JP2007253213A - Working method for workpiece and device therefor - Google Patents

Working method for workpiece and device therefor Download PDF

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JP2007253213A
JP2007253213A JP2006083045A JP2006083045A JP2007253213A JP 2007253213 A JP2007253213 A JP 2007253213A JP 2006083045 A JP2006083045 A JP 2006083045A JP 2006083045 A JP2006083045 A JP 2006083045A JP 2007253213 A JP2007253213 A JP 2007253213A
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workpiece
liquid
laser beam
machining head
cutting line
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JP5017900B2 (en
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Motoi Sasaki
基 佐々木
Ryoji Koseki
良治 小関
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Shibuya Corp
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Shibuya Kogyo Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a working method and a device for a workpiece where, even in the case the workpiece is thick, the workpiece can be efficiently and securely cleaved, and further, even in the case the workpiece is a semiconductor wafer, there is no risk of breaking an electronic circuit formed on the surface of the semiconductor wafer, and the generation of debris can be suppressed as well. <P>SOLUTION: The hybrid working device 1 is provided with a supporting means 4 supporting a workpiece 3 and moved to an XY direction in the horizontal plane; and a working head 2 injecting a liquid column W of high pressure water toward the workpiece 3 on the supporting means 4, and further transmitting laser light L into the liquid column W, so as to be emitted. At first, the liquid column W is injected to the cleavage scheduled line of the workpiece 3 from the working head 2, further, the laser light L transmitted into the liquid column W is emitted to the workpiece, and a continuous groove is formed in such a manner that the cleavage scheduled line may be traced. Thereafter, the liquid column W is injected from the working head 2 to the groove, thus the workpiece 3 is cleaved as the cleavage scheduled line. In this way, cleavage can be efficiently and securely performed even in the case the workpiece 3 is thick. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は被加工物の加工方法とその装置に関し、より詳しくは、例えばガラスやシリコンウエハ等の脆性材料を割断する場合に好適な被加工物の加工方法とその装置に関する。   The present invention relates to a workpiece processing method and apparatus, and more particularly to a workpiece processing method and apparatus suitable for cleaving brittle materials such as glass and silicon wafers.

従来、被加工物に液柱状の高圧水を噴射すると同時に液柱内を案内されたレーザ光を照射することにより、被加工物を所要の形状に切断する加工装置が提案されている（例えば特許文献１、特許文献２）。
また、被加工物としてのガラス体に吸収率の高い紫外線領域のレーザ光を集光して加工目的の形状に沿って走査させることによりスクライビングを施した後に、上記スクライビングを施した部位に沿って吸収率の高い赤外線領域のレーザ光を照射して熱歪みを与えて被加工物を割断する加工方法も提案されている（例えば特許文献３）。
特開２００１−３２１９７７号公報 特表平１０−５００９０３号公報 特許第３０３６９０６号公報 2. Description of the Related Art Conventionally, there has been proposed a processing apparatus that cuts a workpiece into a required shape by irradiating the workpiece with a laser beam guided in the liquid column at the same time as jetting liquid column-shaped high-pressure water (for example, a patent) Literature 1, Patent Literature 2).
In addition, after scribing by concentrating laser light in the ultraviolet region having a high absorption rate on a glass body as a workpiece and scanning it along the shape to be processed, along the portion subjected to the scribing There has also been proposed a processing method for cutting a workpiece by irradiating a laser beam in an infrared region having a high absorption rate to give thermal distortion (for example, Patent Document 3).
JP 2001-321977 A Japanese National Patent Publication No. 10-500903 Japanese Patent No. 3036906

ところで、上記特許文献１および特許文献２に開示された加工装置においては、被加工物が肉厚である場合には切断予定線に沿って上述した加工を行っても一度の走査では切断できないという欠点があった。
また、特許文献３の加工方法のようにレーザ光のみによってウエハに溝を形成すると、レーザ光による熱影響のために半導体ウエハの表面に形成されている電子回路の信頼性に影響が及んだり、デブリと呼ばれる溶融物の発生が多くなるという問題があった。 By the way, in the processing apparatuses disclosed in Patent Document 1 and Patent Document 2, when the workpiece is thick, even if the above-described processing is performed along the planned cutting line, it cannot be cut by one scan. There were drawbacks.
Further, when the groove is formed on the wafer only by the laser beam as in the processing method of Patent Document 3, the reliability of the electronic circuit formed on the surface of the semiconductor wafer is affected by the thermal effect of the laser beam. There was a problem that the generation of melt called debris increased.

上述した事情に鑑み、請求項１に記載した本発明は、被加工物の割断予定線に沿って被加工物に液体を噴射するとともに上記液体内にレーザ光を透過させることにより被加工物にレーザ光を照射して、被加工物の表面における上記割断予定線の箇所に溝を形成し、
次に上記溝に沿って被加工物に液体を噴射して、上記溝から被加工物の裏面に到達する亀裂を生じさせて被加工物を割断予定線のとおりに割断するようにした被加工物の加工方法を提供するものである。
また、請求項２に記載した本発明は、被加工物を支持する支持手段と、液体を上記被加工物に噴射するとともに該液体内にレーザ光を透過させて出射する加工ヘッドと、上記支持手段と上記加工ヘッドとを相対移動させる移動手段と、上記加工ヘッドに高圧の液体を供給する液体供給手段と、上記加工ヘッドにレーザ光を導入するレーザ光導入手段とを備えて、
上記被加工物の割断予定線に沿って上記加工ヘッドから被加工物に液体を噴射するとともに上記液体内にレーザ光を透過させることにより被加工物にレーザ光を照射して、被加工物の表面における上記割断予定線の箇所に溝を形成し、上記溝に沿って上記加工ヘッドから被加工物に液体を噴射して、上記溝から被加工物の裏面に到達する亀裂を生じさせて被加工物を割断予定線のとおりに割断するようにした被加工物の加工装置を提供するものである。
また、請求項３に記載した本発明は、被加工物を支持する支持手段と、液体を上記被加工物に噴射するとともに該液体内にレーザ光を透過させて出射する第１加工ヘッドと、液体を被加工物に噴射する第２加工ヘッドと、支持手段と上記両加工ヘッドとを相対移動させる移動手段と、上記両加工ヘッドに高圧の液体を供給する液体供給手段と、上記第１加工ヘッドにレーザ光を導入するレーザ光導入手段とを備えて、
上記被加工物の割断予定線に沿って上記第１加工ヘッドから被加工物に液体を噴射するとともに上記液体内にレーザ光を透過させることにより被加工物にレーザ光を照射して、被加工物の表面における上記割断予定線の箇所に溝を形成し、上記溝に沿って上記第２加工ヘッドから被加工物に液体を噴射して、上記溝から被加工物の裏面に到達する亀裂を生じさせて被加工物を割断予定線のとおりに割断するようにした被加工物の加工装置を提供するものである。
さらに、請求項４に記載した本発明は、被加工物を支持する支持手段と、液体を上記被加工物に噴射するとともに該液体内にレーザ光を透過させて出射する第１加工ヘッドと、上記支持手段と上記第１加工ヘッドとを相対移動させる移動手段と、上記第１加工ヘッドに高圧の液体を供給する液体供給手段と、上記第１加工ヘッドにレーザ光を導入するレーザ光導入手段とを備える第１ステーションと、
被加工物を支持する支持手段と、液体を上記被加工物に噴射するとともに該液体内にレーザ光を透過させて出射する第２加工ヘッドと、上記支持手段と上記第２加工ヘッドとを相対移動させる移動手段と、上記第２加工ヘッドに高圧の液体を供給する液体供給手段とを備える第２ステーションとからなり、
上記第１ステーションにおいて上記被加工物の割断予定線に沿って上記第１加工ヘッドから被加工物に液体を噴射するとともに上記液体内にレーザ光を透過させることにより被加工物にレーザ光を照射して、被加工物の表面における上記割断予定線の箇所に溝を形成し、
上記第２ステーションにおいて上記溝に沿って上記第２加工ヘッドから被加工物に液体を噴射して、上記溝から被加工物の裏面に到達する亀裂を生じさせて被加工物を割断予定線のとおりに割断するようにした被加工物の加工装置を提供するものである。 In view of the above-described circumstances, the present invention described in claim 1 is directed to a workpiece by injecting a liquid onto the workpiece along a planned cutting line of the workpiece and transmitting laser light into the liquid. Irradiate with laser light to form a groove at the location of the cutting line on the surface of the workpiece,
Next, a liquid is sprayed onto the work piece along the groove to cause a crack to reach the back surface of the work piece from the groove so that the work piece is cleaved along the planned cutting line. A method for processing an object is provided.
According to a second aspect of the present invention, there is provided a supporting means for supporting a workpiece, a machining head for injecting a liquid onto the workpiece and transmitting a laser beam into the liquid and emitting the liquid, and the supporting Moving means for relatively moving the means and the processing head, liquid supply means for supplying a high-pressure liquid to the processing head, and laser light introduction means for introducing laser light into the processing head,
A liquid is ejected from the machining head to the workpiece along the planned cutting line of the workpiece and laser light is transmitted through the liquid to irradiate the workpiece with laser light. Grooves are formed on the surface of the planned cutting line on the surface, and liquid is sprayed from the machining head onto the workpiece along the grooves to generate cracks that reach the back surface of the workpiece from the grooves. An object of the present invention is to provide a processing apparatus for a workpiece that is to be cut along a planned cutting line.
According to a third aspect of the present invention, there is provided a supporting means for supporting a workpiece, a first machining head that ejects a liquid onto the workpiece and transmits a laser beam into the liquid and emits the liquid. A second machining head for injecting liquid onto the workpiece; a moving means for relatively moving the support means and the two machining heads; a liquid supply means for supplying high-pressure liquid to the two machining heads; and the first machining. Laser light introducing means for introducing laser light into the head,
The liquid is ejected from the first machining head to the workpiece along the planned cutting line of the workpiece, and the workpiece is irradiated with the laser beam by transmitting the laser beam into the liquid. A groove is formed at a position of the planned cutting line on the surface of the object, and a liquid is sprayed from the second processing head to the workpiece along the groove to reach a back surface of the workpiece from the groove. The present invention provides a processing apparatus for a workpiece that is generated and cleaves the workpiece according to a planned cutting line.
Further, the present invention described in claim 4 is a support means for supporting a workpiece, a first machining head that ejects a liquid onto the workpiece and transmits a laser beam into the liquid and emits the liquid. Moving means for relatively moving the support means and the first processing head, liquid supply means for supplying high-pressure liquid to the first processing head, and laser light introduction means for introducing laser light into the first processing head A first station comprising:
A supporting means for supporting a workpiece, a second machining head for injecting a liquid onto the workpiece and transmitting a laser beam into the liquid and emitting the liquid, and the supporting means and the second machining head are relative to each other. A second station comprising moving means for moving and liquid supply means for supplying high-pressure liquid to the second processing head;
In the first station, the workpiece is irradiated with the laser beam by injecting the liquid from the first machining head to the workpiece along the planned cutting line of the workpiece and transmitting the laser beam into the liquid. Then, a groove is formed at the position of the planned cutting line on the surface of the workpiece,
In the second station, a liquid is sprayed from the second processing head to the workpiece along the groove to cause a crack to reach the back surface of the workpiece from the groove, thereby cutting the workpiece along the cutting line. An object of the present invention is to provide a processing apparatus for a workpiece that is divided as described above.

上述した構成によれば、被加工物が肉厚のものであっても、効率的かつ確実に被加工物を割断することができる。また、被加工物が半導体ウエハであっても、半導体ウエハの表面に形成されている電子回路を破損させる虞がなく、しかもデブリの発生を抑制することが可能となる。   According to the configuration described above, even if the workpiece is thick, the workpiece can be cleaved efficiently and reliably. Moreover, even if the workpiece is a semiconductor wafer, there is no possibility of damaging an electronic circuit formed on the surface of the semiconductor wafer, and debris generation can be suppressed.

以下図示実施例について本発明を説明すると、図１において１は被加工物３を所要の形状に割断するハイブリッド加工装置である。ハイブリッド加工装置１は加工ヘッド２を備えており、この加工ヘッド２から高圧水を液柱Ｗにして被加工物３へ噴射するとともに上記液柱Ｗ内にレーザ光Ｌを透過させて被加工物３に照射できるようになっている。このように加工ヘッド２から被加工物３へ液柱Ｗを噴射するとともにレーザ光Ｌを照射しながら、加工ヘッド２と被加工物３とを水平方向に相対移動させることで、被加工物３を割断予定線のとおりに割断できるようになっている。
ハイブリッド加工装置１は、被加工物３を水平に支持する支持手段４と、レーザ光ＬをＱスイッチパルス発振するＹＡＧレーザ発振器５と、被加工物３に向けて高圧水を液柱Ｗにして噴射するとともに液柱Ｗ内にレーザ光Ｌを透過させるように出射する上記加工ヘッド２と、導管６を介して上記加工ヘッド２内へ高圧水を供給する液体供給手段７とを備えており、これらは図示しない制御装置によって作動を制御されるようになっている。本実施例の加工ヘッド２は支持手段４の上方側に固定して配置されている。 Hereinafter, the present invention will be described with reference to the illustrated embodiment. In FIG. 1, reference numeral 1 denotes a hybrid machining apparatus that cleaves a workpiece 3 into a required shape. The hybrid machining apparatus 1 includes a machining head 2, and high-pressure water is ejected from the machining head 2 as a liquid column W onto the workpiece 3 and the laser beam L is transmitted through the liquid column W to be processed. 3 can be irradiated. In this way, the liquid column W is ejected from the machining head 2 to the workpiece 3 and the laser beam L is irradiated, while the machining head 2 and the workpiece 3 are relatively moved in the horizontal direction, thereby the workpiece 3. Can be cleaved as planned.
The hybrid machining apparatus 1 includes a supporting means 4 that horizontally supports the workpiece 3, a YAG laser oscillator 5 that oscillates the laser light L with a Q switch pulse, and a high-pressure water as a liquid column W toward the workpiece 3. The processing head 2 that injects and emits the laser light L into the liquid column W, and the liquid supply means 7 that supplies high-pressure water into the processing head 2 through a conduit 6 are provided. These are controlled by a control device (not shown). The machining head 2 of this embodiment is fixedly arranged on the upper side of the support means 4.

また、ハイブリッド加工装置１は、ＹＡＧレーザ発振器５から発振されるレーザ光Ｌの光路上にシャッタ８を備えるとともに、加工ヘッド２の上方に固定して配置した反射ミラー１１と集光レンズ１２とを備えている。シャッタ８は、レーザ光Ｌの光路上となる前進位置と光路からはずれた後退位置とにエアシリンダ１３によって進退動される反射ミラー１４と、レーザ光Ｌを吸収する吸収材１５とから構成されている。このエアシリンダ１３は制御装置によって作動を制御されるようになっている。
エアシリンダ１３が作動されずにシャッタ８の反射ミラー１４が後退位置にあってレーザ光Ｌの光路上にない状態でＹＡＧレーザ発振器５からレーザ光Ｌが発振されると、該レーザ光Ｌは反射ミラー１１によって反射されてから集光レンズ１２によって集束されて加工ヘッド２に入射されるようになっている。
他方、ＹＡＧレーザ発振器５からレーザ光Ｌが発振されている状態において、制御装置によってエアシリンダ１３が作動されてシャッタ８の反射ミラー１４がレーザ光Ｌの光路上となる前進位置に移動されると、上記反射ミラー１４によってレーザ光Ｌが反射されて吸収材１５によって吸収される。つまり、加工ヘッド２へのレーザ光Ｌの導入が阻止されるようになっている。
上記ＹＡＧレーザ発振器５は、加工に応じてＣＷ発振又はパルス発振が可能であり、またその出力やパルスの発振周期等の加工条件を適宜調整できるようになっている。 Further, the hybrid machining apparatus 1 includes a shutter 8 on the optical path of the laser beam L oscillated from the YAG laser oscillator 5, and includes a reflection mirror 11 and a condenser lens 12 that are fixedly disposed above the machining head 2. I have. The shutter 8 includes a reflection mirror 14 that is moved forward and backward by an air cylinder 13 to a forward position on the optical path of the laser light L and a backward position that is off the optical path, and an absorber 15 that absorbs the laser light L. Yes. The operation of the air cylinder 13 is controlled by a control device.
If the laser beam L is oscillated from the YAG laser oscillator 5 in a state where the air cylinder 13 is not operated and the reflection mirror 14 of the shutter 8 is in the retracted position and not on the optical path of the laser beam L, the laser beam L is reflected. After being reflected by the mirror 11, it is focused by the condenser lens 12 and is incident on the machining head 2.
On the other hand, when the laser beam L is oscillated from the YAG laser oscillator 5, when the air cylinder 13 is operated by the control device and the reflection mirror 14 of the shutter 8 is moved to a forward position on the optical path of the laser light L. The laser beam L is reflected by the reflection mirror 14 and absorbed by the absorber 15. That is, introduction of the laser beam L to the machining head 2 is prevented.
The YAG laser oscillator 5 can perform CW oscillation or pulse oscillation according to processing, and can adjust processing conditions such as output and pulse oscillation period as appropriate.

本実施例においては、被加工物３として例えば板状で円形の半導体ウエハを加工するものであり、この被加工物３の割断予定線のとおりに被加工物３を割断するようになっている。
図２は図１に示した被加工物３の拡大断面図であり、この図２に示すように、被加工物３としてのウエハは、レーザ光Ｌおよび液体を透過する粘着シート３Ａ上に貼り付けられており、この粘着シート３Ａにおける外周部分はウエハリング３Ｂの下面に張設されている。
ウエハリング３Ｂ、粘着シート３Ａおよび被加工物３としてのウエハが一体となっており、この状態の被加工物３は支持手段４の上面に載置され、支持手段４の周辺部に設けた保持手段１６によって水平に保持されるようになっている。支持手段４の中央部は水平断面がハニカム状となっており、加工時には粘着シートを通過した液体を下方へ通過させるようになっている。そして、加工終了後の被加工物３（製品と残材）は粘着シート３Ａに接着したままで、ウエハリング３Ｂおよび粘着シート３Ａとともに保持手段１６から取り外されるようになっている。そして、その後に新たな加工対象となる被加工物３が支持手段４に供給されて保持手段１６により保持されるようになっている。 In the present embodiment, for example, a plate-shaped and circular semiconductor wafer is processed as the workpiece 3, and the workpiece 3 is cleaved according to the planned cutting line of the workpiece 3. .
FIG. 2 is an enlarged cross-sectional view of the workpiece 3 shown in FIG. 1. As shown in FIG. 2, the wafer as the workpiece 3 is stuck on an adhesive sheet 3A that transmits laser light L and liquid. The outer peripheral portion of the adhesive sheet 3A is stretched on the lower surface of the wafer ring 3B.
The wafer ring 3B, the pressure-sensitive adhesive sheet 3A, and the wafer as the workpiece 3 are integrated, and the workpiece 3 in this state is placed on the upper surface of the support means 4 and is held on the periphery of the support means 4 It is adapted to be held horizontally by means 16. The central portion of the support means 4 has a honeycomb cross section so that the liquid that has passed through the pressure-sensitive adhesive sheet passes downward during processing. Then, the processed workpiece 3 (product and remaining material) after processing is removed from the holding means 16 together with the wafer ring 3B and the adhesive sheet 3A while being adhered to the adhesive sheet 3A. After that, the workpiece 3 to be newly processed is supplied to the support means 4 and is held by the holding means 16.

上記加工ヘッド２は、高圧水の噴射口が鉛直下方を向くように固定して配置されている。そして、集光レンズ１２によって集光されたレーザ光Ｌは、加工ヘッド２の上端部に設けられた透明なウィンドウを介して加工ヘッド２内に導入され、加工ヘッド２内の通路を通過して、上記噴射口を経て高圧水の液柱Ｗ内を透過して被加工物４に照射されるようになっている。
次に、支持手段４はＸ方向移動機構１７上に設けられて水平面におけるＸ方向に移動可能となっている。このＸ方向移動機構１７はＹ方向移動機構１８上に設けられて水平面における上記Ｘ方向と直交するＹ方向に移動可能となっている。これらＸ方向移動機構１７とＹ方向移動機構１８は図示しない制御装置によって作動を制御されるようになっている。そして、制御装置によって上記両移動機構１７、１８が所要量だけＸＹ方向に移動されると、支持手段４上の被加工物３と加工ヘッド２とがＸＹ方向に相対移動されるようになっている。本実施例においては、上記Ｘ方向移動機構１７とＹ方向移動機構１８とによって、加工ヘッド２と支持手段４とを水平面において相対移動させる移動手段２１を構成している。
次に、高圧水を加工ヘッド２へ供給する液体供給手段７は従来公知のものであり、制御装置によって液体供給手段７を作動させることにより導管６を介して加工ヘッド２内の通路に高圧水が供給され、そこから連通する最下方の噴射口を通過することで高圧水は液柱Ｗとなって被加工物３に吹き付けられるようになっている。 The processing head 2 is fixed and arranged so that the high-pressure water injection port faces vertically downward. The laser beam L condensed by the condenser lens 12 is introduced into the machining head 2 through a transparent window provided at the upper end of the machining head 2 and passes through a passage in the machining head 2. The workpiece 4 is irradiated through the liquid column W of the high-pressure water through the injection port.
Next, the support means 4 is provided on the X-direction moving mechanism 17 and is movable in the X direction on the horizontal plane. The X-direction moving mechanism 17 is provided on the Y-direction moving mechanism 18 and can move in the Y direction orthogonal to the X direction on the horizontal plane. The operations of the X-direction moving mechanism 17 and the Y-direction moving mechanism 18 are controlled by a control device (not shown). Then, when both the moving mechanisms 17 and 18 are moved in the XY direction by the required amount by the control device, the workpiece 3 and the processing head 2 on the support means 4 are relatively moved in the XY direction. Yes. In this embodiment, the X-direction moving mechanism 17 and the Y-direction moving mechanism 18 constitute moving means 21 that relatively moves the machining head 2 and the supporting means 4 on a horizontal plane.
Next, the liquid supply means 7 for supplying high-pressure water to the machining head 2 is a conventionally known one. When the liquid supply means 7 is operated by a control device, the high-pressure water is supplied to the passage in the machining head 2 via the conduit 6. Is supplied, and the high-pressure water becomes a liquid column W and is sprayed onto the workpiece 3 by passing through the lowermost injection port communicating therewith.

しかして、本実施例は、上述した構成を前提として、加工ヘッド２と被加工物３を相対移動させながら被加工物３の割断予定線上に液柱Ｗを噴射するとともにレーザ光Ｌを照射して微小な溝を形成し、その後に上記溝に沿って被加工物３に液柱Ｗを噴射することで、割断予定線のとおりに被加工物３を割断するようにしたものである。
すなわち、以上のように構成したハイブリッド加工装置１による被加工物２を割断する工程を説明する。
先ず、ＹＡＧレーザ発振器５からのレーザ光の発振を停止させ、かつ液体供給手段７からの高圧水の供給を停止させた状態において、被加工物３を支持手段４上に載置する。このように支持手段４上に被加工物３が載置されたら保持手段１６によって被加工物３を支持手段４上に固定する。このとき、シャッタ８の反射ミラー１４はレーザ光Ｌの光路上からはずれた後退位置に位置させておく。
この後、制御装置によって移動手段２１の両移動機構１７、１８が作動されて、支持手段４が水平面におけるＸＹ方向に所要量だけ移動されて、加工ヘッド２の下方に被加工物３の加工開始位置が位置決めされる。 Thus, in the present embodiment, on the premise of the above-described configuration, the liquid column W is ejected onto the planned cutting line of the workpiece 3 while the machining head 2 and the workpiece 3 are relatively moved, and the laser beam L is irradiated. Then, a minute groove is formed, and then the liquid column W is sprayed onto the workpiece 3 along the groove, so that the workpiece 3 is cleaved according to the planned cutting line.
That is, a process of cleaving the workpiece 2 by the hybrid machining apparatus 1 configured as described above will be described.
First, the workpiece 3 is placed on the support means 4 in a state where the oscillation of the laser light from the YAG laser oscillator 5 is stopped and the supply of high-pressure water from the liquid supply means 7 is stopped. When the workpiece 3 is placed on the support means 4 in this way, the workpiece 3 is fixed on the support means 4 by the holding means 16. At this time, the reflection mirror 14 of the shutter 8 is positioned at a retracted position deviated from the optical path of the laser light L.
Thereafter, both the moving mechanisms 17 and 18 of the moving means 21 are actuated by the control device, and the support means 4 is moved by a required amount in the XY direction on the horizontal plane, and the machining of the workpiece 3 is started below the machining head 2. The position is positioned.

この後、制御装置は、液体供給手段７を作動させて導管６を介して加工ヘッド２へ高圧水を供給し、加工ヘッド２から液柱Ｗに形成された高圧水を被加工物３の加工開始位置へ噴射させる。その後、制御装置はレーザ発振器５からレーザ光Ｌを発振させ、レーザ発振器５から発振されたレーザ光Ｌが加工ヘッド２から液柱Ｗ内を透過して被加工物３の加工開始位置に照射される。
そして制御装置が上記移動手段２１の両移動機構１７、１８を介して加工ヘッド２と支持手段４とを相対移動させることで、液柱Ｗ内のレーザ光Ｌの照射位置が被加工物３の割断予定線２２上を順次なぞるように相対移動され、それによって被加工物２の表面３Ｃにおける割断予定線２２の全てに断面Ｖ字形の微小な溝２３が連続的に形成される（図３ａ参照）。 Thereafter, the control device operates the liquid supply means 7 to supply high-pressure water to the machining head 2 via the conduit 6, and the high-pressure water formed in the liquid column W from the machining head 2 is processed into the workpiece 3. Inject to start position. Thereafter, the control device oscillates the laser beam L from the laser oscillator 5, and the laser beam L oscillated from the laser oscillator 5 passes through the liquid column W from the machining head 2 and is irradiated to the machining start position of the workpiece 3. The
The control device moves the processing head 2 and the support means 4 relative to each other via the moving mechanisms 17 and 18 of the moving means 21, so that the irradiation position of the laser light L in the liquid column W is set on the workpiece 3. Relative movement is performed so as to sequentially follow the planned cutting line 22, and thereby, a minute groove 23 having a V-shaped cross section is continuously formed on all the planned cutting lines 22 on the surface 3 </ b> C of the workpiece 2 (see FIG. 3 a). ).

このようにして被加工物３の表面３Ｃにおける割断予定線２２の全てにわたって溝２３が形成されたら、この後、制御装置はシャッタ８のエアシリンダ１３を作動させて、反射ミラー１４をレーザ光Ｌの光路上となる前進位置に位置させる。そのため、この時点から加工ヘッド２へのレーザ光Ｌの入射が阻止される。
これにより、レーザ光Ｌは被加工物へは照射されなくなるが、液体供給手段７から加工ヘッド２へ継続して高圧水が供給されるので、加工ヘッド２より高圧水のみが液柱Ｗに形成されて噴射される。
そして、このように加工ヘッド２から液柱Ｗを噴射させた状態において、制御装置は上記両移動機構１７，１８を介して加工ヘッド２を加工開始位置に位置させてから、上記割断予定線２２上をなぞるように支持手段４を移動させる。
これに伴い、加工ヘッド２から噴射している液柱Ｗは、被加工物３の割断予定線２２に形成された溝２３に沿って噴射される（図３ｂ参照）。これにより、割断予定線２２に形成された溝２３の深部とその周辺に図３ｂの矢印方向に内部応力が生じるので、上記溝２３の最深部から裏面３Ｄに到達する亀裂２４が生じて、上記割断予定線２２のとおりに被加工物３が完全に割断されるようになっている（図３ｃ参照）。 When the groove 23 is formed over the entire cutting line 22 on the surface 3C of the workpiece 3 in this way, the control device thereafter operates the air cylinder 13 of the shutter 8 to cause the reflection mirror 14 to move to the laser beam L. It is positioned at the forward position on the optical path. Therefore, the laser beam L is prevented from entering the processing head 2 from this point.
As a result, the laser beam L is not irradiated onto the workpiece, but since high-pressure water is continuously supplied from the liquid supply means 7 to the processing head 2, only high-pressure water is formed on the liquid column W from the processing head 2. Is injected.
In this state where the liquid column W is ejected from the machining head 2, the control device positions the machining head 2 at the machining start position via the both moving mechanisms 17, 18, and then the cutting schedule line 22. The support means 4 is moved so as to trace the top.
Accordingly, the liquid column W sprayed from the processing head 2 is sprayed along the groove 23 formed in the planned cutting line 22 of the workpiece 3 (see FIG. 3b). As a result, internal stress is generated in the direction of the arrow in FIG. 3b in and around the deep portion of the groove 23 formed in the planned cutting line 22, so that a crack 24 that reaches the back surface 3D from the deepest portion of the groove 23 occurs. The workpiece 3 is completely cleaved as indicated by the cleaving line 22 (see FIG. 3c).

以上のように、本実施例においては、第１工程においては被加工物３の割断予定線２２に液柱Ｗを噴射すると同時レーザ光Ｌを照射することで被加工物３の表面３Ｃに溝２３を形成し、第２工程において上記溝２３に沿って液柱Ｗを噴射することで割断予定線２２のとおりに被加工物３を完全に割断するようにしている。
したがって、本実施例によれば、被加工物３が厚肉のものであっても、効率的かつ確実に割断予定線２２のとおりに割断することが可能となる。また、被加工物３が半導体ウエハであっても、半導体ウエハの上面に形成されている電子回路を破損させる虞がなく、しかもデブリの発生を抑制することが可能な割断方法を提供することができる。 As described above, in the present embodiment, in the first step, when the liquid column W is ejected onto the cleaving line 22 of the workpiece 3, a groove is formed on the surface 3 </ b> C of the workpiece 3 by irradiating the simultaneous laser beam L. 23 is formed, and in the second step, the liquid column W is sprayed along the groove 23 so that the workpiece 3 is completely cleaved as indicated by the cleaving line 22.
Therefore, according to the present embodiment, even if the workpiece 3 is thick, it is possible to efficiently and reliably cleave the workpiece 3 according to the planned cutting line 22. Moreover, even if the workpiece 3 is a semiconductor wafer, there is provided a cleaving method that can prevent the occurrence of debris without causing damage to the electronic circuit formed on the upper surface of the semiconductor wafer. it can.

次に、図４は本発明の第２実施例を示したものである。この第２実施例は、上記第１実施例の構成を前提として、上記加工ヘッド２を第１加工ヘッド２とする一方、それとは別に高圧水を液柱Ｗにして被加工物３に噴射する第２加工ヘッド１０２を設けたものである。この第２加工ヘッド１０２に対して導管６から分岐させた分岐管１０３を介して高圧水を供給できるようにしてあり、分岐管１０３の途中には制御装置によって作動を制御される電磁開閉弁１０４を設けている。
その他の構成は上記第１実施例のものと同じであり、第１実施例と対応する部材に同じ符号を付している。
この第２実施例においても、移動手段２１の両移動機構１７，１８によって支持手段４と両加工ヘッド２，１０２を水平面におけるＸＹ方向に相対移動させるようになっている。その際、この第２実施例においては、第１加工ヘッド２に対して第２加工ヘッド１０２は少し離隔させて配置してあるので、先ず第１加工ヘッド２が先行して支持手段４と相対移動し、それに追従するようにして第２加工ヘッド２が支持手段４と相対移動されるようになる。 Next, FIG. 4 shows a second embodiment of the present invention. In the second embodiment, on the premise of the configuration of the first embodiment, the processing head 2 is used as the first processing head 2, and separately from that, high-pressure water is used as the liquid column W and sprayed onto the workpiece 3. A second machining head 102 is provided. High-pressure water can be supplied to the second machining head 102 via a branch pipe 103 branched from the conduit 6, and an electromagnetic on-off valve 104 whose operation is controlled by a control device in the middle of the branch pipe 103. Is provided.
Other configurations are the same as those of the first embodiment, and the same reference numerals are given to members corresponding to the first embodiment.
Also in the second embodiment, the supporting means 4 and the two processing heads 2 and 102 are moved relative to each other in the XY directions on the horizontal plane by the moving mechanisms 17 and 18 of the moving means 21. At this time, in the second embodiment, since the second machining head 102 is disposed slightly apart from the first machining head 2, first, the first machining head 2 precedes the support means 4. The second machining head 2 moves relative to the support means 4 so as to follow the movement.

この第２実施例によって被加工物３を割断する場合には、先ず、第１加工ヘッド２から液柱Ｗを被加工物３の割断予定線に噴射するとともに該液柱Ｗ内を透過させたレーザ光Ｌを照射し、かつ移動手段２１により支持手段４を水平面で相対移動させる。これにより、割断予定線２２に上記図３ａに示したような溝２３が形成され、第１加工ヘッド２に追従する第２加工ヘッド１０２から噴射される液柱Ｗが第１加工ヘッド２により形成された溝２３に噴射され、割断予定線２２のとおりに被加工物３が完全に割断されるようになっている（図３ｂ、図３ｃ参照）。
このような構成の第２実施例によれば上記第１実施例と同様の作用・効果を得ることができるとともに、作業時間を短縮することができる。 When the workpiece 3 is cleaved according to the second embodiment, first, the liquid column W is sprayed from the first machining head 2 onto the planned cutting line of the workpiece 3 and transmitted through the liquid column W. The laser beam L is irradiated, and the support unit 4 is relatively moved on the horizontal plane by the moving unit 21. As a result, the groove 23 as shown in FIG. 3 a is formed in the planned cutting line 22, and the liquid column W ejected from the second processing head 102 following the first processing head 2 is formed by the first processing head 2. Injected into the groove 23, the workpiece 3 is completely cleaved as indicated by the cleaving line 22 (see FIGS. 3b and 3c).
According to the second embodiment having such a configuration, the same operation and effect as the first embodiment can be obtained, and the working time can be shortened.

次に、図５は本発明の第３実施例を示したものである。この第３実施例は、上記第２実施例における支持手段４を搬送コンベヤ１０５によって間欠的に第１ステーションＡから第２ステーションＢへ順次移送することで被加工物３を２工程で割断するようにしている。
すなわち、図示しない左方の搬入位置において搬送コンベヤ１０５上の支持手段４に被加工物３が供給されるようになっており、この搬送コンベヤ１０５の搬送経路上に第１ステーションＡと第２ステーションＢを設けている。
第１ステーションＡには、第１加工ヘッド２を図示しない第１駆動手段によって水平面のＸＹ方向に移動可能に設けてあり、また、第２ステーションＢには、上記第２実施例と同様の第２加工ヘッド１０２を図示しない第２駆動手段によって水平面におけるＸＹ方向に移動可能に設けている。なお、第１加工ヘッド２に対しては、レーザ発振器５から光ファイバ１０６を介してレーザ光Ｌを導入するようにしている。また、レーザ発振器５の内部には、所要時にレーザ光Ｌの発振を阻止するシャッターを設けている。そして、搬送コンベヤ１０５、第１駆動手段、第２駆動手段およびシャッタの作動も図示しない制御装置によって制御されるようになっている。その他の構成は第２実施例と同じであり、第２実施例と対応する部材に同じ符号を付している。
この第３実施例においては、搬送コンベヤ１０５が間欠的に走行されることで、搬送コンベヤ１０５上の被加工物３が先ず第１ステーションＡに停止する。すると、この第１ステーションＡに停止した被加工物３に対して第１加工ヘッド２から液柱Ｗを割断予定線に噴射するとともに該液柱Ｗ内を透過させたレーザ光Ｌを照射し、かつ第１駆動手段により第１加工ヘッド２を割断予定線に沿って水平方向に移動させる。これにより、第１ステーションＡにおいて被加工物３の割断予定線２２に上記図３ａに示したような溝２３が形成される。
この後、搬送コンベヤ１０５が再度走行されてから停止されるので、溝２３が形成された第１の被加工物３は第２ステーションＢに移送されると同時に、第２の被加工物３が第１ステーションＡに移送される。
すると、第２ステーションＢに停止した第１の被加工物３に対して上記第２駆動手段により第２加工ヘッド１０２が水平方向に移動されて、この第２加工ヘッド１０２から液柱Ｗが被加工物３の溝２３に沿って噴射されるので、割断予定線２２のとおりに被加工物３が完全に割断されるようになっている（図３ｂ、図３ｃ参照）。
同時に、前述した要領で、第１ステーションＡにおいて第２の被加工物３に対して第１加工ヘッド２から液柱Ｗが噴射され、かつレーザ光Ｌが照射されて割断予定線２２に溝２３が形成される。
この後、搬送コンベヤ１０５が再度走行されてから停止されるので、割断が終了した第１の被加工物３は第２ステーションＢから次の工程へ搬送されるとともに溝２３が形成された第２の被加工物３が第２ステーションＢに移送される。
このように、第３実施例においては、第１ステーションＡにおいて溝を形成し、隣接する第２ステーションＢにおいて完全に割断するようにしている。このような構成とすることで、第３実施例においては上記第１実施例と同様の作用・効果を得ることができ、また、多数の被加工物を効率よく処理することができる。
この第３実施例では、被加工物を割断する際に加工ヘッド側を被加工物に対して移動するようにしたが、各ステーションの支持手段をＸＹ方向の移動手段上に設けて、被加工物側を移動させるようにしても良く、ステーション間をロボットにより移載するようにしても良い。
なお、上記各実施例において、加工ヘッドを被加工物へ液柱を形成しない程度に接近させるようにしても良い。
また、上記各実施例において、高圧水の圧力を溝を形成するとき割断時とで変更するようにしても良い。
さらに、上記各実施例は、被加工物として半導体ウエハ以外の脆性材料を加工する場合にも適用することができ、その場合には被加工物の材料に応じた波長のレーザ光を用いればよい。 Next, FIG. 5 shows a third embodiment of the present invention. In the third embodiment, the support means 4 in the second embodiment is intermittently transferred from the first station A to the second station B intermittently by the transfer conveyor 105 so as to cleave the workpiece 3 in two steps. I have to.
That is, the workpiece 3 is supplied to the support means 4 on the transport conveyor 105 at a left carry-in position (not shown), and the first station A and the second station are transported on the transport path of the transport conveyor 105. B is provided.
In the first station A, the first processing head 2 is provided so as to be movable in the XY directions on the horizontal plane by a first driving means (not shown), and in the second station B, the same as in the second embodiment. The two machining heads 102 are provided so as to be movable in the XY directions on the horizontal plane by a second driving means (not shown). The laser beam L is introduced from the laser oscillator 5 through the optical fiber 106 to the first processing head 2. In addition, a shutter that prevents oscillation of the laser beam L when necessary is provided inside the laser oscillator 5. The operations of the conveyor 105, the first drive means, the second drive means and the shutter are also controlled by a control device (not shown). Other configurations are the same as those of the second embodiment, and members corresponding to those of the second embodiment are denoted by the same reference numerals.
In the third embodiment, the workpiece 3 on the conveyor 105 is first stopped at the first station A by intermittently running the conveyor 105. Then, the workpiece 3 stopped at the first station A is irradiated with the laser beam L that is injected from the first machining head 2 onto the planned cutting line and is transmitted through the liquid column W, In addition, the first processing head 2 is moved in the horizontal direction along the planned cutting line by the first driving means. As a result, in the first station A, the groove 23 as shown in FIG. 3 a is formed in the planned cutting line 22 of the workpiece 3.
After this, since the conveyor 105 is stopped again after traveling, the first workpiece 3 in which the groove 23 is formed is transferred to the second station B, and at the same time, the second workpiece 3 is moved. Transferred to the first station A.
Then, the second machining head 102 is moved in the horizontal direction by the second driving means with respect to the first workpiece 3 stopped at the second station B, and the liquid column W is moved from the second machining head 102 to the workpiece. Since it is sprayed along the groove | channel 23 of the workpiece 3, the to-be-processed object 3 is completely cleaved according to the cutting projected line 22 (refer FIG. 3b and FIG. 3c).
At the same time, the liquid column W is ejected from the first machining head 2 to the second workpiece 3 at the first station A and irradiated with the laser beam L in the first station A, and the groove 23 is formed in the planned cutting line 22. Is formed.
After this, since the conveyor 105 is stopped after traveling again, the first workpiece 3 that has been cleaved is transported from the second station B to the next process and the second groove 23 is formed. The workpiece 3 is transferred to the second station B.
As described above, in the third embodiment, a groove is formed in the first station A and completely cleaved in the adjacent second station B. By adopting such a configuration, the third embodiment can obtain the same operations and effects as the first embodiment, and can efficiently process a large number of workpieces.
In this third embodiment, when the workpiece is cleaved, the machining head side is moved relative to the workpiece. However, the supporting means of each station is provided on the moving means in the XY directions, and the workpiece is processed. The object side may be moved, or between stations may be transferred by a robot.
In each of the above embodiments, the machining head may be brought close to the workpiece so as not to form a liquid column.
In each of the above embodiments, the pressure of the high-pressure water may be changed depending on when the groove is cut.
Further, each of the above embodiments can also be applied to processing a brittle material other than a semiconductor wafer as a workpiece, in which case laser light having a wavelength corresponding to the material of the workpiece may be used. .

本発明の一実施例を示す正面図。The front view which shows one Example of this invention. 図１の要部を拡大した断面図。Sectional drawing which expanded the principal part of FIG. 図１および図４に示した実施例の作動工程図。FIG. 5 is an operation process diagram of the embodiment shown in FIGS. 1 and 4. 本発明の第２実施例を示す正面図。The front view which shows 2nd Example of this invention. 本発明の第３実施例を示す正面図。The front view which shows 3rd Example of this invention.

符号の説明Explanation of symbols

１…ハイブリッド加工装置 ２…加工ヘッド（第１加工ヘッド）
３…被加工物 ５…ＹＡＧレーザ発振器
７…液体供給手段 ８…シャッタ
２１…移動手段 ２２…割断予定線
２３…溝 １０５…搬送コンベヤ（搬送手段）
１０６…光ファイバ（レーザ光導入手段） Ｌ…レーザ光
Ｗ…液柱 DESCRIPTION OF SYMBOLS 1 ... Hybrid processing apparatus 2 ... Processing head (1st processing head)
DESCRIPTION OF SYMBOLS 3 ... Workpiece 5 ... YAG laser oscillator 7 ... Liquid supply means 8 ... Shutter 21 ... Moving means 22 ... Split line 23 ... Groove 105 ... Conveyor (conveyance means)
106: Optical fiber (laser light introducing means) L: Laser light W: Liquid column

Claims (4)

被加工物の割断予定線に沿って被加工物に液体を噴射するとともに上記液体内にレーザ光を透過させることにより被加工物にレーザ光を照射して、被加工物の表面における上記割断予定線の箇所に溝を形成し、
次に上記溝に沿って被加工物に液体を噴射して、上記溝から被加工物の裏面に到達する亀裂を生じさせて被加工物を割断予定線のとおりに割断することを特徴とする被加工物の加工方法。 Injecting the liquid onto the workpiece along the planned cutting line of the workpiece and irradiating the workpiece with the laser beam by transmitting the laser beam into the liquid, the cutting schedule on the surface of the workpiece Forming a groove at the line,
Next, liquid is sprayed onto the work piece along the groove to cause a crack to reach the back surface of the work piece from the groove, and the work piece is cleaved according to a planned cutting line. Processing method of work piece. 被加工物を支持する支持手段と、液体を上記被加工物に噴射するとともに該液体内にレーザ光を透過させて出射する加工ヘッドと、上記支持手段と上記加工ヘッドとを相対移動させる移動手段と、上記加工ヘッドに高圧の液体を供給する液体供給手段と、上記加工ヘッドにレーザ光を導入するレーザ光導入手段とを備えて、
上記被加工物の割断予定線に沿って上記加工ヘッドから被加工物に液体を噴射するとともに上記液体内にレーザ光を透過させることにより被加工物にレーザ光を照射して、被加工物の表面における上記割断予定線の箇所に溝を形成し、上記溝に沿って上記加工ヘッドから被加工物に液体を噴射して、上記溝から被加工物の裏面に到達する亀裂を生じさせて被加工物を割断予定線のとおりに割断することを特徴とする被加工物の加工装置。 A support means for supporting the workpiece; a machining head for injecting a liquid onto the workpiece and transmitting the laser beam through the liquid; and a moving means for moving the support means and the machining head relative to each other. And liquid supply means for supplying a high-pressure liquid to the processing head, and laser light introduction means for introducing laser light into the processing head,
A liquid is ejected from the machining head to the workpiece along the planned cutting line of the workpiece and laser light is transmitted through the liquid to irradiate the workpiece with laser light. Grooves are formed on the surface of the planned cutting line on the surface, and liquid is sprayed from the machining head onto the workpiece along the grooves to generate cracks that reach the back surface of the workpiece from the grooves. An apparatus for processing a workpiece, wherein the workpiece is cut along a planned cutting line. 被加工物を支持する支持手段と、液体を上記被加工物に噴射するとともに該液体内にレーザ光を透過させて出射する第１加工ヘッドと、液体を被加工物に噴射する第２加工ヘッドと、支持手段と上記両加工ヘッドとを相対移動させる移動手段と、上記両加工ヘッドに高圧の液体を供給する液体供給手段と、上記第１加工ヘッドにレーザ光を導入するレーザ光導入手段とを備えて、
上記被加工物の割断予定線に沿って上記第１加工ヘッドから被加工物に液体を噴射するとともに上記液体内にレーザ光を透過させることにより被加工物にレーザ光を照射して、被加工物の表面における上記割断予定線の箇所に溝を形成し、上記溝に沿って上記第２加工ヘッドから被加工物に液体を噴射して、上記溝から被加工物の裏面に到達する亀裂を生じさせて被加工物を割断予定線のとおりに割断することを特徴とする被加工物の加工装置。 A support means for supporting the workpiece, a first machining head for ejecting a liquid onto the workpiece and transmitting the laser beam through the liquid, and a second machining head for ejecting the liquid onto the workpiece A moving means for relatively moving the support means and the two processing heads, a liquid supply means for supplying a high-pressure liquid to the two processing heads, and a laser light introducing means for introducing laser light into the first processing head. With
The liquid is ejected from the first machining head to the workpiece along the planned cutting line of the workpiece, and the workpiece is irradiated with the laser beam by transmitting the laser beam into the liquid. A groove is formed at a position of the planned cutting line on the surface of the object, and a liquid is sprayed from the second processing head to the workpiece along the groove to reach a back surface of the workpiece from the groove. An apparatus for processing a workpiece, characterized by causing the workpiece to be cut according to a planned cutting line. 被加工物を支持する支持手段と、液体を上記被加工物に噴射するとともに該液体内にレーザ光を透過させて出射する第１加工ヘッドと、上記支持手段と上記第１加工ヘッドとを相対移動させる移動手段と、上記第１加工ヘッドに高圧の液体を供給する液体供給手段と、上記第１加工ヘッドにレーザ光を導入するレーザ光導入手段とを備える第１ステーションと、
被加工物を支持する支持手段と、液体を上記被加工物に噴射するとともに該液体内にレーザ光を透過させて出射する第２加工ヘッドと、上記支持手段と上記第２加工ヘッドとを相対移動させる移動手段と、上記第２加工ヘッドに高圧の液体を供給する液体供給手段とを備える第２ステーションとからなり、
上記第１ステーションにおいて上記被加工物の割断予定線に沿って上記第１加工ヘッドから被加工物に液体を噴射するとともに上記液体内にレーザ光を透過させることにより被加工物にレーザ光を照射して、被加工物の表面における上記割断予定線の箇所に溝を形成し、
上記第２ステーションにおいて上記溝に沿って上記第２加工ヘッドから被加工物に液体を噴射して、上記溝から被加工物の裏面に到達する亀裂を生じさせて被加工物を割断予定線のとおりに割断することを特徴とする被加工物の加工装置。 A supporting means for supporting a workpiece, a first machining head for injecting a liquid onto the workpiece and transmitting a laser beam through the liquid and emitting the liquid, and the supporting means and the first machining head relative to each other. A first station comprising: moving means for moving; liquid supply means for supplying high-pressure liquid to the first processing head; and laser light introducing means for introducing laser light into the first processing head;
A supporting means for supporting a workpiece, a second machining head for injecting a liquid onto the workpiece and transmitting a laser beam into the liquid and emitting the liquid, and the supporting means and the second machining head are relative to each other. A second station comprising moving means for moving and liquid supply means for supplying high-pressure liquid to the second processing head;
In the first station, the workpiece is irradiated with the laser beam by injecting the liquid from the first machining head to the workpiece along the planned cutting line of the workpiece and transmitting the laser beam into the liquid. Then, a groove is formed at the position of the planned cutting line on the surface of the workpiece,
In the second station, a liquid is sprayed from the second processing head to the workpiece along the groove to cause a crack to reach the back surface of the workpiece from the groove, thereby cutting the workpiece along the cutting line. The processing apparatus of the workpiece characterized by cleaving according to the above.
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