JP2007220969A - 電子部品の樹脂封止方法 - Google Patents
電子部品の樹脂封止方法 Download PDFInfo
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Abstract
【解決手段】電子部品22を装着した基板21を上金型15に固定し、下金型7に形成されたキャビティ部10に樹脂材料37を樹脂材料投入装置30により配設し加熱溶融化して溶融樹脂とし、前記上金型15及び前記下金型7を型閉めすることにより、前記電子部品22を前記溶融樹脂に浸漬して樹脂封止する電子部品の樹脂封止方法であって、前記樹脂材料投入装置30に於いて、前記樹脂材料35を、前記下金型7の前記キャビティ部10と略同一の大きさを有する樹脂材料収容部33に配設し、加圧手段31により前記樹脂材料収容部33内に於いて均一に加圧し、振動手段により前記樹脂材料収容部33内に於いて略均一に分散し、前記樹脂材料収容部33を開放することにより、前記樹脂材料35を前記下金型7の前記キャビティ部10に収容する。
【選択図】図10
Description
まず、本発明の電子部品の樹脂封止方法の第1の実施の形態について図8乃至図15を参照して説明する。
次に、本発明の電子部品の樹脂封止方法の第2の実施の形態について図16乃至図20を参照して説明する。なお、前記第1の実施の形態で説明した部位に対応する部位については同一の符号を付し、その説明を省略する。
次に、本発明の電子部品の樹脂封止方法の第3の実施の形態について図21乃至図27を参照して説明する。なお、前記第1、第2の実施の形態で説明した部位と同じ部位については同一の符号を付し、その説明を省略する。
例えば図23に示す例にあっては、3番及び12番と番号が付けされた箇所に半導体素子22が搭載されていないことが認識される(位置情報)。
次に、本発明の電子部品の樹脂封止方法の第4の実施の形態について図28乃至図30を参照して説明する。なお、前記第3の実施の形態で説明した部位に対応する部位については同一の符号を付し、その説明を省略する。
次に、本発明の電子部品の樹脂封止方法の第5の実施の形態について図31乃至図34を参照して説明する。なお、前記実施の形態にて説明した部位と同じ部位については同一の符号を付し、その説明を省略する。
次に、本発明の樹脂封止方法を用いた半導体装置の製造方法の例について、図35を参照して説明する。
(付記1) 上金型に複数個の電子部品が搭載された基板を装着し、下金型のキャビティ部に収容された樹脂材料を溶融し、前記上金型に保持された電子部品を前記溶融された樹脂に浸漬して樹脂封止する電子部品の樹脂封止方法であって、
前記樹脂材料は、予め封止用樹脂投入装置に於いて加圧処理、及び分散処理がなされた後、前記下金型のキャビティ部に収容されることを特徴とする電子部品の樹脂封止方法。
(付記2) 前記封止用樹脂投入装置に於ける樹脂材料に対する加圧処理は、当該封止用樹脂投入装置に於ける蓋部材を用いて行うことを特徴とする付記1記載の電子部品の樹脂封止方法。
(付記3) 前記封止用樹脂投入装置に於ける樹脂材料に対する分散処理は、当該封止用樹脂投入装置に振動を与えてなされることを特徴とする付記1記載の電子部品の樹脂封止方法。
(付記4) 前記封止用樹脂投入装置に於いて加圧処理、分散処理がなされた封止用樹脂は、当該封止用樹脂投入装置内から落下して、下金型のキャビティ部に収容されることを特徴とする付記1記載の電子部品の樹脂封止方法。
(付記5) 前記蓋部材には、前記基板に搭載された電子部品の搭載位置に対応して、当該電子部品の体積に対応する体積を有する突起が配設されてなることを特徴とする付記1記載の電子部品の樹脂封止方法。
(付記6) 前記蓋部材には、前記基板に搭載された電子部品の体積に対応する体積を有する突起が、当該電子部品の有無に対応して選択的に突出可能に配設されてなることを特徴とする付記1記載の電子部品の樹脂封止方法。
(付記7) 前記基板に装着される前記電子部品が有る箇所に対しては、前記突起部を突出させ、
前記基板に装着される前記電子部品が無い箇所に対しては、前記突起部を突出させないことを特徴とする付記6記載の電子部品の樹脂封止方法。
(付記8) 前記樹脂材料は、前記基板に搭載されるべき電子部品が全数搭載されている場合に適用される樹脂材料量に、前記基板に装着されていない電子部品の体積に相当する樹脂材料量が加えられて、前記樹脂材料収容部に収容されることを特徴とする付記1記載の電子部品の樹脂封止方法。
(付記9) 登録部に登録されている前記電子部品1個分の体積に相当する前記樹脂材料の重量についての情報と、
実際に前記基板に装着されていない電子部品の数についての情報と、に基づいて、
実際に前記基板に装着されていない前記電子部品の体積に相当する量の樹脂材料の重量を算出することを特徴とする付記8記載の電子部品の樹脂封止方法。
(付記10) 上金型に複数個の電子部品が搭載された基板を装着し、下金型のキャビティ部に収容された樹脂材料を溶融し、前記上金型に保持された電子部品を前記溶融された樹脂に浸漬して樹脂封止する電子部品の樹脂封止方法であって、
前記樹脂材料は、前記基板に搭載された電子部品の搭載位置に対応し且つ当該電子部品の体積に対応する容積を有する凹部が配設されて固化された後、前記下金型のキャビティ部に収容されることを特徴とする電子部品の樹脂封止方法。
(付記11) 前記樹脂材料を固化するために用いられる金型部材には、前記基板に搭載された電子部品の体積に対応する体積を有する突起が、当該電子部品の有無に対応して選択的に突出可能に配設されてなることを特徴とする付記10記載の電子部品の樹脂封止方法。
(付記12) 前記基板に装着される前記電子部品が有る箇所に対しては、前記突起部を突出させ、
前記基板に装着される前記電子部品が無い箇所に対しては、前記突起部を突出させないことを特徴とする付記11記載の電子部品の樹脂封止方法。
(付記13) 前記樹脂材料は、前記基板に搭載されるべき電子部品が全数搭載されている場合に適用される樹脂材料量に、前記基板に装着されていない電子部品の体積に相当する樹脂材料量が加えられて、前記樹脂材料収容部に収容されることを特徴とする付記10記載の電子部品の樹脂封止方法。
(付記14) 登録部に登録されている前記電子部品1個分の体積に相当する前記樹脂材料の重量についての情報と、
実際に前記基板に装着されていない電子部品の数についての情報と、に基づいて、
実際に前記基板に装着されていない前記電子部品の体積に相当する量の樹脂材料の重量を算出することを特徴とする付記13記載の電子部品の樹脂封止方法。
(付記15)
上金型に複数個の電子部品が搭載された基板を装着し、下金型のキャビティ部に収容された樹脂材料を溶融し、前記上金型に保持された電子部品を前記溶融された樹脂に浸漬して樹脂封止する電子部品の樹脂封止方法であって、
前記基板に搭載された電子部品の体積に対応する体積を有する突起が、当該電子部品の有無に対応して選択的に突出可能に配設された下金型のキャビティ部に、樹脂材料を収容して溶融し、
当該溶融樹脂中への前記電子部品の浸漬に対応させて、前記突起の突出量を減少させることを特徴とする電子部品の樹脂封止方法。
10 キャビティ部
15 上金型
21 配線基板
22 半導体素子
23 ボンディングワイヤ
30、40、50、200 封止用樹脂投入装置
33、255 封止用樹脂収容部
35 封止用樹脂
42、52、212 突起部
45 凹部
70 データベース
210 雄金型
250 雌金型
Claims (9)
- 上金型に複数個の電子部品が搭載された基板を装着し、下金型のキャビティ部に収容された樹脂材料を溶融し、前記上金型に保持された電子部品を前記溶融された樹脂に浸漬して樹脂封止する電子部品の樹脂封止方法であって、
前記樹脂材料は、予め封止用樹脂投入装置に於いて加圧処理、及び分散処理がなされた後、前記下金型のキャビティ部に収容されることを特徴とする電子部品の樹脂封止方法。 - 前記封止用樹脂投入装置に於ける樹脂材料に対する加圧処理は、当該封止用樹脂投入装置に於ける蓋部材を用いて行うことを特徴とする請求項1記載の電子部品の樹脂封止方法。
- 前記封止用樹脂投入装置に於ける樹脂材料に対する分散処理は、当該封止用樹脂投入装置に振動を与えてなされることを特徴とする請求項1記載の電子部品の樹脂封止方法。
- 前記封止用樹脂投入装置に於いて加圧処理、分散処理がなされた封止用樹脂は、当該封止用樹脂投入装置内から落下して、下金型のキャビティ部に収容されることを特徴とする請求項1記載の電子部品の樹脂封止方法。
- 前記蓋部材には、前記基板に搭載された電子部品の搭載位置に対応して、当該電子部品の体積に対応する体積を有する突起が配設されてなることを特徴とする請求項1記載の電子部品の樹脂封止方法。
- 前記蓋部材には、前記基板に搭載された電子部品の体積に対応する体積を有する突起が、当該電子部品の有無に対応して選択的に突出可能に配設されてなることを特徴とする請求項1記載の電子部品の樹脂封止方法。
- 前記樹脂材料は、前記基板に搭載されるべき電子部品が全数搭載されている場合に適用される樹脂材料量に、前記基板に装着されていない電子部品の体積に相当する樹脂材料量が加えられて、前記樹脂材料収容部に収容されることを特徴とする請求項1記載の電子部品の樹脂封止方法。
- 上金型に複数個の電子部品が搭載された基板を装着し、下金型のキャビティ部に収容された樹脂材料を溶融し、前記上金型に保持された電子部品を前記溶融された樹脂に浸漬して樹脂封止する電子部品の樹脂封止方法であって、
前記樹脂材料は、前記基板に搭載された電子部品の搭載位置に対応し且つ当該電子部品の体積に対応する容積を有する凹部が配設されて固化された後、前記下金型のキャビティ部に収容されることを特徴とする電子部品の樹脂封止方法。 - 上金型に複数個の電子部品が搭載された基板を装着し、下金型のキャビティ部に収容された樹脂材料を溶融し、前記上金型に保持された電子部品を前記溶融された樹脂に浸漬して樹脂封止する電子部品の樹脂封止方法であって、
前記基板に搭載された電子部品の体積に対応する体積を有する突起が、当該電子部品の有無に対応して選択的に突出可能に配設された下金型のキャビティ部に、樹脂材料を収容して溶融し、
当該溶融樹脂中への前記電子部品の浸漬に対応させて、前記突起の突出量を減少させることを特徴とする電子部品の樹脂封止方法。
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CN101026105A (zh) | 2007-08-29 |
US20070196957A1 (en) | 2007-08-23 |
KR20070082838A (ko) | 2007-08-22 |
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US7923303B2 (en) | 2011-04-12 |
CN101026105B (zh) | 2011-01-26 |
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