JP2007180585A - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP2007180585A JP2007180585A JP2007083930A JP2007083930A JP2007180585A JP 2007180585 A JP2007180585 A JP 2007180585A JP 2007083930 A JP2007083930 A JP 2007083930A JP 2007083930 A JP2007083930 A JP 2007083930A JP 2007180585 A JP2007180585 A JP 2007180585A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting element
- reflecting
- reflecting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
【解決手段】 本発明の発光装置は、第1の光を発生する発光素子1と、上方に突出しており側面に光反射層2cが設けられた発光素子1の載置部2aを備えた基体2と、発光素子1を囲み第1の光を反射する第1の面3aと、載置部の光反射層に接する第2の面とを有する反射部材3と、を有する。
【選択図】 図3
Description
2:基体
2a:載置部
2b:載置領域
2c:光反射層
3:反射部材
3a:反射面(第1の面)
4:発光装置
5:反射治具
6:発光装置駆動回路基板
Claims (5)
- 第1の光を発生する発光素子と、
上方に突出しており側面に光反射層が設けられた前記発光素子の載置部を備えた基体と、
前記発光素子を囲み前記第1の光を反射する第1の面と、前記載置部の前記光反射層に接する第2の面とを有する反射部材と、を有することを特徴とする発光装置。 - 前記光反射層が金属からなることを特徴とする請求項1に記載の発光装置。
- 前記光反射層は、モリブデンを含む第1の層と、ニッケルを含む第2の層が積層された構造からなることを特徴とする請求項2に記載の発光装置。
- 前記光反射層は前記基体の前記載置部の上面から前記側面にかけて設けられていることを特徴とする請求項1〜3のいずれかに記載の発光装置。
- 前記発光素子は、前記基体の前記載置部にフリップチップ実装されていることを特徴とする請求項1〜4のいずれかに記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007083930A JP4480736B2 (ja) | 2003-06-26 | 2007-03-28 | 発光装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003183454 | 2003-06-26 | ||
JP2007083930A JP4480736B2 (ja) | 2003-06-26 | 2007-03-28 | 発光装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004071425A Division JP2005039194A (ja) | 2003-06-26 | 2004-03-12 | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007180585A true JP2007180585A (ja) | 2007-07-12 |
JP4480736B2 JP4480736B2 (ja) | 2010-06-16 |
Family
ID=38305370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007083930A Expired - Fee Related JP4480736B2 (ja) | 2003-06-26 | 2007-03-28 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4480736B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011258801A (ja) * | 2010-06-10 | 2011-12-22 | Citizen Electronics Co Ltd | 発光ダイオード |
-
2007
- 2007-03-28 JP JP2007083930A patent/JP4480736B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011258801A (ja) * | 2010-06-10 | 2011-12-22 | Citizen Electronics Co Ltd | 発光ダイオード |
Also Published As
Publication number | Publication date |
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JP4480736B2 (ja) | 2010-06-16 |
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