JP2007242711A - Led light emitting device - Google Patents
Led light emitting device Download PDFInfo
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- JP2007242711A JP2007242711A JP2006059871A JP2006059871A JP2007242711A JP 2007242711 A JP2007242711 A JP 2007242711A JP 2006059871 A JP2006059871 A JP 2006059871A JP 2006059871 A JP2006059871 A JP 2006059871A JP 2007242711 A JP2007242711 A JP 2007242711A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
Description
本発明は、NC旋盤機などの機械装置に組み込まれる機内照明や読書灯などの照明器具に使用されるLED発光装置に関するものである。 The present invention relates to an LED light-emitting device used for lighting equipment such as in-machine lighting and a reading lamp incorporated in a mechanical device such as an NC lathe.
従来、NC旋盤機などの機械装置に組み込まれる機内照明や読書灯などの照明器具に使用されるLED発光装置1’として、図8及び図9に示すように複数のLED素子2をプリント基板3上に整列配置したものがある。図8のLED発光装置1’は、LED素子2として指向角30〜40°程度の砲弾型LEDを使用したものであり、図9のLED発光装置1’は、LED素子2として指向角110〜120°程度の面実装型LEDを使用したものである。 Conventionally, as an LED light-emitting device 1 ′ used for lighting equipment such as in-machine lighting and reading lamps incorporated in a mechanical device such as an NC lathe, a plurality of LED elements 2 are arranged on a printed circuit board 3 as shown in FIGS. 8 and 9. Some are aligned above. The LED light-emitting device 1 ′ in FIG. 8 uses a bullet-type LED having a directivity angle of about 30 to 40 ° as the LED element 2, and the LED light-emitting device 1 ′ in FIG. A surface mount LED of about 120 ° is used.
図8及び図9に示す従来のLED発光装置1’は、1つのLED素子2に1つのLEDチップ(図示略)しか搭載していないため、単位面積あたりの光度が小さいという問題がある。そこで、本発明者らは、複数(例えば8個)のLEDチップを搭載したLED素子2を使用することで単位面積あたりの光度を大きくしようと考えた。ところが、複数のLEDチップを搭載したLED素子2を使用すると、LEDチップが増加した分だけ発熱量が大きくなるため、LED素子2の光度劣化が激しく短寿命になるという問題が生じた。 The conventional LED light emitting device 1 ′ shown in FIGS. 8 and 9 has a problem that the luminous intensity per unit area is small because only one LED chip (not shown) is mounted on one LED element 2. Therefore, the present inventors considered to increase the luminous intensity per unit area by using the LED element 2 on which a plurality of (for example, eight) LED chips are mounted. However, when the LED element 2 on which a plurality of LED chips are mounted is used, the amount of heat generation increases as the number of LED chips increases, causing a problem that the luminous intensity of the LED element 2 is severely deteriorated and the life is shortened.
従来は、プリント基板3としてガラスエポキシなどの樹脂製のものを使用していたため、LED素子2の放熱性が低く短寿命になるという問題があった。そこで、プリント基板3として金属製のものを使用することにより、LED素子2の放熱性を高めて長寿命化を図ったものが提案されている(例えば、特許文献1参照)。 Conventionally, since a printed circuit board 3 made of a resin such as glass epoxy has been used, the LED element 2 has a problem of low heat dissipation and a short life. In view of this, there has been proposed a printed circuit board 3 that is made of a metal to enhance the heat dissipation of the LED element 2 and to extend its life (for example, see Patent Document 1).
金属製のプリント基板3を使用すると、LED素子2の放熱性は高まる反面、LED素子2をプリント基板3に半田付けする際に半田熱がプリント基板3に奪われるので半田付けの作業性が低下する。また、金属製のプリント基板3は、ガラスエポキシなどの樹脂性のプリント基板3に比べて高価であるため、LED素子2の配列などのバリエーション展開が容易ではない。 When the metal printed board 3 is used, the heat dissipation of the LED element 2 is increased, but when the LED element 2 is soldered to the printed board 3, the soldering heat is taken away by the printed board 3, so that the soldering workability is lowered. To do. Further, since the metal printed board 3 is more expensive than the resinous printed board 3 such as glass epoxy, it is not easy to develop variations such as the arrangement of the LED elements 2.
本発明は斯かる実情に鑑み創案されたものであって、その目的は、バリエーション展開が容易な樹脂製のプリント基板を使用しつつLED素子の放熱作用を向上させることにより、LED素子の光度劣化を抑制し長寿命化を図ったLED発光装置を提供することにある。 The present invention was devised in view of such circumstances, and its purpose is to improve the heat dissipation effect of the LED element while using a printed circuit board made of resin that can be easily developed in variations, thereby degrading the luminous intensity of the LED element. It is in providing the LED light-emitting device which suppressed the lifetime and aimed at lifetime improvement.
本発明に係るLED発光装置は、上記目的を達成するため、LEDチップが樹脂にてモールドされたLED素子を樹脂製のプリント基板に取り付けてなるLED発光装置であって、LED素子の底部に装着される放熱ピンと、プリント基板に穿設された挿通孔に放熱ピンを挿し通して放熱ピンの先端が接続される放熱板とを備えたことを特徴とする。 In order to achieve the above object, an LED light-emitting device according to the present invention is an LED light-emitting device in which an LED element in which an LED chip is molded with a resin is attached to a printed circuit board made of resin. And a heat radiating plate to which the tip of the heat radiating pin is connected by inserting the heat radiating pin through an insertion hole formed in the printed circuit board.
上記のLED発光装置は、LEDチップにて発生した熱がLED素子から放熱ピンを介して放熱板に伝達され、放熱板から外部へ放熱される。このように、LEDチップにて発生した熱を放熱させることで、LED素子の蓄熱が抑制され、LED素子の光度劣化を抑制して長寿命化を図ることができる。 In the LED light emitting device, the heat generated in the LED chip is transmitted from the LED element to the heat radiating plate through the heat radiating pin, and is radiated from the heat radiating plate to the outside. Thus, by dissipating the heat generated in the LED chip, the heat storage of the LED element is suppressed, and it is possible to extend the life by suppressing the light intensity deterioration of the LED element.
また、本発明に係るLED発光装置は、前記LED素子の底部に凹部を設け、該凹部に充填した熱伝導性接着剤にて前記放熱ピンを前記LED素子に装着したことを特徴とする。 The LED light-emitting device according to the present invention is characterized in that a recess is provided at the bottom of the LED element, and the heat dissipation pin is attached to the LED element with a heat conductive adhesive filled in the recess.
上記のLED発光装置は、前記LED素子の底部に凹部を設けて凹部の形成箇所を可能な限り薄く形成してある。そして、凹部に熱伝導性接着剤を充填することで、LED素子の凹部を除く他の部分よりも凹部の熱伝導効率を高めてある。このような凹部に放熱ピンを接続することでLEDチップから凹部に充填した熱伝導性接着剤を介して放熱ピンへ熱を逃がしやすくなる。 Said LED light-emitting device has provided the recessed part in the bottom part of the said LED element, and formed the formation location of the recessed part as thinly as possible. And the heat conductive efficiency of a recessed part is improved rather than the other part except the recessed part of a LED element by filling a recessed part with a heat conductive adhesive. By connecting the heat dissipation pin to such a recess, heat is easily released from the LED chip to the heat dissipation pin via the thermally conductive adhesive filled in the recess.
また、本発明に係るLED発光装置は、前記放熱ピンが前記LED素子の底部に植設されていることを特徴とする。 Moreover, the LED light-emitting device according to the present invention is characterized in that the heat dissipation pin is implanted at the bottom of the LED element.
上記のLED発光装置は、前記LED素子の底部に放熱ピンを植設することで、LED素子と放熱ピンの接触面積が増加するので、LED素子から放熱ピンへ熱を逃がしやすくなる。 In the LED light emitting device described above, since the contact area between the LED element and the heat dissipation pin is increased by implanting the heat dissipation pin at the bottom of the LED element, heat is easily released from the LED element to the heat dissipation pin.
また、本発明に係るLED発光装置は、前記放熱ピンが、プリント基板の挿通孔に挿し通す挿通部と、LED素子に接続される接続部とを有し、接続部を挿通部よりも大径としたことを特徴とする。 Further, the LED light emitting device according to the present invention has an insertion portion in which the heat dissipation pin is inserted through the insertion hole of the printed circuit board and a connection portion connected to the LED element, and the connection portion has a larger diameter than the insertion portion. It is characterized by that.
上記のLED発光装置は、前記放熱ピンの接続部を挿通部よりも大径とすることで、放熱ピンの集熱作用が増大するので、LED素子から放熱ピンへ熱を逃がしやすくなる。 In the above LED light emitting device, the heat collecting action of the heat radiating pin is increased by making the connecting portion of the heat radiating pin larger in diameter than the insertion portion, so that heat is easily released from the LED element to the heat radiating pin.
また、本発明に係るLED発光装置は、前記プリント基板と放熱板との間に絶縁体からなるスペーサを介在させたことを特徴とする。 The LED light-emitting device according to the present invention is characterized in that a spacer made of an insulator is interposed between the printed board and the heat sink.
上記のLED発光装置は、プリント基板と放熱板との間に絶縁体からなるスペーサを介在させることで、プリント基板と放熱板との間の絶縁性を担保してある。したがって、プリント基板と放熱板の相互間距離を絶縁距離よりも短くすることができ、LED発光装置の小型化を図ることができる。また、スペーサによって、プリント基板と放熱板とのガタツキを抑制することができ、LED発光装置の指向性を高めることもできる。 Said LED light-emitting device has ensured the insulation between a printed circuit board and a heat sink by interposing the spacer which consists of an insulator between a printed circuit board and a heat sink. Therefore, the distance between the printed board and the heat sink can be made shorter than the insulation distance, and the LED light emitting device can be downsized. Further, the spacer can suppress backlash between the printed circuit board and the heat radiating plate, and can enhance the directivity of the LED light emitting device.
本発明によれば、LEDチップにて発生した熱が放熱ピンを介して放熱板に伝達され、LED素子の蓄熱を抑制できるので、LED素子の光度劣化を抑制できると共に長寿命化を図ることができる。 According to the present invention, the heat generated in the LED chip is transmitted to the heat radiating plate through the heat radiating pin, and the heat storage of the LED element can be suppressed. Therefore, the luminous intensity of the LED element can be suppressed and the life can be extended. it can.
以下、図面を参照しつつ本発明に係るLED発光装置の実施形態について説明する。 Hereinafter, embodiments of an LED light-emitting device according to the present invention will be described with reference to the drawings.
図1は本発明に係るLED発光装置1の一実施形態を示す平面図で、図2は図1のA−A線側から見た側面図で、図3は図1のB−B線断面図で、図4は図1のA−A線と平行な線であって、LED素子2を通る線における断面図である。各図に示すように、このLED発光装置1は、複数のLED素子2が整列配置された樹脂製のプリント基板3を放熱板としてのケーシング5に取り付けたものである。 1 is a plan view showing an embodiment of an LED light emitting device 1 according to the present invention, FIG. 2 is a side view seen from the line AA in FIG. 1, and FIG. 3 is a cross section taken along line BB in FIG. 4 is a cross-sectional view taken along the line AA in FIG. 1 and passing through the LED element 2. As shown in each drawing, this LED light emitting device 1 is obtained by attaching a resin printed board 3 in which a plurality of LED elements 2 are arranged and arranged to a casing 5 as a heat radiating plate.
LED素子2は、図4に示すように、複数のLEDチップ4が配置されたリードフレーム6と、リードフレーム6をモールドする樹脂製のハウジング7と、リードフレーム6上に配置されたLEDチップ4を被覆する蛍光体8と、ハウジング7の底部に装着される放熱ピン9とを主要な構成要素として備え、絶縁ワッシャ10を介してプリント基板3に装着される。 As shown in FIG. 4, the LED element 2 includes a lead frame 6 in which a plurality of LED chips 4 are disposed, a resin housing 7 for molding the lead frame 6, and an LED chip 4 disposed on the lead frame 6. The phosphor 8 that covers the surface of the housing 7 and the heat dissipating pins 9 that are attached to the bottom of the housing 7 are the main components, and are attached to the printed circuit board 3 via the insulating washers 10.
リードフレーム6は、複数のLEDチップ4が配置される本体部6aと、本体部6aから延び出た一対のリード部6b,6bとからなる。本体部6aは、例えば円板状とされ、その上面に複数のLEDチップ4が適宜整列配置される。この実施形態では、例えば図5に示すように、8個のLEDチップ4を楕円周上に配置すると共に2個のLEDチップ4を前記楕円の中央部であって楕円の短径方向に所定の間隔を隔てて配置してある。各リード部6b,6bは、プリント基板3に接続される部位であって、細線状に形成され、本体部6aから折り曲げてLED素子2の底面側へ延在させてある。そして、各リード部6b,6bは、プリント基板3に穿設された挿通孔3a,3aに挿し通して半田付けされる。 The lead frame 6 includes a main body portion 6a on which the plurality of LED chips 4 are disposed, and a pair of lead portions 6b and 6b extending from the main body portion 6a. The main body 6a is formed in, for example, a disk shape, and a plurality of LED chips 4 are appropriately arranged on the upper surface thereof. In this embodiment, for example, as shown in FIG. 5, eight LED chips 4 are arranged on the circumference of the ellipse and two LED chips 4 are arranged in the center of the ellipse with a predetermined length in the minor axis direction of the ellipse. They are spaced apart. Each lead portion 6b, 6b is a portion connected to the printed circuit board 3, is formed in a thin line shape, is bent from the main body portion 6a, and extends to the bottom surface side of the LED element 2. The lead portions 6b and 6b are inserted into the insertion holes 3a and 3a formed in the printed circuit board 3 and soldered.
ハウジング7は、リードフレーム6の本体部6aの表面側であってLEDチップ4が配置される中央部を除く周縁部を被覆すると共に、本体部6aの裏面全体を被覆する構成とされる。ハウジング7の表面側は擂鉢状に形成され、この擂鉢部7aの傾斜角により、LED素子2の指向角が設定される。ハウジング7の擂鉢部7aには蛍光体8が充填され、リードフレーム6のLEDチップ4が配置される中央部を封止してある。蛍光体8は、所望の色(例えば黄色)に着色された樹脂(例えばシリコン樹脂やエポキシ樹脂など)からなっている。こうすることで、蛍光体8の色とLEDチップ4の発光色(例えば青色)が合成され、LED素子2の蛍光体8部分が所望の色(例えば白色)に光るようになっている。 The housing 7 is configured to cover the entire peripheral surface of the lead frame 6 except for the central portion where the LED chip 4 is disposed on the surface side of the main body portion 6a and the entire back surface of the main body portion 6a. The surface side of the housing 7 is formed in a bowl shape, and the directivity angle of the LED element 2 is set by the inclination angle of the bowl part 7a. The mortar portion 7a of the housing 7 is filled with a phosphor 8, and the central portion of the lead frame 6 where the LED chip 4 is disposed is sealed. The phosphor 8 is made of a resin (for example, silicon resin or epoxy resin) colored in a desired color (for example, yellow). By doing so, the color of the phosphor 8 and the light emission color (for example, blue) of the LED chip 4 are combined, and the phosphor 8 portion of the LED element 2 shines in a desired color (for example, white).
ハウジング7の底部には、放熱ピン9を植設するための凹部11を形成してある。この凹部11は、放熱ピン9を嵌合させる大径孔11aと、大径孔11aの中央部に穿設された小径孔11bとからなる異径孔構造とされ、小径孔11bに充填した接着剤12aにて放熱ピン9が固着される。接着剤12aとしては、シリコン等の熱伝導性に優れたものが使用される。 A recess 11 for planting the heat dissipation pin 9 is formed at the bottom of the housing 7. The recess 11 has a different-diameter hole structure including a large-diameter hole 11a into which the heat radiating pin 9 is fitted and a small-diameter hole 11b drilled in the center of the large-diameter hole 11a. The heat radiation pin 9 is fixed by the agent 12a. As the adhesive 12a, an adhesive having excellent thermal conductivity such as silicon is used.
放熱ピン9は、LEDチップ4にて発生した熱をケーシング5へ逃がすための部材で、例えば金属(アルミニウムや銅など)やセラミックなどの熱伝導性に優れた材料からなっている。プリント基板3には、各リード部6b,6bを挿し通す挿通孔3a,3aの相互間に、前記挿通孔3a,3aよりも大径の挿通孔3bを形成してある。放熱ピン9は、この大径の挿通孔3bに挿し通す挿通部9aと、LED素子2のハウジング7の底部に接続される接続部9bとを有し、接続部9bを挿通部9aよりも大径に形成してある。接続部9bは、ハウジング7の底部の大部分に渡って形成された大径孔11aに嵌合される。詳しくは、リードフレーム6のLEDチップ4が配置される領域と対応するように該領域の真下に形成された大径孔11aに接続部9bが嵌合される。このように放熱ピン9の接続部9bをLEDチップ4が配置される領域と対応するように形成することで、放熱ピン9の集熱作用が向上し、LEDチップ4にて発生した熱を逃がしやすくなる。しかも、本実施形態の場合は、接続部9bをハウジング7に嵌合させて接触面積を大きくとっているので、放熱ピン9の集熱作用がより一層向上する。ちなみに、ハウジング7の小径孔11bは、放熱ピン9の挿通部9aとほぼ同径でかつ挿通部9aの延長上に形成してある。ハウジング7において最も熱が集中するのはその中央部であり、また、放熱ピン9において最も熱伝導経路が短くなるのは、接続部9bの中央部から挿通部9aに至る部分である。かかる観点から、ハウジング7の中央部に小径孔11bを形成してハウジング7の中央部の肉厚を薄く形成すると共に、小径孔11bにハウジング7を構成する樹脂よりも熱伝導性に優れたシリコン系接着剤12aを充填することにより、LEDチップ4にて発生した熱が放熱ピン9に伝わりやすくなる。 The heat dissipation pin 9 is a member for releasing heat generated in the LED chip 4 to the casing 5 and is made of a material having excellent thermal conductivity such as metal (aluminum, copper, etc.) or ceramic. In the printed circuit board 3, an insertion hole 3b having a larger diameter than the insertion holes 3a and 3a is formed between the insertion holes 3a and 3a through which the lead portions 6b and 6b are inserted. The heat dissipation pin 9 has an insertion portion 9a that is inserted through the large-diameter insertion hole 3b and a connection portion 9b that is connected to the bottom of the housing 7 of the LED element 2, and the connection portion 9b is larger than the insertion portion 9a. It is formed in the diameter. The connecting portion 9 b is fitted into a large diameter hole 11 a formed over most of the bottom portion of the housing 7. Specifically, the connection portion 9b is fitted into a large-diameter hole 11a formed immediately below the region of the lead frame 6 so as to correspond to the region where the LED chip 4 is disposed. Thus, by forming the connection part 9b of the heat dissipation pin 9 so as to correspond to the region where the LED chip 4 is disposed, the heat collecting action of the heat dissipation pin 9 is improved and the heat generated in the LED chip 4 is released. It becomes easy. In addition, in the present embodiment, since the contact portion 9b is fitted to the housing 7 to increase the contact area, the heat collecting action of the heat radiating pins 9 is further improved. Incidentally, the small-diameter hole 11b of the housing 7 has substantially the same diameter as the insertion portion 9a of the heat dissipation pin 9 and is formed on the extension of the insertion portion 9a. The heat is most concentrated in the housing 7 in the central portion, and the heat conduction path in the heat radiation pin 9 is the shortest in the portion from the central portion of the connection portion 9b to the insertion portion 9a. From this point of view, the small diameter hole 11b is formed in the central portion of the housing 7 to reduce the thickness of the central portion of the housing 7, and the silicon having better thermal conductivity than the resin constituting the housing 7 in the small diameter hole 11b. By filling the system adhesive 12a, the heat generated in the LED chip 4 is easily transmitted to the heat dissipation pins 9.
上記の如く構成されたLED素子2は、絶縁ワッシャ10を介してプリント基板3の挿通孔3bに放熱ピン9を挿し通すと共に、プリント基板3の挿通孔3a,3aに挿し通したリード部6b,6bを半田付けすることによりプリント基板3に装着される。プリント基板3の表面には、図1に示すように、適宜の電極パターン3cを設けてある。複数のLED素子2が装着されたプリント基板3は、スペーサ13を介してケーシング5に装着される。 The LED element 2 configured as described above has the heat radiation pin 9 inserted through the insertion hole 3b of the printed circuit board 3 through the insulating washer 10, and the lead portion 6b inserted through the insertion holes 3a and 3a of the printed circuit board 3. 6b is attached to the printed circuit board 3 by soldering. As shown in FIG. 1, an appropriate electrode pattern 3 c is provided on the surface of the printed circuit board 3. The printed circuit board 3 on which the plurality of LED elements 2 are mounted is mounted on the casing 5 via the spacer 13.
ケーシング5は、LEDチップ4にて発生した熱をLED発光装置1の外部へ逃がすための部材で、各LED素子2から延び出した放熱ピン9の挿通部9aの先端が接続される。この実施形態では、ケーシング5としてアルミニウムからなる樋状のものを使用している。ケーシング5には、放熱ピン9の挿通部9aを接続する貫通孔5aを設けてあり、貫通孔5aに充填した接着剤12bにて放熱ピン9が固着される。接着剤12bとしては、シリコン等の熱伝導性に優れたものが使用される。スペーサ13は、ゴムや樹脂等の絶縁体からなり、プリント基板3とケーシング5の間に介在させて、プリント基板3とケーシング5の絶縁性を担保するものである。また、スペーサ13によって、プリント基板3とケーシング5とのガタツキを抑制することができ、LED発光装置1の指向性を高めることもできる。 The casing 5 is a member for releasing the heat generated in the LED chip 4 to the outside of the LED light emitting device 1, and the tip of the insertion portion 9 a of the heat radiation pin 9 extending from each LED element 2 is connected. In this embodiment, a casing 5 made of aluminum is used as the casing 5. The casing 5 is provided with a through hole 5a for connecting the insertion portion 9a of the radiating pin 9, and the radiating pin 9 is fixed by an adhesive 12b filled in the through hole 5a. As the adhesive 12b, an adhesive having excellent thermal conductivity such as silicon is used. The spacer 13 is made of an insulator such as rubber or resin, and is interposed between the printed board 3 and the casing 5 to ensure the insulation between the printed board 3 and the casing 5. Further, the spacer 13 can suppress backlash between the printed circuit board 3 and the casing 5, and the directivity of the LED light emitting device 1 can also be improved.
本実施形態のLED発光装置1は、上記の如く構成され、LEDチップ4にて発生した熱が放熱ピン9を介してケーシング5に伝達され、ケーシング5から外部へ放熱される。このように、LEDチップ4にて発生した熱を放熱させることで、LED素子2の蓄熱が抑制され、LED素子2の光度劣化を抑制して長寿命化を図ることができる。また、ハウジング7の底部に凹部11を設けてハウジング7の一部を薄く形成し、かつ、該凹部11の小径孔11bに熱伝導性接着剤12aを充填することで、LED素子2から放熱ピン9への熱伝導効率を高めてある。さらに、放熱ピン9をハウジング7の底部に形成した凹部11の大径孔11aに植設し、ハウジング7と放熱ピン9の接触面積を増加させることによっても、LED素子2から放熱ピン9へ熱を逃がしやすくなる。さらにまた、放熱ピン9の接続部9bを挿通部9aよりも大径に形成することで、放熱ピン9の製造コストを抑制しつつ集熱作用を向上させることもできる。 The LED light emitting device 1 of the present embodiment is configured as described above, and heat generated in the LED chip 4 is transmitted to the casing 5 via the heat radiation pins 9 and is radiated from the casing 5 to the outside. Thus, by dissipating the heat generated in the LED chip 4, the heat storage of the LED element 2 is suppressed, and the deterioration of the luminous intensity of the LED element 2 can be suppressed to extend the life. In addition, a recess 11 is provided at the bottom of the housing 7 so that a part of the housing 7 is formed thin, and a small diameter hole 11b of the recess 11 is filled with a heat conductive adhesive 12a. The heat conduction efficiency to 9 is increased. Furthermore, the heat radiation pin 9 is also implanted in the large-diameter hole 11a of the recess 11 formed in the bottom of the housing 7 and the contact area between the housing 7 and the heat radiation pin 9 is increased, so that the heat from the LED element 2 to the heat radiation pin 9 can be increased. Easier to escape. Furthermore, by forming the connecting portion 9b of the radiating pin 9 to have a larger diameter than the insertion portion 9a, the heat collecting action can be improved while suppressing the manufacturing cost of the radiating pin 9.
以上、本発明の一実施形態につき説明したが、本発明は上記実施形態に限定されることなく種々の変形が可能である。上記実施形態では、LED素子2が外部に露出されているが、例えば図6に示すように、ケーシング5の開口部を拡散板14にて閉塞し、LED素子2が外部に露出されないようにしても構わない。図6では、ケーシング5の各壁部5b,5bの内面に設けた溝5c,5cに拡散板14を嵌め付けてケーシング5の開口部を閉塞してある。拡散板14は、ケーシング5の開口部を閉塞する蓋として機能するほか、拡散板14の全域からほぼ一様に光が照射されるように複数のLED素子2の光を拡散させる機能も有する。また図6では、ケーシング5の底面の両端にレール(例えばDINレール)5d,5dを設けてあり、このレール5d,5dに図示外の電源や端子台をワンタッチで取り付けられるようにしてある。 Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment and can be variously modified. In the above embodiment, the LED element 2 is exposed to the outside. For example, as shown in FIG. 6, the opening of the casing 5 is closed by the diffusion plate 14 so that the LED element 2 is not exposed to the outside. It doesn't matter. In FIG. 6, the diffusion plate 14 is fitted in the grooves 5 c and 5 c provided on the inner surfaces of the wall portions 5 b and 5 b of the casing 5 to close the opening of the casing 5. In addition to functioning as a lid that closes the opening of the casing 5, the diffusion plate 14 also has a function of diffusing the light of the plurality of LED elements 2 so that light is irradiated almost uniformly from the entire area of the diffusion plate 14. In FIG. 6, rails (for example, DIN rails) 5d and 5d are provided at both ends of the bottom surface of the casing 5, and a power source and a terminal block (not shown) can be attached to the rails 5d and 5d with one touch.
また、上記実施形態では、放熱板としてのケーシング5を樋状に形成してあるが、ケーシング5は平板状の底部分だけでも放熱板としての機能を十分に発揮することができる。例えば図7に示すLED発光装置1は、平板状に形成された放熱板5にプリント基板3を装着したものであって、該LED発光装置1をガラス管15に封入してある。ガラス管15の内部には、LED発光装置1と共に定電流電源16が収容され、ガラス管15の開口部をゴム栓17にて閉塞してある。また、放熱板5の端部には、ゴム栓17に挿し通してガラス管15の外部に延在させる放熱部5eを設けてある。このようにLED発光装置1をガラス管15に封入して防水・防油構造とすることで、水や油を使用する機械装置の機内照明としても使用することができる。 Moreover, in the said embodiment, although the casing 5 as a heat sink is formed in bowl shape, the casing 5 can fully exhibit the function as a heat sink only by the flat bottom part. For example, the LED light-emitting device 1 shown in FIG. 7 has a printed board 3 mounted on a heat sink 5 formed in a flat plate shape, and the LED light-emitting device 1 is enclosed in a glass tube 15. Inside the glass tube 15, a constant current power supply 16 is accommodated together with the LED light emitting device 1, and the opening of the glass tube 15 is closed with a rubber plug 17. Further, a heat radiating portion 5 e that is inserted through the rubber plug 17 and extends to the outside of the glass tube 15 is provided at the end of the heat radiating plate 5. Thus, by enclosing the LED light-emitting device 1 in the glass tube 15 and having a waterproof / oil-proof structure, it can also be used as in-machine lighting of a mechanical device using water or oil.
1 LED発光装置
2 LED素子
3 プリント基板
3a,3a 挿通孔
3b 挿通孔
4 LEDチップ
5 ケーシング(放熱板)
6 リードフレーム
6a 本体部
6b,6b リード部
7 ハウジング
8 蛍光体
9 放熱ピン
9a 挿通部
9b 接続部
10 絶縁ワッシャ
11 凹部
12a,12b接着剤
13 スペーサ
DESCRIPTION OF SYMBOLS 1 LED light-emitting device 2 LED element 3 Printed circuit board 3a, 3a Insertion hole 3b Insertion hole 4 LED chip 5 Casing (heat sink)
6 Lead frame 6a Body portion 6b, 6b Lead portion 7 Housing 8 Phosphor 9 Radiating pin 9a Insertion portion 9b Connection portion 10 Insulating washer 11 Recesses 12a, 12b Adhesive 13 Spacer
Claims (5)
LED素子の底部に装着される放熱ピンと、プリント基板に穿設された挿通孔に放熱ピンを挿し通して放熱ピンの先端が接続される放熱板とを備えたことを特徴とするLED発光装置。 An LED light emitting device in which an LED element in which an LED chip is molded with a resin is attached to a resin printed board,
An LED light emitting device comprising: a heat radiating pin attached to a bottom portion of an LED element; and a heat radiating plate to which a tip of the heat radiating pin is connected by inserting the heat radiating pin through an insertion hole formed in a printed board.
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