JP2007220988A - Automatic set-up and shut-down system of production line - Google Patents

Automatic set-up and shut-down system of production line Download PDF

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JP2007220988A
JP2007220988A JP2006041259A JP2006041259A JP2007220988A JP 2007220988 A JP2007220988 A JP 2007220988A JP 2006041259 A JP2006041259 A JP 2006041259A JP 2006041259 A JP2006041259 A JP 2006041259A JP 2007220988 A JP2007220988 A JP 2007220988A
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production line
information
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setup change
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JP4671425B2 (en
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Mitsuo Imai
美津男 今井
Teruyuki Ohashi
輝之 大橋
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To enable an automatic set-up and shut-down with inexpensive means in such a way that each equipment of the production line independently determines a set-up and shut-down timing. <P>SOLUTION: In a relation between a plurality of equipment 11-14 constituting the production line, information of production number of sheets of identical substrate group worked by upstream equipment is sent in order from the upstream equipment to downstream equipment when the production of the identical substrate group is finished. The downstream equipment executes the plan substitution by judging the set-up and shut-down timing based on the information of production number of sheets of the identical substrate group received from the upstream equipment. Furthermore, when a circuit board is removed or added between any equipment of the production line, information of removed or added number of sheets is sent with respect to the downstream. Then this downstream equipment executes the set-up and shut-down by determining the set-up and shut-down timing by increasing/decreasing the information of production number of sheets of the identical substrate group received from the upstream equipment by the removed or added number of sheets. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、電子部品を実装した電子部品実装基板を生産するための複数の工程を順番に実行する複数の装置を、前記回路基板の搬送経路に沿って配置した生産ラインの自動段取替えシステムに関する発明である。   The present invention relates to an automatic setup change system for a production line in which a plurality of devices for sequentially executing a plurality of steps for producing an electronic component mounting board on which electronic components are mounted are arranged along a conveyance path of the circuit board. It is an invention.

電子部品を実装した電子部品実装基板を生産ラインにおいては、半田ペースト印刷装置、接着剤塗布装置、電子部品実装装置、リフロー装置、検査装置等を生産ラインの搬送経路に沿って配置し、その搬送経路の上流側から回路基板を搬送して、上記各装置を順番に通過することで、電子部品実装基板を生産するようにしている。この生産ラインでは、様々な仕様の電子部品実装基板を生産可能であり、生産ラインの稼働中に生産する基板種が切り替わる毎に各装置の生産プログラムを切り替えたり搬送系を基板サイズに合わせて調整する“段取替え”を行うようにしている。   In the production line, the electronic component mounting board on which the electronic components are mounted is arranged along the transport path of the production line by solder paste printing device, adhesive coating device, electronic component mounting device, reflow device, inspection device, etc. By transporting the circuit board from the upstream side of the path and sequentially passing through each of the above devices, an electronic component mounting board is produced. With this production line, it is possible to produce electronic component mounting boards with various specifications. Each time the board type to be produced is switched during operation of the production line, the production program of each device is switched and the transport system is adjusted to the board size. "Setup change" is performed.

この段取替えの従来技術としては、例えば特許文献１（特開２０００−３１６９４号公報）に記載されているように、生産ラインの各装置を制御するホストコンピュータで基板種や生産枚数を管理して、各装置毎に同一の基板種の生産が終了した時点で、ホストコンピュータから段取替え信号を出力して、次に生産する基板種の生産プログラムをプログラム記憶部から読み出すようにしたものがある。   As a conventional technique of this setup change, for example, as described in Patent Document 1 (Japanese Patent Laid-Open No. 2000-31694), the substrate type and the number of produced sheets are managed by a host computer that controls each device on the production line. When the production of the same substrate type is completed for each apparatus, a setup change signal is output from the host computer, and the production program for the next substrate type to be produced is read from the program storage unit.

しかし、この構成では、ホストコンピュータが生産ラインの全ての装置の生産進行状況を各装置毎にリアルタイムで把握する必要があり、生産ラインの装置の数が多くなると、ホストコンピュータの処理負荷が過大になるおそれがある。   However, with this configuration, the host computer needs to grasp the production progress of all the devices on the production line in real time for each device, and if the number of devices on the production line increases, the processing load on the host computer becomes excessive. There is a risk.

また、特許文献２（特開２０００−１２４６７６号公報）、特許文献３（特開２００４−９５９７８号公報）に記載されているように、基板ＩＤ（基板種情報）を記録したバーコード等を回路基板に設けると共に、生産ラインの最上流の装置に基板ＩＤを読み取るＩＤ読取装置を設け、このＩＤ読取装置で読み取った基板ＩＤの情報を下流側の各装置に送信するようにしたものがある。
特開２０００−３１６９４号公報（第１頁〜第４頁等） 特開２０００−１２４６７６号公報（第１頁等） 特開２００４−９５９７８号公報（第１頁等） Further, as described in Patent Document 2 (Japanese Patent Laid-Open No. 2000-124676) and Patent Document 3 (Japanese Patent Laid-Open No. 2004-95978), a bar code or the like on which a substrate ID (substrate type information) is recorded is a circuit. In addition to being provided on the substrate, an ID reader that reads the substrate ID is provided in the most upstream device on the production line, and information on the substrate ID read by the ID reader is transmitted to each downstream device.
Japanese Unexamined Patent Publication No. 2000-31694 (first page to fourth page, etc.) JP 2000-124676 A (first page, etc.) JP 2004-95978 A (first page, etc.)

上記特許文献２，３の構成では、生産ラインの各装置は、上流側の装置から送信されてくる基板ＩＤの情報に基づいて各装置が独自に段取替えタイミングを判断できるため、ホストコンピュータの処理負荷を軽減できる利点があるが、ＩＤ読取装置が必要となるため、コスト高になるという欠点がある。   In the configurations of Patent Documents 2 and 3, each device on the production line can determine the setup change timing independently based on the substrate ID information transmitted from the upstream device. Although there is an advantage that the load can be reduced, there is a disadvantage that the cost increases because an ID reader is required.

本発明はこのような事情を考慮してなされたものであり、従ってその目的は、安価な手段で生産ラインの各装置が独自に段取替えタイミングを判断して自動的に段取替えを実行することができる生産ラインの自動段取替えシステムを提供することにある。   The present invention has been made in consideration of such circumstances. Therefore, the object of the present invention is to automatically perform the setup change by each device on the production line independently determining the setup change timing by an inexpensive means. It is to provide an automatic setup change system for production lines.

上記目的を達成するために、請求項１に係る発明は、電子部品を実装した電子部品実装基板を生産するための複数の工程を順番に実行する複数の装置を、当該基板の搬送経路に沿って配置した生産ラインの自動段取替えシステムにおいて、生産ラインを構成する複数の装置間において、順次、上流側の装置からその下流側の装置に対して前記上流側の装置が作業した同一基板種の生産枚数の情報を送信し、前記下流側の装置は、前記上流側の装置から受信した前記同一基板種の生産枚数情報に基づいて段取替えのタイミングを判断して段取替えを実行するようにしたものである。   In order to achieve the above object, the invention according to claim 1 provides a plurality of devices that sequentially execute a plurality of steps for producing an electronic component mounting board on which electronic components are mounted, along a transport path of the board. In the production line automatic setup change system of the production line, the upstream substrate is sequentially operated from the upstream device to the downstream device among a plurality of devices constituting the production line. The information on the number of productions is transmitted, and the downstream apparatus determines the timing of the setup change based on the production quantity information of the same substrate type received from the upstream apparatus, and executes the setup change. Is.

このようにすれば、例えば、生産ラインを管理するホストコンピュータ等から生産ラインの最上流の装置に同一基板種の生産枚数情報を送信すれば、その最上流の装置が適宜のタイミングでその下流側の装置に当該同一基板種の生産枚数情報に自動的に送信し、当該下流側の装置が適宜のタイミングで更にその下流側の装置に対して当該同一基板種の生産枚数情報に自動的に送信するという処理を順次実行することで、生産ラインを構成する全ての装置に当該同一基板種の生産枚数情報を各装置の段取替えタイミングに間に合うように送信することができる。これにより、生産ラインの各装置にＩＤ読取装置が無くても、生産ラインの各装置が独自に段取替えタイミングを判断して自動的に段取替えを実行することができ、低コスト化の要求を満たすことができる。   In this way, for example, if the production number information of the same substrate type is transmitted from the host computer or the like that manages the production line to the most upstream device on the production line, the most upstream device can be downstream at an appropriate timing. The number of pieces of production information of the same substrate type is automatically transmitted to the device of the same substrate, and the device of the downstream side automatically transmits the number of pieces of production information of the same substrate type to the downstream side device at an appropriate timing. By sequentially executing the process of doing, it is possible to transmit the production number information of the same substrate type to all the devices constituting the production line in time for the setup change timing of each device. As a result, even if each device on the production line does not have an ID reader, each device on the production line can independently determine the setup change timing and automatically execute the setup change. Can be satisfied.

この場合、上流側の装置から下流側の装置に同一基板種の生産枚数情報を送信するタイミングは、種々考えられ、例えば、上流側の装置が同一基板種の生産枚数情報を受信した時点で直ちに下流側の装置に送信するようにしたり、或は、上流側の装置で生産する同一基板種の残り枚数が所定枚数まで減った時点で当該同一基板種の生産枚数情報を下流側の装置に送信するようにしても良い。   In this case, there are various timings for transmitting the production number information of the same substrate type from the upstream device to the downstream device. For example, immediately when the upstream device receives the production number information of the same substrate type. Send to downstream equipment, or send production quantity information of the same board type to the downstream equipment when the remaining number of the same board type produced by the upstream equipment is reduced to a predetermined number. You may make it do.

或は、請求項２のように、上流側の装置は、その下流側の装置に対して同一基板種の生産枚数情報を当該同一の基板種の生産終了時に送信するようにしても良い。このようにすれば、上流側の装置が同一の基板種の生産を終了した時点でその下流側の装置に当該同一基板種の生産枚数情報に自動的に送信し、当該下流側の装置が当該同一の基板種の生産終了時に更にその下流側の装置に対して当該同一基板種の生産枚数情報に自動的に送信するという処理を順次実行することで、生産ラインを構成する全ての装置に当該同一基板種の生産枚数情報を各装置の段取替えタイミングに合わせて送信することができる。これにより、生産ラインの各装置は、極めて簡単に段取替えタイミングを判断して自動的に段取替えを実行することができる。   Alternatively, as described in claim 2, the upstream apparatus may transmit the production number information of the same board type to the downstream apparatus at the end of production of the same board type. In this way, when the upstream device finishes producing the same substrate type, the downstream device automatically transmits the production number information of the same substrate type to the downstream device. At the end of production of the same board type, by sequentially executing the process of automatically transmitting the number of pieces of production information of the same board type to the downstream apparatus, it applies to all the apparatuses constituting the production line. Information on the number of produced substrates of the same substrate type can be transmitted in accordance with the setup change timing of each apparatus. Thereby, each apparatus of a production line can determine a setup change timing very easily and can perform setup change automatically.

更に、請求項３のように、生産ラインのいずれかの装置間で回路基板の抜き取り又は追加があった場合にその下流側の装置に対して抜き取り又は追加の枚数の情報を送信し、当該下流側の装置は、上流側の装置から受信した同一基板種の生産枚数情報を前記抜き取り又は追加の枚数分だけ増減させて段取替えのタイミングを判断するようにすると良い。このようにすれば、生産ラインのいずれかの装置間で不良発生等による回路基板の抜き取り又は追加があった場合でも、その下流側の装置の段取替えのタイミングを正確に判断して段取替えを実行することができる。   Further, as described in claim 3, when a circuit board is extracted or added between any of the devices on the production line, the information on the number of extracted or added circuits is transmitted to the downstream device, and the downstream It is preferable that the apparatus on the side increases or decreases the production number information of the same substrate type received from the upstream apparatus by the number of the extracted or additional sheets to determine the timing of the setup change. In this way, even when a circuit board is removed or added due to a failure or the like between any of the devices on the production line, the timing of the device replacement on the downstream side is accurately determined and the device replacement is performed. Can be executed.

以下、本発明を実施するための最良の形態を具体化した一実施例を図１を用いて説明する。
電子部品を実装した電子部品実装基板を生産ラインは、例えば、半田ペースト印刷装置１１、接着剤塗布装置１２、第１の電子部品実装装置１３、第２の電子部品実装装置１４等を生産ラインの搬送経路に沿って配置すると共に、第１の電子部品実装装置１３と第２の電子部品実装装置１４との間にバッファ１５を配置した構成となっている。この生産ラインは、ホストコンピュータ１６によって管理される。 An embodiment embodying the best mode for carrying out the present invention will be described below with reference to FIG.
For example, a production line for an electronic component mounting board on which electronic components are mounted includes, for example, a solder paste printing device 11, an adhesive coating device 12, a first electronic component mounting device 13, a second electronic component mounting device 14, and the like. In addition to being arranged along the transport path, a buffer 15 is arranged between the first electronic component mounting apparatus 13 and the second electronic component mounting apparatus 14. This production line is managed by the host computer 16.

生産ラインの稼働開始前又は稼働開始時の初期設定処理によって、ホストコンピュータ１６から各装置１１〜１４毎に段取替えの順序（生産する基板種の順序）が指示される。また、各装置１１〜１４には、生産する基板種に対応する生産プログラムが記憶されているが、段取替えに必要な生産プログラムが装置自身に記憶されていない場合は、必要な生産プログラムをホストコンピュータ１６から読み込むようにしている。   By the initial setting process before the start of the operation of the production line or at the start of the operation, the order of the setup change (the order of the substrate types to be produced) is instructed for each of the devices 11 to 14 from the host computer 16. Each of the devices 11 to 14 stores a production program corresponding to the type of board to be produced. However, if a production program necessary for setup change is not stored in the device itself, the necessary production program is hosted. Reading from the computer 16 is performed.

生産ラインを構成する各装置１１〜１４間において、順次、上流側の装置からその下流側の装置に対して前記上流側の装置が作業した同一基板種の生産枚数の情報を当該同一の基板種の生産終了時に送信し、前記下流側の装置は、前記上流側の装置から受信した同一基板種の生産枚数情報に基づいて段取替えのタイミングを判断して段取替えを実行する。各装置１１〜１４は、段取替え時に生産プログラムを切り替えたり搬送系を基板サイズに合わせて自動的に調整する。尚、この搬送系を基板サイズに合わせて調整する作業は、オペレータが操作して行うようにしても良い。   Between the respective devices 11 to 14 constituting the production line, information on the number of productions of the same substrate type on which the upstream device has worked with respect to the downstream device from the upstream device is sequentially obtained. The downstream apparatus determines the timing of the setup change based on the production number information of the same substrate type received from the upstream apparatus and executes the setup change. Each of the devices 11 to 14 automatically switches the production program at the time of changeover and automatically adjusts the transport system according to the substrate size. The operation for adjusting the transport system according to the substrate size may be performed by an operator.

また、生産ラインのいずれかの装置間で回路基板の抜き取り又は追加があった場合に、オペレータが抜き取り又は追加の枚数の情報をホストコンピュータ１６に入力することで、ホストコンピュータ１６から回路基板の抜き取り又は追加が発生した位置の下流側の装置に対して抜き取り又は追加の枚数の情報を送信し、当該下流側の装置は、上流側の装置から受信した同一基板種の生産枚数情報を前記抜き取り又は追加の枚数分だけ増減させて書き替え、この書き替え後の同一基板種の生産枚数情報に基づいて段取替えのタイミングを判断して段取替えを実行する。前記抜き取り又は追加の枚数に応じて書き替えられた同一基板種の生産枚数情報は、順次、下流側の装置に送信される。尚、回路基板の抜き取り又は追加を検出する検出装置を搭載した生産ラインでは、この検出装置で回路基板の抜き取り又は追加を検出した時点で、この検出装置から下流側の装置に抜き取り又は追加の枚数の情報を自動的に送信するようにしても良い。   In addition, when a circuit board is extracted or added between any devices on the production line, the operator inputs information on the number of extracted or added circuit boards to the host computer 16 so that the circuit board is extracted from the host computer 16. Alternatively, information on the number of samples to be extracted or added is transmitted to the downstream apparatus at the position where the addition has occurred, and the downstream apparatus extracts the information on the number of production of the same substrate type received from the upstream apparatus. Rewriting is performed by increasing / decreasing by the additional number of sheets, and the stage replacement is executed by judging the timing of the stage replacement based on the production number information of the same substrate type after the rewriting. The production number information of the same substrate type rewritten according to the sampling or additional number is sequentially transmitted to the downstream apparatus. In addition, in a production line equipped with a detection device that detects the extraction or addition of a circuit board, when this detection device detects the extraction or addition of a circuit board, the number of sheets extracted or added from this detection device to a downstream device. The information may be automatically transmitted.

以上説明した生産ラインの自動段取替えを以下に具体的に説明する。
ホストコンピュータ１６は、生産ラインの稼働開始前又は稼働開始時の初期設定処理によって、各装置１１〜１４毎に段取替えの順序を指示する信号を送信する。これにより、生産ラインの稼働開始前又は稼働開始時に、各装置１１〜１４は、最初に生産する基板種に合わせて段取替えを実行する。そして、ホストコンピュータ１６は、生産ラインの稼働開始時に生産ラインの最上流に位置する半田ペースト印刷装置１１に対して最初に生産する基板種の生産枚数情報を送信する。 The automatic setup change of the production line described above will be specifically described below.
The host computer 16 transmits a signal instructing the order of the setup change for each of the devices 11 to 14 by the initial setting process before starting the operation of the production line or at the start of the operation. Thereby, before the operation start of a production line or at the time of an operation start, each apparatus 11-14 performs a setup change according to the board | substrate kind produced first. Then, the host computer 16 transmits the production number information of the board type to be produced first to the solder paste printing apparatus 11 located at the uppermost stream of the production line at the start of operation of the production line.

この後、半田ペースト印刷装置１１は、順次、搬入される回路基板に半田ペーストを印刷して、その回路基板を下流側の接着剤塗布装置１２へ搬送する。この際、半田ペースト印刷装置１１は、半田ペーストを印刷した回路基板の枚数をカウントして、印刷枚数がホストコンピュータ１６から受信した生産枚数情報に達した時点で、同一の基板種の印刷終了と判断して、下流側の接着剤塗布装置１２に対して同一基板種の生産枚数の情報を送信すると共に、次に生産する基板種に合わせて段取替えを実行する。   Thereafter, the solder paste printing device 11 sequentially prints the solder paste on the circuit board that is carried in, and conveys the circuit board to the adhesive application device 12 on the downstream side. At this time, the solder paste printing apparatus 11 counts the number of circuit boards on which the solder paste is printed, and when the number of printed sheets reaches the production number information received from the host computer 16, the printing of the same board type is completed. Determination is made, and information on the number of productions of the same substrate type is transmitted to the adhesive application device 12 on the downstream side, and a setup change is executed according to the substrate type to be produced next.

この半田ペースト印刷装置１１から搬送されてくる回路基板に接着剤を塗布する接着剤塗布装置１２も、接着剤を塗布した回路基板の枚数をカウントして、塗布枚数が上流側の半田ペースト印刷装置１１から受信した生産枚数情報に達した時点で、同一の基板種の塗布終了と判断して、下流側の第１の電子部品実装装置１３に対して同一基板種の生産枚数の情報を送信すると共に、次に生産する基板種に合わせて段取替えを実行する。   The adhesive application device 12 that applies an adhesive to the circuit board conveyed from the solder paste printing apparatus 11 also counts the number of circuit boards coated with the adhesive, and the number of applied solder paste printing apparatuses is upstream. When the production number information received from 11 is reached, it is determined that the application of the same substrate type has been completed, and information on the production number of the same substrate type is transmitted to the first electronic component mounting apparatus 13 on the downstream side. At the same time, the setup change is executed in accordance with the substrate type to be produced next.

この接着剤塗布装置１２から搬送されてくる回路基板に電子部品を実装する第１の電子部品実装装置１３も、同様に、電子部品を実装した回路基板の枚数をカウントして、実装枚数が上流側の接着剤塗布装置１２から受信した生産枚数情報に達した時点で、同一の基板種の実装終了と判断して、下流側の第２の電子部品実装装置１４に対して同一基板種の生産枚数の情報を送信すると共に、次に生産する基板種に合わせて段取替えを実行する。   Similarly, the first electronic component mounting apparatus 13 that mounts electronic components on the circuit board conveyed from the adhesive application device 12 similarly counts the number of circuit boards on which the electronic components are mounted, and the mounting number is upstream. When the production number information received from the side adhesive coating device 12 is reached, it is determined that the mounting of the same board type is completed, and the production of the same board type is performed for the second electronic component mounting apparatus 14 on the downstream side. The number of pieces of information is transmitted, and the setup change is executed in accordance with the type of board to be produced next.

この第１の電子部品実装装置１３から搬送されてくる回路基板に他の電子部品を実装する第２の電子部品実装装置１４も、同様に、電子部品を実装した回路基板の枚数をカウントして、実装枚数が上流側の第１の電子部品実装装置１３から受信した生産枚数情報に達した時点で、同一の基板種の実装終了と判断して、下流側のリフロー装置（図示せず）に対して同一基板種の生産枚数の情報を送信すると共に、次に生産する基板種に合わせて段取替えを実行する。   Similarly, the second electronic component mounting apparatus 14 for mounting other electronic components on the circuit board conveyed from the first electronic component mounting apparatus 13 counts the number of circuit boards on which the electronic components are mounted. When the number of mounted sheets reaches the production number information received from the first electronic component mounting apparatus 13 on the upstream side, it is determined that the mounting of the same board type is finished, and the downstream reflow apparatus (not shown) Information on the number of produced boards of the same board type is transmitted to the board, and the setup change is executed in accordance with the board type to be produced next.

また、生産ラインのいずれかの装置間で回路基板の抜き取り又は追加があった場合に、オペレータが抜き取り又は追加の枚数の情報をホストコンピュータ１６に入力することで、ホストコンピュータ１６から回路基板の抜き取り又は追加が発生した位置の下流側の装置に対して抜き取り又は追加の枚数の情報を送信する。そして、ホストコンピュータ１６から抜き取り又は追加の枚数の情報を受信した下流側の装置は、上流側の装置から受信した同一基板種の生産枚数情報を前記抜き取り又は追加の枚数分だけ増減させて書き替え、この書き替え後の同一基板種の生産枚数情報に基づいて段取替えのタイミングを判断して段取替えを実行すると共に、この書き替えた同一基板種の生産枚数情報を、順次、下流側の装置に送信する。   In addition, when a circuit board is extracted or added between any devices on the production line, the operator inputs information on the number of extracted or added circuit boards to the host computer 16 so that the circuit board is extracted from the host computer 16. Alternatively, information on the number of samples extracted or added is transmitted to a device downstream of the position where the addition has occurred. Then, the downstream apparatus that has received the information of the extracted or added number of sheets from the host computer 16 rewrites the production number information of the same substrate type received from the upstream apparatus by increasing or decreasing by the amount of the extracted or added number of sheets. Based on the production number information of the same substrate type after the rewriting, the timing of the setup change is determined and the setup change is executed, and the production number information of the rewritten same board type is sequentially transmitted to the downstream apparatus. Send to.

以上説明した本実施例では、生産ラインの各装置１１〜１４にＩＤ読取装置が無くても、生産ラインの各装置１１〜１４が独自に段取替えタイミングを判断して自動的に段取替えを実行することができ、低コスト化の要求を満たすことができる。   In the present embodiment described above, even if each device 11-14 on the production line does not have an ID reader, each device 11-14 on the production line independently determines the setup change timing and automatically executes the setup change. Can meet the demand for cost reduction.

しかも、本実施例では、生産ラインのいずれかの装置間で回路基板の抜き取り又は追加があった場合にその下流側の装置に対して抜き取り又は追加の枚数の情報を送信するようにしたので、生産ラインのいずれかの装置間で不良発生等による回路基板の抜き取り又は追加があった場合でも、その下流側の装置の段取替えのタイミングを正確に判断して段取替えを実行することができる。   In addition, in this embodiment, when the circuit board is extracted or added between any of the devices on the production line, information on the number of extracted or added sheets is transmitted to the downstream device. Even when a circuit board is extracted or added due to a defect or the like between any of the devices on the production line, the setup change can be executed by accurately determining the setup change timing of the downstream apparatus.

尚、本実施例では、生産ラインの稼働開始前又は稼働開始時の初期設定処理によって、ホストコンピュータ１６から各装置１１〜１４毎に段取替えの順序を指示する信号を送信するようにしたが、生産ラインの一部の装置又は全ての装置に対してオペレータが個別に段取替えの順序を指示する操作を行うようにしても良い。   In the present embodiment, the host computer 16 transmits a signal instructing the order of setup change for each of the devices 11 to 14 by the initial setting process before the start of operation of the production line or at the start of operation. The operator may individually perform an operation of instructing the order of setup change for a part or all of the devices on the production line.

或は、ホストコンピュータ１６から最上流の半田ペースト印刷装置１１に同一基板種の生産枚数情報と段取替え順序の情報を送信し、順次、この同一基板種の生産枚数情報と段取替え順序の情報を下流側の装置１２〜１４に送信するようにしても良い。この場合は、予め、各装置１１〜１４毎に段取替えの順序を指示しておく必要はない。   Alternatively, the host computer 16 sends the production board number information and setup change order information of the same board type to the most upstream solder paste printing apparatus 11, and sequentially outputs the production board number information and setup change order information of the same board type. You may make it transmit to the apparatus 12-14 of a downstream side. In this case, it is not necessary to instruct the order of the setup change for each of the devices 11 to 14 in advance.

また、本実施例では、ホストコンピュータ１６から装置側に送信されてくる回路基板の抜き取り又は追加の枚数の情報に基づいて装置側で書き替えた同一基板種の生産枚数情報を、順次、下流側の装置に送信するようにしたが、回路基板の抜き取り又は追加が発生した位置よりも下流側に存在する全ての装置に対してホストコンピュータ１６から個別に抜き取り又は追加の枚数の情報を送信し、各装置毎に同一基板種の生産枚数を抜き取り又は追加の枚数分だけ増減させる演算を行わせるようにしても良い。   Further, in this embodiment, the production board number information of the same board type rewritten on the apparatus side based on the information on the extraction or additional number of circuit boards transmitted from the host computer 16 to the apparatus side is sequentially transferred to the downstream side. However, the information on the number of sheets to be extracted or added individually is transmitted from the host computer 16 to all apparatuses existing downstream from the position where the circuit board has been extracted or added. You may make it perform the calculation which extracts or increases / decreases only the production | generation number of the same board | substrate type for every apparatus by an additional number.

また、本実施例では、上流側の装置が同一の基板種の生産を終了した時点でその下流側の装置に当該同一基板種の生産枚数情報に送信するようにしたが、この生産枚数情報の送信タイミングは適宜変更しても良く、例えば、上流側の装置が同一基板種の生産枚数情報を受信した時点で直ちに下流側の装置に送信するようにしたり、或は、上流側の装置で生産する同一基板種の残り枚数が所定枚数まで減った時点で当該同一基板種の生産枚数情報を下流側の装置に送信するようにしても良い。   In this embodiment, when the upstream apparatus finishes the production of the same substrate type, the production number information of the same substrate type is transmitted to the downstream apparatus. The transmission timing may be changed as appropriate. For example, when the upstream device receives the production number information of the same board type, the transmission timing is immediately transmitted to the downstream device, or the upstream device produces the information. When the remaining number of the same substrate type is reduced to a predetermined number, the production number information of the same substrate type may be transmitted to the downstream apparatus.

その他、本発明は、生産ラインを構成する装置の種類や数を適宜変更しても良い等、種々変更して実施できることは言うまでもない。   In addition, it goes without saying that the present invention can be implemented with various changes such as the type and number of devices constituting the production line may be changed as appropriate.

本発明の一実施例を示す生産ラインの構成を概念的に示す図である。It is a figure which shows notionally the structure of the production line which shows one Example of this invention.

符号の説明Explanation of symbols

１１…半田ペースト印刷装置、１２…接着剤塗布装置、１３…第１の電子部品実装装置、１４…第２の電子部品実装装置、１５…バッファ、１６…ホストコンピュータ   DESCRIPTION OF SYMBOLS 11 ... Solder paste printing apparatus, 12 ... Adhesive application apparatus, 13 ... 1st electronic component mounting apparatus, 14 ... 2nd electronic component mounting apparatus, 15 ... Buffer, 16 ... Host computer

Claims (3)

電子部品を実装した電子部品実装基板を生産するための複数の工程を順番に実行する複数の装置を、当該基板の搬送経路に沿って配置した生産ラインの自動段取替えシステムにおいて、
生産ラインを構成する複数の装置間において、順次、上流側の装置からその下流側の装置に対して前記上流側の装置が作業した同一基板種の生産枚数の情報を送信し、
前記下流側の装置は、前記上流側の装置から受信した前記同一基板種の生産枚数情報に基づいて段取替えのタイミングを判断して段取替えを実行することを特徴とする生産ラインの自動段取替えシステム。 In an automatic setup change system for a production line in which a plurality of devices for sequentially executing a plurality of steps for producing an electronic component mounting board on which electronic components are mounted are arranged along the transport path of the board,
Between a plurality of devices constituting a production line, sequentially transmit information on the number of production of the same substrate type worked by the upstream device from the upstream device to the downstream device,
The downstream apparatus determines the timing of setup change based on the production number information of the same substrate type received from the upstream apparatus, and executes setup change. system. 前記上流側の装置は、同一基板種の生産を終了した時点で当該同一基板種の生産枚数情報を前記下流側の装置に送信することを特徴とする請求項１に記載の生産ラインの自動段取替えシステム。   2. The automatic stage of a production line according to claim 1, wherein when the production of the same substrate type is completed, the upstream device transmits the production number information of the same substrate type to the downstream device. Replacement system. 生産ラインのいずれかの装置間で回路基板の抜き取り又は追加があった場合にその下流側の装置に対して抜き取り又は追加の枚数の情報を送信し、当該下流側の装置は、前記上流側の装置から受信した前記同一基板種の生産枚数情報を前記抜き取り又は追加の枚数分だけ増減させて段取替えのタイミングを判断することを特徴とする請求項１又は２に記載の生産ラインの自動段取替えシステム。   When a circuit board is extracted or added between any of the devices on the production line, information on the number of extracted or added circuit boards is transmitted to the downstream device, and the downstream device is connected to the upstream device. 3. The automatic setup change of a production line according to claim 1 or 2, wherein the number of pieces of production of the same substrate type received from the apparatus is increased or decreased by the number of the extracted or added pieces to determine the changeover timing. system.
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JP2009105107A (en) * 2007-10-22 2009-05-14 Panasonic Corp Electronic component mounting system, and facility arrangement information generating method
JP2010258113A (en) * 2009-04-22 2010-11-11 Hitachi High-Tech Instruments Co Ltd Method for controlling printed board production line
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