is used as a heating element, in the cooling device for an electronic device according to Embodiment 3 of the present invention. Configurations similar to those in FIG. 3 in the second embodiment are given the same numbers, and descriptions thereof are omitted.

図において、発光ダイオード、またはレーザーダイオードからなる半導体光源１０が実装された銅ベース基板２と、その背面に密着して取り付けられ、ペルチェ素子３の吸熱面以上の面積を有し、熱伝達率の良い純銅系や純アルミ系の材料でできた熱拡散部品９と、その背面に密着して取り付けられたペルチェ素子３と、ペルチェ素子３の放熱側に密接させた放熱構造を持つ熱伝達部品４と、半導体光源１０、銅ベース基板２及びペルチェ素子３を熱伝達部品４に加圧し押さえ付ける押圧部品５と、熱伝達部品４とにより押圧部品５、半導体光源１０、銅ベース基板２及びペルチェ素子３を外気と遮断させる密閉ケース１１と、密閉ケース１１に設けられた光を取り出すガラスやプラスチックなどの透光性を有する一つもしくは複数の光学部品１２と、熱伝達部品４と密閉ケース１１の間に配置された密閉性を確保するＯリング７と、熱伝達部品４と密閉ケース１１とにより形成された密閉空間内に満たされた乾燥気体１４と、熱伝達部品４のペルチェ素子３が配置されていない面に密接された放熱器８とから構成されている。実施の形態２と異なるところは、発熱体を半導体光源１０とし、密閉ケース１１に光学部品１２を設けた点である。   In the figure, a copper base substrate 2 on which a semiconductor light source 10 made of a light emitting diode or a laser diode is mounted, and is attached in close contact with the back surface, has an area larger than the heat absorption surface of the Peltier element 3, and has a heat transfer coefficient. A heat diffusion component 9 made of a good pure copper or pure aluminum material, a Peltier element 3 attached in close contact with the back surface thereof, and a heat transfer component 4 having a heat dissipation structure in close contact with the heat dissipation side of the Peltier element 3 And a pressing component 5 that presses and holds the semiconductor light source 10, the copper base substrate 2, and the Peltier element 3 against the heat transfer component 4, and the heat transfer component 4, the pressing component 5, the semiconductor light source 10, the copper base substrate 2, and the Peltier element A sealed case 11 that shuts off 3 from the outside air, and one or more optical parts having translucency such as glass or plastic for extracting light provided in the sealed case 11 12, a dry gas 14 filled in a sealed space formed by the heat transfer component 4 and the sealed case 11, an O-ring 7 that is disposed between the heat transfer component 4 and the sealed case 11, and that secures hermeticity. And a heat radiator 8 in close contact with the surface on which the Peltier element 3 of the heat transfer component 4 is not disposed. The difference from the second embodiment is that the heating element is a semiconductor light source 10 and an optical component 12 is provided in a sealed case 11.

以上のように構成された冷却装置について、実施の形態２と異なる部分の動作を説明する。発光ダイオードまたはレーザーダイオードからなる半導体光源１０からの光が密閉ケース１１に設けられた透光性を有する光学部品１２から放出され、投射型表示装置の光源として利用される。このような半導体光源は、温度依存性が高く、部品の性能、信頼性及び寿命を確保するためには、半導体の温度をある温度範囲内に保つ必要がある。この本発明の構成により、高く安定した光出力と光源の信頼性を得ることが可能となる。   About the cooling device comprised as mentioned above, operation | movement of a different part from Embodiment 2 is demonstrated. Light from a semiconductor light source 10 made of a light emitting diode or a laser diode is emitted from a translucent optical component 12 provided in a sealed case 11 and used as a light source for a projection display device. Such a semiconductor light source is highly temperature dependent, and it is necessary to keep the temperature of the semiconductor within a certain temperature range in order to ensure the performance, reliability and life of the components. With the configuration of the present invention, it is possible to obtain a highly stable light output and the reliability of the light source.

（実施の形態４）
図５は本発明の実施の形態４における電子機器の冷却装置で、液冷方式を使った構成を示す断面図である。実施の形態３における図４と同様の構成は同一の番号を付与し説明を省略する。 (Embodiment 4)
FIG. 5 is a cross-sectional view showing a configuration using a liquid cooling system in the electronic apparatus cooling apparatus according to Embodiment 4 of the present invention. Components similar to those in FIG. 4 in the third embodiment are given the same numbers, and description thereof is omitted.

図において、発光ダイオード、またはレーザーダイオードからなる半導体光源１０が実装された銅ベース基板２と、その背面に密着して取り付けられ、ペルチェ素子３の吸熱面以上の面積を有し、熱伝達率の良い純銅系や純アルミ系の材料でできた熱拡散部品９と、その背面に密着して取り付けられたペルチェ素子３と、ペルチェ素子３の放熱側に密接させた放熱構造を持つ熱伝達部品４と、半導体光源１０、銅ベース基板２及びペルチェ素子３を熱伝達部品４に加圧し押さえ付ける押圧部品５と、熱伝達部品４とにより押圧部品５、半導体光源１０、銅ベース基板２及びペルチェ素子３を外気と遮断させる密閉ケース１１と、密閉ケース１１に設けられた光を取り出す透明な光学部品１２と、熱伝達部品４と密閉ケース１１の間に配置された密閉性を確保するＯリング７と、熱伝達部品４と密閉ケース１１とにより形成された密閉空間内に満たされた乾燥気体１４と、熱伝達部品４のペルチェ素子３が配置されていない面に密接された液冷受熱部品１３とから構成されている。実施の形態３と異なるところは、放熱器８に替え、液冷受熱部品１３を設けた点である。   In the figure, a copper base substrate 2 on which a semiconductor light source 10 made of a light emitting diode or a laser diode is mounted, and is attached in close contact with the back surface, has an area larger than the heat absorption surface of the Peltier element 3, and has a heat transfer coefficient. A heat diffusion component 9 made of a good pure copper or pure aluminum material, a Peltier element 3 attached in close contact with the back surface thereof, and a heat transfer component 4 having a heat dissipation structure in close contact with the heat dissipation side of the Peltier element 3 And a pressing component 5 that presses and holds the semiconductor light source 10, the copper base substrate 2, and the Peltier element 3 against the heat transfer component 4, and the heat transfer component 4, the pressing component 5, the semiconductor light source 10, the copper base substrate 2, and the Peltier element 3 is arranged between the heat transfer component 4 and the airtight case 11. On the surface of the heat transfer component 4 where the Peltier element 3 is not disposed, the O-ring 7 that ensures hermeticity, the dry gas 14 filled in the sealed space formed by the heat transfer component 4 and the sealed case 11. The liquid-cooling heat receiving component 13 is in close contact. The difference from the third embodiment is that a liquid-cooled heat receiving component 13 is provided instead of the radiator 8.

以上のように構成された冷却装置について、実施の形態３と異なる部分の動作を説明する。液冷方式の放熱器１３はポンプ（図示せず）や熱交換器内部（図示せず）と結ばれており、その内部を循環する液体により熱を発熱部から離れたところまで運ぶことが可能であり、発熱部（半導体光源１０）の背面側に大きな空間を必要とせず、また、温まっていない外気を使って熱交換器にて放熱できるため、高い冷却性能を得ることができ、高く安定した出力と信頼性を得ることが可能となる。   About the cooling device comprised as mentioned above, operation | movement of a different part from Embodiment 3 is demonstrated. The liquid-cooled radiator 13 is connected to a pump (not shown) and the inside of the heat exchanger (not shown), and heat can be transported to a place away from the heat generating part by the liquid circulating inside. It does not require a large space on the back side of the heat generating part (semiconductor light source 10), and heat can be dissipated in the heat exchanger using unheated outside air, so high cooling performance can be obtained and high stability Output and reliability can be obtained.

また、放熱構造を持つ熱伝達部品４をファン（図示せず）によって強制空冷することで、さらに冷却能力を高めることが可能となる。   Further, the cooling capability can be further increased by forcibly air-cooling the heat transfer component 4 having a heat dissipation structure with a fan (not shown).

本発明にかかる冷却装置は、周囲温度以下に冷却を行っても結露せず、放熱手段の着脱性とユニットの密閉性を両立できるという優れた効果を有し、半導体素子を周囲温度以下まで冷却が必要で、かつ交換の可能性のある半導体光源を使用するような投射型表示装置等に有用である。   The cooling device according to the present invention does not form condensation even when cooled below the ambient temperature, and has the excellent effect that both the detachability of the heat radiating means and the sealing property of the unit can be achieved, and the semiconductor element is cooled to the ambient temperature or less. This is useful for projection display devices that use a semiconductor light source that is necessary and can be replaced.

本発明の実施の形態１における電子機器の冷却装置の構成を示す分解斜視図The disassembled perspective view which shows the structure of the cooling device of the electronic device in Embodiment 1 of this invention. 本発明の実施の形態１における電子機器の冷却装置の構成を示す断面図Sectional drawing which shows the structure of the cooling device of the electronic device in Embodiment 1 of this invention 本発明の実施の形態２における電子機器の冷却装置の構成を示す断面図Sectional drawing which shows the structure of the cooling device of the electronic device in Embodiment 2 of this invention 本発明の実施の形態３における電子機器の冷却装置の構成を示す断面図Sectional drawing which shows the structure of the cooling device of the electronic device in Embodiment 3 of this invention 本発明の実施の形態４における電子機器の冷却装置の構成を示す断面図Sectional drawing which shows the structure of the cooling device of the electronic device in Embodiment 4 of this invention 従来のペルチェ素子と液冷方式による冷却装置の例を説明する概略図Schematic explaining an example of a conventional Peltier element and a cooling device using a liquid cooling method 従来のペルチェ素子と液冷方式による冷却装置の構成を示す断面図Sectional drawing which shows the structure of the cooling device by the conventional Peltier device and a liquid cooling system

符号の説明Explanation of symbols

１ 発熱体
２ 銅ベース基板
３ ペルチェ素子
４ 熱伝達部品
５ 押圧部品
６、１１ 密閉ケース
７ Ｏリング
８ 放熱器
９ 熱拡散部品
１０ 半導体光源
１２ 光学部品
１３ 液冷受熱部品
１４ 乾燥気体 DESCRIPTION OF SYMBOLS 1 Heating body 2 Copper base board 3 Peltier element 4 Heat transfer component 5 Press component 6, 11 Sealed case 7 O-ring 8 Radiator 9 Heat diffusion component 10 Semiconductor light source 12 Optical component 13 Liquid-cooled heat receiving component 14 Dry gas

Claims (7)

ペルチェ素子により発熱部品の熱を吸熱する冷却装置において、半導体等の発熱体、またはその発熱体が実装された基板に吸熱側面を密着させたペルチェ素子と、前記ペルチェ素子の放熱側面の略全面に密接させた伝熱面を持つ熱伝達部品と、前記発熱体及び前記ペルチェ素子を前記熱伝達部品に加圧し押さえ付ける押圧部品と、前記熱伝達部品とにより前記発熱体及び前記ペルチェ素子を外気と遮断させる密閉ケースとを備えたことを特徴とする電子機器の冷却装置。 In a cooling device that absorbs the heat of a heat-generating component by a Peltier element, a Peltier element having a heat-absorbing side closely attached to a heating element such as a semiconductor, or a substrate on which the heating element is mounted, and substantially the entire heat-dissipating side surface of the Peltier element A heat transfer component having a closely connected heat transfer surface, a pressing component that presses and presses the heating element and the Peltier element against the heat transfer component, and the heat transfer component causes the heating element and the Peltier element to be exposed to the outside air. An electronic device cooling apparatus comprising a sealed case for blocking. 前記熱伝達部品と前記密閉ケースにより挟まれる弾性体と、前記熱伝達部品と前記密閉ケースにより形成された密閉空間内に満たされた乾燥気体を有することを特徴とする請求項１記載の電子機器の冷却装置。 2. The electronic apparatus according to claim 1, further comprising: an elastic body sandwiched between the heat transfer component and the sealed case; and a dry gas filled in a sealed space formed by the heat transfer component and the sealed case. Cooling system. 前記熱伝達部品のペルチェ素子を密接させた伝熱面の反対面側に放熱器を密接させたことを特徴とする請求項１または請求項２記載の冷却装置。 The cooling device according to claim 1 or 2, wherein a radiator is in close contact with a surface opposite to a heat transfer surface where the Peltier element of the heat transfer component is in close contact. 前記発熱体と前記ペルチェ素子の間に熱拡散部品を配置したことを特徴とする請求項１乃至請求項３のいずれかに記載の冷却装置。 The cooling device according to any one of claims 1 to 3, wherein a heat diffusion component is disposed between the heating element and the Peltier element. 前記放熱器が液冷方式であることを特徴とする請求項３乃至請求項５のいずれかに記載の電子機器の冷却装置。 6. The electronic apparatus cooling apparatus according to claim 3, wherein the radiator is a liquid cooling system. 前記発熱体が発光ダイオード、またはレーザーダイオードからなる半導体光源であり、前記密閉ケースに光を取り出す透明な光学部品を有していることを特徴とする請求項１乃至請求項４のいずれかに記載の電子機器の冷却装置。 The said heat generating body is a semiconductor light source which consists of a light emitting diode or a laser diode, and has a transparent optical component which takes out light in the said sealing case, The any one of Claim 1 thru | or 4 characterized by the above-mentioned. Electronic equipment cooling device. 請求項６記載の冷却装置を備えた光源を使用することを特徴とする投射型表示装置。 A projection-type display device using a light source comprising the cooling device according to claim 6.
JP2006082273A 2006-03-24 2006-03-24 Cooling device of electronics device Pending JP2007258520A (en)

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WO2011108571A1 (en) * 2010-03-05 2011-09-09 日本電気株式会社 Cooling system for light emitting device, and light emitting device using same
JP2011187962A (en) * 2010-03-09 2011-09-22 Lg Innotek Co Ltd Light-emitting device
CN102237632A (en) * 2010-04-26 2011-11-09 无锡亮源激光技术有限公司 Outdoor semiconductor laser module
WO2013077067A1 (en) * 2011-11-22 2013-05-30 日本電気株式会社 Light source apparatus, image display apparatus, and method for controlling light source apparatus
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Publication number Priority date Publication date Assignee Title
WO2011108571A1 (en) * 2010-03-05 2011-09-09 日本電気株式会社 Cooling system for light emitting device, and light emitting device using same
JPWO2011108571A1 (en) * 2010-03-05 2013-06-27 日本電気株式会社 Light-emitting device cooling system and light-emitting device using the same
US8845134B2 (en) 2010-03-05 2014-09-30 Nec Corporation Cooling system for light emitting device and light emitting device using the same
JP2011187962A (en) * 2010-03-09 2011-09-22 Lg Innotek Co Ltd Light-emitting device
US8546835B2 (en) 2010-03-09 2013-10-01 Lg Innotek Co., Ltd. Light emitting device
CN102237632A (en) * 2010-04-26 2011-11-09 无锡亮源激光技术有限公司 Outdoor semiconductor laser module
WO2013077067A1 (en) * 2011-11-22 2013-05-30 日本電気株式会社 Light source apparatus, image display apparatus, and method for controlling light source apparatus
US9433064B2 (en) 2011-11-22 2016-08-30 Nec Display Solutions, Ltd. Light source apparatus, image display apparatus, and control method for light source apparatus
US9677752B2 (en) 2012-12-19 2017-06-13 Esjonsson Ehf Light emitting diode (LED) lighting system
WO2023238457A1 (en) * 2022-06-07 2023-12-14 株式会社日立ハイテク Analysis device

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