JP2007182244A - Carrier tape, top cover tape, and packing method for electronic component - Google Patents

Carrier tape, top cover tape, and packing method for electronic component Download PDF

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JP2007182244A
JP2007182244A JP2006001959A JP2006001959A JP2007182244A JP 2007182244 A JP2007182244 A JP 2007182244A JP 2006001959 A JP2006001959 A JP 2006001959A JP 2006001959 A JP2006001959 A JP 2006001959A JP 2007182244 A JP2007182244 A JP 2007182244A
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tape
top cover
carrier tape
cover tape
longitudinal direction
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JP4822845B2 (en
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Hiroki Naraoka
浩喜 楢岡
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrier tape which can eliminate the sagging of a top cover tape. <P>SOLUTION: An incision 17 for bending the end section in the tape width direction is provided on one side (the end section on the opposite side from the end section on which feeding holes 13 are provided) of the end section being in parallel with an embossed carrier tape 11 in the longitudinal direction. A semiconductor device 14 is housed in a recess section (pocket) 12, and the top cover tape 15 is pasted. Then, the embossed carrier tape 11 and the top cover tape 15 are bent along the incision 17, and thus, a space which is formed above the recess section 12 when the top cover tape 15 is pasted, and a gap which is formed between the upper surface of the carrier tape and the top cover tape are eliminated. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、主としてＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）やＬＧＡ（Ｌａｎｄ Ｇrｉｄ Ａｒｒａｙ）等に代表される下面に実装用の端子が配置された薄型の半導体装置などの電子部品を収納するキャリヤテープ、及び電子部品を収納したキャリヤテープの上面に貼着されるトップカバーテープ、並びに電子部品の梱包方法に関する。   The present invention relates to a carrier tape for storing an electronic component such as a thin semiconductor device in which mounting terminals are arranged on the lower surface, represented by BGA (Ball Grid Array), LGA (Land Grid Array), and the like. The present invention relates to a top cover tape that is adhered to the upper surface of a carrier tape that contains a battery and a packaging method for electronic components.

近年、電子機器の軽薄短小化に伴い、半導体装置あるいはチップ部品などの電子部品に対してＰＷＢ（Ｐｒｉｎｔｅｄ Ｗｉｒｉｎｇ Ｂｏａｒｄ）等への実装面積の縮小化が要求されている。この要求に応じるため、例えば半導体装置として、下面に実装用の端子が配置されたＢＧＡやＬＧＡタイプの薄型の半導体装置が多く採用されている。   2. Description of the Related Art In recent years, as electronic devices have become lighter, thinner, and smaller, electronic components such as semiconductor devices and chip components have been required to have a reduced mounting area on a printed wiring board (PWB) or the like. In order to meet this demand, for example, many BGA and LGA type thin semiconductor devices in which mounting terminals are arranged on the lower surface are employed as semiconductor devices.

一般的に、半導体装置の包装には、取り扱いが容易で電子部品の実装効率が良好な、キャリヤテープを使ったテーピング包装が多く使われており、その中でも、電子部品の保管、輸送、実装に際し電子部品を汚染から保護することができることから、ポケットと呼ばれる電子部品収納用の凹部が列設されたエンボスキャリヤテープを用いたエンボステーピング包装が主流となっている。   Generally, tape packaging using carrier tape, which is easy to handle and has good mounting efficiency for electronic components, is often used for packaging semiconductor devices. Since the electronic components can be protected from contamination, embossed taping packaging using an embossed carrier tape in which concave portions for storing electronic components called pockets are arranged has become mainstream.

さらに、薄型化された電子部品の輸送時の吸湿を抑制し、かつ密封性向上や実装時のジャンピング防止を図るため、凹部（ポケット）を覆うようにトップカバーテープをエンボスキャリヤテープ上面に貼着する方法も取られている（例えば、特許文献１参照。）。   Furthermore, in order to suppress moisture absorption during transportation of thin electronic components, and to improve sealing performance and prevent jumping during mounting, a top cover tape is attached to the top surface of the embossed carrier tape so as to cover the recess (pocket). The method of doing is also taken (for example, refer patent document 1).

図５（ａ）は従来のエンボスキャリヤテープの構成を説明するための平面図、図５（ｂ）は図５（ａ）におけるＢ−Ｂ断面図であり、エンボスキャリヤテープに電子部品として半導体装置が収納された状態を示している。   FIG. 5A is a plan view for explaining the configuration of a conventional embossed carrier tape, and FIG. 5B is a cross-sectional view taken along line BB in FIG. 5A. Is shown in a stored state.

図５（ａ）、（ｂ）に示すように、エンボスキャリヤテープ５１には、複数の電子部品収納用の凹部（ポケット）５２が長手方向に沿って列設されている。また、エンボスキャリヤテープ５１の長手方向に平行な一方の端部には、送り穴５３が長手方向に沿って所定の間隔で貫通形成されている。   As shown in FIGS. 5A and 5B, the embossed carrier tape 51 is provided with a plurality of recesses (pockets) 52 for storing electronic components arranged in the longitudinal direction. In addition, feed holes 53 are formed at predetermined intervals along the longitudinal direction at one end parallel to the longitudinal direction of the embossed carrier tape 51.

このエンボスキャリヤテープ５１の凹部５２内に半導体装置５４が収納された後、凹部５２を覆うようにトップカバーテープ５５がエンボスキャリヤテープ５１上面に熱圧着等により貼着される。   After the semiconductor device 54 is accommodated in the recess 52 of the embossed carrier tape 51, a top cover tape 55 is attached to the upper surface of the embossed carrier tape 51 by thermocompression bonding or the like so as to cover the recess 52.

凹部５２は概ね直方体であり、従来のエンボステーピング包装では、半導体装置５４を収納した凹部５２が輸送時に密閉されるように凹部５２の外周部でトップカバーテープ５５を接着している。具体的には、図５（ａ）に示すように、接着部５６は、各凹部５２間においてＸ状となっており、凹部５２の外周部で六角形状となる。   The recess 52 is generally a rectangular parallelepiped, and in the conventional embossed taping packaging, the top cover tape 55 is bonded to the outer periphery of the recess 52 so that the recess 52 containing the semiconductor device 54 is sealed during transportation. Specifically, as shown in FIG. 5A, the bonding portion 56 has an X shape between the concave portions 52, and has a hexagonal shape at the outer peripheral portion of the concave portion 52.

また、通常、エンボステーピング包装では、図６に示すように、トップカバーテープ５５が貼着されたエンボスキャリヤテープ５１をリール６１に巻き取った状態でダンボール等に入れて出荷する。半導体装置の実装時には、送り穴５３を利用してエンボスキャリヤテープ５１をリール６１から送り出しながらトップカバーテープ５５を剥がして半導体装置５４を取り出し、ＰＷＢ等に搭載すればよいため、トレイやマガジン包装よりも実装の高速化を図ることができ、近年、エンボステーピング包装は半導体装置の出荷形態として増加してきている。   Normally, in embossed taping packaging, as shown in FIG. 6, the embossed carrier tape 51 with the top cover tape 55 attached is wound on a reel 61 and shipped in cardboard. When mounting the semiconductor device, the embossed carrier tape 51 is fed from the reel 61 using the feed hole 53 and the top cover tape 55 is peeled off to remove the semiconductor device 54 and mount it on a PWB or the like. However, in recent years, embossed taping packaging has been increasing as a shipment form of semiconductor devices.

しかしながら、上記従来のエンボステーピング包装では、図５（ｂ）に示すように、凹部５２の上方にトップカバーテープ１５が浮き上がって凹部５２の上方に空間が形成されるとともに、エンボスキャリヤテープ５１の上面とトップカバーテープ５５との間に隙間が形成されてしまい、電子部品収納後、振動等により電子部品が移動してその隙間に嵌り込み、半導体装置５４の電子回路部が損傷するなどの問題があった。また半導体装置５４の端子部５４ａが損傷すると、実装信頼性に影響を及ぼすといった問題もあった。
特開平５−３３８６１７号公報 However, in the above-described conventional embossed taping packaging, as shown in FIG. 5B, the top cover tape 15 floats above the recess 52 to form a space above the recess 52, and the top surface of the embossed carrier tape 51 And a gap is formed between the top cover tape 55 and the electronic component is moved by vibration or the like after being stored in the electronic component, and the electronic circuit portion of the semiconductor device 54 is damaged. there were. Further, when the terminal portion 54a of the semiconductor device 54 is damaged, there is a problem that the mounting reliability is affected.
JP-A-5-338617

本発明は、上記問題点に鑑み、キャリヤテープの長手方向に平行な端部の一方の側に、その端部をテープ幅方向に折り曲げるための折り曲げ部を設けることにより、キャリヤテープにトップカバーテープ貼着後、その折り曲げ部に沿ってキャリヤテープおよびトップカバーテープを折り曲げることで、電子部品収納用の凹部の上方に形成された空間、およびキャリヤテープの上面とトップカバーテープとの間に形成された隙間をなくすことができ、電子部品を安定した状態で収納できるキャリヤテープ、並びに電子部品の梱包方法を提供することを目的とする。   In view of the above problems, the present invention provides a top cover tape on a carrier tape by providing a bent portion for bending the end portion in the tape width direction on one side of the end portion parallel to the longitudinal direction of the carrier tape. After sticking, the carrier tape and the top cover tape are bent along the bent portion to form a space formed above the concave portion for storing the electronic components and between the upper surface of the carrier tape and the top cover tape. Another object of the present invention is to provide a carrier tape that can eliminate the gap and store electronic components in a stable state, and a method for packing electronic components.

また、本発明は、上記問題点に鑑み、キャリヤテープの上面側にトップカバーテープ接着用の溝部を設けることにより、キャリヤテープにトップカバーテープ貼着後、その溝部にトップカバーテープをさらに接着することで、電子部品収納用の凹部の上方に形成された空間、およびキャリヤテープの上面とトップカバーテープとの間に形成された隙間をなくすことができ、電子部品を安定した状態で収納できるキャリヤテープ、並びに電子部品の梱包方法を提供することを目的とする。   Further, in view of the above problems, the present invention provides a groove for bonding the top cover tape on the upper surface side of the carrier tape so that the top cover tape is further bonded to the groove after the top cover tape is attached to the carrier tape. Thus, the space formed above the recess for storing the electronic component and the gap formed between the upper surface of the carrier tape and the top cover tape can be eliminated, and the carrier that can stably store the electronic component. It is an object of the present invention to provide a packaging method for a tape and an electronic component.

また、本発明は、上記問題点に鑑み、トップカバーテープの一部を加熱収縮性の材質で構成することにより、キャリヤテープにトップカバーテープ貼着後、トップカバーテープの一部を加熱収縮させることで、電子部品収納用の凹部の上方に形成された空間、およびキャリヤテープの上面とトップカバーテープとの間に形成された隙間をなくすことができ、電子部品を安定した状態で収納できるトップカバーテープ、並びに電子部品の梱包方法を提供することを目的とする。   Further, in the present invention, in view of the above-mentioned problems, a part of the top cover tape is made of a heat-shrinkable material so that a part of the top cover tape is heated and shrunk after the top cover tape is attached to the carrier tape. Therefore, the space formed above the recess for storing electronic components and the gap formed between the upper surface of the carrier tape and the top cover tape can be eliminated, and the top that can stably store electronic components. It is an object of the present invention to provide a cover tape and a packaging method for electronic components.

本発明の請求項１記載のキャリヤテープは、その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープであって、前記長手方向に平行な端部の一方の側に、その端部を前記長手方向に直交するテープ幅方向に折り曲げるための折り曲げ部を有することを特徴とする。   The carrier tape according to claim 1 of the present invention is a carrier tape in which recesses for storing electronic components are arranged along the longitudinal direction thereof, on one side of the end parallel to the longitudinal direction. It has a bent portion for bending the end portion in the tape width direction orthogonal to the longitudinal direction.

また、本発明の請求項２記載のキャリヤテープは、その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープであって、前記凹部の開口部を覆うトップカバーテープを接着するための溝部を有することを特徴とする。   The carrier tape according to claim 2 of the present invention is a carrier tape in which recesses for storing electronic components are arranged in the longitudinal direction, and a top cover tape covering the opening of the recess is bonded. It has the groove part for, It is characterized by the above-mentioned.

また、本発明の請求項３記載のトップカバーテープは、その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープの上面に、前記凹部の開口部を覆うように貼着されるトップカバーテープであって、少なくともその一部が加熱収縮性の材質で構成されていることを特徴とする。   Further, the top cover tape according to claim 3 of the present invention is adhered to the upper surface of the carrier tape in which recesses for storing electronic components are arranged along the longitudinal direction so as to cover the opening of the recess. The top cover tape is characterized in that at least a part thereof is made of a heat-shrinkable material.

また、本発明の請求項４記載の電子部品の梱包方法は、その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープの前記凹部に電子部品を収納し、前記凹部の開口部を覆うように前記キャリヤテープの上面にトップカバーテープを貼着した後、前記長手方向に平行な前記キャリヤテープの端部の一方の側に設けられた折り曲げ部に沿って、前記キャリヤテープおよび前記トップカバーテープを前記長手方向に直交するテープ幅方向に折り曲げることを特徴とする。   According to a fourth aspect of the present invention, there is provided a method for packing electronic components, wherein the electronic components are stored in the concave portions of the carrier tape in which concave portions for storing the electronic components are arranged along the longitudinal direction, and the openings of the concave portions are opened. A top cover tape is applied to the upper surface of the carrier tape so as to cover the portion, and then the carrier tape and the carrier tape and a bent portion provided on one side of the end of the carrier tape parallel to the longitudinal direction. The top cover tape is bent in a tape width direction orthogonal to the longitudinal direction.

また、本発明の請求項５記載の電子部品の梱包方法は、その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープの前記凹部に電子部品を収納し、前記凹部の開口部を覆うように前記キャリヤテープの上面にトップカバーテープを貼着した後、さらに前記キャリヤテープに設けられた溝部に前記トップカバーテープを接着することを特徴とする。   According to a fifth aspect of the present invention, there is provided the electronic component packaging method, wherein the electronic component is stored in the concave portion of the carrier tape in which concave portions for storing the electronic component are arranged along the longitudinal direction, and the opening of the concave portion is provided. A top cover tape is attached to the upper surface of the carrier tape so as to cover the portion, and then the top cover tape is bonded to a groove provided in the carrier tape.

また、本発明の請求項６記載の電子部品の梱包方法は、請求項５記載の電子部品の梱包方法であって、前記キャリヤテープの上面に前記トップカバーテープが貼着され、かつ前記溝部に前記トップカバーテープが接着された前記キャリヤテープを水平に置いた場合に、前記溝部における前記トップカバーテープの最下部が前記キャリヤテープの上面よりも低い位置となるように、前記溝部に前記トップカバーテープを接着することを特徴とする。   The electronic component packaging method according to claim 6 of the present invention is the electronic component packaging method according to claim 5, wherein the top cover tape is adhered to the upper surface of the carrier tape, and the groove portion is provided. When the carrier tape to which the top cover tape is bonded is placed horizontally, the top cover is placed in the groove so that the lowermost part of the top cover tape in the groove is lower than the upper surface of the carrier tape. It is characterized by adhering a tape.

また、本発明の請求項７記載の電子部品の梱包方法は、その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープの前記凹部に電子部品を収納し、前記凹部の開口部を覆うように前記キャリヤテープの上面にトップカバーテープを貼着した後、前記トップカバーテープの少なくとも一部を加熱収縮させることを特徴とする。   According to a seventh aspect of the present invention, there is provided a packaging method for an electronic component, wherein the electronic component is stored in the concave portion of the carrier tape in which concave portions for storing the electronic component are arranged along the longitudinal direction, and the opening of the concave portion is provided. After a top cover tape is stuck on the upper surface of the carrier tape so as to cover the portion, at least a part of the top cover tape is heated and shrunk.

本発明によれば、電子部品収納用の凹部の上方に形成された空間、およびキャリヤテープの上面とトップカバーテープとの間に形成された隙間をなくすことができる。よって、電子部品収納後、振動等により電子部品が移動して隙間に嵌り込むことによる電子部品の損傷（例えば、半導体装置の電子回路部の損傷）を防ぐことができる。また、隙間に嵌り込んだ電子部品が傾いたまま収納されることによる実装時の吸着エラーを防止できる。また、電子部品として半導体装置を収納する場合に、半導体装置の端子部が損傷して、実装信頼性に影響を及ぼすことを回避できる。以上のことから、電子部品の輸送時の信頼性向上や実装時の吸着歩留まり向上を実現できる。   According to the present invention, it is possible to eliminate the space formed above the recess for storing electronic components and the gap formed between the top surface of the carrier tape and the top cover tape. Therefore, after the electronic component is stored, damage to the electronic component (for example, damage to the electronic circuit portion of the semiconductor device) due to movement of the electronic component due to vibration or the like and fitting into the gap can be prevented. Further, it is possible to prevent an adsorption error at the time of mounting due to the electronic component fitted in the gap being stored while being tilted. Further, when the semiconductor device is housed as an electronic component, it is possible to avoid damage to the terminal portion of the semiconductor device and affect mounting reliability. From the above, it is possible to improve the reliability during transportation of electronic components and the adsorption yield during mounting.

（実施の形態１）
図１（ａ）は本発明の実施の形態１におけるエンボスキャリヤテープの構成を説明するための平面図、図１（ｂ）は図１（ａ）におけるＡ−Ａ断面図、図１（ｃ）は図１（ａ）におけるＢ−Ｂ断面図であり、エンボスキャリヤテープに電子部品として半導体装置が収納された状態を示している。 (Embodiment 1)
1A is a plan view for explaining the configuration of an embossed carrier tape according to Embodiment 1 of the present invention, FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A, and FIG. FIG. 2B is a cross-sectional view taken along the line B-B in FIG.

図１（ａ）、（ｂ）、（ｃ）に示すように、エンボスキャリヤテープ１１には、複数の電子部品収納用の凹部（ポケット）１２が長手方向に沿って一定間隔で圧空成型、プレス成型、または真空成形等により列設されている。また、エンボスキャリヤテープ１１の長手方向に平行な一方の端部には、送り穴１３が長手方向に沿って所定の間隔で貫通形成されている。   As shown in FIGS. 1A, 1B, and 1C, the embossed carrier tape 11 has a plurality of recesses (pockets) 12 for storing electronic components, which are formed by pressure forming and pressing at regular intervals along the longitudinal direction. They are arranged by molding or vacuum forming. In addition, feed holes 13 are formed at predetermined intervals along the longitudinal direction at one end parallel to the longitudinal direction of the embossed carrier tape 11.

また、エンボスキャリヤテープ１１には、凹部１２内に半導体装置１４が収納された後、凹部１２を覆うようにトップカバーテープ１５がエンボスキャリヤテープ１１上面に熱圧着等により貼着される。   Further, after the semiconductor device 14 is accommodated in the recess 12 on the embossed carrier tape 11, a top cover tape 15 is attached to the upper surface of the embossed carrier tape 11 by thermocompression bonding or the like so as to cover the recess 12.

トップカバーテープ１５の接着部１６は、図１（ａ）に示すように、エンボスキャリヤテープ１１の長手方向に平行な両端部に沿って、凹部１２の両側に延在させている。なお、接着部１６を直線形状で示しているが、無論、形状はこれに限るものではない。また、凹部１２の形状は、例えば直方体とするが、無論、直方体に限るものではない。   As shown in FIG. 1A, the adhesive portion 16 of the top cover tape 15 extends on both sides of the recess 12 along both end portions parallel to the longitudinal direction of the embossed carrier tape 11. In addition, although the adhesion part 16 is shown by the linear shape, of course, a shape is not restricted to this. Moreover, although the shape of the recessed part 12 is a rectangular parallelepiped, for example, of course, it is not restricted to a rectangular parallelepiped.

本実施の形態１では、エンボスキャリヤテープ１１の送り穴１３が設けられた端部と反対側の端部に、その端部を長手方向に直行するテープ幅方向に折り曲げるための折り曲げ部が設けられている。図１（ａ）に示す例では、折り曲げ部として、一般的にミシン目と呼ばれる一定間隔ごとの切り込み１７を設けている。なお、切り込み１７はエンボスキャリヤテープ１１の上面に設けてもよいし、下面に設けてもよく、また貫通させてもよい。また切り込みに限らず、例えば折り曲げやすいように一部を薄くするような手法で折り曲げ部を設けても構わない。また、切り込み１７を連続して延在させるだけでなく、エンボスキャリヤテープ１１の長手方向に沿って所定長の切り込み部（一定間隔の切り込みが連続する部分）を所定の間隔毎に設けるなどしてもよい。また、折り曲げ部は１本に限るものではなく、例えば隣接して２本以上もうけてもよい。   In the first embodiment, the end of the embossed carrier tape 11 opposite to the end provided with the feed hole 13 is provided with a bent portion for bending the end in the tape width direction perpendicular to the longitudinal direction. ing. In the example shown in FIG. 1A, notches 17 at regular intervals, generally called perforations, are provided as bent portions. The notch 17 may be provided on the upper surface of the embossed carrier tape 11, or may be provided on the lower surface, or may be penetrated. In addition to the notch, for example, a bent portion may be provided by a method of thinning a part so as to be easily bent. In addition to continuously extending the cuts 17, a predetermined length of cut portions (a portion where cuts at a constant interval continue) are provided at predetermined intervals along the longitudinal direction of the embossed carrier tape 11. Also good. Further, the number of bent portions is not limited to one, and for example, two or more bent portions may be provided adjacent to each other.

続いて、本実施の形態１における電子部品の梱包方法について説明する。
まず、エンボスキャリヤテープ１１の凹部１２に半導体装置１４を収納し、凹部１２の開口部を覆うようにエンボスキャリヤテープ１１の上面にトップカバーテープ１５を貼着した後、送り穴１３を利用して図示しないテーピングマシンにより図示しないリールに巻き取る前に、例えばテーピングマシンに設置した図示しない折り曲げ治具により、図１（ｂ）に示すように、切り込み１７に沿ってエンボスキャリヤテープ１１およびトップカバーテープ１５をテープ幅方向に機械的に折り曲げながら、リールに巻き取る。ここで折り曲げ角度は、実装機への装着に影響しないように設定する。 Next, the electronic component packaging method according to the first embodiment will be described.
First, the semiconductor device 14 is accommodated in the recess 12 of the embossed carrier tape 11, and a top cover tape 15 is attached to the upper surface of the embossed carrier tape 11 so as to cover the opening of the recess 12. Before winding on a reel (not shown) by a taping machine (not shown), the embossed carrier tape 11 and the top cover tape along the notch 17 as shown in FIG. 15 is wound around a reel while being mechanically bent in the tape width direction. Here, the bending angle is set so as not to affect the mounting on the mounting machine.

このように切り込み１７でエンボスキャリヤテープ１１およびトップカバーテープ１５を折り曲げ、トップカバーテープ１５のたるみを引っ張ることにより、先に説明した図５（ｂ）に示すような凹部の上方に形成された空間、およびエンボスキャリヤテープの上面とトップカバーテープとの間に形成された隙間をなくすことができる（図１（ｂ）、（ｃ））。   In this way, the embossed carrier tape 11 and the top cover tape 15 are bent at the notch 17 and the slack of the top cover tape 15 is pulled, so that the space formed above the concave portion as shown in FIG. And a gap formed between the top surface of the embossed carrier tape and the top cover tape can be eliminated (FIGS. 1B and 1C).

エンボスキャリヤテープの材料としては、例えば、ポリスチレン、ポリプロピレン等の樹脂にカーボンを練り込んだ樹脂を用いる。エンボスキャリヤテープの作成は、樹脂が熱可塑性樹脂であるため、１００°Ｃ程度に加熱後、金型を圧接、型抜きし、厚み０．１ｍｍ〜０．３ｍｍ程度に成型する。次に、このように成型された所定幅のテープ基材を加熱しながら、凸形状または凹形状の金型にエアー等で押し込んでポケット（凹部）１２を作成する。また同様にして送り穴１３を作成する。機材トップカバーテープはポリエチレンテレフタレート等が一般的であり、接着層等が積層された構造を有する。   As a material for the embossed carrier tape, for example, a resin obtained by kneading carbon into a resin such as polystyrene or polypropylene is used. Since the resin is a thermoplastic resin, the embossed carrier tape is heated to about 100 ° C., and then the mold is pressed and punched to form a thickness of about 0.1 mm to 0.3 mm. Next, while heating the tape base material having a predetermined width thus formed, it is pushed into a convex or concave mold with air or the like to create a pocket (concave portion) 12. Similarly, the feed hole 13 is created. The equipment top cover tape is generally made of polyethylene terephthalate or the like, and has a structure in which an adhesive layer or the like is laminated.

（実施の形態２）
図２（ａ）は本発明の実施の形態２におけるエンボスキャリヤテープの構成を説明するための平面図、図２（ｂ）は図２（ａ）におけるＡ−Ａ断面図であり、エンボスキャリヤテープに電子部品として半導体装置が収納された状態を示している。但し、前述した実施の形態１において説明した部材と同一の部材には同一符号を付して、説明を省略する。 (Embodiment 2)
2A is a plan view for explaining the configuration of the embossed carrier tape according to Embodiment 2 of the present invention, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. FIG. 2 shows a state where a semiconductor device is housed as an electronic component. However, the same members as those described in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

本実施の形態２におけるエンボスキャリヤテープ１１は、その長手方向に沿ってトップカバーテープ１５を接着するための溝部２１を有する点に特徴がある。すなわち、図２（ａ）、（ｂ）に示す例では、エンボスキャリヤテープ１１の送り穴１３が設けられた側と反対側において、接着部１６と凹部１２の間にトップカバーテープ接着用の溝部２１を設けている。なお、溝を連続して延在させるだけでなく、例えばエンボスキャリヤテープ１１の長手方向に沿って所定長の溝部を一定間隔毎に設けるようにしてもよい。また、溝部は１本に限るものではない。   The embossed carrier tape 11 according to the second embodiment is characterized in that it has a groove portion 21 for adhering the top cover tape 15 along its longitudinal direction. That is, in the example shown in FIGS. 2A and 2B, the groove portion for bonding the top cover tape between the bonding portion 16 and the recess 12 on the side opposite to the side where the feed hole 13 of the embossed carrier tape 11 is provided. 21 is provided. In addition to extending the grooves continuously, for example, grooves having a predetermined length may be provided at regular intervals along the longitudinal direction of the embossed carrier tape 11. Further, the number of groove portions is not limited to one.

続いて、本実施の形態２における電子部品の梱包方法について説明する。
まず、エンボスキャリヤテープ１１の凹部１２に半導体装置１４を収納し、凹部１２の開口部を覆うようにエンボスキャリヤテープ１１の上面にトップカバーテープ１５を貼着した後、送り穴１３を利用して図示しないテーピングマシンにより図示しないリールに巻き取る前に、例えばテーピングマシンに設置した図示しない押し付け治具により、図２（ｂ）に示すように、溝部２１の底部でトップカバーテープ１５をさらに接着してトップカバーテープ１５のたるみを溝部２１に引き込むんだ後、リールに巻き取る。 Next, the electronic component packaging method according to the second embodiment will be described.
First, the semiconductor device 14 is accommodated in the recess 12 of the embossed carrier tape 11, and a top cover tape 15 is attached to the upper surface of the embossed carrier tape 11 so as to cover the opening of the recess 12. Prior to winding on a reel (not shown) by a taping machine (not shown), the top cover tape 15 is further bonded to the bottom of the groove 21 by a pressing jig (not shown) installed in the taping machine, for example, as shown in FIG. Then, the slack of the top cover tape 15 is drawn into the groove portion 21 and then wound on a reel.

このように溝部２１へトップカバーテープ１５を接着することにより、先に説明した図５（ｂ）に示すような凹部の上方に形成された空間、およびエンボスキャリヤテープの上面とトップカバーテープとの間に形成された隙間をなくすことができる（図２（ｂ））。   By adhering the top cover tape 15 to the groove portion 21 in this way, the space formed above the concave portion as shown in FIG. 5B and the upper surface of the embossed carrier tape and the top cover tape are formed. A gap formed between them can be eliminated (FIG. 2B).

なお、ここではエンボスキャリヤテープ１１の送り穴１３が設けられた側と反対側において、接着部１６と凹部１２の間に溝部２１を設けたが、エンボスキャリヤテープ１１の長手方向に沿って各凹部１２の間に溝部２１を設けてもよい。この場合のエンボスキャリヤテープの構成を説明するための平面図を図３（ａ）に示す。また、図３（ｂ）は図３（ａ）におけるＡ−Ａ断面図、図３（ｃ）は図３（ａ）におけるＢ−Ｂ断面図である。   Here, the groove portion 21 is provided between the adhesive portion 16 and the concave portion 12 on the side opposite to the side where the feed hole 13 of the embossed carrier tape 11 is provided, but each concave portion along the longitudinal direction of the embossed carrier tape 11 is provided. A groove 21 may be provided between 12. FIG. 3A is a plan view for explaining the configuration of the embossed carrier tape in this case. 3B is a cross-sectional view taken along line AA in FIG. 3A, and FIG. 3C is a cross-sectional view taken along line BB in FIG.

図３に示すように、エンボスキャリヤテープ１１の長手方向に沿って各凹部１２の間に設けられた溝部２１の例えば底部にトップカバーテープ１５を接着して、トップカバーテープ１５のたるみを溝部２１に引き込むことにより、先に説明した図５（ｂ）に示すような凹部の上方に形成された空間、およびエンボスキャリヤテープの上面とトップカバーテープとの間に形成された隙間をなくすことができる（図３（ｂ））。なお、溝部は１本に限るものではない。   As shown in FIG. 3, the top cover tape 15 is bonded to, for example, the bottom of the groove 21 provided between the recesses 12 along the longitudinal direction of the embossed carrier tape 11, and the slack of the top cover tape 15 is reduced to the groove 21. The space formed above the concave portion as shown in FIG. 5B and the gap formed between the top surface of the embossed carrier tape and the top cover tape can be eliminated. (FIG. 3B). Note that the number of grooves is not limited to one.

このように、本実施の形態２では、エンボスキャリヤテープ１１の上面にトップカバーテープ１５が貼着され、かつ溝部２１にトップカバーテープ１５が接着されたエンボスキャリヤテープ１１を水平に置いた場合に、溝部２１におけるトップカバーテープ１５の最下部がエンボスキャリヤテープ１１の上面よりも低い位置となるように、溝部２１にトップカバーテープ１５を接着することにより、トップカバーテープ１５のたるみを溝部２１に引き込むことで、先に説明した図５（ｂ）に示すような凹部の上方に形成された空間、およびエンボスキャリヤテープの上面とトップカバーテープとの間に形成された隙間をなくすことができる。   As described above, in the second embodiment, when the embossed carrier tape 11 having the top cover tape 15 adhered to the upper surface of the embossed carrier tape 11 and the top cover tape 15 bonded to the groove portion 21 is placed horizontally. By attaching the top cover tape 15 to the groove portion 21 so that the lowermost portion of the top cover tape 15 in the groove portion 21 is lower than the upper surface of the embossed carrier tape 11, the slack of the top cover tape 15 is added to the groove portion 21. By pulling in, the space formed above the recess as shown in FIG. 5B and the gap formed between the top surface of the embossed carrier tape and the top cover tape can be eliminated.

なお、本実施の形態２では、溝部２１の底部にのみトップカバーテープ１５を接着したが、溝部２１における接着部１６ａを設ける箇所は溝部２１の底部に限るものではなく、エンボスキャリヤテープ１１を水平に置いた場合に、溝部２１におけるトップカバーテープ１５の最下部がエンボスキャリヤテープ１１の上面よりも低い位置となるように接着できればよい。   In the second embodiment, the top cover tape 15 is adhered only to the bottom of the groove portion 21, but the location where the adhesive portion 16 a is provided in the groove portion 21 is not limited to the bottom portion of the groove portion 21, and the embossed carrier tape 11 is disposed horizontally. It is only necessary that the lowermost portion of the top cover tape 15 in the groove portion 21 can be bonded to a position lower than the upper surface of the embossed carrier tape 11.

また、接着部１６は、図２（ａ）、３（ａ）に示すように、エンボスキャリヤテープ１１の長手方向に延在する形状で凹部１２の両側に設ける場合に限らず、例えば凹部１２の周縁部を囲むような形状でもよい。   2 (a) and 3 (a), the adhesive portion 16 is not limited to the case where it is provided on both sides of the concave portion 12 in a shape extending in the longitudinal direction of the embossed carrier tape 11, but for example, A shape surrounding the peripheral edge may be used.

また、溝部２１についても、エンボスキャリヤテープ１１の長手方向に延在する形状に限るものではなく、トップカバーテープ１５を溝部に接着することで、トップカバーテープ１５のたるみを引っ張ることができればよい。   Further, the groove portion 21 is not limited to the shape extending in the longitudinal direction of the embossed carrier tape 11, and it is only necessary that the slack of the top cover tape 15 can be pulled by bonding the top cover tape 15 to the groove portion.

（実施の形態３）
図４（ａ）は本発明の実施の形態３におけるエンボスキャリヤテープの構成を説明するための平面図、図４（ｂ）は図４（ａ）におけるＡ−Ａ断面図であり、エンボスキャリヤテープに電子部品として半導体装置が収納された状態を示している。但し、前述した実施の形態１において説明した部材と同一の部材には同一符号を付して、説明を省略する。 (Embodiment 3)
4A is a plan view for explaining the configuration of an embossed carrier tape according to Embodiment 3 of the present invention, and FIG. 4B is a cross-sectional view taken along line AA in FIG. FIG. 2 shows a state where a semiconductor device is housed as an electronic component. However, the same members as those described in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

本実施の形態３におけるトップカバーテープ１５は、少なくとも一部が熱収縮する基材（加熱収縮性の材質）で構成されている点に特徴がある。すなわち、図４（ａ）、（ｂ）に示す例では、トップカバーテープ１５の略中央部が、熱収縮する熱収縮部４１で構成されており、熱収縮部４１は、エンボスキャリヤテープ１１の長手方向に沿って延在している。なお、熱収縮部としては、例えばサラン樹脂（ポリ塩化ビニルデン）を用いる。   The top cover tape 15 according to the third embodiment is characterized in that it is composed of a base material (heat-shrinkable material) that at least partially heat-shrinks. That is, in the example shown in FIGS. 4A and 4B, the substantially central portion of the top cover tape 15 is configured by a heat shrinkable portion 41 that thermally shrinks, and the heat shrinkable portion 41 is formed on the embossed carrier tape 11. It extends along the longitudinal direction. In addition, as a heat contraction part, Saran resin (polyvinyl chloride) is used, for example.

なお、エンボスキャリヤテープ１１の長手方向に沿って平行に２本以上の熱収縮部４１を設けてもよい。また、熱収縮部を連続して延在させるだけでなく、例えばエンボスキャリヤテープ１１の長手方向に沿って所定長の熱収縮部を一定間隔毎に設けるようにしてもよい。また、熱収縮部４１で構成する部分はトップカバーテープ１５の略中央部に限るものではなく、熱収縮部４１は両接着部１６の間に設けてあればよい。   Note that two or more heat shrinking portions 41 may be provided in parallel along the longitudinal direction of the embossed carrier tape 11. In addition to continuously extending the heat-shrinkable portions, for example, heat-shrinkable portions having a predetermined length along the longitudinal direction of the embossed carrier tape 11 may be provided at regular intervals. Further, the portion constituted by the heat shrinkage portion 41 is not limited to the substantially central portion of the top cover tape 15, and the heat shrinkage portion 41 only needs to be provided between the adhesive portions 16.

続いて、本実施の形態３における電子部品の梱包方法について説明する。
まず、エンボスキャリヤテープ１１の凹部１２に半導体装置１４を収納し、凹部１２の開口部を覆うようにエンボスキャリヤテープ１１の上面にトップカバーテープ１５を貼着した後、送り穴１３を利用して図示しないテーピングマシンにより図示しないリールに巻き取る前に、例えばテーピングマシンに設置した図示しない加熱治具により、熱収縮部４１をエンボスキャリヤテープ１１に接着しない程度の温度で部分加熱し熱収縮させて（図４（ｂ））、トップカバーテープ１５のたるみをなくした後、リールに巻き取る。 Next, a method for packing electronic components according to the third embodiment will be described.
First, the semiconductor device 14 is accommodated in the recess 12 of the embossed carrier tape 11, and a top cover tape 15 is attached to the upper surface of the embossed carrier tape 11 so as to cover the opening of the recess 12. Before being wound on a reel (not shown) by a taping machine (not shown), for example, by a heating jig (not shown) installed in the taping machine, the heat shrinking portion 41 is partially heated at a temperature that does not adhere to the embossed carrier tape 11 and thermally contracted. (FIG. 4B) After the slack of the top cover tape 15 is eliminated, the tape is wound around a reel.

このようにトップカバーテープ１５の少なくとも一部を熱収縮性の材質とすることにより、先に説明した図５（ｂ）に示すような凹部の上方に形成された空間、およびエンボスキャリヤテープの上面とトップカバーテープとの間に形成された隙間をなくすことができる（図４（ｂ））。   Thus, by using at least a part of the top cover tape 15 as a heat-shrinkable material, the space formed above the concave portion as shown in FIG. 5B and the upper surface of the embossed carrier tape described above. And the gap formed between the top cover tape and the top cover tape can be eliminated (FIG. 4B).

なお、接着部１６は、図４（ａ）に示すように、エンボスキャリヤテープ１１の長手方向に延在する形状で凹部１２の両側に設ける場合に限らず、例えば凹部１２の周縁部を囲むような形状でもよい。   As shown in FIG. 4A, the adhesive portion 16 is not limited to being provided on both sides of the recess 12 in a shape extending in the longitudinal direction of the embossed carrier tape 11, and for example, surrounds the peripheral portion of the recess 12. Any shape may be used.

また、熱収縮部４１についても、エンボスキャリヤテープ１１の長手方向に延在する形状に限るものではなく、収縮させることで、トップカバーテープ１５のたるみを引っ張ることができればよい。   Further, the heat shrinkable portion 41 is not limited to the shape extending in the longitudinal direction of the embossed carrier tape 11, and it is sufficient that the slack of the top cover tape 15 can be pulled by shrinking.

なお、本実施の形態１ないし３では、エンボスキャリヤテープとトップカバーテープと半導体装置を一例に取り上げたが、プラスチックや紙などのパンチキャリヤタイプ、あるいは半導体装置以外のチップ部品において実施しても同様の効果が得られる。   In the first to third embodiments, the embossed carrier tape, the top cover tape, and the semiconductor device are taken as an example. However, the present invention can also be applied to a punch carrier type such as plastic or paper, or a chip component other than the semiconductor device. The effect is obtained.

本発明にかかるキャリヤテープ、及びトップカバーテープ、並びに電子部品の梱包方法
は、トップカバーテープのたるみをなくすことができ、電子部品の輸送時の信頼性向上や実装時の吸着歩留まり向上を実現でき、下面に実装用の端子が配置された薄型の半導体装置を包装するエンボステーピング包装に有用である。 The carrier tape, the top cover tape, and the electronic component packaging method according to the present invention can eliminate the slack of the top cover tape, and can improve the reliability of the electronic components during transportation and the adsorption yield during mounting. It is useful for embossed taping packaging for packaging a thin semiconductor device having a mounting terminal disposed on the lower surface.

（ａ）は本発明の実施の形態１におけるエンボスキャリヤテープの構成を説明するための平面図、（ｂ）は（ａ）におけるＡ−Ａ断面図、（ｃ）は（ａ）におけるＢ−Ｂ断面図(A) is a top view for demonstrating the structure of the embossed carrier tape in Embodiment 1 of this invention, (b) is AA sectional drawing in (a), (c) is BB in (a). Cross section （ａ）は本発明の実施の形態２におけるエンボスキャリヤテープの構成を説明するための平面図、（ｂ）は（ａ）におけるＡ−Ａ断面図(A) is a top view for demonstrating the structure of the embossed carrier tape in Embodiment 2 of this invention, (b) is AA sectional drawing in (a). （ａ）は同実施の形態２の他の例におけるエンボスキャリヤテープの構成を説明するための平面図、（ｂ）は（ａ）におけるＡ−Ａ断面図、（ｃ）は（ａ）におけるＢ−Ｂ断面図(A) is a top view for demonstrating the structure of the embossed carrier tape in the other example of Embodiment 2, (b) is AA sectional drawing in (a), (c) is B in (a). -B sectional view （ａ）は本発明の実施の形態３におけるエンボスキャリヤテープの構成を説明するための平面図、（ｂ）は（ａ）におけるＡ−Ａ断面図(A) is a top view for demonstrating the structure of the embossed carrier tape in Embodiment 3 of this invention, (b) is AA sectional drawing in (a). （ａ）は従来のエンボスキャリヤテープの構成を説明するための平面図、（ｂ）は（ａ）におけるＢ−Ｂ断面図(A) is a top view for demonstrating the structure of the conventional embossed carrier tape, (b) is BB sectional drawing in (a). 従来のエンボステーピング包装の斜視図Perspective view of conventional embossed taping packaging

符号の説明Explanation of symbols

１１、５１ エンボスキャリヤテープ
１２、５２ 凹部
１３、５３ 送り穴
１４、５４ 半導体装置
１５、５５ トップカバーテープ
１６、５６ 接着部
１７ 切り込み
２１ 溝部
４１ 熱収縮部
５４ａ 端子部
６１ リール 11, 51 Embossed carrier tape 12, 52 Recessed part 13, 53 Feed hole 14, 54 Semiconductor device 15, 55 Top cover tape 16, 56 Adhesive part 17 Notch 21 Groove part 41 Thermal contraction part 54a Terminal part 61 Reel

Claims (7)

その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープであって、前記長手方向に平行な端部の一方の側に、その端部を前記長手方向に直交するテープ幅方向に折り曲げるための折り曲げ部を有することを特徴とするキャリヤテープ。   A carrier tape in which recesses for storing electronic components are arranged along the longitudinal direction, and the end is parallel to the longitudinal direction, and the end is perpendicular to the longitudinal direction. A carrier tape having a bent portion for bending the tape. その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープであって、前記凹部の開口部を覆うトップカバーテープを接着するための溝部を有することを特徴とするキャリヤテープ。   A carrier tape in which recesses for storing electronic components are arranged along a longitudinal direction thereof, and has a groove for bonding a top cover tape covering an opening of the recess. その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープの上面に、前記凹部の開口部を覆うように貼着されるトップカバーテープであって、少なくともその一部が加熱収縮性の材質で構成されていることを特徴とするトップカバーテープ。   A top cover tape that is attached to an upper surface of a carrier tape in which concave portions for storing electronic components are arranged along the longitudinal direction so as to cover the opening of the concave portion, at least a part of which is heat-shrinkable The top cover tape is characterized by being made of a material of the nature. その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープの前記凹部に電子部品を収納し、前記凹部の開口部を覆うように前記キャリヤテープの上面にトップカバーテープを貼着した後、前記長手方向に平行な前記キャリヤテープの端部の一方の側に設けられた折り曲げ部に沿って、前記キャリヤテープおよび前記トップカバーテープを前記長手方向に直交するテープ幅方向に折り曲げることを特徴とする電子部品の梱包方法。   Electronic parts are stored in the recesses of the carrier tape in which recesses for storing electronic components are arranged along the longitudinal direction, and a top cover tape is attached to the upper surface of the carrier tape so as to cover the openings of the recesses. After that, the carrier tape and the top cover tape are bent in the tape width direction perpendicular to the longitudinal direction along a bent portion provided on one side of the end of the carrier tape parallel to the longitudinal direction. A method for packing electronic parts characterized by the above. その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープの前記凹部に電子部品を収納し、前記凹部の開口部を覆うように前記キャリヤテープの上面にトップカバーテープを貼着した後、さらに前記キャリヤテープに設けられた溝部に前記トップカバーテープを接着することを特徴とする電子部品の梱包方法。   Electronic parts are stored in the recesses of the carrier tape in which recesses for storing electronic components are arranged along the longitudinal direction, and a top cover tape is attached to the upper surface of the carrier tape so as to cover the openings of the recesses. Then, the top cover tape is further bonded to a groove provided in the carrier tape. 請求項５記載の電子部品の梱包方法であって、前記キャリヤテープの上面に前記トップカバーテープが貼着され、かつ前記溝部に前記トップカバーテープが接着された前記キャリヤテープを水平に置いた場合に、前記溝部における前記トップカバーテープの最下部が前記キャリヤテープの上面よりも低い位置となるように、前記溝部に前記トップカバーテープを接着することを特徴とする電子部品の梱包方法。   6. The method of packing electronic components according to claim 5, wherein the carrier tape having the top cover tape adhered to the upper surface of the carrier tape and the top cover tape adhered to the groove is placed horizontally. And packing the top cover tape in the groove so that the lowermost portion of the top cover tape in the groove is lower than the upper surface of the carrier tape. その長手方向に沿って電子部品収納用の凹部が列設されたキャリヤテープの前記凹部に電子部品を収納し、前記凹部の開口部を覆うように前記キャリヤテープの上面にトップカバーテープを貼着した後、前記トップカバーテープの少なくとも一部を加熱収縮させることを特徴とする電子部品の梱包方法。
Electronic parts are stored in the recesses of the carrier tape in which recesses for storing electronic components are arranged along the longitudinal direction, and a top cover tape is attached to the upper surface of the carrier tape so as to cover the openings of the recesses. Then, at least a part of the top cover tape is heated and shrunk, and the electronic component packaging method is characterized in that:
JP2006001959A 2006-01-10 2006-01-10 Carrier tape, electronic component packaging body, and electronic component packaging method Expired - Fee Related JP4822845B2 (en)

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WO2011024860A1 (en) * 2009-08-31 2011-03-03 旭化成ケミカルズ株式会社 Cover tape, method for manufacturing cover tape, and electronic part package
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