JP2007180924A - Method of sealing quartz oscillator container - Google Patents

Method of sealing quartz oscillator container Download PDF

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JP2007180924A
JP2007180924A JP2005377241A JP2005377241A JP2007180924A JP 2007180924 A JP2007180924 A JP 2007180924A JP 2005377241 A JP2005377241 A JP 2005377241A JP 2005377241 A JP2005377241 A JP 2005377241A JP 2007180924 A JP2007180924 A JP 2007180924A
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hole
wafer
sealing
crystal
glass
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Yoshinori Nasu
義紀 那須
Hirokazu Kobayashi
宏和 小林
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Kyocera Crystal Device Corp
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Kyocera Crystal Device Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of sealing a through hole of a quartz oscillator container which is pinched by the plate-like member of glass or the like and is hermetically sealed. <P>SOLUTION: The sealing method includes a processing in which a globular material which is thermally melted is dispersed on a second wafer, a process in which the second wafer is rocked so that the globular material which is thermally melted drops into a through hole of the second wafer, and a process in which the globular material which is thermally melted is melted to stop the through hole so that a quartz oscillator is hermetically sealed. The through hole of the quartz oscillator is almost conical, and the globular material which is thermally melted is held in the through hole of the second wafer. The globular material which is thermally melted is made from at least low melting-point glass, resin, or metal. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明はガラスなどから成る板状の部材に挟まれて気密封止された水晶振動子容器の封止方法に関する。         The present invention relates to a sealing method for a crystal resonator container which is hermetically sealed by being sandwiched between plate-like members made of glass or the like.

従来から、一般的に水晶振動子は周囲の温度・湿度変化や、微細な異物の水晶振動子素板への付着によってその振動が抑制されるおそれを無くすためにパッケージ内部に水晶振動素子が搭載された後に気密封止されて使用されているが、水晶振動子が搭載される情報端末といった電子機器の急速な小型化や高周波化に対応するために、前述の個々の水晶振動子でパッケージを形成するのに対して、水晶振動子が複数個同時に形成されたウェーハの形態でその上下方向から同様の形状のウェーハといった板状の部材を用いて封止した後に、それぞれ個々の水晶振動子に個割り切断して小型のチップ形状をした水晶振動子を製造する技術が実現されている。         Conventionally, a crystal resonator is generally mounted inside the package to eliminate the risk of vibration suppression due to changes in ambient temperature and humidity, and the attachment of fine foreign objects to the crystal resonator base plate. However, in order to cope with the rapid miniaturization and high frequency of electronic devices such as information terminals on which crystal units are mounted, packages are used with the aforementioned individual crystal units. In contrast to the formation of a wafer in which a plurality of crystal resonators are formed at the same time, after sealing with a plate-like member such as a wafer of the same shape from the top and bottom, each crystal resonator is A technique for manufacturing a crystal resonator having a small chip shape by cutting into pieces has been realized.

先述の水晶振動子が複数個同時に形成されたウェーハの形態でその上下方向から挟むようにして板状の部材を用いて封止する方法としては、板状の部材にガラスなどを用いて、陽極接合や直接接合といった接合方法を用いて個々の水晶振動子を一括的に気密封止することが生産効率も良く適している。         As a method of sealing using a plate-like member so as to be sandwiched from above and below in the form of a wafer in which a plurality of the above-described crystal resonators are simultaneously formed, glass or the like is used for the plate-like member, and anodic bonding or It is also suitable in terms of production efficiency that the individual crystal resonators are collectively hermetically sealed using a bonding method such as direct bonding.

特開平７−１５４１８３号公報JP 7-154183 A 特開２０００−２８１４５９号公報Japanese Patent Laid-Open No. 2000-281459 特開２００１−１７７３６２号公報JP 2001-177362 A 特開２００１−２３０６５１号公報Japanese Patent Laid-Open No. 2001-230651

なお、出願人は前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を、本件出願時までに発見するに至らなかった。         The applicant has not found any prior art documents related to the present invention other than the prior art documents specified by the prior art document information described above by the time of filing of the present application.

しかしながら、従来の水晶振動子パッケージにはセラミック基板が多く使用されており、このセラミックパッケージにスルーホール（貫通孔）やビアホールを形成し図３に示すようなスキージを使用した方法や、図４に示されるようなディスペンサで樹脂を貫通孔に注入するといった方法や、または、配線が施されるメッキの厚みを厚くして、ホール内部をメッキ材で満たして気密封止が行われていたが、先述のようなガラスパッケージを水晶振動子に使用する場合においても、パッケージ内部から外部にかけて配線のためにスルーホールをあけ配線を施した後に、水晶振動子の特性を維持する為にスルーホールを塞いで気密封止する必要があるが、ガラスパッケージにスルーホールをあけて配線後にスルーホール内部を封止材で満たして気密封止をする工法がこれまで確立されていないといった問題があった。         However, a ceramic substrate is often used in the conventional crystal unit package, and a method of using a squeegee as shown in FIG. 3 by forming a through hole (through hole) or a via hole in the ceramic package, or FIG. The method of injecting resin into the through-hole with a dispenser as shown, or the thickness of the plating on which wiring is applied was increased, and the inside of the hole was filled with a plating material, and hermetic sealing was performed, Even when the glass package as described above is used for a crystal unit, after the through hole is formed for wiring from the inside of the package to the outside, the through hole is closed to maintain the characteristics of the crystal unit. However, it is necessary to open a through hole in the glass package and fill the inside of the through hole with a sealing material after wiring. Method for the sealing is a problem not been established so far.

本発明は、以上のような技術的背景のもとでなされたものであり、従がってその目的は、ガラスなどから成る板状の部材に挟まれて封止された水晶振動子容器の封止方法を提供することである。         The present invention has been made under the technical background as described above. Accordingly, the object of the present invention is to provide a quartz resonator container sealed by being sandwiched between plate-like members made of glass or the like. It is to provide a sealing method.

上記の目的を達成するために本発明は、水晶振動子が多数個形成された第一のウェーハを挟むように上下方向からそれぞれガラスなどの部材から成る複数の水晶振動子容器が形成された第二のウェーハで気密封止される個々の水晶振動子容器の封止方法において、
球状の熱溶解する材料を先の第二のウェーハ上に散らす工程と、第二のウェーハを揺動して、球状の熱溶解する材料を第二のウェーハの貫通孔に落とし込む工程と、球状の熱溶解する材料を溶かして貫通孔を塞ぎ、水晶振動子を気密封止する工程とから成ることを特徴とする。 In order to achieve the above object, the present invention provides a first embodiment in which a plurality of crystal resonator containers each made of a member such as glass are formed from above and below so as to sandwich a first wafer on which a large number of crystal resonators are formed. In the sealing method of the individual crystal resonator container hermetically sealed with two wafers,
Dispersing the spherical heat-dissolving material on the second wafer, swinging the second wafer, dropping the spherical heat-dissolving material into the through hole of the second wafer, And a step of sealing a crystal resonator in an airtight manner by melting a material to be thermally melted to close the through hole.

また、水晶振動子のスルーホール（貫通孔）が略円錐形とされており、球状の熱溶解する材料が第二のウェーハの貫通孔内に留められることを特徴とする。         In addition, the through hole (through hole) of the crystal resonator has a substantially conical shape, and a spherical heat-melting material is retained in the through hole of the second wafer.

また、球状の熱溶解する材料が少なくとも低融点ガラス、樹脂、金属のひとつから形成されていることを特徴とする。         The spherical heat-melting material is formed of at least one of low-melting glass, resin, and metal.

本発明の水晶振動子容器の封止方法により、マスキングなどの手間をかけること無く、スルーホールに封止材料を入れて加熱するだけで封止することが出来、その結果、生産コストを抑えて生産性を著しく高めることが出来る。         With the method for sealing a crystal resonator container according to the present invention, sealing can be performed simply by putting a sealing material in a through hole and heating without taking time and effort such as masking. Productivity can be significantly increased.

また、本発明の水晶振動子容器の封止方法により、従来のディスペンサを使用したスルーホールの封止方法に比べて、スルーホールの位置確認を行う必要が無く、揺動（振り込み）作業により一括的に複数のスルーホール内に封止材を入れることが出来、封止材の供給位置の制御、及び塗布量制御の必要が無く著しく生産設備コストを抑制することが出来る。         In addition, the method for sealing a crystal resonator container according to the present invention eliminates the need to check the position of the through hole as compared with the conventional method for sealing a through hole using a dispenser. Therefore, it is possible to put a sealing material into a plurality of through holes, and it is not necessary to control the supply position of the sealing material and control the coating amount, thereby significantly reducing the production equipment cost.

また、本発明の水晶振動子容器の封止方法により、スルーホールの形状が略円錐形とされて封止材が入れられる側の孔径が、他の孔径よりも大きいために、球状の封止材料が孔に入り易く、かつ孔内部に封止材料が留められるためにスルーホールの孔径の大きい側外部にはみだすおそれが無いといった効果を奏する。         In addition, since the through hole has a substantially conical shape and the hole diameter on the side where the sealing material is put is larger than the other hole diameters by the sealing method of the quartz crystal container of the present invention, the spherical sealing is performed. Since the material is easy to enter the hole and the sealing material is retained inside the hole, there is an effect that there is no possibility that the material will protrude outside the through hole having a large hole diameter.

以下に図面を参照しながら本発明の実施の一形態について説明する。なお、各図においての同一の符号は同じ対象を示すものとする。         Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol in each figure shall show the same object.

図１は本発明の水晶振動子容器３の封止方法の工程図である。即ち、水晶振動子１が複数個形成された第一のウェーハ２を挟むように上下方向からそれぞれガラスなどの材料から成る複数の水晶振動子容器３が形成された第二のウェーハ４で気密封止される個々の水晶振動子容器３の封止方法において、まず球状の熱溶解する材料５を先の第二のウェーハ４上に散らし（Ｓ１０１）、次に第二のウェーハ４を揺動して、球状の熱溶解する材料５を第二のウェーハの貫通孔６に落とし込み（Ｓ１０２）、最後に球状の熱溶解する材料５を溶かして貫通孔６を塞いで水晶振動子１を気密封止する（Ｓ１０３）。 球状の封止材には低融点ガラス、樹脂、金属など様々なものがあり、この内のいずれかひとつ、若しくは複数種が混ぜ合わされていても全く構わず、これらの場合も本発明の技術的範囲に含まれることは言うまでも無い。       FIG. 1 is a process diagram of a sealing method for a crystal resonator container 3 according to the present invention. That is, the second wafer 4 in which a plurality of crystal resonator containers 3 made of a material such as glass are formed from above and below so as to sandwich the first wafer 2 on which a plurality of crystal resonators 1 are formed is hermetically sealed. In the sealing method of the individual crystal resonator containers 3 to be stopped, the spherical heat-melting material 5 is first scattered on the second wafer 4 (S101), and then the second wafer 4 is swung. Then, the spherical heat-dissolving material 5 is dropped into the through-hole 6 of the second wafer (S102), and finally the spherical heat-dissolving material 5 is melted to close the through-hole 6 to hermetically seal the crystal unit 1. (S103). There are various spherical sealing materials such as low-melting glass, resin, and metal, and any one of them or a mixture of plural kinds may be used. Needless to say, it is included in the range.

図２は本発明の水晶振動子容器３のスルーホール（貫通孔）の封止方法を示したＡ−Ａ‘を結ぶ側面方向からみた概略の模式図である。即ち、球状の熱で溶ける材料５をスルーホール（貫通孔）６の形成されたガラスウェーハ上に散らし、ガラスウェーハを揺動（振込み動作）して、先の球状の熱溶解する封止材５をスルーホール６内に落とし込む。このとき、スルーホール６に入らない封止材は、ガラスウェーハ上から除く。更に、ガラスウェーハ、若しくはスルーホール６部の温度を封止材の融点まで上げて封止材を溶かし、その後冷却して封止材を固めてスルーホール６を真空雰囲気のなかで封止することにより、ガラスウェーハで挟まれた水晶振動子１が気密封止される。スルーホール６の直径は０．１ｍｍ程度のものである。ガラスウェーハ、若しくはスルーホール６部の温度を封止材の融点まで上げて封止材を溶かす時間と、その後冷却して封止材を固める時間をそれぞれ調整することにより、スルーホール６の孔径の小さな側から溶けた封止材が流れ出ることを防ぐことが出来る。         FIG. 2 is a schematic schematic view seen from the side surface connecting A-A ′ showing a method of sealing a through hole (through hole) of the crystal resonator container 3 of the present invention. That is, the spherical material 5 is melted by scattering the spherical material 5 on the glass wafer on which the through holes (through holes) 6 are formed, and the glass wafer is swung (transferring operation). Into the through hole 6. At this time, the sealing material that does not enter the through hole 6 is removed from the glass wafer. Furthermore, the temperature of the glass wafer or through-hole 6 part is raised to the melting point of the sealing material to melt the sealing material, and then cooled to solidify the sealing material and seal the through-hole 6 in a vacuum atmosphere. Thus, the quartz crystal resonator 1 sandwiched between the glass wafers is hermetically sealed. The diameter of the through hole 6 is about 0.1 mm. By adjusting the time for melting the sealing material by raising the temperature of the glass wafer or the through-hole 6 part to the melting point of the sealing material and the time for cooling and solidifying the sealing material thereafter, the hole diameter of the through-hole 6 is adjusted. The melted sealing material can be prevented from flowing out from the small side.

図３は従来のセラミックパッケージにスルーホール（貫通孔）やビアホールを形成し、スキージを使用して封止する方法を示した側面方向からみた概略の模式図である。         FIG. 3 is a schematic diagram viewed from the side showing a method of forming a through hole (through hole) or a via hole in a conventional ceramic package and sealing using a squeegee.

図４は従来のセラミックパッケージにスルーホール（貫通孔）やビアホールを形成し、ディスペンサで樹脂を貫通孔に注入して封止する方法を示した側面方向からみた概略の模式図である。         FIG. 4 is a schematic diagram viewed from the side showing a method of forming a through hole (through hole) or a via hole in a conventional ceramic package and injecting resin into the through hole with a dispenser and sealing.

図５は従来の、水晶振動子が複数個同時に形成されたウェーハをその上下方向から挟むようにガラスなどの板状の部材を用いて封止されたシート状の基板を個割りして取り出された水晶振動子を側面方向からみた概略の模式図である。         FIG. 5 shows a conventional sheet-like substrate that is sealed using a plate-like member such as glass so as to sandwich a wafer on which a plurality of quartz crystal resonators are formed simultaneously from above and below. It is the schematic model which looked at the quartz crystal resonator from the side surface direction.

本発明の水晶振動子容器の封止方法の工程図である。It is process drawing of the sealing method of the crystal oscillator container of this invention. 本発明の水晶振動子容器の封止方法を示したＡ−Ａ‘を結ぶ側面方向からみた概略の模式図である。It is the schematic model seen from the side direction which ties A-A 'which showed the sealing method of the crystal oscillator container of the present invention. 従来のセラミックパッケージにスルーホール（貫通孔）やビアホールを形成し、スキージを使用して封止する方法を示した側面方向からみた概略の模式図である。It is the schematic model seen from the side direction which showed the method of forming a through-hole (through-hole) and a via hole in the conventional ceramic package, and sealing using a squeegee. 従来のセラミックパッケージにスルーホール（貫通孔）やビアホールを形成し、ディスペンサで樹脂を貫通孔に注入して封止する方法を示した側面方向からみた概略の模式図である。It is the schematic model seen from the side direction which showed the method of forming a through hole (through-hole) and a via hole in the conventional ceramic package, and inject | pouring resin into a through-hole with a dispenser and sealing. 従来の水晶振動子が複数個同時に形成されたウェーハをその上下方向から挟むようにして板状の部材を用いて封止されたシート状の基板を個割りして取り出された水晶振動子を側面方向からみた概略の模式図である。A quartz crystal unit taken out by dividing a sheet-like substrate sealed with a plate-like member so as to sandwich a wafer on which a plurality of conventional crystal units are simultaneously formed from above and below is taken from the side surface direction. FIG.

符号の説明Explanation of symbols

１ 水晶振動子
２ 第一のウェーハ
３ 水晶振動子容器
４ 第二のウェーハ
５ 球状の熱溶解する材料
６ 第二のウェーハの貫通孔 DESCRIPTION OF SYMBOLS 1 Crystal oscillator 2 First wafer 3 Crystal oscillator container 4 Second wafer 5 Spherical heat-melting material 6 Through hole of second wafer

Claims (3)

水晶振動子が複数個形成された第一のウェーハを挟むように上下方向からそれぞれガラスなどの材料から成る複数の水晶振動子容器が形成された第二のウェーハで気密封止される個々の水晶振動子容器の封止方法において、
球状の熱溶解する材料を該第二のウェーハ上に散らす工程と、
該第二のウェーハを揺動して、該球状の熱溶解する材料を該第二のウェーハの貫通孔に落とし込む工程と、
該球状の熱溶解する材料を溶かして該貫通孔を塞ぎ、該水晶振動子を気密封止する工程と、
から成る水晶振動子容器の封止方法。 Each quartz crystal hermetically sealed with a second wafer formed with a plurality of crystal resonator containers made of a material such as glass from above and below so as to sandwich the first wafer on which a plurality of crystal resonators are formed. In the method for sealing the vibrator container,
Dispersing a spherical heat melting material on the second wafer;
Swinging the second wafer and dropping the spherical heat-melting material into the through hole of the second wafer;
Melting the spherical heat-melting material to close the through-hole, and hermetically sealing the crystal unit;
A method for sealing a crystal unit container comprising: 該水晶振動子のスルーホール（貫通孔）が略円錐形とされており、該球状の熱溶解する材料が該第二のウェーハの貫通孔内に留められることを特徴とする請求項１記載の水晶振動子容器の封止方法。         2. The through hole (through hole) of the quartz crystal resonator has a substantially conical shape, and the spherical heat-melting material is retained in the through hole of the second wafer. A method of sealing a crystal resonator container. 該球状の熱溶解する材料が少なくとも低融点ガラス、樹脂、金属のひとつから形成されていることを特徴とする請求項１記載の水晶振動子容器の封止方法。         2. The method for sealing a crystal unit container according to claim 1, wherein the spherical heat-melting material is formed of at least one of low melting glass, resin, and metal.
JP2005377241A 2005-12-28 2005-12-28 Method of sealing quartz oscillator container Pending JP2007180924A (en)

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US9148956B2 (en) 2012-04-27 2015-09-29 Seiko Epson Corporation Base substrate, electronic device, and method of manufacturing base substrate

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JP2004056760A (en) * 2002-05-31 2004-02-19 Seiko Epson Corp Piezoelectric device, package for piezoelectric device, manufacture of piezoelectric device, mobile telephone equipment utilizing piezoelectric device and electronic equipment utilizing piezoelectric device
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