JP2007180924A - Method of sealing quartz oscillator container - Google Patents
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- JP2007180924A JP2007180924A JP2005377241A JP2005377241A JP2007180924A JP 2007180924 A JP2007180924 A JP 2007180924A JP 2005377241 A JP2005377241 A JP 2005377241A JP 2005377241 A JP2005377241 A JP 2005377241A JP 2007180924 A JP2007180924 A JP 2007180924A
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Abstract
Description
本発明はガラスなどから成る板状の部材に挟まれて気密封止された水晶振動子容器の封止方法に関する。 The present invention relates to a sealing method for a crystal resonator container which is hermetically sealed by being sandwiched between plate-like members made of glass or the like.
従来から、一般的に水晶振動子は周囲の温度・湿度変化や、微細な異物の水晶振動子素板への付着によってその振動が抑制されるおそれを無くすためにパッケージ内部に水晶振動素子が搭載された後に気密封止されて使用されているが、水晶振動子が搭載される情報端末といった電子機器の急速な小型化や高周波化に対応するために、前述の個々の水晶振動子でパッケージを形成するのに対して、水晶振動子が複数個同時に形成されたウェーハの形態でその上下方向から同様の形状のウェーハといった板状の部材を用いて封止した後に、それぞれ個々の水晶振動子に個割り切断して小型のチップ形状をした水晶振動子を製造する技術が実現されている。 Conventionally, a crystal resonator is generally mounted inside the package to eliminate the risk of vibration suppression due to changes in ambient temperature and humidity, and the attachment of fine foreign objects to the crystal resonator base plate. However, in order to cope with the rapid miniaturization and high frequency of electronic devices such as information terminals on which crystal units are mounted, packages are used with the aforementioned individual crystal units. In contrast to the formation of a wafer in which a plurality of crystal resonators are formed at the same time, after sealing with a plate-like member such as a wafer of the same shape from the top and bottom, each crystal resonator is A technique for manufacturing a crystal resonator having a small chip shape by cutting into pieces has been realized.
先述の水晶振動子が複数個同時に形成されたウェーハの形態でその上下方向から挟むようにして板状の部材を用いて封止する方法としては、板状の部材にガラスなどを用いて、陽極接合や直接接合といった接合方法を用いて個々の水晶振動子を一括的に気密封止することが生産効率も良く適している。 As a method of sealing using a plate-like member so as to be sandwiched from above and below in the form of a wafer in which a plurality of the above-described crystal resonators are simultaneously formed, glass or the like is used for the plate-like member, and anodic bonding or It is also suitable in terms of production efficiency that the individual crystal resonators are collectively hermetically sealed using a bonding method such as direct bonding.
なお、出願人は前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を、本件出願時までに発見するに至らなかった。 The applicant has not found any prior art documents related to the present invention other than the prior art documents specified by the prior art document information described above by the time of filing of the present application.
しかしながら、従来の水晶振動子パッケージにはセラミック基板が多く使用されており、このセラミックパッケージにスルーホール(貫通孔)やビアホールを形成し図3に示すようなスキージを使用した方法や、図4に示されるようなディスペンサで樹脂を貫通孔に注入するといった方法や、または、配線が施されるメッキの厚みを厚くして、ホール内部をメッキ材で満たして気密封止が行われていたが、先述のようなガラスパッケージを水晶振動子に使用する場合においても、パッケージ内部から外部にかけて配線のためにスルーホールをあけ配線を施した後に、水晶振動子の特性を維持する為にスルーホールを塞いで気密封止する必要があるが、ガラスパッケージにスルーホールをあけて配線後にスルーホール内部を封止材で満たして気密封止をする工法がこれまで確立されていないといった問題があった。 However, a ceramic substrate is often used in the conventional crystal unit package, and a method of using a squeegee as shown in FIG. 3 by forming a through hole (through hole) or a via hole in the ceramic package, or FIG. The method of injecting resin into the through-hole with a dispenser as shown, or the thickness of the plating on which wiring is applied was increased, and the inside of the hole was filled with a plating material, and hermetic sealing was performed, Even when the glass package as described above is used for a crystal unit, after the through hole is formed for wiring from the inside of the package to the outside, the through hole is closed to maintain the characteristics of the crystal unit. However, it is necessary to open a through hole in the glass package and fill the inside of the through hole with a sealing material after wiring. Method for the sealing is a problem not been established so far.
本発明は、以上のような技術的背景のもとでなされたものであり、従がってその目的は、ガラスなどから成る板状の部材に挟まれて封止された水晶振動子容器の封止方法を提供することである。 The present invention has been made under the technical background as described above. Accordingly, the object of the present invention is to provide a quartz resonator container sealed by being sandwiched between plate-like members made of glass or the like. It is to provide a sealing method.
上記の目的を達成するために本発明は、水晶振動子が多数個形成された第一のウェーハを挟むように上下方向からそれぞれガラスなどの部材から成る複数の水晶振動子容器が形成された第二のウェーハで気密封止される個々の水晶振動子容器の封止方法において、
球状の熱溶解する材料を先の第二のウェーハ上に散らす工程と、第二のウェーハを揺動して、球状の熱溶解する材料を第二のウェーハの貫通孔に落とし込む工程と、球状の熱溶解する材料を溶かして貫通孔を塞ぎ、水晶振動子を気密封止する工程とから成ることを特徴とする。
In order to achieve the above object, the present invention provides a first embodiment in which a plurality of crystal resonator containers each made of a member such as glass are formed from above and below so as to sandwich a first wafer on which a large number of crystal resonators are formed. In the sealing method of the individual crystal resonator container hermetically sealed with two wafers,
Dispersing the spherical heat-dissolving material on the second wafer, swinging the second wafer, dropping the spherical heat-dissolving material into the through hole of the second wafer, And a step of sealing a crystal resonator in an airtight manner by melting a material to be thermally melted to close the through hole.
また、水晶振動子のスルーホール(貫通孔)が略円錐形とされており、球状の熱溶解する材料が第二のウェーハの貫通孔内に留められることを特徴とする。 In addition, the through hole (through hole) of the crystal resonator has a substantially conical shape, and a spherical heat-melting material is retained in the through hole of the second wafer.
また、球状の熱溶解する材料が少なくとも低融点ガラス、樹脂、金属のひとつから形成されていることを特徴とする。 The spherical heat-melting material is formed of at least one of low-melting glass, resin, and metal.
本発明の水晶振動子容器の封止方法により、マスキングなどの手間をかけること無く、スルーホールに封止材料を入れて加熱するだけで封止することが出来、その結果、生産コストを抑えて生産性を著しく高めることが出来る。 With the method for sealing a crystal resonator container according to the present invention, sealing can be performed simply by putting a sealing material in a through hole and heating without taking time and effort such as masking. Productivity can be significantly increased.
また、本発明の水晶振動子容器の封止方法により、従来のディスペンサを使用したスルーホールの封止方法に比べて、スルーホールの位置確認を行う必要が無く、揺動(振り込み)作業により一括的に複数のスルーホール内に封止材を入れることが出来、封止材の供給位置の制御、及び塗布量制御の必要が無く著しく生産設備コストを抑制することが出来る。 In addition, the method for sealing a crystal resonator container according to the present invention eliminates the need to check the position of the through hole as compared with the conventional method for sealing a through hole using a dispenser. Therefore, it is possible to put a sealing material into a plurality of through holes, and it is not necessary to control the supply position of the sealing material and control the coating amount, thereby significantly reducing the production equipment cost.
また、本発明の水晶振動子容器の封止方法により、スルーホールの形状が略円錐形とされて封止材が入れられる側の孔径が、他の孔径よりも大きいために、球状の封止材料が孔に入り易く、かつ孔内部に封止材料が留められるためにスルーホールの孔径の大きい側外部にはみだすおそれが無いといった効果を奏する。 In addition, since the through hole has a substantially conical shape and the hole diameter on the side where the sealing material is put is larger than the other hole diameters by the sealing method of the quartz crystal container of the present invention, the spherical sealing is performed. Since the material is easy to enter the hole and the sealing material is retained inside the hole, there is an effect that there is no possibility that the material will protrude outside the through hole having a large hole diameter.
以下に図面を参照しながら本発明の実施の一形態について説明する。なお、各図においての同一の符号は同じ対象を示すものとする。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol in each figure shall show the same object.
図1は本発明の水晶振動子容器3の封止方法の工程図である。即ち、水晶振動子1が複数個形成された第一のウェーハ2を挟むように上下方向からそれぞれガラスなどの材料から成る複数の水晶振動子容器3が形成された第二のウェーハ4で気密封止される個々の水晶振動子容器3の封止方法において、まず球状の熱溶解する材料5を先の第二のウェーハ4上に散らし(S101)、次に第二のウェーハ4を揺動して、球状の熱溶解する材料5を第二のウェーハの貫通孔6に落とし込み(S102)、最後に球状の熱溶解する材料5を溶かして貫通孔6を塞いで水晶振動子1を気密封止する(S103)。 球状の封止材には低融点ガラス、樹脂、金属など様々なものがあり、この内のいずれかひとつ、若しくは複数種が混ぜ合わされていても全く構わず、これらの場合も本発明の技術的範囲に含まれることは言うまでも無い。
FIG. 1 is a process diagram of a sealing method for a
図2は本発明の水晶振動子容器3のスルーホール(貫通孔)の封止方法を示したA−A‘を結ぶ側面方向からみた概略の模式図である。即ち、球状の熱で溶ける材料5をスルーホール(貫通孔)6の形成されたガラスウェーハ上に散らし、ガラスウェーハを揺動(振込み動作)して、先の球状の熱溶解する封止材5をスルーホール6内に落とし込む。このとき、スルーホール6に入らない封止材は、ガラスウェーハ上から除く。更に、ガラスウェーハ、若しくはスルーホール6部の温度を封止材の融点まで上げて封止材を溶かし、その後冷却して封止材を固めてスルーホール6を真空雰囲気のなかで封止することにより、ガラスウェーハで挟まれた水晶振動子1が気密封止される。スルーホール6の直径は0.1mm程度のものである。ガラスウェーハ、若しくはスルーホール6部の温度を封止材の融点まで上げて封止材を溶かす時間と、その後冷却して封止材を固める時間をそれぞれ調整することにより、スルーホール6の孔径の小さな側から溶けた封止材が流れ出ることを防ぐことが出来る。
FIG. 2 is a schematic schematic view seen from the side surface connecting A-A ′ showing a method of sealing a through hole (through hole) of the
図3は従来のセラミックパッケージにスルーホール(貫通孔)やビアホールを形成し、スキージを使用して封止する方法を示した側面方向からみた概略の模式図である。 FIG. 3 is a schematic diagram viewed from the side showing a method of forming a through hole (through hole) or a via hole in a conventional ceramic package and sealing using a squeegee.
図4は従来のセラミックパッケージにスルーホール(貫通孔)やビアホールを形成し、ディスペンサで樹脂を貫通孔に注入して封止する方法を示した側面方向からみた概略の模式図である。 FIG. 4 is a schematic diagram viewed from the side showing a method of forming a through hole (through hole) or a via hole in a conventional ceramic package and injecting resin into the through hole with a dispenser and sealing.
図5は従来の、水晶振動子が複数個同時に形成されたウェーハをその上下方向から挟むようにガラスなどの板状の部材を用いて封止されたシート状の基板を個割りして取り出された水晶振動子を側面方向からみた概略の模式図である。 FIG. 5 shows a conventional sheet-like substrate that is sealed using a plate-like member such as glass so as to sandwich a wafer on which a plurality of quartz crystal resonators are formed simultaneously from above and below. It is the schematic model which looked at the quartz crystal resonator from the side surface direction.
1 水晶振動子
2 第一のウェーハ
3 水晶振動子容器
4 第二のウェーハ
5 球状の熱溶解する材料
6 第二のウェーハの貫通孔
DESCRIPTION OF
Claims (3)
球状の熱溶解する材料を該第二のウェーハ上に散らす工程と、
該第二のウェーハを揺動して、該球状の熱溶解する材料を該第二のウェーハの貫通孔に落とし込む工程と、
該球状の熱溶解する材料を溶かして該貫通孔を塞ぎ、該水晶振動子を気密封止する工程と、
から成る水晶振動子容器の封止方法。 Each quartz crystal hermetically sealed with a second wafer formed with a plurality of crystal resonator containers made of a material such as glass from above and below so as to sandwich the first wafer on which a plurality of crystal resonators are formed. In the method for sealing the vibrator container,
Dispersing a spherical heat melting material on the second wafer;
Swinging the second wafer and dropping the spherical heat-melting material into the through hole of the second wafer;
Melting the spherical heat-melting material to close the through-hole, and hermetically sealing the crystal unit;
A method for sealing a crystal unit container comprising:
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Cited By (5)
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JP2009194788A (en) * | 2008-02-18 | 2009-08-27 | Seiko Instruments Inc | Method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device and radio clock |
JP2010087250A (en) * | 2008-09-30 | 2010-04-15 | Kyocera Kinseki Corp | Airtightness leak inspection device for wafer and airtightness leak inspection method for wafer |
JP2011129735A (en) * | 2009-12-18 | 2011-06-30 | Seiko Epson Corp | Method of manufacturing piezoelectric device |
US8334639B2 (en) | 2008-10-24 | 2012-12-18 | Seiko Epson Corporation | Package for electronic component, piezoelectric device and manufacturing method thereof |
US9148956B2 (en) | 2012-04-27 | 2015-09-29 | Seiko Epson Corporation | Base substrate, electronic device, and method of manufacturing base substrate |
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JPH07106890A (en) * | 1993-10-06 | 1995-04-21 | Matsushita Electric Ind Co Ltd | Manufacture of oscillator |
JP2000077965A (en) * | 1998-08-27 | 2000-03-14 | Seiko Epson Corp | Piezoelectric vibrator and sealing method for piezoelectric vibration element |
JP2004056760A (en) * | 2002-05-31 | 2004-02-19 | Seiko Epson Corp | Piezoelectric device, package for piezoelectric device, manufacture of piezoelectric device, mobile telephone equipment utilizing piezoelectric device and electronic equipment utilizing piezoelectric device |
JP2005109886A (en) * | 2003-09-30 | 2005-04-21 | Seiko Epson Corp | Piezoelectric device, manufacturing method thereof, cellular telephone apparatus using the same, and electronic apparatus using the same |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH07106890A (en) * | 1993-10-06 | 1995-04-21 | Matsushita Electric Ind Co Ltd | Manufacture of oscillator |
JP2000077965A (en) * | 1998-08-27 | 2000-03-14 | Seiko Epson Corp | Piezoelectric vibrator and sealing method for piezoelectric vibration element |
JP2004056760A (en) * | 2002-05-31 | 2004-02-19 | Seiko Epson Corp | Piezoelectric device, package for piezoelectric device, manufacture of piezoelectric device, mobile telephone equipment utilizing piezoelectric device and electronic equipment utilizing piezoelectric device |
JP2005109886A (en) * | 2003-09-30 | 2005-04-21 | Seiko Epson Corp | Piezoelectric device, manufacturing method thereof, cellular telephone apparatus using the same, and electronic apparatus using the same |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009194788A (en) * | 2008-02-18 | 2009-08-27 | Seiko Instruments Inc | Method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device and radio clock |
JP2010087250A (en) * | 2008-09-30 | 2010-04-15 | Kyocera Kinseki Corp | Airtightness leak inspection device for wafer and airtightness leak inspection method for wafer |
US8334639B2 (en) | 2008-10-24 | 2012-12-18 | Seiko Epson Corporation | Package for electronic component, piezoelectric device and manufacturing method thereof |
CN101729037B (en) * | 2008-10-24 | 2013-05-08 | 精工爱普生株式会社 | Package for electronic component, piezoelectric device and manufacturing method thereof |
JP2011129735A (en) * | 2009-12-18 | 2011-06-30 | Seiko Epson Corp | Method of manufacturing piezoelectric device |
US9148956B2 (en) | 2012-04-27 | 2015-09-29 | Seiko Epson Corporation | Base substrate, electronic device, and method of manufacturing base substrate |
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