JP2007129314A - Non-reciprocating circuit element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin and inexpensive non-reciprocating circuit element. <P>SOLUTION: In the non-reciprocating circuit element, a first center conductor 6 is provided on one surface side of an insulating board 5; a second center conductor 7 is provided on the other surface side of the insulating board 5, while the second center conductor 7 crosses the first one 6; and a third center conductor 8 is provided on one surface side of the insulating board 5, while the third center conductor 8 is not continuous to the first one 6. The non-reciprocating circuit has: a first conductive material 10a crossing the second center conductor 7; a second conductive material 10b that is provided on the other surface side of the insulating board 5 while the second conductive material 10b is not continuous to the second center conductor 7, and crosses the first center conductor 6; and a connection conductor 11 for connecting the first and second conductive materials 10a, 10b. Thus the first, second, and third center conductors 6, 7, 8 are formed on one insulating substrate 5, and hence providing the thin and inexpensive non-reciprocating circuit element. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、携帯電話機等の移動体通信機の送信部等に使用されるアイソレータやサーキュレータからなる非可逆回路素子に関するものである。   The present invention relates to an irreversible circuit element including an isolator and a circulator used in a transmission unit of a mobile communication device such as a mobile phone.

従来の非可逆回路素子は、図３に示すように、複数枚の絶縁基板が積層された多層基板５１の下面にはポート部５２ａとアース部５２ｂを有する第１の中心導体５２が、また、多層基板５１の積層内にはポート部５３ａとアース部５３ｂを有する第２の中心導体５３が、更に、多層基板５１の上面にはポート部５４ａとアース部５４ｂを有する第３の中心導体５４が設けられ、第２，第３の中心導体５３，５４のポート部５３ａ、５４ａとアース部５３ｂ、５４ｂは、接続導体５５によって多層基板５１の下面に引き出され、第１の中心導体５２のポート部５２ａと、ポート部５３ａ、５４ａに接続された多層基板５１の下面に位置する導電体５６ａ、５６ｂには、チップ型コンデンサＣが接続されると共に、第１の中心導体５２のアース部５２ｂと、第２，第３の中心導体５３，５４のアース部５３ｂ、５４ｂは、フェライト部材５７に設けられた接地電極５８に接続されるようになって、従来の非可逆回路素子が形成されている（例えば、特許文献１参照）。
特開２００３−２０９４０９号公報 As shown in FIG. 3, the conventional non-reciprocal circuit element includes a first central conductor 52 having a port portion 52a and a ground portion 52b on the lower surface of a multilayer substrate 51 in which a plurality of insulating substrates are laminated. A second central conductor 53 having a port portion 53a and a ground portion 53b is provided in the multilayer substrate 51, and a third central conductor 54 having a port portion 54a and a ground portion 54b is provided on the upper surface of the multilayer substrate 51. The port portions 53a and 54a of the second and third center conductors 53 and 54 and the ground portions 53b and 54b are drawn out to the lower surface of the multilayer substrate 51 by the connection conductor 55, and the port portions of the first center conductor 52 are provided. The chip-type capacitor C is connected to the conductors 56a and 56b located on the lower surface of the multilayer substrate 51 connected to the port portion 53a and the port portions 53a and 54a, and the ground portion of the first central conductor 52 2b and the ground portions 53b and 54b of the second and third center conductors 53 and 54 are connected to a ground electrode 58 provided on the ferrite member 57, thereby forming a conventional non-reciprocal circuit element. (For example, refer to Patent Document 1).
JP 2003-209409 A

しかし、従来の非可逆回路素子は、多層基板５１の下面には第１の中心導体５２が、また、多層基板５１の積層内には第２の中心導体５３が、更に、多層基板５１の上面には第３の中心導体５４が設けられているため、多層基板５１が厚くなって、薄型のものが得られないばかりか、複数枚の絶縁基板を必要として、コスト高になるという問題がある。   However, in the conventional non-reciprocal circuit element, the first central conductor 52 is provided on the lower surface of the multilayer substrate 51, the second central conductor 53 is provided in the multilayer substrate 51, and the upper surface of the multilayer substrate 51 is further provided. Since the third central conductor 54 is provided, the multilayer substrate 51 becomes thick, and a thin substrate cannot be obtained. In addition, a plurality of insulating substrates are required, resulting in high costs. .

本発明は、このような従来技術の実情に鑑みてなされたもので、その目的は、薄型で、安価な非可逆回路素子を提供することにある。   The present invention has been made in view of such a state of the art, and an object thereof is to provide a thin and inexpensive non-reciprocal circuit device.

上記の目的を達成するために、本発明の第１の解決手段として、磁石とフェライト部材を収納したヨークと、前記磁石と前記フェライト部材との間に配置され、第１，第２，第３の中心導体を設けた絶縁基板とを備え、前記第１の中心導体は、前記絶縁基板の一面側に設けられると共に、前記第２の中心導体は、前記第１の中心導体と交叉した状態で前記絶縁基板の他面側に設けられ、前記第３の中心導体は、前記第１の中心導体に非導通状態で前記絶縁基板の一面側に設けられ、前記第２の中心導体と交叉する第１の導電体と、前記第２の中心導体に非導通状態で前記絶縁基板の他面側に設けられ、前記第１の中心導体と交叉する第２の導電体と、前記第１，第２の導電体を接続する接続導体とを有した構成とした。   In order to achieve the above object, as a first solving means of the present invention, a yoke containing a magnet and a ferrite member, and a magnet disposed between the magnet and the ferrite member, the first, second, third The first central conductor is provided on one surface side of the insulating substrate, and the second central conductor is in a state of intersecting with the first central conductor. The third central conductor is provided on the other surface side of the insulating substrate, and the third central conductor is provided on the one surface side of the insulating substrate in a non-conductive state with the first central conductor, and intersects with the second central conductor. 1 conductor, a second conductor provided on the other surface side of the insulating substrate in a non-conductive state with the second center conductor, and intersecting the first center conductor, and the first and second conductors And a connecting conductor for connecting the conductors.

また、第２の解決手段として、前記絶縁基板には複数の貫通孔が設けられ、前記貫通孔内に設けられた前記接続導体によって前記第１，第２の導電体を接続した構成とした。   As a second solution, the insulating substrate is provided with a plurality of through holes, and the first and second conductors are connected by the connection conductors provided in the through holes.

また、第３の解決手段として、前記第３の中心導体は、前記第１，第２の中心導体と交叉する２本の平行な第１，第２の導体で構成され、前記第１の導体は、前記第１，第２の中心導体の交叉部からずれた位置に設けられ、前記第１，第２の導電体と前記接続導体で形成され、前記第２の導体は、前記交叉部を挟んで前記第１の導体と対向した状態で前記第１，第２の中心導体の交叉部からずれた位置に設けられ、前記第１，第２の導電体と前記接続導体で形成された構成とした。   As a third solution, the third central conductor is composed of two parallel first and second conductors intersecting with the first and second central conductors, and the first conductor Is provided at a position shifted from the crossing portion of the first and second central conductors, and is formed by the first and second conductors and the connecting conductor, and the second conductor includes the crossing portion. A configuration in which the first and second conductors and the connecting conductor are provided at a position shifted from the crossing portion of the first and second center conductors in a state of being opposed to the first conductor with being sandwiched therebetween. It was.

また、第４の解決手段として、前記ヨークは、第１，第２のヨークを有し、前記第１のヨーク側には前記磁石が配置されると共に、前記第２のヨーク側には前記フェライト部材が配置され、前記第１，第２，第３の中心導体のそれぞれは、ポート部とアース部を有し、前記第１の中心導体が前記フェライト部材側に位置すると共に、前記第２の中心導体が前記磁石側に位置して、前記第２の中心導体の前記ポート部は、前記第１の中心導体が位置する前記絶縁基板の一面側に設けられた引出導体に接続されると共に、前記第３の中心導体の前記ポート部が前記第１の中心導体が位置する前記絶縁基板の一面側に設けられた構成とした。   As a fourth solution, the yoke has first and second yokes, the magnet is disposed on the first yoke side, and the ferrite is disposed on the second yoke side. A member is disposed, each of the first, second, and third center conductors has a port portion and a ground portion, and the first center conductor is located on the ferrite member side, and the second center conductor A center conductor is located on the magnet side, and the port portion of the second center conductor is connected to a lead conductor provided on one surface side of the insulating substrate on which the first center conductor is located, The port portion of the third central conductor is provided on one surface side of the insulating substrate where the first central conductor is located.

また、第５の解決手段として、前記第２のヨークと前記ポート部のそれぞれに接続された複数のチップ型コンデンサを有し、このチップ型コンデンサは、絶縁体の一面側に設けられ、前記ポート部に接続された第１の電極と、前記絶縁体の他面側に設けられ、前記第２のヨークに接続された第２の電極で形成された構成とした。   Further, as a fifth solution, a plurality of chip type capacitors connected to each of the second yoke and the port portion are provided, and the chip type capacitors are provided on one surface side of the insulator, and the port And a second electrode connected to the second yoke and provided on the other surface side of the insulator.

本発明の非可逆回路素子において、第１の中心導体は、絶縁基板の一面側に設けられると共に、第２の中心導体は、第１の中心導体と交叉した状態で絶縁基板の他面側に設けられ、第３の中心導体は、第１の中心導体に非導通状態で絶縁基板の一面側に設けられ、第２の中心導体と交叉する第１の導電体と、第２の中心導体に非導通状態で絶縁基板の他面側に設けられ、第１の中心導体と交叉する第２の導電体と、第１，第２の導電体を接続する接続導体とを有したため、第１，第２，第３の中心導体が１枚の絶縁基板に形成できて、薄型で、安価なものが得られる。   In the nonreciprocal circuit device of the present invention, the first central conductor is provided on one surface side of the insulating substrate, and the second central conductor is on the other surface side of the insulating substrate in a state of crossing the first central conductor. The third central conductor is provided on one side of the insulating substrate in a non-conducting state with the first central conductor, and the first central conductor intersects the second central conductor, and the second central conductor Since it has a second conductor which is provided on the other surface side of the insulating substrate in a non-conductive state and crosses the first central conductor, and a connecting conductor which connects the first and second conductors, The second and third central conductors can be formed on one insulating substrate, and a thin and inexpensive product can be obtained.

また、絶縁基板には複数の貫通孔が設けられ、貫通孔内に設けられた接続導体によって第１，第２の導電体を接続したため、その接続構造が簡単で、生産性が良く、安価なものが得られる。   Further, since the insulating substrate has a plurality of through holes, and the first and second conductors are connected by the connection conductors provided in the through holes, the connection structure is simple, the productivity is high, and the cost is low. Things are obtained.

また、第３の中心導体は、第１，第２の中心導体と交叉する２本の平行な第１，第２の導体で構成され、第１の導体は、第１，第２の中心導体の交叉部からずれた位置に設けられ、第１，第２の導電体と接続導体で形成され、第２の導体は、交叉部を挟んで第１の導体と対向した状態で第１，第２の中心導体の交叉部からずれた位置に設けられ、第１，第２の導電体と接続導体で形成されたため、２本の第３の中心導体が第１，第２の中心導体に対して対称な位置に形成され、電気的な特性の良好なものが得られる。   The third center conductor is composed of two parallel first and second conductors intersecting the first and second center conductors, and the first conductor is the first and second center conductors. The first and second conductors and the connecting conductor are provided at positions shifted from the crossing portion of the first and second conductors, and the second conductor faces the first conductor across the crossing portion. Since the first and second conductors and the connecting conductor are provided at positions shifted from the intersection of the two center conductors, the two third center conductors are located with respect to the first and second center conductors. Are formed in symmetrical positions with good electrical characteristics.

また、第１，第２，第３の中心導体のポート部が回路基板の一面側（フェライト部材側）に配置されたため、複数のチップ型コンデンサの接続が回路基板の一面側で同時にできて、生産性の良好なものが得られる。   In addition, since the port portions of the first, second and third central conductors are arranged on one side of the circuit board (ferrite member side), a plurality of chip type capacitors can be connected simultaneously on the one side of the circuit board, Good productivity can be obtained.

また、第２のヨークとポート部のそれぞれに接続された複数のチップ型コンデンサを有し、このチップ型コンデンサは、絶縁体の一面側に設けられ、ポート部に接続された第１の電極と、絶縁体の他面側に設けられ、第２のヨークに接続された第２の電極で形成されたため、複数のチップ型コンデンサは、第２のヨークに同時にできて、生産性の良好なものが得られる。   In addition, a plurality of chip capacitors connected to each of the second yoke and the port portion are provided. The chip capacitors are provided on one surface side of the insulator, and are connected to the first electrode connected to the port portion. Since the second electrode is provided on the other surface side of the insulator and connected to the second yoke, the plurality of chip capacitors can be formed on the second yoke at the same time and have good productivity. Is obtained.

発明の実施の形態について図面を参照して説明すると、図１は本発明の非可逆回路素子の要部断面図、図２は本発明の非可逆回路素子に係る絶縁基板の平面図であり、本発明の非可逆回路素子は、第１，第２のヨーク１，３と、この第１，第２のヨーク１，３内に収納された磁石２，及びフェライト部材５と、磁石２とフェライト部材４との間に配置され、第１，第２，第３の中心導体６，７，８を設けた絶縁基板５と、第１，第２，第３の中心導体６，７，８と第２のヨーク３に接続された複数のチップ型コンデンサＣで構成されている。   An embodiment of the invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a principal part of the non-reciprocal circuit element of the present invention, and FIG. 2 is a plan view of an insulating substrate according to the non-reciprocal circuit element of the present invention. The nonreciprocal circuit device of the present invention includes first and second yokes 1 and 3, magnets 2 and ferrite members 5 housed in the first and second yokes 1 and 3, magnet 2 and ferrite. An insulating substrate 5 disposed between the member 4 and provided with the first, second and third central conductors 6, 7 and 8, and the first, second and third central conductors 6, 7, 8; A plurality of chip capacitors C connected to the second yoke 3 are used.

そして、第１のヨーク１は、箱形やＵ字状の磁性板（鉄板等）からなり、四角形の平板状の上板１ａと、この上板１ａの側辺から下方に折り曲げられた側板１ｂを有し、この第１のヨーク１内の上板１ａには、磁石２が接着剤等によって取り付けられると共に、第２のヨーク３は、箱形やＵ字状の磁性板（鉄板等）からなり、四角形の平板状の底板３ａと、この底板３ａの側辺から下方に折り曲げられた側板３ｂを有し、この第２のヨーク３の側板３ｂは、第１のヨーク１の側板１ｂと結合され、第１，第２のヨーク１，３によって磁気閉回路が形成されており、また、フェライト部材４は、平板状のＹＩＧ（Ｙｔｔｒｉｕｍ ｉｒｏｎ ｇａｒｎｅｔ）等からなり、磁石２と対向した状態で、第２のヨーク３の底板３ａに接着剤等の適宜手段によって取り付けられている。   The first yoke 1 is composed of a box-shaped or U-shaped magnetic plate (iron plate or the like), a rectangular flat plate-shaped upper plate 1a, and a side plate 1b bent downward from the side of the upper plate 1a. A magnet 2 is attached to the upper plate 1a in the first yoke 1 by an adhesive or the like, and the second yoke 3 is made of a box-shaped or U-shaped magnetic plate (iron plate or the like). A square plate-like bottom plate 3a and a side plate 3b bent downward from the side of the bottom plate 3a. The side plate 3b of the second yoke 3 is coupled to the side plate 1b of the first yoke 1. A magnetic closed circuit is formed by the first and second yokes 1 and 3, and the ferrite member 4 is made of a flat YIG (Yttrium iron garnet) or the like, facing the magnet 2, Appropriate means such as an adhesive on the bottom plate 3a of the second yoke 3 Is attached by.

１枚のフェイル基板等からなる絶縁基板５には、互いに交叉した状態で第１，第２，第３の中心導体６，７，８が形成されており、ポート部６ａとアース部６ｂを有する第１の中心導体６は、絶縁基板５の一面側（下面側）に、また、ポート部７ａとアース部７ｂを有する第２の中心導体７は、絶縁基板５の他面側（上面側）に、更に、ポート部８ａとアース部８ｂを有する第３の中心導体８は、第１，第２の中心導体６，７との接触を避けた状態で、絶縁基板５の両面に形成されている。   A first, second, and third central conductors 6, 7, and 8 are formed on an insulating substrate 5 made of a single fail substrate or the like so as to cross each other, and have a port portion 6a and a ground portion 6b. The first center conductor 6 is on one surface side (lower surface side) of the insulating substrate 5, and the second center conductor 7 having the port portion 7 a and the ground portion 7 b is on the other surface side (upper surface side) of the insulating substrate 5. Furthermore, the third center conductor 8 having the port portion 8a and the ground portion 8b is formed on both surfaces of the insulating substrate 5 while avoiding contact with the first and second center conductors 6 and 7. Yes.

ここで第３の中心導体８の構成を図２に基づいて詳述すると、この第３の中心導体８は、第１，第２の中心導体６，７と交叉する２本の平行な第１，第２の導体９ａ、９ｂで構成され、第１の導体９ａは、第１，第２の中心導体６，７の交叉部Ｋからずれた位置に設けられ、また、第２の導体９ｂは、交叉部Ｋを挟んで第１の導体９ａと対向し、且つ、対称の位置で第１，第２の中心導体６，７の交叉部Ｋからずれた位置に設けられている。   Here, the configuration of the third central conductor 8 will be described in detail with reference to FIG. 2. The third central conductor 8 is composed of two parallel first conductors intersecting with the first and second central conductors 6 and 7. , Second conductors 9a and 9b. The first conductor 9a is provided at a position shifted from the intersection K of the first and second center conductors 6 and 7, and the second conductor 9b is The first conductor 9a is opposed to the first conductor 9a with the crossing portion K interposed therebetween, and is provided at a position shifted from the crossover portion K of the first and second center conductors 6 and 7 in a symmetrical position.

そして、第１の導体９ａは、第１の中心導体６に非導通状態で絶縁基板５の下面側に設けられた第１の導電体１０ａと、第２の中心導体７に非導通状態で絶縁基板５の上面側に設けられた第２の導電体１０ｂと、第１，第２の導電体１０ａ、１０ｂを繋ぎ、絶縁基板５の貫通孔５ａ内に設けられた接続導体１１とで形成され、また、第２の導体９ｂは、第１の中心導体６に非導通状態で絶縁基板５の下面側に設けられた２個の第１の導電体１０ａと、第２の中心導体７に非導通状態で絶縁基板５の上面側に設けられた２個の第２の導電体１０ｂと、第１，第２の導電体１０ａ、１０ｂを繋ぎ、絶縁基板５の貫通孔５ａ内に設けられた複数の接続導体１１とで形成されており、このような構成を有する第３の中心導体８は、ポート部８ａが絶縁基板５の下面側に位置すると共に、アース部８ｂが絶縁基板５の上面側に位置した状態となっているが、ポート部８ａとアース部８ｂを絶縁基板５の下面側、或いは、ポート部８ａとアース部８ｂを絶縁基板５の上面側に形成しても良い。   The first conductor 9a is insulated from the first central conductor 6 in a non-conductive state and is insulated from the first conductor 10a provided on the lower surface side of the insulating substrate 5 and the second central conductor 7 in a non-conductive state. The second conductor 10b provided on the upper surface side of the substrate 5 is connected to the first and second conductors 10a and 10b, and the connection conductor 11 is provided in the through hole 5a of the insulating substrate 5. In addition, the second conductor 9b is not connected to the first center conductor 6 and is not connected to the two first conductors 10a provided on the lower surface side of the insulating substrate 5 in a non-conductive state. The two second conductors 10b provided on the upper surface side of the insulating substrate 5 in a conductive state are connected to the first and second conductors 10a and 10b, and are provided in the through holes 5a of the insulating substrate 5. The third central conductor 8 having such a configuration is formed of a plurality of connection conductors 11, and the port portion 8a is insulated. Although it is located on the lower surface side of the plate 5 and the ground portion 8b is located on the upper surface side of the insulating substrate 5, the port portion 8a and the ground portion 8b are connected to the lower surface side of the insulating substrate 5 or the port portion 8a. The ground portion 8 b may be formed on the upper surface side of the insulating substrate 5.

また、絶縁基板５の一面側（下面側）には、第２の中心導体７のポート部７ａに接続された引出導体１２が設けられると共に、このような構成を有する絶縁基板５は、第１の中心導体６をフェライト部材４側（下面側）にして、第１，第２のヨーク１，３内の磁石２とフェライト部材４との間に位置して取り付けられるようになっている。   In addition, on one surface side (lower surface side) of the insulating substrate 5, the lead conductor 12 connected to the port portion 7 a of the second central conductor 7 is provided, and the insulating substrate 5 having such a configuration is the first substrate. The central conductor 6 is set to the ferrite member 4 side (lower surface side), and is positioned between the magnet 2 and the ferrite member 4 in the first and second yokes 1 and 3.

複数のチップ型コンデンサＣは、一面側に第１の電極１４ａを設けた絶縁体１３と、第１の電極１４ａに対向した状態で他面側に第２の電極１４ｂを有し、これ等のチップ型コンデンサＣそれぞれは、第１の電極１４ａが第１，第２，第３の中心導体６，７，８のポート部６ａ、７ａ、８ａに半田付によって取付、接続されると共に、第２の電極１４ｂが第２のヨーク３の底板３ａに半田付によって取付、接続されており、このようにチップ型コンデンサＣが取り付けられ、第１，第２のヨーク１，３内に収納された絶縁基板５上の第１，第２，第３の中心導体６，７，８のアース部６ｂ、７ｂ、８ｂのそれぞれは、図示しない接続体等を介して第２のヨーク３に接地された構成となって、本発明のサーキュレータからなる非可逆回路素子が形成されている。   The plurality of chip capacitors C have an insulator 13 provided with a first electrode 14a on one surface side, and a second electrode 14b on the other surface side facing the first electrode 14a. In each of the chip capacitors C, the first electrode 14a is attached and connected to the port portions 6a, 7a, and 8a of the first, second, and third center conductors 6, 7, and 8 by soldering, and the second The electrode 14b is attached and connected to the bottom plate 3a of the second yoke 3 by soldering, and the chip type capacitor C is attached in this way, and the insulation accommodated in the first and second yokes 1 and 3 is accommodated. Each of the ground portions 6b, 7b, and 8b of the first, second, and third center conductors 6, 7, and 8 on the substrate 5 is grounded to the second yoke 3 through a connection body (not shown). Thus, the non-reciprocal circuit device comprising the circulator of the present invention is It has been made.

なお、上記実施例では、サーキュレータを例にして説明したが、第３の中心導体８のアース部８ｂ側に抵抗器を接続してなるアイソレータに適用しても良い。   In the above embodiment, the circulator has been described as an example. However, the present invention may be applied to an isolator in which a resistor is connected to the ground portion 8b side of the third central conductor 8.

本発明の非可逆回路素子の要部断面図である。It is principal part sectional drawing of the nonreciprocal circuit device of this invention. 本発明の非可逆回路素子に係る絶縁基板の平面図である。It is a top view of the insulated substrate which concerns on the nonreciprocal circuit device of this invention. 従来の非可逆回路素子の要部の分解斜視図である。It is a disassembled perspective view of the principal part of the conventional nonreciprocal circuit device.

符号の説明Explanation of symbols

１ 第１のヨーク
１ａ 上板
１ｂ 側板
２ 磁石
３ 第２のヨーク
３ａ 底板
３ｂ 側板
４ フェライト部材
５ 絶縁基板
５ａ 貫通孔
６ 第１の中心導体
６ａ ポート部
６ｂ アース部
７ 第２の中心導体
７ａ ポート部
７ｂ アース部
８ 第３の中心導体
８ａ ポート部
８ｂ アース部
９ａ 第１の導体
９ｂ 第２の導体
１０ａ 第１の導電体
１０ｂ 第２の導電体
１１ 接続導体
１２ 引出導体
Ｃ チップ型コンデンサ
１３ 絶縁体
１４ａ 第１の電極
１４ｂ 第２の電極
Ｋ 交叉部 DESCRIPTION OF SYMBOLS 1 1st yoke 1a Top plate 1b Side plate 2 Magnet 3 2nd yoke 3a Bottom plate 3b Side plate 4 Ferrite member 5 Insulating substrate 5a Through-hole 6 1st center conductor 6a Port part 6b Grounding part 7 2nd center conductor 7a Port Part 7b Ground part 8 Third central conductor 8a Port part 8b Ground part 9a First conductor 9b Second conductor 10a First conductor 10b Second conductor 11 Connection conductor 12 Lead conductor C Chip capacitor 13 Insulation Body 14a first electrode 14b second electrode K crossing part

Claims (5)

磁石とフェライト部材を収納したヨークと、前記磁石と前記フェライト部材との間に配置され、第１，第２，第３の中心導体を設けた絶縁基板とを備え、前記第１の中心導体は、前記絶縁基板の一面側に設けられると共に、前記第２の中心導体は、前記第１の中心導体と交叉した状態で前記絶縁基板の他面側に設けられ、前記第３の中心導体は、前記第１の中心導体に非導通状態で前記絶縁基板の一面側に設けられ、前記第２の中心導体と交叉する第１の導電体と、前記第２の中心導体に非導通状態で前記絶縁基板の他面側に設けられ、前記第１の中心導体と交叉する第２の導電体と、前記第１，第２の導電体を接続する接続導体とを有したことを特徴とする非可逆回路素子。 A yoke containing a magnet and a ferrite member; and an insulating substrate disposed between the magnet and the ferrite member and provided with first, second and third center conductors, wherein the first center conductor is The second central conductor is provided on the other surface side of the insulating substrate in a state of crossing the first central conductor, and the third central conductor is provided on the one surface side of the insulating substrate. A first conductor that is provided on one surface of the insulating substrate in a non-conductive state with the first central conductor and intersects the second central conductor; and the insulating in a non-conductive state with the second central conductor. An irreversible, comprising a second conductor provided on the other surface side of the substrate and intersecting the first center conductor, and a connection conductor connecting the first and second conductors Circuit element. 前記絶縁基板には複数の貫通孔が設けられ、前記貫通孔内に設けられた前記接続導体によって前記第１，第２の導電体を接続したことを特徴とする請求項１記載の非可逆回路素子。 The nonreciprocal circuit according to claim 1, wherein the insulating substrate is provided with a plurality of through holes, and the first and second conductors are connected by the connection conductors provided in the through holes. element. 前記第３の中心導体は、前記第１，第２の中心導体と交叉する２本の平行な第１，第２の導体で構成され、前記第１の導体は、前記第１，第２の中心導体の交叉部からずれた位置に設けられ、前記第１，第２の導電体と前記接続導体で形成され、前記第２の導体は、前記交叉部を挟んで前記第１の導体と対向した状態で前記第１，第２の中心導体の交叉部からずれた位置に設けられ、前記第１，第２の導電体と前記接続導体で形成されたことを特徴とする請求項１、又は２記載の非可逆回路素子。 The third central conductor is composed of two parallel first and second conductors crossing the first and second central conductors, and the first conductor is the first and second conductors. Provided at a position deviated from the crossing portion of the central conductor, formed by the first and second conductors and the connection conductor, the second conductor facing the first conductor across the crossing portion The first and second conductors and the connecting conductors are provided at positions shifted from the intersections of the first and second center conductors in a state where the first and second central conductors are connected. 3. The nonreciprocal circuit device according to 2. 前記ヨークは、第１，第２のヨークを有し、前記第１のヨーク側には前記磁石が配置されると共に、前記第２のヨーク側には前記フェライト部材が配置され、前記第１，第２，第３の中心導体のそれぞれは、ポート部とアース部を有し、前記第１の中心導体が前記フェライト部材側に位置すると共に、前記第２の中心導体が前記磁石側に位置して、前記第２の中心導体の前記ポート部は、前記第１の中心導体が位置する前記絶縁基板の一面側に設けられた引出導体に接続されると共に、前記第３の中心導体の前記ポート部が前記第１の中心導体が位置する前記絶縁基板の一面側に設けられたことを特徴とする請求項１から３の何れか１項に記載の非可逆回路素子。 The yoke has first and second yokes, the magnet is disposed on the first yoke side, and the ferrite member is disposed on the second yoke side. Each of the second and third center conductors has a port portion and a ground portion, and the first center conductor is located on the ferrite member side, and the second center conductor is located on the magnet side. The port portion of the second central conductor is connected to a lead conductor provided on one surface side of the insulating substrate where the first central conductor is located, and the port of the third central conductor 4. The nonreciprocal circuit device according to claim 1, wherein a portion is provided on one side of the insulating substrate on which the first central conductor is located. 5. 前記第２のヨークと前記ポート部のそれぞれに接続された複数のチップ型コンデンサを有し、このチップ型コンデンサは、絶縁体の一面側に設けられ、前記ポート部に接続された第１の電極と、前記絶縁体の他面側に設けられ、前記第２のヨークに接続された第２の電極で形成されたことを特徴とする請求項４記載の非可逆回路素子。 A plurality of chip capacitors connected to each of the second yoke and the port portion; and the chip capacitors are provided on one side of an insulator, and are connected to the port portion. 5. The nonreciprocal circuit device according to claim 4, wherein the nonreciprocal circuit device is formed of a second electrode provided on the other surface side of the insulator and connected to the second yoke.

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