JP2007203258A - Chuck table for base material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chuck table for a base material for horizontally sucking and supporting the plate-like base material, in which the flatness of a surface on which the base material is sucked and supported can be highly accurately adjusted without enhancing the machining accuracy of the surface. <P>SOLUTION: The chuck table 13 is provided with a surface plate 14 with the supporting surface 14a on which the base material 8 is placed, a Bessel point support 15 for supporting the surface plate 14 by three Bessel points P and a plurality of adjustable supports 16 for supporting the surface plate 14 in a region except the Bessel points and capable of adjusting the supporting height of the surface plate 14. The flatness of the supporting surface 14a of the surface plate is adjusted by the adjustment of the supporting height by the adjustable support 16. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、ガラス基板等の板状の基材を水平に載せて支持するために用いる基材用チャック台に関し、特に、１辺が１５００ｍｍ以上となるような大型の基材を支持するために用いるのに好適な基材用チャック台に関する。   The present invention relates to a base material chuck base used to horizontally support a plate-like base material such as a glass substrate, and particularly to support a large base material having a side of 1500 mm or more. The present invention relates to a substrate chuck base suitable for use.

従来より、ガラス基板等の板状の基材を水平に且つ高精度の平面度となるように支持する基材用チャック台が使用されており、その一つの例がダイコート方式の塗工装置に見られる。図６は従来の基材用チャック台を用いたダイコート方式の塗工装置を示す概略斜視図、図７はその主要部分の概略断面図である。図６、図７において、塗工装置１は、ベース２と、そのベース２に保持され、上面に、塗工を施されるべきガラス基板等の板状の基材８を水平に吸着支持する支持面３ａを備えたチャック台３と、ベース２の両側縁上面に設けられたガイド手段４と、そのガイド手段４に往復動するように保持された移動台５と、その移動台５を往復移動させる駆動装置（図示せず）と、移動台５に昇降するように設けられたヘッド保持部材６と、そのヘッド保持部材６を昇降させる駆動装置（図示せず）と、ヘッド保持部材６に保持され、塗工液を膜状に吐出するスリットを備えたダイヘッド７と、そのダイヘッド７に塗工液を供給する液供給系（図示せず）等を備えており、塗工に当たっては、チャック台３の支持面３ａに基材８を吸着支持させた状態で、ダイヘッド７を基材８の塗工開始位置の上方に位置決めし、その位置でダイヘッド７を、基材８に対する塗工に適した高さ位置（例えば、ダイヘッド７の吐出スリット下端と基材８上面の距離が３０μｍ程度となる位置）に降下させ、ダイヘッド７から塗工液を膜状に吐出しながらそのダイヘッド７を基材８に沿って移動させて行くことで、基材８の上面に塗工を行っていた。   Conventionally, a substrate chuck base that supports a plate-like substrate such as a glass substrate horizontally and with high precision flatness has been used, one example of which is in a die coating type coating apparatus. It can be seen. FIG. 6 is a schematic perspective view showing a conventional die coating type coating apparatus using a substrate chuck base, and FIG. 7 is a schematic cross-sectional view of the main part thereof. 6 and 7, a coating apparatus 1 is supported by a base 2 and a plate-like base material 8 such as a glass substrate to be coated on the upper surface of the base 2 and horizontally supports it. The chuck table 3 provided with the support surface 3a, the guide means 4 provided on the upper surfaces of both side edges of the base 2, the moving table 5 held so as to reciprocate with the guide means 4, and the moving table 5 reciprocated. A drive device (not shown) to be moved, a head holding member 6 provided so as to move up and down on the moving table 5, a drive device (not shown) to raise and lower the head holding member 6, and a head holding member 6 A die head 7 provided with a slit for holding and discharging a coating liquid into a film, and a liquid supply system (not shown) for supplying the coating liquid to the die head 7 are provided. In a state where the base material 8 is adsorbed and supported on the support surface 3a of the table 3 The die head 7 is positioned above the coating start position of the base material 8, and the die head 7 is positioned at the height position suitable for coating on the base material 8 (for example, the lower end of the discharge slit of the die head 7 and the upper surface of the base material 8. Is moved to a position where the distance is about 30 μm), and the die head 7 is moved along the substrate 8 while discharging the coating liquid from the die head 7 into a film shape. I was working.

この種の塗工装置において、基材８の上面に一定膜厚の塗工を行うには、ダイヘッド７の吐出スリット下端と基材８上面との距離（塗布ギャップ）が高精度で一定となっている必要があり、そのためには、基材８の上面に精密な平面度が要求される。そこで、従来はチャック台３として、グラナイトなどの石定盤が用いられ、その上面を高精度に機械加工して高精度の平面度を得ている。また、チャック台３に用いられる石定盤は、通常、３００ｍｍ程度の厚い、剛性の大きいものであり、ベース２に保持させた際に自重等によってたわんで上面の平面度が低下することが無いようにしている。   In this type of coating apparatus, in order to apply a constant film thickness on the upper surface of the substrate 8, the distance (application gap) between the lower end of the discharge slit of the die head 7 and the upper surface of the substrate 8 is constant with high accuracy. For this purpose, precise flatness is required on the upper surface of the substrate 8. Therefore, conventionally, a stone surface plate such as granite is used as the chuck base 3, and the upper surface thereof is machined with high accuracy to obtain high accuracy flatness. Further, the stone surface plate used for the chuck base 3 is generally thick and has a large rigidity of about 300 mm, and the flatness of the upper surface is not lowered due to its own weight when held on the base 2. I am doing so.

近年、塗工装置で扱う基材の大型化が進んでいる。例えば、大型基材を扱う例として、液晶ディスプレイに用いられるカラーフィルターが挙げられ、近年、第６世代（１５００×１８００ｍｍ）の開発が進んでいる。この第６世代に対応するには、石定盤で形成するチャック台３の寸法も、１５００×１８００ｍｍ以上の大きさが必要となる。現在の研磨技術では、このような大面積の石定盤の平面度は、２０μｍが限度である。石定盤が仮に高精度の２０μｍの平面度の場合、塗工開始時（ビード形成時）のダイヘッド７の吐出スリット下端と基材８上面との距離を３０μｍに設定して塗工を行うと、大型の基材８に厚みむらが１０μｍあった場合、ダイヘッド７が基材８に沿って移動する途中で、ダイヘッド７と基材８が接触してしまうことがある。よって、ダイヘッド７が傷ついて再研磨に時間を要すると共に高額な費用も発生する。接触しない場合でも塗布ギャップのばらつきが大きくなり、膜厚ばらつき悪化が懸念される。   In recent years, the size of base materials handled by coating apparatuses has been increasing. For example, a color filter used for a liquid crystal display can be cited as an example of handling a large base material, and in recent years, development of the sixth generation (1500 × 1800 mm) is progressing. In order to cope with the sixth generation, the size of the chuck base 3 formed of a stone surface plate is also required to be 1500 × 1800 mm or more. With the current polishing technique, the flatness of such a large stone surface plate is limited to 20 μm. If the stone surface plate has a high-precision flatness of 20 μm, coating is performed by setting the distance between the lower end of the discharge slit of the die head 7 and the upper surface of the substrate 8 to 30 μm at the start of coating (during bead formation). When the large substrate 8 has a thickness unevenness of 10 μm, the die head 7 and the substrate 8 may come into contact with each other while the die head 7 moves along the substrate 8. Therefore, the die head 7 is damaged, and it takes time for re-polishing and high costs are also incurred. Even when they are not in contact with each other, the variation in the coating gap becomes large, and there is a concern that the variation in film thickness may be worsened.

石定盤の平面度は限界の２０μｍで製作し、基材８の厚みむらが１０μｍ以内におさまらない場合でも、塗布ギャップを３０μｍを越える大きさに設定すれば、ダイヘッド７と基材８との接触の危険は回避できる。しかし、この場合には、塗布開始時の厚みむらを引き起こす割合が高くなる。また、ビード形成時のギャップは３０μｍ程度に設定しておき、ダイヘッド７を基材８に沿って移動させる際に、ダイヘッド７から基材８までの間隔をレーザセンサ等で測定し、その距離が一定になるようにダイヘッド７の高さ位置をフィードバック制御することも考えられるが、この制御を行っても、塗布幅方向での塗布ギャップのばらつきは解消できず、塗布幅方向での膜厚ばらつきが発生する。   When the flatness of the stone surface plate is manufactured with a limit of 20 μm, and the thickness unevenness of the substrate 8 does not fall within 10 μm, if the coating gap is set to a size exceeding 30 μm, the die head 7 and the substrate 8 The risk of contact can be avoided. However, in this case, the ratio causing the thickness unevenness at the start of coating increases. Further, the gap at the time of bead formation is set to about 30 μm, and when the die head 7 is moved along the base material 8, the distance from the die head 7 to the base material 8 is measured by a laser sensor or the like, and the distance is Although it is conceivable to feedback control the height position of the die head 7 so as to be constant, even if this control is performed, variations in the coating gap in the coating width direction cannot be eliminated, and film thickness variations in the coating width direction. Will occur.

本発明は、かかる状況に鑑みてなされたもので、基材を吸着支持する面の平面度を、機械加工精度を上げなくても、２０μｍ未満となるような高精度に調整することの可能な基材用チャック台を提供することを課題とする。   The present invention has been made in view of such a situation, and it is possible to adjust the flatness of the surface that supports the substrate by suction with high accuracy so as to be less than 20 μm without increasing the machining accuracy. An object is to provide a chuck base for a substrate.

本発明は、上記課題を解決するため、チャック台を、基材を載置するための支持面を備えた定盤と、前記定盤をベッセル点で支持する３個のベッセル点支持具と、前記定盤を、ベッセル点以外の領域で支持すると共に前記定盤の支持高さを調整可能な複数の可調整支持具を備えた構成とし、該可調整支持具による調整によって前記定盤の支持面の平面度を調整可能としたものである。   In order to solve the above-mentioned problems, the present invention provides a surface plate provided with a support surface for placing a base material on a chuck table, three vessel point support tools for supporting the surface plate at a vessel point, The surface plate is supported by a region other than the vessel point and includes a plurality of adjustable support devices capable of adjusting the support height of the surface plate, and the surface plate is supported by adjustment by the adjustable support device. The flatness of the surface can be adjusted.

ここで、前記可調整支持具として、圧電素子を用いることが好ましい。   Here, it is preferable to use a piezoelectric element as the adjustable support.

また、前記３個のベッセル点支持具の少なくとも２個が、前記定盤の支持高さを調整可能な機能を備えた構成とすることが好ましい。   Moreover, it is preferable that at least two of the three Bessel point supports have a function capable of adjusting the support height of the surface plate.

更に、前記定盤として、厚さ７５〜１２５ｍｍの石定盤を用いることが好ましい。   Furthermore, it is preferable to use a stone surface plate having a thickness of 75 to 125 mm as the surface plate.

本発明の基材用チャック台は、定盤を、該定盤の３点のベッセル点に配置したベッセル点支持具によって支持する構成としたことで、定盤を最もたわみが小さくなる形態で支持して定盤の基準位置を設定でき、ベッセル点以外の領域の複数箇所に配置した可調整支持具で支持高さを調整することで、定盤上面、すなわち基材を支持するための支持面の平面度を調整することができ、定盤支持面の機械加工によって得た平面度よりも、更に高精度の平面度を得ることができる。しかも、ベッセル点支持具で定盤の３点のベッセル点を支持しているので、定盤の他の領域のたわみはきわめて小さくなっており、可調整支持具による調整量はきわめて小さくてよく、容易に調整できる。かくして、大型の基材を支持できるよう定盤１４のサイズを大きくし、その支持面の機械加工精度を従来と同程度に、例えば、平面度２０μｍ程度とした場合においても、支持面の平面度を２０μｍ未満の高精度に容易に調整することができ、大型の基材でも高精度の平面度となるように支持することができる。また、定盤の加工精度を２０μｍ程度の高精度としなくても、支持面の平面度を２０μｍ未満の高精度に調整することもでき、定盤の機械加工精度を下げることで、機械加工のコストを削減できる。更に、定盤の支持面の平面度を向上できるのみならず、支持面に基材を支持した状態で、基材上面の平面度を測定しながら可調整支持具で定盤の支持高さを調整することもでき、これによって、基材に厚さむらがあっても、その基材の上面の平面度を高精度で調整することができる。   The substrate chuck base of the present invention is configured to support the surface plate in a form in which the deflection is minimized by adopting a configuration in which the surface plate is supported by the vessel point support tools arranged at the three vessel points of the surface plate. The reference position of the surface plate can be set, and the height of the surface plate, that is, the support surface for supporting the base material is adjusted by adjusting the support height with an adjustable support tool arranged at multiple locations other than the vessel point The flatness of the platen can be adjusted, and flatness with higher accuracy can be obtained than the flatness obtained by machining the support surface of the surface plate. Moreover, since the three vessel points of the surface plate are supported by the vessel point support, the deflection of the other areas of the surface plate is extremely small, and the amount of adjustment by the adjustable support may be very small. Easy to adjust. Thus, even when the size of the surface plate 14 is increased so that a large base material can be supported and the machining accuracy of the support surface is about the same as the conventional one, for example, the flatness is about 20 μm, the flatness of the support surface. Can be easily adjusted to a high accuracy of less than 20 μm, and even a large-sized substrate can be supported so as to have a high degree of flatness. In addition, even if the processing accuracy of the surface plate is not as high as about 20 μm, the flatness of the support surface can be adjusted to a high accuracy of less than 20 μm. Cost can be reduced. In addition to improving the flatness of the support surface of the surface plate, the height of the surface plate can be adjusted with an adjustable support while measuring the flatness of the upper surface of the substrate while the substrate is supported on the support surface. Therefore, even if the substrate has a thickness unevenness, the flatness of the upper surface of the substrate can be adjusted with high accuracy.

図１は本発明の好適な実施の形態に係る基材用チャック台を用いたダイコート方式の塗工装置を示す概略斜視図、図２はその塗工装置の主要部分の概略断面図、図３はその塗工装置を、図２のＡ−Ａ線に沿って切断して示す概略断面図、図４は図１に示す塗工装置に用いている定盤とそれを支持するベッセル点支持具及び可調整支持具の位置関係を示す概略平面図である。全体を参照符号１Ａで示す塗工装置は、ベース２と、そのベース２に保持され、上面に、塗工を施されるべきガラス基板等の板状の基材８を水平に吸着支持するためのチャック台１３と、ベース２の両側縁上面に設けられたガイド手段４と、そのガイド手段４に往復動するように保持された移動台５と、その移動台５を往復移動させる駆動装置（図示せず）と、移動台５に昇降するように設けられたヘッド保持部材６と、そのヘッド保持部材６を昇降させる駆動装置（図示せず）と、ヘッド保持部材６に保持され、塗工液を膜状に吐出するスリットを備えたダイヘッド７と、そのダイヘッド７に塗工液を供給する液供給系（図示せず）等を備えている。   FIG. 1 is a schematic perspective view showing a die coating type coating apparatus using a substrate chuck base according to a preferred embodiment of the present invention, FIG. 2 is a schematic sectional view of a main part of the coating apparatus, and FIG. Fig. 4 is a schematic sectional view showing the coating apparatus cut along the line AA in Fig. 2, and Fig. 4 is a surface plate used in the coating apparatus shown in Fig. 1 and a vessel point support for supporting the platen. It is a schematic plan view which shows the positional relationship of an adjustable support tool. The coating apparatus shown as a whole by reference numeral 1A is used for horizontally adsorbing and supporting a base 2 and a plate-like base material 8 such as a glass substrate to be coated, which is held on the base 2 and is to be coated. Chuck base 13, guide means 4 provided on the upper surfaces of both side edges of the base 2, a moving base 5 held so as to reciprocate with the guide means 4, and a drive device (for reciprocating the moving base 5) (Not shown), a head holding member 6 provided so as to be moved up and down on the movable table 5, a drive device (not shown) for moving the head holding member 6 up and down, and a head holding member 6 to hold the coating A die head 7 having a slit for discharging the liquid into a film and a liquid supply system (not shown) for supplying a coating liquid to the die head 7 are provided.

チャック台１３は、基材８を載置するための支持面１４ａを備えた定盤１４と、その定盤１４を３個のベッセル点Ｐで３点支持するように、ベース２に取り付けられた３個のベッセル点支持具１５と、その定盤１４を、ベッセル点以外の複数の領域で支持するようにベース２に取り付けられた可調整支持具１６を備えている。ここで、定盤１４としては、従来用いていたような厚さ３００ｍｍ以上もあるような剛性の大きい石定盤に代えて、適度に剛性の低いものを用い、その定盤１４をベッセル点Ｐで３点支持した場合に、支持されていない領域に自重による多少のたわみが生じるようにしている。ここで、定盤１４に生じるたわみとしては、最もたわみの大きい領域で５〜２０μｍ程度のたわみが生じるようにすることが好ましい。定盤１４の剛性が大きく、最もたわみの大きい領域でも５μｍよりも小さいたわみしか生じないような場合には、定盤１４の剛性が大きいため可調整支持具１６による定盤上面１４ａの平面度調整が困難となる。一方、定盤１４の剛性が小さく、最もたわみの大きい領域で２０μｍを越えるようなたわみが生じる場合には、可調整支持具１６を多数、小ピッチで配置しなければ定盤上面１４ａの良好な平面度調整ができない。このため、定盤１４は、上記したように、最もたわみの大きい領域で５〜２０μｍ程度のたわみが生じるような剛性のものとすることが好ましい。定盤１４として用いるのに好適なものとしては、厚さ７５〜１２５ｍｍ程度のグラナイトなどの石定盤を例示できる。定盤１４には、基材８を吸着支持するための真空吸着穴（図示せず）が形成され、真空供給源（図示せず）に連結されている。   The chuck base 13 is attached to the base 2 so as to support the surface plate 14 provided with a support surface 14a for placing the substrate 8 and the surface plate 14 at three Bessel points P. Three vessel point supports 15 and an adjustable support 16 attached to the base 2 so as to support the surface plate 14 in a plurality of regions other than the vessel points are provided. Here, in place of the stone platen having a large rigidity such as a thickness of 300 mm or more as conventionally used, a platen having a moderately low rigidity is used instead of the stone platen having a thickness of 300 mm or more. When three points are supported, a slight deflection due to its own weight occurs in an unsupported region. Here, it is preferable that a deflection of about 5 to 20 μm is generated in a region where the deflection is greatest as the deflection generated in the surface plate 14. When the rigidity of the surface plate 14 is large and only a deflection smaller than 5 μm occurs even in the region with the largest deflection, the rigidity of the surface plate 14 is large, so that the flatness of the surface plate upper surface 14a is adjusted by the adjustable support 16. It becomes difficult. On the other hand, when the rigidity of the surface plate 14 is small and a deflection exceeding 20 μm occurs in the region where the deflection is the largest, the surface plate upper surface 14a is good unless a large number of adjustable supports 16 are arranged at a small pitch. Flatness cannot be adjusted. For this reason, as mentioned above, it is preferable that the surface plate 14 has a rigidity such that a deflection of about 5 to 20 μm is generated in a region having the largest deflection. As a suitable thing to use as the surface plate 14, stone surface plates, such as a granite of thickness about 75-125 mm, can be illustrated. A vacuum suction hole (not shown) for sucking and supporting the substrate 8 is formed in the surface plate 14 and connected to a vacuum supply source (not shown).

ベッセル点支持具１５は、定盤１４を３個のベッセル点Ｐで３点支持することで、定盤１４を水平に且つ所定高さとなるように支持するためのものである。ここで、３個のベッセル点Ｐとは、定盤１４を３点支持した際に、定盤１４に自重によって生じる最大ひずみがもっとも小さくなる点を意味しており、定盤１４をベッセル点Ｐで支持することで定盤１４を最もひずみの生じない形態で支持できる。ベッセル点支持具１５としては、定盤１４のベッセル点を所定の高さ位置に支持することができるものであればその構造は任意であり、支持高さを一定とした構造のものでもよいし、支持高さを調整ねじ機構等を利用して調整可能としたものでもよいが、少なくとも２個のベッセル点支持具１５を支持高さを調整可能としたものとすることが、定盤１４の上面を高精度で水平に調整できるので好ましい。   The vessel point support 15 is for supporting the surface plate 14 horizontally and at a predetermined height by supporting the surface plate 14 with three vessel points P at three points. Here, the three Bessel points P mean the point where the maximum strain caused by the weight of the surface plate 14 becomes the smallest when the surface plate 14 is supported at three points. It is possible to support the surface plate 14 in a form in which most distortion does not occur. The vessel point support 15 may have any structure as long as it can support the vessel point of the surface plate 14 at a predetermined height position, and may have a structure in which the support height is constant. The support height may be adjustable using an adjustment screw mechanism or the like. However, it is possible to adjust the support height of at least two vessel point supports 15 by using the surface plate 14. It is preferable because the upper surface can be adjusted horizontally with high accuracy.

可調整支持具１６は、定盤１４を、ベッセル点以外の複数の領域で支持するように配置されたもので、定盤１４の支持高さを調整可能な機能を備えた構造のものである。ここで用いる可調整支持具１６は、定盤１４の支持高さをミクロンオーダーで調整可能なものとすることが好ましく、この実施の形態では、積層型の圧電素子を用いている。圧電素子は、印加電圧に応じた変位を生じ、且つその変位はミクロンオーダーで調整可能であるので、印加電圧の調整により、容易に定盤１４の支持高さをミクロンオーダーで調整できる。圧電素子からなる可調整支持具１６には、電圧を印加すると共にその印加電圧を調整するための電圧印加調整装置（図示せず）が接続されている。なお、積層型の圧電素子は通電により延び方向の変位のみを生じるので、圧電素子からなる可調整支持具１６は、通電によって延び方向に変位させることで定盤１４を持ち上げ、定盤上面１４ａの平面度を向上させることができるように、取り付け高さが定められている。可調整支持具１６の設置位置及び使用個数は、図５（ａ）、（ｂ）に示すように、ベッセル点Ｐで３点支持された状態の定盤１４を、ベッセル点Ｐから離れた位置で持ち上げることで、定盤上面即ち支持面１４ａを所望の平面度に調整できるように定めるものであり、必要とされる平面度や定盤１４の剛性を考慮して適切に定めればよい。   The adjustable support 16 is arranged so as to support the surface plate 14 in a plurality of regions other than the vessel point, and has a structure having a function capable of adjusting the support height of the surface plate 14. . The adjustable support 16 used here is preferably one capable of adjusting the support height of the surface plate 14 on the order of microns, and in this embodiment, a laminated piezoelectric element is used. The piezoelectric element generates a displacement corresponding to the applied voltage, and the displacement can be adjusted in the micron order. Therefore, the supporting height of the surface plate 14 can be easily adjusted in the micron order by adjusting the applied voltage. A voltage application adjusting device (not shown) for applying a voltage and adjusting the applied voltage is connected to the adjustable support 16 made of a piezoelectric element. Since the laminated piezoelectric element only causes displacement in the extending direction when energized, the adjustable support 16 made of a piezoelectric element lifts the surface plate 14 by displacing it in the extending direction by energizing, so that the surface plate 14 The mounting height is determined so that the flatness can be improved. As shown in FIGS. 5 (a) and 5 (b), the installation position and the number of use of the adjustable support 16 are the positions apart from the vessel point P on the surface plate 14 that is supported by the vessel point P at three points. The upper surface of the surface plate, that is, the support surface 14a is determined so as to be adjusted to a desired flatness, and may be appropriately determined in consideration of the required flatness and the rigidity of the surface plate 14.

次に、上記構成のチャック台１３の製造、組立方法を説明する。チャック台１３に用いる定盤１４の支持面１４ａを所望の平面度、例えば、カラーフィルターの第６世代に対応する大型の基材（１５００ｍｍ×１８００ｍｍ）を支持するための定盤１４においては２０μｍ程度の平面度に機械加工しておき、その定盤１４をベース２に保持させた３個のベッセル点支持具１５に保持させる。次いで、図５（ａ）に示すように、ベッセル点支持具１５に保持された定盤１４の上面１４ａの平面度を測定し、平面度を上げるために定盤を持ち上げるべき領域の下にある可調整支持具１６に電圧を印加し且つその電圧を調整することで定盤上面１４ａの平面度を調整する。また、必要に応じ、可調整支持具１６の取り付け位置を、平面度調整に適した位置にずらせるとか、新たな可調整支持具１６を配置して平面度調整を行う。この調整により、定盤１４の上面１４ａの平面度を、当初の機械加工によって得た平面度よりも更に小さく、例えば、平面度１０μｍ程度に調整できる。   Next, a method for manufacturing and assembling the chuck base 13 having the above configuration will be described. The support surface 14a of the surface plate 14 used for the chuck base 13 has a desired flatness, for example, about 20 μm in the surface plate 14 for supporting a large base material (1500 mm × 1800 mm) corresponding to the sixth generation of the color filter. The surface plate 14 is held by three Bessel point supports 15 held by the base 2. Next, as shown in FIG. 5A, the flatness of the upper surface 14a of the surface plate 14 held by the Bessel point support 15 is measured, and the surface plate is below the region to be lifted to increase the flatness. The flatness of the surface plate upper surface 14a is adjusted by applying a voltage to the adjustable support 16 and adjusting the voltage. Further, if necessary, the mounting position of the adjustable support 16 is shifted to a position suitable for the flatness adjustment, or a new adjustable support 16 is arranged to adjust the flatness. By this adjustment, the flatness of the upper surface 14a of the surface plate 14 can be adjusted to be smaller than the flatness obtained by the original machining, for example, to a flatness of about 10 μm.

このように定盤上面１４ａの平面度を調整した後は、従来と同様に、その定盤１４の上面即ち支持面１４ａに基材８を吸着支持させ、ダイヘッド７による塗布を行う。この際、上面１４の支持面１４ａの平面度が小さく調整されているため、その上に吸着支持した基材８の上面の平面度も小さく抑制されており、ダイヘッド７との塗布ギャップを従来よりも均一として塗布を行うことができ、塗膜厚さのばらつきを小さくできる。また、塗布開始時におけるダイヘッド７の下端と基材８上面との間隔を、３０μｍ程度の小さい値に設定した場合においても、塗工中にダイヘッド７が基材８に接触して損傷するということがない。更に、ダイヘッド７の移動中における塗布ギャップの変動も小さく抑制されるため、ダイヘッド移動中に、ダイヘッド７と基材８との間隔を測定して塗布ギャップをフィードバック制御するといった必要もなくなり、塗工が容易となる。かくして、このチャック台１３を用いることで、第６世代に対応するような大型の基材８であっても高精度の平面度となるように支持でき、良好な塗工を行うことができる。   After the flatness of the upper surface 14a of the surface plate is adjusted in this way, the base material 8 is sucked and supported on the upper surface of the surface plate 14, that is, the support surface 14a, and coating is performed by the die head 7 as in the prior art. At this time, since the flatness of the support surface 14a of the upper surface 14 is adjusted to be small, the flatness of the upper surface of the substrate 8 adsorbed and supported on the upper surface 14 is also suppressed to be small, and the coating gap between the die head 7 and the die head 7 is smaller than before. Can also be applied uniformly, and variations in coating thickness can be reduced. Further, even when the distance between the lower end of the die head 7 and the upper surface of the base material 8 at the start of coating is set to a small value of about 30 μm, the die head 7 comes into contact with the base material 8 during the coating and is damaged. There is no. Further, since the fluctuation of the coating gap during the movement of the die head 7 is suppressed to a small value, there is no need to measure the distance between the die head 7 and the substrate 8 during the movement of the die head to perform feedback control of the coating gap. Becomes easy. Thus, by using this chuck base 13, even a large base material 8 corresponding to the sixth generation can be supported so as to have a high degree of flatness, and satisfactory coating can be performed.

以上の動作説明では、定盤１４に基材８を保持させる前に定盤１４の支持面１４ａの平面度を調整しているが、平面度調整はこれに限らず、定盤の支持面１４ａに基材８を吸着支持させた状態で、その基材８の上面の平面度を調整することも可能である。すなわち、定盤１４の支持面１４ａに基材８を吸着支持させた状態で、その基材８の上面の平面度を測定し、凹んでいる領域にある可調整支持具１６に通電し且つ電圧調整することで、その領域の定盤１４を押し上げ、また、基材８の上面の高くなっている領域にある可調整支持具１６が通電状態であれば、印加電圧を下げることでその領域の高さを下げるといった動作を基材８の全域に行うことで、基材８の上面の平面度を小さく調整できる。この調整動作を行うと、基材８に厚みむらがあっても、基材８の上面の平面度を小さく調整できるので、定盤１４の支持面１４ａのみの平面度を調整し、その上に基材８を吸着支持させた場合に比べて、基材８の上面の平面度を一層小さく調整でき、基材８に対する塗工に当たって塗布ギャップのむらを一層小さくして精密塗工を行うことが可能となる。   In the above description of the operation, the flatness of the support surface 14a of the surface plate 14 is adjusted before holding the base material 8 on the surface plate 14, but the flatness adjustment is not limited to this and the support surface 14a of the surface plate is not limited thereto. It is also possible to adjust the flatness of the upper surface of the base material 8 in a state where the base material 8 is supported by suction. That is, in a state where the base material 8 is adsorbed and supported on the support surface 14a of the surface plate 14, the flatness of the upper surface of the base material 8 is measured, and the adjustable support 16 in the recessed area is energized and voltage is applied. By adjusting, the surface plate 14 of the region is pushed up, and if the adjustable support 16 in the region where the upper surface of the substrate 8 is high is energized, the applied voltage is lowered to reduce the region. By performing the operation of lowering the height over the entire area of the base material 8, the flatness of the upper surface of the base material 8 can be adjusted to be small. When this adjustment operation is performed, the flatness of the upper surface of the base material 8 can be adjusted to be small even if the base material 8 has uneven thickness. Therefore, the flatness of only the support surface 14a of the surface plate 14 is adjusted, Compared with the case where the base material 8 is supported by suction, the flatness of the upper surface of the base material 8 can be adjusted to be smaller, and the unevenness of the coating gap can be further reduced when applying to the base material 8 to perform precise coating. It becomes.

なお、以上に説明した実施の形態では、可調整支持具１６として圧電素子を用いたものを示したが、可調整支持具１６としてはこれに限らず、油圧治具を用いたり、ねじ等の微調整が可能である代用品を用いても良い。更に、上記した実施の形態では、本発明の基材用チャック台を塗工装置における基材支持用に用いているが、塗工装置は本発明の基材用チャック台の一使用例であり、本発明の基材用チャック台は、基材を載せるための平面度を必要とするチャック台が必要な任意の装置、例えば、印刷機、研磨機、検査機及び加工機等に使用することも可能である。   In the embodiment described above, a piezoelectric element is used as the adjustable support 16. However, the adjustable support 16 is not limited to this, and a hydraulic jig, screw, or the like is used. A substitute that can be finely adjusted may be used. Furthermore, in the above-described embodiment, the substrate chuck base of the present invention is used for supporting the substrate in the coating apparatus, but the coating apparatus is an example of use of the substrate chuck base of the present invention. The chuck base for a substrate of the present invention is used for any device that requires a chuck base that requires flatness for placing a substrate, for example, a printing machine, a polishing machine, an inspection machine, and a processing machine. Is also possible.

本発明の好適な実施の形態に係る基材用チャック台を用いた塗工装置の概略斜視図1 is a schematic perspective view of a coating apparatus using a substrate chuck base according to a preferred embodiment of the present invention. 図１に示す塗工装置の主要部分の概略断面図Schematic sectional view of the main part of the coating apparatus shown in FIG. 図１に示す塗工装置を、図２のＡ−Ａ線に沿って切断して示す概略断面図1 is a schematic cross-sectional view showing the coating apparatus shown in FIG. 1 cut along the line AA in FIG. 図１に示す塗工装置に用いている定盤とそれを支持するベッセル点支持具及び可調整支持具の位置関係を示す概略平面図FIG. 1 is a schematic plan view showing the positional relationship between a surface plate used in the coating apparatus shown in FIG. （ａ）は定盤をベッセル点支持具で支持した状態を、定盤のたわみを誇張して示す概略断面図、（ｂ）は定盤をベッセル点支持具と可調整支持具で支持し、平面度調整した状態を示す概略断面図(A) is a schematic cross-sectional view showing a state in which the surface plate is supported by the vessel point support, exaggerating the deflection of the surface plate, (b) is a surface plate supported by the vessel point support and the adjustable support, Schematic sectional view showing the state of flatness adjustment 従来のチャック台を用いた塗工装置の概略斜視図Schematic perspective view of a coating apparatus using a conventional chuck base 図６に示す塗工装置の主要部分の概略断面図Schematic sectional view of the main part of the coating apparatus shown in FIG.

符号の説明Explanation of symbols

１、１Ａ 塗工装置
２ ベース
３ チャック台
４ ガイド手段
５ 移動台
６ ヘッド保持部材
７ ダイヘッド
１３ チャック台
１４ 定盤
１４ａ 支持面（上面）
１５ ベッセル点支持具
１６ 可調整支持具
Ｐ ベッセル点 DESCRIPTION OF SYMBOLS 1, 1A coating apparatus 2 Base 3 Chuck stand 4 Guide means 5 Moving stand 6 Head holding member 7 Die head 13 Chuck stand 14 Surface plate 14a Support surface (upper surface)
15 Bessel point support 16 Adjustable support P Bessel point

Claims (4)

基材を載置するための支持面を備えた定盤と、該定盤をベッセル点で３点支持する３個のベッセル点支持具と、前記定盤を、ベッセル点以外の領域で支持すると共に前記定盤の支持高さを調整可能な複数の可調整支持具を備えていることを特徴とする基材用チャック台。   A surface plate provided with a support surface for placing the base material, three vessel point supporters for supporting the surface plate at three vessel points, and the platen are supported in a region other than the vessel point. And a plurality of adjustable support tools capable of adjusting the support height of the surface plate. 前記可調整支持具が圧電素子で構成されていることを特徴とする請求項１記載の基材用チャック。   The substrate chuck according to claim 1, wherein the adjustable support is made of a piezoelectric element. 前記３個のベッセル点支持具の少なくとも２個が、前記定盤の支持高さを調整可能な機能を備えていることを特徴とする請求項１又は２記載の基材用チャック台。   3. The substrate chuck base according to claim 1, wherein at least two of the three Bessel point supports have a function of adjusting a support height of the surface plate. 4. 前記定盤が厚さ７５〜１２５ｍｍの石定盤で形成されていることを特徴とする請求項１から３のいずれか１項記載の基材用チャック台。   The base plate chuck base according to any one of claims 1 to 3, wherein the surface plate is formed of a stone surface plate having a thickness of 75 to 125 mm.

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