JP2007157707A - Led backlight device - Google Patents

Led backlight device Download PDF

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Publication number
JP2007157707A
JP2007157707A JP2006307473A JP2006307473A JP2007157707A JP 2007157707 A JP2007157707 A JP 2007157707A JP 2006307473 A JP2006307473 A JP 2006307473A JP 2006307473 A JP2006307473 A JP 2006307473A JP 2007157707 A JP2007157707 A JP 2007157707A
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Prior art keywords
guide plate
light guide
led
light
backlight device
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JP2006307473A
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Japanese (ja)
Inventor
In Geol An
ゴル アン、イン
Jong Jin Park
ジン パク、ジョン
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication of JP2007157707A publication Critical patent/JP2007157707A/en
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/002Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
    • G02B6/0021Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0016Grooves, prisms, gratings, scattering particles or rough surfaces
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068Arrangements of plural sources, e.g. multi-colour light sources

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Planar Illumination Modules (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED backlight device. <P>SOLUTION: This LED backlight device is provided with: a light guide plate having opposing corners in a width direction on one side surface thereof extended to form a pair of opposing walls and a recessed part therebetween; and an LED light source accommodated in the recessed part to project light into the light guide plate. The recessed part is thus formed on the one side surface of the light guide plate to arrange the LED package in the recessed part, whereby, while minimizing loss when light is incident from the LED package into the light guide plate, the LED package is stably aligned with respect to the light guide plate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、LEDバックライト装置に関し、より具体的には導光板の一側面に凹部を形成し、該凹部内にLED(発光ダイオード)パッケージを装着することによって、光がLEDパッケージから導光板内に入射される際の損失を最小化しながらLEDパッケージと導光板を安定的に位置合わせできるLEDバックライト装置に関する。   The present invention relates to an LED backlight device, and more specifically, a concave portion is formed on one side surface of a light guide plate, and an LED (light emitting diode) package is mounted in the concave portion, whereby light is transmitted from the LED package into the light guide plate. The present invention relates to an LED backlight device capable of stably aligning an LED package and a light guide plate while minimizing a loss when being incident on the LED.

液晶表示装置(LCD)自体は光源がないため外部照明を要し、一般的にバックライト装置を照明装置として使用する。バックライト装置はLCDを後方から照らし、CCFL(Cold Cathode Fluorescent Lamp)、LEDなどを光源とする。   Since the liquid crystal display (LCD) itself does not have a light source, external illumination is required, and a backlight device is generally used as the illumination device. The backlight device illuminates the LCD from the back, and uses a CCFL (Cold Cathode Fluorescent Lamp), LED, or the like as a light source.

これらの中で、LEDを光源とするバックライト装置、即ち、LEDバックライト装置の例が図1に示されている。   Among these, an example of a backlight device using an LED as a light source, that is, an LED backlight device is shown in FIG.

LEDバックライト装置10は、LEDパッケージ20と導光板30とを含む。なお、図示しないが、当該分野に公知されたように、これらを取り囲むハウジングと導光板30の下面36の散乱パターンと反射板がさらに設けられる。   The LED backlight device 10 includes an LED package 20 and a light guide plate 30. Although not shown, a housing surrounding them, a scattering pattern on the lower surface 36 of the light guide plate 30, and a reflecting plate are further provided as known in the art.

LEDパッケージ20はLEDチップ22と、該LEDチップ22を支持しながら電源を供給する一対のリードフレーム24及びこれらを取り囲むパッケージ本体26とを含む。パッケージ本体26はLEDチップ22から発生した光が前方、即ち、導光板30側に放出されるようにLED窓、即ち、透明な部分を含む。   The LED package 20 includes an LED chip 22, a pair of lead frames 24 that supply power while supporting the LED chip 22, and a package body 26 that surrounds them. The package body 26 includes an LED window, i.e., a transparent portion, so that light generated from the LED chip 22 is emitted forward, i.e., toward the light guide plate 30.

LEDパッケージ20から導光板30へ放出された光Lは、導光板30の前方30a側の側面32を介して導光板30内に入射された後、後方30b側へ進行する。その後、導光板30の上面34と下面36で内部反射され導光板30内を伝播した後、前述した散乱パターンと反射板によって導光板30の上面34を介して上方へ放出される。放出された光は、通常、導光板30の上部に配置された(図示せず)拡散板及びプリズムシートなどを介してLCDの液晶パネルに入射されバックライト照明を提供するようになる。   The light L emitted from the LED package 20 to the light guide plate 30 enters the light guide plate 30 through the side surface 32 on the front 30a side of the light guide plate 30, and then proceeds to the rear 30b side. Thereafter, the light is internally reflected by the upper surface 34 and the lower surface 36 of the light guide plate 30 and propagates through the light guide plate 30, and then is emitted upward through the upper surface 34 of the light guide plate 30 by the scattering pattern and the reflection plate described above. The emitted light is normally incident on the liquid crystal panel of the LCD through a diffusion plate (not shown) and a prism sheet (not shown) disposed on the light guide plate 30 to provide backlight illumination.

ここで、便宜上、光LはLEDチップ22の一地点Fから出るもので示した。   Here, for the sake of convenience, the light L is shown as being emitted from one point F of the LED chip 22.

一方、LEDパッケージ20から導光板30に放出された光の一部L1は導光板30の側面32の縁において入射できず反射され光の損失が生じることもある。もちろん、LEDパッケージ20を導光板30に付着すればこのような光の損失を減らすことが可能である。   On the other hand, a part of the light L1 emitted from the LED package 20 to the light guide plate 30 cannot be incident on the edge of the side surface 32 of the light guide plate 30 and is reflected to cause light loss. Of course, if the LED package 20 is attached to the light guide plate 30, it is possible to reduce such light loss.

しかしながら、そのようにしても依然として、通常の白色光を得るためにRGB−LEDを組み合わせて使用することを考慮した時、各々のRGB−LEDパッケージから放出された光が混合され白色が得られるまでの距離を確保しなければならない。即ち、導光板30を図1の間隔dだけ延長させLEDパッケージ20と接触させてもこの間隔dだけの領域は液晶パネルの照明領域として使用することができず、間隔dはLCDにおいてベゼル幅(Bezel width)に含まれるだけである。そのため、LEDパッケージを導光板に付着しても全体ベゼル幅は減少しないという問題が依然として存在する。さらに、導光板が必要以上増加することにより全体LEDバックライト装置の重さが増加するという問題を有する。   However, even so, when considering using RGB-LED combinations to obtain normal white light, the light emitted from each RGB-LED package is mixed until a white color is obtained. Must keep the distance. That is, even if the light guide plate 30 is extended by the distance d shown in FIG. 1 and brought into contact with the LED package 20, the area corresponding to the distance d cannot be used as the illumination area of the liquid crystal panel. Bezel width). Therefore, there is still a problem that the overall bezel width does not decrease even when the LED package is attached to the light guide plate. Furthermore, when the light guide plate increases more than necessary, there is a problem that the weight of the entire LED backlight device increases.

また、図1に示すように、LEDパッケージ20を導光板30の側面に配置する際、次のような問題も生じる。LEDパッケージ20は導光板30の外側に配置されるため、バックライト装置10の組立中に他のものと衝突する恐れがあり、導光板30と精緻に整列しにくい。また、LEDパッケージ20はハウジングに付着され固定されると、ハウジングに外部衝撃が加えられた際、その衝撃がLEDパッケージ20に直接伝達されるという問題もある。   Further, as shown in FIG. 1, when the LED package 20 is disposed on the side surface of the light guide plate 30, the following problem also occurs. Since the LED package 20 is disposed outside the light guide plate 30, there is a risk of colliding with another during assembly of the backlight device 10, and it is difficult to precisely align with the light guide plate 30. Further, when the LED package 20 is attached and fixed to the housing, there is a problem that when an external impact is applied to the housing, the impact is directly transmitted to the LED package 20.

したがって、本発明は前述した従来技術の問題を解決するために案出されたもので、本発明の目的は導光板の一側面に凹部を形成し、この凹部中にLEDパッケージを装着することによって、光がLEDパッケージから導光板の中に入射される際の損失を最小化しながらLEDパッケージと導光板を安定的に位置合わせできるLCD用LEDバックライト装置を提供することである。   Accordingly, the present invention has been devised to solve the above-described problems of the prior art, and the object of the present invention is to form a recess on one side of the light guide plate and to mount the LED package in the recess. It is an object of the present invention to provide an LED backlight device for an LCD that can stably align the LED package and the light guide plate while minimizing a loss when light enters the light guide plate from the LED package.

本発明の他の目的は、上記凹部の壁面に凹凸を形成してLEDパッケージから導光板内に入射される光の入射角を広げることによって、白色光を得るための色混合に必要な距離を減らすことのできるLCD用LEDバックライト装置を提供することである。   Another object of the present invention is to increase the incident angle of light incident from the LED package into the light guide plate by forming irregularities on the wall surface of the recess, thereby reducing the distance necessary for color mixing to obtain white light. It is an object to provide an LED backlight device for LCD that can be reduced.

上述した本発明の目的を達成するために、本発明は一側面の幅方向の向かい合う角が延長され一対の向かい合う壁部と上記壁部の間に凹部が形成された導光板と、上記導光板内に光を投射するよう上記凹部に収容されたLED光源を含むことを特徴とする。   In order to achieve the above-described object of the present invention, the present invention is directed to a light guide plate in which corners in the width direction of one side surface are extended and a pair of facing wall portions and a recess is formed between the wall portions, and the light guide plate. It includes an LED light source accommodated in the concave portion so as to project light therein.

本発明のバックライト装置は、上記LED光源が一面に付着し、両縁が上記導光板壁部の末端に結合された板部材をさらに含むことができる。このとき、上記板部材は金属基板であれば好ましい。   The backlight device of the present invention may further include a plate member in which the LED light source is attached to one surface and both edges are coupled to the end of the light guide plate wall. At this time, the plate member is preferably a metal substrate.

本発明のバックライト装置において、上記LED光源は上記凹部に嵌合され得る。   In the backlight device of the present invention, the LED light source can be fitted into the recess.

本発明のバックライト装置において、上記導光板の上記凹部の外面には上記LEDパッケージから放出された光を上記導光板内に案内する際、光を広がるようにする凹凸が形成され得る。この時、上記凹凸はプリズム、半円周、半円周陰刻及びこれらの組み合わせのいずれか一つから選択され得る。   In the backlight device according to the present invention, the outer surface of the concave portion of the light guide plate may be formed with unevenness for spreading light when the light emitted from the LED package is guided into the light guide plate. At this time, the unevenness may be selected from any one of a prism, a semicircumference, a semicircular inscription, and a combination thereof.

また、本発明のバックライト装置において、上記壁部は互いに向い合った面の基部が曲線で上記導光板に連結され得る。   Further, in the backlight device of the present invention, the wall portions may be connected to the light guide plate with base portions of surfaces facing each other being curved.

本発明のLEDバックライト装置は、導光板の一側面に凹部を形成し、この凹部中にLEDパッケージを装着することによって、光がLEDパッケージから導光板の中に入射される際の損失を最小化しながらLEDパッケージと導光板を安定的に位置合わせできる。   In the LED backlight device of the present invention, a recess is formed on one side of the light guide plate, and the LED package is mounted in the recess, thereby minimizing loss when light enters the light guide plate from the LED package. It is possible to stably align the LED package and the light guide plate while reducing the size.

また、上記凹部の壁面にプリズム及び半円周などのような凹凸を形成し、LEDパッケージから導光板の中に入射される光の入射角を広げることによって、白色光を得るための色混合に必要な距離を減らすことができる。   In addition, by forming irregularities such as prisms and semicircular circles on the wall surface of the recess, and widening the incident angle of light incident from the LED package into the light guide plate, color mixing for obtaining white light is achieved. The required distance can be reduced.

さらに、支持板にLEDパッケージを付着した後、支持板を導光板の凹部側に結合させることによって、LEDパッケージを導光板に対して容易に位置合わせできる。   Furthermore, after attaching the LED package to the support plate, the LED package can be easily aligned with the light guide plate by coupling the support plate to the concave side of the light guide plate.

以下、本発明の好ましき実施例を添付の図面を参照してより詳しく説明する。   Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

図2は本発明によるLEDバックライト装置の斜視図であり、図3は図2の正面図であり、図4は図3の4−4線に沿って切った断面図である。   2 is a perspective view of an LED backlight device according to the present invention, FIG. 3 is a front view of FIG. 2, and FIG. 4 is a cross-sectional view taken along line 4-4 of FIG.

図2乃至図4を参照すると、本発明のLEDバックライト装置100は一側面に幅方向に沿って角を除いた部分に凹部130が形成された導光板120及びこの凹部130に装着された光源である3つのLEDパッケージ110とを含む。ここで、LEDパッケージ110は3つであるもので示したが、これは例示であるだけで、LEDパッケージ110は必要に応じて多様な数に構成することが可能である。   Referring to FIGS. 2 to 4, the LED backlight device 100 of the present invention includes a light guide plate 120 in which a recess 130 is formed on a side surface except for a corner along a width direction, and a light source mounted in the recess 130. And the three LED packages 110. Here, although three LED packages 110 are shown, this is only an example, and the LED packages 110 can be configured in various numbers as needed.

また、図示しないが、当該分野に公知されたように、これらを取り囲んだハウジングと導光板120の下面128の散乱パターンと反射板がさらに備えられる。   Further, although not shown in the drawing, a housing surrounding them, a scattering pattern on the lower surface 128 of the light guide plate 120, and a reflection plate are further provided as known in the art.

以下、LEDバックライト装置100の各々の構成要素を具体的に説明する。   Hereinafter, each component of the LED backlight device 100 will be described in detail.

先ず、LEDパッケージ110はLEDチップ112と、このLEDチップ112を支持しながら電源を供給する一対のリードフレーム114及びこれらを取り囲んだパッケージ本体116とを含む。パッケージ本体116は、LEDチップ112から発生した光が前方、即ち、導光板120側へ放出するように透明な部分LED窓(図8及び図10の118参照)を含む。   First, the LED package 110 includes an LED chip 112, a pair of lead frames 114 that supply power while supporting the LED chip 112, and a package body 116 that surrounds the lead frame 114. The package body 116 includes a transparent partial LED window (refer to 118 in FIGS. 8 and 10) so that light generated from the LED chip 112 is emitted forward, that is, toward the light guide plate 120 side.

導光板120は一定の厚さを有する平板部材であって、透明なアクリル、PMMA(Polymethylmethacrylate)、プラスチックまたは硝子などから成る。前述したように、導光板120は前方120a側にLEDパッケージ110を収容する凹部130が形成されており、後方120bの方は平坦な面が形成される。ここで、導光板120の前方120aはLEDパッケージ110に近い側面を示すものであり、後方120bはその反対側面を示す。   The light guide plate 120 is a flat plate member having a certain thickness, and is made of transparent acrylic, PMMA (Polymethylmethacrylate), plastic, glass or the like. As described above, the light guide plate 120 has the recess 130 for housing the LED package 110 on the front side 120a, and a flat surface is formed on the rear side 120b. Here, the front 120a of the light guide plate 120 indicates a side surface close to the LED package 110, and the rear 120b indicates the opposite side surface.

また、凹部130は導光板120の角を除いた部分に形成されるため、凹部130の上下には幅方向に沿って互いに向かい合う壁部124が残ってLEDパッケージ110を上下から収容し、その内面は曲線の連結部125を介して導光板120の側面122と連結される。この形状は導光板原板の側面を削って凹部130を得たり、所望の導光板形態に該当するモールドを使用して得ることができる。   Further, since the recess 130 is formed in a portion excluding the corner of the light guide plate 120, the wall portions 124 facing each other along the width direction remain on the top and bottom of the recess 130, and the LED package 110 is accommodated from above and below, and the inner surface thereof Is connected to the side surface 122 of the light guide plate 120 through a curved connecting portion 125. This shape can be obtained by scraping the side surface of the original light guide plate to obtain the recess 130 or using a mold corresponding to the desired light guide plate form.

このような凹部130内にLEDパッケージ110を配置すると、壁部124がLEDパッケージ110を外部の衝撃から保護することができる。   When the LED package 110 is disposed in such a recess 130, the wall portion 124 can protect the LED package 110 from external impacts.

一方、たとえ図面ではLEDパッケージ110の厚さが凹部130の幅より小さいもので示したが、凹部130の幅をLEDパッケージ110がはまり込まれる程度に形成することができる。こうすると、LEDパッケージ110を導光板120により容易に整列することができる。もちろん、この場合にはLEDパッケージ110と導光板120の側面122との間隔d1を維持しても良いし、これを省略してLEDパッケージ110を導光板120の側面122に密着させても良い。   On the other hand, although the thickness of the LED package 110 is shown as being smaller than the width of the recess 130 in the drawing, the width of the recess 130 can be formed to such an extent that the LED package 110 can be fitted. In this way, the LED package 110 can be easily aligned by the light guide plate 120. Of course, in this case, the distance d1 between the LED package 110 and the side surface 122 of the light guide plate 120 may be maintained, or this may be omitted and the LED package 110 may be in close contact with the side surface 122 of the light guide plate 120.

次いで、図4を参照して、LEDバックライト装置100の動作を説明する。ここで、便宜上、光LはLEDチップ112の一地点Fから出るもので示した。   Next, the operation of the LED backlight device 100 will be described with reference to FIG. Here, for convenience, the light L is shown as being emitted from a single point F of the LED chip 112.

LEDチップ112が発光すると、LEDパッケージ110から導光板120へ放出された光Lは導光板120の前方120a側の側面122を介して導光板120内に入射される。その後、導光板120の上面126と下面128で内部反射して導光板120内を伝播した後(図示せず)散乱パターンと反射板によって導光板120の上面126を介して上方へ放出される。通常、放出された光は導光板120上部に配置された (図示せず)拡散板及びプリズムシートなどを介してLCDの液晶パネルに入射されバックライト照明を提供するようになる。   When the LED chip 112 emits light, the light L emitted from the LED package 110 to the light guide plate 120 enters the light guide plate 120 via the side surface 122 on the front 120 a side of the light guide plate 120. Thereafter, the light is internally reflected by the upper surface 126 and the lower surface 128 of the light guide plate 120 and propagates through the light guide plate 120 (not shown), and is emitted upward through the upper surface 126 of the light guide plate 120 by the scattering pattern and the reflection plate. Normally, the emitted light is incident on the liquid crystal panel of the LCD through a diffusion plate (not shown) and a prism sheet disposed on the light guide plate 120 to provide backlight illumination.

ここで、一部の光L2は図1の一部の光L1に該当するが、図1とは異なって導光板120内に入射されるため、本発明のLEDバックライト装置100は従来技術に比べて光効率が高いことが分かる。   Here, a part of the light L2 corresponds to a part of the light L1 in FIG. 1, but unlike the case of FIG. 1, the light L2 is incident on the light guide plate 120. It can be seen that the light efficiency is higher than that.

続いて、図5を参照してLEDパッケージ110の装着状態の一例を説明する。図5に示すように、LEDパッケージ110は支持板140に付着された状態で凹部130内に配置され、支持板140は適切な手段、例えば接着剤などによって壁部124の末端に結合される。   Next, an example of the mounting state of the LED package 110 will be described with reference to FIG. As shown in FIG. 5, the LED package 110 is disposed in the recess 130 while being attached to the support plate 140, and the support plate 140 is coupled to the end of the wall portion 124 by an appropriate means such as an adhesive.

こうすると、LEDパッケージ110を導光板120に対して精緻に位置を合わせるのがより容易になる。即ち、LEDパッケージ110を支持板140に正確に整列するだけで済むので、より効果的に位置合わせの作業を行うことができる。   This makes it easier to precisely position the LED package 110 with respect to the light guide plate 120. That is, since it is only necessary to accurately align the LED package 110 with the support plate 140, alignment work can be performed more effectively.

支持板140は金属基板であることが好ましい。これはLEDチップ112から発生した熱を容易に外部へ逃がすことができるからである。   The support plate 140 is preferably a metal substrate. This is because the heat generated from the LED chip 112 can be easily released to the outside.

このような支持板140の代わりに他の構成を使用してLEDパッケージ110を導光板に対して位置合わせることが可能である。例えば、前述したようにLEDパッケージ110と凹部130を互いに一致する寸法で形成すると、支持板140なしでも容易にLEDパッケージ110を導光板120に対して位置合わせることができる。   It is possible to align the LED package 110 with respect to the light guide plate using other configurations instead of the support plate 140. For example, as described above, when the LED package 110 and the recess 130 are formed so as to coincide with each other, the LED package 110 can be easily aligned with the light guide plate 120 without the support plate 140.

図6は本発明の他の実施例によるLEDバックライト装置においてLEDパッケージを省略した斜視図であり、図7は図6の7−7線に沿って切った断面図であり、図8は図6の8−8線に沿って切った断面図である。   6 is a perspective view in which an LED package is omitted in an LED backlight device according to another embodiment of the present invention, FIG. 7 is a cross-sectional view taken along line 7-7 of FIG. 6, and FIG. 6 is a cross-sectional view taken along line 8-8.

図6乃至図7のLEDバックライト装置100Aは、凹部130内の導光板120の側面122からプリズム123が突出したことを除いては、前述した実施例のLEDバックライト装置100と同じである。従って、同一な構成要素には同一な図面符号を付し、繰り返し説明は省略する。   The LED backlight device 100A of FIGS. 6 to 7 is the same as the LED backlight device 100 of the above-described embodiment except that the prism 123 protrudes from the side surface 122 of the light guide plate 120 in the recess 130. Therefore, the same components are denoted by the same reference numerals, and the repeated description is omitted.

プリズム123は床123aが一定の高さに突出し、谷123bが互いに連結されている。この構成はLEDパッケージ110から放出された光が導光板120内に入射される際、この光を図8の平面で広がるようにすることができる。こうすると、R、G及びBの単色LEDパッケージを組み合わせて使用する際、各々の単色LEDパッケージから導光板120内に入射された単色光が互いに混合され白色光を形成する長さが短縮される。これはLEDパッケージ110と導光板120との間隔d2をより減らすことができ、全体バックライト装置100Aの小型化を可能にする。   The prism 123 has a floor 123a protruding at a certain height, and valleys 123b are connected to each other. In this configuration, when light emitted from the LED package 110 is incident on the light guide plate 120, the light can be spread in the plane of FIG. Accordingly, when the R, G, and B single color LED packages are used in combination, the length of the monochromatic light incident on the light guide plate 120 from each single color LED package is mixed with each other to form white light. . This can further reduce the distance d2 between the LED package 110 and the light guide plate 120, and enables the overall backlight device 100A to be miniaturized.

また、本実施例のバックライト装置100Aにも、図5に示すような支持板140を使用してLEDパッケージ110を導光板120に対して装着することができる。   Further, the LED package 110 can be mounted on the light guide plate 120 using the support plate 140 as shown in FIG.

一方、プリズム123は床123a及び/または谷123bを平坦に形成することもできる。この平坦な部分の寸法を最小にすると、上記の光広がり効果を維持しながらもプリズム123の成形作業を容易に行うことができる。   On the other hand, the prism 123 can also form the floor 123a and / or the valley 123b flat. When the dimension of the flat portion is minimized, the prism 123 can be easily molded while maintaining the above light spreading effect.

図9は本発明のさらに他の実施例によるLEDバックライト装置においてLEDパッケージを省略した斜視図であり、図10は図9の10−10線に沿って切った断面図である。   FIG. 9 is a perspective view in which an LED package is omitted from an LED backlight device according to another embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along line 10-10 of FIG.

図9及び図10を参照すると、本実施例のLEDバックライト装置100Bは凹部130内の導光板120の側面122から半円周223が突出したことを除いては、前述した実施例のLEDバックライト装置100と同じである。従って、同一な構成要素には同一な図面符号を付し、繰り返し説明は省略する。   Referring to FIGS. 9 and 10, the LED backlight device 100 </ b> B according to the present embodiment is the LED backlight according to the above-described embodiment except that the semicircular 223 protrudes from the side surface 122 of the light guide plate 120 in the recess 130. This is the same as the light device 100. Therefore, the same components are denoted by the same reference numerals, and the repeated description is omitted.

半円周223は一定の高さに突出し、谷223bが互いに連結されている。この構成はLEDパッケージ110から放出された光が導光板120内に入射される際、この光を図10の平面でより広く拡散できるようにする。こうすると、R、G及びBの単色LEDパッケージを組み合わせて使用する際、各々の単色LEDパッケージにおいて導光板120内に入射された単色光が互いに混合され白色光を形成する長さが短縮される。これはLEDパッケージ110と導光板120との間隔(図7のd2参照)をより減らすことができ、全体バックライト装置100Bの小型化を可能にする。   The semicircular circumference 223 protrudes to a certain height, and the valleys 223b are connected to each other. This configuration allows the light emitted from the LED package 110 to diffuse more widely in the plane of FIG. 10 when entering the light guide plate 120. Accordingly, when the R, G, and B monochromatic LED packages are used in combination, the length of the monochromatic light incident on the light guide plate 120 in each monochromatic LED package is mixed with each other to form white light. . This can further reduce the distance between the LED package 110 and the light guide plate 120 (see d2 in FIG. 7), and enables downsizing of the entire backlight device 100B.

また、本実施例のバックライト装置100Bにも、図5に示すような支持板140を使用してLEDパッケージ110を導光板120に対して装着することができる。   Further, the LED package 110 can be mounted on the light guide plate 120 using the support plate 140 as shown in FIG.

一方、半円周223は谷123bを平坦に形成することもできる。この平坦な部分の寸法を最小にすると、上記の光広がり効果を維持しながらも半円周223の成形作業を容易にすることができる。   On the other hand, the semicircular circumference 223 can also form the valley 123b flat. By minimizing the dimension of this flat portion, it is possible to facilitate the forming operation of the semicircular circumference 223 while maintaining the above light spreading effect.

また、本実施例の半円周223の代わりにその逆の形態、即ち、半円周形態の陰刻を導光板の側面122に形成することができる。また、半円周223を前述したプリズム123と組み合わせるなどの多様な変形も可能である。   Further, instead of the semicircular circumference 223 of the present embodiment, the opposite form, that is, a semicircular inscription, can be formed on the side surface 122 of the light guide plate. Various modifications such as combining the semicircular circumference 223 with the prism 123 described above are also possible.

上記では本発明の好ましき実施例を参照して説明したが、当該技術分野において通常の知識を有する者であれば、下記の特許請求範囲に記載された本発明の思想及び領域から外れない範囲内において本発明を多様に修正及び変更できることを理解するであろう。   The above description has been made with reference to the preferred embodiments of the present invention. However, those skilled in the art will not depart from the spirit and scope of the present invention described in the claims below. It will be understood that various modifications and changes can be made to the present invention within the scope.

従来技術によるLEDバックライト装置を示す断面図である。It is sectional drawing which shows the LED backlight apparatus by a prior art. 本発明によるLEDバックライト装置の斜視図である。1 is a perspective view of an LED backlight device according to the present invention. 図2の正面図である。FIG. 3 is a front view of FIG. 2. 図3の4−4線に沿って切った断面図である。FIG. 4 is a cross-sectional view taken along line 4-4 of FIG. 支持板を利用してLEDパッケージを導光板と結合した状態を示す断面図である。It is sectional drawing which shows the state which couple | bonded the LED package with the light-guide plate using the support plate. 本発明の他の実施例によるLEDバックライト装置においてLEDパッケージを省略した斜視図である。FIG. 6 is a perspective view of an LED backlight device according to another embodiment of the present invention in which an LED package is omitted. 図6の7−7線に沿って切った断面図である。FIG. 7 is a cross-sectional view taken along line 7-7 in FIG. 6. 図6の8−8線に沿って切った断面図である。FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 6. 本発明のさらに他の実施例によるLEDバックライト装置においてLEDパッケージを省略した斜視図である。FIG. 6 is a perspective view of an LED backlight device according to still another embodiment of the present invention in which an LED package is omitted. 図9の10−10線に沿って切った断面図である。It is sectional drawing cut along the 10-10 line of FIG.

符号の説明Explanation of symbols

110 LEDパッケージ
120 導光板
124 壁部
123 プリズム
125 連結部
130 凹部
140 支持板
223 半円周
110 LED package
120 Light guide plate 124 Wall
123 Prism 125 connecting part
130 Recess 140 Support plate
223 semicircle

Claims (7)

一側面の幅方向の向かい合う角が延長され一対の向かい合う壁部と前記壁部の間に凹部が形成された導光板と、
前記導光板内に光を投射するよう前記凹部に収容されたLED光源を含むことを特徴とする、バックライト装置。
A light guide plate in which opposite corners in the width direction of one side surface are extended and a recess is formed between the pair of opposite wall portions and the wall portion;
A backlight device comprising an LED light source accommodated in the recess so as to project light into the light guide plate.
前記LED光源が一面に付着し、両縁が前記導光板壁部の末端に結合された板部材をさらに含むことを特徴とする、請求項1に記載のバックライト装置。   The backlight apparatus according to claim 1, further comprising a plate member having the LED light source attached to one surface and having both edges coupled to the ends of the light guide plate wall. 前記板部材は金属基板であることを特徴とする、請求項2に記載のバックライト装置。   The backlight device according to claim 2, wherein the plate member is a metal substrate. 前記LED光源は前記凹部に嵌合されることを特徴とする、請求項1に記載のバックライト装置。   The backlight device according to claim 1, wherein the LED light source is fitted in the recess. 前記導光板の前記凹部側の外面には前記LEDパッケージから放出された光を前記導光板内に案内する際、光を広がるようにする凹凸が形成されたことを特徴とする、請求項1に記載のバックライト装置。   2. The light guide plate according to claim 1, wherein the light guide plate has an uneven surface for spreading light when the light emitted from the LED package is guided into the light guide plate. The backlight device described. 前記凹凸は、プリズム、半円周、半円周陰刻及びこれらの組み合わせのいずれか一つから選択されることを特徴とする、請求項5に記載のバックライト装置。   The backlight device according to claim 5, wherein the unevenness is selected from any one of a prism, a semicircumference, a semicircular inscription, and a combination thereof. 前記壁部は互いに向い合う面の基部が曲線で前記導光板に連結されることを特徴とする、請求項1に記載のバックライト装置。   The backlight device according to claim 1, wherein base portions of the walls facing each other are connected to the light guide plate by curves.
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