JP2007115940A - Thermal dissipation plate - Google Patents

Thermal dissipation plate Download PDF

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JP2007115940A
JP2007115940A JP2005306769A JP2005306769A JP2007115940A JP 2007115940 A JP2007115940 A JP 2007115940A JP 2005306769 A JP2005306769 A JP 2005306769A JP 2005306769 A JP2005306769 A JP 2005306769A JP 2007115940 A JP2007115940 A JP 2007115940A
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heat
pores
pore
working fluid
substrate
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Akio Adachi
昭夫 安達
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Fuji Electric Co Ltd
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Fuji Electric Holdings Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermal dissipation plate capable of radiating heat efficiently with a low temperature difference by unifying the thermal distribution of an entire flat plate, by absorbing variations when the distribution of the heating value of an electrical heating element, such as a plurality of semiconductor devices provided on the flat plate, varies. <P>SOLUTION: In the thermal dissipation plate, a plurality of linear pores are dispersed in a flat substrate made of a high heat transfer material and are arranged in parallel to form pore rows, respective pores in the pore rows are connected by a header channel at both the upper and lower ends, and a biphase condensing working fluid is sealed in the pore rows airtightly. In the thermal dissipation plate, one or a plurality of communicating openings are provided for allowing all pores excluding a pore that becomes the reflux path of the working fluid in the pore rows to communication one another. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、半導体素子等の発熱密度の高い発熱体の冷却に適した熱分散プレートに関する。   The present invention relates to a heat dispersion plate suitable for cooling a heating element having a high heat generation density such as a semiconductor element.

半導体素子は高集積化、高出力化に伴って損失が増加し、発熱量が増大するので、これを効果的に冷却することが必要となる。
半導体素子の発生損失が数Ｗレベルまでは半導体素子の表面からの自然放熱でもよいが、数十Ｗレベルでは、これまで図９に示すようにアルミニウム等の高熱伝導性材料で構成された基板５１に放熱フィン５２を多数取付けて構成した放熱器５０を用いるようにしていた。この放熱器５０を半導体素子などの発熱体１に結合し、発熱体１の熱をこの放熱器５０へ伝達し放熱フィン５２から大気中への放熱することにより発熱体の熱の放熱が促進される。また、半導体素子などの発熱体の損失が数十Ｗ以上のレベルとなった場合は、この放熱器５０に電動ファン６０により送風することにより放熱効率をさらに向上させるようにするのが一般的である。 As semiconductor elements are highly integrated and have higher outputs, losses increase and the amount of heat generated increases, so it is necessary to cool them effectively.
Natural heat dissipation from the surface of the semiconductor element may be performed until the generated loss of the semiconductor element is several W level, but if it is several tens W level, the substrate 51 made of a high heat conductive material such as aluminum as shown in FIG. A heat radiator 50 constituted by attaching a large number of heat radiation fins 52 is used. The radiator 50 is coupled to the heating element 1 such as a semiconductor element, and the heat of the heating element 1 is transmitted to the radiator 50 and radiated from the radiation fins 52 to the atmosphere. The In addition, when the loss of a heating element such as a semiconductor element reaches a level of several tens of watts or more, it is common to further improve the heat dissipation efficiency by blowing air to the radiator 50 by the electric fan 60. is there.

半導体素子の出力がさらに増大し、または実装密度が高密度化することにより、放熱器にさらに高い単位面積あたりの放熱量が要求されるが、この場合は、一般に、図１０に示すように、放熱器５０に設ける櫛歯状の放熱フィン５２ａの間隔を可能な限り小さくしたり、図１１に示すように、放熱フィン５２ｂを格子状にしたりすることにより、放熱フィン５２の放熱面積を増加させて放熱効率を高め、半導体素子の温度上昇を抑制するようにしている。   As the output of the semiconductor element further increases or the mounting density is increased, a higher heat dissipation amount per unit area is required for the radiator, but in this case, generally, as shown in FIG. By reducing the interval between the comb-shaped heat radiation fins 52a provided in the heat radiator 50 as much as possible, or by forming the heat radiation fins 52b in a lattice shape as shown in FIG. 11, the heat radiation area of the heat radiation fins 52 is increased. Thus, the heat dissipation efficiency is increased and the temperature rise of the semiconductor element is suppressed.

このような放熱器の放熱性能は次の（１）式の関係にある。   The heat dissipation performance of such a radiator is in the relationship of the following equation (1).

放熱器の温度上昇ΔＴ［K］＝熱抵抗Ｒ［K/W］×発熱量Ｑ［W］ ・・・（１）
ここで、熱抵抗Ｒ［K/W］は、次の（２）式で示すことができる。 Temperature rise ΔT [K] = Thermal resistance R [K / W] x Calorific value Q [W] (1)
Here, the thermal resistance R [K / W] can be expressed by the following equation (2).

熱抵抗Ｒ［K/W］＝１／（放熱面積A［ｍ2］×熱伝達率ｈ［W/ｍ2K］×フィン効率η）
・・・（２）
半導体素子等の発熱体１の発熱量Qが大きい場合、放熱器の温度上昇を抑制するには、放熱面積Aを大きくして、熱抵抗Rを小さくすることが必要であるため、図９に示す放熱器５０の幅または長さを大きくすればよいのであるが、放熱器の基板５１の熱抵抗により発熱体１の取付け部近傍と基板の端部との温度差は、放熱器の幅および長さを増加させるにしたがって大きくなるため、必ずしも、放熱器５０の表面積拡大に比例して放熱器の温度上昇が低減されるものではない。 Thermal resistance R [K / W] = 1 / (Heat dissipation area A [m 2 ] × Heat transfer coefficient h [W / m 2 K] × Fin efficiency η)
... (2)
When the heat generation amount Q of the heating element 1 such as a semiconductor element is large, it is necessary to increase the heat dissipation area A and reduce the thermal resistance R in order to suppress the temperature rise of the radiator. It is only necessary to increase the width or length of the radiator 50 shown, but the temperature difference between the vicinity of the mounting portion of the heating element 1 and the end of the substrate due to the thermal resistance of the substrate 51 of the radiator is the width of the radiator and Since it increases as the length is increased, the temperature rise of the radiator is not necessarily reduced in proportion to the increase in the surface area of the radiator 50.

このため、発熱体１で発生した熱を放熱器基板５１の全面に低温度差で分散する手段が必要であり、特許文献１には、図１２に示すような熱分散型放熱器が提案されている。   For this reason, means for dispersing the heat generated in the heating element 1 over the entire surface of the radiator substrate 51 with a low temperature difference is required. Patent Document 1 proposes a heat dispersion type radiator as shown in FIG. ing.

この図１２の放熱器は、アルミニウム等の高熱伝導性の金属で形成された櫛歯状放熱フィン５２を有する放熱器５０の基板５１内にそれぞれ密封された細管により独立して形成されたヒートパイプ７を複数分散して配設し、基板５１の一部に結合された半導体素子等の発熱体１から発生する熱をこのヒートパイプ７により基板５１の全体に分散させて放熱フィン５２に伝達するようにしたものである。これにより実効的な放熱器の放熱面積が拡大し、大気に対して低温度差での放熱が行えるようになり、放熱効率が高まる。   The radiator shown in FIG. 12 is a heat pipe independently formed by a thin tube sealed in a substrate 51 of a radiator 50 having comb-like radiation fins 52 made of a metal having high thermal conductivity such as aluminum. The heat generated from the heating element 1 such as a semiconductor element coupled to a part of the substrate 51 is dispersed throughout the substrate 51 by the heat pipe 7 and transmitted to the radiation fins 52. It is what I did. As a result, the effective heat dissipating area of the radiator is increased, and heat can be dissipated at a low temperature difference with respect to the atmosphere, thereby increasing the heat dissipating efficiency.

また、特許文献２には、図１３に示すような、金属平板６１内部に細孔６２の列を形成し、この細孔列の各細孔を上下両端においてヘッダ流路６３により連通したうえで、細孔６２列内に２相凝縮性の作動流体６５を適量封入して構成した平板状ヒートパイプ６０が開示されている。この平板状ヒートパイプ６０は、平板６１内に形成された細孔列により形成されたヒートパイプにより半導体素子等の発熱体１から発生された熱を平板６１の全体に拡散することができ平板６１全体の温度分布を均一化でき、温度上昇を抑制できる。
特開２００１−１５６２２９号公報 特開平０４−２６０７９１号公報 Further, in Patent Document 2, as shown in FIG. 13, a row of pores 62 is formed inside a metal flat plate 61, and the pores of this pore row are communicated by header channels 63 at both upper and lower ends. A flat plate-shaped heat pipe 60 is disclosed in which an appropriate amount of a two-phase condensable working fluid 65 is sealed in a row of fine pores 62. The flat plate heat pipe 60 can diffuse the heat generated from the heating element 1 such as a semiconductor element to the entire flat plate 61 by the heat pipe formed by the pore array formed in the flat plate 61. The entire temperature distribution can be made uniform, and temperature rise can be suppressed.
JP 2001-156229 A Japanese Patent Laid-Open No. 04-260791

半導体素子などの高集積化と実装密度の高密度化に対応して単位面積あたりの放熱量が１０Ｗ／ｃｍ2レベルを超えるような発熱体を冷却する場合には、前記のようなヒートパイプを組み込んだ放熱器の採用が検討されているが、図１２に示した放熱器の基板５１内にヒートパイプ７を組み込む形式の放熱器の場合は、複数のヒートパイプ７が独立して形成されているので放熱器の基板５１内での熱分散方向が、ヒートパイプ７の長手方向に限られるため、実効的な放熱面積の拡大はできても複数の半導体素子などの発熱体の発熱分布のバラツキを十分に吸収することができない。これを改善するためには、特に大容量の半導体変換装置の冷却装置に適用した場合、より多数のヒートパイプを設ける必要があり、基板５１への細孔の加工およびヒートパイプにかかる費用が嵩む問題がある。 When cooling a heating element whose heat dissipation amount per unit area exceeds 10 W / cm 2 level corresponding to higher integration of semiconductor elements and higher mounting density, a heat pipe as described above is used. Although adoption of the built-in heat radiator is considered, in the case of the heat radiator of the type which incorporates the heat pipe 7 in the board | substrate 51 of the heat radiator shown in FIG. 12, several heat pipe 7 is formed independently. Therefore, since the heat distribution direction in the substrate 51 of the radiator is limited to the longitudinal direction of the heat pipe 7, even if the effective heat radiation area can be expanded, the heat generation distribution of a plurality of heating elements such as semiconductor elements varies. Cannot be absorbed sufficiently. In order to improve this, particularly when applied to a cooling device for a large-capacity semiconductor conversion device, it is necessary to provide a larger number of heat pipes, which increases the cost of processing the pores in the substrate 51 and the heat pipe. There's a problem.

また、図１３に示した平板状ヒートパイプ６０は、平板列内の細孔列の個々の細孔が上下端においてヘッダ流路で連通されているだけであるので、複数の半導体素子を取付けたとき、各素子間で発熱量に不平衡が生じても各細孔間での作動流体の移動がほとんど行われないため、平板状ヒートパイプにおける熱の分布に偏りが生じ、この場合も、発熱分布のバラツキを吸収する作用が十分でない問題がある。   Further, the flat plate-like heat pipe 60 shown in FIG. 13 is provided with a plurality of semiconductor elements because only the individual pores of the pore row in the flat plate row are communicated with each other through the header channel at the upper and lower ends. However, even if there is an imbalance in the amount of heat generated between each element, there is almost no movement of the working fluid between the pores, so there is a bias in the heat distribution in the flat plate heat pipe. There is a problem that the effect of absorbing the variation in distribution is not sufficient.

この発明は、このような問題を解決するために、平板に取付けられた複数の半導体素子等の発熱体の発熱量の分布にバラツキが生じた場合、これを吸収して平板全体の熱分布をより均一化することにより低温度差で効率よく放熱を行うことのできる熱分散プレートを提供することを課題とする。   In order to solve such a problem, the present invention absorbs the variation in the calorific value distribution of the heat generating elements such as a plurality of semiconductor elements mounted on the flat plate, thereby reducing the heat distribution of the entire flat plate. It is an object of the present invention to provide a heat dispersion plate that can efficiently dissipate heat at a low temperature difference by making it more uniform.

この課題を解決するため、この発明は、高熱伝導性材からなる平板状の基板内に複数の直線状の細孔を分散して平行に配設して細孔列を形成し、この細孔列の各細孔を上下両端においてをヘッダ流路により連通し、細孔列内に2相凝縮性作動流体を気密的に封入してなる熱分散プレートにおいて、前記細孔列の作動流体の還流路となる細孔を除いたすべての細孔を相互に連通させる連通孔を１本または複数本設けたことを特徴とする。   In order to solve this problem, the present invention disperses a plurality of linear pores in a flat substrate made of a high thermal conductivity material and arranges them in parallel to form a pore array. In the heat dispersion plate in which the pores of the row are connected to each other by the header flow path at the upper and lower ends, and the two-phase condensable working fluid is hermetically sealed in the pore row, the working fluid in the pore row is circulated. One or a plurality of communicating holes for communicating all the pores excluding the pores serving as the passages are provided.

前記連通孔は、基板の加熱部分と放熱部分の少なくとも一方に設けることができる。   The communication hole can be provided in at least one of the heating portion and the heat dissipation portion of the substrate.

そして、前記基板は、多穴板で構成することが最適である。   The substrate is optimally composed of a multi-hole plate.

この発明によれば、平板状の基板内に設けられたヒートパイプを構成する複数の細孔が全て両端においてヘッダ流路によって連通されるだけでなく、細孔列の作動流体の還流路となる細孔を除いたすべての細孔が発熱部分または冷却部ないしは両部付近において連通孔により連通されているので、液相の作動流体および発熱体によって加熱されて気相となった作動流体が発熱体の取付け位置に係わらず、各細孔を流れる作動流体が相互に流通し混じり合い、温度が均一化されるようになる。このため発熱体の熱が基板全体に均一に伝達拡散されるようになるとともに、発熱体に発熱分布のバラツキがあってもこれを吸収し、均一に冷却することができる効果を得られる。   According to the present invention, the plurality of pores constituting the heat pipe provided in the flat substrate are not only communicated by the header channel at both ends, but also serve as a reflux path for the working fluid in the pore row. Since all the pores except for the pores are connected by the communicating holes in the heat generating part or the cooling part or in the vicinity of both parts, the liquid working fluid and the working fluid heated to the gas phase by the heating element generate heat. Regardless of the attachment position of the body, the working fluids flowing through the respective pores circulate and mix with each other, and the temperature becomes uniform. For this reason, the heat of the heating element is uniformly transmitted and diffused over the entire substrate, and even if there is variation in the heat generation distribution in the heating element, it can be absorbed and cooled uniformly.

また作動流体の還流路となる細孔は、他の細孔とは連通されず独立しているため、還流路の圧力が他の細孔の圧力より低くなるので、作動流体の上部ヘッダ流路から下部ヘッダ流路への還流が主としてのこの還流路を通して行われるようになり、作動流体の循環が円滑に行われるようになり、熱の輸送効率を高めることができるとともに、熱輸送量の限界値を大きくでき、発熱体の冷却を安全に行うことができる効果も得られる。   In addition, since the pores serving as the return path for the working fluid are independent of the other pores without being communicated with each other, the pressure of the return path is lower than the pressure of the other pores. Since the return to the lower header flow path is mainly performed through this return path, the working fluid can be circulated smoothly, the heat transfer efficiency can be improved, and the heat transfer limit is limited. The value can be increased, and the effect that the heating element can be cooled safely is also obtained.

以下に、この発明の実施の形態を図に示す実施例について説明する   Embodiments of the present invention will be described below with reference to the embodiments shown in the drawings.

図１はこの発明の熱分散プレートの実施例１を示すものであり、（Ａ）は、一部を切欠いて内部を示す斜視図、（Ｂ）は正面断面図である。   FIG. 1 shows Embodiment 1 of the heat dispersion plate of the present invention, in which (A) is a perspective view showing the inside with a part cut away, and (B) is a front sectional view.

図1において、２１は、高熱伝導性材により構成した平板状の基板であり、この中に複数の直線状の隔壁２２により仕切られた細孔を分散配列した細孔列２３と、この細孔列２３の上下端において個々の細孔を相互に連通する上部ヘッダ流路２６および下部ヘッダ流路２７が設けられる。細孔列２３、ヘッダ流路２６、２７によって形成された基板内空間に、封止パイプ２９から排気したのち、２相凝縮性作動流体３１を注入し、封止パイプ２９を封じ切ることによってサーモサイフォン形ヒートパイプを形成する。   In FIG. 1, reference numeral 21 denotes a plate-like substrate made of a high thermal conductivity material, and a pore array 23 in which pores partitioned by a plurality of linear partition walls 22 are dispersed, and the pores. An upper header channel 26 and a lower header channel 27 are provided at the upper and lower ends of the row 23 to communicate the individual pores with each other. After exhausting from the sealing pipe 29 into the space in the substrate formed by the pore array 23 and the header channels 26 and 27, the two-phase condensable working fluid 31 is injected and the sealing pipe 29 is sealed off to A siphon heat pipe is formed.

基板２１内の液相状の作動流体の溜まった下部において細孔列２３の両外側の２３ｓを除いた残りの細孔２３ｃのすべてを相互に連通するために、所要数の水平方向に延びた連通孔２８が設けられている。このため、基板２１内の細孔列２３の下部に溜められた液相状の作動流体３１は、連通孔２８を介して各細孔２３ｃ間を流通することができる。   In order to communicate all of the remaining pores 23c except for 23s on both outer sides of the pore array 23 at the lower part where the liquid-phase working fluid is accumulated in the substrate 21, the required number of horizontal directions are extended. A communication hole 28 is provided. For this reason, the liquid-phase working fluid 31 stored in the lower portion of the pore row 23 in the substrate 21 can flow between the pores 23 c via the communication holes 28.

このように構成された熱分散プレート２０の動作を、図２を参照して説明する。   The operation of the heat distribution plate 20 configured as described above will be described with reference to FIG.

図２に示すとおり、熱分散プレート２０は、細孔２３の列を形成する各細孔２３の長手方向が垂直になるように配置され、このプレートの主面の一方の下方に冷却の必要な半導体素子などの発熱体１を取付ける。基板２１の内部空間の下部に液相状態の作動流体３１が溜まっている。発熱体１が作動して発熱し、基板２１が加熱されると、基板２１内の液相状の作動流体３１がその熱によって相変化（沸騰）し、蒸気泡３４を発生する。この作動流体が気化する過程で発熱体から気化潜熱を吸収し、冷却する。この蒸気泡３４は液相より密度が小さいため、浮力によって矢印で示すように細孔内を上方へ移動する。これが連続発生して蒸気流３５となって基板２１の上方へ移動する。発熱体１の設けられた加熱部より温度の低い基板２１の上部は放熱部となって、作動流体の蒸気を凝縮して液化し、潜熱を放出する。このような過程で加熱部より放熱部へ熱輸送が行われる。凝縮した作動流体は、蒸気流３５に同伴して移動し、気液２相流となって、上部ヘッダ流路２６を経て、主として左右両外側の還流路２５を形成する細孔２３ｓを通って基板２１の下部の加熱部へ還流し、下部ヘッダ流路２７に液溜まりを形成して、定常的な沸騰・凝縮サイクルを形成する。   As shown in FIG. 2, the heat distribution plate 20 is arranged so that the longitudinal direction of each pore 23 forming the row of pores 23 is vertical, and cooling is necessary below one of the main surfaces of the plate. A heating element 1 such as a semiconductor element is attached. A liquid-phase working fluid 31 is accumulated in the lower part of the internal space of the substrate 21. When the heating element 1 is activated to generate heat and the substrate 21 is heated, the liquid-phase working fluid 31 in the substrate 21 undergoes a phase change (boiling) due to the heat and generates a vapor bubble 34. In the process of vaporizing the working fluid, the latent heat of vaporization is absorbed from the heating element and cooled. Since the vapor bubbles 34 have a lower density than the liquid phase, they move upward in the pores as indicated by arrows by buoyancy. This continuously occurs and becomes a vapor flow 35 and moves above the substrate 21. The upper part of the substrate 21 whose temperature is lower than that of the heating part provided with the heating element 1 becomes a heat radiating part, which condenses and liquefies the vapor of the working fluid and releases latent heat. In this process, heat is transported from the heating unit to the heat dissipation unit. The condensed working fluid moves along with the vapor flow 35, becomes a gas-liquid two-phase flow, passes through the upper header flow path 26, and mainly passes through the pores 23s forming the right and left outer reflux paths 25. The mixture is refluxed to the heating section below the substrate 21 to form a liquid pool in the lower header flow path 27 to form a steady boiling / condensing cycle.

液相の作動流体の溜められた基板の下部の加熱部付近には、中央側の各細孔２３ｃを相互に連通する連通孔２８ａが設けられていることにより、この部分において図２に矢印３６で示すように連通孔２８ａを通して各細孔２３ｃ間で、作動流体の分散流が生じ、発熱密度の高い部分で集中的に発生する蒸気泡を横方向に分散し、凝縮および対流により作動流体内で熱伝達を行い、各細孔２３ｃへの熱分散をおこない、作動流体全体の温度を均一化することができる。これによって、発熱体１の発熱分布のバラツキを吸収することができる。   In the vicinity of the heating portion at the lower part of the substrate where the liquid-phase working fluid is stored, there is provided a communication hole 28a for communicating the central pores 23c with each other. As shown in FIG. 2, a dispersed flow of the working fluid is generated between the respective pores 23c through the communication holes 28a, and the steam bubbles generated in a concentrated manner in a portion having a high heat generation density are laterally dispersed. In this way, heat can be transferred to distribute the heat to each pore 23c, and the temperature of the entire working fluid can be made uniform. As a result, variations in the heat generation distribution of the heating element 1 can be absorbed.

そして、ここで、両外側の細孔２３ｓより内側の細孔列２３ｃは、連通孔２８ａによって相互を連通させるため、各細孔２３ｃの内部圧力が均一化されるが、両外側の還流路となる外側の細孔２３ｓは、ヘッダ流路２６、２７によって細孔２３ｃと連通されるだけであるので、細孔２３ｃの列の内部圧力と等しくなることはなく、これより低い圧力となる。このため基板２１の加熱体１の取付けられた加熱部で加熱された作動流体は細孔列２３ｃを上昇し、上部ヘッダ流路２６に至ると、ここから低い圧力に置かれた両外側の還流路となる細孔２３ｓを通して自然に下部ヘッダ流路２７へ還るようになり、循環路の行きと還りの流路が区分けされることになり、作動流体の循環が円滑となる。このため、作動流体による熱輸送の効率が高まり、熱の分散を良好に行うことができる。   Here, the pore rows 23c inside the outer pores 23s communicate with each other through the communication holes 28a, so that the internal pressure of each pore 23c is made uniform. Since the outer fine pores 23s are merely communicated with the fine pores 23c by the header channels 26 and 27, they do not become equal to the internal pressure of the row of fine pores 23c but become a lower pressure. For this reason, when the working fluid heated by the heating part to which the heating element 1 of the substrate 21 is attached rises in the pore row 23c and reaches the upper header flow path 26, the reflux flows on both outer sides placed at a low pressure from here. It will naturally return to the lower header flow path 27 through the pores 23s as a path, and the circulation path and the return path will be separated, and the circulation of the working fluid will be smooth. For this reason, the efficiency of heat transport by the working fluid is increased, and heat can be dispersed well.

次に、この発明の実施例２を図３に示すので、これについて説明する。   Next, a second embodiment of the present invention will be described with reference to FIG.

この実施例２においては、図３に示すよう、基板２１に設けた細孔列２３の内側の各細孔２３ｃのすべてを連通させるための連通孔２８ｂを、基板２１の放熱部となる上部に設けている。   In the second embodiment, as shown in FIG. 3, the communication holes 28 b for communicating all the pores 23 c inside the pore array 23 provided in the substrate 21 are formed in the upper part serving as a heat radiating portion of the substrate 21. Provided.

このように、基板２１の上部に各細孔２３ｃを連通する連通孔２８ｂを設けることにより、図４に示すように、連通孔２８ｂを介して各細孔２３ｃ間で作動流体の蒸気流の分散流３７が生じるので、発熱密度の高い部分で集中的に発生した、蒸気泡を凝縮部（放熱部）において横方向に分散することにより基板全体に熱を分散し、基板の放熱部における温度の均一化を図ることができ、放熱効率を高めることができる。   In this manner, by providing the communication holes 28b communicating the respective pores 23c in the upper part of the substrate 21, as shown in FIG. 4, the vapor flow of the working fluid is dispersed between the respective pores 23c via the communication holes 28b. Since the flow 37 is generated, heat is distributed over the entire substrate by dispersing the vapor bubbles generated in a concentrated manner in the portion where the heat generation density is high in the condensing part (heat dissipating part), and the temperature in the heat dissipating part of the substrate is reduced. Uniformity can be achieved and heat dissipation efficiency can be increased.

還流路となる細孔２３ｓが連通孔２８ｂによりたの細孔２３ｃと連通されないことにより、作動流体の循環作用が良好になることは、実施例１の場合と同様である。   As in the case of the first embodiment, the circulation action of the working fluid is improved because the pore 23s serving as the reflux path is not communicated with the pore 23c formed by the communication hole 28b.

図５にこの発明の実施例３を示す。   FIG. 5 shows Embodiment 3 of the present invention.

この実施例３は、図５から明らかなとおり、基板２１の上部の放熱部付近および下部の加熱部付近において、基板２１内に設けた細孔列２３のうちの料外側の還流路２５となる細孔２３ｓを除いた残りの中央よりの細孔２３ｃのすべてを連通するために、連通孔２８ａおよび２８ｂを設けている。   As is apparent from FIG. 5, this Example 3 becomes a reflux path 25 outside the material in the pore array 23 provided in the substrate 21 in the vicinity of the upper heat dissipation portion and the lower heating portion of the substrate 21. In order to communicate all the remaining pores 23c from the center except for the pores 23s, communication holes 28a and 28b are provided.

このため、この実施例３においては、図６に示すように、中央側の細孔２３ｃの発熱部および放熱部の両部付近で、連通孔２８ａおよび２８ｃを通して、各細孔２３ｃ間に分散流３５および３６が発生し、発熱密度の高い部分で集中的に発生する蒸気泡は加熱部および放熱部において、基板の横方向に分散することができでき、基板全体の温度をより均一化することができるので、放熱効率を高めることが可能となる。   For this reason, in the third embodiment, as shown in FIG. 6, in the vicinity of both the heat generating portion and the heat radiating portion of the central pore 23c, the dispersed flow between the pores 23c passes through the communication holes 28a and 28c. Vapor bubbles generated in a concentrated manner in a portion where heat generation density is high and 35 and 36 can be dispersed in the horizontal direction of the substrate in the heating unit and the heat dissipation unit, and the temperature of the entire substrate can be made more uniform. Therefore, it is possible to improve the heat dissipation efficiency.

この場合も、前記実施例１、２と同様に、還流路となる細孔２３ｓによって作動流体の循環作用が良好にされる。   Also in this case, like the first and second embodiments, the circulating action of the working fluid is improved by the pores 23s serving as the reflux path.

図７にこの発明の実施例４を示す。   FIG. 7 shows a fourth embodiment of the present invention.

この実施例４は、この発明による熱分散プレートを放熱器に適用した例を示すものである。   The fourth embodiment shows an example in which the heat dispersion plate according to the present invention is applied to a radiator.

前記の実施例１から３に示した熱分散プレート２０の主面の一面に、複数の櫛歯状の放熱フィン2を結合して、放熱器を構成する。   A plurality of comb-like radiating fins 2 are coupled to one surface of the main surface of the heat distribution plate 20 shown in the first to third embodiments to constitute a radiator.

この放熱器を構成する熱分散プレート２０の他方の主面に（Ｂ）に示すように、半導体素子等の発熱体１を３個密着して結合する。熱分散プレート２０には、多数の細孔２３が１列に並べて設けられており、この細孔の中に２相凝縮性作動流体が封入され平板状のヒートパイプを構成する。この放熱器は、熱分散プレートの、放熱フィン２や発熱体１の取付けられた主面を、取付け方向を示す矢印の通り、細孔２３が垂直になり、かつ発熱体１の取付けられた側を下になるように立てて使用する。   As shown in (B), three heating elements 1 such as semiconductor elements are closely bonded to the other main surface of the heat dissipating plate 20 constituting the heat radiator. The heat dispersion plate 20 is provided with a large number of pores 23 arranged in a line, and a two-phase condensable working fluid is enclosed in the pores to form a flat plate-like heat pipe. This heatsink has a main surface on which the heat dissipating fins 2 and the heat generating element 1 are mounted on the main surface of the heat dissipating plate, as shown by the arrows indicating the mounting direction, and the side where the heat generating element 1 is mounted. Use the stand upside down.

熱分散プレート２０に取付けた３個の発熱体１の通電電流が不平衡となって、発熱体間の発熱量が不均一となると、熱分散プレートの温度分布が付近一となり、発熱体の電流不平衡をさらに悪化させる場合も生じる。   If the energization currents of the three heat generating elements 1 attached to the heat dissipating plate 20 become unbalanced and the amount of heat generated between the heat generating elements becomes non-uniform, the temperature distribution of the heat dispersive plate becomes close to one another, In some cases, the unbalance is further exacerbated.

この発明の熱分散プレートは、前記した通り、各細孔２３間で作動流体が流通可能にしていることにより、このような複数の発熱体の発熱量のバラツキを吸収してプレート全体の温度分布が均一となるように熱を分散させることができる。   As described above, the heat dissipating plate of the present invention allows the working fluid to flow between the respective pores 23, thereby absorbing the variation in the calorific value of the plurality of heating elements, and the temperature distribution of the entire plate. The heat can be dispersed so as to be uniform.

図８にこの発明の実施例５を示す。   FIG. 8 shows a fifth embodiment of the present invention.

この実施例５は、押し出し加工によって大量に安価に製造される平板状の多穴板を使用した熱分散プレートの例を示すものである。   Example 5 shows an example of a heat dispersion plate using a flat multi-hole plate manufactured in a large amount at a low cost by extrusion.

図８（Ａ）にアルミニウム等の高熱伝導性金属材料を押し出し加工により製造した平板状の多穴板３１を示す。この多穴板３１には、長手方向に貫通した複数の細孔３２が設けられ、多穴板３１の幅方向に１列に配列され、細孔列を構成している。
これらの細孔３２の列が作動流体の循環路を形成する。 FIG. 8A shows a flat multi-hole plate 31 manufactured by extruding a highly heat conductive metal material such as aluminum. The multi-hole plate 31 is provided with a plurality of fine holes 32 penetrating in the longitudinal direction and arranged in one row in the width direction of the multi-hole plate 31 to constitute a fine-hole row.
These rows of pores 32 form a working fluid circulation path.

以下に、この多穴板３１により形成した熱分散プレートについて説明する。   Hereinafter, a heat dispersion plate formed by the multi-hole plate 31 will be described.

図８（Ｂ）に示すように、多穴板３１上下両端の開口部に端板３３，３３を当てて、ロウ付けまたは溶接等により気密的に封止する。封止の方法は、端板を使用しないで、多穴板の両端を機械的に押し潰して開放部を封止するようにした圧着法であってもよい。   As shown in FIG. 8 (B), end plates 33 and 33 are applied to openings at both upper and lower ends of the multi-hole plate 31 and hermetically sealed by brazing or welding. The sealing method may be a pressure bonding method in which the open portion is sealed by mechanically crushing both ends of the multi-hole plate without using an end plate.

次に、このように密閉された多穴板３１に、前記各実施例で説明した細孔列の全部の細孔を上下両端で相互に連通させる上下のヘッダ流路および還流路となる両外側の細孔を除いた残りの細孔のすべてを連通する連通孔を設ける。ヘッダ流路３６を設ける場合は、これは多穴板３１の一方の側面３５からドリルなどにより、図８（Ｃ）に示すように、全部の細孔３２に連通するようにほぼ全幅に亘って連通孔３６を穿孔する。側面３５に開いた孔は、密閉栓３６ａを詰めるなどして密閉する。   Next, the upper and lower header channels and the outer sides serving as the reflux channels are connected to the multi-hole plate 31 sealed in this manner so that all the pores of the pore array described in the above embodiments communicate with each other at the upper and lower ends. A communication hole for communicating all of the remaining pores except for the pores is provided. In the case of providing the header flow path 36, this is almost the entire width so as to communicate with all the pores 32 by drilling or the like from one side surface 35 of the multi-hole plate 31 as shown in FIG. The communication hole 36 is drilled. The hole opened in the side surface 35 is sealed by, for example, filling a sealing plug 36a.

還流路となる両外側の細孔３２ｓを除いた残りの細孔のすべてを連通する連通孔３７を設ける場合は、同様に一方の側面３５からドリルなどにより、図８（Ｂ）において左側の最外側の還流路となる細孔３２ｓには達しないように、その１つ手前の細孔までの連通孔３７を所要本数穿孔する。そしてこれらの連通孔３７を設けるために側面３５開けられた孔と、右側最外側の細孔３２ｓとそのすぐ左隣の細孔３２ｃとの間の隔壁３５ａに開けられた孔を密閉栓３７ａによって埋める（図８（Ｄ）参照）。これにより連通孔３７は、両外側の還流路となる細孔３２ｓには連通されないようになる。   In the case of providing the communication hole 37 that communicates all of the remaining pores except for the two outside pores 32s that serve as the reflux path, similarly, the left side in FIG. The required number of communicating holes 37 up to the immediately preceding fine hole is drilled so as not to reach the fine pore 32s serving as the outer reflux path. Then, a hole opened in the side surface 35 for providing these communication holes 37 and a hole opened in the partition wall 35a between the rightmost outermost pore 32s and the immediately adjacent pore 32c are formed by a sealing plug 37a. Fill (see FIG. 8D). As a result, the communication hole 37 is not communicated with the pores 32 s serving as reflux paths on the outer sides.

なお、このような穿孔過程で多穴板３１の側面３５に設けられた複数の孔のうちの１つには密閉栓を設けないで、多穴板３１内に２相凝縮性の作動流体を封入するための封入パイプ３８を結合する。この封入パイプ３８から多穴板３１の内部の空気を抜き出し減圧してから、作動流体を所要量注入し、この封入パイプ３８を押し潰す等して気密的に封止することにより多穴板３１全体を密封する。これにより熱分散プレート３０が完成する。   In addition, a sealing plug is not provided in one of the plurality of holes provided in the side surface 35 of the multi-hole plate 31 in such a drilling process, and a two-phase condensable working fluid is placed in the multi-hole plate 31. A sealing pipe 38 for sealing is connected. The air inside the multi-hole plate 31 is extracted from the enclosed pipe 38 and decompressed, and then a required amount of working fluid is injected, and the enclosed pipe 38 is crushed and sealed in an airtight manner to thereby form the multi-hole plate 31. Seal the whole. Thereby, the heat distribution plate 30 is completed.

このように構成された、熱分散プレート３０は前記した実施例のものと同様に、連通孔３７により多穴板３１内の中央側細孔３２ｃの列内で作動流体を流通させて均一な温度および圧力として発熱のバラツキを吸収する作用をし、上下のヘッダ流路３６および還流路と外側細孔３２ｓとによって作動流体の還流路を形成し、作動流体の多穴板内での循環路の行きと還りの流路を区分することができ、熱分散効率を高めることができる。   The heat dispersion plate 30 configured as described above has a uniform temperature by circulating the working fluid in the row of the central side pores 32c in the multi-hole plate 31 through the communication holes 37, as in the above-described embodiment. In addition, it acts to absorb variations in heat generation as pressure, and forms a return path for the working fluid by the upper and lower header flow paths 36 and the return path and the outer pores 32 s. The outgoing and return flow paths can be separated, and the heat dispersion efficiency can be increased.

そして、この実施例５による熱分散プレートは、何よりも、大量生産される多穴板を利用しているので、安価に製造することができるという実用上効果が大きい。   And since the heat dispersion | distribution plate by this Example 5 utilizes the multi-hole board produced in large quantities above all, it is large in practical effect that it can be manufactured cheaply.

この発明の実施例１による熱分散プレートを示すもので、（Ａ）は、一部切欠き部を含む斜視図、（Ｂ）は正面断面図である。1 shows a heat distribution plate according to Embodiment 1 of the present invention, in which (A) is a perspective view including a partially cutout portion, and (B) is a front sectional view. FIG. この発明の実施例１の動作説明図であり、（Ａ）は正面断面図、（Ｂ）は側面断面図である。It is operation | movement explanatory drawing of Example 1 of this invention, (A) is front sectional drawing, (B) is side sectional drawing. この発明の実施例２による熱分散プレートを示す正面断面図である。It is front sectional drawing which shows the heat-distribution plate by Example 2 of this invention. この発明の実施例２の動作説明図であり、（Ａ）は正面断面図、（Ｂ）は側面断面図である。It is operation | movement explanatory drawing of Example 2 of this invention, (A) is front sectional drawing, (B) is side sectional drawing. この発明の実施例３による熱分散プレートを示す正面断面図である。It is front sectional drawing which shows the heat distribution plate by Example 3 of this invention. この発明の実施例３の動作説明図であり、（Ａ）は正面断面図、（Ｂ）は側面断面図である。It is operation | movement explanatory drawing of Example 3 of this invention, (A) is front sectional drawing, (B) is side sectional drawing. この発明の実施例４による放熱器を示すもので、（Ａ）は全体の斜視図、（Ｂ）は切断面を含む斜視図である。4 shows a radiator according to Embodiment 4 of the present invention, in which (A) is an overall perspective view, and (B) is a perspective view including a cut surface. FIG. この発明の実施例５による放熱プレートを示すもので、（Ａ）はこの実施例に使用する基板の斜視図、（Ｂ）は正面断面図、（Ｃ）は（Ｂ）におけるＣ−Ｃ線断面図、（Ｄ）は（Ｂ）のＤ−Ｄ線断面図、（Ｅ）は側面図である。7 shows a heat dissipation plate according to Embodiment 5 of the present invention, in which (A) is a perspective view of a substrate used in this embodiment, (B) is a front cross-sectional view, and (C) is a cross-sectional view taken along line CC in (B). The figure, (D) is the DD sectional view taken on the line of (B), (E) is a side view. 従来の放熱器の構成を示す斜視図である。It is a perspective view which shows the structure of the conventional heat radiator. 従来の放熱器の構成を示す図であり、（Ａ）は平面図、（Ｂ）は側面図である。It is a figure which shows the structure of the conventional heat radiator, (A) is a top view, (B) is a side view. 従来の放熱器の構成を示す図であり、（Ａ）は平面図、（Ｂ）は側面図である。It is a figure which shows the structure of the conventional heat radiator, (A) is a top view, (B) is a side view. 従来の放熱器の構成を示す図であり、（Ａ）は平面図、（Ｂ）は側面図である。It is a figure which shows the structure of the conventional heat radiator, (A) is a top view, (B) is a side view. 従来の熱分散プレートの構成を示す図であり、（Ａ）は正面断面図、（Ｂ）は側面断面図である。It is a figure which shows the structure of the conventional heat distribution plate, (A) is front sectional drawing, (B) is side sectional drawing.

符号の説明Explanation of symbols

１：発熱体
２０：熱分散プレート ２１：基板
２３：細孔 ２５：還流路
２６：上部ヘッダ流路 ２７：下部ヘッダ流路
２８ａ、２８ｂ：連通孔 1: Heating element 20: Heat distribution plate 21: Substrate 23: Fine hole 25: Recirculation path 26: Upper header flow path 27: Lower header flow path 28a, 28b: Communication hole

Claims (3)

高熱伝導性材からなる平板状の基板内に複数の直線状の細孔を分散して平行に配設して細孔列を形成し、この細孔列の各細孔を上下両端においてをヘッダ流路により連通し、細孔列内に2相凝縮性作動流体を気密的に封入してなる熱分散プレートにおいて、前記細孔列の作動流体の還流路となる細孔を除いたすべての細孔を相互に連通させる連通孔を１本または複数本設けたことを特徴とする熱分散プレート。   A plurality of linear pores are dispersed and arranged in parallel in a flat substrate made of a high thermal conductivity material to form a pore row, and each pore of this pore row is placed at the top and bottom ends of the header. In a heat dispersion plate that is communicated by a flow path and hermetically encloses a two-phase condensable working fluid in a fine pore row, all fine pores except for the fine pores that serve as a return path for the working fluid in the fine pore row are provided. A heat dispersion plate, wherein one or a plurality of communication holes for communicating the holes with each other are provided. 請求項１記載の熱分散プレートにおいて、前記連通孔を基板の加熱部分と放熱部分の少なくとも一方に設けたことを特徴とする熱分散プレート。   2. The heat distribution plate according to claim 1, wherein the communication hole is provided in at least one of a heating portion and a heat radiation portion of the substrate. 請求項１または２に記載の熱分散プレートにおいて、前記基板を多穴板で構成したことを特徴とする熱分散プレート。

3. The heat distribution plate according to claim 1, wherein the substrate is a multi-hole plate.

JP2005306769A 2005-10-21 2005-10-21 Thermal dissipation plate Pending JP2007115940A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Publications (1)

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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220452A (en) * 2013-05-10 2014-11-20 三菱電機株式会社 Cooler for electronic component
CN107072368A (en) * 2014-11-18 2017-08-18 Seb公司 Steam hairdressing apparatus with improved housing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220452A (en) * 2013-05-10 2014-11-20 三菱電機株式会社 Cooler for electronic component
CN107072368A (en) * 2014-11-18 2017-08-18 Seb公司 Steam hairdressing apparatus with improved housing
CN107072368B (en) * 2014-11-18 2022-03-04 Seb公司 Steam haircut device with improved housing

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